200532371 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種多環氧基之高分子及其樹脂組成 物，尤指一種適於微機電系統用感光材料，即厚膜光阻， 5 以及塗料、油墨、或光阻等光硬化和熱硬化領域之多環氧 基之高分子及其樹脂組成物。 【先前技術】 微機電糸統（Micro Electro-Mechanical System)是結合 10半導體技術與超精密加工的前瞻技術。系統微小化帶來許 多優點，如節省材料、空間、環保、節約能源，更重要的 是如果技術成熟，還可以經濟量產。由於產品的大小，符 合電子產品輕、薄、短、小的未來發展趨勢，因此，微機 電系統技術被認為將是21世紀產業技術的主流。 15 微機電系統包含微感測器、微致動器、電子系統三部 分。自然界的類比訊號如聲、光、震動、溫度等，經由微 感測器（SenS〇r)接收上述訊號之後，經過類比數位轉換 (ADC)成為數位訊號之後，交由控制器（⑶處理， 處理過後的數位訊號在經類比轉換（DAC)後交由微致動器 20 (aCtUat〇r)反應做出控制器所欲傳達的動作至外界。 微感測器技術層次高，含有半導體技術、微電子技術， 因技術進步快，造成製程難度高、發展尚未成熟等障礙。 其中，光阻材料是影響製程的關鍵材料。目前，微感測器 產品製程中使用的光阻最常用的SU-8光阻如下式⑺， 6 200532371200532371 发明. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a polyepoxide-based polymer and its resin composition, especially a photosensitive material suitable for micro-electromechanical systems, that is, a thick film photoresist, 5 And polyepoxy polymer and its resin composition in the field of light hardening and heat hardening such as paint, ink, or photoresist. [Previous Technology] Micro Electro-Mechanical System is a forward-looking technology that combines 10 semiconductor technologies with ultra-precision machining. The miniaturization of the system brings many advantages, such as saving materials, space, environmental protection, and energy saving. More importantly, if the technology is mature, it can also be economically mass-produced. Due to the size of the product, it is in line with the future development trend of light, thin, short, and small electronic products. Therefore, microcomputer electrical system technology is considered to be the mainstream of industrial technology in the 21st century. 15 MEMS includes three parts: micro-sensor, micro-actuator, and electronic system. Natural analog signals such as sound, light, vibration, temperature, etc. After receiving the above signals through a micro sensor (SenSor), after analog digital conversion (ADC) becomes a digital signal, it is processed by the controller (3) After the digital signal is converted by the analog converter (DAC), the micro-actuator 20 (aCtUat0r) responds to the action that the controller wants to convey to the outside world. Micro-sensor technology has a high level of technology, including semiconductor technology, micro- Electronic technology, due to rapid technological progress, has caused obstacles such as high process difficulty and immature development. Among them, photoresist materials are the key materials that affect the process. At present, the photoresist used in the production process of micro-sensors is the most commonly used SU-8. The photoresist is as follows: 6 200532371
