TW201906874A - Photosensitive composition, photosensitive composition for black matrix, and photosensitive composition for black column spacer - Google Patents

Photosensitive composition, photosensitive composition for black matrix, and photosensitive composition for black column spacer Download PDF

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TW201906874A
TW201906874A TW107120727A TW107120727A TW201906874A TW 201906874 A TW201906874 A TW 201906874A TW 107120727 A TW107120727 A TW 107120727A TW 107120727 A TW107120727 A TW 107120727A TW 201906874 A TW201906874 A TW 201906874A
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group
compound
carbon atoms
polymerizable composition
acid
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TWI778082B (en
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松平桂典
六谷翔
中田祐也
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日商艾迪科股份有限公司
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8723Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/303Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one or more carboxylic moieties in the chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F292/00Macromolecular compounds obtained by polymerising monomers on to inorganic materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136209Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8791Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers

Abstract

A polymerizable composition according to the present invention is a polymerizable composition containing a polymerization initiator (A), a coloring agent (B), an alkali-developable compound (C) and an ethylenically unsaturated compound (D) excluding the alkali-developable compound (C), wherein the polymerization initiator (A) includes an [alpha]-aminoacetophenone compound (A1) having a hydroxyl group. It is preferred that the polymerization initiator (A) also includes an oxime ester compound (A2) having a group represented by general formula (I) in addition to the [alpha]-aminoacetophenone compound (A1) having a hydroxyl group. (With respect to the definitions for the symbols in the formula, see the description.).

Description

聚合性組合物、黑色矩陣用感光性組合物及黑柱間隔物用感光性組合物Polymerizable composition, photosensitive composition for black matrix, and photosensitive composition for black column spacer

本發明係關於含有具有羥基之α-胺基苯乙酮化合物作為聚合起始劑,進而含有著色劑、鹼性顯影性化合物及除鹼性顯影性化合物以外之乙烯性不飽和化合物的聚合性組合物。又,本發明係關於含有該組合物之黑色矩陣(以下亦記載為「BM」)用感光性組合物及黑柱間隔物(以下亦記載為「BCS」)用感光性組合物以及由該等組合物獲得之硬化物。The present invention relates to a polymerizable combination containing an α-aminoacetophenone compound having a hydroxyl group as a polymerization initiator, and further containing a colorant, an alkaline developing compound, and an ethylenically unsaturated compound other than the alkaline developing compound. Thing. The present invention relates to a photosensitive composition for a black matrix (hereinafter also referred to as "BM") and a black column spacer (hereinafter also referred to as "BCS") containing the composition, and a photosensitive composition for the same. A hardened product obtained from the composition.

於液晶顯示裝置、有機EL顯示裝置等顯示器顯示裝置中,為了保持單元之上部與下部之基板間之距離而使用間隔物。In a display display device such as a liquid crystal display device or an organic EL display device, a spacer is used in order to maintain the distance between the upper part of the cell and the lower substrate.

間隔物係藉由如下方式而形成者:將聚合性組合物塗佈於基板上,介隔特定之遮罩進行曝光後進行顯影。近年來,使用將柱間隔物及黑色矩陣整合於1個模組中而具有遮光性之BCS。The spacer is formed by applying a polymerizable composition to a substrate, developing it after exposure through a specific mask. In recent years, BCS which uses a column spacer and a black matrix in one module and has a light-shielding property has been used.

於專利文獻1中記載了含有α-胺基苯烷酮化合物之感光性阻焊劑用光聚合起始劑。於專利文獻2中記載了BCS形成用感光性樹脂組合物,其含有實施了導入酸性基之處理的碳黑,可形成相對介電常數較低之BCS。於專利文獻3中記載了著色感光性樹脂組合物,其含有共聚物、環氧樹脂化合物或由其而衍生之化合物、以及包含黑色著色劑及藍色著色劑之著色劑,可形成顯示良好之彈性回覆率之BCS。 [先前技術文獻] [專利文獻]Patent Document 1 describes a photopolymerization initiator for a photosensitive solder resist containing an α-aminobenzophenone compound. Patent Document 2 describes a photosensitive resin composition for forming BCS, which contains carbon black subjected to a treatment for introducing an acidic group, and can form BCS having a low relative dielectric constant. Patent Document 3 describes a colored photosensitive resin composition containing a copolymer, an epoxy resin compound or a compound derived therefrom, and a coloring agent containing a black coloring agent and a blue coloring agent. BCS with flexible response rate. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2016-090857號公報 [專利文獻2]日本專利特開2015-093986號公報 [專利文獻3]日本專利特開2014-146029號公報[Patent Literature 1] Japanese Patent Laid-Open Publication No. 2016-090857 [Patent Literature 2] Japanese Patent Laid-Open Publication No. 2015-093986 [Patent Literature 3] Japanese Patent Laid-Open Publication No. 2014-146029

本發明所欲解決之課題係目前尚不存在彈性回覆、遮光性、耐化學品性優異,介電常數低,電特性良好之硬化物(尤其是BCS)。The problem to be solved by the present invention is that there is currently no hardened material (especially BCS) with excellent elastic response, excellent light-shielding properties, chemical resistance, low dielectric constant, and good electrical properties.

因此,本發明之目的在於提供可獲得彈性回覆、遮光性、耐化學品性優異,介電常數低,電特性良好之硬化物的聚合性組合物、BM用感光性組合物及BCS用感光性組合物。又,本發明之目的在於提供由該聚合性組合物、該BM用感光性組合物及該BCS用感光性組合物獲得之硬化物,含有該硬化物之顯示器顯示裝置,及製造該硬化物之方法。Therefore, an object of the present invention is to provide a polymerizable composition, a photosensitive composition for BM, and a photosensitive property for BCS, which can obtain a cured product having excellent elastic recovery, excellent light-shielding properties, chemical resistance, low dielectric constant, and good electrical properties. combination. Another object of the present invention is to provide a cured product obtained from the polymerizable composition, the photosensitive composition for BM, and the photosensitive composition for BCS, a display device including the cured product, and a method for manufacturing the cured product. method.

本發明進行銳意研究之結果,藉由提供下述[1]~[9]而達成上述目的。As a result of earnest research conducted by the present invention, the above-mentioned object is achieved by providing the following [1] to [9].

[1] 一種聚合性組合物,其係含有聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及除該鹼性顯影性化合物(C)以外之乙烯性不飽和化合物(D)之聚合性組合物, 上述聚合起始劑(A)含有具有羥基之α-胺基苯乙酮化合物(A1)。[1] A polymerizable composition containing a polymerization initiator (A), a colorant (B), an alkaline developable compound (C), and an ethylenic compound other than the alkaline developable compound (C) A polymerizable composition of a saturated compound (D), wherein the polymerization initiator (A) contains an α-aminoacetophenone compound (A1) having a hydroxyl group.

[2] 如[1]之聚合性組合物,其係上述聚合起始劑(A)進而含有具有下述通式(I)所表示之基之肟酯化合物(A2)的聚合性組合物;[2] The polymerizable composition according to [1], which is a polymerizable composition in which the polymerization initiator (A) further contains an oxime ester compound (A2) having a group represented by the following general formula (I);

[化1](式中,R1 及R2 分別獨立地表示氫原子、鹵素原子、硝基、氰基、碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 存在R1 及R2 所表示之基中之氫原子經鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯醚基、巰基、異氰酸基或含有雜環之碳原子數為2~20之基取代之情形,且存在R1 及R2 所表示之基中之亞甲基被取代為-O-、-CO-、-COO-、-OCO-、-NR3 -、-NR3 CO-、-S-、-CS-、-SO2 -、-SCO-、-COS-、-OCS-、不飽和鍵或CSO-之情形, R3 表示氫原子、碳原子數為1~20之烴基, m表示0或1, 式中之*表示鍵結鍵)。[Chemical 1] (In the formula, R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a heterocyclic group containing 2 to 20 carbon atoms. The hydrogen atom in the group represented by R 1 and R 2 passes through a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amine group, a carboxyl group, a methacryl group, an acryl group, an epoxy group, a vinyl group, and a vinyl ether group. In the case of substitution with a mercapto group, an isocyanate group, or a group containing 2 to 20 carbon atoms containing a heterocyclic ring, and the methylene group in the group represented by R 1 and R 2 is substituted with -O-, -CO -, -COO-, -OCO-, -NR 3- , -NR 3 CO-, -S-, -CS-, -SO 2- , -SCO-, -COS-, -OCS-, unsaturated bond or In the case of CSO-, R 3 represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, m represents 0 or 1, and * in the formula represents a bonding bond).

[3] 如[1]或[2]之聚合性組合物,其中著色劑(B)係黑色顏料。[3] The polymerizable composition according to [1] or [2], wherein the colorant (B) is a black pigment.

[4] 如[1]至[3]中任一項之聚合性組合物,其中鹼性顯影性化合物(C)係下述通式(II)所表示之鹼性顯影性化合物;[4] The polymerizable composition according to any one of [1] to [3], wherein the alkaline developable compound (C) is an alkaline developable compound represented by the following general formula (II);

[化2](式中,R11 、R13 及R15 分別獨立地表示氫原子或甲基,R12 、R14 及R16 分別獨立地表示碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 於R13 及R14 存在複數個之情形時,存在相同之情形亦存在不同之情形, Y1 、Y2 及Y3 表示直接鍵、碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 於Y2 存在複數個之情形時,存在相同之情形亦存在不同之情形, Z1 、Z2 及Z3 表示碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 於Z2 存在複數個之情形時,存在相同之情形亦存在不同之情形, 存在R12 、R14 、R16 、Y1 、Y2 、Y3 、Z1 、Z2 及Z3 所表示之基中之氫原子經鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、巰基、異氰酸基或含有雜環之基取代之情形,且亦存在R12 、R14 、R16 、Y1 、Y2 、Y3 、Z1 、Z2 及Z3 所表示之基中之亞甲基被取代為-O-、-CO-、-COO-、-OCO-、-S-、-SO2 -、-SCO-或-COS-之情形, n表示0或10以下之正數,a表示0或4以下之正數,b表示0或3以下之正數,c表示0或4以下之正數,於n為2以上之情形時,b存在相同之情形亦存在不同之情形)。[Chemical 2] (In the formula, R 11 , R 13 and R 15 each independently represent a hydrogen atom or a methyl group, and R 12 , R 14 and R 16 each independently represent a hydrocarbon group having 1 to 20 carbon atoms or a carbon atom containing a heterocyclic ring. The base is a number of 2 to 20. When there are a plurality of cases of R 13 and R 14 , the same situation exists and there are different situations. Y 1 , Y 2, and Y 3 represent direct bonds, and the number of carbon atoms is 1 to 20. In the case of a hydrocarbon group or a heterocyclic-containing carbon group having 2 to 20 carbon atoms, when there are a plurality of Y 2 , there are the same situations and different situations. Z 1 , Z 2 and Z 3 represent the number of carbon atoms as In the case of a hydrocarbon group of 1 to 20 or a group of 2 to 20 carbon atoms containing a heterocyclic ring, when there are a plurality of Z 2 , there are the same cases and different cases. There are R 12 , R 14 , R 16 , The hydrogen atom in the group represented by Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 passes a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amine group, a carboxyl group, a methacryl group, and acryl group. In the case of the substitution of an alkyl group, an epoxy group, a vinyl group, a mercapto group, an isocyanate group or a group containing a heterocyclic ring, and there are also R 12 , R 14 , R 16 , Y 1 , Y 2 , Y 3 , Z represents a group of the 1, Z 2 and Z 3 in the methylene group is replaced by -O -, - CO -, - COO -, - OCO -, - S -, - SO 2 -, - SCO- or In the case of -COS-, n is a positive number below 0 or 10, a is a positive number below 0 or 4, b is a positive number below 0 or 3, and c is a positive number below 0 or 4, when n is 2 or more , B exists in the same situation and there are different situations).

[5] 一種黑色矩陣用感光性組合物,其含有如[1]~[4]中任一項之聚合性組合物。[5] A photosensitive composition for a black matrix, comprising the polymerizable composition according to any one of [1] to [4].

[6] 一種黑柱間隔物用感光性組合物,其含有如[1]~[4]中任一項之聚合性組合物。[6] A photosensitive composition for a black column spacer, comprising the polymerizable composition according to any one of [1] to [4].

[7] 一種硬化物之製造方法,其係使用如[1]~[4]中任一項之聚合性組合物、如[5]之黑色矩陣用感光性組合物或如[6]之黑柱間隔物用感光性組合物,藉由光照射或加熱而製造硬化物之方法。[7] A method for producing a cured product, using the polymerizable composition according to any one of [1] to [4], the photosensitive composition for a black matrix according to [5], or the black composition according to [6] A method for producing a cured product by irradiating or heating a photosensitive composition for a column spacer.

[8] 一種硬化物,其係如[1]~[4]中任一項之聚合性組合物、如[5]之黑色矩陣用感光性組合物或如[6]之黑柱間隔物用感光性組合物之硬化物。[8] A hardened product, which is a polymerizable composition according to any one of [1] to [4], a photosensitive composition for a black matrix such as [5], or a black column spacer such as [6] A cured product of a photosensitive composition.

[9] 一種顯示器顯示裝置,其含有如[8]之硬化物。[9] A display device including a hardened body as in [8].

以下,基於較佳之實施形態對本發明之聚合性組合物加以詳細說明。Hereinafter, the polymerizable composition of the present invention will be described in detail based on a preferred embodiment.

本發明之聚合性組合物含有作為聚合起始劑之具有羥基之α-胺基苯乙酮化合物、著色劑、鹼性顯影性化合物及除該鹼性顯影性化合物以外之乙烯性不飽和化合物。以下,關於各成分而順次加以說明。The polymerizable composition of the present invention contains an α-aminoacetophenone compound having a hydroxyl group as a polymerization initiator, a colorant, a basic developing compound, and an ethylenically unsaturated compound other than the basic developing compound. Hereinafter, each component is demonstrated sequentially.

<聚合起始劑(A)> 本發明之聚合性組合物中所使用之聚合起始劑(A)含有具有羥基之α-胺基苯乙酮化合物(A1)[以下亦記為(A1)成分],且可併用除先前已知之(A1)成分以外之自由基聚合起始劑。<Polymerization initiator (A)> The polymerization initiator (A) used in the polymerizable composition of the present invention contains an α-aminoacetophenone compound (A1) having a hydroxyl group [hereinafter also referred to as (A1) Component], and a radical polymerization initiator other than the previously known (A1) component may be used in combination.

上述自由基聚合起始劑係光自由基聚合起始劑與熱自由基聚合起始劑。自反應性高考慮,更佳為光自由基聚合起始劑。The radical polymerization initiator is a photo radical polymerization initiator and a thermal radical polymerization initiator. Considering high self-reactivity, a photoradical polymerization initiator is more preferable.

作為光自由基聚合起始劑,若為藉由光照射而產生自由基者,則並無特別限制,可使用先前已知之化合物,例如可例示苯乙酮系化合物、苯偶醯系化合物、二苯甲酮系化合物、9-氧硫系化合物及肟酯系化合物等作為較佳者。The photo-radical polymerization initiator is not particularly limited as long as it generates radicals by light irradiation, and conventionally known compounds can be used. For example, acetophenone-based compounds, benzophenone-based compounds, Benzophenone compounds, 9-oxosulfur As the compound, an oxime ester compound and the like are preferable.

所謂(A1)成分係表示於一分子內具有羥基與α-胺基苯乙酮結構之化合物,並無特別限定,可較佳地列舉下述通式(V)所表示之化合物。The component (A1) refers to a compound having a hydroxyl group and an α-aminoacetophenone structure in one molecule, and is not particularly limited, and a compound represented by the following general formula (V) is preferable.

[化3](式中,Xr 表示下述通式(i)、(ii)或(iii)所表示之結構, Xs 表示硫原子或NR100 , R100 、R101 、R102 、R103 及R104 分別獨立地表示氫原子、碳原子數為1~12之烷基、苯基、碳原子數為7~20之芳烷基或碳原子數為2~12之烯基,存在該烷基經羥基、羧基、鹵素原子、氰基或硝基取代之情形,且存在該苯基及該芳烷基經碳原子數為1~4之烷基、羥基、羧基、鹵素原子、氰基或硝基取代之情形, 存在R101 與R102 連結而形成3~6員環之雜環之情形,且存在於該雜環中之氮原子上鍵結有R99 之情形, 存在R103 與R104 連結而形成3~6員環之情形, R105 、R106 、R107 及R108 分別獨立地表示氫原子、鹵素原子、氰基、硝基、羥基、羧基或碳原子數為1~12之烷基,存在該烷基經鹵素原子、羧基、氰基、硝基或羥基取代之情形, R99 表示氫原子、碳原子數為1~12之烷基、苯基、碳原子數為7~20之芳烷基或碳原子數為2~12之烯基,存在該烷基經羥基、羧基、鹵素原子、氰基或硝基取代之情形,且存在該苯基及該芳烷基經碳原子數為1~4之烷基、羥基、羧基、鹵素原子、氰基或硝基取代之情形。 存在上述所列舉之各烷基及上述各芳烷基中之亞甲基被取代為-O-、-S-、-NR117 -、-CO-、-CO-O-、-O-CO-或-O-CO-O-之情形。 R117 表示氫原子、碳原子數為1~12之烷基、苯基、碳原子數為7~20之芳烷基或碳原子數為2~12之烯基,存在該烷基經羥基、羧基、鹵素原子、氰基或硝基取代之情形,且存在該苯基及該芳烷基經碳原子數為1~4之烷基、羥基、羧基、鹵素原子、氰基或硝基取代之情形。 其中,式(V)所表示之化合物於分子中具有至少一個羥基)[Chemical 3] (In the formula, X r represents the structure represented by the following general formula (i), (ii), or (iii), X s represents a sulfur atom or NR 100 , and R 100 , R 101 , R 102 , R 103, and R 104 Each independently represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a phenyl group, an aralkyl group having 7 to 20 carbon atoms, or an alkenyl group having 2 to 12 carbon atoms, and the alkyl group has a hydroxyl group , Carboxyl group, halogen atom, cyano group or nitro group, and the phenyl group and the aralkyl group are substituted by alkyl group having 1 to 4 carbon atoms, hydroxyl group, carboxyl group, halogen atom, cyano group or nitro group In some cases, R 101 and R 102 are linked to form a heterocyclic ring of 3 to 6 members, and a nitrogen atom in the heterocyclic ring is bound to R 99 , and R 103 and R 104 are linked. When a 3- to 6-membered ring is formed, R 105 , R 106 , R 107, and R 108 each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group, a carboxyl group, or an alkyl group having 1 to 12 carbon atoms. , the presence of the alkyl group substituted by a halogen atom, a carboxyl group, a cyano group, a nitro group or a hydroxyl case, R 99 represents a hydrogen atom, an alkyl group having carbon atoms of 1 to 12, phenyl, carbon atoms, An aralkyl group having 7 to 20 or an alkenyl group having 2 to 12 carbon atoms, the alkyl group may be substituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group, or a nitro group, and the phenyl group and the aryl group may be present. The alkyl group may be substituted by an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group, or a nitro group. When substituted with -O-, -S-, -NR 117- , -CO-, -CO-O-, -O-CO-, or -O-CO-O-. R 117 represents a hydrogen atom, the number of carbon atoms An alkyl group, phenyl group, aralkyl group having 7 to 20 carbon atoms, or an alkenyl group having 2 to 12 carbon atoms, and the alkyl group exists through a hydroxyl group, a carboxyl group, a halogen atom, a cyano group, or a nitrate And the phenyl group and the aralkyl group are substituted with an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group, or a nitro group. (The compound represented has at least one hydroxyl group in the molecule)

[化4](式中,R109 及R110 分別獨立地表示氫原子、羥基、羧基、鹵素原子或碳原子數為1~4之烷基,於p為2以上之情形時,可相同亦可不同, 式中之下述(i-1)[Chemical 4] (In the formula, R 109 and R 110 each independently represent a hydrogen atom, a hydroxyl group, a carboxyl group, a halogen atom, or an alkyl group having 1 to 4 carbon atoms. When p is 2 or more, they may be the same or different. Of the following (i-1)

[化5]所表示之結構中之亞甲基亦可經-O-、-S-、-NR117 、-CO-、-CO-O-、-O-CO-或-O-CO-O-取代, R111 表示氫原子、鹵素原子、羥基、羧基、氰基、胺基或苯基,存在該苯基經碳原子數為1~4之烷基、羥基、羧基、鹵素原子、氰基或硝基取代之情形,p表示1~12之數)[Chemical 5] The methylene group in the structure represented may also be substituted with -O-, -S-, -NR 117 , -CO-, -CO-O-, -O-CO- or -O-CO-O-, R 111 represents a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a cyano group, an amine group, or a phenyl group, and the phenyl group is substituted with an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group, or a nitro group In the case, p represents a number from 1 to 12)

[化6](式中,R112 、R113 、R114 、R115 及R116 分別獨立地表示氫原子、鹵素原子、氰基、硝基、羥基或碳原子數為1~12之烷基,存在該烷基經鹵素原子、氰基、硝基或羥基取代之情形,且存在該烷基中之亞甲基被取代為-O-、-S-、-NR117 、-CO-、-CO-O-、-O-CO-或-O-CO-O-之情形,存在R106 或R107 與R112 或R116 鍵結而形成環之情形)[Chemical 6] (In the formula, R 112 , R 113 , R 114 , R 115, and R 116 each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group, or an alkyl group having 1 to 12 carbon atoms, and the alkyl group is present. When the group is substituted with a halogen atom, a cyano group, a nitro group, or a hydroxyl group, and the methylene group in the alkyl group is substituted with -O-, -S-, -NR 117 , -CO-, -CO-O- , -O-CO- or -O-CO-O-, there may be cases where R 106 or R 107 is bonded to R 112 or R 116 to form a ring)

[化7](式中,R101 、R102 、R103 、R104 、R105 、R106 、R107 及R108 與上述通式(V)相同,R109 、R110 及p與上述通式(i)相同)[Chemical 7] (Wherein R 101 , R 102 , R 103 , R 104 , R 105 , R 106 , R 107 and R 108 are the same as the general formula (V), and R 109 , R 110 and p are the same as the general formula (i) the same)

作為通式(V)之說明而於上述中所述之各碳原子數為1~12之烷基例如可列舉作為下述通式(I)中之碳原子數為1~20之烴基之例的碳原子數為1~20之烷基中之碳原子數為1~12者。Examples of the alkyl group having 1 to 12 carbon atoms as described above as the description of the general formula (V) include, for example, examples of the hydrocarbon group having 1 to 20 carbon atoms in the following general formula (I) The number of carbon atoms in the alkyl group having 1 to 20 carbon atoms is 1 to 12.

作為通式(V)之說明而於上述中所述之各碳原子數為1~4之烷基可列舉作為下述通式(I)中之碳原子數為1~20之烴基之例的作為碳原子數為1~20之烷基而後述者中之碳原子數為1~4者。As the description of the general formula (V), each of the alkyl groups having 1 to 4 carbon atoms described above can be exemplified as a hydrocarbon group having 1 to 20 carbon atoms in the following general formula (I). As the alkyl group having 1 to 20 carbon atoms, the number of carbon atoms in the latter group is 1 to 4.

作為通式(V)之說明而於上述中所述之各碳原子數為7~20之芳烷基例如可列舉:苄基、α-甲基苄基、α,α-二甲基苄基、苯基乙基等。Examples of the aralkyl group having 7 to 20 carbon atoms as the description of the general formula (V) include, for example, benzyl, α-methylbenzyl, α, α-dimethylbenzyl , Phenylethyl, etc.

作為通式(V)之說明而於上述中所述之各碳原子數為2~12之烯基可列舉:乙烯基、1-丙烯基、2-丙烯基、異丙烯基、1-丁烯基、2-丁烯基、3-丁烯基、1-辛烯基、1-癸烯基等基。Examples of the alkenyl group having 2 to 12 carbon atoms described above as the description of the general formula (V) include vinyl, 1-propenyl, 2-propenyl, isopropenyl, and 1-butene. Groups such as methyl, 2-butenyl, 3-butenyl, 1-octenyl, and 1-decenyl.

作為通式(V)中之R101 與R102 可連結而形成之3~6員環之雜環,例如可較佳地列舉哌啶環、哌環、啉環、內醯胺環等。As the heterocyclic ring having 3 to 6 members which R 101 and R 102 in the general formula (V) can be linked to each other, for example, a piperidine ring, a piperidine ring, a phosphonium ring, a linacline ring, and the like are preferably mentioned.

