WO2018235664A1 - Polymerizable composition, photosensitive composition for black matrixes, and photosensitive composition for black column spacers - Google Patents

Polymerizable composition, photosensitive composition for black matrixes, and photosensitive composition for black column spacers Download PDF

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Publication number
WO2018235664A1
WO2018235664A1 PCT/JP2018/022276 JP2018022276W WO2018235664A1 WO 2018235664 A1 WO2018235664 A1 WO 2018235664A1 JP 2018022276 W JP2018022276 W JP 2018022276W WO 2018235664 A1 WO2018235664 A1 WO 2018235664A1
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group
compound
carbon atoms
polymerizable composition
acid
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PCT/JP2018/022276
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French (fr)
Japanese (ja)
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桂典 松平
翔 六谷
祐也 中田
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株式会社Adeka
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Priority to KR1020197029943A priority Critical patent/KR102597826B1/en
Priority to CN201880025335.5A priority patent/CN110520796A/en
Priority to JP2019525421A priority patent/JP7218069B2/en
Publication of WO2018235664A1 publication Critical patent/WO2018235664A1/en

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8723Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/303Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one or more carboxylic moieties in the chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F292/00Macromolecular compounds obtained by polymerising monomers on to inorganic materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136209Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8791Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers

Definitions

  • the present invention relates to a polymerizable composition containing an ⁇ -aminoacetophenone compound having a hydroxyl group as a polymerization initiator, and further containing an ethylenic unsaturated compound excluding a coloring agent, an alkali developable compound and an alkali developable compound.
  • the present invention also relates to a photosensitive composition for a black matrix (hereinafter also described as BM) containing this composition, a photosensitive composition for a black column spacer (hereinafter also described as BCS), and a cured composition obtained from these compositions Related to things.
  • BM black matrix
  • BCS black column spacer
  • a spacer is used to maintain the distance between the upper and lower substrates of the cell.
  • the spacer is formed by applying the polymerizable composition to the substrate, exposing it through a predetermined mask and developing it.
  • BCS has been used that integrates a column spacer and a black matrix into one module and has a light shielding property.
  • Patent Document 1 describes a photopolymerization initiator for a photosensitive solder resist containing an ⁇ -aminoalkylphenone compound.
  • Patent Document 2 describes a photosensitive resin composition for BCS formation which can form a BCS having a low relative dielectric constant, which contains carbon black subjected to a treatment for introducing an acidic group.
  • Patent Document 3 can form a BCS showing a good elastic recovery, containing a copolymer, an epoxy resin compound or a compound derived therefrom, and a colorant containing a black colorant and a blue colorant.
  • a colored photosensitive resin composition is described.
  • the problem to be solved by the present invention is that there has been no cured product (especially BCS) which is excellent in elastic recovery, light shielding property, chemical resistance, low in dielectric constant and good in electric characteristics.
  • the object of the present invention is to provide a polymerizable composition which is excellent in elastic recovery, light shielding property and chemical resistance, has a low dielectric constant and has a good electrical property, a photosensitive composition for BM and a photosensitive for BCS. It is providing a sex composition.
  • the present invention also provides the polymerizable composition, the photosensitive composition for the BM, a cured product obtained from the photosensitive composition for the BCS, a display device containing the cured product, and a method for producing the cured product. It is.
  • the present invention achieves the above object by providing the following [1] to [9] after earnest study.
  • a polymerizable composition containing a polymerization initiator (A), a colorant (B), an alkali developable compound (C) and an ethylenically unsaturated compound (D) excluding the alkali developable compound (C) There, A polymerizable composition, wherein the polymerization initiator (A) contains an ⁇ -aminoacetophenone compound (A1) having a hydroxyl group.
  • R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a heterocycle
  • the hydrogen atom in the group represented by R 1 and R 2 is a halogen atom, nitro group, cyano group, hydroxyl group, amino group, carboxyl group, methacryloyl group, acryloyl group, epoxy group, vinyl group, vinyl ether group, mercapto group, It may be substituted with an isocyanate group or a group having 2 to 20 carbon atoms containing a heterocycle, and the methylene group in the groups represented by R 1 and R 2 is —O—, —CO—, —COO— , -OCO -, - NR 3 - , - NR 3 CO -, - S -, - CS -,
  • R 11 , R 13 and R 15 each independently represent a hydrogen atom or a methyl group
  • R 12 , R 14 and R 16 each independently represent a hydrocarbon group having 1 to 20 carbon atoms or a complex
  • Y 1 , Y 2 and Y 3 each represents a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, or a group having 2 to 20 carbon atoms containing a heterocycle
  • Z 1 , Z 2 and Z 3 each represent a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a heterocyclic ring
  • a photosensitive composition for black matrix comprising the polymerizable composition according to any one of [1] to [4].
  • a photosensitive composition for a black column spacer comprising the polymerizable composition according to any one of [1] to [4].
  • the polymerizable composition of the present invention contains, as a polymerization initiator, an ⁇ -aminoacetophenone compound having a hydroxyl group, a colorant, an alkali developable compound and an ethylenically unsaturated compound other than the alkali developable compound.
  • a polymerization initiator an ⁇ -aminoacetophenone compound having a hydroxyl group
  • a colorant an alkali developable compound
  • an ethylenically unsaturated compound other than the alkali developable compound ethylenically unsaturated compound other than the alkali developable compound.
  • the polymerization initiator (A) used in the polymerizable composition of the present invention contains a hydroxyl group-containing ⁇ -aminoacetophenone compound (A1) [hereinafter, also described as the component (A1)], and the conventionally known component (A1) It is possible to use a radical polymerization initiator other than.
  • the said radical polymerization initiator is a photo radical polymerization initiator and a thermal radical polymerization initiator.
  • a photo radical polymerization initiator is more preferable because of high reactivity.
  • the photo radical polymerization initiator is not particularly limited as long as it generates radicals by light irradiation, and conventionally known compounds can be used.
  • acetophenone compounds, benzyl compounds, benzophenone compounds, thioxanthone Preferred are compounds based on the compound and oxime ester compounds and the like.
  • the component (A1) means a compound having a hydroxyl group and an ⁇ -aminoacetophenone structure in one molecule, and is not particularly limited, but preferably includes a compound represented by the following general formula (V).
  • Xr represents a structure represented by the following general formula (i), (ii) or (iii)
  • Xs represents a sulfur atom or NR 100
  • R 100 , R 101 , R 102 , R 103 and R 104 each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a phenyl group, an arylalkyl group having 7 to 20 carbon atoms, or the number of carbon atoms
  • the alkyl group may be substituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, and the phenyl group and the arylalkyl group each have 1 to 4 carbon atoms.
  • R 101 and R 102 may form a heterocyclic ring linked to 3-6 membered ring, the nitrogen atom in the heterocyclic ring may R 99 is bonded R 103 and R 104 may be linked to form a 3- to 6-membered ring, R 105 , R 106 , R 107 and R 108 each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group, a carboxyl group or an alkyl group having 1 to 12 carbon atoms, and the alkyl group is It may be substituted by a halogen atom, a carboxyl group, a cyano group, a nitro group or a hydroxyl group, R 99 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atom
  • R 117 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a phenyl group, an arylalkyl group having 7 to 20 carbon atoms or an alkenyl group having 2 to 12 carbon atoms, and the alkyl group is a hydroxyl group or a carboxyl group
  • the phenyl group and the arylalkyl group may be substituted with an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group. It may be substituted by a group.
  • the compound represented by Formula (V) has at least one hydroxyl group in the molecule. )
  • each of R 109 and R 110 independently represents a hydrogen atom, a hydroxyl group, a carboxyl group, a halogen atom, or an alkyl group having 1 to 4 carbon atoms, and even when p is 2 or more, they are the same) It may be different, Following in the formula (i-1)
  • R 111 represents a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a cyano group, an amino group or a phenyl group, and the phenyl group is an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group
  • p may be substituted with a nitro group, and p represents a number of 1 to 12.
  • R 112 , R 113 , R 114 , R 115 and R 116 each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group or an alkyl group having 1 to 12 carbon atoms
  • alkyl group may have been substituted by a halogen atom, a cyano group, a nitro group or a hydroxyl group, a methylene group in the alkyl group, -O -, - S -, - NR 117, -CO -, - CO- It may be substituted by O-, -O-CO- or -O-CO-O-, and R 106 or R 107 may combine with R 112 or R 116 to form a ring. .
  • R 101 , R 102 , R 103 , R 104 , R 105 , R 106 , R 107 and R 108 are the same as the above general formula (V), and R 109 , R 110 and p are the above The same as general formula (i).)
  • Examples of the alkyl group having 1 to 12 carbon atoms described above as the explanation of the general formula (V) include, for example, a carbon atom which is an example of a hydrocarbon group having 1 to 20 carbon atoms in the following general formula (I) Among the alkyl groups of 1 to 20, those having 1 to 12 carbon atoms can be mentioned.
  • Examples of the alkyl group having 1 to 4 carbon atoms described above as the explanation of the general formula (V) include 1 to 20 carbon atoms which is an example of a hydrocarbon group having 1 to 20 carbon atoms in the following general formula (I) Among the groups described below as the alkyl group of -20, one having 1 to 4 carbon atoms can be mentioned.
  • Examples of the arylalkyl group having 7 to 20 carbon atoms described above as the explanation of the general formula (V) include benzyl, ⁇ -methylbenzyl, ⁇ , ⁇ -dimethylbenzyl, phenylethyl and the like.
  • Preferred examples of the 3- to 6-membered heterocyclic ring which may be formed by linking R 101 and R 102 in the general formula (V) include piperidine ring, piperazine ring, morpholine ring, lactam ring and the like.
  • Preferred examples of the 3- to 6-membered ring which can be formed by linking R 103 and R 104 in the general formula (V) include a cyclopentane ring, a cyclohexane ring, a cyclopentene ring, a lactone ring and a lactam ring. .
  • Examples of the ring formed by combining R 106 or R 107 with R 112 or R 116 in the general formula (V) include a carbazole ring, a tianthrene ring and a dibenzothiophene ring as a structure combined with the benzene ring on both sides of Xs. It can be mentioned.
  • each halogen atom described above as an explanation in the general formula (V) examples include fluorine, chlorine, bromine and iodine.
  • Examples of preferable component (A1) include the following compound Nos. A1-1 to A-11.
  • Examples of the acetophenone-based compound other than the component (A1) include ⁇ -aminoacetophenone compounds and ⁇ -hydroxyacetophenone compounds having no hydroxyl group.
  • acetophenone compounds other than the component (A1) include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 4′-isopropyl-2-hydroxy-2-methylpropiophenone , 2-hydroxymethyl-2-methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p-dimethylaminoacetophenone, p-tert-butyl dichloroacetophenone, p-tert-butyl trichloro Acetophenone, p-azidobenzalacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -bu
  • benzyl compound examples include benzyl and the like.
  • benzophenone compounds include benzophenone, methyl o-benzoylbenzoate, Michler's ketone, 4,4'-bisdiethylaminobenzophenone, 4,4'-dichlorobenzophenone and 4-benzoyl-4'-methyldiphenyl sulfide. .
  • thioxanthone compounds include thioxanthone, 2-methyl thioxanthone, 2-ethyl thioxanthone, 2-chloro thioxanthone, 2-isopropyl thioxanthone, 2,4-diethyl thioxanthone and the like.
  • oxime ester compounds examples include oxime ester compounds (A2) having a group represented by the above general formula (I), etc.
  • high sensitivity can be obtained by using in combination with the component (A1). As a result, it can be preferably used in the polymerizable composition of the present invention.
  • the hydrocarbon group having 1 to 20 carbon atoms represented by R 1 to R 3 in the general formula (I) is not particularly limited, but is preferably an alkyl group having 1 to 20 carbon atoms, An alkenyl group having 2 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkyl alkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms or 7 to 20 carbon atoms Represents an arylalkyl group or the like.
  • an alkyl group having 1 to 10 carbon atoms As the sensitivity when used as a polymerization initiator (A) is good, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, carbon More preferred is a cycloalkylalkyl group having 4 to 10 atoms, an aryl group having 6 to 10 carbon atoms, or an arylalkyl group having 7 to 10 carbon atoms.
  • alkyl group having 1 to 20 carbon atoms examples include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, amyl, isoamyl, tert-amyl, hexyl, heptyl, octyl and isooctyl. 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl and icosyl and the like.
  • alkyl group having 1 to 10 carbon atoms examples include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, amyl, isoamyl, tert-amyl, hexyl, heptyl, octyl and isooctyl. 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl, isodecyl and the like.