雖然具有低分子量可提高光阻之固含量，降低溶_ 用量’南光穿透性可製作厚膜，具化學增幅性而有高感度 易平坦化等優點’但是也具有如下的缺點：⑴高交聯度， 使得收縮量過大，易造成矽晶片碎裂及變巾，⑺黏姓 (binder)樹脂無法因應需求而變化，（3)雖能耐受電鑄液γ 但完成電鑄後，脫膜困難。 一般光阻組成物可應用於印刷電路板 組成物含有多環氧基樹脂，如_等、反應^稀4釋^和 10陽離子型光起始劑。# +，多環氧基樹脂叫8 具有低 分子量和多個環氧基，所以交聯度很高，使得收縮量過大-， 易造成基材碎裂及變形，而且樹脂分子固定無法因應需求 而變化調整。 ％ 本發明之樹脂組成物中，多環氧基之高分子是經由鏈 15鎖聚合反應形成。並由共聚物組成設計，可輕易調整環氧 基數量（即交聯數），不會使基材碎裂或變形。另外也可調 整共聚物單體，應付其他不同物性需求。 ° 【發明内容】 7 200532371 、本炙明之主要目的係在提供一種樹脂組成物，俾能增 加感光性、提升耐熱性、並輕易地調整各官能基含量，因 應各種製程需求。 本發明之另一目的係在提供一種多環氧基之高分 5子，俾能同時具有良好之顯影性及解析度，並可提升耐熱 性。 為達成上述目的，本發明之樹脂組成物，主要包括一 種具有％氧基之高分子，該高分子由異三聚氰酸鹽 (isocyanurate)所聚合或共聚合而成，該高分子重量百分比 10為該樹脂組成物之1%〜99% ;以及一反應性稀釋劑，其重 量百分比為總重量之1 %〜99%。 為達成上述目的，本發明之多環氧基之高分子係經由 鏈鎖聚合反應形成，其中環氧基由異三聚氰酸鹽 (isocyanurate)系化合物所提供。 15 【實施方式】 本發明之樹脂組成物，包含由鏈鎖聚合反應得到具多 環氧基之高分子，此聚合反應所使用之異三聚氰酸鹽 (isocyanurate)，Ri 較佳為 Ci-C6 之連接基或為-C00_，r2 20 較佳為_CH3或-Η。此外，多環氧基之高分子亦可為異三聚 氰酸鹽（isocyanurate)與至少一具不飽合雙鍵之單體共聚合 而成，此不飽合雙鍵之單體，可調整各官能基含量，其較 佳選自由丙烯酸甲酯（methyl acrylate)、甲基丙烯酸甲酿 (methyl methacrylate)、丙烯酸乙酉旨（ethyl acrylate)、曱基 8 200532371 丙稀酸乙S旨（ethyl methacrylate)、丙稀酸丙6旨（propyl acrylate)、曱基丙烯酸丙酯（propyl methacrylate)、丙烯酸 異丙酉旨（isopropyl acrylate)、甲基丙稀酸異丙酯（isopropyl methacrylate)、丙婦酸 丁酉旨（butyl acrylate)、曱基丙浠酸丁 5 醋（butyl methacrylate)、丙浠酸異丁醋（isobutyl acrylate)、 甲基丙烯酸異丁醋（isobutyl methacrylate)、丙烯酸三級丁 醋（t-butyl acrylate)、甲基丙浠酸三級丁醋（t-butyl methacrylate)、丙烯酸乙基己基酉旨（ethylhexyl acrylate)、曱 基丙稀酸乙基己基自旨（ethylhexyl methacrylate)、丙稀酸苯 10 甲西旨（benzyl acrylate)、甲基丙烯酸苯甲西旨（benzyl methacrylate)、丙稀酸苯酯（phenyl acrylate)、曱基丙稀酸 苯酯（phenyl methacrylate)、丙烯酸環己酯（cyclohexyl acrylate)、曱基丙稀酸環己酉旨（cyclohexyl methacrylate)、丙 烯酸苯氧基乙酯（phenoxyethyl acrylate)、曱基丙烯酸苯氧 15 基乙酉旨（phenoxyethyl methacrylate)、丙稀酸異冰片酯 (isobornyl acrylate)、曱基丙稀酸異冰片酯（isobornyl methacrylate)、丙稀酸四氳糠酯（tetrahydrofurfuryl acrylate)、甲基丙稀酸四氫糠酉旨（tetrahydrofurfuryl methacrylate)、苯乙稀（styrene)及其衍生物、α -曱基苯乙 20 稀（a -methylstyrene)、馬來酸酐（maleic anhydride)、醋酸 乙稀酯（vinyl acetat) 、N-乙稀基-2-氮五圜酮 (N-vinyl-2-pyrrolidone)、乙烯基石比。定（vinylpyridine)、丙酸 乙稀酯（vinyl propionate)、丙稀（acrylonitrile)、α -曱基 丙烯腈（methacrylonitrile)、丙烯酸（acrylic acid)、曱基丙 9 200532371 稀酸（methacrylic acid)、巴豆酸（crotonic acid)、肉桂酸 (cinnamic acid)、2-甲基丙浠醯基氧乙基琥珀酸酯 (2-methacryloyloxyethyl succinate)、2-丙烯醯基氧乙基琥 ί白酸 S旨（2-acryloyloxyethyl succinate)、2-甲基丙浠醯基氧 5 乙基六氫鄰苯二甲酸酉旨（2-methacryloyloxyethyl hexahydrophthalate)、2·丙稀醢基氧乙基六氫鄰苯二曱酸酯 (2-acryloyloxyethyl hexahydrophthalate)、2-甲基丙晞醢基 氧乙基鄰苯二甲酸醋（2-methacryloyloxyethyl phthalate)、 以及2-丙稀醢基氧乙基鄰苯二甲酸醋（2-acryloyloxyethyl 10 phthalate)所組成之群組。一般多環氧基之高分子之重量平 均分子量為500〜1，000,000 g/mol。 在樹脂組成物中，反應性稀釋劑無特定限制，一般為 具有兩個或兩個以上環氧基之化合物。