作為通式(V)中之R103 與R104 可連結而形成之3~6員環,例如可較佳地列舉環戊烷環、環己烷環、環戊烯環、內酯環、內醯胺環等。As the 3- to 6-membered ring that R 103 and R 104 in the general formula (V) can be linked to form, for example, a cyclopentane ring, a cyclohexane ring, a cyclopentene ring, a lactone ring, an internal Amine ring and so on.

作為通式(V)中之R106 或R107 與R112 或R116 鍵結而成之環,Xs 與左右相鄰之苯環合在一起之結構可列舉:咔唑環、噻嗯環、二苯并噻吩環。As a ring in which R 106 or R 107 is bonded to R 112 or R 116 in the general formula (V), a structure in which X s and left and right adjacent benzene rings are combined may be exemplified by a carbazole ring or a thion ring , Dibenzothiophene ring.

作為通式(V)中之說明而於上述中所述之各鹵素原子可列舉氟、氯、溴、碘。Examples of each halogen atom described above as the description in the general formula (V) include fluorine, chlorine, bromine, and iodine.

較佳之(A1)成分例如可列舉下述化合物No.A1-1~11。As a preferable (A1) component, the following compound No. A1-1-11 is mentioned, for example.

[化8] [Chemical 8]

作為除(A1)成分以外之苯乙酮系化合物,可列舉:並不具有羥基之α-胺基苯乙酮化合物及α-羥基苯乙酮化合物。Examples of the acetophenone-based compounds other than the component (A1) include α-aminoacetophenone compounds and α-hydroxyacetophenone compounds which do not have a hydroxyl group.

作為除(A1)成分以外之苯乙酮系化合物,例如可列舉:二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、4'-異丙基-2-羥基-2-甲基苯丙酮、2-羥基甲基-2-甲基苯丙酮、2,2-二甲氧基-1,2-二苯基乙烷-1-酮、對二甲基胺基苯乙酮、對第三丁基二氯苯乙酮、對第三丁基三氯苯乙酮、對疊氮苯亞甲基苯乙酮、1-羥基環己基苯基酮、2-甲基-1-[4-(甲硫基)苯基]-2-啉基丙酮-1、2-苄基-2-二甲基胺基-1-(4-啉基苯基)-丁酮-1、安息香、安息香甲醚、安息香乙醚、安息香異丙醚、安息香正丁醚、安息香異丁醚及1-[4-(2-羥基乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮等。Examples of the acetophenone-based compound other than the component (A1) include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, and 4'-isopropyl 2-hydroxy-2-methylphenylacetone, 2-hydroxymethyl-2-methylphenylacetone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p- Dimethylaminoacetophenone, p-tert-butyldichloroacetophenone, p-tert-butyltrichloroacetophenone, p-azidebenzylidene, 1-hydroxycyclohexylphenylketone 2-methyl-1- [4- (methylthio) phenyl] -2-olinylacetone-1, 2-benzyl-2-dimethylamino-1- (4-olinylphenyl ) -Butanone-1, benzoin, benzoin methyl ether, benzoin ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether and 1- [4- (2-hydroxyethoxy) -phenyl] -2 -Hydroxy-2-methyl-1-propane-1-one and the like.

作為苯偶醯系化合物,可列舉苯偶醯等。Examples of the benzodiazone-based compound include benzodiazone.

作為二苯甲酮系化合物,例如可列舉:二苯甲酮、鄰苯甲醯基苯甲酸甲酯、米其勒酮、4,4'-雙二乙基胺基二苯甲酮、4,4'-二氯二苯甲酮及4-苯甲醯基-4'-甲基二苯硫醚等。Examples of the benzophenone-based compound include benzophenone, methyl orthobenzoylbenzoate, Michelin, 4,4'-bisdiethylaminobenzophenone, 4, 4'-dichlorobenzophenone and 4-benzylidene-4'-methyldiphenyl sulfide.

作為9-氧硫系化合物,可列舉:9-氧硫、2-甲基-9-氧硫、2-乙基-9-氧硫、2-氯-9-氧硫、2-異丙基-9-氧硫、2,4-二乙基-9-氧硫等。As 9-oxysulfur Compounds, 9-oxysulfur 2-methyl-9-oxysulfur , 2-ethyl-9-oxysulfur , 2-chloro-9-oxysulfur , 2-isopropyl-9-oxysulfur , 2,4-diethyl-9-oxysulfur Wait.

作為肟酯系化合物,可列舉具有上述通式(I)所表示之基的肟酯化合物(A2)等,其可藉由與上述光自由基聚合起始劑中之(A1)成分併用而成為高感度,因此可較佳地用於本發明之聚合性組合物中。Examples of the oxime ester compound include an oxime ester compound (A2) having a group represented by the general formula (I). The oxime ester compound can be used in combination with the component (A1) in the photoradical polymerization initiator. Since it has high sensitivity, it can be preferably used in the polymerizable composition of the present invention.

上述通式(I)中之R1 ~R3 所表示之碳原子數為1~20之烴基並無特別限定,較佳為表示碳原子數為1~20之烷基、碳原子數為2~20之烯基、碳原子數為3~20之環烷基、碳原子數為4~20之環烷基烷基、碳原子數為6~20之芳基或碳原子數為7~20之芳烷基等。自用作聚合起始劑(A)之情形時之感度良好考慮,更佳為碳原子數為1~10之烷基、碳原子數為2~10之烯基、碳原子數為3~10之環烷基、碳原子數為4~10之環烷基烷基、碳原子數為6~10之芳基或碳原子數為7~10之芳烷基等。The hydrocarbon group having 1 to 20 carbon atoms represented by R 1 to R 3 in the general formula (I) is not particularly limited, but preferably an alkyl group having 1 to 20 carbon atoms and 2 carbon atoms Alkenyl group of -20, cycloalkyl group of 3 to 20 carbon atoms, cycloalkylalkyl group of 4 to 20 carbon atoms, aryl group of 6 to 20 carbon atoms, or 7 to 20 carbon atoms Aralkyl and the like. Since the sensitivity when used as a polymerization initiator (A) is considered good, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, and 3 to 10 carbon atoms are more preferable. A cycloalkyl group, a cycloalkylalkyl group having 4 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an aralkyl group having 7 to 10 carbon atoms, and the like.

作為上述碳原子數為1~20之烷基,例如可列舉:甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、異戊基、第三戊基、己基、庚基、辛基、異辛基、2-乙基己基、第三辛基、壬基、異壬基、癸基、異癸基、十一烷基、十二烷基、十四烷基、十六烷基、十八烷基及二十烷基等。作為上述碳原子數為1~10之烷基,例如可列舉:甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、異戊基、第三戊基、己基、庚基、辛基、異辛基、2-乙基己基、第三辛基、壬基、異壬基、癸基及異癸基等。Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, second butyl, third butyl, pentyl, and the like. Isopentyl, third pentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, third octyl, nonyl, isononyl, decyl, isodecyl, undecyl , Dodecyl, tetradecyl, hexadecyl, octadecyl and eicosyl. Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, second butyl, third butyl, pentyl, Isopentyl, third pentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, third octyl, nonyl, isononyl, decyl, and isodecyl, and the like.

作為上述碳原子數為2~20之烯基,例如可列舉:乙烯基、2-丙烯基、3-丁烯基、2-丁烯基、4-戊烯基、3-戊烯基、2-己烯基、3-己烯基、5-己烯基、2-庚烯基、3-庚烯基、4-庚烯基、3-辛烯基、3-壬烯基、4-癸烯基、3-十一碳烯基、4-十二碳烯基、3-環己烯基、2,5-環己二烯基-1-甲基、及4,8,12-十四碳三烯基烯丙基等。作為上述碳原子數為2~10之烯基,例如可列舉:乙烯基、2-丙烯基、3-丁烯基、2-丁烯基、4-戊烯基、3-戊烯基、2-己烯基、3-己烯基、5-己烯基、2-庚烯基、3-庚烯基、4-庚烯基、3-辛烯基、3-壬烯基及4-癸烯基等。Examples of the alkenyl group having 2 to 20 carbon atoms include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, and 2 -Hexenyl, 3-hexenyl, 5-hexenyl, 2-heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-nonenyl, 4-decenyl Alkenyl, 3-undecenyl, 4-dodecenyl, 3-cyclohexenyl, 2,5-cyclohexadienyl-1-methyl, and 4,8,12-14 Carbotrienyl allyl and the like. Examples of the alkenyl group having 2 to 10 carbon atoms include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, and 2 -Hexenyl, 3-hexenyl, 5-hexenyl, 2-heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-nonenyl and 4-decenyl Alkenyl, etc.

所謂上述碳原子數為3~20之環烷基係表示具有3~20個碳原子之飽和單環式或飽和多環式烷基。例如可列舉:環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基、環癸基、金剛烷基、十氫萘基、八氫并環戊二烯、雙環[1.1.1]戊基及十四氫蒽基等。作為上述碳原子數為3~10之環烷基,例如可列舉:環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基、環癸基、金剛烷基、十氫萘基、八氫并環戊二烯及雙環[1.1.1]戊基等。The above-mentioned cycloalkyl group having 3 to 20 carbon atoms means a saturated monocyclic or saturated polycyclic alkyl group having 3 to 20 carbon atoms. Examples include: cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, adamantyl, decahydronaphthyl, octahydrocyclopentane Alkenes, bicyclic [1.1.1] pentyl and tetradecahydroanthracenyl, etc. Examples of the cycloalkyl group having 3 to 10 carbon atoms include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, and adamantane. Alkyl, decahydronaphthyl, octahydrocyclopentadiene and bicyclic [1.1.1] pentyl, etc.

所謂上述碳原子數為4~20之環烷基烷基係表示烷基之氫原子經環烷基取代之具有4~20個碳原子之基。例如可列舉:環丙基甲基、環丁基甲基、環戊基甲基、環己基甲基、環庚基甲基、環辛基甲基、環壬基甲基、環癸基甲基、2-環丁基乙基、2-環戊基乙基、2-環己基乙基、2-環庚基乙基、2-環辛基乙基、2-環壬基乙基、2-環癸基乙基、3-環丁基丙基、3-環戊基丙基、3-環己基丙基、3-環庚基丙基、3-環辛基丙基、3-環壬基丙基、3-環癸基丙基、4-環丁基丁基、4-環戊基丁基、4-環己基丁基、4-環庚基丁基、4-環辛基丁基、4-環壬基丁基、4-環癸基丁基、3-金剛烷基丙基及3-十氫萘基丙基等。作為上述碳原子數為4~10之環烷基烷基,例如可列舉:環丙基甲基、環丁基甲基、環戊基甲基、環己基甲基、環庚基甲基、環辛基甲基、環壬基甲基、2-環丁基乙基、2-環戊基乙基、2-環己基乙基、2-環庚基乙基、2-環辛基乙基、3-環丁基丙基、3-環戊基丙基、3-環己基丙基、3-環庚基丙基、4-環丁基丁基、4-環戊基丁基及4-環己基丁基等。The above-mentioned cycloalkylalkyl group having 4 to 20 carbon atoms means a group having 4 to 20 carbon atoms in which a hydrogen atom of an alkyl group is substituted with a cycloalkyl group. Examples include cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclononylmethyl, cyclodecylmethyl, 2 -Cyclobutylethyl, 2-cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 2-cyclononylethyl, 2-cyclodecyl Ethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 3-cyclooctylpropyl, 3-cyclononylpropyl , 3-cyclodecylpropyl, 4-cyclobutylbutyl, 4-cyclopentylbutyl, 4-cyclohexylbutyl, 4-cycloheptylbutyl, 4-cyclooctylbutyl, 4- Cyclononylbutyl, 4-cyclodecylbutyl, 3-adamantylpropyl and 3-decahydronaphthylpropyl. Examples of the cycloalkylalkyl group having 4 to 10 carbon atoms include cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, and cyclooctyl. Methyl, cyclononylmethyl, 2-cyclobutylethyl, 2-cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 3- Cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 4-cyclobutylbutyl, 4-cyclopentylbutyl and 4-cyclohexylbutyl Base etc.

作為上述碳原子數為6~20之芳基,例如可列舉:苯基、甲苯基、二甲苯基、乙基苯基、萘基、蒽基、菲基等,或經一個以上之上述烷基、上述烯基或羧基、鹵素原子等取代之苯基、聯苯基、萘基、蒽基等,例如4-氯苯基、4-羧基苯基、4-乙烯基苯基、4-甲基苯基、2,4,6-三甲基苯基等。作為上述碳原子數為6~10之芳基,例如可列舉:苯基、甲苯基、二甲苯基、乙基苯基及萘基等,或經一個以上之上述烷基、上述烯基或羧基、鹵素原子等取代之苯基、聯苯基、萘基、蒽基等,例如4-氯苯基、4-羧基苯基、4-乙烯基苯基、4-甲基苯基、2,4,6-三甲基苯基等。Examples of the aryl group having 6 to 20 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, or the like, or one or more of the above alkyl groups. Phenyl, biphenyl, naphthyl, anthracenyl, etc. substituted with the above alkenyl or carboxyl groups, halogen atoms, etc., such as 4-chlorophenyl, 4-carboxyphenyl, 4-vinylphenyl, 4-methyl Phenyl, 2,4,6-trimethylphenyl and the like. Examples of the aryl group having 6 to 10 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, and a naphthyl group, or one or more of the alkyl group, the alkenyl group, or the carboxyl group. Phenyl, biphenyl, naphthyl, anthracenyl, etc. substituted with halogen atoms, such as 4-chlorophenyl, 4-carboxyphenyl, 4-vinylphenyl, 4-methylphenyl, 2,4 , 6-trimethylphenyl and the like.

所謂上述碳原子數為7~20之芳烷基係表示烷基之氫原子經上述碳原子數為6~20之芳基中的碳原子數為6~19之芳基取代之具有7~20個碳原子之基。例如可列舉:苄基、α-甲基苄基、α,α-二甲基苄基、苯基乙基及萘基丙基等。作為上述碳原子數為7~10之芳烷基,表示烷基之氫原子經上述碳原子數為6~20之芳基中的碳原子數為6~9之芳基取代之具有7~10個碳原子之基,例如可列舉:苄基、α-甲基苄基、α,α-二甲基苄基及苯基乙基等。The above-mentioned aralkyl group having 7 to 20 carbon atoms means that a hydrogen atom of an alkyl group is substituted with an aryl group having 6 to 19 carbon atoms in the aryl group having 6 to 20 carbon atoms and has 7 to 20 A base of carbon atoms. Examples include benzyl, α-methylbenzyl, α, α-dimethylbenzyl, phenylethyl, and naphthylpropyl. The above-mentioned aralkyl group having 7 to 10 carbon atoms means that a hydrogen atom of an alkyl group having 7 to 10 is substituted with an aryl group having 6 to 9 carbon atoms in the aryl group having 6 to 20 carbon atoms. Examples of the carbon atom group include benzyl, α-methylbenzyl, α, α-dimethylbenzyl, and phenylethyl.

於存在上述通式(I)中之R1 及R2 所表示之含有雜環之碳原子數為2~20之基以及R1 及R2 所表示之基中之氫原子經取代之情形時,含有雜環之碳原子數為2~20之基並無特別限定,例如可列舉:吡咯基、吡啶基、吡啶基乙基、嘧啶基、嗒基、哌基、哌啶基、吡喃基、吡喃基乙基、吡唑基、三基、三基甲基、吡咯啶基、喹啉基、異喹啉基、咪唑基、苯并咪唑基、三唑基、呋喃基(furyl)、呋喃基(furanyl)、苯并呋喃基、噻吩基(thienyl)、噻吩基(thiophenyl)、苯并噻吩基、噻二唑基、噻唑基、苯并噻唑基、㗁唑基、苯并㗁唑基、異噻唑基、異㗁唑基、吲哚基、啉基、硫代啉基、2-吡咯啶酮-1-基、2-哌啶酮-1-基、2,4-二氧基咪唑啶-3-基及2,4-二氧基㗁唑啶-3-基等,若包含取代基等而具體地記載,則可列舉具有下述結構之基等。When a heterocyclic-containing carbon atom group having 2 to 20 carbon atoms represented by R 1 and R 2 in the above-mentioned general formula (I) and a hydrogen atom in a radical represented by R 1 and R 2 are substituted The group containing 2 to 20 carbon atoms containing a heterocyclic ring is not particularly limited, and examples thereof include pyrrolyl, pyridyl, pyridylethyl, pyrimidinyl, daphyl, piperidyl, piperidinyl, and pyranyl , Pyranylethyl, pyrazolyl, triyl, triylmethyl, pyrrolidinyl, quinolinyl, isoquinolinyl, imidazolyl, benzimidazolyl, triazolyl, furyl, Furanyl, benzofuranyl, thienyl, thiophenyl, benzothienyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl , Isothiazolyl, isoxazolyl, indolyl, phosphono, thiolineno, 2-pyrrolidinone-1-yl, 2-piperidone-1-yl, 2,4-dioxyimidazole Pyridin-3-yl and 2,4-dioxyoxazolidin-3-yl and the like are specifically described as including a substituent and the like, and examples thereof include groups having the following structures.

[化9](上述式中,R分別獨立地表示氫原子或碳原子數為1~6之烷基,Z表示直接鍵或碳原子數為1~6之伸烷基。再者,作為式中之*,該等式所表示之基以*部分表示鍵結鍵)[Chemical 9] (In the above formula, R independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and Z represents a direct bond or an alkylene group having 1 to 6 carbon atoms. In addition, as * in the formula, (The basis represented by this equation is the bond part with *.)

作為上述式中之R所表示之碳原子數為1~6之烷基,可列舉作為上述碳原子數為1~20之烷基而例示者中之碳原子數為1~6者。 作為上述式中之Z所表示之碳原子數為1~6之伸烷基,可列舉:亞甲基、伸乙基、伸丙基、甲基伸乙基、伸丁基、1-甲基伸丙基、2-甲基伸丙基、1,2-二甲基伸丙基、1,3-二甲基伸丙基、1-甲基伸丁基、2-甲基伸丁基、3-甲基伸丁基、4-甲基伸丁基、2,4-二甲基伸丁基、1,3-二甲基伸丁基、伸戊基、伸己基等直鏈或支鏈之伸烷基。Examples of the alkyl group having 1 to 6 carbon atoms represented by R in the above formula include those having 1 to 6 carbon atoms as examples of the alkyl group having 1 to 20 carbon atoms. Examples of the alkylene group having 1 to 6 carbon atoms represented by Z in the above formula include methylene, ethylidene, propylidene, methylidene, butyl, and 1-methyl. Butyl, 2-methyl butyral, 1,2-dimethyl butyral, 1,3-dimethyl butyral, 1-methyl butyl, 2-methyl butyl, Linear or branched chains such as 3-methyl-butylene, 4-methyl-butylene, 2,4-dimethyl-butylene, 1,3-dimethyl-butylene, pentyl, and hexyl Of extension alkyl.

作為通式(I)及(III)之註釋中所記載之各鹵素原子,可列舉氟、氯、溴、碘。Examples of each halogen atom described in the comments of the general formulae (I) and (III) include fluorine, chlorine, bromine, and iodine.

本說明書中,作為存在對各通式(I)或(IV)之註釋中所記載之基中之亞甲基進行取代之情形之不飽和鍵,可列舉-C=C-、-C≡C-等。In the present specification, as an unsaturated bond in the case where the methylene group in the group described in the comment of each general formula (I) or (IV) is substituted, -C = C-, -C≡C -Wait.

具有上述通式(I)所表示之基之化合物中,較佳為下述通式(III)所表示之化合物,其感度特別高,因此可用於本發明之聚合性組合物中。Among the compounds having a group represented by the general formula (I), a compound represented by the following general formula (III) is preferred, and its sensitivity is particularly high, and therefore it can be used in the polymerizable composition of the present invention.

[化10](式中,R1 、R2 及m分別與通式(I)中之R1 、R2 及m相同, R21 及R22 分別獨立地表示氫原子、硝基、氰基、碳原子數為1~20之烷基、碳原子數為6~20之芳基、碳原子數為7~20之芳烷基或含有雜環之碳原子數為2~20之基, X1 表示氧原子、硫原子、硒原子、CR23 R24 、CO、NR25 或PR26 , X2 表示無鍵結、直接鍵、碳原子數為1~20之烴基、CO,R23 ~R26 分別獨立地表示氫原子、碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基,且亦存在R21 ~R26 所表示之基中之氫原子經鹵素原子、硝基、氰基、羥基、羧基或雜環基取代之情形, 亦存在R21 ~R26 所表示之基中之亞甲基於氧不相鄰之條件下取代為-O-或-CO-之情形, 亦存在R21 ~R26 分別獨立地與鄰接之任意苯環成為一體而形成環之情形, g表示0~4之數, h表示0~3之數)。[Chemical 10] (Wherein, R 1, R 2, and m, R 2 the same as m, R 21 and R 22 each independently represent a hydrogen atom, a nitro group, a cyano group, respectively, the general formula (I), R 1 and the carbon atom An alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or a carbon group having 2 to 20 carbon atoms containing a heterocyclic ring, X 1 represents an oxygen atom , Sulfur atom, selenium atom, CR 23 R 24 , CO, NR 25 or PR 26 , X 2 represents a non-bonded, direct bond, hydrocarbon group having 1 to 20 carbon atoms, CO, and R 23 to R 26 are each independently Represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a heterocyclic-containing carbon group having 2 to 20 carbon atoms, and a hydrogen atom in the group represented by R 21 to R 26 also exists through a halogen atom or a nitro group. , Cyano, hydroxy, carboxyl or heterocyclic groups, there are also cases where the methylene group in the group represented by R 21 to R 26 is substituted with -O- or -CO- under the condition that oxygen is not adjacent. There are also cases where R 21 to R 26 each independently form an integral ring with an adjacent benzene ring, g represents a number of 0 to 4, and h represents a number of 0 to 3).

上述通式(III)中之R23 ~R26 所表示之碳原子數為1~20之烴基分別與通式(I)之R1 ~R3 所表示之碳原子數為1~20之烴基相同。又,作為通式(III)中之X2 所表示之碳原子數為1~20之烴基,可列舉自作為通式(I)之R1 ~R3 所表示之碳原子數為1~20之烴基而列舉的各基中除去一個氫原子而成之二價基。 上述通式(III)中之R21 及R22 所表示之碳原子數為1~20之烷基、碳原子數為6~20之芳基、碳原子數為7~20之芳烷基分別與關於作為R1 ~R3 所表示之碳原子數為1~20之烴基之例的上述碳原子數為1~20之烷基、上述碳原子數為6~20之芳基、上述碳原子數為7~20之芳烷基而於上述中所述者相同。A hydrocarbon group having 1 to 20 carbon atoms represented by R 23 to R 26 in the general formula (III) and a hydrocarbon group having 1 to 20 carbon atoms represented by R 1 to R 3 in general formula (I) the same. Examples of the hydrocarbon group having 1 to 20 carbon atoms represented by X 2 in the general formula (III) include those having 1 to 20 carbon atoms represented by R 1 to R 3 as the general formula (I). It is a divalent group obtained by removing one hydrogen atom from each of the listed hydrocarbon groups. The alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, and the aralkyl group having 7 to 20 carbon atoms represented by R 21 and R 22 in the general formula (III), respectively Examples of the hydrocarbon group having 1 to 20 carbon atoms represented by R 1 to R 3 are the alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, and the carbon atom The number of aralkyl groups of 7 to 20 is the same as that described above.

上述通式(III)中之R21 ~R26 所表示的含有雜環之碳原子數為2~20之基與R1 及R2 所表示之含有雜環之碳原子數為2~20之基相同。The heterocyclic-containing carbon atom group represented by R 21 to R 26 in the general formula (III) and the heterocyclic-containing carbon atom group represented by R 1 and R 2 are 2 to 20 carbon atoms. The same base.

作為上述肟酯化合物(A2),例如可列舉下述所示之化合物No.A2-1~No.A2-14。但本發明中所使用之肟酯化合物(A2)並不受以下化合物任何限制。Examples of the oxime ester compound (A2) include compounds No. A2-1 to No. A2-14 shown below. However, the oxime ester compound (A2) used in the present invention is not limited in any way by the following compounds.

[化11] [Chemical 11]

[化12] [Chemical 12]

作為其他自由基聚合起始劑,可列舉:2,4,6-三甲基苯甲醯基二苯基氧化膦等氧化膦系化合物及雙(環戊二烯基)-雙[2,6-二氟-3-(吡咯-1-基)]鈦等二茂鈦系化合物等。Examples of other radical polymerization initiators include phosphine oxide compounds such as 2,4,6-trimethylbenzylidene diphenylphosphine oxide, and bis (cyclopentadienyl) -bis [2,6 -Difluoro-3- (pyrrole-1-yl)] titanium-locene compounds such as titanium.

