200540086 九、發明說明： 【發明所屬之技術領域】 本發明係有關把由晶圓所切出的晶片按其分類而搬運至 托架的指定位置之晶片的搬運方法及裝置，特別是有關在以 與以往同等的成本下能將晶片搬運之所要時間縮短約1 / 2 以下之晶片的搬運方法及裝置。 【先前技術】 有關由半導體等之晶圓所製作且被1個1個地切出之晶 片，因爲各個電氣特性不同，所以將其電氣特性1個1個作檢 查，且檢查晶片之表裏兩面的傷及裂痕，且依其結果從良品到 不良品賦予數個分類，將其各自利用例如標記來作區別且編 碼化並作爲地圖（MAP )資訊以記錄在FD (撓性碟片）等 上。 此等晶片係按該分類而分別被收容在指定的托架或托架 中之指定的位置，但是、以往係從晶圓將晶片1個1個拾取 而搬運到托架之各位置，所以以往用以搬運1個晶片之所要 時間最短也需要0.7s (秒）。 由於晶片微細化之緣故，毎1片晶圓的晶片數乃戲劇性的 增加，所以晶片搬運所要的總時間也增大，雖然晶片搬運之所 要時間更縮短化係被期待著，然而截至目前爲止像那樣的手 段尙未曾被提供過。 此外，本案申請人及發明者因不知悉與本案發明有關連之 公知專利文獻及公知非專利文獻，所以省略其記載。 【發明內容】 200540086 【發明所欲解決之課題】 本^發明係爲消除上述先前技術的缺點而成者，其目的爲一 種晶片的搬運方法，係把由晶圓切出且按各個特性而分類的 晶片利用夾具拾取到托架，並按分類而排列在該托架之指定 的位置，該晶片的搬運方法晶片係藉由使用夾具而直接搬運 到托架、及將該方法與暫時搬運到設置在晶圓近傍之至少1 個中繼台'再由該中繼台將該晶片利用搬運臂搬運到托架之 方法組合使用，或可選擇此等任一之方法，而將利用夾具的 搬運與利用搬運臂的搬運作適宜組合或選擇係將用以把1個 晶片搬運到托架之所要時間抑制成例如成爲以往的1 /2之 〇.3 5s以下，而戲劇性地提升晶片的搬運效率。 又’其他目的爲，於上述方法中，係藉由將晶片利用夾具而 搬運到設置在晶圓近傍之數個中繼台，且利用與各個該中繼 台對應的搬運臂而將晶片從中繼台各自搬運到各個設置在 該中繼台近傍之托架，使得從晶圓至該中繼台爲止的搬運時 間爲更縮短，且依此而更縮短晶片搬運之所要時間。 再者，其他目的爲，在上述方法中，把前述晶片當中之應搬 運到第1托架之第1分類晶片、利用夾具直接搬運到第1托 架、且將其他分類的晶片利用前述夾具搬運到設置在前述晶 圓近傍之中繼台，再將該其他分類的晶片利用搬運臂各自搬 運到設置在前述中繼台近傍之第2托架，而將對第1托架之 直接搬運與對經由中繼台的第2托架之搬運作組合，而縮短 各晶片搬運之所要時間。 又，其他目的爲，將晶片利用夾具搬運到設置在晶圓近傍 200540086 設爲中 到台到 運繼運 搬中搬 自至地。 各圓三上 台晶連^ 繼從二P 中短接至 從縮被M* 片謀片晶 晶 圖晶 '運 將可使f 臂係即台 運架、繼 搬托此中 個之依從 數傍時地 用近同滯 _ 、、λ, 手台間停 再 繼時不 台中運可 繼該搬,m 中在的台 之置止繼 再者’其他目的爲，藉由具備安裝有收容晶片的托架且構 成爲使該托架在面方向可移動之安裝台、保持晶片被切出白勺 晶圓且構成爲使該晶圓可在面方向移動或旋轉之晶圓台、將 晶片暫時事先保持之中繼台、和以由晶圓拾取晶片的狀態下 往復摇動且構成爲使該晶片可搬運至托架或中繼台之夾 具、以及構成爲可將晶片從中繼台搬運至托架之搬運臂，而 使得夾具和搬運臂係聯合地動作，晶片搬運之所要時間係例 如可縮短成爲以往1/2的0.35s以下。 又，其他目的爲，於上述構成中，藉由複數設置安裝台、中 繼台及搬運臂，而使得從晶圓至該中繼台爲止的搬運時間可 更縮短，且依此係能使晶片搬運的所要時間更縮短。 再者，其他目的爲，於上述構成中，藉由具備安裝有用以收 容被預先分類的晶片當中之第1分類晶片的托架且構成爲使 該第1托架在面方向可移動之第1安裝台、安裝有用以收容 被預先分類的晶片當中之其他分類晶片的第2托架且構成爲 使該第2托架在面方向可移動之第2安裝台、保持晶片被切 出的晶圓且構成爲使該晶圓可在面方向移動或旋轉之晶圓 台、配設在該晶圓台之近傍且構成爲可使其他分類晶片暫時 地保持之中繼台、和以由晶圓拾取晶片的狀態下往復揺動且 構成爲使第1分類晶片可搬運至前述第1托架且可將其他分 200540086 類晶片各自搬運到前述中繼台之夾具；以及構成爲可將其他 分類晶片從中繼台搬運至第2托架之搬運臂，而將對第1托 架之直接搬運與對經由中繼台的第2托架搬運作組合，可縮 短各晶片搬運之所要時間。 ’ 又’其他目的爲，於上述構成中，藉由對中繼台設置數個搬 · 運臂，係縮短從晶圓至中繼台爲止的搬運時間，同時依此、即 “ 使晶片被接二連三地搬運到中繼台，也可不停滞地從中繼台 搬運晶片至托架上。 【用以解決課題之手段】 ♦ 總之，本發明方法（申請專利範圍第1項）爲，藉由夾具 把由晶圓切出且按各自特性所分類的晶片加以拾取而搬運 至托架，且按前述分類而在該托架之指定位置排列，其特徵 爲：使用將前述晶片以前述夾具直接搬運至前述托架之方 法、及將該方法與將該晶片暫時搬運到設置在前述晶圓近傍 之至少1個中繼台，再從該中繼台以搬運臂將該晶片搬運到 前述托架之方法予以組合使用，或可選擇此等任一之方法。 又’本發明方法（申請專利範圍第2項）爲，藉由夾具把 _ 由晶圓切出且按各自特性所分類的晶片加以拾取而搬運至 托架，且按前述分類而在該托架之指定位置排列，其特徵爲： 利用前述夾具將前述晶片搬運到設置在前述晶圓近傍之數 個中繼台，再利用與各個該中繼台對應的搬運臂將各個前述 晶片從前述中繼台搬運到各自設置在該中繼台近傍之前述 托架。 又，本發明方法（申請專利範圍第3項）爲，藉由夾具把 200540086 由晶圓切出且按各自特性所分類的晶片加以拾取而搬運至 托架，且按前述分類而在該托架之指定位置排列，其特徵爲： 把前述晶片當中之應搬運到第1托架之第1分類晶片、利用 夾具直接搬運到第1托架、且將其他分類的晶片利用前述夾 具搬運到設置在前述晶圓近傍之中繼台，再將該其他分類的 晶片利用搬運臂各自搬運到設置在前述中繼台近傍之第2托 架。 又，本發明方法（申請專利範圍第4項）爲，藉由夾具把 由晶圓切出且按各自特性所分類的晶片加以拾取而搬運至 托架，且按前述分類而在該托架之指定位置排列，其特徵爲： 將前述晶片利用前述夾具搬運到設置在前述晶圓近傍之中 繼台，再利用數個搬運臂將前述晶片從前述中繼台各自搬運 到設置在該中繼台近傍之前述托架。 又’本發明方法（申請專利範圍第5項）之特徵爲具備： 安裝有收容晶片的托架且構成爲使該托架在面方向可移動 之安裝台；保持前述晶片被切出的晶圓且構成爲使該晶圓可 在面方向移動或旋轉之晶圓台；將前述晶片暫時事先保持之 中繼台；以由前述晶圓拾取前述晶片的狀態下往復揺動且構 成爲使該晶片可搬運至前述托架或前述中繼台之夾具；以及 構成爲可將前述晶片從前述中繼台搬運至前述托架之搬運 臂。 又’本發明方法（申請專利範圍第6項）之特徵爲具備： 安裝有各個收容晶片的托架且構成爲使該托架在面方向可 各自移動之數個安裝台；保持前述晶片被切出的晶圓且構成 200540086 爲使該晶圓可在面方向移動或旋轉之晶圓台，·配設在該晶圓 台之近傍且構成爲可使前述晶片暫時地保持之數個中繼 台；以由前述晶圓拾取前述晶片的狀態下往復揺動且構成爲 使該晶片可各自搬運至前述中繼台之夾具；以及構成爲可將 前述晶片各自從前述中繼台搬運至前述托架之數個搬運臂。 又，本發明方法（申請專利範圍第7項）之特徵爲具備： 安裝有用以收容被預先分類的晶片當中之第1分類晶片的托 架且構成爲使該第1托架在面方向可移動之第1安裝台；安 裝有用以收容被預先分類的晶片當中之其他分類晶片的第2 托架且構成爲使該第2托架在面方向可移動之第2安裝台； 保持前述晶片被切出的晶圓且構成爲使該晶圓可在面方向 移動或旋轉之晶圓台；配設在該晶圓台之近傍且構成爲可使 其他分類晶片暫時地保持之中繼台；以由前述晶圓拾取前述 晶片的狀態下往復摇動且構成爲使第1分類晶片可搬運至前 述第1托架且可將前述其他分類晶片各自搬運到前述中繼台 之夾具；以及構成爲可將前述其他分類晶片從前述中繼台搬 運至前述第2托架之搬運臂。 又’本發明方法（申請專利範圍第8項）之特徵爲具備： 安裝有收容晶片的托架且構成爲使該托架在面方向可移動 之安裝台；保持前述晶片被切出的晶圓且構成爲使該晶圓可 在面方向移動或旋轉之晶圓台；配設在該晶圓台之近傍且構 成爲可使前述晶片暫時地保持之中繼台；以由前述晶圓拾取 前述晶片的狀態下往復揺動且構成爲使該晶片可搬運至前 述中繼台之夾具；以及構成爲可將前述晶片各自從前述中繼 -10- 200540086 台搬運至前述托架之數個搬運臂。 【發明之效果】 本發明係如同上述，係一種晶片的搬運方法，其藉由夾具把 由晶圓切出且按各自特性所分類的晶片加以拾取而搬運至 托架，且按前述分類而在該托架之指定位置排列，其乃使用將 前述晶片以前述夾具直接搬運至前述托架之方法、及將該方 法與將該晶片暫時搬運到設置在前述晶圓近傍之至少1個中 繼台，再從該中繼台以搬運臂將該晶片搬運到前述托架之方 法予以組合使用，或可選擇此等任一之方法，所以把利用夾具 的搬運及利用搬運臂的搬運予以適宜地組合或作選擇，而把 用以將1個晶片搬運到托架之所要時間抑制成例如成爲以往 的1/ 2之0.35s以下，而具有戲劇性地提升晶片的搬運效率。 又，在上述方法中，因爲係作成利用夾具將晶片搬運到設 置在晶圓近傍之數個中繼台，再利用與各個該中繼台對應的 搬運臂將各個晶片從中繼台搬運到各自設置在該中繼台近 傍之托架，所以具有從晶圓至該中繼台爲止的搬運時間可更 縮短的效果，且最後係可獲得使晶片搬運之所要時間更縮短 之效果。 再者，上述方法中，因爲作成把晶片當中之應搬運到第1 托架之第1分類晶片、利用夾具直接搬運到第1托架、且將 其他分類的晶片利用夾具搬運到設置在晶圓近傍之中繼台， 再將該其他分類的晶片利用搬運臂各自搬運到設置在中繼 台近傍之第2托架，所以把朝向第1托架之直接搬運和經由 中繼台再對第2托架搬運加以組合而具有可使各晶片搬運之 -11- 200540086 所要時間縮短化之效果。 此外’因爲作成將晶片利用夾具搬運到設置在晶圓近傍之 中繼台，再利用數個搬運臂將晶片從中繼台各自搬運到設置 在該中繼台近傍之托架，所以可圖謀縮短從晶圓至中繼台爲 止的搬運時間，藉此、即使晶片被接二連三地搬運到中繼台， 也可獲得不停滯地執行從中繼台搬運至托架上之效果。 再者，因爲具備安裝有收容晶片的托架且構成爲使該托架 在面方向可移動之安裝台；保持晶片被切出的晶圓且構成爲 使該晶圓可在面方向移動或旋轉之晶圓台；將晶片暫時事先 保持之中繼台；以由晶圓拾取晶片的狀態下往復摇動且構成 爲使該晶片可搬運至托架或中繼台之夾具；以及構成爲可將 晶片從中繼台搬運至托架之搬運臂，所以使夾具與搬運臂聯 合地動作，係具有使晶片搬運之所要時間縮短爲例如成爲以 往1 / 2的0 · 3 5 s以下之效果。 又，於上述構成中，因爲複數設置安裝台、中繼台及搬運 臂，所以具有從晶圓至該中繼台爲止的搬運時間可更縮短的 效果，且最後係可獲得使晶片搬運之所要時間更縮短之效 再者，於上述構成中，因爲具備安裝有用以收容被預先分 類的晶片當中之第1分類晶片的托架且構成爲使該第丨托架 在面方向可移動之第1安裝台；安裝有用以收容被預先分類 的晶片當中之其他分類晶片的第2托架且構成爲使該第2托 架在面方向可移動之第2安裝台；保持晶片被切出的晶圓且 構成爲使該晶圓可在面方向移動或旋轉之晶圓台；配設在該 -12- 200540086 晶圓台之近傍且構成爲可使其他分類晶片暫時地保持之中 繼台；以由晶圓拾取晶片的狀態下往復揺動且構成爲使第1 分類晶片可搬運至第1托架且可將其他分類晶片各自搬運到 中繼台之夾具；以及構成爲可將其他分類晶片從中繼台搬運 至前述第2托架之搬運臂，所以把朝向第i托架之直接搬運 與經由中繼台而對第2托架之搬運加以組合，可獲得能縮短 各晶片搬運之所要時間的效果。 又’於上述構成中，因爲對中繼台設置數個搬運臂，所以能 縮短從晶圓至中繼台爲止的搬運時間，同時依此、即使晶片 被接二連三地搬運到中繼台，也可獲得從中繼台執行將晶片 往托架搬運不會停滯的效果。 【實施方式】 以下兹依據圖面所示之實施例來說明本發明。本發明之有 關第1實施例之晶片的搬運裝置1,在第1圖至第3圖中係具 備安裝台2、3、晶圓台4、中繼台5、6、夾具8、及搬運臂 10、1 卜 安裝台2、3係安裝各個用以收容晶片1 4的托架1 2、1 3， 且構成爲使該托架12、13在面方向各自可移動，例如形成在 Y軸方向（箭頭+ Y方向及箭頭一 Y方向）爲可移動。 安裝台2、3係在托架1 2、1 3之Y軸方向由端到端形成例 如能以單程〇.3s執行進給動作（位置補正）。200540086 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method and a device for transferring wafers cut out from wafers and sorting the wafers to a specified position of the carrier, and particularly to A wafer transfer method and apparatus that can reduce the time required for wafer transfer by about 1/2 the same cost as in the past. [Prior technology] As for the wafers made of semiconductors and cut out one by one, the electrical characteristics are different, so check the electrical characteristics one by one, and check the two sides of the wafer. It hurts cracks, and assigns several classifications from good products to defective products according to the results. Each of them is distinguished and coded using, for example, a mark, and recorded as MAP information on a flexible disc (FD) or the like. These wafers are respectively stored in a designated tray or a designated position in the tray according to the classification. However, conventionally, wafers are picked up one by one from a wafer and transferred to each position of the tray. The shortest time required to move a wafer is 0.7s (seconds). Due to the miniaturization of wafers, the number of wafers per one wafer has increased dramatically, so the total time required for wafer transfer has also increased. Although the time required for wafer transfer has been shortened, it is expected that the time required for wafer transfer will decrease. That means was never provided. In addition, since the applicant and the inventor of this case do not know the publicly known patent