  • Examples of the above alkenyl group having 2 to 20 carbon atoms include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, 2-hexenyl, 3-hexenyl, 5-hexenyl, and the like.
  • Examples of the above alkenyl groups having 2 to 10 carbon atoms include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, 2-hexenyl, 3-hexenyl, 5-hexenyl, and the like -Heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-nonenyl, 4-decenyl and the like.
  • cycloalkyl group having 3 to 20 carbon atoms means a saturated monocyclic or saturated polycyclic alkyl group having 3 to 20 carbon atoms.
  • Examples of the cycloalkyl group having 3 to 10 carbon atoms include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, adamantyl, decahydronaphthyl, octahydropentalene and bicyclo [1. 1.1] Pentanyl and the like.
  • cycloalkyl alkyl group having 4 to 20 carbon atoms means a group having 4 to 20 carbon atoms in which the hydrogen atom of the alkyl group is substituted with a cycloalkyl group.
  • Examples of the above cycloalkyl group having 4 to 10 carbon atoms include cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclononylmethyl, 2-cyclobutylethyl, -Cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 4-cyclobutylbutyl, 4 And -cyclopentylbutyl and 4-cyclohexylbutyl and the like.
  • aryl group having 6 to 20 carbon atoms examples include one or more of phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthryl, phenanthrenyl and the like, the above alkyl group, the above alkenyl group, carboxyl group, halogen atom and the like.
  • phenyl, biphenylyl, naphthyl, anthryl and the like for example, 4-chlorophenyl, 4-carboxyphenyl, 4-vinylphenyl, 4-methylphenyl, 2,4,6-trimethylphenyl and the like can be mentioned.
  • Examples of the aryl group having 6 to 10 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl and naphthyl and the like, and phenyl substituted with one or more of the above alkyl group, the above alkenyl group, carboxyl group, halogen atom and the like.
  • biphenylyl, naphthyl, anthryl and the like for example, 4-chlorophenyl, 4-carboxyphenyl, 4-vinylphenyl, 4-methylphenyl, 2,4,6-trimethylphenyl and the like.
  • the above-mentioned arylalkyl group having 7 to 20 carbon atoms means 7 to 20 in which the hydrogen atom of the alkyl group is replaced with an aryl group having 6 to 19 carbon atoms among the above-mentioned aryl groups having 6 to 20 carbon atoms.
  • benzyl, ⁇ -methylbenzyl, ⁇ , ⁇ -dimethylbenzyl, phenylethyl and naphthylpropyl and the like can be mentioned.
  • the arylalkyl group having 7 to 10 carbon atoms is exemplified by 7 to 10 in which a hydrogen atom of the alkyl group is replaced with an aryl group having 6 to 9 carbon atoms among the aryl groups having 6 to 20 carbon atoms.
  • heterocyclic group having 2 to 20 carbon atoms is not particularly limited, and examples thereof include pyrrolyl, pyridyl, pyridylethyl, pyrimidyl, pyridazyl, piperazyl, piperidyl, pyranyl, pyranylethyl, pyrazolyl, and the like.
  • each R independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and Z represents a direct bond or an alkylene group having 1 to 6 carbon atoms. Means that the group represented by these formulas is a bond at * part.
  • Examples of the alkyl group having 1 to 6 carbon atoms represented by R in the above-mentioned formula include those having 1 to 6 carbon atoms in the above-mentioned alkyl group having 1 to 20 carbon atoms. it can.
  • the alkylene group having 1 to 6 carbon atoms represented by Z in the above formula methylene, ethylene, propylene, methylethylene, butylene, 1-methylpropylene, 2-methylpropylene, 1,2-dimethylpropylene, 1 , 3-dimethylpropylene, 1-methylbutylene, 2-methylbutylene, 3-methylbutylene, 4-methylbutylene, 2,4-dimethylbutylene, 1,3-dimethylbutylene, pentylene, hexylene, etc.
  • a compound represented by the following general formula (III) is preferably used in the polymerizable composition of the present invention since the sensitivity is particularly high.
  • R 21 and R 22 each independently represent a hydrogen atom, a nitro group, a cyano group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an arylalkyl group having 7 to 20 carbon atoms Or a group having 2 to 20 carbon atoms containing a heterocycle
  • X 1 represents an oxygen atom, a sulfur atom, a selenium atom, CR 23 R 24 , CO, NR 25 or PR 26
  • X 2 represents non-bonding, direct bonding, a hydrocarbon group having 1 to 20 carbon atoms, CO
  • R 23 to R 26 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or
  • a hydrogen atom in the group represented by R 21 to R 26 is a halogen atom, a nitro group, a cyan
  • R 21 to R 26 may be substituted by —O— or —CO— under the condition that oxygen is not adjacent to each other, R 21 to R 26 may independently form a ring together with either of adjacent benzene rings, g represents a number from 0 to 4; h represents a number of 0 to 3; )
  • the hydrocarbon group having 1 to 20 carbon atoms represented by R 23 to R 26 in the general formula (III) has 1 to 20 carbon atoms represented by R 1 to R 3 in the general formula (I) It is similar to 20 hydrocarbon groups. Further, in the general formula (III) having 1 to 20 carbon atoms represented by X 2 in Examples of the hydrocarbon group, the general formula of R 1 ⁇ 1 to 20 carbon atoms represented by R 3 in (I) The bivalent group which removed one hydrogen atom from each group mentioned as a hydrocarbon group is mentioned.
  • the alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, and the arylalkyl group having 7 to 20 carbon atoms represented by R 21 and R 22 in the general formula (III) are respectively The alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, which is an example of the hydrocarbon group having 1 to 20 carbon atoms represented by R 1 to R 3 , and the above 7 carbon atoms The same as described above for the -20 arylalkyl group.
  • the heterocyclic ring-containing group having 2 to 20 carbon atoms represented by R 21 to R 26 in the general formula (III) is a heterocyclic ring-containing carbon atom represented by R 1 and R 2 The same applies to the groups of 2 to 20.
  • Examples of the oxime ester compound (A2) include the compound No. 1 shown below. A2-1 to No. A2-14 can be mentioned. However, the oxime ester compound (A2) used in the present invention is not limited at all by the following compounds.
  • radical polymerization initiators include phosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenyl phosphine oxide and bis (cyclopentadienyl) -bis [2,6-difluoro-3- (pill-1) -Yl)] Titanocene compounds such as titanium etc. may be mentioned.
  • radical initiators include Adeka Optomer N-1414, N-1717, N-1919, Adeka Arkles NCI-831, NCI-930 (all manufactured by ADEKA Corporation); IRGACURE 184, IRGACURE 369, IRGACURE 651, IRGACURE 907, IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE 784 (above, made by BASF Corporation); TR-PBG-304, TR-PBG-305, TR-PBG-309 and TR-PBG-314 (above, made by TRONLY); Be
  • the thermal radical polymerization initiator is not particularly limited as long as it generates radicals by heating, and conventionally known compounds can be used.
  • azo compounds, peroxides and persulfates are preferable. It can be illustrated as a thing.
  • azo compounds examples include 2,2'-azobisisobutyronitrile, 2,2'-azobis (methylisobutyrate), 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'- And azobis (1-acetoxy-1-phenylethane) and the like.
  • peroxides examples include benzoyl peroxide, di-t-butyl benzoyl peroxide, t-butyl peroxypivalate and di (4-t-butylcyclohexyl) peroxy dicarbonate.
  • Persulfates include persulfates such as ammonium persulfate, sodium persulfate and potassium persulfate.
  • a polymerization initiator having a hydroxyl group is particularly preferable because it can provide a display having low liquid crystal contamination and excellent electrical characteristics.
  • compound No. 1 is a sulfur atom and X 2 is non-bonding in the general formula (III), for example, compound No. 1 described above may be used. It is an oxime ester compound having a diphenyl sulfide skeleton represented by A2-1 to A2-7, and is preferably used in combination as a polymerization initiator from the viewpoint that a polymerizable composition having good sensitivity can be obtained.
  • X 1 is NR 55 and X 2 is a direct bond in the general formula (III)
  • the compound No. 1 mentioned above may be used. It is an oxime ester compound having a carbazole skeleton represented by A2-8 to A2-14, which is particularly preferable in that a polymerizable composition having good sensitivity can be obtained.
  • the said polymerization initiator (A) can be mixed and used 1 type, or 2 or more types illustrated until now.
  • the content of the polymerization initiator (A) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali developable compound (C) And preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, and more preferably 0 based on 100 parts by mass of a total of 100 parts by mass of the ethylenically unsaturated compound (D). 3 to 5 parts by mass.
  • the content of the polymerization initiator (A) is in the above range, a polymerizable composition having excellent curability and excellent storage stability without precipitation of the polymerization initiator can be obtained, which is preferable.
  • the content of the polymerization initiator (A) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali
  • the amount is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, more preferably 0. It is 3 to 5 parts by mass.
  • the proportion of the component (A1) in the polymerization initiator (A) is preferably 30% by mass or more, and more preferably 50% by mass to 85% by mass.
  • the mass ratio of the component (A1) to the compound having a group represented by formula (I) (the former : The latter is preferably 2 to 5: 1, more preferably 2 to 3: 1.
  • pigments and dyes can be used as the colorant (B) used in the polymerizable composition of the present invention.
  • the pigment and the dye an inorganic color material or an organic color material can be used, respectively. These can be used alone or in combination of two or more.
  • the pigment means a coloring agent insoluble in a solvent described later, and among inorganic or organic coloring materials, those insoluble in a solvent, and those obtained by laked inorganic or organic dyes are also included.
  • the pigment examples include carbon black obtained by the furnace method, channel method or thermal method, carbon black such as acetylene black, ketjen black or lamp black, carbon black prepared or coated with epoxy resin, the above carbon black Prepared by dispersing the resin in a solvent in advance and coating with 20 to 200 mg / g of resin, acid or alkaline surface treatment of the carbon black, average particle diameter of 8 nm or more and DBP oil absorption of 90 ml / 100 g or less of carbon black, the total amount of oxygen calculated from CO and CO 2 in the volatile content at 950 ° C.
  • carbon black obtained by the furnace method, channel method or thermal method
  • carbon black such as acetylene black, ketjen black or lamp black
  • carbon black prepared or coated with epoxy resin the above carbon black Prepared by dispersing the resin in a solvent in advance and coating with 20 to 200 mg / g of resin, acid or alkaline surface treatment of the carbon black, average particle diameter of 8 nm or more and DBP oil absorption of 90
  • carbon black is surface area 100 m 2 per 9mg above, graphitized carbon black, graphite, activated carbon, carbon fibers, carbon nanotubes, Kabonma Black pigments represented by crocoyl, carbon nanohorn, carbon aerogel, fullerene, aniline black, pigment black 7, titanium black, lactam black and perylene black etc., chromium oxide green, miloli blue, cobalt green, cobalt blue, manganese based, ferrocyan , Phosphate blue, bitumen, ultramarine, cerulian blue, pyridinium, emerald green, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron oxide (III)), cadmium red, synthetic iron black, amber, lake pigment And organic or inorganic pigments such as
  • pigments it is preferable to use a black pigment because of high light shielding property, and it is more preferable to use an organic black pigment represented by lactam black and perylene black because of low liquid crystal contamination.
  • a commercial item can also be used as said pigment, For example, pigment red 1, 2, 3, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48, 49, 88, 90, 97 , 112, 119, 122, 123, 144, 149, 166, 168, 169, 170, 171, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223 , 224, 226, 227, 254, 228, 240 and 254; pigment orange 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64 65 and 71; pigment yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86, 93, 5, 97, 98, 100, 109, 110, 113, 114, 117, 120, 125, 126, 127, 129, 137, 138, 139, 147, 148, 150,
  • the dye examples include nitroso compounds, nitro compounds, azo compounds, diazo compounds, xanthene compounds, quinoline compounds, anthraquinone compounds, coumarin compounds, cyanine compounds, phthalocyanine compounds, isoindolinone compounds, isoindoline compounds, quinacridone compounds, anthantrone
  • examples thereof include compounds, perinone compounds, perylene compounds, diketopyrrolopyrrole compounds, thioindigo compounds, dioxazine compounds, triphenylmethane compounds, quinophthalone compounds, naphthalenetetracarboxylic acids, azo dyes, metal complex compounds of cyanine dyes, and the like.
  • the content of the colorant (B) is not particularly limited, but preferably 10 to 500 parts by weight with respect to 100 parts by weight of the following alkali developable compound (C).
  • the amount is preferably 10 to 300 parts by mass, more preferably 10 to 200 parts by mass.