而此具有兩個或兩 個以上環氧基之反應性稀釋劑較佳為3,4-環氧基環己基甲 15 基-3,4 環氧基環己基緩酸酯（3,4-epoxycyclohexylmethyl_ 3,4epoxycyclohexyl carboxylate)、7_ 氧雙環（4·1·0)庚烧 3-竣酸（7-oxabicyclo (4.1.0)heptane 3-carboxylic acid)、7-氧 雙環（4·1·0)庚基-3-甲基醋（7-oxabicyclo (4.1.0) heptyl-3-methyl ester)、1，4 環己烧二甲醇二縮水甘油 _ 20 (1，4-cyclohexanedimethanol diglycidyl ether)、甘油丙氧基 醋三縮水甘油醚（glycerol propoxylate triglycidyl ether)、 1，1，1-三（對羥基苯）乙烷三縮水#*_(l，l，l-tris-(p-hydroxyphenyl)ethane triglycidyl ether)、4,4’·亞甲雙（N，N-二 縮水甘 油 苯 胺）(4,4’_methylenebis(N，N- 200532371 diglycidylaniline))、四個（4-羥基苯基）乙烷之四縮水甘油 醚(tetraglycidyl ether of tetrakis(4-hydroxyphenyl) ethane)、 三縮水甘油-對-氨基齡（triglycidyl -p-aminophenol)、三縮水甘油異三聚氰酸鹽（triglycidyl 5 isocyanurate)、二縮水甘油六氫鄰苯二曱酸酯（diglycidyl hexahydrophthalate)、3,4-二縮水甘油環氧基環己基環氧乙 烧（3,4-epoxycyclohexyloxirane)、2-(3’4’-環氧基環己 基）-5，1’’-螺-3’’，4’’-環氧基環己基-1，3-二氧陸圜 (2-(3，，4’-epoxycyclohexyl)-5,1 ’、spiro-3 ’’，4’’-epoxycyclohe 10义&11卜1，3_(^〇乂&1^、二（3,4-環氧基-環己基甲基）己二酸 (bis(3,4-epoxy-cyclohexylmethyl) adipate)、1，4-二縮水甘油 氧基-丁院（l，4-diglycidyloxy- butane)、1，2-二縮水甘油連氧 基乙烧（l，2-diglycidyloxyethane)、二縮水甘油氧基新戊烧 (diglycidyloxyneopentane)、盼曱烧之二縮水甘油 _ 15 (diglycidyl ether of bisphenol A)、雙齡 F 之二縮水甘油鱗 (diglycidyl ether of bisphenol F)、鄰苯二盼之二縮水甘油 醚（diglycidyl ether of catechol)、間苯二紛之二縮水甘油 _ (diglycidyl ether of resorcinol)、丙三醇之二縮水甘油 _ (diglycidyl ether of glycerol)、1，3_丙醇之二縮水甘油醚 20 (diglycidyl ether of 1，3-propanol)、偏苯三酸酯之三縮水甘 油醚（triglycidyl ether of trimellitate)、苯三甲 S旨之三縮水 甘油醚（triglycidyl ether of trimesate)、l，2-3,4-丁烧二環氧 化物（l，2-3,4-butane diepoxide)、1，2,7,8-環氧基辛烧 (l，2,7,8-diepoxy octane)、對-苯雙環氧化合物（p-benzene 25 diepoxide)、雙紛 A 環氧樹脂（bisphenol A epoxy resins)、 11 200532371 雙齡F環氧樹脂（bisphenol F epoxy resins)或上述之混合 物。樹脂組成物更可包含一陽離子型光起始劑，係經光照 射引起陽離子型聚合反應者，其較佳為芳香烴基二重氮銨 鹽（aryldiazonium salts)、二芳香烴基埃銨言（diaryliodonium 5 salts)、三芳香烴基硫化構鏔鹽（triaryl sulphonium salts)、 三芳香烴基填酸銨鹽（triarylphosphonium salts)、三芳香烴 基亞石西銨鹽（triarylselenonium salts)、二烧基苯配（先）甲基 硫化石粦銨鹽（dialkylphenacylsulphonium salts)、二烧基-4-經基苯硫化構銨鹽（dialkyl-4-hydroxyphenylsulphonium 10 salts)、硫化填酸酯（sulphonic acid ester)、石夕醇基呂錯合 物(si land-aluminium complexes)、 或二茂鐵銨鹽 (Ferrocenium salts)。此陽離子型光起始劑較佳還再包含一 增感劑，其為熒（perylene)、蒽（anthracene)、或上述之衍生 物。本發明之樹脂組成物遥可再包含一添加劑，其可為熱 15 安定劑、抗氧化劑、光安定劑、潤滑劑、著色劑、消泡劑、 平坦劑、填充劑以及補強材所組成之族群。 本發明之多環氧基之高分子與樹脂組成物可應用於油 墨、塗料、光阻、或微機電系統用感光材料。且由於經由 鏈鎖聚合反應形成之含環氧基之高分子中，環氧基可由異 20 三聚氰酸鹽系化合物所提供，故樹脂組成物同時具有環氧 基、異三聚氰酸鹽等官能基。使其具有以下之優點：一、 導入異三聚氰酸鹽系化合物，因含有2個環氧基，使感光 基倍增，增加感光性。二、導入異三聚氰酸鹽系化合物， 因含有異三聚氰酸鹽，為含氮雜環，可提升耐熱性。三、 12 200532371 多環氧基之高分子可藉由變化單體組成，輕易調整各官能 基含量，因應各種製程需求。 為能讓貴審查委員能更瞭解本發明之技術内容，特 舉五較佳具體實施例說明如下。 5 實施例1 :感光榭脂合成 將 500g 溶劑 diethylene glycol monomethyl ether acetate 置於四口反應瓶中，通氮氣，保持80°C。單體丙烯基二縮 水甘油異三聚氰酸鹽（allyl diglycidyl isocyanurate)200g 與 起始劑 2,2’_azobis(isobutyronitrile)20g 充分混合後，滴入 10 反應器中，再持續反應4hr。得如下式3之感光樹脂a，分 子量為4700，其中為-CH2_，R2為Η。