documents and publicly known non-patent literatures related to the invention of the present case, their descriptions are omitted. [Summary of the Invention] 200540086 [Problems to be Solved by the Invention] The present invention was created to eliminate the shortcomings of the above-mentioned prior art, and its purpose is a method for transferring wafers. The wafers are cut out and classified according to each characteristic. The wafers are picked up by a jig using a jig, and arranged in a designated position on the carrier according to the classification. The wafer transfer method is to directly transfer the wafer to the carrier by using the jig, and to temporarily transfer the method to the installation. At least one relay station near the wafer is used by the relay station to transfer the wafer to the carrier by using a transfer arm, or any one of these methods can be selected, and The appropriate combination or selection using the transfer of the transfer arm suppresses the time required to transfer one wafer to the carrier to, for example, less than 1/2 / 0.35s in the past, and dramatically improves wafer transfer efficiency. Still another object is that, in the above method, the wafer is transferred to a plurality of relay stations provided near the wafer by using a jig, and the wafer is relayed from the relay arm by using a transfer arm corresponding to each of the relay stations. Each stage is transferred to each of the brackets arranged near the relay station, so that the transfer time from the wafer to the relay station is shortened, and the time required for wafer transfer is shortened accordingly. In addition, in the above method, among the above-mentioned methods, the first sorted wafer to be transferred to the first tray among the wafers is directly transferred to the first tray using a jig, and the other sorted wafers are transferred using the jig. To the relay station installed near the aforementioned wafer, and then the wafers of other classifications are transferred to the second bracket installed near the aforementioned relay station by using the transfer arm, and the first bracket is directly transported and aligned. The combination of the second carrier's transfer through the repeater reduces the time required for each wafer transfer. Another purpose is to use a jig to move the wafer to the vicinity of the wafer. Each round three on the stage ^ Continued from the two P short to the contraction M * piece plot piece Jingjing Tujing 'operation will enable the f-arm system to be the platform transport rack, and then follow the number of compliance of this one Use the same hysteresis _, λ from time to time, stop and move between the hands and the platform, and continue to move without the Taichung transportation. The location of the platform in the m is stopped and the other purpose is to provide The holder is a mounting table configured to move the holder in the plane direction, a wafer table configured to hold the wafer to be cut out of the wafer, and a wafer table configured to allow the wafer to be moved or rotated in the plane direction. A holding repeater, a jig that is rocked back and forth while picking up a wafer from a wafer, and configured to carry the wafer to a carrier or a repeater, and is configured to carry a wafer from the repeater to the carrier The transfer arm makes the gripper and the transfer arm operate in a joint manner, and the time required for wafer transfer can be shortened to, for example, less than 0.35 s of the conventional 1/2. In addition, another object is that in the above configuration, a plurality of mounting tables, relay stations, and transfer arms are provided, so that the transfer time from the wafer to the relay station can be further shortened, and the wafer can be made according to this. The time required for handling is even shorter. In addition, another object is to provide the first structure in the above-mentioned configuration with a holder mounted to receive a first sorted wafer among the pre-sorted wafers and a first mount configured to move the first tray in a planar direction. A mounting table, a second holder for mounting other sorted wafers among the pre-sorted wafers, and a second mounting table configured to move the second tray in the plane direction, holding wafers cut out of the wafer A wafer stage capable of moving or rotating the wafer in a planar direction, a relay stage arranged near the wafer stage and configured to temporarily hold other sorted wafers, and a wafer pick-up A jig that reciprocates in a state of a wafer and is configured so that the first sorted wafer can be transferred to the aforementioned first bracket and each of the other 200540086-type wafers can be transferred to the aforementioned repeater; and a jig configured to transfer other sorted wafers therefrom The combination of the direct transfer to the first carrier and the second carrier through the repeater can reduce the time required to transfer each wafer. Another purpose is to shorten the transfer time from the wafer to the repeater by providing a number of transfer and transfer arms to the repeater in the above configuration. It can also be transported to the relay station on the ground, or it can be transported from the relay station to the carrier without stagnation. [Means to solve the problem] ♦ In short, the method of the present invention (the first scope of the patent application) is The wafers are cut out, and the wafers classified according to their respective characteristics are picked up and transported to the carrier, and arranged at the specified position of the carrier according to the aforementioned classification, which is characterized in that the aforementioned wafers are directly transported to the aforementioned carrier by the aforementioned jig. A method for racking, and a method for temporarily transporting the wafer to at least one relay station installed near the wafer, and then transporting the wafer to the bracket by a transfer arm from the relay station Use, or select any of these methods. Also, the method of the present invention (the second item in the scope of patent application) is to pick out the wafers cut out from the wafer by the fixture and pick up the wafers classified according to their characteristics. It is transported to the tray and arranged at the designated position of the tray according to the aforementioned classification. It is characterized in that the wafer is transported to the several relay stations arranged near the wafer by the jig, and reused with each of them. The transfer arm corresponding to the subsequent station transfers each of the aforementioned wafers from the aforementioned relay station to each of the aforementioned brackets disposed near the relay station. In addition, the method of the present invention (item 3 of the scope of patent application) is to use a clamp to transfer the 200540086 