作為市售之自由基起始劑,可列舉:Adeka Optomer N-1414、N-1717、N-1919、ADEKA ARKLS NCI-831、NCI-930(以上由ADEKA公司製造);IRGACURE184、IRGACURE369、IRGACURE651、IRGACURE907、IRGACURE OXE 01、IRGACURE OXE 02、IRGACURE784(以上由巴斯夫公司製造);TR-PBG-304、TR-PBG-305、TR-PBG-309及TR-PBG-314(以上由TRONLY公司製造)等。Examples of commercially available free radical initiators include: Adeka Optomer N-1414, N-1717, N-1919, ADEKA ARKLS NCI-831, NCI-930 (the above are manufactured by ADEKA); IRGACURE184, IRGACURE369, IRGACURE651, IRGACURE907, IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE784 (above manufactured by BASF); TR-PBG-304, TR-PBG-305, TR-PBG-309 and TR-PBG-314 (above manufactured by TRONLY), etc. .

作為熱自由基聚合起始劑,若為藉由加熱而產生自由基者,則並無特別限制,可使用先前已知之化合物,例如可例示偶氮系化合物、過氧化物及過硫酸鹽等作為較佳者。The thermal radical polymerization initiator is not particularly limited as long as it generates radicals by heating, and previously known compounds can be used, and examples thereof include azo compounds, peroxides, and persulfates. Better.

作為偶氮系化合物,可列舉:2,2'-偶氮雙異丁腈、2,2'-偶氮雙(異丁酸甲酯)、2,2'-偶氮雙-2,4-二甲基戊腈、1,1'-偶氮雙(1-乙醯氧基-1-苯基乙烷)等。Examples of the azo-based compound include 2,2'-azobisisobutyronitrile, 2,2'-azobis (isobutyric acid methyl ester), and 2,2'-azobis-2,4- Dimethylvaleronitrile, 1,1'-azobis (1-acetamido-1-phenylethane), and the like.

作為過氧化物,可列舉:苯甲醯過氧化物、二第三丁基苯甲醯過氧化物、過氧化特戊酸第三丁酯及過氧化二碳酸二(4-第三丁基環己酯)等。Examples of the peroxide include benzamidine peroxide, di-tert-butyl benzamidine peroxide, tert-butyl pervalerate, and di (4-tert-butyl ring peroxydicarbonate). Hexyl ester) and the like.

作為過硫酸鹽,可列舉:過硫酸銨、過硫酸鈉及過硫酸鉀等過硫酸鹽等。Examples of the persulfate include persulfate such as ammonium persulfate, sodium persulfate, and potassium persulfate.

作為(A1)成分以外之上述聚合起始劑(A),具有羥基之聚合起始劑由於可提供液晶污染性低、且電特性優異之顯示器顯示裝置而尤佳。As the polymerization initiator (A) other than the component (A1), a polymerization initiator having a hydroxyl group is particularly preferable because it can provide a display device having low liquid crystal contamination and excellent electrical characteristics.

於通式(III)中,於X1 為硫原子、X2 無鍵結之情形時,成為例如上述化合物No.A2-1~A2-7所表示之具有二苯硫醚骨架之肟酯系化合物,於如下方面而言較佳:藉由併用作為聚合起始劑,可獲得感度良好之聚合性組合物。In the general formula (III), when X 1 is a sulfur atom and X 2 is not bonded, it becomes, for example, an oxime ester system having a diphenyl sulfide skeleton represented by the aforementioned compounds Nos. A2-1 to A2-7. The compound is preferred in that a polymerizable composition having a good sensitivity can be obtained by using it in combination as a polymerization initiator.

於通式(III)中,於X1 為NR55 、X2 為直接鍵之情形時,成為例如上述化合物No.A2-8~A2-14所表示之具有咔唑骨架之肟酯系化合物,於可獲得感度良好之聚合性組合物之方面而言尤佳。In the general formula (III), when X 1 is NR 55 and X 2 is a direct bond, it becomes an oxime ester compound having a carbazole skeleton represented by the aforementioned compound Nos. A2-8 to A2-14, It is especially preferable at the point which can obtain a polymerizable composition with favorable sensitivity.

上述聚合起始劑(A)可使用到此為止所例示之一種或混合使用兩種以上。The above-mentioned polymerization initiator (A) may be used singly as exemplified so far, or two or more thereof may be used in combination.

於本發明之聚合性組合物中,上述聚合起始劑(A)之含量並無特別限定,相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,自硬化性良好之方面考慮較佳為0.1~20質量份、更佳為0.3~10質量份、更佳為0.3~5質量份。於聚合起始劑(A)之含量為上述範圍內之情形時,可獲得硬化性良好、且並不伴隨著聚合起始劑析出之保存穩定性優異之聚合性組合物,因此較佳。 例如於形成厚度為2~5 μm之硬化膜之情形時,聚合起始劑(A)之含量並無特別限定,相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,較佳為0.1~20質量份、更佳為0.3~10質量份、更佳為0.3~5質量份。 又,自彈性回覆、介電常數、電特性等方面考慮,於上述聚合起始劑(A)中,(A1)成分之比例較佳為30質量%以上,且較佳為50質量%以上85質量%以下。又,於將(A1)成分與具有式(I)所表示之基之化合物併用之情形時,(A1)成分:具有式(I)所表示之基之化合物之質量比(前者:後者)較佳為2~5:1,更佳為2~3:1。In the polymerizable composition of the present invention, the content of the polymerization initiator (A) is not particularly limited, and it is relative to the polymerization initiator (A), the colorant (B), the alkaline developing compound (C), and The total amount of the ethylenically unsaturated compound (D) is preferably from 0.1 to 20 parts by mass, more preferably from 0.3 to 10 parts by mass, and even more preferably from 0.3 to 5 parts by mass from the viewpoint of good hardenability in terms of 100 parts by mass in total. When the content of the polymerization initiator (A) is within the above range, it is preferable to obtain a polymerizable composition that has good curability and is excellent in storage stability without accompanying precipitation of the polymerization initiator. For example, when a hardened film having a thickness of 2 to 5 μm is formed, the content of the polymerization initiator (A) is not particularly limited, and it is relative to the polymerization initiator (A), the colorant (B), and the alkaline developability. The total of 100 parts by mass of the compound (C) and the ethylenically unsaturated compound (D) is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, and even more preferably 0.3 to 5 parts by mass. In addition, from the viewpoints of elastic resilience, dielectric constant, and electrical characteristics, the proportion of the component (A1) in the polymerization initiator (A) is preferably 30% by mass or more, and more preferably 50% by mass or more. 85 Mass% or less. When the component (A1) is used in combination with a compound having a base represented by formula (I), the mass ratio of the component (A1): a compound having a base represented by formula (I) (the former: the latter) is smaller than It is preferably 2 to 5: 1, and more preferably 2 to 3: 1.

<著色劑(B)> 作為本發明之聚合性組合物中所使用之著色劑(B),可使用顏料或染料。作為顏料及染料,可分別使用無機有色材料或有機有色材料。該等可單獨使用或混合使用兩種以上。此處,所謂顏料是表示不溶於後述溶劑中之著色劑,亦包含無機或有機有色材料中之不溶於溶劑中者、或對無機或有機染料進行了色澱化者。<Colorant (B)> As the coloring agent (B) used in the polymerizable composition of the present invention, a pigment or a dye can be used. As the pigment and the dye, an inorganic colored material or an organic colored material can be used, respectively. These can be used alone or in combination of two or more. Here, the term "pigment" means a coloring agent that is insoluble in a solvent to be described later, and also includes those that are insoluble in solvents in inorganic or organic colored materials, or those that have been inorganic-organic dyed.

作為上述顏料,可列舉:藉由爐法、槽法或熱裂法而獲得之碳黑、或乙炔黑、科琴黑或燈黑等碳黑;藉由環氧樹脂對上述碳黑進行調整或被覆而成者;將上述碳黑預先於溶劑中進行分散於樹脂中之處理而由20~200 mg/g樹脂被覆而成者;對上述碳黑進行酸性或鹼性表面處理而成者;平均粒徑為8 nm以上且DBP吸油量為90 ml/100 g以下之碳黑;由950℃之揮發分中之CO及CO2 而算出之總氧量相對於每100 m2 表面積為9 mg以上之碳黑;以石墨化碳黑、石墨、活性碳、碳纖維、碳奈米管、微米螺旋碳纖維(carbon micro-coil)、碳奈米角、碳氣凝膠、富勒烯、苯胺黑、顏料黑7、鈦黑、內醯胺黑及苝黑等為代表之黑色顏料;氧化鉻綠、米洛麗藍、鈷綠、鈷藍、錳系、亞鐵氰化物、磷酸鹽群青、鐵藍、群青、天藍、濃綠、翡翠綠、硫酸鉛、黃丹、鋅黃、鐵丹(紅色氧化鐵(III))、鎘紅、合成鐵黑、棕土、色澱顏料等有機或無機顏料。Examples of the pigment include carbon black obtained by a furnace method, a trough method, or a thermal cracking method, or carbon black such as acetylene black, Ketjen black, or lamp black; and the carbon black is adjusted or covered by an epoxy resin. Those obtained by dispersing the carbon black in a solvent in advance and coating the resin with 20 to 200 mg / g of resin; those obtained by subjecting the carbon black to an acidic or alkaline surface treatment; average particle size Carbon black with a diameter of 8 nm or more and DBP oil absorption of 90 ml / 100 g or less; the total oxygen amount calculated from the CO and CO 2 in the volatile matter at 950 ° C relative to a surface area of 9 mg per 100 m 2 Carbon black; Graphitized carbon black, graphite, activated carbon, carbon fiber, carbon nanotube, carbon micro-coil, carbon nanohorn, carbon aerogel, fullerene, aniline black, pigment black 7. Black pigments represented by titanium black, melamine black and perylene black; chrome oxide green, milori blue, cobalt green, cobalt blue, manganese, ferrocyanide, phosphate ultramarine blue, iron blue, ultramarine blue , Sky blue, strong green, emerald green, lead sulfate, yellow dan, zinc yellow, iron dan (red iron (III) oxide), cadmium red, To iron black, umber, organic lake pigments and inorganic pigments.

上述顏料中,自遮光性高考慮,較佳為使用黑色顏料,自液晶污染性低考慮,更佳為使用以內醯胺黑及苝黑等為代表之有機系黑色顏料。Among the above pigments, black pigments are preferred because of their high light-shielding properties, and organic black pigments such as osmamine and osmium black are more preferred in view of low liquid crystal contamination.

作為上述顏料,亦可使用市售品,例如可列舉:顏料紅1、2、3、9、10、14、17、22、23、31、38、41、48、49、88、90、97、112、119、122、123、144、149、166、168、169、170、171、177、179、180、184、185、192、200、202、209、215、216、217、220、223、224、226、227、254、228、240及254;顏料橙13、31、34、36、38、43、46、48、49、51、52、55、59、60、61、62、64、65及71;顏料黃1、3、12、13、14、16、17、20、24、55、60、73、81、83、86、93、95、97、98、100、109、110、113、114、117、120、125、126、127、129、137、138、139、147、148、150、151、152、153、154、166、168、175、180及185;顏料綠7、10、36及58;顏料藍15、15:1、15:2、15:3、15:4、15:5、15:6、22、24、56、60、61、62及64;顏料紫1、19、23、27、29、30、32、37、40及50等。As the pigment, a commercially available product may be used, and examples thereof include pigment red 1, 2, 3, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48, 49, 88, 90, and 97. , 112, 119, 122, 123, 144, 149, 166, 168, 169, 170, 171, 177, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223 , 224, 226, 227, 254, 228, 240, and 254; Pigment Orange 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64 , 65 and 71; pigment yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86, 93, 95, 97, 98, 100, 109, 110 , 113, 114, 117, 120, 125, 126, 127, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 166, 168, 175, 180, and 185; Pigment Green 7 , 10, 36, and 58; Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 5, 15: 6, 22, 24, 56, 60, 61, 62, and 64; pigments Purple 1, 19, 23, 27, 29, 30, 32, 37, 40, and 50.

作為上述染料,例如可列舉:亞硝基化合物、硝基化合物、偶氮化合物、重氮化合物、化合物、喹啉化合物、蒽醌化合物、香豆素化合物、花青化合物、酞菁化合物、異吲哚啉酮化合物、異吲哚啉化合物、喹吖啶酮化合物、蒽締蒽酮化合物、芘化合物、苝化合物、吡咯并吡咯二酮化合物、硫靛藍化合物、二㗁 化合物、三苯基甲烷化合物、喹酞酮化合物、萘四羧酸、偶氮染料、花青染料金屬錯合物等。Examples of the dye include a nitroso compound, a nitro compound, an azo compound, a diazo compound, Compounds, quinoline compounds, anthraquinone compounds, coumarin compounds, cyanine compounds, phthalocyanine compounds, isoindolinone compounds, isoindolin compounds, quinacridone compounds, anthracene anthracene compounds, fluorene compounds , Fluorene compound, pyrrolopyrrole dione compound, thioindigo compound, difluorene compound, triphenylmethane compound, quinophthalone compound, naphthalenetetracarboxylic acid, azo dye, cyanine dye metal complex, and the like.

於本發明之聚合性組合物中,上述著色劑(B)之含量並無特別限定,相對於下述鹼性顯影性化合物(C)100質量份而言較佳為10~500質量份、更佳為10~300質量份、進而較佳為10~200質量份。於著色劑(B)之含量為上述範圍內之情形時,聚合性組合物成為並不伴隨著色劑凝聚之保存穩定性優異者,聚合性組合物之硬化物之遮光性變高,因此較佳。 例如於形成厚度為1~3 μm之硬化物之情形時,著色劑(B)之含量並無特別限定,相對於鹼性顯影性化合物(C)100質量份而言較佳為10~500質量份、更佳為10~300質量份、進而較佳為10~200質量份。In the polymerizable composition of the present invention, the content of the colorant (B) is not particularly limited, and it is preferably 10 to 500 parts by mass, more than 100 parts by mass of the basic developing compound (C) described below. It is preferably 10 to 300 parts by mass, and more preferably 10 to 200 parts by mass. When the content of the colorant (B) is within the above range, the polymerizable composition is excellent in storage stability without accompanying colorant agglomeration, and the light-shielding property of the hardened material of the polymerizable composition is high. . For example, when a hardened material having a thickness of 1 to 3 μm is formed, the content of the colorant (B) is not particularly limited, and it is preferably 10 to 500 masses relative to 100 mass parts of the alkaline developable compound (C). Parts, more preferably 10 to 300 parts by mass, and even more preferably 10 to 200 parts by mass.

<鹼性顯影性化合物(C)> 本發明之鹼性顯影性化合物(C)係具有親水性基、且顯示出鹼性顯影性之化合物。於本發明中,作為鹼性顯影性化合物(C),若滿足上述條件,則可使用先前所使用之化合物。 作為上述親水性基,可列舉:羥基、硫醇基、羧基、磺基、胺基、醯胺基或其鹽等,羥基及羧基由於鹼性顯影性化合物(C)於鹼中之顯影性高而較佳。 鹼性顯影性化合物(C)中之親水性基之較佳之官能基當量(包含1當量親水性基之高分子化合物之質量)為50~10000。 鹼性顯影性化合物(C)之較佳之分子量係重量平均分子量為2000~10000,尤佳為3000~6000。又,數平均分子量為1000~8000,尤其是2000~5000。於鹼性顯影性化合物(C)之分子量為上述範圍之情形時,可獲得顯影性優異、且耐化學品性優異之硬化物,因此較佳。<Alkali developable compound (C)> The alkali developable compound (C) of this invention is a compound which has a hydrophilic group and shows alkali developability. In the present invention, as the basic developable compound (C), if the above-mentioned conditions are satisfied, a previously used compound can be used. Examples of the hydrophilic group include a hydroxyl group, a thiol group, a carboxyl group, a sulfo group, an amine group, an amido group, or a salt thereof. The hydroxyl group and the carboxyl group have high developability in an alkali because of the alkali developable compound (C). And better. The preferred functional group equivalent of the hydrophilic group in the alkaline developing compound (C) (the mass of the polymer compound containing 1 equivalent of the hydrophilic group) is 50 to 10,000. The preferred molecular weight of the alkaline developable compound (C) is a weight average molecular weight of 2,000 to 10,000, particularly preferably 3,000 to 6,000. The number average molecular weight is from 1,000 to 8000, especially from 2000 to 5,000. When the molecular weight of the alkaline developable compound (C) is in the above range, it is preferable to obtain a hardened material having excellent developability and excellent chemical resistance.

上述鹼性顯影性化合物(C)之酸值較佳為10~200 mg/KOH、進而較佳為30~150 mg/KOH。若酸值未達10 mg/KOH,則存在無法充分獲得鹼性顯影性之情形,若大於200 mg/KOH,則存在高分子化合物之製造困難之虞。此處,所謂酸值係依據JIS K 0050及JIS K 0211者。The acid value of the basic developing compound (C) is preferably 10 to 200 mg / KOH, and more preferably 30 to 150 mg / KOH. If the acid value is less than 10 mg / KOH, the alkaline developability may not be sufficiently obtained, and if it is more than 200 mg / KOH, the production of a polymer compound may be difficult. Here, the acid value is based on JIS K 0050 and JIS K 0211.

作為鹼性顯影性化合物(C),具體而言可使用:上述通式(II)所表示之化合物、丙烯酸酯之共聚物;酚系及/或甲酚酚醛清漆環氧樹脂;具有多官能環氧基之聚苯基甲烷型環氧樹脂;環氧丙烯酸酯樹脂;具有於下述通式(IV)所表示之環氧化合物等上加成有不飽和一元酸之結構的環氧加成化合物;具有藉由酯化反應而獲得之結構之樹脂(不飽和化合物)等,上述酯化反應係具有於下述通式(IV)所表示之環氧化合物上加成有不飽和一元酸之結構的環氧加成化合物與多元酸酐之酯化反應。As the alkali developable compound (C), specifically, a compound represented by the above-mentioned general formula (II) and an acrylic ester copolymer; a phenol-based and / or cresol novolac epoxy resin; and a polyfunctional ring Epoxy polyphenylmethane type epoxy resin; epoxy acrylate resin; epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the following general formula (IV) ; A resin (unsaturated compound) having a structure obtained by an esterification reaction; the above-mentioned esterification reaction has a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the following general formula (IV); Esterification of epoxy addition compounds with polybasic acid anhydrides.

[化13](式中,M4 表示選自直接鍵、碳原子數為1~20之烴基、-O-、-S-、-SO2 -、-SS-、-SO-、-CO-、-OCO-或下述式(a)、(b)、(c)或(d)所表示之群之取代基, 存在M4 所表示之碳原子數為1~20之烴基中之氫原子經鹵素原子取代之情形,R31 、R32 、R33 、R34 、R35 、R36 、R37 及R38 (以下亦記載為「R31 ~R38 」)分別獨立地表示氫原子、碳原子數為1~20之烴基、或鹵素原子,k為0~10之數,於k≧1之情形時,存在複數個之R31 ~R38 及M4 分別存在相同之情形,亦存在不同之情形)[Chemical 13] (In the formula, M 4 represents a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, -O-, -S-, -SO 2- , -SS-, -SO-, -CO-, -OCO- Or a substituent of the group represented by the following formula (a), (b), (c) or (d), a hydrogen atom in a hydrocarbon group having 1 to 20 carbon atoms represented by M 4 is substituted with a halogen atom In the case, R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 and R 38 (hereinafter also referred to as “R 31 to R 38 ”) each independently represent a hydrogen atom and a carbon atom number as For a hydrocarbon group of 1 to 20 or a halogen atom, k is a number of 0 to 10, and in the case of k ≧ 1, there are a plurality of R 31 to R 38 and M 4 in the same case, and there are also different cases)

[化14](式中,R39 表示碳原子數為1~20之烴基, R40 、R41 、R42 、R43 、R44 、R45 、R46 、R47 、R48 、R49 、R50 、R51 、R52 、R53 、R54 、R55 、R56 、R57 、R58 、R59 、R60 、R61 、R62 、R63 、R64 、R65 、R66 、R67 及R68 (以下亦記載為「R40 ~R68 」)分別獨立地表示氫原子、碳原子數為1~20之烴基、含有雜環之碳原子數為2~20之基、或鹵素原子, 存在R31 ~R38 及R40 ~R68 所表示之基中之亞甲基被取代為不飽和鍵、-O-或-S-之情形, 存在R40 與R41 、R41 與R42 、R42 與R43 、R43 與R44 、R45 與R46 、R46 與R47 、R47 與R48 、R53 與R54 、R54 與R55 、R55 與R56 、R61 與R62 、R62 與R63 、R63 與R64 、R65 與R66 、R66 與R67 及R67 與R68 鍵結而形成環之情形, (a)、(b)、(c)及(d)所表示之基中之*表示鍵結鍵)[Chemical 14] (In the formula, R 39 represents a hydrocarbon group having 1 to 20 carbon atoms, and R 40 , R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 , R 48 , R 49 , R 50 , R 51 , R 52 , R 53 , R 54 , R 55 , R 56 , R 57 , R 58 , R 59 , R 60 , R 61 , R 62 , R 63 , R 64 , R 65 , R 66 , R 67 And R 68 (hereinafter also referred to as "R 40 to R 68 ") each independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a heterocyclic group containing 2 to 20 carbon atoms, or a halogen atom In some cases, the methylene group in the group represented by R 31 to R 38 and R 40 to R 68 is substituted with an unsaturated bond, -O- or -S-, and R 40 and R 41 , R 41 and R are present. 42 , R 42 and R 43 , R 43 and R 44 , R 45 and R 46 , R 46 and R 47 , R 47 and R 48 , R 53 and R 54 , R 54 and R 55 , R 55 and R 56 , When R 61 and R 62 , R 62 and R 63 , R 63 and R 64 , R 65 and R 66 , R 66 and R 67, and R 67 and R 68 are bonded to form a ring, (a), (b) (* In the bases represented by (c) and (d) represents a bonding bond)

藉由使用上述通式(II)所表示之鹼性顯影性化合物,由聚合性組合物所獲得之硬化物之耐化學品性優異,因此較佳。By using the alkaline developable compound represented by the said general formula (II), since the hardened | cured material obtained from a polymerizable composition is excellent in chemical resistance, it is preferable.

若使用具有於上述通式(IV)所表示之環氧化合物上加成有不飽和一元酸之結構的環氧加成化合物;或作為藉由酯化反應(該酯化反應係具有於上述通式(IV)所表示之環氧化合物上加成有不飽和一元酸之結構之環氧加成化合物與多元酸酐之酯化反應)而獲得之反應產物之鹼性顯影性化合物,則聚合性組合物之感度變高,由該聚合性組合物而獲得之硬化物之彈性回覆率優異,因此較佳。If an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to the epoxy compound represented by the general formula (IV) is used, or as an esterification reaction (the esterification reaction is The basic developable compound of the reaction product obtained by adding an epoxy addition compound having a structure of an unsaturated monobasic acid to an epoxy compound represented by the formula (IV) and an esterification reaction of a polybasic acid anhydride) is a polymerizable combination The sensitivity of the material is high, and the cured product obtained from the polymerizable composition is excellent in elastic recovery rate, and is therefore preferred.

自著色劑(B)之分散性變良好、且耐熱性良好考慮,上述鹼性顯影性化合物(C)較佳為上述通式(IV)所表示之環氧化合物;於上述通式(IV)所表示之環氧化合物上加成不飽和一元酸而成之具有下述結構[(e)]之環氧化合物;或藉由該不飽和化合物與多元酸酐之酯化反應而獲得之具有下述結構[(f)]之不飽和化合物。Since the dispersibility of the colorant (B) is improved and the heat resistance is good, the basic developable compound (C) is preferably an epoxy compound represented by the general formula (IV); An epoxy compound having the following structure [(e)], which is obtained by adding an unsaturated monoacid to the represented epoxy compound; or having the following structure obtained by an esterification reaction of the unsaturated compound and a polybasic acid anhydride: Unsaturated compound of structure [(f)].

[化15](式中,Y7 表示不飽和一元酸之殘基,Y8 表示多元酸酐之殘基, *表示鍵結鍵)[Chemical 15] (In the formula, Y 7 represents a residue of an unsaturated monobasic acid, Y 8 represents a residue of a polybasic acid anhydride, and * represents a bonding bond)

於上述通式(IV)所表示之鹼性顯影性化合物中,M4 為(b)或(c)所表示之基之情形時,由該聚合性組合物所獲得之硬化物之耐溶劑性變良好,因此尤佳。In the case where M 4 is a base represented by (b) or (c) in the alkaline developable compound represented by the general formula (IV), the solvent resistance of the cured product obtained from the polymerizable composition Get better, so better.