Although having a low molecular weight can increase the solid content of the photoresist and reduce the amount of solvent _ the amount of "nanguang penetrability can make a thick film, with chemical amplification and high sensitivity and easy flattening", but also has the following disadvantages: The degree of shrinkage makes the shrinkage too large, which easily causes the silicon wafer to crack and change. The binder resin cannot be changed according to demand. (3) Although it can withstand the electroforming solution γ, it is difficult to remove the film after electroforming. The general photoresist composition can be applied to printed circuit boards. The composition contains polyepoxy resins such as _, etc., and the reaction is dilute, 4 release, and 10 cationic photoinitiators. # +, Polyepoxy resin called 8 has a low molecular weight and multiple epoxy groups, so the degree of cross-linking is very high, making the shrinkage too large-easy to cause the substrate to crack and deform, and the resin molecules cannot be fixed according to demand. Change adjustment. % In the resin composition of the present invention, the polymer having a polyepoxide group is formed through a chain 15 polymerization reaction. It is designed with copolymer, which can easily adjust the number of epoxy groups (that is, the number of cross-linking) without causing the substrate to crack or deform. In addition, the copolymer monomer can be adjusted to meet other physical requirements. ° [Contents of the Invention] 7 200532371 The main purpose of the present invention is to provide a resin composition that can increase the sensitivity, improve the heat resistance, and easily adjust the content of various functional groups to meet the needs of various processes. Another object of the present invention is to provide a high-molecular-weight polyoxyl group, which can simultaneously have good developability and resolution, and can improve heat resistance. In order to achieve the above object, the resin composition of the present invention mainly includes a polymer having% oxy group, the polymer is polymerized or copolymerized by isocyanurate, and the weight percentage of the polymer is 10 It is 1% to 99% of the resin composition; and a reactive diluent, and its weight percentage is 1% to 99% of the total weight. In order to achieve the above object, the polymer of the polyepoxide group of the present invention is formed by a chain polymerization reaction, wherein the epoxy group is provided by an isocyanurate-based compound. 15 [Embodiment] The resin composition of the present invention comprises a polymer having polyepoxy groups obtained by a chain polymerization reaction. The isocyanurate used in this polymerization reaction, Ri is preferably Ci- The linking group of C6 may be -C00_, and r2 20 is preferably _CH3 or -Η. In addition, the polyepoxide-based polymer may be obtained by copolymerizing isocyanurate with at least one monomer having an unsaturated double bond, and the monomer having an unsaturated double bond may be adjusted. The content