The wafers cut out from the wafer and picked up according to their respective characteristics are picked up and transported to the carrier, and arranged at the specified position of the carrier according to the aforementioned classification, which is characterized in that: the wafers should be transported to the first tray The first sorted wafer of the rack is directly transferred to the first tray by the jig, and the other sorted wafers are transferred to the relay station installed near the wafer by the jig, and then the wafers of other sorts are transferred by the transfer arm. Carry it to the second bracket installed near the relay station. In addition, the method of the present invention (item 4 of the scope of patent application) is to cut out the wafer by a jig and adjust it according to its characteristics. The wafers of this type are picked up and transported to a carrier, and are arranged at a specified position of the carrier according to the aforementioned classification. The feature is that the wafer is transported to the relay station located near the wafer by the jig and reused. A plurality of transfer arms each carry the wafer from the relay station to the bracket provided near the relay station. The method of the present invention (item 5 of the patent application) is characterized by: A holder is configured as a mounting table that allows the holder to move in the plane direction; a wafer table holding the wafer from which the wafer is cut out is configured as a wafer table that allows the wafer to move or rotate in the plane direction; the wafer is temporarily A relay stage held in advance; a jig that is reciprocated in a state where the wafer is picked up by the wafer; and a jig configured to allow the wafer to be carried to the carrier or the relay station; and configured to move the wafer from the wafer The relay station is carried to the carrying arm of the aforementioned bracket. The method of the present invention (item 6 of the scope of patent application) is characterized by comprising: a plurality of mounting tables, each of which is provided with a holder for accommodating wafers, and each of which is configured to be movable in the plane direction; and the wafer is cut. Out of the wafer and the structure 200540086 In order to allow the wafer to move or rotate in the plane direction, a wafer stage is arranged near the wafer stage and is configured to hold a number of repeaters for the wafer temporarily ; A jig that is reciprocated in a state where the wafer is picked up from the wafer and is configured so that the wafer can be individually transferred to the relay station; and a structure that can be transferred from the relay station to the bracket respectively Several carrying arms. In addition, the method of the present invention (item 7 of the scope of patent application) is characterized in that: a bracket for accommodating the first sorted wafer among the pre-sorted wafers is mounted, and the first bracket is configured to be movable in the plane direction. The first mounting table; the second mounting table for accommodating the other sorted wafers among the pre-sorted wafers, and the second mounting table configured to move the second tray in the plane direction; and to keep the wafers cut. The wafers produced are configured as wafer tables that can be moved or rotated in a planar direction; the relay tables are arranged near the wafer tables and are configured to temporarily hold other sorted wafers; The jig that reciprocates while the wafer is picking up the wafer and is configured so that the first sorted wafer can be transferred to the first bracket and each of the other sorted wafers can be transferred to the repeater; The other sorted wafer is transferred from the relay station to the transfer arm of the second bracket. The method of the present invention (item No. 8 of the scope of patent application) is characterized by comprising: a mounting table on which a bracket for accommodating a wafer is mounted and configured to move the bracket in a plane direction; and a wafer in which the wafer is cut out is held. A wafer stage configured to allow the wafer to move or rotate in a planar direction; a relay stage disposed near the wafer stage and configured to temporarily hold the wafer; to pick up the wafer from the wafer A jig that reciprocates in a state of a wafer and is configured to allow the wafer to be transferred to the relay station; and a plurality of transfer arms configured to transfer each of the wafer from the relay -10- 200540086 unit to the bracket. . [Effects of the Invention] The present invention is, as described above, a method for transferring wafers. The wafers are cut out of the wafers and sorted according to their respective characteristics by a jig and transferred to a carrier. The trays are arranged at a specified position by using a method of directly transferring the wafer to the bracket by the fixture, and temporarily transferring the method and the wafer to at least one relay station located near the wafer. , And then use the transfer arm to transfer the wafer to the aforementioned bracket from the relay station, or use any of these methods, so the combination of the use of the gripper and the use of the transfer arm are appropriately combined. Alternatively, the time required to transfer one wafer to the carrier can be reduced to 0.32 s or less, which is conventional 1/2, for example, and the wafer transfer efficiency can be dramatically improved. Furthermore, in the above method, the wafer is transferred to several relay stations installed near the wafer by using a jig, and each wafer is transferred from the relay station to each installation by a transfer arm corresponding to each relay station. The carrier near the relay station has the effect of shortening the transfer time from the wafer to the relay station, and finally the effect of shortening the time required for wafer transfer can be obtained. Furthermore, in the above method, the first sorted wafers to be transferred to the first tray among the wafers are prepared, the wafers are directly transferred to the first tray by a jig, and the wafers of other categories are transferred to the wafers by the jigs. Near the relay station, the wafers of other classifications are transferred to the second bracket installed near the relay station by the transfer arm. Therefore, the first bracket is directly transported and the second wafer is transferred to the second bracket via the relay station. The combination of carrier transportation has the effect of shortening the time required for each wafer transportation. In addition, because the wafer is transferred to the relay station located near the wafer by a jig, and several wafer transfer arms are used to transfer the wafer from the relay station to the bracket installed near the relay station, it is possible to shorten the With the transfer time from the wafer to the relay station, even if the wafers are successively transferred to the relay station, the effect of carrying the wafer from the relay station to the carrier can be obtained without stopping. Furthermore, since a mounting table is provided on which a holder for accommodating a wafer is mounted, and the bracket is configured to be movable in the plane direction, the wafer from which the wafer is cut is held, and the wafer is configured to be movable or rotated in the plane direction. A wafer stage; a relay stage for temporarily holding a wafer in advance; a jig to reciprocate in a state of picking up a wafer from a wafer; and a jig configured so that the wafer can be carried to a tray or a relay stage; Since the wafer is transferred from the relay station to the transfer arm of the carrier, the joint operation of the jig and the transfer arm has the effect of shortening the time required for wafer transfer to, for example, 0. 