  • the content of the colorant (B) is not particularly limited, but is preferably based on 100 parts by mass of the alkali developable compound (C). Is 10 to 500 parts by mass, more preferably 10 to 300 parts by mass, and still more preferably 10 to 200 parts by mass.
  • the alkali developable compound (C) according to the present invention is a compound having a hydrophilic group and exhibiting alkali developability.
  • conventionally used compounds can be used as the alkali-developable compound (C) as long as the above conditions are satisfied.
  • the hydrophilic group include a hydroxyl group, a thiol group, a carboxyl group, a sulfo group, an amino group, an amido group or a salt thereof, and the hydroxyl group and the carboxyl group are the developability of the alkali developable compound (C) to an alkali. Is preferable because it is high.
  • the preferred functional group equivalent of the hydrophilic group in the alkali developable compound (C) (the mass of the polymer compound containing one equivalent of the hydrophilic group) is 50 to 10,000.
  • the weight average molecular weight of the alkali developable compound (C) is preferably 2,000 to 10,000, and particularly preferably 3,000 to 6,000.
  • the number average molecular weight is from 1000 to 8000, in particular from 2000 to 5000.
  • the alkali developable compound (C) preferably has an acid value of 10 to 200 mg / KOH, more preferably 30 to 150 mg / KOH. If the acid value is less than 10 mg / KOH, the alkali developability may not be sufficiently obtained, and if it is more than 200 mg / KOH, production of the polymer compound may be difficult.
  • the acid value is in accordance with JIS K 0050 and JIS K 0211.
  • alkali developable compound (C) a compound represented by the above general formula (II), a copolymer of acrylic acid ester, a phenol and / or cresol novolac epoxy resin, and a polyfunctional epoxy group Polyphenylmethane type epoxy resin; epoxy acrylate resin; epoxy addition compound having a structure in which unsaturated monobasic acid is added to an epoxy compound etc. represented by the following general formula (IV); It is represented by the following general formula (IV) A resin (unsaturated compound) having a structure obtained by the esterification reaction of an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound and a polybasic acid anhydride can be used.
  • M 4 is a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, -O-, -S-, -SO 2- , -SS-, -SO-, -CO-, -OCO- or Represents a substituent selected from the group represented by the following formulas (a), (b), (c) or (d),
  • the hydrogen atom in the C1-C20 hydrocarbon group represented by M 4 may be substituted by a halogen atom, and R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 and R 38 (hereinafter also described as R 31 to R 38 ) each independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a halogen atom, and k is a number of 0 to 10, , K ⁇ 1, the plurality of R 31 to R 38 and M 4 may be identical to or different from each other. )
  • R 39 represents a hydrocarbon group having 1 to 20 carbon atoms
  • the methylene group in the group represented by R 31 to R 38 and R 40 to R 68 may be substituted by an unsaturated bond, -O- or -S-.
  • R 40 and R 41 , R 41 and R 42 , R 42 and R 43 , R 43 and R 44 , R 45 and R 46 , R 46 and R 47 , R 47 and R 48 , R 53 and R 54 , R 54 And R 55 , R 55 and R 56 , R 61 and R 62 , R 62 and R 63 , R 63 and R 64 , R 65 and R 66 , R 66 and R 67 And R 67 and R 68 may combine to form a ring, In the groups represented by (a), (b), (c) and (d), * represents a bond. )
  • a cured product obtained from the polymerizable composition is preferable because it is excellent in chemical resistance.
  • An epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the above general formula (IV); or an unsaturated monobasic acid to an epoxy compound represented by the above general formula (IV) The use of an alkali developable compound which is a reaction product obtained by the esterification reaction of an epoxy adduct compound having an adduct structure with a polybasic acid anhydride increases the sensitivity of the polymerizable composition, and the polymerizability is raised. A cured product obtained from the composition is preferred because of its excellent elastic recovery.
  • Y 7 represents a residue of unsaturated monobasic acid
  • Y 8 represents a residue of polybasic acid anhydride, * Means a bond.
  • the solvent resistance of the cured product obtained from the polymerizable composition is It is particularly preferable because it becomes good.
  • the hydrocarbon group having 1 to 20 carbon atoms represented by R 12 , R 14 , R 16 , Y 1 to Y 3 and Z 1 to Z 3 in the above general formula (II) has the general formula (I)
  • the same ones as the above-mentioned hydrocarbon group having 1 to 20 carbon atoms can be mentioned.
  • the hydrogen atom in the group represented by 14 , R 16 , Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 may be substituted, and has 2 to 20 carbon atoms containing a heterocycle
  • the same groups as the groups having 2 to 20 carbon atoms containing the heterocyclic ring described above in the description of the general formula (I) can be mentioned as the group of the above.
  • the hydrocarbon group having 1 to 20 carbon atoms represented by M 4 and R 31 to R 68 in the general formula (IV) is a carbon having 1 to 20 carbon atoms as described in the description of the general formula (I) The same thing as a hydrogen group is mentioned.
  • the halogen atom for substituting the hydrogen atom of the hydrocarbon group having 1 to 20 carbon atoms represented by M 4 in the general formula (IV) and the halogen atom represented by R 31 to R 68 include fluorine and chlorine , Bromine and iodine.
  • Examples of the ring formed by combining R 68 and R 68 include 5- to 7-membered rings such as cyclopentane, cyclohexane, cyclopentene, benzene, pyrrolidine, pyrrole, piperazine, morpholine, thiomorpholine, tetrahydropyridine, lactone ring and lactam ring And fused rings such as naphthalene and anthracene.
  • the unsaturated monobasic acid means an acid having an unsaturated bond in the structure and having one hydrogen atom per molecule which can be ionized to be a hydrogen ion.
  • the unsaturated monobasic acids include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid and hydroxyethyl methacrylate malate, hydroxypropyl methacrylate malate, hydroxypropyl acrylate malate and dicyclopentadiene malate, etc. Can be mentioned.
  • biphenyl tetracarboxylic acid dianhydride tetrahydrophthalic anhydride, succinic anhydride, biphthalic anhydride, maleic anhydride, Trimellitic anhydride, pyromellitic anhydride, 2,2'-3,3'-benzophenonetetracarboxylic acid anhydride, ethylene glycol bisanhydrotrimellitate, glycerol trisanehydrotrimellitate, hexahydrophthalic anhydride Methyltetrahydrophthalic anhydride, nadic anhydride, methyl nadic anhydride, trialkyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene -1,2-dicarboxy
  • the reaction molar ratio of the said epoxy compound, the said unsaturated monobasic acid, and the said polybasic acid anhydride be as follows. That is, it is preferable to add the above-mentioned epoxy addition compound so that the carboxyl group of the above-mentioned unsaturated monobasic acid is in a ratio of 0.1 to 1.0 per one epoxy group of the above-mentioned epoxy compound. It is preferable that the reaction product be in a ratio such that the acid anhydride structure of the polybasic acid anhydride is 0.1 to 1.0 per hydroxyl group of the epoxy adduct.
  • the reaction of the epoxy compound represented by the above general formula (IV), the above unsaturated monobasic acid and the above polybasic acid anhydride can be carried out according to a conventional method.
  • the photosensitive composition for BM and the photosensitive composition for BCS a monofunctional or polyfunctional compound is further added together with the above alkali developable compound (C).
  • Epoxy compounds can be reacted.
  • the acid value of the solid content of the above alkali developable compound (C) is preferably in the range of 5 to 120 mg KOH / g, and the amount of the monofunctional or polyfunctional epoxy compound used is selected so as to satisfy the above acid value. Is preferred.
  • glycidyl methacrylate methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, isobutyl glycidyl ether, t-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl Glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, undecyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl methacrylate, methyl
  • the above-mentioned polyfunctional epoxy compound it is preferable to use one or more compounds selected from the group consisting of bisphenol type epoxy compounds and glycidyl ethers as the above-mentioned polyfunctional epoxy compound, because a polymerizable composition having better properties can be obtained.
  • a bisphenol type epoxy compound such as a hydrogenated bisphenol type epoxy compound can also be used.
  • glycidyl ethers ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,8-octanediol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl Ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1,1-tri (glycidyloxymethyl) propane, 1,1,1-to (Glycidyloxymethyl) ethane, 1,1,1-tri (glycidyloxy
  • novolac epoxy compounds such as phenol novolac epoxy compounds, biphenyl novolac epoxy compounds, cresol novolac epoxy compounds, bisphenol A novolac epoxy compounds, dicyclopentadiene novolac epoxy compounds, etc .
  • Alicyclic epoxy such as cyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane Compounds
  • Glycidyl esters such as phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, dimer acid glycidyl ester
  • tetraglycidyl diamino acid Glycidyl amines such as phenylmethane, triglycidyl P-aminophenol, N, N-digly
  • a commercial item can also be used suitably as an alkali developable compound (C).
  • Examples of the commercially available product include SPC1000, SPC-2000, SPC-3000, SPRR-1X, SPRR-2X, SPRR-3X, SPRR-5X, SPRR-6X, SPRR-7X, SPRR-8X, SPRR-9X, and the like.
  • SPRR-10X, SPRR-11X, SPRR-12X, SPRR-13X, SPRR-14X, SPRR-15X, SPRR-16X, SPRR-17X, SPRR-18X, SPRR-19X, SPRR-20X, SPRR-21X Showa Denko KK, JET 2000, AGOR 1060, AGOR 3060, ORGA 1060, ORGA 2060 (above, Osaka Organic Chemical Company), CCR-1171H (Nippon Kayaku Co., Ltd.), and the like.
  • the content of the alkali developable compound (C) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali developable compound (C) And preferably from 10 to 90 parts by mass, more preferably from 20 to 80 parts by mass, still more preferably from 30 to 80 parts by mass, based on 100 parts by mass of the total of the above and the ethylenically unsaturated compound (D). .
  • content of an alkali developable compound (C) is in said range, it is preferable from the alkali developability of a polymeric composition being favorable.
  • the content of the alkali developable compound (C) is not particularly limited, but the polymerization initiator (A), the colorant (B), The amount is preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, still more preferably, 100 parts by mass in total of the alkali developable compound (C) and the ethylenically unsaturated compound (D). 30 to 80 parts by mass.
  • the alkali developable compound (C) contains a compound represented by the general formula (II)
  • the amount thereof is as follows: polymerization initiator (A), colorant (B), alkali developable compound (C) and The amount is preferably 10 to 60 parts by mass, more preferably 20 to 50 parts by mass, based on 100 parts by mass of the ethylenically unsaturated compound (D) in total. Further, it is obtained by an esterification reaction of an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to the epoxy compound represented by the above general formula (IV), or the epoxy addition compound and a polybasic acid anhydride.
  • the amount thereof is 100 parts by mass in total based on the polymerization initiator (A), the colorant (B), the alkali developable compound (C) and the ethylenically unsaturated compound (D).
  • it is 5 to 80 parts by mass, more preferably 5 to 40 parts by mass.
  • the above-mentioned epoxy addition compound and the content of the reaction product obtained by the esterification reaction of the epoxy addition compound with the polybasic acid anhydride refer to the case where only one of the epoxy addition compound and the reaction product is contained. If it contains both, it is the total amount.
  • the ethylenically unsaturated compound (D) used in the present invention is a compound having an ethylenically unsaturated bond and which is not the above-mentioned alkali developable compound (C).
  • Examples of the ethylenically unsaturated compound (D) include unsaturated aliphatic hydrocarbons such as ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride and tetrafluoroethylene; (meth) acrylic acid, ⁇ -Chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinylacetic acid, allylacetic acid, cinnamic acid, sorbic acid, mesaconic acid, succinic acid mono [2- (meth) acryloylate Mono (meth) acrylate of a polymer having a carboxy group and a hydroxyl group at both ends, such as hydroxyethyl, phthalic acid mono [2- (meth) acryloyloxyethyl], ⁇ -carboxypolycaprolactone mono (
  • Polyhydric alcohol or ester of polyhydric phenol Metal salt of unsaturated polybasic acid such as zinc (meth) acrylate and magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyl Tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrofuran Phthalic anhydride-Male anhydride Acid anhydride, acid anhydride of unsaturated polybasic acid such as dodecenyl succinic anhydride, methyl hymic acid anhydride; (meth) acrylamide, methylene bis (meth) acrylamide, diethylene triamine tris (meth) acrylamide, xylylene bis (meth)
  • a commercial item can also be used as said ethylenically unsaturated compound.
  • Examples of the commercially available product include Kayalad DPHA, DPEA-12, PEG400DA, THE-330, RP-1040, NPGDA, PET30, R-684 (manufactured by Nippon Kayaku Co., Ltd.); Alonix M-215, M-350.