of each functional group is preferably selected from the group consisting of methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl 8 200532371 ethyl methacrylate , Propyl acrylate, propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, butyl methacrylate (Butyl acrylate), butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, t-butyl acrylate ), T-butyl methacrylate, ethylhexyl acrylate, ethylhexyl methacrylate, ethyl benzene 10 methacrylate Benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, cyclohexyl acrylate, 曱Cyclohexyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, 15 phenoxyethyl methacrylate, isobornyl acrylate, Isobornyl methacrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, styrene and its derivatives, α-Acetylene 20 a-methylstyrene, maleic anhydride, vinyl acetat, N-vinyl-2- pyrrolidone), vinyl stone ratio. Vinylpyridine, vinyl propionate, acrylonitrile, alpha-methacrylonitrile, acrylic acid, methacrylic acid 9 200532371 methacryl acid, croton Crotonic acid, cinnamic acid, 2-methacryloyloxyethyl succinate, 2-propenyloxyethyl succinate, 2 acid -acryloyloxyethyl succinate), 2-methacryloyloxyethyl hexahydrophthalate, 2-methacryloyloxyethyl hexahydrophthalate, 2-methacryloyloxyethyl hexahydrophthalate ( 2-acryloyloxyethyl hexahydrophthalate), 2-methacryloyloxyethyl phthalate, and 2-acryloyloxyethyl 10 phthalate ). Generally, the weight average molecular weight of polyepoxy polymers is 500 to 1,000,000 g / mol. In the resin composition, the reactive diluent is not particularly limited, and is generally a compound having two or more epoxy groups. The reactive diluent having two or more epoxy groups is preferably 3,4-epoxycyclohexylmethyl 15-yl-3,4 epoxycyclohexylmethyl ester (3,4-epoxycyclohexylmethyl_ 3,4epoxycyclohexyl carboxylate), 7-oxabicyclo (4 · 1 · 0) heptane 3-complete acid (7-oxabicyclo (4.1.0) heptane 3-carboxylic acid), 7-oxybicyclo (4 · 1 · 0) heptane 7-oxabicyclo (4.1.0) heptyl-3-methyl ester, 1,4-cyclohexanedimethanol diglycidyl ether 20, glyceryl propoxylate Glycerol propoxylate triglycidyl ether, 1,1,1-tris (p-hydroxyphenyl) ethane triglycidyl ether # * _ (l, l, l-tris- (p-hydroxyphenyl) ethane triglycidyl ether) , 4,4 '· methylenebis (N, N-diglycidylaniline) (4,4'_methylenebis (N, N- 200532371 diglycidylaniline)), four (4-hydroxyphenyl) ethane tetraglycidyl Ether (tetraglycidyl ether of tetrakis (4-hydroxyphenyl) ethane), triglycidyl-p-aminophenol, triglycidyl isocyanurate (trigl ycidyl 5 isocyanurate), diglycidyl hexahydrophthalate, 3,4-epoxycyclohexyloxirane, 2- (3 ' 4'-epoxycyclohexyl) -5,1 ''-spiro-3 '', 4 ''-epoxycyclohexyl-1,3-dioxolidine (2- (3,, 4'- epoxycyclohexyl) -5,1 ', spiro-3' ', 4' '-epoxycyclohe 10 meaning & 11 1,3 _ (^ 〇 乂 & 