35 seconds or less, which is conventionally 1/2. Moreover, in the above-mentioned configuration, since a plurality of mounting tables, relay stations, and transfer arms are provided, there is an effect that the transfer time from the wafer to the relay station can be further shortened, and finally, it is possible to obtain the wafer transfer requirements The effect of shortening the time is further. In the above-mentioned configuration, since the bracket for mounting the first sorted wafer among the pre-sorted wafers is installed, and the first bracket is configured so that the first bracket can be moved in the plane direction. Mounting table; a second mounting table for mounting a second bracket for accommodating other sorted wafers among the pre-sorted wafers and configured to move the second bracket in a plane direction; a wafer holding a cut out wafer And it is constituted as a wafer stage where the wafer can be moved or rotated in the plane direction; it is arranged near the -12-200540086 wafer stage and is configured as a relay stage for temporarily holding other classified wafers; A jig that reciprocates while the wafer is picking up the wafer and is configured so that the first sorted wafer can be transported to the first tray and each of the other sorted wafers can be transferred to a relay station; The transfer arm transfers to the transfer arm of the second bracket. Therefore, combining the direct transfer to the i-th bracket and the transfer of the second bracket via the repeater can reduce the time required for each wafer transfer. Effect. In the above configuration, since a plurality of transfer arms are provided to the repeater, the transfer time from the wafer to the repeater can be shortened. At the same time, even if the wafer is transferred to the repeater in succession, the transfer can be carried out. An effect is obtained that the wafer is transferred from the relay station to the carrier without stagnation. [Embodiment] The following describes the present invention based on the embodiment shown in the drawings. The wafer transfer device 1 according to the first embodiment of the present invention is provided with a mounting table 2, 3, a wafer table 4, a relay table 5, 6, a jig 8, and a transfer arm in FIGS. 1 to 3. 10, 1 and 2 and 3 are mounted on each of the brackets 1, 2, and 3 for accommodating the wafers 14, and the brackets 12, 13 are respectively movable in the plane direction, for example, formed in the Y-axis direction. (Arrow + Y direction and arrow-Y direction) are movable. The mounting tables 2 and 3 are formed end-to-end in the Y-axis direction of the brackets 1, 2, and 13. For example, it can perform a feed operation (position correction) in a single stroke of 0.3s.
晶圓台4係保持晶片14被切出的晶圓15且構成爲使該晶 圓可在面方向移動或旋轉，例如形成在X軸方向（箭頭+χ 方向及箭頭一 X方向）可移動，同時在箭頭L方向及箭頭R -13- 200540086 方向可旋轉。 爲此，晶圓台4之可動範圍係成爲在移動區域1 6內，又、 晶圓1 5之可動範圍若以旋轉方向固定來考量則爲在移動區 域1 8內。而若考慮晶圓台4之旋轉，則移動區域1 8係與圖 示者不同而成爲圓形。 中繼台5、6係配設在晶圓台4之近傍且構成爲使晶片i 4 可暫時地保持者。中繼台5、6係設置在夾具8之揺動軌跡 上，其位置例如係相互左右對稱。 中繼台5、6係具備著例如吸附機構（未圖示），且例如依 據對晶片14之畫像處理，經由在適宜X軸方向及γ軸方向移 動或在面方向旋轉，而形成可執行該晶片14之位置補正。此 乃係因爲修正中繼台5、6中的該晶片1 4之位置偏差及傾斜 而得以正確地搬運到托架1 2、1 3中之所期望的位置之故。 夾具8係以從晶圓1 5拾取著晶片1 4的狀態下往復摇動， 且可使該晶片14各自搬運到中繼台5、6之構成者，係安裝 在中心軸19,而經由旋轉驅動該中心軸19,而形成例如一次 9〇°在總計180°的範圍內往復揺動。夾具8爲了拾取晶片14, 係各自具有例如吸附機構（未圖示）。 晶圓台4係例如在〇.15s之期間，執行畫像解析，可使應拾 取的晶片14移動到拾取位置，夾具8係例如在0· 1 s之期間， 可執行晶片14之拾取及放開，然後中心軸19係例如在0.1s 之期間旋動而形成可搬運晶片14。 因此，例如利用夾具8吸附晶圓1 5內的晶片14再搬運到 中繼台5爲止所要的時間合計爲0.35s。 -14- 200540086 搬運臂10、11係可從中繼台5、6將晶片14各自搬運到 托架1 2、1 3之構成，係各自具有使具有吸附機構（未圖示） 的夾具1 〇 a、1 1 a在X軸方向驅動之驅動機構（皆未圖示）。 夾具10a、1 la之往復所要的時間係各自例如最大爲〇.45s。 其次，本發明之有關第2實施例之晶片的搬運裝置20,在 第5圖至第7圖中係具備第1安裝台21、第2安裝台22、 晶圓台4、中繼台23、夾具24、及搬運臂26。 第1安裝台21係安裝有用以將預先分類的晶片28當中之 第1分類晶片28A予以收容的第1托架31，且使該第1托架 31可在面方向移動之構成，例如形成在X軸方向（箭頭+ X 方向及箭頭一 X方向）和Y軸方向（箭頭+ Y方向及箭頭一 Y方向）各自可移動。此移動係各個間隔移動，1間隔移動所 要的時間係例如爲0.15s。 第2安裝台22係安裝有用以收容晶片28當中之其他分類 晶片28B的第2托架32且構成爲使該第2托架32在面方向 可移動，例如形成在Y軸方向（箭頭+ Y方向及箭頭一 Y方 向）可移動。 第2安裝台22係在第2托架32的Y軸方向由端到端形成 爲例如能以單程0.3s來執行進給動作（位置補正）。 中繼台23係配設在晶圓台4近傍，且使其他分類晶片28B 可暫時地保持的構成，係設置在夾具24之揺動軌跡上，且具 有例如吸附機構（未圖示）。且例如依據對晶片28B之畫像 處理，經由在適宜X軸方向及Y軸方向移動或在面方向旋轉， 而可執行該晶片28B之位置補正。此乃係因爲作成修正中繼 -15- 200540086 台23中的該晶片28B之偏差及傾斜而可正確地搬運到第2 托架3 2中的所期望位置之故。 夾具24係以從晶圓1 5拾取晶片2 8的狀態下往復揺動，且 使第1分類晶片28A可搬運到第1托架31，且使其他分類晶 片2 8B可各自搬運到中繼台23之構成者，且被安裝在中心軸 29,而爲了拾取晶片28,係各自具有例如吸附機構（未圖 示）。夾具24係藉由旋轉驅動中心軸29而形成在例如一次 爲90°而總計爲180°的範圍內往復揺動。 搬運臂26係可將其他分類晶片28B從中繼台23搬運到第 2托架32之構成，其具有使具有吸附機構（未圖示）的夾具 26a在X軸方向驅動之驅動機構（皆未圖示）。夾具26a之 往復所要的時間例如最大爲0.55s。 此外，有關晶圓台4,因爲係與第1實施例同樣，所以對相 同部分，係在圖面上賦予同一符號並省略說明。 本發明之有關第3實施例之晶片的搬運裝置30,在第9圖 至第12圖中係具備安裝台33、晶圓台4、中繼台34、夾具 35、及搬運臂36、38。 安裝台33係安裝有用以收容晶片39的托架40、且使該托 架4〇在面方向可移動之構成者，例如形成在Y1軸方向（箭 頭+ Y1方向及箭頭一 Y1方向）各自可移動。 安裝台33係在托架40之Y1軸方向由端到端形成例如能 以單程0.3s執行進給動作（位置補正）。 中繼台34係配設在晶圓台4近傍且構成爲使晶片39可暫 時地保持，且設置在夾具3 5之揺動軌跡上，係具有例如吸附 -16- 200540086 機構（未圖示）。又、例如依據對晶片3 9之畫像處理，經由 在適宜Y1軸方向移動或在面方向旋轉，而可執行該晶片39 之位置補正。此乃係因爲作成修正中繼台3 4中的該晶片3 9 之偏差及傾斜而可正確地搬運到托架40中之所期望位置之 故。 夾具35係以由晶圓15拾取晶片39的狀態下往復揺動且 可將該晶片39搬運到中繼台34之構成，係被安裝在中心軸 41，且藉由旋轉驅動該中心軸41而形成例如在45。的範圍內 往復摇動。夾具35爲了拾取晶片39,係具有例如吸附機構（未 圖示）。 搬運臂36、38係可將晶片39從中繼台34各自搬運到托 架40之構成，且具有使具有吸附機構（未圖示）的夾具36a、 3 8a各自在XI軸方向（箭頭+ χΐ方向及箭頭-X1方向） 驅動之驅動機構（皆未圖示）。夾具10a、11a之往復所要 的時間係各自例如最大爲0.55s。 此外，有關晶圓台4,因爲與第1實施例同樣，所以對相同部 分，係在圖面上賦予同一符號並省略說明。 本發明（申請專利範圍第1項）之晶片的搬運方法，係藉 由夾具把由晶圓1 5切出且按各自特性所分類的晶片14加以 拾取而搬運至托架，且按分類而在該托架之指定位置排列，其 使用將晶片14以前述夾具直接搬運至托架之方法、及將該 方法與將該晶片暫時搬運到設置在晶圓1 5近傍之至少i個 中繼台6,再從該中繼台以搬運臂1 1將該晶片搬運到托架13 之方法予以組合使用，或可選擇此等任一之方法。 -17- 200540086 又，本發明（申請專利範圍第2項）之搬運方法，係藉由 夾具把由晶圓切出且按各自特性所分類的晶片加以拾取而 搬運至托架，且按前述分類而在該托架之指定位置排列，其利 用前述夾具8將晶片14搬運到設置在前述晶圓15近傍之數 個中繼台5、6,再利用與各個該中繼台對應的搬運臂10、11， 將各個晶片1 4從前述中繼台5、6搬運到各自設置在該中繼 台近傍之托架12、13。 又，本發明（申請專利範圍第3項）之晶片的搬運方法， 係藉由夾具把由晶圓1 5切出且按各自特性所分類的晶片28 加以拾取而搬運至托架，且按分類而在該托架之指定位置排 列，其係將晶片28當中之應搬運到第1托架3 1之第1分類 晶片28A、利用夾具24直接搬運到第1托架31、且將其他 分類的晶片利用夾具24搬運到設置在晶圓1 5近傍之中繼台 23,再將該其他分類的晶片28B利用搬運臂26各自搬運到設 置在中繼台23近傍之第2托架32。 又，本發明（申請專利範圍第4項）晶片的搬運方法，係 藉由夾具把由晶圓1 5切出且按各自特性所分類的晶片39加 以拾取而搬運至托架，且按分類而在該托架之指定位置排列， 其係將晶片39利用夾具35搬運到設置在晶圓15近傍之中 繼台34,再利用數個搬運臂36、38將晶片39從前述中繼台 34各自搬運到設置在該中繼台近傍之托架40。 本發明係如同上述般地構成，以下茲針對其作用來作說 明。