上述通式(II)中之R12 、R14 、R16 、Y1 ~Y3 及Z1 ~Z3 所表示之碳原子數為1~20之烴基可列舉與通式(I)之說明中所上述之碳原子數為1~20之烴基相同者。Examples of the hydrocarbon group having 1 to 20 carbon atoms represented by R 12 , R 14 , R 16 , Y 1 to Y 3 and Z 1 to Z 3 in the general formula (II) include the descriptions with the general formula (I) The above-mentioned hydrocarbon groups having 1 to 20 carbon atoms are the same.

於存在上述通式(II)中之R12 、R14 、R16 、Y1 ~Y3 及Z1 ~Z3 所表示之含有雜環之碳原子數為2~20之基以及R12 、R14 、R16 、Y1 、Y2 、Y3 、Z1 、Z2 及Z3 所表示之基中之氫原子經取代之情形時,含有雜環之碳原子數為2~20之基可列舉與通式(I)之說明中所上述之含有雜環之碳原子數為2~20之基相同者。A group having 2 to 20 carbon atoms containing a heterocyclic ring represented by R 12 , R 14 , R 16 , Y 1 to Y 3 and Z 1 to Z 3 in the above-mentioned general formula (II), and R 12 , When a hydrogen atom in a group represented by R 14 , R 16 , Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 is substituted, a group containing 2 to 20 carbon atoms containing a heterocyclic ring Examples of the same group as those having 2 to 20 carbon atoms in the heterocyclic-containing ring described in the description of the general formula (I) are mentioned.

上述通式(IV)中之M4 及R31 ~R68 所表示之碳原子數為1~20之烴基可列舉與通式(I)之說明中所上述之碳原子數為1~20之烴基相同者。Examples of the hydrocarbon group having 1 to 20 carbon atoms represented by M 4 and R 31 to R 68 in the general formula (IV) include those having 1 to 20 carbon atoms described in the description of the general formula (I). The same hydrocarbyl group.

作為上述通式(IV)中之R40 ~R68 所表示之含有雜環之碳原子數為2~20之基,可列舉與通式(I)之說明中所上述之含有雜環之碳原子數為2~20之基相同者。Examples of the heterocyclic-containing carbon atom group having 2 to 20 carbon atoms represented by R 40 to R 68 in the general formula (IV) include the heterocyclic-containing carbon groups described in the description of the general formula (I). Those having 2 to 20 atoms have the same base.

作為對上述通式(IV)中之M4 所表示之碳原子數為1~20之烴基之氫原子進行取代之鹵素原子及R31 ~R68 所表示之鹵素原子,可列舉氟、氯、溴、碘。Examples of the halogen atom substituted for a hydrogen atom of a hydrocarbon group having 1 to 20 carbon atoms represented by M 4 in the general formula (IV) and a halogen atom represented by R 31 to R 68 include fluorine, chlorine, and Bromine and iodine.

作為上述通式(IV)中之R40 與R41 、R41 與R42 、R42 與R43 、R43 與R44 、R45 與R46 、R46 與R47 、R47 與R48 、R53 與R54 、R54 與R55 、R55 與R56 、R61 與R62 、R62 與R63 、R63 與R64 、R65 與R66 、R66 與R67 及R67 與R68 鍵結而形成之環,例如可列舉:環戊烷、環己烷、環戊烯、苯、吡咯啶、吡咯、哌、啉、硫代啉、四氫吡啶、內酯環及內醯胺環等5~7員環以及萘及蒽等縮合環等。As R 40 and R 41 , R 41 and R 42 , R 42 and R 43 , R 43 and R 44 , R 45 and R 46 , R 46 and R 47 , R 47 and R 48 in the general formula (IV). , R 53 and R 54 , R 54 and R 55 , R 55 and R 56 , R 61 and R 62 , R 62 and R 63 , R 63 and R 64 , R 65 and R 66 , R 66 and R 67 and R The ring formed by bonding 67 and R 68 includes, for example, cyclopentane, cyclohexane, cyclopentene, benzene, pyrrolidine, pyrrole, piperidine, thioline, tetrahydropyridine, a lactone ring, and 5- to 7-membered rings such as the lactam ring and condensed rings such as naphthalene and anthracene.

上述不飽和一元酸係表示於結構中具有不飽和鍵,且於一分子中具有一個可電離而成為氫離子之氫原子的酸。 作為上述不飽和一元酸,例如可列舉:丙烯酸、甲基丙烯酸、丁烯酸、桂皮酸、山梨酸及甲基丙烯酸羥基乙酯-馬來酸酯、甲基丙烯酸羥基丙酯-馬來酸酯、丙烯酸羥基丙酯-馬來酸酯及二環戊二烯-馬來酸酯等。The unsaturated monobasic acid is an acid having an unsaturated bond in the structure and having one hydrogen atom that can be ionized to become a hydrogen ion in one molecule. Examples of the unsaturated monobasic acid include acrylic acid, methacrylic acid, butenoic acid, cinnamic acid, sorbic acid, and hydroxyethyl methacrylate-maleate, and hydroxypropyl methacrylate-maleate. , Hydroxypropyl acrylate-maleate and dicyclopentadiene-maleate.

又,作為於上述不飽和一元酸起作用之後起作用之上述多元酸酐,可列舉:聯苯四羧酸二酐、四氫鄰苯二甲酸酐、琥珀酸酐、聯苯四甲酸二酐、馬來酸酐、偏苯三甲酸酐、均苯四甲酸二酐、2,2'-3,3'-二苯甲酮四羧酸二酐、乙二醇雙脫水偏苯三酸酯、甘油三脫水偏苯三酸酯、六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、耐地酸酐、甲基耐地酸酐、三烷基四氫鄰苯二甲酸酐、六氫鄰苯二甲酸酐、5-(2,5-二側氧四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-馬來酸酐加成物、十二碳烯基琥珀酸酐、甲基雙環庚烯二甲酸酐等。Examples of the polybasic acid anhydrides that work after the unsaturated monobasic acid functions include biphenyltetracarboxylic dianhydride, tetrahydrophthalic anhydride, succinic anhydride, biphenyltetracarboxylic dianhydride, and malay. Acid anhydride, trimellitic anhydride, pyromellitic dianhydride, 2,2'-3,3'-benzophenone tetracarboxylic dianhydride, ethylene glycol dianhydrotrimellitate, triglyceride trihydrate Triester, Hexahydrophthalic Anhydride, Methyltetrahydrophthalic Anhydride, Geo-Anhydride, Methyl Geodesic Anhydride, Trialkyltetrahydrophthalic Anhydride, Hexahydrophthalic Anhydride , 5- (2,5-Dioxotetrahydrofuranyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride-maleic anhydride addition Compounds, dodecenyl succinic anhydride, methylbicycloheptene dicarboxylic anhydride and the like.

上述環氧化合物、上述不飽和一元酸及上述多元酸酐之反應莫耳比較佳為如下所示地設定。 亦即,上述環氧加成化合物較佳為以相對於上述環氧化合物之環氧基1個而言,上述不飽和一元酸之羧基成為0.1~1.0個之比率進行加成,又,上述反應產物較佳為相對於上述環氧加成物之羥基1個而言,上述多元酸酐之酸酐結構成為0.1~1.0個之比率。 上述通式(IV)所表示之環氧化合物、上述不飽和一元酸及上述多元酸酐之反應可依照慣例而進行。The molar reaction of the epoxy compound, the unsaturated monobasic acid, and the polybasic acid anhydride is preferably set as follows. That is, it is preferable that the epoxy addition compound is added at a ratio of 0.1 to 1.0 carboxyl groups of the unsaturated monobasic acid relative to one epoxy group of the epoxy compound, and that the reaction is The product is preferably a ratio of 0.1 to 1.0 of the anhydride structure of the polybasic acid anhydride with respect to one hydroxyl group of the epoxy adduct. The reaction of the epoxy compound represented by the general formula (IV), the unsaturated monobasic acid, and the polybasic acid anhydride can be carried out in accordance with conventional practices.

為了調整酸值而改良本發明之聚合性組合物、BM用感光性組合物及BCS用感光性組合物之顯影性,可與上述鹼性顯影性化合物(C)一同而進一步使單官能或多官能環氧化合物反應。上述鹼性顯影性化合物(C)之固形物成分之酸值較佳為5~120 mgKOH/g之範圍,單官能或多官能環氧化合物之使用量較佳為以滿足上述酸值之方式選擇。In order to improve the developability of the polymerizable composition, the photosensitive composition for BM, and the photosensitive composition for BCS of the present invention in order to adjust the acid value, it may be further monofunctional or polyfunctional together with the basic developing compound (C). Functional epoxy compounds react. The acid value of the solid component of the basic developing compound (C) is preferably in the range of 5 to 120 mgKOH / g, and the amount of the monofunctional or polyfunctional epoxy compound is preferably selected in a manner to satisfy the acid value. .

作為上述單官能環氧化合物,可列舉:甲基丙烯酸縮水甘油酯、甲基縮水甘油醚、乙基縮水甘油醚、丙基縮水甘油醚、異丙基縮水甘油醚、丁基縮水甘油醚、異丁基縮水甘油醚、第三丁基縮水甘油醚、戊基縮水甘油醚、己基縮水甘油醚、庚基縮水甘油醚、辛基縮水甘油醚、壬基縮水甘油醚、癸基縮水甘油醚、十一烷基縮水甘油醚、十二烷基縮水甘油醚、十三烷基縮水甘油醚、十四烷基縮水甘油醚、十五烷基縮水甘油醚、十六烷基縮水甘油醚、2-乙基己基縮水甘油醚、烯丙基縮水甘油醚、炔丙基縮水甘油醚、對甲氧基乙基縮水甘油醚、苯基縮水甘油醚、對甲氧基縮水甘油醚、對丁基苯酚縮水甘油醚、甲苯基縮水甘油醚、2-甲基甲苯基縮水甘油醚、4-壬基苯基縮水甘油醚、苄基縮水甘油醚、對異丙苯基苯基縮水甘油醚、三苯甲基縮水甘油醚、甲基丙烯酸2,3-環氧丙酯、環氧化大豆油、環氧化亞麻仁油、丁酸縮水甘油酯、一氧化乙烯基環己烷、1,2-環氧-4-乙烯基環己烷、環氧苯乙烷、氧化蒎烯、甲基環氧苯乙烷、環氧環己烷、環氧丙烷、下述環氧化合物No.E1、No.E2等。Examples of the monofunctional epoxy compound include glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, and isopropyl ether. Butyl glycidyl ether, third butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, ten Monoalkyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, cetyl glycidyl ether, 2-ethyl Hexyl glycidyl ether, allyl glycidyl ether, propargyl glycidyl ether, p-methoxyethyl glycidyl ether, phenyl glycidyl ether, p-methoxy glycidyl ether, p-butylphenol glycidyl ether Ether, tolyl glycidyl ether, 2-methyltolyl glycidyl ether, 4-nonylphenyl glycidyl ether, benzyl glycidyl ether, p-cumylphenyl glycidyl ether, trityl glycidyl ether Glyceryl ether, methacrylic acid 2 , 3-epoxypropyl ester, epoxidized soybean oil, epoxidized linseed oil, glycidyl butyrate, vinyl cyclohexane monoxide, 1,2-epoxy-4-vinyl cyclohexane, epoxy Phenylethane, pinene oxide, methyl phenylene oxide, cyclohexane, propylene oxide, the following epoxy compounds No. E1, No. E2, and the like.

[化16] [Chemical 16]

[化17] [Chemical 17]

作為上述多官能環氧化合物,若使用選自由雙酚型環氧化合物及縮水甘油醚類所構成之群中之一種以上化合物,則可獲得特性進一步良好之聚合性組合物,因此較佳。 作為上述雙酚型環氧化合物,除了可使用上述通式(IV)所表示之環氧化合物以外,例如亦可使用氫化雙酚型環氧化合物等雙酚型環氧化合物。 又,作為上述縮水甘油醚類,可使用乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、1,8-辛二醇二縮水甘油醚、1,10-癸二醇二縮水甘油醚、2,2-二甲基-1,3-丙二醇二縮水甘油醚、二乙二醇二縮水甘油醚、三乙二醇二縮水甘油醚、四乙二醇二縮水甘油醚、六乙二醇二縮水甘油醚、1,4-環己烷二甲醇二縮水甘油醚、1,1,1-三(縮水甘油氧基甲基)丙烷、1,1,1-三(縮水甘油氧基甲基)乙烷、1,1,1-三(縮水甘油氧基甲基)甲烷、1,1,1,1-四(縮水甘油氧基甲基)甲烷等。 另外,亦可使用:酚系酚醛清漆型環氧化合物、聯苯酚醛清漆型環氧化合物、甲酚酚醛清漆型環氧化合物、雙酚A酚醛清漆型環氧化合物、二環戊二烯酚醛清漆型環氧化合物等酚醛清漆型環氧化合物;3,4-環氧-6-甲基環己烷羧酸-3,4-環氧-6-甲基環己基甲酯、3,4-環氧環己烷羧酸-3,4-環氧環己基甲酯、1-環氧乙基-3,4-環氧環己烷等脂環式環氧化合物;鄰苯二甲酸二縮水甘油酯、四氫鄰苯二甲酸二縮水甘油酯、二聚酸縮水甘油酯等縮水甘油酯類;四縮水甘油基二胺基二苯基甲烷、三縮水甘油基對胺基苯酚、N,N-二縮水甘油基苯胺等縮水甘油基胺類;1,3-二縮水甘油基-5,5-二甲基乙內醯脲、異氰尿酸三縮水甘油酯等雜環式環氧化合物;二氧化二環戊二烯等二氧化物化合物;萘型環氧化合物;三苯基甲烷型環氧化合物;二環戊二烯型環氧化合物等。As the polyfunctional epoxy compound, it is preferable to use one or more compounds selected from the group consisting of a bisphenol-type epoxy compound and glycidyl ethers, since a polymerizable composition having further excellent characteristics can be obtained, and therefore, it is preferable. As the bisphenol type epoxy compound, in addition to the epoxy compound represented by the general formula (IV), for example, a bisphenol type epoxy compound such as a hydrogenated bisphenol type epoxy compound may be used. As the glycidyl ethers, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1 , 8-octanediol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, Triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1,1-tri (glycidyl Glyceryloxymethyl) propane, 1,1,1-tris (glycidyloxymethyl) ethane, 1,1,1-tris (glycidyloxymethyl) methane, 1,1,1,1 -Tetrakis (glycidyloxymethyl) methane and the like. In addition, phenolic novolac epoxy compounds, biphenol novolac epoxy compounds, cresol novolac epoxy compounds, bisphenol A novolac epoxy compounds, dicyclopentadiene novolacs Type epoxy compounds and other novolac type epoxy compounds; 3,4-epoxy-6-methylcyclohexanecarboxylic acid-3,4-epoxy-6-methylcyclohexylmethyl ester, 3,4-cyclo Alicyclic epoxy compounds such as oxycyclohexanecarboxylic acid-3,4-epoxycyclohexylmethyl ester, 1-epoxyethyl-3,4-epoxycyclohexane; diglycidyl phthalate , Glycidyl esters such as diglycidyl tetrahydrophthalate, glycidyl dimer acid; tetraglycidyl diamino diphenylmethane, triglycidyl p-aminophenol, N, N-di Glycidyl amines such as glycidyl aniline; heterocyclic epoxy compounds such as 1,3-diglycidyl-5,5-dimethylhydantoin and triglycidyl isocyanurate; Dioxide compounds such as cyclopentadiene; naphthalene type epoxy compounds; triphenylmethane type epoxy compounds; dicyclopentadiene type epoxy compounds and the like.

作為鹼性顯影性化合物(C),亦可適宜使用市售品。 作為該市售品,例如可列舉:SPC1000、SPC-2000、SPC-3000、SPRR-1X、SPRR-2X、SPRR-3X、SPRR-5X、SPRR-6X、SPRR-7X、SPRR-8X、SPRR-9X、SPRR-10X、SPRR-11X、SPRR-12X、SPRR-13X、SPRR-14X、SPRR-15X、SPRR-16X、SPRR-17X、SPRR-18X、SPRR-19X、SPRR-20X、SPRR-21X(以上由昭和電工公司製造)、JET2000、AGOR1060、AGOR3060、ORGA1060、ORGA2060(以上由大阪有機化學公司製造)、CCR-1171H(日本化藥公司製造)等。As the alkali developable compound (C), a commercially available product can also be suitably used. Examples of the commercially available products include SPC1000, SPC-2000, SPC-3000, SPRR-1X, SPRR-2X, SPRR-3X, SPRR-5X, SPRR-6X, SPRR-7X, SPRR-8X, and SPRR- 9X, SPRR-10X, SPRR-11X, SPRR-12X, SPRR-13X, SPRR-14X, SPRR-15X, SPRR-16X, SPRR-17X, SPRR-18X, SPRR-19X, SPRR-20X, SPRR-21X ( The above are manufactured by Showa Denko Corporation), JET2000, AGOR1060, AGOR3060, ORGA1060, ORGA2060 (the above are manufactured by Osaka Organic Chemical Co., Ltd.), CCR-1171H (made by Nippon Kayaku Co., Ltd.), and the like.

於本發明之聚合性組合物中,鹼性顯影性化合物(C)之含量並無特別限定,相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,較佳為10~90質量份、更佳為20~80質量份,進而較佳為30~80質量份。於鹼性顯影性化合物(C)之含量為上述範圍內之情形時,聚合性組合物之鹼性顯影性良好,因此較佳。 例如於形成厚度為2~5 μm之硬化膜之情形時,鹼性顯影性化合物(C)之含量並無特別限定,相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,較佳為10~90質量份、更佳為20~80質量份、進而較佳為30~80質量份。 又,於鹼性顯影性化合物(C)含有通式(II)所表示之化合物之情形時,其量相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,較佳為10~60質量份、更佳為20~50質量份。又,於含有環氧加成化合物(其具有於上述通式(IV)所表示之環氧化合物上加成有不飽和一元酸之結構)、或藉由該環氧加成化合物與多元酸酐之酯化反應而獲得之反應產物之情形時,其量相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,較佳為5~80質量份、更佳為5~40質量份。所謂上述之環氧加成化合物及藉由該環氧加成化合物與多元酸酐之酯化反應而獲得之反應產物之含量,於僅含有該環氧加成化合物及該反應產物之一者之情形時為其量,於含有兩者之情形時為其合計量。In the polymerizable composition of the present invention, the content of the alkali developable compound (C) is not particularly limited, and it is relative to the polymerization initiator (A), the colorant (B), the alkali developable compound (C), and The total amount of the ethylenically unsaturated compound (D) is preferably 100 to 90 parts by mass, preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, and even more preferably 30 to 80 parts by mass. When the content of the alkaline developable compound (C) is within the above-mentioned range, the alkaline developability of the polymerizable composition is good, so it is preferable. For example, when a hardened film having a thickness of 2 to 5 μm is formed, the content of the alkaline developable compound (C) is not particularly limited, and it is relative to the polymerization initiator (A), the colorant (B), and the alkaline development. The total of 100 parts by mass of the sexual compound (C) and the ethylenically unsaturated compound (D) is preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, and even more preferably 30 to 80 parts by mass. When the basic developable compound (C) contains a compound represented by the general formula (II), the amount is relative to the polymerization initiator (A), the colorant (B), and the basic developable compound (C). ) And the ethylenically unsaturated compound (D) in a total amount of 100 parts by mass, preferably 10 to 60 parts by mass, and more preferably 20 to 50 parts by mass. In addition, an epoxy addition compound (having a structure in which an unsaturated monobasic acid is added to the epoxy compound represented by the general formula (IV)), or an epoxy addition compound and a polybasic acid anhydride is used. In the case of a reaction product obtained by an esterification reaction, the amount is 100 with respect to the total of the polymerization initiator (A), the colorant (B), the basic developing compound (C), and the ethylenically unsaturated compound (D). It is preferably 5 to 80 parts by mass, and more preferably 5 to 40 parts by mass. The content of the above-mentioned epoxy addition compound and the reaction product obtained by the esterification reaction of the epoxy addition compound with a polybasic acid anhydride, in the case where only one of the epoxy addition compound and the reaction product is contained When it is the amount, when it contains both, it is the total amount.