  • NK ester A-DPH, A-TMPT, A-DCP, A-HD-N, TMPT, DCP, NPG and HD-N all available from Shin-Nakamura Chemical Co., Ltd.
  • the content of the ethylenically unsaturated compound (D) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali developable compound (C) 1 to 50 parts by mass, more preferably 1 to 30 parts by mass, and still more preferably 5 to 20 parts by mass, based on 100 parts by mass of the total of the ethylenic unsaturated compounds (D) is there.
  • content of an ethylenically unsaturated compound (D) is in said range, since the hardened
  • the content of the ethylenically unsaturated compound (D) is not particularly limited, but the polymerization initiator (A), the colorant (B)
  • the ethylenically unsaturated compound (D) is preferably 1 to 50 parts by mass, more preferably 1 to 50 parts by mass with respect to a total of 100 parts by mass of the alkali developable compound (C) and the ethylenically unsaturated compound (D).
  • the amount is 30 parts by mass, more preferably 5 to 20 parts by mass.
  • a solvent can be further added to the polymerizable composition of the present invention.
  • the solvent usually, the above-mentioned respective components (polymerization initiator (A), coloring agent (B), alkali developable compound (C) and ethylenic unsaturated compound (D), etc.) are dissolved or optionally, if necessary. Dispersible solvents can be used.
  • ketone solvents such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2- Ether solvents such as diethoxyethane and dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, 3-methoxybutyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate and the like Ester solvents such as texanol; cellosolv solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl
  • ketone solvents, ester solvents, ether ester solvents, etc. in particular cyclohexanone, 3-methoxybutyl acetate, dimethyl succinate and PGMEA etc., have good compatibility between the resist and the polymerization initiator in the polymerizable composition. preferable.
  • a combination of PGMEA, 3-methoxybutyl acetate and dimethyl succinate is preferable because a uniform coated surface can be obtained, so that the weight ratio of the above solvent (PGMEA: 3-methoxybutyl acetate: dimethyl succinate) is 15 to 25.
  • the case of 2 to 5: 1 is particularly preferred.
  • the content of the solvent is not particularly limited, but it is preferably 30 to 95% by mass in 100% by mass of the total amount of the polymerizable composition, more preferably 50 It is ⁇ 95 mass%.
  • the handling property viscosity and wettability of the polymerizable composition
  • unevenness of drying reduction and liquid stability without precipitation and sedimentation of components contained in the composition
  • the thickness of the cured product can be appropriately controlled when obtaining the cured product.
  • an epoxy compound an alkali developability imparting agent, a dispersant, a latent additive, an organic polymer, an inorganic compound, a coupling agent, a chain transfer agent, and a sensitization.
  • Polymerization inhibitors such as surfactants, surfactants and melamine compounds, p-anisole, hydroquinone, pyrocatechol, t-butyl catechol and phenothiazine; plasticizers; adhesion promoters; fillers; antifoams; leveling agents; Antioxidants; UV absorbers; dispersing aids; flocculants; catalysts; effect accelerators; crosslinking agents; conventional additives such as thickeners may be added.
  • Examples of the above epoxy compounds include methyl glycidyl ether, 2-ethylhexyl glycidyl ether, butyl glycidyl ether, decyl glycidyl ether, C12 to 13 mixed alkyl glycidyl ether, phenyl 2-methyl glycidyl ether, cetyl glycidyl ether, stearyl glycidyl ether, Glycidyl methacrylate, isopropyl glycidyl ether, allyl glycidyl ether, ethyl glycidyl ether, 2-methyloctyl glycidyl ether, phenyl glycidyl ether, 4-n-butylphenyl glycidyl ether, 4-phenylphenol glycidyl ether, cresyl glycidyl ether, dibromocresyl Glycidy
  • An epoxidized polyolefin can also be used as said epoxy compound.
  • the epoxidized polyolefin is a polyolefin in which an epoxy group is introduced by modifying the polyolefin with an epoxy group-containing monomer. Producing by copolymerizing ethylene or an ⁇ -olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer, and, if necessary, another monomer by either a copolymerization method or a graft method it can. Ethylene or an ⁇ -olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer and another monomer may be polymerized alone or in combination with other monomers.
  • the double bond of a non-conjugated polybutadiene having a hydroxyl group at the end can be obtained by epoxidation by the peracetic acid method, and one having a hydroxyl group in the molecule may be used.
  • a hydroxyl group can be urethane-ized with isocyanate, and a primary hydroxyl group-containing epoxy compound can be made to react here, and an epoxy group can be introduce
  • ethylene or ⁇ -olefins of 3 to 20 carbon atoms examples include ethylene, propylene, butylene, isobutylene, 1,3-butadiene, 1,4-butadiene, 1,3-pentadiene, 2,3-dimethyl-1,3 -Butadiene, piperylene, 3-butyl-1,3-octadiene, isoprene and the like can be mentioned.
  • Examples of the epoxy group-containing monomer include glycidyl esters of ⁇ , ⁇ -unsaturated acids, vinyl benzyl glycidyl ether and allyl glycidyl ether.
  • Specific examples of glycidyl esters of ⁇ , ⁇ -unsaturated acids include glycidyl acrylate, glycidyl methacrylate and glycidyl ethacrylic acid, with glycidyl methacrylate being particularly preferred.
  • a commercial item can also be used as said epoxy compound.
  • Suitable commercial products include, for example, Epolight 40E, 1500 NP, 1600, 80 MF, 4000 and 3002 (all, manufactured by Kyoeisha Chemical Co., Ltd.); Adeka Glycyrol ED-503, ED-503 D, ED-503 G, ED-523 T, ED -513, ED-501, ED-502, ED-509, ED-518, ED-529, Adeka Resin EP-4000, EP-4005, EP-4080 and EP-4085 (all from Adeka); Denacol EX- 201, EX-203, EX-211, EX-212, EX-221, EX-251, EX-252, EX-711, EX-721, Denacol EX-111, EX-121, EX-141, EX-142 , EX-145, EX-146, EX-147, EX-171, EX-192 and EX-731 (above, Nagase
  • the above-mentioned alkali developing property imparting agent is a compound which does not have radical polymerizability and imparts alkali developing property, and as such a compound, it is a compound which is soluble in an aqueous alkali solution by having an acid value.
  • alkali-soluble novolak resins hereinafter simply referred to as "novolak resins" are mentioned as typical ones. Novolak resins are obtained by polycondensation of phenols and aldehydes in the presence of an acid catalyst.
  • phenols examples include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butylphenol, 3-xylenol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, p-phenylphenol, hydroquinone, catechol, resorcinol, 2- Methyl resorcinol, pyrogallol, ⁇ -naphthol, bisphenol A, dihydroxybenzoic acid ester, gallic acid ester and the like are used.
  • phenol, o-cresol, m-cresol, p-cresol, 2,5- Shirenoru, 3,5-xylenol, 2,3,5-trimethylphenol, resorcinol, 2-methyl resorcinol and bisphenol A are preferable.
  • These phenols may be used alone or in combination of two or more.
  • aldehyde examples include formaldehyde, paraformaldehyde, acetaldehyde, propylaldehyde, benzaldehyde, phenylacetaldehyde, ⁇ -phenylpropylaldehyde, ⁇ -phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o -Chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methyl benzaldehyde, m-methyl benzaldehyde, p-methyl benzaldehyde, p-ethyl benzaldehyde and p -N-butyl
  • Aldehyde, acetaldehyde and benzaldehyde are used, and of these compounds Aldehyde, acetaldehyde and benzaldehyde are preferred. These aldehydes may be used alone or in combination of two or more. The aldehydes are preferably used in a proportion of 0.7 to 3 moles, particularly preferably 0.7 to 2 moles, per mole of phenols.
  • an inorganic acid such as hydrochloric acid, nitric acid or sulfuric acid, or an organic acid such as formic acid, oxalic acid or acetic acid is used.
  • the amount of these acid catalysts used is preferably 1 ⁇ 10 -4 to 5 ⁇ 10 -1 mol per mole of phenol.
  • water is usually used as the reaction medium, but when the phenols used in the condensation reaction do not dissolve in the aqueous solution of aldehydes and become heterogeneous from the initial stage of the reaction, they are hydrophilic as the reaction medium Solvents can also be used.
  • hydrophilic solvents include, for example, alcohols such as methanol, ethanol, propanol and butanol, or cyclic ethers such as tetrahydrofuran and dioxane.
  • the amount of the reaction medium used is usually 20 to 1000 parts by mass per 100 parts by mass of the reaction raw material.
  • the reaction temperature of the condensation reaction can be appropriately adjusted depending on the reactivity of the reaction raw material, but it is usually 10 to 200 ° C., preferably 70 to 150 ° C. After completion of the condensation reaction, the internal temperature is generally raised to 130 to 230 ° C.
  • the reaction mixture is dissolved in the hydrophilic solvent and added to a precipitant such as water, n-hexane and n-heptane to precipitate the novolac resin, and the precipitate is separated and dried by heating. It can also be collected by
  • polyhydroxystyrene or a derivative thereof, styrene-maleic anhydride copolymer, polyvinyl hydroxybenzoate and the like can be mentioned.
  • any dispersant may be used as the dispersant, as long as it can disperse and stabilize the colorant (B), and commercially available dispersants such as BYK series manufactured by Bick Chemie Co., Ltd. can be used, and polyester having a basic functional group ,
  • a polymer dispersant comprising a polyether, a polyurethane, a nitrogen atom as a basic functional group, and a functional group having a nitrogen atom is an amine and / or a quaternary salt thereof, and has an amine value of 1 to 100 mg KOH / g Is preferably used.
  • the latent additive is inert at room temperature, in the light exposure step and the pre-bake step, and is heated at 100 to 250 ° C. or protected at 80 to 200 ° C. in the presence of an acid / base catalyst. Is to be desorbed and activated. As an effect obtained by having activated, oxidation prevention, ultraviolet-ray absorption, antifouling property, recoat property, adhesiveness, etc. are mentioned. As the latent additive, those described in WO 2014/021023 can be preferably used.
  • a commercial item can be used as the latent additive, and examples thereof include Adeka Arkles GPA-5001 and the like.
  • organic polymer examples include polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymer, poly (meth) acrylic acid, styrene-(meth) acrylic acid copolymer, (meth) acrylic acid-methyl methacrylate Copolymer, ethylene-vinyl chloride copolymer, ethylene-vinyl copolymer, polyvinyl chloride resin, ABS resin, nylon 6, nylon 66, nylon 12, urethane resin, polycarbonate polyvinyl butyral, cellulose ester, polyacrylamide, saturated Polyester, phenol resin, phenoxy resin, polyamide imide resin, polyamic acid resin, epoxy resin, etc. may be mentioned.
  • polystyrene, (meth) acrylic acid-methyl methacrylate copolymer, epoxy resin Masui polystyrene, (meth) acrylic acid-methyl methacrylate copolymer, epoxy resin Masui.
  • the properties of the cured product can also be improved by using the organic polymer together with the alkali developable compound (C).
  • the amount thereof used is preferably 10 to 500 parts by mass with respect to 100 parts by mass of the alkali developable compound (C).
  • Examples of the above-mentioned inorganic compounds include nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, metal oxides such as silica and alumina; layered clay mineral, miloli blue, calcium carbonate, Magnesium carbonate, cobalt, manganese, glass powder, mica, talc, kaolin, ferrocyanide, various metal sulfates, sulfides, selenide, aluminum silicate, calcium silicate, aluminum silicate, aluminum hydroxide, platinum, gold, silver and copper Among these, titanium oxide, silica, layered clay minerals, silver and the like are preferable.
  • an inorganic compound in the polymerizable composition of the present invention, it can be used as a photosensitive paste composition.
  • the photosensitive paste composition is used to form fired product patterns such as partition patterns, dielectric patterns, electrode patterns and black matrix patterns of plasma display panels.
  • These inorganic compounds are also suitably used as, for example, fillers, antireflective agents, conductive agents, stabilizers, flame retardants, mechanical strength improvers, special wavelength absorbers, ink repellents, and the like.
  • the content of the inorganic compound is preferably 0.1 to 50 parts by mass, relative to 100 parts by mass of the alkali developable compound (C).
  • the amount is preferably 0.5 to 20 parts by mass, and these inorganic compounds may be used alone or in combination of two or more.
  • Examples of the coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane and the like.
  • Alkenyl functional alkoxysilanes such as alkyl functional alkoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane, etc.