首先茲針對本發明之有關第1實施例之晶片的搬運裝置 1的作用作說明，該晶片的搬運裝置1係依據如第4圖所示的 -18 - 200540086 時間圖而動作。 第1圖中，夾具8係從吸附著晶圓15上的晶片14的狀態 藉中心軸19在箭頭R方向90。旋轉而位在中繼台5上以將 該晶片14送出到該中繼台5 (搬運所要的時間爲〇·3 5s )。 夾具8係在將晶片1 4送出到中繼台5之後，再返回晶圓i 5 上。而下個予定被搬運之晶片14係在被夾具8執行吸附之 前，依晶圓台4之驅動而在例如箭頭一 X方向移來吸附位 置。吸附位置，例如爲移動區域1 6之中心。 中繼台5係例如使用畫像解析而在〇· ! s以內被執行位置補 正。接著、搬運臂10的夾具l〇a係吸附中繼台5上的晶片 14而在箭頭一 X方向搬運到托架12。夾具l〇a之往復時間 例如爲0.45s。此時、安裝台2爲了使托架12中之晶片14 的收容位置與夾具10a的移動端配合，係在〇.3s以內將托架 12在Y軸方向驅動以執行定位。 一方面，在上述的中繼台5之位置補正一開始的同時，如 第2圖所示，夾具8係拾取下個晶片14,中心軸19在箭頭L 方向旋轉90。而對中繼台6送出該下個晶片14然後再返回晶 圓15上，此時間也是〇.35s。再者、下個晶片14也是藉由晶 圓台4例如被驅動於箭頭一 X方向而移來吸附位置。 中繼台6係與中繼台5同樣地，例如使用畫像解析而在〇.ls 以內執行位置補正。其次、搬運臂11的夾具^係a吸附中 繼台6上的晶片14而在箭頭+ χ方向搬運到托架13。夾具 Ha之往復時間係例如爲0 45s。此時安裝台3爲了使托架 13中之晶片14的收容位置與夾具丨la的移動端配合，係在 -19 · 200540086 〇.3s以內將托架13驅動γ於軸方向以執行定位。 在此期間，如第3圖所示，再者、下個晶片14係被夾具8 搬運到中繼台5,經由反覆以下相同動作，晶圓15的晶片14 係被搬運到托架12或托架13。 晶片的搬運裝置1中，將晶片i 4從晶圓1 5搬運到中繼台 5、6而再返回晶圓15上爲止的時間爲〇· 35 s，而在其後的搬 運係全憑搬運臂10、11，且作成在中繼台5、6不發生晶片 14滯留，所以毎1個晶片14的搬運所要時間並不超過〇. 3 5s， 與以往的0.7s比較之下係被縮短成2。且並非例如特別 使用高性能的馬達（未圖示）等以縮短所要時間者，因爲係 對搬運的方法下工夫而完成者，所以成本係與以往一樣。 此外，要把晶片1 4搬運到托架1 2和托架1 3當中的那一個， 乃係依各晶片14的分類而任意地決定的事項，例如也可在托 架12和托架13中，將各個同樣分類依序配列晶片14,且也可 將最佳晶質的晶片排列在托架12,而將其餘品質的晶片排列 在托架1 3。晶片1 4之分類係依各晶片之電氣特性的檢查結 果而被執行，各晶片之分類係例如利用標記來進行。在以下 的實施例也是同樣。 此外，在本實施例中係將安裝台、托架、中繼台及搬運臂 各自設置2組，但是並不受限於此，也可以更多。 其次，茲針對本發明之有關第2實施例之晶片的搬運裝置 2〇的作用作說明。該晶片的搬運裝置20係依據如第8圖所 示的時間圖而動作。The wafer stage 4 holds the wafer 15 from which the wafer 14 is cut out and is configured so that the wafer can be moved or rotated in a planar direction, for example, formed in the X-axis direction (arrow + χ direction and arrow-X direction) to be movable, At the same time, it can rotate in the direction of arrow L and arrow R -13- 200540086. For this reason, the movable range of the wafer table 4 is within the moving area 16 and the movable range of the wafer 15 is considered to be within the moving area 18 if the rotation direction is fixed. On the other hand, if the rotation of the wafer stage 4 is taken into consideration, the moving area 18 becomes a circle different from the one shown in the figure. The relay stations 5 and 6 are arranged near the wafer stage 4 and are configured so that the wafer i 4 can be temporarily held. The relay stations 5 and 6 are arranged on the trajectory of the jig 8 and their positions are, for example, symmetrical to each other. The relay stations 5 and 6 are equipped with, for example, a suction mechanism (not shown), and are formed by performing, for example, image processing of the wafer 14 by moving in a suitable X-axis direction and a γ-axis direction or rotating in a plane direction. The position of the wafer 14 is corrected. This is because the positional deviation and inclination of the wafer 14 in the relay stations 5 and 6 are corrected, so that the wafer 14 can be accurately carried to the desired position in the trays 1 and 12. The jig 8 is configured to swing back and forth while picking up the wafers 14 from the wafers 15 and the wafers 14 can be transported to the relay stations 5 and 6 respectively. The jigs 8 are mounted on the central axis 19 and rotated. This central axis 19 is driven to form, for example, 90 ° at a time to reciprocate within a total range of 180 °. Each of the jigs 8 includes a suction mechanism (not shown) for picking up the wafer 14. For example, wafer stage 4 performs image analysis during 0.15s to move the wafer 14 to be picked to the picking position, and jig 8 is capable of picking and releasing wafer 14 during, for example, 0.1 seconds. Then, the central axis 19 is rotated, for example, within 0.1 s to form the transportable wafer 14. Therefore, for example, the total time required for the wafer 14 in the wafer 15 to be sucked by the jig 8 and then transferred to the relay station 5 is 0.35 s. -14- 200540086 The transfer arms 10 and 11 are capable of transferring the wafers 14 to the brackets 1 2 and 13 respectively from the relays 5 and 6, and each has a clamp 1 having a suction mechanism (not shown) 1 〇a 1 1 a drive mechanism (none shown) for driving in the X-axis direction. The time required for reciprocating the clamps 10a and 1a is, for example, 0.45s at the maximum. Next, the wafer transfer device 20 according to the second embodiment of the present invention includes a first mounting table 21, a second mounting table 22, a wafer table 4, a relay table 23, and the like in FIGS. 5 to 7. The clamp 24 and the transfer arm 26. The first mounting table 21 is a structure for mounting a first bracket 31 for accommodating a first sorted wafer 28A among the pre-sorted wafers 28, and the first bracket 31 is movable in a planar direction. The X-axis direction (arrow + X direction and arrow-X direction) and the Y-axis direction (arrow + Y direction and arrow-Y direction) can be moved separately. This movement is performed at intervals, and the time required for one interval movement is, for example, 0.15s. The second mounting table 22 is configured to mount a second bracket 32 for accommodating other sorted wafers 28B among the wafers 28 and is configured to move the second bracket 32 in a plane direction, for example, in the Y-axis direction (arrow + Y) Direction and arrow-Y direction) can be moved. The second mounting table 22 is formed end-to-end in the Y-axis direction of the second bracket 32 so that, for example, a feed operation (position correction) can be performed in 0.3 s per pass. The relay station 23 is disposed near the wafer table 4 and temporarily holds other sorted wafers 28B. The relay station 23 is provided on the trajectory of the jig 24 and has, for example, a suction mechanism (not shown). For example, according to the image processing of the wafer 28B, the position correction of the wafer 28B can be performed by moving in the appropriate X-axis direction and Y-axis direction or rotating in the plane direction. This is because the deviation and inclination of the wafer 28B in the correction relay -15- 200540086 unit 23 is made and can be accurately carried to the desired position in the second bracket 32. The jig 24 is reciprocated in a state of picking up the wafers 28 from the wafers 15 so that the first sorting wafer 28A can be transferred to the first tray 31 and the other sorting wafers 2 8B can be individually transferred to the relay station. The constituents of 23 are mounted on the central axis 29, and each has a suction mechanism (not shown) for picking up the wafer 28, for example. The jig 24 is formed by rotating and driving the central shaft 29 to reciprocate within a range of, for example, 90 ° at a time and 180 ° in total. The transfer arm 26 is a structure that can transfer other sorted wafers 28B from the relay stage 23 to the second bracket 32, and has a driving mechanism (not shown) for driving the jig 26a having a suction mechanism (not shown) in the X-axis direction. Show). The time required for reciprocating the jig 26a is, for example, 0.55s at the maximum. Since the wafer stage 4 is the