<乙烯性不飽和化合物(D)> 本發明中所使用之乙烯性不飽和化合物(D)係具有乙烯性不飽和鍵、且並非上述鹼性顯影性化合物(C)之化合物。作為乙烯性不飽和化合物(D),例如可列舉:乙烯、丙烯、丁烯、異丁烯、氯乙烯、偏二氯乙烯、偏二氟乙烯、四氟乙烯等不飽和脂肪族烴;(甲基)丙烯酸、α-氯丙烯酸、伊康酸、馬來酸、檸康酸、富馬酸、雙環庚烯二甲酸、丁烯酸、異丁烯酸、乙烯基乙酸、烯丙基乙酸、桂皮酸、山梨酸、中康酸、琥珀酸單[2-(甲基)丙烯醯氧基乙酯]、鄰苯二甲酸單[2-(甲基)丙烯醯氧基乙酯]、ω-羧基聚己內酯單(甲基)丙烯酸酯等在兩末端具有羧基與羥基之聚合物之單(甲基)丙烯酸酯;(甲基)丙烯酸羥基乙酯-馬來酸酯、(甲基)丙烯酸羥基丙酯-馬來酸酯、二環戊二烯-馬來酸酯或具有一個羧基與兩個以上(甲基)丙烯醯基之多官能(甲基)丙烯酸酯等不飽和多元酸;(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸縮水甘油酯、下述丙烯酸系化合物No.1~No.4、(甲基)丙烯酸甲酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸二甲基胺基甲酯、(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸胺基丙酯、(甲基)丙烯酸二甲基胺基丙酯、(甲基)丙烯酸乙氧基乙酯、(甲基)丙烯酸聚(乙氧基)乙酯、(甲基)丙烯酸丁氧基乙氧基乙酯、(甲基)丙烯酸乙基己酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸四氫呋喃酯、(甲基)丙烯酸乙烯酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸苄酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、三羥甲基乙烷三(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、異氰尿酸三[(甲基)丙烯醯基乙基]酯、聚酯(甲基)丙烯酸酯低聚物等不飽和一元酸及多元醇或多酚之酯;(甲基)丙烯酸鋅、(甲基)丙烯酸鎂等不飽和多元酸之金屬鹽;馬來酸酐、伊康酸酐、檸康酸酐、甲基四氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、三烷基四氫鄰苯二甲酸酐、5-(2,5-二側氧四氫呋喃基)-3-甲基-3-環己烯-1,2-二羧酸酐、三烷基四氫鄰苯二甲酸酐-馬來酸酐加成物、十二碳烯基琥珀酸酐、甲基雙環庚烯二甲酸酐等不飽和多元酸之酸酐;(甲基)丙烯醯胺、亞甲基雙(甲基)丙烯醯胺、二伸乙基三胺三(甲基)丙烯醯胺、苯二甲基雙(甲基)丙烯醯胺、α-氯丙烯醯胺、N-2-羥基乙基(甲基)丙烯醯胺等不飽和一元酸及多胺之醯胺;丙烯醛等不飽和醛;(甲基)丙烯腈、α-氯丙烯腈、二氰亞乙烯、烯丙基腈等不飽和腈;苯乙烯、4-甲基苯乙烯、4-乙基苯乙烯、4-甲氧基苯乙烯、4-羥基苯乙烯、4-氯苯乙烯、二乙烯基苯、乙烯基甲苯、乙烯基苯甲酸、乙烯基苯酚、乙烯基磺酸、4-乙烯基苯磺酸、乙烯基苄基甲基醚、乙烯基苄基縮水甘油醚等不飽和芳香族化合物;甲基乙烯基酮等不飽和酮;乙烯基胺、烯丙基胺、N-乙烯基吡咯啶酮、乙烯基哌啶等不飽和胺化合物;烯丙醇、巴豆醇等乙烯醇;乙烯基甲基醚、乙烯基乙基醚、正丁基乙烯基醚、異丁基乙烯基醚、烯丙基縮水甘油醚等乙烯醚;馬來醯亞胺、N-苯基馬來醯亞胺、N-環己基馬來醯亞胺等不飽和醯亞胺類;茚、1-甲基茚等茚類;1,3-丁二烯、異戊二烯、氯戊二烯等脂肪族共軛二烯類;聚苯乙烯、聚(甲基)丙烯酸甲酯、聚(甲基)丙烯酸正丁酯、聚矽氧烷等在聚合物分子鏈之末端具有單(甲基)丙烯醯基之巨單體類;氯乙烯、偏二氯乙烯、琥珀酸二乙烯酯、鄰苯二甲酸二烯丙酯、磷酸三烯丙酯、異氰尿酸三烯丙酯、乙烯基硫醚、乙烯基咪唑、乙烯基㗁唑啉、乙烯基咔唑、乙烯基吡咯啶酮、乙烯基吡啶、含有羥基之乙烯基單體及聚異氰酸酯化合物之胺基甲酸乙烯酯化合物、含有羥基之乙烯基單體及聚環氧化合物之乙烯基環氧化合物。 上述乙烯性不飽和化合物(D)可單獨使用或混合使用兩種以上。<Ethylene Unsaturated Compound (D)> The ethylenically unsaturated compound (D) used in the present invention is a compound which has an ethylenically unsaturated bond and is not the above-mentioned basic developing compound (C). Examples of the ethylenically unsaturated compound (D) include unsaturated aliphatic hydrocarbons such as ethylene, propylene, butene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride, and tetrafluoroethylene; (methyl) Acrylic acid, alpha-chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, dicycloheptene dicarboxylic acid, butenoic acid, methacrylic acid, vinylacetic acid, allylacetic acid, cinnamic acid, sorbic acid , Mesaconic acid, succinic acid mono [2- (meth) acryloxyethyl], phthalic acid mono [2- (meth) acryloxyethyl], ω-carboxy polycaprolactone Mono (meth) acrylates such as polymers with carboxyl and hydroxyl groups at both ends; hydroxyethyl (meth) acrylate-maleate, hydroxypropyl (meth) acrylate- Unsaturated polybasic acids such as maleate, dicyclopentadiene-maleate or polyfunctional (meth) acrylates having one carboxyl group and two or more (meth) acrylfluorenyl groups; (meth) acrylic acid 2-hydroxyethyl ester, 2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, the following acrylic compounds No. 1 to No. 4, (meth) Methyl enoate, butyl (meth) acrylate, isobutyl (meth) acrylate, third butyl (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate, Isooctyl (meth) acrylate, isononyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, methoxyethyl (meth) acrylate, (meth) Dimethylaminomethyl acrylate, dimethylaminoethyl (meth) acrylate, aminopropyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, (meth) acrylic acid Ethoxyethyl, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, ethylhexyl (meth) acrylate, benzene (meth) acrylate Ethoxyethyl ester, tetrahydrofuran (meth) acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, di Ethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butane Alcohol di (meth) acrylate, 1,6- Hexanediol di (meth) acrylate, trimethylolethane tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol Penta (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, isocyanuric acid tri [(meth) propylene Unsaturated monobasic acids such as fluorenylethyl] esters, polyester (meth) acrylate oligomers, and esters of polyhydric alcohols or polyphenols; unsaturated polybasic acids such as zinc (meth) acrylate, and magnesium (meth) acrylate Metal salts; maleic anhydride, itaconic anhydride, citraconic anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5- (2, 5-Dioxotetrahydrofuranyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride-maleic anhydride adduct, dodecene Anhydrides of unsaturated polybasic acids such as methyl succinic anhydride, methylbicycloheptene dicarboxylic acid anhydride; (meth) acrylamide, methylenebis (meth) acrylamide, bis (ethyltriamine) tris (methyl) ) Acrylic Ammonium amine, xylylene bis (meth) acrylamide, α-chloroacrylamide, N-2-hydroxyethyl (meth) acrylamide and other unsaturated monoacids and polyamines; ammonium Unsaturated aldehydes, such as aldehydes; (meth) acrylonitrile, α-chloroacrylonitrile, dicyanethylene, allyl nitrile, and other unsaturated nitriles; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene, vinylbenzoic acid, vinylphenol, vinylsulfonic acid, 4-vinylbenzenesulfonic acid Unsaturated aromatic compounds such as vinyl benzyl methyl ether, vinyl benzyl glycidyl ether; unsaturated ketones such as methyl vinyl ketone; vinyl amine, allyl amine, N-vinyl pyrrolidone, Unsaturated amine compounds such as vinyl piperidine; vinyl alcohols such as allyl alcohol and crotyl alcohol; vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether, isobutyl vinyl ether, allyl shrink Vinyl ethers such as glycerin ether; Unsaturated fluorenimines such as maleimide, N-phenylmaleimide, N-cyclohexylmaleimide; indene such as indene, 1-methylindene Aliphatic conjugated dienes such as 1,3-butadiene, isoprene, chloroprene; polystyrene, poly (meth) acrylate, poly (meth) acrylate, polybutylene Siloxane and other macromonomers with a mono (meth) acrylfluorene group at the end of the polymer molecular chain; vinyl chloride, vinylidene chloride, divinyl succinate, diallyl phthalate, phosphoric acid Triallyl ester, triallyl isocyanurate, vinyl sulfide, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, vinyl monomer containing a hydroxyl group And polyisocyanate compounds, urethane compounds, vinyl monomers containing hydroxyl groups, and vinyl epoxy compounds of polyepoxides. The said ethylenically unsaturated compound (D) can be used individually or in mixture of 2 or more types.

作為上述乙烯性不飽和化合物,亦可使用市售品。作為該市售品,例如可列舉:Kayarad DPHA、DPEA-12、PEG400DA、THE-330、RP-1040、NPGDA、PET30、R-684(以上由日本化藥公司製造);ARONIX M-215、M-350(以上由東亞合成公司製造);NK-ESTER A-DPH、A-TMPT、A-DCP、A-HD-N、TMPT、DCP、NPG及HD-N(以上由新中村化學工業公司製造);SPC-1000、SPC-3000(以上由昭和電工公司製造);NK-OLIGO U-4HA、U-4H、U-6HA、U-15HA、U-108A、U-1084A、U-200AX、U-122A、U-340A、U-324A、UA-53H、UA-100、AH-600(以上由新中村化學工業公司製造)、UA-306H、AI-600、UA-101T、UA-101I、UA-306T、UA-306I(以上由共榮社化學公司製造)、Artresin UN-9200A、UN-3320HA、UN-3320HB、UN-3320HC、UN-3320HS、SH-380G、SH-500、SH-9832、UN-901T、UN-904、UN-905、UN-906、UN-906S、UN-907、UN-952、UN-953、UN-954、H-91、H-135(以上由根上工業公司製造)、Sartomer CN968、CN975、CN989、CN9001、CN9010、CN9025、CN9029、CN9165、CN2260(以上由沙多瑪公司製造)、EBECRYL8810(大賽璐公司製造)等。As the ethylenically unsaturated compound, a commercially available product can also be used. Examples of the commercially available products include: Kayarad DPHA, DPEA-12, PEG400DA, THE-330, RP-1040, NPGDA, PET30, and R-684 (the above are manufactured by Nippon Kayaku Co., Ltd.); ARONIX M-215, M -350 (above manufactured by Toa Kosei); NK-ESTER A-DPH, A-TMPT, A-DCP, A-HD-N, TMPT, DCP, NPG, and HD-N (above manufactured by Shin Nakamura Chemical Industry Co., Ltd. ); SPC-1000, SPC-3000 (above manufactured by Showa Denko Corporation); NK-OLIGO U-4HA, U-4H, U-6HA, U-15HA, U-108A, U-1084A, U-200AX, U -122A, U-340A, U-324A, UA-53H, UA-100, AH-600 (above manufactured by Shin Nakamura Chemical Industry Co., Ltd.), UA-306H, AI-600, UA-101T, UA-101I, UA -306T, UA-306I (above manufactured by Kyoeisha Chemical Co., Ltd.), Artresin UN-9200A, UN-3320HA, UN-3320HB, UN-3320HC, UN-3320HS, SH-380G, SH-500, SH-9832 UN-901T, UN-904, UN-905, UN-906, UN-906S, UN-907, UN-952, UN-953, UN-954, H-91, H-135 (The above are manufactured by Kone Industrial Corporation ), Sartomer CN968, CN975, CN989, CN9001, CN9010, CN9025, CN9029, CN9165, CN2260 (the above are manufactured by Sadobene Company), EBEC RYL8810 (manufactured by Daicel).

[化18] [Chemical 18]

[化19] [Chemical 19]

[化20] [Chemical 20]

[化21] [Chemical 21]

於本發明之聚合性組合物中,乙烯性不飽和化合物(D)之含量並無特別限定,相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,較佳為1~50質量份、更佳為1~30質量份、進而較佳為5~20質量份。於乙烯性不飽和化合物(D)之含量為上述範圍內之情形時,所獲得之硬化物之硬化性及遮光性優異,因此較佳。 例如於形成厚度為1~3 μm之硬化膜之情形時,乙烯性不飽和化合物(D)之含量並無特別限定,相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言,乙烯性不飽和化合物(D)較佳為1~50質量份、更佳為1~30質量份、進而較佳為5~20質量份。In the polymerizable composition of the present invention, the content of the ethylenically unsaturated compound (D) is not particularly limited, and it is relative to the polymerization initiator (A), the colorant (B), the alkaline developing compound (C), and The total amount of the ethylenically unsaturated compound (D) is preferably 1 to 50 parts by mass, more preferably 1 to 30 parts by mass, and still more preferably 5 to 20 parts by mass. When the content of the ethylenically unsaturated compound (D) is within the above range, the obtained hardened material is excellent in hardenability and light-shielding property, and therefore, it is preferable. For example, when a hardened film having a thickness of 1 to 3 μm is formed, the content of the ethylenically unsaturated compound (D) is not particularly limited, and it is relative to the polymerization initiator (A), colorant (B), and alkaline development. The 100% by mass of the total of the ethylenic compound (C) and the ethylenically unsaturated compound (D) is preferably 1 to 50 parts by mass, more preferably 1 to 30 parts by mass, and more preferably It is preferably 5 to 20 parts by mass.

於本發明之聚合性組合物中可進一步加入溶劑。該溶劑通常可視需要使用可溶解或分散上述各成分(聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)等)之溶劑。例如可列舉:甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮及2-庚酮等酮系溶劑;乙醚、二㗁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷及二丙二醇二甲醚等醚系溶劑;乙酸甲酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯、乙酸3-甲氧基丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯及TEXANOL等酯系溶劑;乙二醇單甲醚及乙二醇單乙醚等溶纖劑系溶劑;甲醇、乙醇、異或正丙醇、異或正丁醇及戊醇等醇系溶劑;乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、丙二醇-1-單甲醚(PGM)、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、乙酸3-甲氧基丁酯及丙酸乙氧基乙酯等醚酯系溶劑;苯、甲苯及二甲苯等BTX系溶劑;己烷、庚烷、辛烷及環己烷等脂肪族烴系溶劑;松節油、D-檸檬烯及蒎烯等萜烯系烴油;礦油精、Swasol#310(以上由科斯莫松山石油公司製造)及Solvesso#100(以上由Exxon化學公司製造)等石蠟系溶劑;四氯化碳、氯仿、三氯乙烯、二氯甲烷及1,2-二氯乙烷等鹵化脂肪族烴系溶劑;氯苯等鹵化芳香族烴系溶劑;卡必醇系溶劑、苯胺、三乙胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸及水等,該等溶劑可使用一種或作為兩種以上之混合溶劑而使用。A solvent may be further added to the polymerizable composition of the present invention. The solvent is usually a solvent that can dissolve or disperse the above components (polymerization initiator (A), colorant (B), basic developing compound (C), ethylenically unsaturated compound (D), etc.)) as necessary. Examples include: ketone solvents such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone; Ether solvents such as ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, and dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-acetate Ester solvents such as propyl ester, isopropyl acetate, n-butyl acetate, 3-methoxybutyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, and TEXANOL; ethylene glycol monomethyl ether and Cellulose solvents such as ethylene glycol monoethyl ether; alcohol solvents such as methanol, ethanol, iso-or-n-propanol, iso-n-butanol, and pentanol; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether Acetate, propylene glycol-1-monomethyl ether (PGM), propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, and Ether-based solvents such as ethoxyethyl propionate; BTX-based solvents such as benzene, toluene, and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, and cyclohexane; turpentine, D-limonene, and thallium Terpenes ; Paraffin solvents such as mineral spirits, Swasol # 310 (above manufactured by Cosmo Songshan Petroleum Company) and Solvesso # 100 (above manufactured by Exxon Chemical Company); carbon tetrachloride, chloroform, trichloroethylene, methylene chloride and Halogenated aliphatic hydrocarbon solvents such as 1,2-dichloroethane; Halogenated aromatic hydrocarbon solvents such as chlorobenzene; carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N- Dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfinium and water, etc. These solvents can be used alone or as a mixed solvent of two or more use.

該等中,酮系溶劑、酯系溶劑及醚酯系溶劑等,尤其是環己酮、乙酸3-甲氧基丁酯、琥珀酸二甲酯及PGMEA等由於在聚合性組合物中抗蝕劑與聚合起始劑之相容性良好而較佳。Among these, ketone solvents, ester solvents, ether ester solvents, etc., especially cyclohexanone, 3-methoxybutyl acetate, dimethyl succinate, and PGMEA, etc. The compatibility between the agent and the polymerization initiator is good and preferred.

若併用PGMEA、乙酸3-甲氧基丁酯、琥珀酸二甲酯,則獲得均勻之塗佈面,因此較佳,進而於上述溶劑之質量基準之比率(PGMEA:乙酸3-甲氧基丁酯:琥珀酸二甲酯)為15~25:2~5:1之情形時尤佳。If PGMEA, 3-methoxybutyl acetate, and dimethyl succinate are used together, it is preferable to obtain a uniform coating surface, and the ratio based on the mass basis of the above solvent (PGMEA: 3-methoxybutyl acetate Ester: dimethyl succinate) is particularly preferred when it is 15 to 25: 2 to 5: 1.

於本發明之聚合性組合物中,上述溶劑之含量並無特別限定,較佳為於聚合性組合物之總量100質量%中成為30~95質量%,更佳為50~95質量%。 於溶劑之含量為上述範圍之情形時,成為操作性(聚合性組合物之黏度或潤濕性)、乾燥時之不均之減低及液穩定性(並不伴隨著組合物中所含之成分之析出或沈澱)優異之聚合性組合物,於獲得硬化物時可適宜地控制硬化物之厚度,因此較佳。In the polymerizable composition of the present invention, the content of the solvent is not particularly limited, but it is preferably 30 to 95% by mass, and more preferably 50 to 95% by mass, based on 100% by mass of the total amount of the polymerizable composition. When the content of the solvent is in the above range, it becomes operability (viscosity or wettability of the polymerizable composition), reduction of unevenness during drying, and liquid stability (not accompanied by components contained in the composition It is preferable that the polymerizable composition having excellent precipitation or precipitation) is capable of appropriately controlling the thickness of the cured product when obtaining the cured product.

於本發明之聚合性組合物中,可視需要進而加入環氧化合物、鹼性顯影性賦予劑、分散劑、潛伏性添加劑、有機聚合物、無機化合物、偶合劑、鏈轉移劑、增感劑、界面活性劑及三聚氰胺化合物、對苯甲醚、對苯二酚、鄰苯二酚、第三丁基兒茶酚及啡噻等熱聚合抑制劑;可塑劑;接著促進劑;填充劑;消泡劑;調平劑;表面調整劑;抗氧化劑;紫外線吸收劑;分散助劑;抗凝聚劑;觸媒;效果促進劑;交聯劑;增黏劑等慣用之添加物。In the polymerizable composition of the present invention, an epoxy compound, an alkali developability imparting agent, a dispersant, a latent additive, an organic polymer, an inorganic compound, a coupling agent, a chain transfer agent, a sensitizer, Surfactants and thermal polymerization inhibitors such as melamine compounds, p-anisole, hydroquinone, catechol, tertiary butyl catechol, and phenanthrene; plasticizers; adhesion promoters; fillers; defoamers Agents; leveling agents; surface modifiers; antioxidants; ultraviolet absorbers; dispersion aids; anti-agglomerating agents; catalysts; effect promoters; cross-linking agents; tackifiers and other commonly used additives.

作為上述環氧化合物,例如可列舉:甲基縮水甘油醚、2-乙基己基縮水甘油醚、丁基縮水甘油醚、癸基縮水甘油醚、C12~13混合烷基縮水甘油醚、苯基-2-甲基縮水甘油醚、鯨蠟基縮水甘油醚、硬脂基縮水甘油醚、甲基丙烯酸縮水甘油酯、異丙基縮水甘油醚、烯丙基縮水甘油醚、乙基縮水甘油醚、2-甲基辛基縮水甘油醚、苯基縮水甘油醚、4-正丁基苯基縮水甘油醚、4-苯基苯酚縮水甘油醚、甲苯基縮水甘油醚、二溴甲苯基縮水甘油醚、癸基縮水甘油醚、甲氧基聚乙二醇單縮水甘油醚、乙氧基聚乙二醇單縮水甘油醚、丁氧基聚乙二醇單縮水甘油醚、苯氧基聚乙二醇單縮水甘油醚、二溴苯基縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,5-戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、1,1,2,2-四(縮水甘油氧基苯基)乙烷及季戊四醇四縮水甘油醚等縮水甘油醚化物;乙酸縮水甘油酯、硬脂酸縮水甘油酯等縮水甘油酯類;2-(3,4-環氧環己基-5,5-螺-3,4-環氧)環己烷-甲基二㗁烷、亞甲基雙(3,4-環氧環己烷)、丙烷-2,2-二基-雙(3,4-環氧環己烷)、2,2-雙(3,4-環氧環己基)丙烷、伸乙基雙(3,4-環氧環己烷羧酸酯)、己二酸雙(3,4-環氧環己基甲酯)、3,4-環氧環己烷羧酸3,4-環氧環己基甲酯、3,4-環氧-1-甲基己烷羧酸3,4-環氧-1-甲基己酯、6-甲基-3,4-環氧環己烷羧酸6-甲基-3,4-環氧環己基甲酯、3,4-環氧-3-甲基環己烷羧酸3,4-環氧-3-甲基環己基甲酯、3,4-環氧-5-甲基環己烷羧酸3,4-環氧-5-甲基環己基甲酯、1-環氧乙基-3,4-環氧環己烷、1,2-環氧-2-環氧乙基環己烷、二環氧二環戊二烯、3,4-環氧-6-甲基環己基羧酸酯、α-氧化蒎烯、環氧苯乙烷、環氧環己烷及環氧環戊烷等環氧環烷基型化合物及N-縮水甘油基鄰苯二甲醯亞胺等。Examples of the epoxy compound include methyl glycidyl ether, 2-ethylhexyl glycidyl ether, butyl glycidyl ether, decyl glycidyl ether, C12 to 13 mixed alkyl glycidyl ether, and phenyl- 2-methyl glycidyl ether, cetyl glycidyl ether, stearyl glycidyl ether, glycidyl methacrylate, isopropyl glycidyl ether, allyl glycidyl ether, ethyl glycidyl ether, 2 -Methyl octyl glycidyl ether, phenyl glycidyl ether, 4-n-butylphenyl glycidyl ether, 4-phenylphenol glycidyl ether, tolyl glycidyl ether, dibromotolyl glycidyl ether, decyl Glycidyl ether, methoxy polyethylene glycol monoglycidyl ether, ethoxy polyethylene glycol monoglycidyl ether, butoxy polyethylene glycol monoglycidyl ether, phenoxy polyethylene glycol monoglycidyl ether Glyceryl ether, Dibromophenyl glycidyl ether, 1,4-butanediol diglycidyl ether, 1,5-pentanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl Glycidyl ether, 1,1,2,2-tetrakis (glycidyloxyphenyl) ethane and pentaerythritol tetraglycidyl Ethers such as glycidyl ethers; glycidyl esters such as glycidyl acetate and glycidyl stearate; 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) rings Hexane-methyldioxane, methylenebis (3,4-epoxycyclohexane), propane-2,2-diyl-bis (3,4-epoxycyclohexane), 2,2 -Bis (3,4-epoxycyclohexyl) propane, ethylidene bis (3,4-epoxycyclohexanecarboxylate), adipic acid bis (3,4-epoxycyclohexylmethyl ester), 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl ester, 3,4-epoxy-1-methylhexanecarboxylic acid 3,4-epoxy-1-methylhexyl ester 6-methyl-3,4-epoxycyclohexanecarboxylic acid 6-methyl-3,4-epoxycyclohexylmethyl ester 3,4-epoxy-3-methylcyclohexanecarboxylic acid 3 1,4-epoxy-3-methylcyclohexylmethyl ester, 3,4-epoxy-5-methylcyclohexanecarboxylic acid Oxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, diepoxydicyclopentadiene, 3,4-epoxy-6-formaldehyde Cyclohexyl carboxylate, α-pinene oxide, phenylene oxide, epoxy cyclohexane, and epoxy cyclopentane, and other epoxy cycloalkyl compounds and N-glycidylphthalimide Amine, etc.

作為上述環氧化合物,亦可使用環氧化聚烯烴。所謂環氧化聚烯烴係藉由含有環氧基之單體對聚烯烴進行改性,導入環氧基之聚烯烴。可藉由利用共聚法或接枝法之任意方法使乙烯或碳數為3~20之α-烯烴、含有環氧基之單體、及視需要之其他單體共聚而製造。乙烯或碳數為3~20之α-烯烴、含有環氧基之單體及其他單體可分別單獨聚合,也可以與其他單體複數種聚合。又,亦可藉由過乙酸法對末端具有羥基之非共軛之聚丁二烯之雙鍵進行環氧化而獲得,亦可使用於分子內具有羥基者。又,亦可藉由異氰酸酯對羥基進行胺基甲酸酯化,於此處使含有一級羥基之環氧化合物反應而導入環氧基。As the epoxy compound, an epoxidized polyolefin can also be used. The so-called epoxidized polyolefin is a polyolefin modified by an epoxy-containing monomer, and an epoxy-based polyolefin is introduced. It can be produced by copolymerizing ethylene or an α-olefin having 3 to 20 carbon atoms, a monomer containing an epoxy group, and other monomers as necessary, by any method of a copolymerization method or a grafting method. Ethylene or an α-olefin having 3 to 20 carbon atoms, an epoxy-group-containing monomer, and other monomers may be polymerized individually or in combination with other monomers. In addition, it can also be obtained by epoxidizing the double bond of a non-conjugated polybutadiene having a hydroxyl group at its terminal by the peracetic acid method, and it can also be used in a molecule having a hydroxyl group. In addition, the hydroxyl group may be urethanized by isocyanate, and an epoxy compound containing a primary hydroxyl group may be reacted to introduce an epoxy group.

作為上述乙烯或碳數為3~20之α-烯烴,可列舉:乙烯、丙烯、丁烯、異丁烯、1,3-丁二烯、1,4-丁二烯、1,3-戊二烯、2,3-二甲基-1,3-丁二烯、戊二烯、3-丁基-1,3-辛二烯及異戊二烯等。Examples of the ethylene or α-olefin having 3 to 20 carbon atoms include ethylene, propylene, butene, isobutylene, 1,3-butadiene, 1,4-butadiene, and 1,3-pentadiene. , 2,3-dimethyl-1,3-butadiene, pentadiene, 3-butyl-1,3-octadiene, isoprene, etc.

作為上述含有環氧基之單體,例如可列舉:α,β-不飽和酸之縮水甘油酯、乙烯基苄基縮水甘油醚及烯丙基縮水甘油醚等。作為α,β-不飽和酸之縮水甘油酯,具體而言可列舉:丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯及乙基丙烯酸縮水甘油酯等,尤佳為甲基丙烯酸縮水甘油酯。Examples of the epoxy-group-containing monomer include glycidyl esters of α, β-unsaturated acids, vinyl benzyl glycidyl ether, allyl glycidyl ether, and the like. Specific examples of the glycidyl ester of an α, β-unsaturated acid include glycidyl acrylate, glycidyl methacrylate, and glycidyl ethacrylate. Particularly preferred is glycidyl methacrylate.