  • a commercial item can be used as said coupling agent, For example, KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-403, KBM- 502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-9103, KBM-573, KBM-575, KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007, KBM-04, KBE-04, KBM-13, KBE-13, KBE-22, KBE-KBE 103, HMDS-3, KBM-3063, KBM-3103C, KP -3504 and KF-99 (or, Shin-Etsu Silicone Co., Ltd.).
  • a sulfur atom-containing compound is generally used as the chain transfer agent and the sensitizer.
  • the pattern of the cured product obtained by adding the above-mentioned chain transfer agent and sensitizer becomes high definition.
  • the surfactant examples include fluorine surfactants such as perfluoroalkyl phosphates and perfluoroalkyl carboxylates, anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates and alkyl sulfates, and higher amines Cationic surfactants such as halides and quaternary ammonium salts, polyethylene glycol alkyl ethers, polyethylene glycol fatty acid esters, sorbitan fatty acid esters, nonionic surfactants such as fatty acid monoglycerides, amphoteric surfactants and silicone surfactants Surfactants such as agents can be used, and these may be used in combination.
  • fluorine surfactants such as perfluoroalkyl phosphates and perfluoroalkyl carboxylates
  • anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates and alkyl sulfates
  • Examples of the melamine compound, (poly) methylol melamine, (poly) methylol glycoluril, all or part of the (poly) methylol benzoguanamine and (poly) active methylol groups of the nitrogen compound such as methylol urea (CH 2 OH groups) Mention may be made of compounds in which (at least two) are alkyletherified.
  • examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group and a butyl group, which may be identical to or different from each other.
  • the methylol group which is not alkyletherified may be self-condensing within one molecule, or may be condensed between two molecules to form an oligomer component as a result.
  • hexamethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylglycoluril and tetrabutoxymethylglycoluril can be used.
  • alkyletherified melamines such as hexamethoxymethylmelamine and hexabutoxymethylmelamine are preferable.
  • the content of optional components other than the polymerization initiator (A), the colorant (B), the alkali developing compound (C), the ethylenically unsaturated compound (D), the solvent and the inorganic compound Is appropriately selected depending on the purpose of use, and is not particularly limited as long as the effects of the present invention are not impaired, but preferably, polymerization initiator (A), colorant (B), alkali developable compound (C)
  • the total amount is 20 parts by mass or less based on 100 parts by mass of the total of 100 parts by mass of the ethylenically unsaturated compound (D).
  • the photosensitive composition for BM according to the present invention contains, as essential components, a polymerization initiator (A), a colorant (B), an alkali developing compound (C) and an ethylenically unsaturated compound (D), and is photosensitive. And alkali developability, and is a composition particularly suitable for forming a BM.
  • the photosensitive composition for BCS of the present invention contains, as essential components, a polymerization initiator (A), a colorant (B), an alkali developable compound (C) and an ethylenically unsaturated compound (D), and is photosensitive. And alkali developability, and is a composition particularly suitable for forming BCS.
  • the polymerizable composition of the present invention, the photosensitive composition for BM or the photosensitive composition for BCS and the cured product are curable paint, varnish, curable adhesive, printed circuit board, display device (color TV, PC monitor, Color filters in color display liquid crystal display panels such as portable information terminals and digital cameras, color filters for various display applications, color filters for CCD image sensors, touch panels, electroluminescent display devices (partition materials for micro LEDs), plasma display Manufacturing process of panel, organic EL black partition, powder coating, printing ink, printing plate, adhesive, gel coat, photoresist for electronics, electroplating resist, etching resist, solder resist, insulating film, black matrix, and LCD Resists to form structures in Composition for Encapsulating Electronic Component, Solder Resist, Magnetic Recording Material, Micro Mechanical Component, Waveguide, Optical Switch, Plating Mask, Etching Mask, Color Test System, Glass Fiber Cable Coating, Stencil for Screen Printing, Stereolithograph Materials for producing three-dimensional objects, materials for holographic recording, image recording
  • the display device of the present invention has the same structure as a conventionally known display device except that it comprises the cured product of the present invention (in particular, BCS), but BCS may be provided between cells.
  • BCS the cured product of the present invention
  • an alkali developable compound having a weight average molecular weight of 5000 or more may be used because the pattern shape is verticalized, the development adhesion is improved, and the heat resistance is improved. It is preferable to use an alkali developable compound having a weight average molecular weight of 7000 to 15,000. Further, it is obtained by an esterification reaction between an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the above general formula (IV), and an polybasic acid anhydride. Particularly preferred is the unsaturated compound having the following structure.
  • the polymerizable composition of the present invention, the photosensitive composition for BM and the photosensitive composition for BCS can be prepared by a known method such as spin coater, roll coater, bar coater, die coater, curtain coater, various printing, immersion and the like. It can be applied on a supporting substrate such as soda glass, quartz glass, semiconductor substrate, metal, paper, plastic and the like. In addition, once applied on a supporting substrate such as a film, it can be transferred onto another supporting substrate, and the method of application is not limited.
  • an ultra high pressure mercury lamp As a light source of energy rays used when curing the polymerizable composition of the present invention and the photosensitive composition for BCS, an ultra high pressure mercury lamp, a high pressure mercury lamp, a medium pressure mercury lamp, a low pressure mercury lamp, mercury vapor Electromagnetic wave energy or electron beam having a wavelength of 2000 angstrom to 7000 angstrom obtained from arc lamp, xenon arc lamp, carbon arc lamp, metal halide lamp, fluorescent lamp, tungsten lamp, excimer lamp, germicidal lamp, light emitting diode, CRT light source etc.
  • high energy rays such as X-rays and radiation
  • ultra-high pressure mercury lamps that emit light with a wavelength of 300 to 450 nm
  • mercury vapor arc lamps that emit light with a wavelength of 300 to 450 nm
  • carbon arc lamps preferably, xenon arc lamps and the like
  • xenon arc lamps preferably, xenon arc lamps and the like.
  • a laser direct writing method of directly forming an image from digital information of a computer or the like without using a mask improves not only productivity but also resolution and positional accuracy. It is useful because it can also be used, and light with a wavelength of 340 to 430 nm is suitably used as the laser light, but excimer lasers, nitrogen lasers, argon ion lasers, helium cadmium lasers, helium neon lasers, krypton ion lasers Also usable are those emitting light in the visible to infrared region such as various semiconductor lasers and YAG lasers. When using these lasers, sensitizing dyes that absorb the relevant region of visible to infrared are added.
  • the cured products of the present invention are particularly useful as BCS.
  • a multi-tone mask such as a halftone mask or a gray scale mask can also be used.
  • 0.3 mm diameter zirconia beads are added in the same weight as the dispersion (the mixture minus the solvent PGMEA) and painted for 6 hours at a temperature of 25 to 60 ° C. After the dispersion was treated with a shaker, the zirconia beads were removed using a filter to obtain a dispersion. PGMEA was added to the obtained dispersion, and the dispersion concentration was adjusted to 20% by mass, and after making uniform with a stirrer, lactam black dispersion B-1 was obtained.
  • Preparation Example 2 Preparation of Perylene Black Dispersion B-2 Organic Black Pigment [C. I. Pigment black 31 (PalIogenBlackS0084; manufactured by BASF Corp.)], dispersant (BYK-167) and polymer for dispersion (alkaline developable compound PGMEA solution C-2 described later) each in 12 parts by mass, 3.6 parts After mixing in parts by mass and 8 parts by mass, propylene glycol monomethyl ether acetate (PGMEA) was weighed and added to this mixture so as to have a solid content concentration of 25% by mass to prepare a mixture.
  • PGMEA propylene glycol monomethyl ether acetate
  • a stirrer After the above mixture is premixed with a stirrer, 0.3 mm diameter zirconia beads are added in the same weight as the dispersion (the mixture minus the solvent PGMEA) and painted for 6 hours at a temperature of 25 to 60 ° C. After the dispersion was treated with a shaker, the zirconia beads were removed using a filter to obtain a dispersion. PGMEA was added to the obtained dispersion, and the dispersion concentration was adjusted to 20% by mass, and after making uniform using a stirrer, a perylene black dispersion B-2 was obtained.
  • Preparation Example 3 Preparation of Carbon Black Dispersion B-3 20 parts by mass of MA100 (manufactured by Mitsubishi Chemical Corporation) as carbon black, and 12.5 parts by mass of BYK 161 (manufactured by BIC Chemie (BYK)) as a dispersing agent (solid content concentration 40 mass%) and 67.5 parts by mass of propylene glycol monomethyl ether acetate as a solvent were mixed and treated by a bead mill to prepare carbon black dispersion liquid B-3.
  • MA100 manufactured by Mitsubishi Chemical Corporation
  • BYK 161 manufactured by BIC Chemie (BYK)
  • the mixture was cooled to room temperature, 25.9 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride and 1.37 g of PGMEA were added, and the mixture was stirred at 100 ° C. for 5 hours. Furthermore, 30.0 g of 9,9-bis (4-glycidyloxyphenyl) fluorene, 0.269 g of 2,6-di-t-butyl-p-cresol, and 1.50 g of PGMEA are added, and the mixture is heated at 90 ° C. for 90 minutes.
  • A2-14 [polymerization initiator belonging to (A2) component] A3-1 IRGACURE 907 ( ⁇ -Aminoacetophenone compound having no hydroxyl group; manufactured by BASF) B-1 Lactam black dispersion B-1 B-2 Perylene Black Dispersion B-2 B-3 Carbon Black Dispersion B-3 C-1 CCR-1171H (Alkali Developing Compound PGMEA Solution Represented by General Formula (II) Solid Content 69.5% by Mass; Nippon Kayaku Co., Ltd.
  • the polymerizable compositions of Examples 1 to 14 and the comparative polymerizable compositions of Comparative Examples 1 to 5 are applied by spin coating (3 ⁇ m thickness, 300 rpm ⁇ 7 seconds) on a glass substrate and dried for 100 seconds at 90 ° C. After pre-baking and removing the solvent, after exposure with a photomask using a high pressure mercury lamp at 100 mJ / cm 2 and development using a 0.04 mass% KOH aqueous solution, 30 at 230 ° C. Heated for a minute to create a pattern. A 20 ⁇ m portion of the obtained pattern was subjected to a load-unload test at 40 mN using a Shimadzu dynamic microhardness tester DUH-211.
  • the elastic recovery rate (%) was calculated by the following formula.
  • Elastic recovery rate (%) [(recovery distance / compression displacement) x 100]
  • a cured product having an elastic recovery rate (%) of 60% or more can be used as BCS, a cured product having an elastic recovery rate (%) of 70% or more can be preferably used as BCS, and an elastic recovery rate Cured products having (%) of 80% or more can be particularly preferably used as BCS.
  • OD value The polymerizable compositions of Examples 1 to 14 and the comparative polymerizable compositions of Comparative Examples 1 to 5 were spin-coated (300 rpm, 7 seconds) and dried on a glass substrate, and then prebaked at 90 ° C. for 100 seconds. . After exposure using an ultra-high pressure mercury lamp as a light source, a cured product was formed by baking at 230 ° C. for 30 minutes. The OD value of the obtained film was measured using a Macbeth permeation densitometer, and the OD value was divided by the film thickness after post-baking to calculate the OD value per film thickness.
  • a cured product having an OD value per film thickness of 1.0 or more can be used as a BCS because the light shielding property is high, and a cured product having an OD value per film thickness of 1.5 or more is preferably used as a BCS
  • a cured product having an OD value per film thickness of 2.0 or more can be particularly preferably used as BCS.
  • a cured product having an OD value of less than 1.0 per film thickness can not be used as a BCS.
  • a cured product having a dielectric constant of less than 5.0 can be used as BCS, a cured product having a dielectric constant of 4.5 or less can be preferably used as a BCS, and a cured product having a dielectric constant of 4.0 or less It can be particularly preferably used as BCS.
  • a cured product having a relative dielectric constant of 5.0 or more can not be used as a BCS.
  • VHR The polymerizable compositions obtained in Examples 1 to 14 and the comparative polymerizable compositions obtained in Comparative Examples 1 to 5 were coated on a glass substrate (100 mm ⁇ 100 mm) using a spin coater and at 90 ° C. Pre-baking was performed for 100 seconds to form a coating having a thickness of 3.0 ⁇ m. Then, using a mirror projection aligner (product name: TME-150RTO, manufactured by Topcon Co., Ltd.), the coating film was irradiated with ultraviolet light at an irradiation amount of 200 mJ / cm 2 without using a mask. Thereafter, post-baking was performed at 230 ° C. for 30 minutes.