same as the first embodiment, the same parts are given the same reference numerals on the drawings, and descriptions thereof are omitted. The wafer transfer device 30 according to the third embodiment of the present invention includes a mounting table 33, a wafer table 4, a relay table 34, a jig 35, and transfer arms 36 and 38 in Figs. 9 to 12. The mounting table 33 is a structure in which a bracket 40 for accommodating the wafer 39 is mounted and the bracket 40 is movable in the plane direction. mobile. The mounting table 33 is formed end-to-end in the Y1 axis direction of the bracket 40, for example, and can perform a feed operation (position correction) in 0.3s per pass. The relay station 34 is arranged near the wafer table 4 and is configured to temporarily hold the wafer 39, and is arranged on the trajectory of the jig 35, for example, and has a mechanism of suction-16-200540086 (not shown). . Furthermore, for example, based on the image processing of the wafer 39, the position correction of the wafer 39 can be performed by moving in the Y1-axis direction or rotating in the plane direction. This is because the deviation and inclination of the wafer 39 in the relay station 34 are corrected so that the wafer 40 can be accurately carried to a desired position in the carriage 40. The clamp 35 is configured to be reciprocated while picking up the wafer 39 from the wafer 15 and can transport the wafer 39 to the repeater 34. The clamp 35 is mounted on the central axis 41, and the central axis 41 is driven by rotation. Formed at 45, for example. Shake back and forth within the range. In order to pick up the wafer 39, the jig 35 includes, for example, a suction mechanism (not shown). The transfer arms 36 and 38 are each configured to transfer the wafer 39 from the relay stage 34 to the carrier 40, and each of the jigs 36a and 38a having a suction mechanism (not shown) is provided in the XI axis direction (arrow + χΐ direction). And arrow-X1 direction) drive mechanism (none shown). The time required for reciprocating the jigs 10a and 11a is, for example, 0.55s at the maximum. Since the wafer stage 4 is the same as the first embodiment, the same portions are given the same reference numerals on the drawings, and descriptions thereof are omitted. The wafer transfer method of the present invention (the first item in the scope of patent application) is to pick up the wafers 14 cut out from the wafers 15 and sort them according to their respective characteristics by a jig, and then transfer them to the trays. The trays are arranged at a specified position, using a method of directly transferring the wafer 14 to the tray with the aforementioned fixture, and temporarily transferring the method and the wafer to at least i relay stations 6 located near the wafer 15 Then, the method of transferring the wafer to the carrier 13 by the transfer arm 11 from the relay station is used in combination, or any of these methods can be selected. -17- 200540086 In addition, the conveying method of the present invention (item 2 in the scope of patent application) uses a clamp to pick out wafers cut out from the wafer and sort the wafers according to their respective characteristics, and then transports the wafers to the tray. At the designated position of the bracket, the wafer 14 is transferred to the several relay stations 5 and 6 arranged near the wafer 15 by the jig 8, and then the transfer arm 10 corresponding to each of the relay stations is used. 11 and 11. Each wafer 14 is transferred from the relay stations 5 and 6 to the brackets 12 and 13 respectively disposed near the relay station. In addition, the wafer transfer method of the present invention (item 3 of the scope of patent application) is to pick up the wafers 28 cut out from the wafers 15 and classified according to their respective characteristics by a jig, and then transfer the wafers to a tray. Arranged at the specified position of the tray, the first sorted wafer 28A of the wafer 28 to be transferred to the first tray 31, directly transferred to the first tray 31 by the clamp 24, and other sorted The wafer is transferred to the relay station 23 installed near the wafer 15 by the jig 24, and the wafers 28B of other classifications are transferred to the second bracket 32 installed near the relay station 23 by the transfer arm 26. In addition, the wafer transfer method of the present invention (item 4 in the scope of patent application) is to pick up the wafer 39 cut out from the wafer 15 and classified according to the respective characteristics by a jig, and then transfer the wafer 39 to the carrier. Arranged at the specified position of the bracket, the wafer 39 is transferred to the relay station 34 provided near the wafer 15 by the jig 35, and the wafer 39 is transferred from the relay station 34 by a plurality of transfer arms 36 and 38. It is carried to the bracket 40 installed near the repeater. The present invention is structured as described above, and its action will be described below. First, the function of the wafer transfer device 1 according to the first embodiment of the present invention will be described. The wafer transfer device 1 operates according to the timing chart of -18-200540086 shown in FIG. 4. In the first figure, the jig 8 is 90 from the state where the wafer 14 on the wafer 15 is adsorbed on the center axis 19 in the arrow R direction. It is rotated and positioned on the relay station 5 to send out the wafer 14 to the relay station 5 (the time required for transportation is 0.35s). The jig 8 sends out the wafer 14 to the relay station 5 and then returns to the wafer i 5. On the other hand, the wafer 14 to be transported next is moved in the arrow-X direction by the driving of the wafer table 4 to perform the suction position before the suction is performed by the jig 8. The suction position is, for example, the center of the moving area 16. The relay station 5 performs position correction within 0 · s using image analysis, for example. Next, the jig 10a of the transfer arm 10 sucks the wafer 14 on the relay stage 5 and transfers it to the carriage 12 in the direction of the arrow X. The reciprocating time of the jig 10a is, for example, 0.45s. At this time, in order to match the receiving position of the wafer 14 in the bracket 12 with the moving end of the jig 10a, the mounting table 2 drives the bracket 12 in the Y-axis direction within 0.3 seconds to perform positioning. On the other hand, at the same time as the position correction of the relay station 5 described above is started, as shown in FIG. 2, the jig 8 picks up the next wafer 14, and the center axis 19 rotates 90 in the direction of the arrow L. The next wafer 14 is sent to the relay station 6 and then returned to the wafer 15. This time is also 0.35s. In addition, the next wafer 14 is also moved to the suction position by the wafer table 4 being driven in, for example, the direction of arrow X. The relay station 6 is similar to the relay station 5 in that it performs position correction within 0.1s using image analysis, for example. Next, the jig ^ of the transfer arm 11 sucks the wafer 14 on the relay stage 6 and transfers it to the carriage 13 in the arrow + x direction. The reciprocating time of the jig Ha is, for example, 0 to 45 seconds. At this time, in order to match the receiving position of the wafer 14 in the bracket 13 with the moving end of the jig 1a, the mounting table 3 drives the bracket 13 in the axis direction within -19 · 200540086 0.3s to perform positioning. In the meantime, as shown in FIG. 3, the next wafer 14 is transferred to the repeater 5 by the jig 8. After repeating the same operation, the wafer 14 of the wafer 15 is transferred to the tray 12 or tray.