作為上述環氧化合物,亦可使用市售品。作為適宜之市售品,例如可列舉:Epolight 40E、1500NP、1600、80MF、4000及3002(以上由共榮社化學公司製造);Adeka Glycilol ED-503、ED-503D、ED-503G、ED-523T、ED-513、ED-501、ED-502、ED-509、ED-518、ED-529、Adeka Resin EP-4000、EP-4005、EP-4080及EP-4085(以上由ADEKA公司製造);DENACOL EX-201、EX-203、EX-211、EX-212、EX-221、EX-251、EX-252、EX-711、EX-721、DENACOL EX-111、EX-121、EX-141、EX-142、EX-145、EX-146、EX-147、EX-171、EX-192及EX-731(以上由長瀨化成公司製造);EHPE-3150、Celloxide 2021P、2081、2000及3000(以上由大賽璐公司製造);EPIOL M、EH、L-41、SK、SB、TB及OH(以上由日油公司製造);Epolight M-1230及100MF(以上由共榮社化學公司製造);ARONE OXETANE OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211及OXT-212(以上由東亞合成公司製造);Etanacol OXBP及OXTP(以上由宇部興產公司製造);2-羥基乙基乙烯醚、二乙二醇單乙烯醚及4-羥基丁基乙烯醚(以上由丸善石油化學公司製造);DENACOL EX-121、EX-141、EX-142、EX-145、EX-146、EX-147、EX-201、EX-203、EX-711、EX-721、oncoat EX-1020、EX-1030、EX-1040、EX-1050、EX-1051、EX-1010、EX-1011及1012(以上由長瀨化成公司製造);OGSOL PG-100、EG-200、EG-210及EG-250(以上由Osaka Gas Chemicals公司製造);HP4032、HP4032D及HP4700(以上由DIC公司製造);ESN-475V(東都化成公司製造);Marproof G-0105SA及G-0130SP(以上由日油公司製造);EPICLON N-665及HP-7200(以上由DIC公司製造);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H及NC-7000L(以上由日本化藥公司製造)等。As the epoxy compound, a commercially available product may be used. Examples of suitable commercially available products include: Epolight 40E, 1500NP, 1600, 80MF, 4000, and 3002 (the above are manufactured by Kyoeisha Chemical Co., Ltd.); Adeka Glycilol ED-503, ED-503D, ED-503G, ED- 523T, ED-513, ED-501, ED-502, ED-509, ED-518, ED-529, Adeka Resin EP-4000, EP-4005, EP-4080, and EP-4085 (the above are manufactured by ADEKA) ; DENACOL EX-201, EX-203, EX-211, EX-212, EX-221, EX-251, EX-252, EX-711, EX-721, DENACOL EX-111, EX-121, EX-141 , EX-142, EX-145, EX-146, EX-147, EX-171, EX-192, and EX-731 (above manufactured by Nagase Kasei Corporation); EHPE-3150, Celloxide 2021P, 2081, 2000, and 3000 (Above manufactured by Daicel); EPIOL M, EH, L-41, SK, SB, TB, and OH (above manufactured by Nippon Oil Corporation); Epolight M-1230 and 100MF (above manufactured by Kyoeisha Chemical Co., Ltd.) ; ARONE OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211 and OXT-212 (above manufactured by Toa Kosei); Etanacol OXBP and OXTP (above manufactured by Ube Kosan) ; 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether and 4-hydroxyl Butyl vinyl ether (manufactured by Maruzen Petrochemical Corporation); DENACOL EX-121, EX-141, EX-142, EX-145, EX-146, EX-147, EX-201, EX-203, EX-711 , EX-721, oncoat EX-1020, EX-1030, EX-1040, EX-1050, EX-1051, EX-1010, EX-1011 and 1012 (above manufactured by Nagase Kasei Corporation); OGSOL PG-100, EG-200, EG-210 and EG-250 (above manufactured by Osaka Gas Chemicals); HP4032, HP4032D and HP4700 (above manufactured by DIC); ESN-475V (manufactured by Toto Kasei Corporation); Marproof G-0105SA and G -0130SP (above manufactured by Nippon Oil); EPICLON N-665 and HP-7200 (above manufactured by DIC); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000 , EPPN-501H, EPPN-501HY, EPPN-502H and NC-7000L (the above are manufactured by Nippon Kayaku Co., Ltd.) and so on.

所謂上述鹼性顯影性賦予劑係並不具有自由基聚合性之賦予鹼性顯影性之化合物,作為此種化合物,若為由於具有酸值而可溶於鹼性水溶液中之化合物,則並無特別限定,作為代表性化合物,可列舉鹼可溶性酚醛清漆樹脂(以下簡稱為「酚醛清漆樹脂」)。酚醛清漆樹脂可藉由於酸觸媒之存在下使酚類與醛類縮聚而獲得。The above-mentioned alkaline developability imparting agent is a compound that does not have radical polymerizability and imparts alkaline developability. As such a compound, if it is a compound that is soluble in an alkaline aqueous solution because it has an acid value, it does not have In particular, as a representative compound, an alkali-soluble novolak resin (hereinafter referred to simply as "novolak resin") is mentioned. Novolac resins can be obtained by polycondensing phenols and aldehydes in the presence of an acid catalyst.

作為上述酚類,例如使用苯酚、鄰甲酚、間甲酚、對甲酚、鄰乙基苯酚、間乙基苯酚、對乙基苯酚、鄰丁基苯酚、間丁基苯酚、對丁基苯酚、2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚、2,3,5-三甲基苯酚、對苯基苯酚、氫醌、兒茶酚、間苯二酚、2-甲基間苯二酚、鄰苯三酚、α-萘酚、雙酚A、二羥基苯甲酸酯及沒食子酸酯等,該等酚類中較佳為苯酚、鄰甲酚、間甲酚、對甲酚、2,5-二甲苯酚、3,5-二甲苯酚、2,3,5-三甲基苯酚、間苯二酚、2-甲基間苯二酚及雙酚A等。該等酚類可單獨使用或者混合使用兩種以上。Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, and p-butylphenol , 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethyl Phenol, p-phenylphenol, hydroquinone, catechol, resorcinol, 2-methylresorcinol, catechol, α-naphthol, bisphenol A, dihydroxybenzoate, and phenol Gallic acid esters, etc. Among these phenols, phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, 2,3,5- Trimethylphenol, resorcinol, 2-methylresorcinol and bisphenol A. These phenols can be used alone or in combination of two or more.

作為上述醛類,例如可使用甲醛、多聚甲醛、乙醛、丙醛、苯甲醛、苯基乙醛、α-苯基丙醛、β-苯基丙醛、鄰羥基苯甲醛、間羥基苯甲醛、對羥基苯甲醛、鄰氯苯甲醛、間氯苯甲醛、對氯苯甲醛、鄰硝基苯甲醛、間硝基苯甲醛、對硝基苯甲醛、鄰甲基苯甲醛、間甲基苯甲醛、對甲基苯甲醛、對乙基苯甲醛及對正丁基苯甲醛等,該等化合物中較佳為甲醛、乙醛及苯甲醛等。該等醛類可單獨使用或者混合使用兩種以上。醛類以每1莫耳酚類中較佳為0.7~3莫耳、尤佳為0.7~2莫耳之比例使用。Examples of the aldehydes include formaldehyde, paraformaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropanal, β-phenylpropanal, o-hydroxybenzaldehyde, and m-hydroxybenzene Formaldehyde, p-hydroxybenzaldehyde, o-chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methylbenzaldehyde, m-methylbenzene Formaldehyde, p-methylbenzaldehyde, p-ethylbenzaldehyde, and p-n-butylbenzaldehyde. Among these compounds, formaldehyde, acetaldehyde, and benzaldehyde are preferred. These aldehydes can be used alone or in combination of two or more. Aldehydes are preferably used at a ratio of 0.7 to 3 moles, particularly preferably 0.7 to 2 moles per mole of mols.

作為上述酸觸媒,例如可使用鹽酸、硝酸、硫酸等無機酸,或甲酸、草酸、乙酸等有機酸。該等酸觸媒之使用量較佳為於每1莫耳酚類中為1×10-4 ~5×10-1 莫耳。於縮合反應中,通常使用水作為反應介質,但於縮合反應中所使用之酚類並不溶解於醛類之水溶液中,自反應初期便成為非勻相系統之情形時,亦可使用親水性溶劑作為反應介質。作為該等親水性溶劑,例如可列舉:甲醇、乙醇、丙醇及丁醇等醇類,或四氫呋喃及二㗁烷等環狀醚類。該等反應介質之使用量通常是每100質量份反應原料中為20~1000質量份。縮合反應之反應溫度可根據反應原料之反應性而適宜調整,通常為10~200℃、較佳為70~150℃。於縮合反應結束後,為了將系統內存在之未反應原料、酸觸媒及反應介質除去,一般使內溫上升至130~230℃,於減壓下蒸餾去除揮發分,其次將熔融之酚醛清漆樹脂流延於鋼製帶等之上而進行回收。 又,亦可藉由如下方式而回收:於縮合反應結束後,於前述親水性溶劑中溶解反應混合物,添加於水、正己烷及正庚烷等沈澱劑中,由此使酚醛清漆樹脂析出,分離析出物而進行加熱乾燥。Examples of the acid catalyst include inorganic acids such as hydrochloric acid, nitric acid, and sulfuric acid, and organic acids such as formic acid, oxalic acid, and acetic acid. The usage amount of these acid catalysts is preferably 1 × 10 -4 to 5 × 10 -1 mole per 1 mole of phenols. In the condensation reaction, water is usually used as the reaction medium, but the phenols used in the condensation reaction are not dissolved in the aqueous solution of aldehydes, and when the system becomes a heterogeneous system from the beginning of the reaction, hydrophilicity can also be used. The solvent serves as the reaction medium. Examples of such hydrophilic solvents include alcohols such as methanol, ethanol, propanol, and butanol, and cyclic ethers such as tetrahydrofuran and dioxane. The amount of these reaction media used is usually 20 to 1000 parts by mass per 100 parts by mass of the reaction raw material. The reaction temperature of the condensation reaction can be appropriately adjusted according to the reactivity of the reaction raw materials, and is usually 10 to 200 ° C, preferably 70 to 150 ° C. After the condensation reaction is completed, in order to remove unreacted raw materials, acid catalysts and reaction media present in the system, the internal temperature is generally raised to 130-230 ° C, the volatiles are distilled off under reduced pressure, and the molten novolac is then removed. The resin is cast on a steel belt or the like and recovered. In addition, it can also be recovered by dissolving the reaction mixture in the above-mentioned hydrophilic solvent after the completion of the condensation reaction and adding it to a precipitant such as water, n-hexane, and n-heptane to thereby precipitate the novolac resin, The precipitate was separated and dried by heating.

作為上述酚醛清漆樹脂以外之例,可列舉:聚羥基苯乙烯或其衍生物、苯乙烯-馬來酸酐共聚物及聚羥基苯甲酸乙烯酯等。Examples other than the above-mentioned novolak resin include polyhydroxystyrene or a derivative thereof, a styrene-maleic anhydride copolymer, and a polyhydroxybenzoate.

作為上述分散劑,若為可使著色劑(B)分散、穩定化者,則可為任意者,可使用市售之分散劑、例如BYK-Chemie公司製造之BYK系列等,可適宜使用包含具有鹼性官能基之聚酯、聚醚、聚胺基甲酸酯之高分子分散劑,具有氮原子作為鹼性官能基,具有氮原子之官能基為胺及/或其四級鹽,胺值為1~100 mgKOH/g者。The dispersant may be any one that can disperse and stabilize the colorant (B), and a commercially available dispersant such as BYK series manufactured by BYK-Chemie can be used. Polymeric dispersant of basic functional polyester, polyether, polyurethane, with nitrogen atom as basic functional group, functional group with nitrogen atom is amine and / or its quaternary salt, amine value It is 1 ~ 100 mgKOH / g.

上述潛伏性添加劑係於常溫、光曝光步驟及預烘烤步驟中為惰性,藉由於100~250℃下進行加熱,或於酸/鹼觸媒之存在下、80~200℃下進行加熱使保護基脫離而活化者。作為藉由進行活化而獲得之效果,可列舉抗氧化、紫外線吸收、防污性、再塗佈性及密接性等。 作為上述潛伏性添加劑,可較佳地使用WO2014/021023號說明書中所記載者。The above-mentioned latent additive is inert at normal temperature, light exposure step and pre-baking step, and is protected by heating at 100 to 250 ° C or heating at 80 to 200 ° C in the presence of an acid / base catalyst. Base detached and activated. Examples of the effects obtained by activation include oxidation resistance, ultraviolet absorption, antifouling properties, recoatability, and adhesiveness. As the latent additive, those described in WO2014 / 021023 can be preferably used.

作為上述潛伏性添加劑,可使用市售品,例如可列舉ADEKA ARKLS GPA-5001等。As the latent additive, a commercially available product can be used, and examples thereof include ADEKA ARKLS GPA-5001 and the like.

作為上述有機聚合物,例如可列舉:聚苯乙烯、聚甲基丙烯酸甲酯、甲基丙烯酸甲酯-丙烯酸乙酯共聚物、聚(甲基)丙烯酸、苯乙烯-(甲基)丙烯酸共聚物、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、乙烯-氯乙烯共聚物、乙烯-乙烯基共聚物、聚氯乙烯樹脂、ABS樹脂、尼龍6、尼龍66、尼龍12、聚胺酯樹脂、聚碳酸酯、聚乙烯醇縮丁醛、纖維素酯、聚丙烯醯胺、飽和聚酯、酚樹脂、苯氧基樹脂、聚醯胺醯亞胺樹脂、聚醯胺酸樹脂、環氧樹脂等,該等中較佳為聚苯乙烯、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、環氧樹脂。 亦可藉由與上述鹼性顯影性化合物(C)一同使用上述有機聚合物而改善硬化物之特性。 於使用有機聚合物之情形時,其使用量相對於上述鹼性顯影性化合物(C)100質量份而言較佳為10~500質量份。Examples of the organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymer, poly (meth) acrylic acid, and styrene- (meth) acrylic acid copolymer. , (Meth) acrylic acid-methyl methacrylate copolymer, ethylene-vinyl chloride copolymer, ethylene-vinyl copolymer, polyvinyl chloride resin, ABS resin, nylon 6, nylon 66, nylon 12, polyurethane resin, polymer Carbonate, polyvinyl butyral, cellulose ester, polypropylene ammonium, saturated polyester, phenol resin, phenoxy resin, polyamidamine imine resin, polyamino acid resin, epoxy resin, etc. Among these, polystyrene, (meth) acrylic acid-methyl methacrylate copolymer, and epoxy resin are preferable. The properties of the cured product can also be improved by using the organic polymer together with the basic developable compound (C). When using an organic polymer, the usage-amount is 10-500 mass parts with respect to 100 mass parts of said alkaline developable compounds (C).

作為上述無機化合物,例如可列舉:氧化鎳、氧化鐵、氧化銥、氧化鈦、氧化鋅、氧化鎂、氧化鈣、氧化鉀、氧化矽及氧化鋁等金屬氧化物;層狀黏土礦物、米洛麗藍、碳酸鈣、碳酸鎂、鈷系、錳系、玻璃粉末、雲母、滑石、高嶺土、亞鐵氰化物、各種金屬硫酸鹽、硫化物、硒化物、矽酸鋁、矽酸鈣、氫氧化鋁、鉑、金、銀及銅等,該等中較佳為氧化鈦、氧化矽、層狀黏土礦物、及銀等。Examples of the inorganic compound include metal oxides such as nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, silicon oxide, and aluminum oxide; layered clay minerals, and Milo Blue, calcium carbonate, magnesium carbonate, cobalt-based, manganese-based, glass powder, mica, talc, kaolin, ferrocyanide, various metal sulfates, sulfides, selenides, aluminum silicates, calcium silicates, hydroxides Aluminum, platinum, gold, silver, copper, and the like are preferred, among which titanium oxide, silicon oxide, layered clay minerals, and silver are preferred.

藉由於本發明之聚合性組合物中含有無機化合物,可用作感光性膏組合物。該感光性膏組合物用以形成電漿顯示面板之間隔壁圖案、介電體圖案、電極圖案及黑色矩陣圖案等焙燒物圖案。 又,該等無機化合物例如亦可作為填充劑、抗反射劑、導電劑、穩定劑、阻燃劑、機械強度提高劑、特殊波長吸收劑及撥油墨劑等。Since the polymerizable composition of the present invention contains an inorganic compound, it can be used as a photosensitive paste composition. The photosensitive paste composition is used to form baked product patterns such as a partition wall pattern, a dielectric pattern, an electrode pattern, and a black matrix pattern of a plasma display panel. These inorganic compounds can also be used as fillers, antireflection agents, conductive agents, stabilizers, flame retardants, mechanical strength improvers, special wavelength absorbers, ink repellents, and the like.

於本發明之聚合性組合物中添加無機化合物之情形時,無機化合物之含量相對於上述鹼性顯影性化合物(C)100質量份而言較佳為0.1~50質量份、更佳為0.5~20質量份,該等無機化合物可使用一種或兩種以上。When an inorganic compound is added to the polymerizable composition of the present invention, the content of the inorganic compound is preferably from 0.1 to 50 parts by mass, more preferably from 0.5 to 100 parts by mass of the basic developing compound (C). 20 parts by mass of these inorganic compounds may be used alone or in combination of two or more.

作為上述偶合劑,例如可使用二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等烷基官能性烷氧基矽烷,乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等烯基官能性烷氧基矽烷,3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷等(甲基)丙烯酸酯官能性烷氧基矽烷,γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-(3,4-環氧環己基)丙基三甲氧基矽烷等環氧官能性烷氧基矽烷,N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等胺基官能性烷氧基矽烷,γ-巰基丙基三甲氧基矽烷等巰基官能性烷氧基矽烷,3-異氰酸酯基丙基三乙氧基矽烷等異氰酸酯基官能性烷氧基矽烷,3-脲基丙基三烷氧基矽烷等脲基官能性烷氧基矽烷,三(三甲氧基矽烷基丙基)異氰尿酸酯等異氰尿酸酯基官能性烷氧基矽烷,四異丙醇鈦、四正丁醇鈦等烷醇鈦類,二辛氧基鈦雙(辛二醇)、二異丙氧基鈦雙(乙醯乙酸乙酯)等鈦螯合物類,四乙醯丙酮酸鋯、三丁氧基單乙醯基丙酮酸鋯等鋯螯合物類,三丁氧基單硬脂酸鋯等鋯醯化物類,甲基三異氰酸酯基矽烷等異氰酸酯基矽烷類等。 藉由添加偶合劑,可使硬化物與基材間(尤其是玻璃)之密接性提高,因此較佳。Examples of the coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, and methyltrimethoxy Alkyl functional alkoxysilanes such as methylsilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltrimethoxysilane Alkenyl functional alkoxysilanes such as ethoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethyl (Meth) acrylate functional alkoxysilanes such as oxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3 Epoxy-functional alkoxysilanes such as 1,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (3,4-epoxycyclohexyl) propyltrimethoxysilane, N -β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane and other amine groups Mercapto-functional alkoxysilanes such as functional alkoxysilane, γ-mercaptopropyltrimethoxysilane, isocyanate-functional alkoxysilanes such as 3-isocyanatepropyltriethoxysilane, 3-ureido Urea-based alkoxysilanes such as propyltrialkoxysilane, isocyanurate-functional alkoxysilanes such as tris (trimethoxysilylpropyl) isocyanurate, tetraisopropanol Titanium alkoxides such as titanium and titanium tetra-n-butoxide, titanium octyl bis (octanediol), titanium diisopropoxy bis (ethyl ethyl acetate), and tetraethylacetone Zirconium chelates such as zirconium acid, zirconium tributoxymonoethylfluorenylpyruvate, zirconium halides such as zirconium tributoxymonostearate, isocyanate silanes such as methyltriisocyanate silane and the like. The addition of a coupling agent is preferred because the adhesion between the cured product and the substrate (especially glass) can be improved.

作為上述偶合劑,可使用市售品,例如可列舉:KA-1003、KBM-1003、KBE-1003、KBM-303、KBM-403、KBE-402、KBE-403、KBM-1403、KBM-502、KBM-503、KBE-502、KBE-503、KBM-5103、KBM-602、KBM-603、KBE-603,KBM-903,KBE-903,KBE-9103,KBM-573、KBM-575、KBM-6123、KBE-585、KBM-703、KBM-802、KBM-803、KBE-846、KBE-9007、KBM-04、KBE-04、KBM-13、KBE-13、KBE-22、KBE-103、HMDS-3、KBM-3063、KBM-3103C、KPN-3504及KF-99(以上由信越矽酮公司製造)等。As the coupling agent, commercially available products can be used, and examples thereof include KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, and KBM-502. , KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-9103, KBM-573, KBM-575, KBM -6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007, KBM-04, KBE-04, KBM-13, KBE-13, KBE-22, KBE-103 , HMDS-3, KBM-3063, KBM-3103C, KPN-3504, and KF-99 (the above are manufactured by Shin-Etsu Silicone).

作為上述鏈轉移劑及增感劑,一般使用含有硫原子之化合物。例如硫代乙醇酸、硫代蘋果酸、硫代水楊酸、2-巰基丙酸、3-巰基丙酸、3-巰基丁酸、N-(2-巰基丙醯基)甘胺酸、2-巰基菸鹼酸、3-[N-(2-巰基乙基)胺甲醯基]丙酸、3-[N-(2-巰基乙基)胺基]丙酸、N-(3-巰基丙醯基)丙胺酸、2-巰基乙磺酸、3-巰基丙磺酸、4-巰基丁磺酸、十二烷基(4-甲硫基)苯基醚、2-巰基乙醇、3-巰基-1,2-丙二醇、1-巰基-2-丙醇、3-巰基-2-丁醇、巰基苯酚、2-巰基乙胺、2-巰基咪唑、2-巰基苯并咪唑、2-巰基-3-吡啶醇、2-巰基苯并噻唑、巰基乙酸、三羥甲基丙烷三(3-巰基丙酸酯)及季戊四醇四(3-巰基丙酸酯)等巰基化合物;對該巰基化合物進行氧化而獲得之二硫醚化合物、碘乙酸、碘丙酸、2-碘乙醇、2-碘乙磺酸及3-碘丙磺酸等碘烷基化合物;三羥甲基丙烷三(3-巰基異丁酸酯)、丁二醇雙(3-巰基異丁酸酯)、己二硫醇、癸二硫醇、1,4-二甲基巰基苯、丁二醇雙巰基丙酸酯、丁二醇雙巰基乙酸酯、乙二醇雙巰基乙酸酯、三羥甲基丙烷三巰基乙酸酯、丁二醇雙巰基丙酸酯、三羥甲基丙烷三巰基丙酸酯、三羥甲基丙烷三巰基乙酸酯、季戊四醇四巰基丙酸酯、季戊四醇四巰基乙酸酯、三巰基丙酸三羥基乙酯、下述化合物No.C1、昭和電工公司製造之Karenz PE-1及NR1等。As the chain transfer agent and sensitizer, a compound containing a sulfur atom is generally used. For example, thioglycolic acid, thiomalic acid, thiosalicylic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, N- (2-mercaptopropionyl) glycine, 2 -Mercaptonicotinic acid, 3- [N- (2-mercaptoethyl) aminomethane] propionic acid, 3- [N- (2-mercaptoethyl) amino] propionic acid, N- (3-mercapto (Propanyl) alanine, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, 4-mercaptobutanesulfonic acid, dodecyl (4-methylthio) phenyl ether, 2-mercaptoethanol, 3-mercaptoethanol Mercapto-1,2-propanediol, 1-mercapto-2-propanol, 3-mercapto-2-butanol, mercaptophenol, 2-mercaptoethylamine, 2-mercaptoimidazole, 2-mercaptobenzimidazole, 2-mercapto Thiol compounds such as 3-pyridyl alcohol, 2-mercaptobenzothiazole, thioglycolic acid, trimethylolpropane tris (3-mercaptopropionate), and pentaerythritol tetrakis (3-mercaptopropionate); Disulfide compounds obtained by oxidation, iodoacetic acid, iodopropionic acid, 2-iodoethanol, 2-iodoethanesulfonic acid and 3-iodopropanesulfonic acid, iodoalkyl compounds; trimethylolpropane tri (3-mercapto Isobutyrate), butanediol bis (3-mercaptoisobutyrate), hexanedithiol, sebacylthiol, 1,4-dimethylmercaptobenzene, butanediol bismercaptan Propionate, Butanediol Dimercaptoacetate, Ethylene Glycol Dimercaptoacetate, Trimethylolpropane Trimercaptoacetate, Butanediol Dimercaptopropionate, Trimethylolpropane Trimercaptopropane Acid ester, trimethylolpropane trimercaptoacetate, pentaerythritol tetramercaptopropionate, pentaerythritol tetramercaptoacetate, trimercaptopropane trihydroxyethyl ester, the following compound No. C1, Karenz manufactured by Showa Denko Corporation PE-1 and NR1.

[化22] [Chemical 22]

藉由添加上述鏈轉移劑及增感劑而獲得之硬化物之圖案變得高精細,因此較佳。The pattern of the hardened | cured material obtained by adding the said chain transfer agent and a sensitizer becomes high definition, Therefore, it is preferable.