  • the liquid crystal composition was injected into a TN cell for liquid crystal evaluation (cell thickness 5 ⁇ m, electrode area 8 mm ⁇ 8 mm alignment film JALS 2096), and VHR was measured using VHR-1A (manufactured by Toyo Corporation).
  • Cured products with VHR of 90% or more are low in liquid crystal stain and can be used as BCS, and cured products with VHR of 95% or more can be preferably used as BCS, and VHR is 98 or less. % Or more of the cured product can be particularly preferably used as BCS. Cured products with VHR less than 90% can not be used as BCS.
  • NMP chemical resistance The N-methyl pyrrolidone (NMP) dissolution test was performed according to the following procedure. First, the prepared polymerizable compositions obtained in Examples 1 to 14 and the comparative polymerizable compositions obtained in Comparative Examples 1 to 5 were treated with a spin coater to obtain a glass substrate with a final film thickness of 3 ⁇ m. And dried for 1 minute and then dried on a hot plate at 90.degree. C. for 120 seconds. After exposure with a high-pressure mercury lamp at 50 mJ / cm 2 and development, the substrate was heated at an oven temperature of 230 ° C. for 40 minutes to obtain a resist coated substrate.
  • NMP N-methyl pyrrolidone
  • NMP N-methylpyrrolidone
  • a halogen lamp and a deuterium lamp (switching wavelength: 360 nm) are used as a light source, and a photomar is used as a detector, and a slit width of 2 nm is used as a measurement condition.
  • the sample solution is placed in a 1 cm square quartz cell and measured.
  • Absorbance is a dimensionless quantity that indicates how much the light intensity attenuates when light passes through an object in spectroscopy, and is defined by the following equation.
  • a (absorbance) -log 10 (I / I 0 ) (I: transmitted light intensity, I 0 : incident light intensity)
  • the incident light intensity and the transmitted light intensity described above are the light intensity I 0 transmitted through NMP alone and the light intensity I transmitted through the sample solution when light is made incident respectively to the sample solution and NMP alone from the same light source It can be considered. Therefore, (I / I 0 ) in the above equation represents the light transmittance, and the absorbance A is a value obtained by logarithmically expressing the reciprocal of the transmittance.
  • the absorbance A is a notation used when calculating the concentration or the like of a substance contained in a sample solution.
  • the spectral area (nm) of the measured absorbance was calculated, and the evaluation was performed based on the following criteria.
  • NMP chemical resistance evaluation criteria Determination by the area value of the absorption spectrum of NMP elution solution (wavelength 300 to 800 nm) ⁇ : less than 20 (nm) ⁇ : 20 (nm) or more and 60 (nm) or less ⁇ : 60 (nm) or more NMP chemical resistance evaluation is ⁇ that can be particularly preferably used as BCS, those that are ⁇ , Can be used as BCS, those of x can not be used as BCS.
  • the spectral area of the absorbance which is the evaluation criterion, can be represented by the sum of absorbance at each wavelength, and means the sum of the eluted resist components.
  • the cured product obtained from the polymerizable composition of the present invention has a light shielding property (OD value), a relative dielectric constant, low liquid crystal contamination (VHR), and chemical resistance. It is useful as BCS because it has excellent elasticity recovery rate after satisfying the properties at a high level.
  • the cured product obtained from the polymerizable composition of the present invention, the photosensitive composition for BM or the photosensitive composition for BCS is excellent in elastic recovery, light shielding property, chemical resistance, low dielectric constant, and good electrical characteristics. It is a cured product, particularly suitable for BCS. The cured product is particularly useful for display devices and the like.

Abstract

A polymerizable composition according to the present invention is a polymerizable composition containing a polymerization initiator (A), a coloring agent (B), an alkali-developable compound (C) and an ethylenically unsaturated compound (D) excluding the alkali-developable compound (C), wherein the polymerization initiator (A) includes an α-aminoacetophenone compound (A1) having a hydroxyl group. It is preferred that the polymerization initiator (A) also includes an oxime ester compound (A2) having a group represented by general formula (I) in addition to the α-aminoacetophenone compound (A1) having a hydroxyl group. (With respect to the definitions for the symbols in the formula, see the description.)

Description

重合性組成物、ブラックマトリクス用感光性組成物及びブラックカラムスペーサ用感光性組成物Polymerizable composition, photosensitive composition for black matrix, and photosensitive composition for black column spacer
 本発明は、重合開始剤として水酸基を有するα-アミノアセトフェノン化合物を含有し、更に、着色剤、アルカリ現像性化合物及びアルカリ現像性化合物を除くエチレン性不飽和化合物を含有する重合性組成物に関する。また、本発明はこの組成物を含有するブラックマトリクス(以下、BMとも記載)用感光性組成物及びブラックカラムスペーサ(以下、BCSとも記載)用感光性組成物並びにこれらの組成物から得られる硬化物に関する。 The present invention relates to a polymerizable composition containing an α-aminoacetophenone compound having a hydroxyl group as a polymerization initiator, and further containing an ethylenic unsaturated compound excluding a coloring agent, an alkali developable compound and an alkali developable compound. The present invention also relates to a photosensitive composition for a black matrix (hereinafter also described as BM) containing this composition, a photosensitive composition for a black column spacer (hereinafter also described as BCS), and a cured composition obtained from these compositions Related to things.
 液晶表示装置、有機EL表示装置等のディスプレイ表示装置において、セルの上部と下部の基板間の距離を保持するためにスペーサが用いられている。 In display devices such as liquid crystal display devices and organic EL display devices, a spacer is used to maintain the distance between the upper and lower substrates of the cell.
 スペーサは、重合性組成物を基板に塗布し、所定のマスクを介して露光した後現像することにより形成される。近年、カラムスペーサ及びブラックマトリクスを1つのモジュールに統合し、遮光性を持たせたBCSが用いられている The spacer is formed by applying the polymerizable composition to the substrate, exposing it through a predetermined mask and developing it. In recent years, BCS has been used that integrates a column spacer and a black matrix into one module and has a light shielding property.
 特許文献1には、αーアミノアルキルフェノン化合物を含有する感光性ソルダーレジスト用光重合開始剤が記載されている。特許文献2には、酸性基を導入する処理を施されたカーボンブラックを含有する、比誘電率の低いBCSを形成することができるBCS形成用感光性樹脂組成物が記載されている。特許文献3には、共重合体、エポキシ樹脂化合物又はそれから誘導された化合物、並びに黒色着色剤及び青色着色剤を含む着色剤を含有する、良好な弾性回復率を示すBCSを形成することができる着色感光性樹脂組成物が記載されている。 Patent Document 1 describes a photopolymerization initiator for a photosensitive solder resist containing an α-aminoalkylphenone compound. Patent Document 2 describes a photosensitive resin composition for BCS formation which can form a BCS having a low relative dielectric constant, which contains carbon black subjected to a treatment for introducing an acidic group. Patent Document 3 can form a BCS showing a good elastic recovery, containing a copolymer, an epoxy resin compound or a compound derived therefrom, and a colorant containing a black colorant and a blue colorant. A colored photosensitive resin composition is described.
特開2016-090857号公報JP, 2016-090857, A 特開2015-093986号公報JP, 2015-093986, A 特開2014-146029号公報JP, 2014-146029, A
 本発明が解決しようとする課題は、弾性回復、遮光性、耐薬品性に優れ、誘電率が低く、電気特性が良好な硬化物(特にBCS)がこれまでなかったということである。 The problem to be solved by the present invention is that there has been no cured product (especially BCS) which is excellent in elastic recovery, light shielding property, chemical resistance, low in dielectric constant and good in electric characteristics.
 従って、本発明の目的は、弾性回復、遮光性、耐薬品性に優れ、誘電率が低く、電気特性が良好な硬化物が得られる重合性組成物、BM用感光性組成物及びBCS用感光性組成物を提供することにある。また、該重合性組成物、該BM用感光性組成物及び該BCS用感光性組成物より得られる硬化物、該硬化物を含有するディスプレイ表示装置、及び該硬化物を製造する方法を提供することにある。 Accordingly, the object of the present invention is to provide a polymerizable composition which is excellent in elastic recovery, light shielding property and chemical resistance, has a low dielectric constant and has a good electrical property, a photosensitive composition for BM and a photosensitive for BCS. It is providing a sex composition. The present invention also provides the polymerizable composition, the photosensitive composition for the BM, a cured product obtained from the photosensitive composition for the BCS, a display device containing the cured product, and a method for producing the cured product. It is.
 本発明は、鋭意検討の末、下記[1]~[9]を提供することにより、上記目的を達成したものである。 The present invention achieves the above object by providing the following [1] to [9] after earnest study.
[1]重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及び該アルカリ現像性化合物(C)を除くエチレン性不飽和化合物(D)を含有する重合性組成物であって、
 上記重合開始剤(A)が水酸基を有するα-アミノアセトフェノン化合物(A1)を含有する重合性組成物。
[1] A polymerizable composition containing a polymerization initiator (A), a colorant (B), an alkali developable compound (C) and an ethylenically unsaturated compound (D) excluding the alkali developable compound (C) There,
A polymerizable composition, wherein the polymerization initiator (A) contains an α-aminoacetophenone compound (A1) having a hydroxyl group.
[2]上記重合開始剤(A)が、更に下記一般式(I)で表される基を有するオキシムエステル化合物(A2)を含有する重合開始剤である[1]に記載の重合性組成物。 [2] The polymerizable composition according to [1], wherein the polymerization initiator (A) is a polymerization initiator further containing an oxime ester compound (A2) having a group represented by the following general formula (I) .
Figure JPOXMLDOC01-appb-C000003
(式中、R及びRは、それぞれ独立に水素原子、ハロゲン原子、ニトロ基、シアノ基、炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
 R及びRで表される基中の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、ビニルエーテル基、メルカプト基、イソシアネート基又は複素環を含有する炭素原子数2~20の基で置換される場合があり、R及びRで表される基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-NR-、-NRCO-、-S-、-CS-、-SO-、-SCO-、-COS-、-OCS-、不飽和結合又はCSO-で置換される場合があり、
 Rは、水素原子、炭素原子数1~20の炭化水素基を表し、
 mは0又は1を表し、
 式中の*は、結合手を表す。)
Figure JPOXMLDOC01-appb-C000003
(Wherein, R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a heterocycle) Represents
The hydrogen atom in the group represented by R 1 and R 2 is a halogen atom, nitro group, cyano group, hydroxyl group, amino group, carboxyl group, methacryloyl group, acryloyl group, epoxy group, vinyl group, vinyl ether group, mercapto group, It may be substituted with an isocyanate group or a group having 2 to 20 carbon atoms containing a heterocycle, and the methylene group in the groups represented by R 1 and R 2 is —O—, —CO—, —COO— , -OCO -, - NR 3 - , - NR 3 CO -, - S -, - CS -, - SO 2 -, - SCO -, - COS -, - OCS-, substituted with an unsaturated bond or CSO- In some cases,
R 3 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms,
m represents 0 or 1;
* In the formula represents a bond. )
[3]着色剤(B)が黒色顔料である[1]又は[2]に記載の重合性組成物。 [3] The polymerizable composition according to [1] or [2], wherein the colorant (B) is a black pigment.
[4]アルカリ現像性化合物(C)が、下記一般式(II)で表されるアルカリ現像性化合物である請求項[1]~[3]の何れか一項に記載の重合性組成物。 [4] The polymerizable composition according to any one of [1] to [3], wherein the alkali developable compound (C) is an alkali developable compound represented by the following general formula (II).