架 13. Shelf 13. In the wafer transfer device 1, the time required for the wafer i 4 to be transferred from the wafer 15 to the relay stations 5 and 6 and then returned to the wafer 15 is 0.35 s. The subsequent transfer is entirely by transfer. The arms 10 and 11 are made so that the retention of the wafer 14 does not occur at the relay stations 5 and 6. Therefore, the time required for the transportation of one wafer 14 does not exceed 0.3 5 s, which is shortened compared with the conventional 0.7 s. 2. In addition, it is not necessary to use a high-performance motor (not shown) to shorten the required time. The cost is the same as in the past because it is completed by the handling method. In addition, it is a matter of arbitrarily determining whether to transfer the wafers 14 to the trays 12 and 13 depending on the classification of the respective wafers 14. For example, the wafers 12 and 13 may be transferred to the trays 12 and 13. The wafers 14 are sequentially arranged in the same classification, and the wafers with the best crystal quality can also be arranged in the tray 12 while the remaining quality wafers can be arranged in the tray 13. The classification of the wafers 14 is performed based on the inspection results of the electrical characteristics of each wafer, and the classification of each wafer is performed using, for example, a mark. The same applies to the following embodiments. In addition, in this embodiment, two sets of the mounting table, the bracket, the relay station, and the carrying arm are provided, but the present invention is not limited to this, and may be more. Next, the function of the wafer transfer device 20 according to the second embodiment of the present invention will be described. The wafer transfer device 20 operates in accordance with the timing chart shown in FIG.
第5圖中，夾具24係從吸附晶圓15上的第1分類晶片28A -20- 200540086 之狀態藉由中心軸29在箭頭R方向90°旋轉而位在第1托 架31上，以將該晶片28A直接收容到該第1托架31 (夾具 24從晶圓15拾取晶片28A搬運到第1托架31而再返回晶 圓1 5上爲止的時間爲0 · 3 5 s )。 此時第1安裝台21爲了預先使第1托架31中之第1分類 晶片28A的收容位置與來自夾具24之授取位置配合，係在 〇 · 1 5 s以內使第1托架3 1在X軸方向及Y軸方向間隔移動以 執行定位。第1托架31因爲成爲第1分類晶片28A專用， 所以即使是僅間隔移動、也可將該晶片接二連三地收容下 去。 一方面，此時其他分類晶片28B係例如藉由將晶圓台4朝 一 X方向驅動而移動到吸附位置，接著再被夾具24所吸附。 在夾具24 —吸附該其他分類晶片2 8B之後，則中心軸29係 在箭頭L方向90°旋轉，該其他分類晶片28B係被搬運到中繼 台23 (夾具24從晶圓15拾取晶片28B而搬運到第2托架 32而再返回晶圓15上爲止的時間爲〇.35s)。此外，在第8 圖之時間圖中並未顯示，即也可在中繼台2 3，例如使用畫像 解析以執行位置補正（X軸方向、Y軸方向及旋轉方向）。 該位置補正所要時間例如爲0.1 s以內。 接者，如第7圖所不，搬運臂26的夾具26a係吸附中繼台 23上之其他分類晶片28B而在箭頭X方向搬運到第2托架 32。夾具26a之往復時間例如爲〇.55s。此時第2安裝台22 爲了使第2托架32中的其他分類晶片28B之收容位置與夾 具26a的移動端配合，係在〇.3s以內使第2托架32在Y軸方 -21- 200540086 向驅動以執行定位。 在利用搬運臂2 6執行搬運的期間，中心軸2 9係在箭頭R 方向90°旋轉，而第1分類晶片28A係被搬運到第1托架31。 此時、例如第1安裝台2 1係例如在箭頭一 X方向間隔移動 著。以下同樣地，晶圓15的晶片28係被搬運到第1托架31 或第2托架32。此外，也可對第1托架31或第2托架32交 互地搬運晶片28,又如第8圖的時間圖所示，也可作成基本上 對第1托架31搬運第1分類晶片28A，而僅在爲其他分類 晶片2 8 B時才將該晶片對第2托架3 2搬運。 有關本實施例，也與第1實施例同樣地，毎1個晶片28之搬 運所要時間並不超過0.35s，乃非常具有效率。 接著，茲針對本發明之有關第3實施例之晶片的搬運裝置 3 0的作用作說明。該晶片的搬運裝置3 〇係依據如第1 3圖所 示的時間圖而動作。 第9圖中，夾具35係從吸附著晶圓15上的晶片39的狀態 藉中心軸41在箭頭R方向45。旋轉而位在中繼台34上，以將 該晶片39對該中繼台34送出（夾具35從晶圓15拾取晶片 39而搬運到中繼台34爲止，且再返回晶圓15爲止的時間爲 〇.35s 左右）。 以中繼台3 4而言，當晶片3 9被送出時，則例如使用畫像處 理而在〇· 1 s以內、例如在箭頭+ γ 1方向執行位置補正。有 時係在旋轉方向執行位置補正。在該位置補正被執行爲止， 安裝台33係被驅動於γ軸方向以執行托架40之定位，而在 中繼台34之位置補正完了後，搬運臂38之夾具38a係吸附 -22- 200540086 中繼台34上的晶片39而在箭頭一 XI方向搬運到托架40。 夾具38a之往復時間係例如爲0.55s。 中繼台34係在晶片39 —被夾具38a吸附之後立即在箭頭 —Y 1方向移動，且成爲中立狀態（第9圖之位置）。此外， 若維持移動到搬運臂3 8側能接收下個晶片3 9，則也可使中繼 台34不返回中立狀態。 第10圖及第11圖中，在搬運臂38執行晶片39的搬運之 期間，晶圓台4係例如在箭頭一 X方向移動，且下個晶片3 9係 被夾具35所吸附，中心軸41在箭頭L方向45。旋轉且晶片被 搬運到中繼台34。接著、這次如第12·圖所示，中繼台34係 在0.1s以內於箭頭-Y上方向被執行位置補正，搬運臂36之 夾具36a係吸附中繼台34上的晶片39,在箭頭一 XI方向搬 運到托架40。夾具36a之往復時間也比如爲〇.55s。 以下同樣地，交互地使用搬運臂36、38而將各晶片39朝 托架40之指定的位置搬運，依此毎丨個晶片39之搬運所要 時間並不會超過0.3 5 s。 此外在本實施例中，係將搬運臂設置2支，但是並不受限於 此，也可以更多。又、中繼台34的位置補正並不受限於Y1 軸方向，也可因應需要而執行旋轉方向的位置補正。 又、在第4、8、1 3圖係各自顯示時間圖，但此等乃係例示， 晶片之搬運裝置1、20、30的作用並不受限於依據此等時間 圖者。 【圖式簡單說明】 【第1圖】第1圖至第4圖係有關第1實施例，第1圖係 -23- 200540086 表示晶片的搬運裝置之槪略上視圖。 【第2圖】表示被夾具搬運到一方的中繼台之晶片在被搬 運臂搬運到托架之期間，利用夾具搬運晶片到另一方的中繼 台之狀態的上視圖。 【第3圖】表示第2圖中之另一方的中繼台上的晶片在被 搬運臂搬運到托架之期間，利用夾具搬運晶片到一方的中繼 台之狀態的上視圖。 【第4圖】時間圖。 【第5圖】第5圖至第8圖係有關第2實施例，第5圖係 表示晶片的搬運裝置之槪略上視圖。 【第6圖】表示利用夾具將其他分類晶片從晶圓搬運到中 繼台之狀態的上視圖。 【第7圖】表示在第6圖中之中繼台上的其他分類晶片被 搬運臂搬運到第2托架之期間，將第1分類晶片搬運到第1 托架之狀態的上視圖。 【第8圖】時間圖。 【第9圖】第9圖至第13圖係有關第3實施例，第9圖係 表示晶片的搬運裝置之槪略上視圖。 【第1 0圖】表示在將中繼台上的晶片利用搬運臂搬運到 托架的期間、夾具吸附著晶圓上的晶片之狀態的上視圖。 【第1 1圖】表示將第1 0圖中之由夾具所吸附的晶片從晶 圓搬運到中繼台的狀態之上視圖。 【第12圖】表示將第11圖中之晶片利用搬運臂從中繼台 搬運到托架之狀態的上視圖。 -24- 200540086 【第13圖】時間圖。 【符號說明】 1 搬運裝置 2 安裝台 3 安裝台 5 中繼台 6 中繼台 8 夾具 10 搬運臂 11 搬運臂 12 托架 13 托架 14 晶片 15 晶圓. 20 晶片的搬運裝置 21 第1安裝台 22 第2安裝台 23 中繼台 24 夾具 26 搬運臂 28 晶片 28 A 第1分類晶片 28B 第2分類晶片 30 搬運裝置 -25- 200540086 3 1 第1托架 32 第2托架 33 安裝台 34 中繼台 35 夾具 36 搬運臂 38 搬運臂 39 晶片 40 托架 -26-In FIG. 5, the clamp 24 is located on the first bracket 31 from the state of the first sorted wafer 28A -20- 200540086 on the suction wafer 15 by rotating the central axis 29 in the direction of the arrow R by 90 °, so that The wafer 28A is directly stored in the first carrier 31 (the time until the holder 24 picks up the wafer 28A from the wafer 15 and transports the wafer 28A to the first carrier 31 and returns to the wafer 15 is 0 · 3 5 s). At this time, in order to match the receiving position of the first sorting wafer 28A in the first bracket 31 with the receiving position from the clamp 24 in advance, the first mounting table 21 makes the first bracket 3 1 within 0.15 seconds. Positioning is performed by moving at intervals in the X-axis direction and the Y-axis direction. Since the first bracket 31 is used exclusively for the first sorted wafer 28A, the wafer can be stored one after another even if it is moved only at intervals. On the one hand, at this time, the other sorted wafers 28B are moved to the suction position by, for example, driving the wafer stage 4 in an X direction, and then sucked by the clamp 24. After the clamper 24 attracts the other sorted wafer 2 8B, the central axis 29 rotates 90 ° in the direction of the arrow L, and the other sorted wafer 28B is carried to the relay station 23 (the clamper 24 picks up the wafer 28B from the wafer 15 and The time until it is transferred to the second carrier 32 and returned to the wafer 15 is 0.35s). In addition, it is not shown in the time chart of Fig. 8, that is, it is also possible to perform position correction (for example, X-axis direction, Y-axis direction, and rotation direction) on the relay station 2 3 using, for example, image analysis. The time required for this position correction is, for example, within 0.1 s. Then, as shown in FIG. 7, the jig 26a of the transfer arm 26 sucks the other sorted wafers 28B on the relay table 23 and transfers them to the second bracket 32 in the direction of the arrow X. The reciprocating time of the jig 26a is, for example, 0.55 s. At this time, in order to match the storage position of the other sorted wafers 28B in the second bracket 32 with the moving end of the clamp 26a, the second mounting table 22 makes the second bracket 32 on the Y axis side within 0.3 seconds. 