作為上述界面活性劑,可使用全氟烷基磷酸酯、全氟烷基碳酸鹽等氟界面活性劑,高級脂肪酸鹼金屬鹽、烷基磺酸鹽、烷基硫酸鹽等陰離子系界面活性劑,高級胺氫鹵酸鹽、四級銨鹽等陽離子系界面活性劑,聚乙二醇烷基醚、聚乙二醇脂肪酸酯、山梨醇酐脂肪酸酯、脂肪酸單甘油酯等非離子界面活性劑,兩性界面活性劑及矽酮系界面活性劑等界面活性劑,該等亦可組合使用。As the surfactant, a fluorine surfactant such as a perfluoroalkyl phosphate, a perfluoroalkyl carbonate, or an anionic surfactant such as an alkali metal salt of a higher fatty acid, an alkyl sulfonate, or an alkyl sulfate can be used. , Cationic surfactants such as higher amine hydrohalates, quaternary ammonium salts, non-ionic interfaces such as polyethylene glycol alkyl ethers, polyethylene glycol fatty acid esters, sorbitan fatty acid esters, and fatty acid monoglycerides Surfactants such as active agents, amphoteric surfactants and silicone-based surfactants can also be used in combination.

作為上述三聚氰胺化合物,可列舉:(聚)羥甲基三聚氰胺、(聚)羥甲基甘脲、(聚)羥甲基苯并胍胺及(聚)羥甲基脲等氮化合物中之活性羥甲基(CH2 OH基)之全部或一部分(至少兩個)烷基醚化而成之化合物。此處,作為構成烷基醚之烷基,可列舉甲基、乙基及丁基,可相互相同亦可不同。又,未烷基醚化之羥甲基可於一分子內自縮合,亦可於兩分子間縮合,其結果形成低聚物成分。具體而言,可使用六甲氧基甲基三聚氰胺、六丁氧基甲基三聚氰胺、四甲氧基甲基甘脲及四丁氧基甲基甘脲等。該等中較佳為六甲氧基甲基三聚氰胺及六丁氧基甲基三聚氰胺等進行了烷基醚化之三聚氰胺。Examples of the melamine compound include active hydroxyl groups in nitrogen compounds such as (poly) methylol melamine, (poly) methylol glycoluril, (poly) methylol benzoguanamine, and (poly) methylol urea. A compound in which all or a part (at least two) of methyl groups (CH 2 OH groups) are alkylated. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group, and a butyl group, which may be the same as or different from each other. In addition, the hydroxymethyl group which is not alkyl etherified may be self-condensed in one molecule, or may be condensed between two molecules, and as a result, an oligomer component is formed. Specifically, hexamethoxymethyl melamine, hexabutoxymethyl melamine, tetramethoxymethyl glycoluril, tetrabutoxymethyl glycoluril, and the like can be used. Among these, melamine having alkyl etherification such as hexamethoxymethylmelamine and hexabutoxymethylmelamine is preferred.

於本發明之聚合性組合物中,聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)、乙烯性不飽和化合物(D)、溶劑及無機化合物以外之任意成分之含量可根據其使用目的而適宜選擇,只要不損及本發明之效果,則並無特別限制,較佳為相對於聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)之合計100質量份而言合計為20質量份以下。In the polymerizable composition of the present invention, an optional component other than a polymerization initiator (A), a colorant (B), an alkaline developing compound (C), an ethylenically unsaturated compound (D), a solvent, and an inorganic compound The content can be appropriately selected according to the purpose of use, and is not particularly limited as long as the effect of the present invention is not impaired. It is preferably based on the polymerization initiator (A), the colorant (B), and the alkaline developing compound. The total of 100 parts by mass of the total of (C) and the ethylenically unsaturated compound (D) is 20 parts by mass or less.

本發明之BM用感光性組合物係含有聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)作為必須成分,具有感光性及鹼性顯影性,尤其適合形成BM之組合物。The photosensitive composition for BM of the present invention contains a polymerization initiator (A), a colorant (B), an alkaline developing compound (C), and an ethylenically unsaturated compound (D) as essential components. Alkali developability, especially suitable for BM-forming compositions.

本發明之BCS用感光性組合物係含有聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及乙烯性不飽和化合物(D)作為必須成分,具有感光性及鹼性顯影性,尤其適合形成BCS之組合物。The photosensitive composition for BCS of the present invention contains a polymerization initiator (A), a colorant (B), an alkaline developing compound (C), and an ethylenically unsaturated compound (D) as essential components. Alkali developability, especially suitable for forming BCS composition.

本發明之聚合性組合物、BM用感光性組合物或BCS用感光性組合物以及硬化物可用於硬化性塗料、清漆、硬化性接著劑、印刷基板、顯示器顯示裝置(彩色電視、PC顯示器、攜帶型資訊終端及數位相機等彩色顯示之液晶顯示面板中之彩色濾光片、各種顯示用途用彩色濾光片、CCD影像感測器之彩色濾光片、觸控面板、電氣發光顯示裝置(微LED之間隔壁材料)、電漿顯示面板、有機EL之黑色間隔壁、粉末塗層、印刷墨水、印刷版、接著劑、凝膠塗層、電子工學用光阻劑、電鍍抗蝕劑、蝕刻阻劑、焊料抗蝕劑、絕緣膜、黑色矩陣、及用以於LCD之製造步驟中形成結構之抗蝕劑、用以封入電氣及電子零件之組合物、阻焊劑、磁記錄材料、微小機械零件、波導、光開關、鍍覆用遮罩、蝕刻遮罩、彩色試驗系統、玻璃纖維纜線塗層、網版印刷用模板、用以藉由立體光刻製造三維物體之材料、全像記錄用材料、圖像記錄材料、微細電子電路、脫色材料、用於圖像記錄材料之脫色材料、使用微膠囊之圖像記錄材料用脫色材料、印刷配線板用光阻劑材料、UV及可見光雷射直接圖像系統用光阻劑材料、印刷電路基板之逐次積層中之介電體層形成中所使用之光阻劑材料及保護膜等各種用途,但並不特別限制於該用途,尤其適合用於上述用途中之顯示器顯示裝置中。The polymerizable composition, the photosensitive composition for BM or the photosensitive composition for BCS, and the cured product of the present invention can be used for curable coatings, varnishes, curable adhesives, printed substrates, and display devices (color televisions, PC monitors, Color filters for liquid crystal display panels such as portable information terminals and digital cameras, color filters for various display applications, color filters for CCD image sensors, touch panels, and electroluminescent display devices ( Micro LED partition wall material), plasma display panel, black partition wall of organic EL, powder coating, printing ink, printing plate, adhesive, gel coating, photoresist for electronics, plating resist , Etching resist, solder resist, insulating film, black matrix, and resist used to form structures in the manufacturing steps of LCDs, compositions for sealing electrical and electronic parts, solder resists, magnetic recording materials, Tiny mechanical parts, waveguides, optical switches, masks for plating, etching masks, color test systems, fiberglass cable coatings, stencils for screen printing, made by stereolithography Materials for three-dimensional objects, hologram recording materials, image recording materials, fine electronic circuits, decoloring materials, decoloring materials for image recording materials, decoloring materials for image recording materials using microcapsules, and light for printed wiring boards Resistant materials, photoresist materials for UV and visible laser direct image systems, photoresist materials and protective films used in the formation of dielectric layers in successive laminations of printed circuit boards, etc., but not special Limited to this use, it is particularly suitable for use in a display device for the above-mentioned use.

本發明之顯示器顯示裝置除了具有本發明之硬化物(尤其是BCS)以外是與先前公知之顯示裝置相同之構成,BCS較佳為設於單元與單元之間。The display device of the present invention has the same structure as the conventionally known display device except that it has the hardened material (especially BCS) of the present invention. The BCS is preferably provided between the units.

於使用本發明之聚合性組合物作為有機EL之黑色間隔壁之情形時,自圖案形狀之垂直化、顯影密接性之提高、耐熱性之提高考慮,較佳為使用重量平均分子量為5000以上之鹼性顯影性化合物,進而較佳為使用重量平均分子量7000~15000之鹼性顯影性化合物。進而,於鹼性顯影性化合物為具有藉由酯化反應而獲得之結構之不飽和化合物之情形時尤佳,上述酯化反應係具有於下述通式(IV)所表示之環氧化合物上加成有不飽和一元酸之結構的環氧加成化合物與多元酸酐之酯化反應。When the polymerizable composition of the present invention is used as the black partition wall of the organic EL, it is preferable to use a weight average molecular weight of 5,000 or more in consideration of the verticalization of the pattern shape, the improvement of the development adhesion, and the improvement of the heat resistance. The alkaline developable compound is more preferably an alkaline developable compound having a weight average molecular weight of 7,000 to 15,000. Furthermore, it is particularly preferable when the basic developable compound is an unsaturated compound having a structure obtained by an esterification reaction, and the above-mentioned esterification reaction is included in the epoxy compound represented by the following general formula (IV) Esterification reaction of an epoxy addition compound having an unsaturated monobasic acid structure and a polybasic acid anhydride.

關於使用本發明之聚合性組合物、BM用感光性組合物及BCS用感光性組合物而製造硬化物之方法,於以下加以詳細說明。The method of manufacturing a hardened | cured material using the polymerizable composition of this invention, the photosensitive composition for BM, and the photosensitive composition for BCS is demonstrated in detail below.

本發明之聚合性組合物、BM用感光性組合物及BCS用感光性組合物可藉由旋轉塗佈機、輥式塗佈機、棒式塗佈機、模嘴塗佈機、簾幕式塗佈機、各種印刷、浸漬等公知之手段而應用於鈉玻璃、石英玻璃、半導體基板、金屬、紙、塑膠等支持基體上。又,於暫時賦予至膜等支持基體上之後,亦可轉印於其他支持基體上,其應用方法並無限制。The polymerizable composition, the photosensitive composition for BM, and the photosensitive composition for BCS of the present invention can be applied by a spin coater, a roll coater, a bar coater, a die coater, and a curtain type. Coating machines, various printing, and dipping methods are applied to support substrates such as soda glass, quartz glass, semiconductor substrates, metals, paper, and plastics. In addition, after being temporarily applied to a supporting substrate such as a film, it can also be transferred to another supporting substrate, and its application method is not limited.

又,作為使本發明之聚合性組合物及BCS用感光性組合物硬化時所使用之能量線之光源,可利用由超高壓水銀燈、高壓水銀燈、中壓水銀燈、低壓水銀燈、水銀蒸氣弧燈、氙弧燈、碳弧燈、金屬鹵素燈、螢光燈、鎢絲燈、準分子燈、殺菌燈、發光二極體、CRT光源等而獲得之具有2000埃至7000埃之波長的電磁波能量或電子束、X射線、放射線等高能量線,較佳為列舉發出波長為300~450 nm之光的超高壓水銀燈、水銀蒸氣弧燈、碳弧燈、氙弧燈等。In addition, as the light source of the energy ray used when curing the polymerizable composition and the photosensitive composition for BCS of the present invention, an ultrahigh-pressure mercury lamp, a high-pressure mercury lamp, a medium-pressure mercury lamp, a low-pressure mercury lamp, a mercury vapor arc lamp, Xenon arc lamp, carbon arc lamp, metal halide lamp, fluorescent lamp, tungsten lamp, excimer lamp, germicidal lamp, light emitting diode, CRT light source, etc. High-energy rays such as electron beams, X-rays, and radiation are preferably ultra-high pressure mercury lamps, mercury vapor arc lamps, carbon arc lamps, xenon arc lamps, etc. that emit light having a wavelength of 300 to 450 nm.

進而,藉由於曝光光源中使用雷射光,並不使用遮罩地由電腦等之數位資訊形成直接圖像之雷射直接刻寫法不僅可實現生產性之提高,亦可實現解像性或位置精度等之提高,因此有用,該雷射光可適宜使用340~430 nm之波長的光,亦可使用準分子雷射、氮雷射、氬離子雷射、氦-鎘雷射、氦氖雷射、氪離子雷射、各種半導體雷射及YAG雷射等發出自可見至紅外區域之光者。於使用該等雷射之情形時,可加入吸收自可見至紅外之該區域的增感色素。Furthermore, because laser light is used for the exposure light source, a direct laser writing method that forms a direct image from digital information such as a computer without using a mask can not only improve productivity, but also achieve resolution or position accuracy. The laser light is useful because the laser light can be suitably used at a wavelength of 340 to 430 nm. Excimer lasers, nitrogen lasers, argon ion lasers, helium-cadmium lasers, helium-neon lasers, Samarium ion lasers, various semiconductor lasers, and YAG lasers emit light from the visible to the infrared region. In the case of using such lasers, a sensitizing pigment that absorbs the region from visible to infrared may be added.

本發明之硬化物作為BCS特別有用。BCS可藉由如下步驟而較佳地形成:(1)於基板上形成本發明之BCS用感光性組合物之塗膜之步驟、(2)經由具有特定圖案形狀之遮罩對該塗膜照射放射線之步驟、(3)曝光後烘烤步驟、(4)對曝光後之該被膜進行顯影之步驟、(5)對顯影後之該被膜進行加熱之步驟。 作為上述遮罩,亦可使用半色調遮罩或灰度遮罩等多階遮罩。 [實施例]The hardened | cured material of this invention is especially useful as BCS. BCS can be preferably formed by the following steps: (1) a step of forming a coating film of the photosensitive composition for BCS of the present invention on a substrate, and (2) irradiating the coating film through a mask having a specific pattern shape The step of radiating, (3) the step of baking after exposure, (4) the step of developing the film after exposure, and (5) the step of heating the film after development. As the mask, a multi-step mask such as a halftone mask or a grayscale mask may be used. [Example]

以下,列舉實施例及比較例對本發明加以更詳細之說明,但本發明並不限定於該等實施例等。Hereinafter, the present invention will be described in more detail with examples and comparative examples, but the present invention is not limited to these examples and the like.

[製造例1]內醯胺黑分散液B-1之製備 將有機系之黑色顏料(作為內醯胺黑之Black 582;巴斯夫公司製造)、分散劑(BYK-167)及用於分散物之聚合物(後述之鹼性顯影性化合物PGMEA溶液C-2)分別以16質量份、3.2質量份及3.6質量份加以混合後,以固形物成分濃度成為25質量%之方式稱量丙二醇單甲醚乙酸酯(PGMEA)添加於該混合物中,製成混合物。 藉由攪拌器將上述混合物預混合後,以與分散物(自混合物中去除了溶劑PGMEA者)相同之重量添加直徑為0.3 mm之氧化鋯珠,於25~60℃之溫度下歷時6小時實施利用塗料振盪機之分散物處理,然後使用過濾器去除氧化鋯珠,獲得分散液。於所獲得之分散液中追加PGMEA,以分散物濃度成為20質量%之方式進行調整,藉由攪拌器使其變均勻後,獲得內醯胺黑分散液B-1。[Manufacturing Example 1] Preparation of lactam black dispersion B-1 An organic black pigment (Black 582 as lindamine black; manufactured by BASF), a dispersant (BYK-167), and a dispersion for dispersion A polymer (an alkali-developing compound PGMEA solution C-2 described later) was respectively mixed with 16 parts by mass, 3.2 parts by mass, and 3.6 parts by mass, and propylene glycol monomethyl ether was weighed so that the solid content concentration became 25% by mass. Acetate (PGMEA) was added to the mixture to make a mixture. After the above mixture was pre-mixed by a stirrer, zirconia beads with a diameter of 0.3 mm were added at the same weight as the dispersion (when the solvent PGMEA was removed from the mixture), and it was carried out at a temperature of 25 to 60 ° C. for 6 hours. The dispersion was treated with a paint shaker, and then zirconia beads were removed using a filter to obtain a dispersion. PGMEA was added to the obtained dispersion liquid, adjusted so that the dispersion concentration became 20% by mass, and homogenized by a stirrer to obtain a lactam black dispersion B-1.

[製造例2]苝黑分散液B-2之製備 將有機系之黑色顏料[作為苝黑之C.I.顏料黑31(Paliogen Black S 0084;巴斯夫公司製造)]、分散劑(BYK-167)及用於分散物之聚合物(後述之鹼性顯影性化合物PGMEA溶液C-2)分別以12質量份、3.6質量份及8質量份加以混合後,以固形物成分濃度成為25質量%之方式稱量丙二醇單甲醚乙酸酯(PGMEA)添加於該混合物中,製成混合物。 藉由攪拌器將上述混合物預混合後,以與分散物(自混合物中去除了溶劑PGMEA者)相同之重量添加直徑為0.3 mm之氧化鋯珠,於25~60℃之溫度下歷時6小時實施利用塗料振盪機之分散物處理,然後使用過濾器去除氧化鋯珠,獲得分散液。於所獲得之分散液中追加PGMEA,以分散物濃度成為20質量%之方式進行調整,藉由攪拌器使其變均勻後,獲得苝黑分散液B-2。[Manufacturing Example 2] Preparation of black dispersion B-2 An organic black pigment [CI Pigment Black 31 (Paliogen Black S 0084; manufactured by BASF)], a dispersant (BYK-167), and After dispersing the polymer (the basic developable compound PGMEA solution C-2 described later) at 12 parts by mass, 3.6 parts by mass, and 8 parts by mass, respectively, the weight was measured so that the solid content concentration became 25% by mass. Propylene glycol monomethyl ether acetate (PGMEA) was added to the mixture to prepare a mixture. After the above mixture was pre-mixed by a stirrer, zirconia beads with a diameter of 0.3 mm were added at the same weight as the dispersion (when the solvent PGMEA was removed from the mixture), and it was carried out at a temperature of 25 to 60 ° C. for 6 hours. The dispersion was treated with a paint shaker, and then zirconia beads were removed using a filter to obtain a dispersion. PGMEA was added to the obtained dispersion, and the dispersion was adjusted so that the concentration of the dispersion became 20% by mass. After homogenizing with a stirrer, a black dispersion B-2 was obtained.

[製造例3]碳黑分散液B-3之製備 將作為碳黑之MA100 (三菱化學公司製造)20質量份、作為分散劑之BYK161 (BYK-Chemie(BYK)公司製造)12.5質量份(固形物成分濃度為40質量%)、作為溶劑之丙二醇單甲醚乙酸酯67.5質量份加以混合,藉由珠磨機進行處理而製備碳黑分散液B-3。[Production Example 3] Preparation of Carbon Black Dispersion Liquid B-3 20 parts by mass of MA100 (manufactured by Mitsubishi Chemical Corporation) as carbon black and 12.5 parts by mass of BYK161 (manufactured by BYK-Chemie (BYK)) as a dispersant (solid form The component concentration was 40% by mass), 67.5 parts by mass of propylene glycol monomethyl ether acetate was mixed as a solvent, and the mixture was processed by a bead mill to prepare a carbon black dispersion B-3.

[製造例4]鹼性顯影性化合物PGMEA溶液C-2之製備 裝入1,1-雙[4-(2,3-環氧丙氧基)苯基]茚滿184 g、丙烯酸58 g、2,6-二-第三丁基-對甲酚0.26 g、四正丁基溴化銨0.11 g及PGMEA 105 g,於120℃下進行16小時攪拌。將反應液冷卻至室溫,加入PGMEA 160 g、聯苯四甲酸二酐59 g及四正丁基溴化銨0.24 g,於120℃下攪拌4小時。進而,加入四氫鄰苯二甲酸酐20 g,於120℃下攪拌4小時,於100℃下攪拌3小時,於80℃下攪拌4小時,於60℃下攪拌6小時,於40℃下攪拌11小時後,加入PGMEA 128 g,以PGMEA溶液之形式獲得鹼性顯影性化合物C-2 (Mw=5000、Mn=2100、酸值(固形物成分)為92.7 mgKOH/g)。鹼性顯影性化合物PGMEA溶液C-2中之鹼性顯影性化合物之含有率為45質量%。[Manufacturing Example 4] Preparation of alkaline developable compound PGMEA solution C-2 Charged 1,1-bis [4- (2,3-glycidoxy) phenyl] indane 184 g, acrylic acid 58 g, 0.26 g of 2,6-di-third-butyl-p-cresol, 0.11 g of tetra-n-butylammonium bromide, and 105 g of PGMEA were stirred at 120 ° C for 16 hours. The reaction liquid was cooled to room temperature, 160 g of PGMEA, 59 g of biphenyltetracarboxylic dianhydride, and 0.24 g of tetra-n-butylammonium bromide were added, and stirred at 120 ° C for 4 hours. Further, 20 g of tetrahydrophthalic anhydride was added, and the mixture was stirred at 120 ° C for 4 hours, at 100 ° C for 3 hours, at 80 ° C for 4 hours, at 60 ° C for 6 hours, and at 40 ° C. After 11 hours, 128 g of PGMEA was added to obtain an alkaline developable compound C-2 (Mw = 5000, Mn = 2100, and acid value (solid content) of 92.7 mgKOH / g) as a PGMEA solution. The content of the alkali developable compound in the alkali developable compound PGMEA solution C-2 was 45% by mass.

[製造例5]鹼性顯影性化合物PGMEA溶液C-3之製造 裝入9,9-雙(4-縮水甘油氧基苯基)茀75.0 g、丙烯酸23.8 g、2,6-二-第三丁基-對甲酚0.273 g、四丁基氯化銨0.585 g、及PGMEA 65.9 g,於90℃下攪拌1小時,於100℃下攪拌1小時,於110℃下攪拌1小時及於120℃下攪拌14。冷卻至室溫而加入琥珀酸酐25.9 g、四丁基氯化銨0.427 g、及PGMEA 1.37 g,於100℃下攪拌5小時。進而加入9,9-雙(4-縮水甘油氧基苯基)茀30.0 g、2,6-二-第三丁基-對甲酚0.269 g、及PGMEA 1.50 g,於90℃下攪拌90分鐘,於120℃下攪拌4小時後,加入PGMEA 122.2 g,以PGMEA溶液之形式獲得作為目標物之鹼性顯影性化合物C-3(Mw=4190、Mn=2170、酸值(固形物成分)為52 mg・KOH/g)。鹼性顯影性化合物PGMEA溶液C-3中之鹼性顯影性化合物之含有率為45質量%。[Production Example 5] Production of alkaline developable compound PGMEA solution C-3 Charge 9,9-bis (4-glycidyloxyphenyl) 茀 75.0 g, acrylic acid 23.8 g, 2,6-di-third 0.273 g of butyl-p-cresol, 0.585 g of tetrabutylammonium chloride, and 65.9 g of PGMEA, stirred at 90 ° C for 1 hour, stirred at 100 ° C for 1 hour, stirred at 110 ° C for 1 hour, and 120 ° C Under stirring 14. After cooling to room temperature, 25.9 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride, and 1.37 g of PGMEA were added, and stirred at 100 ° C for 5 hours. Furthermore, 30.0 g of 9,9-bis (4-glycidyloxyphenyl) fluorene, 0.269 g of 2,6-di-third-butyl-p-cresol, and 1.50 g of PGMEA were added, and it stirred at 90 degreeC for 90 minutes After stirring at 120 ° C for 4 hours, 122.2 g of PGMEA was added to obtain an alkaline developing compound C-3 (Mw = 4190, Mn = 2170, acid value (solid content)) as a target in the form of a PGMEA solution. 52 mg · KOH / g). The content of the alkali developable compound in the alkali developable compound PGMEA solution C-3 was 45% by mass.