1 ^, bis (3,4-epoxy-cyclohexylmethyl) Bis (3,4-epoxy-cyclohexylmethyl) adipate, 1,4-diglycidyloxy-butane, 1,2-diglycidyloxy-butane 1,2-diglycidyloxyethane, diglycidyloxyneopentane, diglycidyl ether of bisphenol A, diglycidyl scale F (diglycidyl) ether of bisphenol F), diglycidyl ether of catechol, diglycidyl ether of resorcinol, diglycidyl ether of resorcinol, glycerol _ (diglycidyl ether of glycerol), diglycidyl ether of 1,3-propanol 20, diglycidyl ether of 1,3-propanol, triglycidyl ether of trimellitate, trimellitate The purpose of S is triglycidyl ether of trimesate, 1,2-3,4-butane diepoxide, 1,2,7,8-ring Oxy-octane (l, 2,7,8-diepoxy octane), p-benzene 25 diepoxide, bisphenol A epoxy resins, 11 200532371 double age F Epoxy resins (bisphenol F epoxy resins) or mixtures thereof. The resin composition may further include a cationic photoinitiator, which is a cationic polymerization reaction caused by light irradiation, and is preferably an aromatic hydrocarbon-based diazonium ammonium salt (aryldiazonium salts) or a diaromatic hydrocarbon-based ammonium diaryliodonium 5 salts), triaryl sulphonium salts, triaryl phosphonium salts, triaryl phosphonium salts, triaryl selenonium salts Dialkylphenacylsulphonium salts, dialkyl-4-hydroxyphenylsulphonium 10 salts, sulphonic acid esters, sulphonic alcohols Compounds (si land-aluminium complexes), or ferrocenium salts. The cationic photoinitiator preferably further comprises a sensitizer, which is perylene, anthracene, or a derivative thereof. The resin composition of the present invention may further include an additive, which may be a group consisting of heat stabilizers, antioxidants, light stabilizers, lubricants, colorants, defoamers, leveling agents, fillers, and reinforcing materials. . The polyepoxide-based polymer and resin composition of the present invention can be applied to inks, coatings, photoresists, or photosensitive materials for micro-electromechanical systems. And since the epoxy group-containing polymer formed through the chain polymerization reaction, the epoxy group can be provided by an iso-20 tricyanate-based compound, the resin composition has both an epoxy group and an isotricyanate And other functional groups. It has the following advantages: First, the introduction of isocyanurate-based compounds contains two epoxy groups, which doubles the photosensitive group and increases the sensitivity. Second, the introduction of isocyanurate-based compounds, because it contains isocyanurates, is a nitrogen-containing heterocyclic ring, which can improve heat resistance. III. 12 200532371 Polyepoxy-based polymers can easily adjust the content of each functional group by changing the monomer composition to meet various process requirements. In order to make your reviewing committee better understand the technical content of the present invention, five preferred embodiments are described below. 