Figure JPOXMLDOC01-appb-C000004
(式中、R11、R13及びR15は、それぞれ独立に水素原子又はメチル基を表し、R12、R14及びR16は、それぞれ独立に炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
 R13及びR14が、複数存在する場合、同一の場合も異なる場合もあり、
 Y、Y及びYは、直接結合、炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
 Yが、複数存在する場合、同一の場合も異なる場合もあり、
 Z、Z及びZは、炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
 Zが、複数存在する場合、同一の場合も異なる場合もあり、
 R12、R14、R16、Y、Y、Y、Z、Z及びZで表される基中の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、メルカプト基、イソシアネート基又は複素環を含有する基で置換される場合があり、R12、R14、R16、Y、Y、Y、Z、Z及びZで表される基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-S-、-SO-、-SCO-又は-COS-で置換される場合もあり、
 nは0又は10以下の正の数を表し、aは、0又は4以下の正の数を表し、bは、0又は3以下の正の数を表し、cは、0又は4以下の正の数を表し、nが2以上の場合、bは同一の場合も異なる場合もある。)
Figure JPOXMLDOC01-appb-C000004
(Wherein, R 11 , R 13 and R 15 each independently represent a hydrogen atom or a methyl group, and R 12 , R 14 and R 16 each independently represent a hydrocarbon group having 1 to 20 carbon atoms or a complex) Represents a group having 2 to 20 carbon atoms containing a ring,
When a plurality of R 13 and R 14 exist, they may be the same or different,
Y 1 , Y 2 and Y 3 each represents a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, or a group having 2 to 20 carbon atoms containing a heterocycle,
When two or more Y 2 exist, they may be the same or different,
Z 1 , Z 2 and Z 3 each represent a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a heterocyclic ring,
When two or more Z 2 exist, they may be the same or different,
The hydrogen atom in the group represented by R 12 , R 14 , R 16 , Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 is a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amino group, It may be substituted by a group containing a carboxyl group, a methacryloyl group, an acryloyl group, an epoxy group, a vinyl group, a mercapto group, an isocyanate group or a heterocycle, and R 12 , R 14 , R 16 , Y 1 , Y 2 , The methylene group in the group represented by Y 3 , Z 1 , Z 2 and Z 3 is —O—, —CO—, —COO—, —OCO—, —S—, —SO 2 —, —SCO— or May be replaced with -COS-,
n represents a positive number of 0 or 10 or less, a represents a positive number of 0 or 4 or less, b represents a positive number of 0 or 3 or less, and c is a positive number of 0 or 4 or less And when n is 2 or more, b may be the same or different. )
[5] [1]~[4]の何れか一項に記載の重合性組成物を含有するブラックマトリクス用感光性組成物。 [5] A photosensitive composition for black matrix comprising the polymerizable composition according to any one of [1] to [4].
[6] [1]~[4]の何れか一項に記載の重合性組成物を含有するブラックカラムスペーサ用感光性組成物。 [6] A photosensitive composition for a black column spacer, comprising the polymerizable composition according to any one of [1] to [4].
[7] [1]~[4]の何れか一項に記載の重合性組成物、[5]に記載のブラックマトリクス用感光性組成物又[6]に記載のブラックカラムスペーサ用感光性組成物を用いて、光照射又は加熱にて硬化物を製造する方法。 [7] The polymerizable composition according to any one of [1] to [4], the photosensitive composition for a black matrix according to [5], and the photosensitive composition for a black column spacer according to [6] Method of producing a cured product by light irradiation or heating using a product.
[8] [1]~[4]の何れか一項に記載の重合性組成物、[5]に記載のブラックマトリクス用感光性組成物又は[6]に記載のブラックカラムスペーサ用感光性組成物の硬化物。 [8] The polymerizable composition according to any one of [1] to [4], the photosensitive composition for a black matrix according to [5], or the photosensitive composition for a black column spacer according to [6] Cured product.
[9] [8]に記載の硬化物を含有するディスプレイ表示装置。 [9] A display device containing the cured product according to [8].
 以下、本発明の重合性組成物について好ましい実施形態に基づき詳細に説明する。 Hereinafter, the polymerizable composition of the present invention will be described in detail based on preferred embodiments.
 本発明の重合性組成物は、重合開始剤として水酸基を有するα-アミノアセトフェノン化合物、着色剤、アルカリ現像性化合物及び該アルカリ現像性化合物を除くエチレン性不飽和化合物を含有する。以下、各成分について順に説明する。 The polymerizable composition of the present invention contains, as a polymerization initiator, an α-aminoacetophenone compound having a hydroxyl group, a colorant, an alkali developable compound and an ethylenically unsaturated compound other than the alkali developable compound. Hereinafter, each component will be described in order.
 <重合開始剤(A)>
 本発明の重合性組成物に用いられる重合開始剤(A)は、水酸基を有するα-アミノアセトフェノン化合物(A1)[以下、(A1)成分とも記載]を含有し、従来既知の(A1)成分を除くラジカル重合開始剤を併用することが可能である。
<Polymerization initiator (A)>
The polymerization initiator (A) used in the polymerizable composition of the present invention contains a hydroxyl group-containing α-aminoacetophenone compound (A1) [hereinafter, also described as the component (A1)], and the conventionally known component (A1) It is possible to use a radical polymerization initiator other than.
 上記ラジカル重合開始剤とは、光ラジカル重合開始剤と熱ラジカル重合開始剤である。反応性が高いことから光ラジカル重合開始剤がより好ましい。 The said radical polymerization initiator is a photo radical polymerization initiator and a thermal radical polymerization initiator. A photo radical polymerization initiator is more preferable because of high reactivity.
 光ラジカル重合開始剤としては、光照射によりラジカルを発生するものであれば特に制限されず従来既知の化合物を用いることが可能であり、例えば、アセトフェノン系化合物、ベンジル系化合物、ベンゾフェノン系化合物、チオキサントン系化合物及びオキシムエステル系化合物等を好ましいものとして例示することができる。 The photo radical polymerization initiator is not particularly limited as long as it generates radicals by light irradiation, and conventionally known compounds can be used. For example, acetophenone compounds, benzyl compounds, benzophenone compounds, thioxanthone Preferred are compounds based on the compound and oxime ester compounds and the like.
 (A1)成分とは、一分子内に水酸基とα-アミノアセトフェノン構造を有する化合物を意味し、特に限定されないが、好ましくは、下記一般式(V)で表される化合物が挙げられる。 The component (A1) means a compound having a hydroxyl group and an α-aminoacetophenone structure in one molecule, and is not particularly limited, but preferably includes a compound represented by the following general formula (V).
Figure JPOXMLDOC01-appb-C000005
(式中、Xrは下記一般式(i)、(ii)又は(iii)で表される構造を表し、
 Xsは、硫黄原子又はNR100を表し、
 R100、R101、R102、R103及びR104は、それぞれ独立に、水素原子、炭素原子数1~12のアルキル基、フェニル基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~12のアルケニル基を表し、該アルキル基は水酸基、カルボキシル基、ハロゲン原子、シアノ基又はニトロ基で置換されている場合があり、該フェニル基及び該アリールアルキル基は炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基又はニトロ基で置換されている場合があり、
 R101とR102は、連結して3~6員環の複素環を形成している場合があり、該複素環中の窒素原子にはR99が結合している場合があり
 R103とR104は、連結して3~6員環を形成している場合があり、
 R105、R106、R107及びR108はそれぞれ独立に、水素原子、ハロゲン原子、シアノ基、ニトロ基、水酸基、カルボキシル基又は炭素原子数1~12のアルキル基を表し、該アルキル基は、ハロゲン原子、カルボキシル基、シアノ基、ニトロ基又は水酸基で置換されている場合があり、
 R99は水素原子、炭素原子数1~12のアルキル基、フェニル基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~12のアルケニル基を表し、該アルキル基は水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されている場合があり、該フェニル基及び該アリールアルキル基は炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されている場合がある。
 上記で挙げた各アルキル基及び上記各アリールアルキル基中のメチレン基は、-O-、-S-、-NR117-、-CO-、-CO-O-、-O-CO-又は-O-CO-O-で置換されている場合がある。
 R117は、水素原子、炭素原子数1~12のアルキル基、フェニル基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~12のアルケニル基を表し、該アルキル基は水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されている場合があり、該フェニル基及び該アリールアルキル基は炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されている場合がある。
 ただし、式(V)で表される化合物は、分子中に少なくとも一つの水酸基を有している。)
Figure JPOXMLDOC01-appb-C000005
(Wherein, Xr represents a structure represented by the following general formula (i), (ii) or (iii),
Xs represents a sulfur atom or NR 100 ,
R 100 , R 101 , R 102 , R 103 and R 104 each independently represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a phenyl group, an arylalkyl group having 7 to 20 carbon atoms, or the number of carbon atoms And the alkyl group may be substituted with a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group, and the phenyl group and the arylalkyl group each have 1 to 4 carbon atoms. In some cases substituted with an alkyl group, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group,
R 101 and R 102 may form a heterocyclic ring linked to 3-6 membered ring, the nitrogen atom in the heterocyclic ring may R 99 is bonded R 103 and R 104 may be linked to form a 3- to 6-membered ring,
R 105 , R 106 , R 107 and R 108 each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group, a carboxyl group or an alkyl group having 1 to 12 carbon atoms, and the alkyl group is It may be substituted by a halogen atom, a carboxyl group, a cyano group, a nitro group or a hydroxyl group,
R 99 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a phenyl group, an arylalkyl group having 7 to 20 carbon atoms or an alkenyl group having 2 to 12 carbon atoms, and the alkyl group is a hydroxyl group or a carboxyl group , And may be substituted with a halogen atom, a cyano group or a nitro group, and the phenyl group and the arylalkyl group are each an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group May be replaced by
Methylene groups in each alkyl group and each aryl alkyl groups listed above, -O -, - S -, - NR 117 -, - CO -, - CO-O -, - O-CO- or -O It may be substituted by -CO-O-.
R 117 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a phenyl group, an arylalkyl group having 7 to 20 carbon atoms or an alkenyl group having 2 to 12 carbon atoms, and the alkyl group is a hydroxyl group or a carboxyl group The phenyl group and the arylalkyl group may be substituted with an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group or a nitro group. It may be substituted by a group.
However, the compound represented by Formula (V) has at least one hydroxyl group in the molecule. )
Figure JPOXMLDOC01-appb-C000006
(式中、R109及びR110は、それぞれ独立に、水素原子、水酸基、カルボキシル基、ハロゲン原子又は炭素原子数1~4のアルキル基を表し、pが2以上の場合は同じであっても異なっていてもよく、
 式中の下記(i-1)
Figure JPOXMLDOC01-appb-C000006
(Wherein, each of R 109 and R 110 independently represents a hydrogen atom, a hydroxyl group, a carboxyl group, a halogen atom, or an alkyl group having 1 to 4 carbon atoms, and even when p is 2 or more, they are the same) It may be different,
Following in the formula (i-1)
Figure JPOXMLDOC01-appb-C000007
で表される構造中のメチレン基は、-O-、-S-、-NR117、-CO-、-CO-O-、-O-CO-又は-O-CO-O-で置換されていてもよく、
 R111は、水素原子、ハロゲン原子、水酸基、カルボキシル基、シアノ基、アミノ基又はフェニル基を表し、該フェニル基は炭素原子数1~4のアルキル基、水酸基、カルボキシル基、ハロゲン原子、シアノ基若しくはニトロ基で置換されている場合があり、pは、1~12の数を表す。)
Figure JPOXMLDOC01-appb-C000007
In methylene groups represented by structure is, -O -, - S -, - NR 117, -CO -, - CO-O -, - O-CO- or -O-CO-O- in substituted May be
R 111 represents a hydrogen atom, a halogen atom, a hydroxyl group, a carboxyl group, a cyano group, an amino group or a phenyl group, and the phenyl group is an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a carboxyl group, a halogen atom, a cyano group And p may be substituted with a nitro group, and p represents a number of 1 to 12. )
Figure JPOXMLDOC01-appb-C000008
(式中、R112、R113、R114、R115及びR116はそれぞれ独立に、水素原子、ハロゲン原子、シアノ基、ニトロ基、水酸基又は炭素原子数1~12のアルキル基を表し、該アルキル基はハロゲン原子、シアノ基、ニトロ基又は水酸基で置換されている場合があり、該アルキル基中のメチレン基は、-O-、-S-、-NR117、-CO-、-CO-O-、-O-CO-又は-O-CO-O-で置換されている場合があり、R106又はR107は、R112又はR116と結合して環を形成している場合がある。)
Figure JPOXMLDOC01-appb-C000008
(Wherein, R 112 , R 113 , R 114 , R 115 and R 116 each independently represent a hydrogen atom, a halogen atom, a cyano group, a nitro group, a hydroxyl group or an alkyl group having 1 to 12 carbon atoms, alkyl group may have been substituted by a halogen atom, a cyano group, a nitro group or a hydroxyl group, a methylene group in the alkyl group, -O -, - S -, - NR 117, -CO -, - CO- It may be substituted by O-, -O-CO- or -O-CO-O-, and R 106 or R 107 may combine with R 112 or R 116 to form a ring. .)
Figure JPOXMLDOC01-appb-C000009
(式中、R101、R102、R103、R104、R105、R106、R107及びR108は、上記一般式(V)と同じであり、R109、R110及びpは、上記一般式(i)と同じである。)
Figure JPOXMLDOC01-appb-C000009
(Wherein, R 101 , R 102 , R 103 , R 104 , R 105 , R 106 , R 107 and R 108 are the same as the above general formula (V), and R 109 , R 110 and p are the above The same as general formula (i).)