[實施例1~14及比較例1~5]聚合性組合物之製備 依照[表1]~[表4]之組成將各成分加以混合,獲得聚合性組合物(實施例1~12及比較例1~5)。再者,表中之組成之數值表示質量份。 又,表中之各成分之符號表示下述成分。 A1-1 化合物No.A1-1 [屬於(A1)成分之聚合起始劑] A2-1 化合物No.A2-1 [屬於(A2)成分之聚合起始劑] A2-2 化合物No.A2-8 [屬於(A2)成分之聚合起始劑] A2-3 化合物No.A2-14 [屬於(A2)成分之聚合起始劑] A3-1 IRGACURE907 (並不具有羥基之α-胺基苯乙酮化合物;巴斯夫公司製造) B-1 內醯胺黑分散液B-1 B-2 苝黑分散液B-2 B-3 碳黑分散液B-3 C-1 CCR-1171H (通式(II)所表示之鹼性顯影性化合物之PGMEA溶液 固形物成分為69.5質量%;日本化藥公司製造) C-2 鹼性顯影性化合物PGMEA溶液C-2 C-3 鹼性顯影性化合物PGMEA溶液C-3 D-1 Kayarad DPHA (乙烯性不飽和化合物;日本化藥公司製造) D-2 UA-306H (胺基甲酸酯單體、PETA+HDI) E-1 γ-縮水甘油氧基丙基三甲氧基矽烷(偶合劑) E-2 Karenz PE-1 (硫醇化合物;昭和電工公司製造) G-1 PGMEA G-2 乙酸3-甲氧基丁酯 G-3 琥珀酸二甲酯[Examples 1 to 14 and Comparative Examples 1 to 5] Preparation of polymerizable composition Each component was mixed according to the composition of [Table 1] to [Table 4] to obtain a polymerizable composition (Examples 1 to 12 and comparison Examples 1 to 5). The numerical values of the composition in the table indicate parts by mass. The symbols of the components in the table indicate the following components. A1-1 Compound No. A1-1 [Polymerization initiator belonging to (A1) component] A2-1 Compound No. A2-1 [Polymerization initiator belonging to (A2) component] A2-2 Compound No. A2- 8 [Polymerization initiator belonging to the (A2) component] A2-3 Compound No. A2-14 [Polymerization initiator belonging to the (A2) component] A3-1 IRGACURE907 (α-aminophenethyl which does not have a hydroxyl group) Ketone compound; manufactured by BASF) B-1 lactam black dispersion B-1 B-2 black dispersion B-2 B-3 carbon black dispersion B-3 C-1 CCR-1171H (general formula (II The solid content of the PGMEA solution represented by the basic developing compound is 69.5% by mass; manufactured by Nippon Kayaku Co., Ltd.) C-2 Basic developing compound PGMEA solution C-2 C-3 Basic developing compound PGMEA solution C -3 D-1 Kayarad DPHA (Ethylene unsaturated compound; manufactured by Nippon Kayaku Co., Ltd.) D-2 UA-306H (carbamate monomer, PETA + HDI) E-1 γ-glycidoxypropyltrimethoxy Silane (coupling agent) E-2 Karenz PE-1 (thiol compound; manufactured by Showa Denko Corporation) G-1 PGMEA G-2 3-methoxybutyl acetate G-3 dimethyl succinate

[由聚合性組合物獲得之硬化物之評價] 關於由實施例1~14及比較例1~5之聚合性組合物獲得之硬化物,依照下述順序進行彈性回覆率、遮光性(OD值)、相對介電常數、液晶污染性(VHR)及耐化學品性之評價。將結果一併記載於[表1]~[表4]中。[Evaluation of hardened material obtained from polymerizable composition] With respect to the hardened materials obtained from the polymerizable compositions of Examples 1 to 14 and Comparative Examples 1 to 5, the elastic recovery ratio and light-shielding property (OD value) were performed in the following order. ), Evaluation of relative dielectric constant, liquid crystal contamination (VHR), and chemical resistance. The results are collectively described in [Table 1] to [Table 4].

(彈性回覆率) 藉由旋轉塗佈(3 μm厚、300 rpm×7秒)於玻璃基板上塗佈實施例1~14之聚合性組合物及比較例1~5之比較聚合性組合物,進行乾燥後於90℃下進行100秒之預烘烤,將溶劑除去後,使用光罩而藉由高壓水銀燈進行100 mJ/cm2 曝光後,使用0.04質量%之KOH水溶液進行顯影,然後於230℃下進行30分鐘加熱,製成圖案。於所獲得之圖案之20 μm部分,使用島津公司之動態微小硬度計DUH-211,以40 mN之荷重進行負載-卸載試驗。藉由下述計算式算出彈性回覆率(%)。 彈性回覆率(%)=[(回覆距離/壓縮位移)×100] 彈性回覆率(%)為60%以上之硬化物可作為BCS而使用,彈性回覆率(%)為70%以上之硬化物可作為BCS而較佳地使用,彈性回覆率(%)為80%以上之硬化物可作為BCS而尤佳地使用。(Elastic Response Rate) The polymerizable composition of Examples 1 to 14 and the comparative polymerizable composition of Comparative Examples 1 to 5 were applied to a glass substrate by spin coating (3 μm thickness, 300 rpm × 7 seconds), After drying, pre-baking was performed at 90 ° C for 100 seconds. After removing the solvent, exposure was performed at 100 mJ / cm 2 with a high-pressure mercury lamp using a photomask, and development was performed using a 0.04% by mass KOH aqueous solution. It heated at 30 degreeC for 30 minutes, and patterned. A 20-μm portion of the obtained pattern was subjected to a load-unload test with a load of 40 mN using a dynamic micro hardness tester DUH-211 of Shimadzu Corporation. The elastic response rate (%) was calculated by the following calculation formula. Elastic response rate (%) = [(response distance / compression displacement) × 100] Hardened products with an elastic response rate (%) of 60% or more can be used as BCS, and elastic response rates (%) of a hardened product of 70% or more It can be preferably used as BCS, and a hardened product having an elastic response rate (%) of 80% or more can be particularly preferably used as BCS.

(OD值) 於玻璃基板上旋轉塗佈實施例1~14之聚合性組合物及比較例1~5之比較聚合性組合物(300 rpm、7秒)而使其乾燥後,於90℃下進行100秒之預烘烤。於使用超高壓水銀燈作為光源而進行曝光後,於230℃下烘烤30分鐘而製成硬化物。使用麥克貝思透射密度計而測定所獲得之膜之OD值,該OD值除以後烘烤後之膜厚,算出單位膜厚之OD值。 單位膜厚之OD值為1.0以上之硬化物之遮光性高,因此可作為BCS而使用,單位膜厚之OD值為1.5以上之硬化物可作為BCS而較佳地使用,單位膜厚之OD值為2.0以上之硬化物可作為BCS而尤佳地使用。單位膜厚之OD值未達1.0之硬化物無法作為BCS而使用。(OD value) The polymerizable compositions of Examples 1 to 14 and the comparative polymerizable compositions of Comparative Examples 1 to 5 (300 rpm, 7 seconds) were spin-coated on a glass substrate and dried, and then dried at 90 ° C. Pre-bake for 100 seconds. After exposure using an ultra-high pressure mercury lamp as a light source, baking was performed at 230 ° C. for 30 minutes to prepare a cured product. The OD value of the obtained film was measured using a Macbeth transmission densitometer, and the OD value was divided by the film thickness after baking to calculate the OD value per unit film thickness. Hardened products with unit film thickness of OD value of 1.0 or more have high light-shielding properties, so they can be used as BCS. Hardened products with unit film thickness of OD values of 1.5 or more can be used as BCS. A hardened material having a value of 2.0 or more is particularly preferably used as BCS. Hardened products with an OD value of less than 1.0 per unit film thickness cannot be used as BCS.

(相對介電常數) 於玻璃基板上旋轉塗佈實施例1~14之聚合性組合物及比較例1~5之比較聚合性組合物(3 μm厚、300 rpm×7秒)而使其乾燥後,於90℃下進行100秒之預烘烤,並不使用遮罩而藉由高壓水銀燈進行100 mJ/cm2 之曝光後,進行230℃×180分鐘之加熱,製成上述評價樣品。 (評價法) 關於上述評價樣品,使用LCR測定計、安捷倫公司之4284A,施加AC1V、1 kHz進行測定。 相對介電常數未達5.0之硬化物可作為BCS而使用,相對介電常數為4.5以下之硬化物可作為BCS而較佳地使用,相對介電常數為4.0以下之硬化物可作為BCS而尤佳地使用。相對介電常數為5.0以上之硬化物無法作為BCS而使用。(Relative permittivity) The polymerizable composition of Examples 1 to 14 and the comparative polymerizable composition of Comparative Examples 1 to 5 (3 μm thick, 300 rpm × 7 seconds) were spin-coated on a glass substrate and dried. Then, pre-baking was performed at 90 ° C for 100 seconds, and exposure was performed at 100 mJ / cm 2 by a high-pressure mercury lamp without using a mask, followed by heating at 230 ° C for 180 minutes to prepare the above-mentioned evaluation sample. (Evaluation method) About the said evaluation sample, it measured using LCR meter, 4284A of Agilent, and applied AC1V and 1 kHz. Hardened products with a relative dielectric constant of less than 5.0 can be used as BCS, hardened products with a relative dielectric constant of 4.5 or less can be preferably used as BCS, and hardened products with a relative dielectric constant of 4.0 or less can be particularly used as BCS. Best to use. Hardened products having a relative dielectric constant of 5.0 or more cannot be used as BCS.

(VHR) 使用旋轉塗佈機將實施例1~14中所獲得之聚合性組合物及比較例1~5中所獲得之比較聚合性組合物塗佈於玻璃基板(100mm×100mm)上,於90℃下進行100秒之預烘烤,形成膜厚為3.0 μm之塗膜。其次,使用鏡面投影對準曝光器(產品名:TME-150RTO、拓普康股份有限公司製造),並未介隔遮罩而以200mJ/cm2 之照射量對塗膜照射紫外線。其後,於230℃下進行30分鐘之後烘烤。 將後烘烤後之塗膜之1質量份與40質量份之ADEKA公司製造之液晶「RS-182」加以混合,於120℃下保存1小時。將其取出於室溫下靜置後,採取上清液。測定所採取之液晶組合物之VHR(電壓保持率)。詳細之評價方法如下所述。將液晶組合物注入至液晶評價用TN單元(單元厚度為5 μm、電極面積為8 mm×8 mm、配向膜為JALS2096)中,使用VHR-1A(東陽技術公司製造)測定VHR。(測定條件:脈波電壓寬度為60 μs、幀週期為16.7 ms、波高為±5 V、測定溫度為60℃) VHR為90%以上之硬化物之液晶污染性低,可作為BCS而使用,VHR為95%以上之硬化物可作為BCS而較佳地使用,VHR為98%以上之硬化物可作為BCS而尤佳地使用。 VHR未達90%之硬化物無法作為BCS使用。(VHR) The polymerizable composition obtained in Examples 1 to 14 and the comparative polymerizable composition obtained in Comparative Examples 1 to 5 were applied to a glass substrate (100 mm × 100 mm) using a spin coater, and Pre-baking was performed at 90 ° C for 100 seconds to form a coating film having a film thickness of 3.0 μm. Next, a specular projection alignment exposure device (product name: TME-150RTO, manufactured by Topcon Co., Ltd.) was used, and the coating film was irradiated with ultraviolet rays at an irradiation amount of 200 mJ / cm 2 without a mask. Thereafter, it was baked at 230 ° C for 30 minutes. One part by mass of the post-bake coating film and 40 parts by mass of a liquid crystal "RS-182" manufactured by ADEKA Corporation were mixed and stored at 120 ° C for 1 hour. After taking it out and leaving it to stand at room temperature, the supernatant was collected. The VHR (voltage holding ratio) of the taken liquid crystal composition was measured. The detailed evaluation method is as follows. The liquid crystal composition was poured into a TN cell for liquid crystal evaluation (cell thickness: 5 μm, electrode area: 8 mm × 8 mm, alignment film: JALS2096), and VHR-1A (manufactured by Toyo Technology Co., Ltd.) was used to measure VHR. (Measurement conditions: Pulse voltage width is 60 μs, frame period is 16.7 ms, wave height is ± 5 V, and measurement temperature is 60 ° C.) Hardened materials with VHR of 90% or above have low liquid crystal contamination and can be used as BCS. A hardened product having a VHR of 95% or more can be preferably used as BCS, and a hardened product having a VHR of 98% or more can be particularly preferably used as BCS. Hardened products with VHR less than 90% cannot be used as BCS.

<NMP耐化學品性> N-甲基吡咯啶酮(NMP)溶出試驗按照以下順序進行。 首先,藉由旋轉塗佈機將所製備之實施例1~14中所獲得之聚合性組合物及比較例1~5中所獲得之比較聚合性組合物以最終膜厚成為3 μm之方式塗佈於玻璃基板上,進行1分鐘減壓乾燥後,藉由加熱板以90℃進行120秒之乾燥。藉由高壓水銀燈進行50 mJ/cm2 之曝光後,經過顯影步驟後,於烘箱中以230℃進行40分鐘之加熱而獲得抗蝕劑塗佈基板。自所製作之抗蝕劑塗佈基板切出2枚測定用基板(25 mm×35 mm見方),將其浸漬於放入有8 mL N-甲基吡咯啶酮(NMP)之10 mL用小瓶中。繼而,於將該放入有測定用基板之小瓶於90℃之潔淨烘箱中靜置60分鐘之狀態下實施NMP溶出試驗。於靜置40分鐘後自熱浴中取出小瓶,藉由分光光度計(島津製作所公司製造之「UV-3100PC」),於300~800 nm之波長範圍每隔1 nm地測定該NMP溶出溶液之吸光度。光源使用鹵素燈及氘燈(切換波長為360 nm),檢測器使用光電倍增器,將狹縫寬度2 nm作為測定條件。又,將試樣溶液放入至1 cm見方之石英槽中進行測定。吸光度係於分光法中表示使光通過某物體時光強度衰減何種程度之無因次量,藉由以下式進行定義。<NMP Chemical Resistance> The N-methylpyrrolidone (NMP) dissolution test was performed in the following procedure. First, the polymerizable composition obtained in Examples 1 to 14 and the comparative polymerizable composition obtained in Comparative Examples 1 to 5 were applied by a spin coater so that the final film thickness became 3 μm. The cloth was dried on a glass substrate for 1 minute under reduced pressure, and then dried on a hot plate at 90 ° C. for 120 seconds. After exposure to 50 mJ / cm 2 by a high-pressure mercury lamp, and after a development step, heating was performed at 230 ° C. for 40 minutes in an oven to obtain a resist-coated substrate. Two substrates for measurement (25 mm × 35 mm square) were cut out of the prepared resist-coated substrate, and immersed in a 10 mL vial containing 8 mL of N-methylpyrrolidone (NMP). in. Next, the NMP dissolution test was performed while the vial with the substrate for measurement placed in a clean oven at 90 ° C. for 60 minutes. After standing for 40 minutes, the vial was taken out of the hot bath, and the NMP elution solution was measured by a spectrophotometer ("UV-3100PC" manufactured by Shimadzu Corporation) at a wavelength range of 300 to 800 nm every 1 nm. Absorbance. The light source was a halogen lamp and a deuterium lamp (the switching wavelength was 360 nm), the detector was a photomultiplier, and the slit width was 2 nm as the measurement condition. The sample solution was placed in a 1 cm square quartz cell for measurement. The absorbance is a dimensionless quantity that indicates how much the light intensity is attenuated when light passes through an object in a spectroscopic method, and is defined by the following formula.

A(吸光度)=-log10 (I/I0 ) (I:透射光強度、I0 :入射光強度)A (absorbance) = -log 10 (I / I 0 ) (I: transmitted light intensity, I 0 : incident light intensity)

又,上述之入射光強度及透射光強度可視為自相同光源對試樣溶液與單獨之NMP分別射入光時,透過單獨之NMP之光強度I0 與透過試樣溶液之光強度I。因此,上式之(I/I0 )表示透光率,吸光度A係指以對數表示透過率之倒數之值。吸光度A係算出試樣溶液中所含有之物質之濃度等時所使用之記法。於吸光度A=0之情形時,表示完全不吸收光之狀態(透過率為100%),於吸光度A=∞之情形時,表示完全不透過光之狀態(透過率為0%)。亦即,吸光度越強,越表示抗蝕劑塗膜成分較多地溶出至NMP中,耐NMP性差。算出所測定之吸光度之光譜面積(nm),以下述之基準進行評價。 NMP耐化學品性評價基準:根據NMP溶出溶液之吸收光譜之面積值而判定(波長為300~800 nm) ○:未達20(nm) △:20(nm)以上、未達60(nm) ×:60(nm)以上 NMP耐化學品性評價為〇者可作為BCS而尤佳地使用,NMP耐化學品性評價為△者可作為BCS而使用,NMP耐化學品性評價為×者無法作為BCS而使用。 作為本評價基準之吸光度之光譜面積可藉由各波長之吸光度之和而表示,表示所溶出之抗蝕劑成分之總和。In addition, the above-mentioned incident light intensity and transmitted light intensity can be regarded as the light intensity I 0 that passes through the NMP alone and the light intensity I that passes through the sample solution when the sample light and the separate NMP are incident from the same light source. Therefore, (I / I 0 ) in the above formula represents the light transmittance, and the absorbance A refers to a value in which the reciprocal of the transmittance is represented by a logarithm. The absorbance A is a notation used when calculating the concentration and the like of a substance contained in a sample solution. When the absorbance A = 0, it indicates a state where light is not absorbed at all (transmittance is 100%), and when the absorbance A = ∞, it indicates a state where light is not transmitted at all (transmittance 0%). That is, the stronger the absorbance, the more the component of the resist coating film is eluted into the NMP, and the NMP resistance is poor. The measured spectral area (nm) of the absorbance was calculated and evaluated based on the following criteria. NMP chemical resistance evaluation criteria: Determined based on the area value of the absorption spectrum of the NMP elution solution (wavelength 300 to 800 nm) ○: less than 20 (nm) △: more than 20 (nm) and less than 60 (nm) ×: 60 (nm) or more NMP chemical resistance evaluation can be used as BCS, especially better, NMP chemical resistance evaluation △ can be used as BCS, NMP chemical resistance evaluation is not possible Used as BCS. The spectral area of the absorbance used as the evaluation criterion can be expressed by the sum of the absorbances of the respective wavelengths, and represents the total of the eluted resist components.

[表1] [Table 1]

[表2] [Table 2]

[表3] [table 3]

[表4] [Table 4]

根據[表1]~[表4]可知:由本發明之聚合性組合物而獲得之硬化物以較高水準滿足遮光性(OD值)、相對介電常數、低液晶污染性(VHR)、耐化學品性,且彈性回覆率優異,因此可用作BCS。 [產業上之可利用性]From [Table 1] to [Table 4], it can be seen that the hardened material obtained from the polymerizable composition of the present invention satisfies light-shielding property (OD value), relative dielectric constant, low liquid crystal contamination resistance (VHR), and Chemical properties and excellent elastic response make it useful as a BCS. [Industrial availability]

由本發明之聚合性組合物、BM用感光性組合物或BCS用感光性組合物獲得之硬化物係彈性回覆、遮光性、耐化學品性優異,介電常數低,電特性良好之硬化物,特別適於BCS。該硬化物於顯示器顯示裝置等中特別有用。The hardened material obtained from the polymerizable composition, the photosensitive composition for BM or the photosensitive composition for BCS of the present invention is a hardened material having excellent elastic response, light-shielding properties, chemical resistance, low dielectric constant, and good electrical properties. Particularly suitable for BCS. This hardened | cured material is especially useful in a display device, etc.

Claims (9)

一種聚合性組合物,其係含有聚合起始劑(A)、著色劑(B)、鹼性顯影性化合物(C)及除該鹼性顯影性化合物(C)以外之乙烯性不飽和化合物(D)者, 上述聚合起始劑(A)含有具有羥基之α-胺基苯乙酮化合物(A1)。A polymerizable composition containing a polymerization initiator (A), a colorant (B), an alkaline developable compound (C), and an ethylenically unsaturated compound other than the alkaline developable compound (C) ( D) The polymerization initiator (A) contains an α-aminoacetophenone compound (A1) having a hydroxyl group. 如請求項1之聚合性組合物,其中上述聚合起始劑(A)除了具有羥基之α-胺基苯乙酮化合物(A1)以外亦含有具有下述通式(I)所表示之基之肟酯化合物(A2); [化1](式中,R1 及R2 分別獨立地表示氫原子、鹵素原子、硝基、氰基、碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 存在R1 及R2 所表示之基中之氫原子經鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、乙烯醚基、巰基、異氰酸基或含有雜環之碳原子數為2~20之基取代之情形,且存在R1 及R2 所表示之基中之亞甲基被取代為-O-、-CO-、-COO-、-OCO-、-NR3 -、-NR3 CO-、-S-、-CS-、-SO2 -、-SCO-、-COS-、-OCS-、不飽和鍵或CSO-之情形, R3 表示氫原子、碳原子數為1~20之烴基, m表示0或1, 式中之*表示鍵結鍵)。The polymerizable composition according to claim 1, wherein the polymerization initiator (A) contains, in addition to the α-aminoacetophenone compound (A1) having a hydroxyl group, a group having a group represented by the following general formula (I) Oxime ester compound (A2); (In the formula, R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a heterocyclic group containing 2 to 20 carbon atoms. The hydrogen atom in the group represented by R 1 and R 2 passes through a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amine group, a carboxyl group, a methacryl group, an acryl group, an epoxy group, a vinyl group, and a vinyl ether group. In the case of substitution with a mercapto group, an isocyanate group, or a group containing 2 to 20 carbon atoms containing a heterocyclic ring, and the methylene group in the group represented by R 1 and R 2 is substituted with -O-, -CO -, -COO-, -OCO-, -NR 3- , -NR 3 CO-, -S-, -CS-, -SO 2- , -SCO-, -COS-, -OCS-, unsaturated bond or In the case of CSO-, R 3 represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, m represents 0 or 1, and * in the formula represents a bonding bond). 如請求項1之聚合性組合物,其中著色劑(B)係黑色顏料。The polymerizable composition according to claim 1, wherein the colorant (B) is a black pigment. 如請求項1之聚合性組合物,其中鹼性顯影性化合物(C)係下述通式(II)所表示之鹼性顯影性化合物; [化2](式中,R11 、R13 及R15 分別獨立地表示氫原子或甲基,R12 、R14 及R16 分別獨立地表示碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 於R13 及R14 存在複數個之情形時,存在相同之情形亦存在不同之情形, Y1 、Y2 及Y3 表示直接鍵、碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 於Y2 存在複數個之情形時,存在相同之情形亦存在不同之情形, Z1 、Z2 及Z3 表示碳原子數為1~20之烴基或含有雜環之碳原子數為2~20之基, 於Z2 存在複數個之情形時,存在相同之情形亦存在不同之情形, 存在R12 、R14 、R16 、Y1 、Y2 、Y3 、Z1 、Z2 及Z3 所表示之基中之氫原子經鹵素原子、硝基、氰基、羥基、胺基、羧基、甲基丙烯醯基、丙烯醯基、環氧基、乙烯基、巰基、異氰酸基或含有雜環之碳原子數為2~20之基取代之情形,且亦存在R12 、R14 、R16 、Y1 、Y2 、Y3 、Z1 、Z2 及Z3 所表示之基中之亞甲基被取代為-O-、-CO-、-COO-、-OCO-、-S-、-SO2 -、-SCO-或-COS-之情形, n表示0或10以下之正數,a表示0或4以下之正數,b表示0或3以下之正數,c表示0或4以下之正數, 於n為2以上之情形時,b存在相同之情形亦存在不同之情形)。The polymerizable composition according to claim 1, wherein the alkaline developable compound (C) is an alkaline developable compound represented by the following general formula (II); (In the formula, R 11 , R 13 and R 15 each independently represent a hydrogen atom or a methyl group, and R 12 , R 14 and R 16 each independently represent a hydrocarbon group having 1 to 20 carbon atoms or a carbon atom containing a heterocyclic ring. The base is a number of 2 to 20. When there are a plurality of cases of R 13 and R 14 , the same situation exists and there are different situations. Y 1 , Y 2, and Y 3 represent direct bonds, and the number of carbon atoms is 1 to 20. In the case of a hydrocarbon group or a heterocyclic-containing carbon group having 2 to 20 carbon atoms, when there are a plurality of Y 2 , there are the same situations and different situations. Z 1 , Z 2 and Z 3 represent the number of carbon atoms as In the case of a hydrocarbon group of 1 to 20 or a group of 2 to 20 carbon atoms containing a heterocyclic ring, when there are a plurality of Z 2 , there are the same cases and different cases. There are R 12 , R 14 , R 16 , The hydrogen atom in the group represented by Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 passes a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amine group, a carboxyl group, a methacryl group, and acryl group. In the case of the substitution of an alkyl group, an epoxy group, a vinyl group, a mercapto group, an isocyanate group or a group containing 2 to 20 carbon atoms containing a heterocyclic ring, and there are also R 12 , R 14 , R 16, Y 1, Y 2, the group represented by Y 3, Z 1, Z 2 and Z 3 in the methylene group is replaced by -O -, - CO -, - COO -, - OCO -, - S- , -SO 2- , -SCO- or -COS-, n is a positive number below 0 or 10, a is a positive number below 0 or 4, b is a positive number below 0 or 3, and c is a number below 0 or 4 A positive number, when n is 2 or more, b is the same or different.) 一種黑色矩陣用感光性組合物,其含有如請求項1至4中任一項之聚合性組合物。The photosensitive composition for black matrices containing the polymerizable composition as described in any one of Claims 1-4. 一種黑柱間隔物用感光性組合物,其含有如請求項1至4中任一項之聚合性組合物。A photosensitive composition for a black column spacer, comprising the polymerizable composition according to any one of claims 1 to 4. 一種硬化物之製造方法,其藉由對如請求項1至4中任一項之聚合性組合物進行光照射或加熱而製造硬化物。A method for producing a cured product, which comprises producing a cured product by irradiating or heating the polymerizable composition according to any one of claims 1 to 4. 一種硬化物,其係如請求項1至4中任一項之聚合性組合物之硬化物。A hardened | cured material is a hardened | cured material of the polymerizable composition as described in any one of Claims 1-4. 一種顯示器顯示裝置,其含有如請求項8之硬化物。A display display device containing the hardened material as claimed in claim 8.
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