5 Example 1: Synthesis of Photosensitive Fats and Fats 500 g of solvent diethylene glycol monomethyl ether acetate was placed in a four-necked reaction flask, and nitrogen was passed through to maintain 80 ° C. After 200 g of the monomer allyl diglycidyl isocyanurate and 20 g of the starter 2,2'_azobis (isobutyronitrile) were thoroughly mixed, the mixture was dropped into a 10 reactor, and the reaction was continued for 4 hours. A photosensitive resin a of the following formula 3 was obtained, with a molecular weight of 4,700, where -CH2_ and R2 was Η.
實施例2 :感光樹脂合成 同實施例1的合成步驟，單體丙烯基二縮水甘油異三聚 15 氰酸鹽（allyl diglycidyl isocyanurate)200g 改為單體 allyl diglycidyl isocyanurate 100g 和曱基丙烯酸甲 S旨（methyl methacrylate) 72g，可得感光樹脂b，分子量37000。故本 發明之感光樹脂可任意加入其他單體共聚合，以調整所需 13 200532371 物性。 實竣l创3 :熱硬化榭脂細成铷 將4.5g感光樹脂a，〇· 1 8g硬化劑雙氰胺 (dicyandiamide)，1 g溶劑二甲基甲酰胺縮二甲醇（dimethyl 5 f〇rmamide) ’〇·〇〇 1 g 觸媒 2-甲基味。坐（2-methyl imidazole) 此合並稅掉均勻成熱硬化樹脂組成物。將熱硬化樹脂組成 物旋轉塗佈在銅箔基板上，置於80°c烘箱中預烘3〇min。 17〇°C下熱硬化2小時。使用熱重分析儀（Tga)分析此硬化 後的樹脂組成物，以20°C /min速率自25°C升溫至85(TC， 10在300 C時熱重量損失只有5%，耐熱性佳。故本發明之感 光樹脂可應用於熱硬化樹脂組成物。 實施例4 :光硬化樹脂組成物a 將2g感光樹脂a，〇.3g曱酚酚醛清漆環氧樹脂（cres〇i novolac type epoxy resin)，lg 溶劑 diethylene glyc〇1 15 monomethyl ether acetate，O.lg 染料，〇.15g 陽離子型光起 始劑 bis{4-(diphenylSulf0ni0)-phenyl 卜 sulfide-bis_hexa fluorophosphate混合並攪拌均勻成光硬化樹脂組成物。將 光硬化樹脂組成物旋轉塗佈在銅箔基板上，置於7〇〇c烘箱 中預烘30min。待冷卻後，蓋上圖樣光罩，使用紫外線平 20 4亍曝光機曝光800 mJ/cm2，以1% Na2C〇3(aq)顯影，接著 用清水洗淨試片乾燥，可得到清晰圖形。 奮施例5 :光硬化榭脂組成物h 將2g感光樹脂b，0.3g曱酚醛清漆環氧樹脂（cres〇1 novolac type epoxy resin)，lg 溶劑心灿咖狀 §1八〇1 14 200532371 monomethyl ether acetate ’ O.lg 染料，〇」5g 陽離子型光起 始劑 bis{4-(diphenylsulf〇ni〇)-pheny1}_sulfide_bis-hexa fluorophosphate混合並攪拌均勻成光硬化樹脂組成物。將 光硬化樹脂組成物旋轉塗佈在銅箔基板上，置於7〇洪箱 5中預烘30min。待冷卻後，蓋上圖樣光罩，使用紫外線平 行曝光機曝光800 mJ/cm2，以i%Na2C〇3(aq)顯影，接著 用清水洗淨試片乾燥，可得到清晰圖形。 本發明之多環氧基之高分子與樹脂組成物可增加减 光性、提升耐熱性、並輕易地調整各官能基含量，因應各 10種製私需求。唯上述實施例僅係為了方便說明而舉例而 已，本發明所主張之權利範圍自應以申請專利範圍所述 準，而非僅限於上述實施例。 以”、' 【圖式簡單說明】 15 無。 【圖號說明】 益 〇 # η、 15Example 2: The photosensitive resin was synthesized in the same manner as in Example 1. The monomer acrylic diglycidyl isocyanurate 200g was changed to monomer 100g allyly diglycidyl isocyanurate and succinic acrylic acid methyl ester. (Methyl methacrylate) 72g, can obtain photosensitive resin b, molecular weight 37000. Therefore, the photosensitive resin of the present invention can be copolymerized with other monomers arbitrarily to adjust the required physical properties. Realization 3: Thinning of heat-cured fat into 4.5 g of photosensitive resin a, 0.8 g of hardener dicyandiamide, 1 g of solvent dimethyl formamide dimethyl 5 fommamide ) '〇 · 〇〇1 g catalyst 2-methyl flavor. (2-methyl imidazole) This combined tax is uniformly formed into a thermosetting resin composition. The thermosetting resin composition was spin-coated on a copper foil substrate, and pre-baked in an 80 ° C oven for 30 minutes. Heat hardened at 17 ° C for 2 hours. A thermogravimetric analyzer (Tga) was used to analyze the hardened resin composition, and the temperature was raised from 25 ° C to 85 ° C at a rate of 20 ° C / min, and the thermal weight loss was only 5% at 300 ° C, and the heat resistance was good. Therefore, the photosensitive resin of the present invention can be applied to a thermosetting resin composition. Example 4: Photocuring resin composition a 2 g of photosensitive resin a, 0.3 g of cresol novolac type epoxy resin , Lg solvent diethylene glyc〇1 15 monomethyl ether acetate, O.lg dye, 0.15 g cationic photoinitiator bis {4- (diphenylSulf0ni0) -phenyl sulfide-bis_hexa fluorophosphate, mix and stir to form a light-hardening resin composition The light-hardening resin composition is spin-coated on a copper foil substrate, and pre-baked in a 700C oven for 30 minutes. After cooling, cover the pattern mask and use an ultraviolet flat 20 4 亍 exposure machine to expose 800 mJ / cm2, developed with 1% Na2CO3 (aq), and then washed the test piece with water to dry it to obtain a clear figure. Example 5: Light-curing resin composition h 2g of photosensitive resin b, 0.3g of phenol novolac Epoxy resin (cres〇1 novolac type epoxy resi n), lg Solvent-like bright coffee § 1801 14 200532371 monomethyl ether acetate 'O.lg dye, 〇 ″ 5g cationic photo initiator bis {4- (diphenylsulf〇ni〇) -pheny1} _sulfide_bis-hexa The fluorophosphate is mixed and stirred to form a light-hardening resin composition. The light-hardening resin composition is spin-coated on a copper foil substrate and placed in a 70-hour flood box 5 for pre-baking for 30 minutes. After cooling, cover the pattern photomask and use The ultraviolet parallel exposure machine is exposed to 800 mJ / cm2, developed with i% Na2CO3 (aq), and then the test piece is washed with water and dried to obtain a clear pattern. The polyepoxy polymer and resin composition of the present invention can be Increase the light reduction, improve the heat resistance, and easily adjust the content of each functional group to meet the needs of each of the 10 kinds of private manufacturing. The above examples are merely examples for the convenience of explanation, and the scope of the rights claimed by the present invention should be applied by itself The scope of the patent is accurate, but not limited to the above embodiments. "", "[Simplified description of the drawings] 15 None. [Illustration of the drawing numbers] 益 〇 # η, 15