200540086 Drive to perform positioning. During the transfer by the transfer arm 26, the central axis 29 is rotated 90 ° in the direction of the arrow R, and the first sorted wafer 28A is transferred to the first bracket 31. At this time, for example, the first mounting base 21 is moved at intervals in the direction of arrow X, for example. Similarly, the wafer 28 of the wafer 15 is transferred to the first carrier 31 or the second carrier 32. In addition, the wafer 28 may be transferred to the first bracket 31 or the second bracket 32 alternately, and as shown in the timing chart of FIG. 8, the first sorted wafer 28A may be basically transferred to the first bracket 31. , And only when the wafers of other classifications 2 8 B are transported to the second bracket 32. In this embodiment, as in the first embodiment, the time required to move one wafer 28 does not exceed 0.35 s, which is very efficient. Next, the function of the wafer transfer device 30 according to the third embodiment of the present invention will be described. The wafer transfer device 30 operates according to the timing chart shown in FIG. 13. In FIG. 9, the jig 35 is in a direction 45 of the arrow R by the central axis 41 from the state where the wafer 39 on the wafer 15 is adsorbed. Rotate and position on the relay stage 34 to send the wafer 39 to the relay stage 34 (time until the clamp 35 picks up the wafer 39 from the wafer 15 and transfers it to the relay stage 34, and returns to the wafer 15 again (About 0.35s). For the relay station 34, when the wafer 39 is sent out, for example, image processing is used to perform position correction within 0.1 s, for example, in the direction of arrow + γ 1. Sometimes position correction is performed in the rotation direction. Until the position correction is performed, the mounting table 33 is driven in the γ-axis direction to perform the positioning of the bracket 40, and after the position correction of the relay table 34 is completed, the jig 38a of the transfer arm 38 is sucked-22- 200540086 The wafer 39 on the repeater 34 is transferred to the carriage 40 in the direction of arrow XI. The reciprocating time of the jig 38a is, for example, 0.55s. The relay station 34 moves in the direction of arrow Y1 immediately after the wafer 39 is attracted by the jig 38a, and becomes a neutral state (the position shown in FIG. 9). In addition, if the next wafer 39 can be received while moving to the transfer arm 38 side, the relay station 34 can be prevented from returning to the neutral state. In FIGS. 10 and 11, during the transfer of the wafer 39 by the transfer arm 38, the wafer stage 4 is moved, for example, in the direction of the arrow X, and the next wafer 39 is attracted by the jig 35, and the central axis 41 45 in the direction of arrow L. The wafer is rotated and transferred to the relay station 34. Next, as shown in FIG. 12 this time, the relay station 34 is position-corrected in the direction of the arrow -Y within 0.1 s. The holder 36a of the transfer arm 36 sucks the wafer 39 on the relay station 34, and It is carried to the bracket 40 in the XI direction. The reciprocating time of the clamp 36a is, for example, 0.55s. Hereinafter, similarly, the transfer arms 36 and 38 are used alternately to transfer each wafer 39 to a designated position of the carriage 40, so that the time required for the transfer of each wafer 39 does not exceed 0.3 5 s. In addition, in this embodiment, two carrying arms are provided, but it is not limited to this, and may be more. The position correction of the repeater 34 is not limited to the Y1-axis direction, and the position correction in the rotation direction may be performed as needed. In addition, the time charts are shown in Figs. 4, 8, and 13, respectively, but these are examples, and the functions of the wafer handling devices 1, 20, and 30 are not limited to those based on these time charts. [Brief description of the drawings] [Fig. 1] Figs. 1 to 4 are related to the first embodiment, and Fig. 1 is a top view of a wafer handling device -23- 200540086. [Fig. 2] A top view showing a state in which a wafer conveyed by a jig to one of the repeaters is conveyed by a jig to the other repeater while the conveyance arm is conveying it to the carrier. [Fig. 3] A top view showing a state in which a wafer on the other relay stage in Fig. 2 is being transported to the one relay stage by a jig while the wafer is being transported to the carrier by the transfer arm. [Figure 4] Time chart. [Fig. 5] Figs. 5 to 8 are views related to the second embodiment, and Fig. 5 is a schematic top view showing a wafer transfer device. [Fig. 6] A top view showing a state in which other sorted wafers are transferred from the wafer to the relay stage using a jig. [Fig. 7] A top view showing a state in which the other sorted wafers on the repeater in Fig. 6 are being transported to the second tray by the transfer arm and the first sorted wafers are transferred to the first tray. [Figure 8] Time chart. [Fig. 9] Figs. 9 to 13 relate to the third embodiment, and Fig. 9 is a schematic top view showing a wafer transfer device. [Fig. 10] A top view showing a state where the jig is holding the wafer on the wafer while the wafer on the relay stage is being transferred to the carrier by the transfer arm. [Fig. 11] A top view showing a state where the wafer adsorbed by the jig shown in Fig. 10 is transferred from the wafer to the relay station. [Fig. 12] A top view showing a state in which the wafer in Fig. 11 is transferred from the relay station to the carrier by a transfer arm. -24- 200540086 [Figure 13] Time chart. [Symbol description] 1 Carrying device 2 Mounting table 3 Mounting table 5 Relay station 6 Relay station 8 Fixture 10 Carrying arm 11 Carrying arm 12 Carriage 13 Carriage 14 Wafer 15 Wafer. 20 Wafer handling device 21 First installation Stage 22 2nd mounting stage 23 Relay station 24 Jig 26 Carrying arm 28 Wafer 28 A 1st class wafer 28B 2nd class wafer 30 Handling device-25- 200540086 3 1 1st bracket 32 2nd bracket 33 Mounting table 34 Relay station 35 Jig 36 Carrying arm 38 Carrying arm 39 Wafer 40 Carrier -26-