 一般式(V)の説明として上記で述べた各炭素原子数1~12のアルキル基としては、例えば、下記一般式(I)における炭素原子数1~20の炭化水素基の例である炭素原子数1~20のアルキル基のうち、炭素原子数1~12のものを挙げることができる。 Examples of the alkyl group having 1 to 12 carbon atoms described above as the explanation of the general formula (V) include, for example, a carbon atom which is an example of a hydrocarbon group having 1 to 20 carbon atoms in the following general formula (I) Among the alkyl groups of 1 to 20, those having 1 to 12 carbon atoms can be mentioned.
 一般式(V)の説明として上記で述べた各炭素原子数1~4のアルキル基としては、下記一般式(I)における炭素原子数1~20の炭化水素基の例である炭素原子数1~20のアルキル基として後述するもののうち、炭素原子数1~4のものを挙げることができる。 Examples of the alkyl group having 1 to 4 carbon atoms described above as the explanation of the general formula (V) include 1 to 20 carbon atoms which is an example of a hydrocarbon group having 1 to 20 carbon atoms in the following general formula (I) Among the groups described below as the alkyl group of -20, one having 1 to 4 carbon atoms can be mentioned.
 一般式(V)の説明として上記で述べた各炭素原子数7~20のアリールアルキル基としては、例えば、ベンジル、α-メチルベンジル、α、α-ジメチルベンジル、フェニルエチル等が挙げられる。 Examples of the arylalkyl group having 7 to 20 carbon atoms described above as the explanation of the general formula (V) include benzyl, α-methylbenzyl, α, α-dimethylbenzyl, phenylethyl and the like.
 一般式(V)の説明として上記で述べた各炭素原子数2~12のアルケニル基としては、ビニル基、1-プロペニル基、2-プロペニル基、イソプロペニル基、1-ブテニル基、2-ブテニル基、3-ブテニル基、1-オクテニル基、1-デセニル基等の基が挙げられる。 As the alkenyl group having 2 to 12 carbon atoms described above as the explanation of the general formula (V), a vinyl group, 1-propenyl group, 2-propenyl group, isopropenyl group, 1-butenyl group, 2-butenyl group And groups such as 3-butenyl group, 1-octenyl group and 1-decenyl group.
 一般式(V)中の、R101とR102が連結して形成し得る3~6員環の複素環としては、例えば、ピペリジン環、ピペラジン環、モルホリン環、ラクタム環等が好ましく挙げられる。 Preferred examples of the 3- to 6-membered heterocyclic ring which may be formed by linking R 101 and R 102 in the general formula (V) include piperidine ring, piperazine ring, morpholine ring, lactam ring and the like.
 一般式(V)中の、R103とR104が連結して形成し得る3~6員環としては、例えば、シクロペンタン環、シクロヘキサン環、シクロペンテン環、ラクトン環、ラクタム環等が好ましく挙げられる。 Preferred examples of the 3- to 6-membered ring which can be formed by linking R 103 and R 104 in the general formula (V) include a cyclopentane ring, a cyclohexane ring, a cyclopentene ring, a lactone ring and a lactam ring. .
 一般式(V)中の、R106又はR107がR112又はR116と結合してなる環としては、Xsの両隣のベンゼン環と合わせた構造として、カルバゾール環、チアントレン環、ジベンゾチオフェン環が挙げられる。 Examples of the ring formed by combining R 106 or R 107 with R 112 or R 116 in the general formula (V) include a carbazole ring, a tianthrene ring and a dibenzothiophene ring as a structure combined with the benzene ring on both sides of Xs. It can be mentioned.
 一般式(V)中の説明として上記で述べた各ハロゲン原子としては、フッ素、塩素、臭素、ヨウ素が挙げられる。 Examples of each halogen atom described above as an explanation in the general formula (V) include fluorine, chlorine, bromine and iodine.
 好ましい(A1)成分としては、例えば、下記化合物No.A1-1~11が挙げられる。 Examples of preferable component (A1) include the following compound Nos. A1-1 to A-11.
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000010
(A1)成分を除くアセトフェノン系化合物としては、水酸基を有さないα-アミノアセトフェノン化合物及びα-ヒドロキシアセトフェノン化合物が挙げられる。 Examples of the acetophenone-based compound other than the component (A1) include α-aminoacetophenone compounds and α-hydroxyacetophenone compounds having no hydroxyl group.
(A1)成分を除くアセトフェノン系化合物としては、例えば、ジエトキシアセトフェノン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、4’-イソプロピル-2-ヒドロキシ-2-メチルプロピオフェノン、2-ヒドロキシメチル-2-メチルプロピオフェノン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、p-ジメチルアミノアセトフェノン、p-ターシャリブチルジクロロアセトフェノン、p-ターシャリブチルトリクロロアセトフェノン、p-アジドベンザルアセトフェノン、1-ヒドロキシシクロヘキシルフェニルケトン、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパノン-1、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾイン-n-ブチルエーテル、ベンゾインイソブチルエーテル及び1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン等が挙げられる。 Examples of acetophenone compounds other than the component (A1) include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 4′-isopropyl-2-hydroxy-2-methylpropiophenone , 2-hydroxymethyl-2-methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p-dimethylaminoacetophenone, p-tert-butyl dichloroacetophenone, p-tert-butyl trichloro Acetophenone, p-azidobenzalacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -bu Non-1, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether and 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl -1-propan-1-one and the like.
 ベンジル系化合物としては、ベンジル等が挙げられる。 Examples of the benzyl compound include benzyl and the like.
 ベンゾフェノン系化合物としては、例えば、ベンゾフェノン、o-ベンゾイル安息香酸メチル、ミヒラーケトン、4,4’-ビスジエチルアミノベンゾフェノン、4,4’-ジクロロベンゾフェノン及び4-ベンゾイル-4’-メチルジフェニルスルフィド等が挙げられる。 Examples of benzophenone compounds include benzophenone, methyl o-benzoylbenzoate, Michler's ketone, 4,4'-bisdiethylaminobenzophenone, 4,4'-dichlorobenzophenone and 4-benzoyl-4'-methyldiphenyl sulfide. .
 チオキサントン系化合物としては、チオキサントン、2-メチルチオキサントン、2-エチルチオキサントン、2-クロロチオキサントン、2-イソプロピルチオキサントン、2,4-ジエチルチオキサントン等が挙げられる。 Examples of thioxanthone compounds include thioxanthone, 2-methyl thioxanthone, 2-ethyl thioxanthone, 2-chloro thioxanthone, 2-isopropyl thioxanthone, 2,4-diethyl thioxanthone and the like.
 オキシムエステル系化合物としては、上記一般式(I)で表される基を有するオキシムエステル化合物(A2)等が挙げられ、上記光ラジカル重合開始剤の中でも(A1)成分と併用することで高感度になることから、本発明の重合性組成物に好ましく使用することができる。 Examples of oxime ester compounds include oxime ester compounds (A2) having a group represented by the above general formula (I), etc. Among the above photo radical polymerization initiators, high sensitivity can be obtained by using in combination with the component (A1). As a result, it can be preferably used in the polymerizable composition of the present invention.
 上記一般式(I)中のR~Rで表される炭素原子数1~20の炭化水素基は、特に限定されるものではないが、好ましくは炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基、炭素原子数3~20のシクロアルキル基、炭素原子数4~20のシクロアルキルアルキル基、炭素原子数6~20のアリール基又は炭素原子数7~20のアリールアルキル基等を表す。重合開始剤(A)として用いた場合の感度が良好なことから、炭素原子数1~10のアルキル基、炭素原子数2~10のアルケニル基、炭素原子数3~10のシクロアルキル基、炭素原子数4~10のシクロアルキルアルキル基、炭素原子数6~10のアリール基又は炭素原子数7~10のアリールアルキル基等がより好ましい。 The hydrocarbon group having 1 to 20 carbon atoms represented by R 1 to R 3 in the general formula (I) is not particularly limited, but is preferably an alkyl group having 1 to 20 carbon atoms, An alkenyl group having 2 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkyl alkyl group having 4 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms or 7 to 20 carbon atoms Represents an arylalkyl group or the like. As the sensitivity when used as a polymerization initiator (A) is good, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, carbon More preferred is a cycloalkylalkyl group having 4 to 10 atoms, an aryl group having 6 to 10 carbon atoms, or an arylalkyl group having 7 to 10 carbon atoms.
 上記炭素原子数1~20のアルキル基としては、例えば、メチル、エチル、プロピル、イソプロピル、ブチル、イソブチル、s-ブチル、t-ブチル、アミル、イソアミル、t-アミル、ヘキシル、ヘプチル、オクチル、イソオクチル、2-エチルヘキシル、t-オクチル、ノニル、イソノニル、デシル、イソデシル、ウンデシル、ドデシル、テトラデシル、ヘキサデシル、オクタデシル及びイコシル等が挙げられる。上記炭素原子数1~10のアルキル基としては、例えば、メチル、エチル、プロピル、イソプロピル、ブチル、イソブチル、s-ブチル、t-ブチル、アミル、イソアミル、t-アミル、ヘキシル、ヘプチル、オクチル、イソオクチル、2-エチルヘキシル、t-オクチル、ノニル、イソノニル、デシル及びイソデシル等が挙げられる。 Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, amyl, isoamyl, tert-amyl, hexyl, heptyl, octyl and isooctyl. 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl and icosyl and the like. Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, amyl, isoamyl, tert-amyl, hexyl, heptyl, octyl and isooctyl. 2-ethylhexyl, t-octyl, nonyl, isononyl, decyl, isodecyl and the like.
 上記炭素原子数2~20のアルケニル基としては、例えば、ビニル、2-プロペニル、3-ブテニル、2-ブテニル、4-ペンテニル、3-ペンテニル、2-ヘキセニル、3-ヘキセニル、5-ヘキセニル、2-ヘプテニル、3-ヘプテニル、4-ヘプテニル、3-オクテニル、3-ノネニル、4-デセニル、3-ウンデセニル、4-ドデセニル、3-シクロヘキセニル、2,5-シクロヘキサジエニル-1-メチル、及び4,8,12-テトラデカトリエニルアリル等が挙げられる。上記炭素原子数2~10のアルケニル基としては、例えば、ビニル、2-プロペニル、3-ブテニル、2-ブテニル、4-ペンテニル、3-ペンテニル、2-ヘキセニル、3-ヘキセニル、5-ヘキセニル、2-ヘプテニル、3-ヘプテニル、4-ヘプテニル、3-オクテニル、3-ノネニル及び4-デセニル等が挙げられる。 Examples of the above alkenyl group having 2 to 20 carbon atoms include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, 2-hexenyl, 3-hexenyl, 5-hexenyl, and the like. -Heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-nonenyl, 4-decenyl, 3-undecenyl, 4-dodecenyl, 3-cyclohexenyl, 2,5-cyclohexadienyl-1-methyl, and 4 , 8, 12-tetradecatrienyl allyl and the like. Examples of the above alkenyl groups having 2 to 10 carbon atoms include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, 2-hexenyl, 3-hexenyl, 5-hexenyl, and the like -Heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-nonenyl, 4-decenyl and the like.
 上記炭素原子数3~20のシクロアルキル基とは、3~20の炭素原子を有する、飽和単環式又は飽和多環式アルキル基を意味する。例えば、シクロプロピル、シクロブチル、シクロペンチル、シクロヘキシル、シクロヘプチル、シクロオクチル、シクロノニル、シクロデシル、アダマンチル、デカハイドロナフチル、オクタヒドロペンタレン、ビシクロ[1.1.1]ペンタニル及びテトラデカヒドロアントラセニル等が挙げられる。上記炭素原子数3~10のシクロアルキル基としては、例えば、シクロプロピル、シクロブチル、シクロペンチル、シクロヘキシル、シクロヘプチル、シクロオクチル、シクロノニル、シクロデシル、アダマンチル、デカハイドロナフチル、オクタヒドロペンタレン及びビシクロ[1.1.1]ペンタニル等が挙げられる。 The above-mentioned cycloalkyl group having 3 to 20 carbon atoms means a saturated monocyclic or saturated polycyclic alkyl group having 3 to 20 carbon atoms. For example, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, adamantyl, decahydronaphthyl, octahydropentalene, bicyclo [1.1.1] pentanyl and tetradecahydroanthracenyl etc. It can be mentioned. Examples of the cycloalkyl group having 3 to 10 carbon atoms include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, adamantyl, decahydronaphthyl, octahydropentalene and bicyclo [1. 1.1] Pentanyl and the like.
 上記炭素原子数4~20のシクロアルキルアルキル基とは、アルキル基の水素原子が、シクロアルキル基で置換された4~20の炭素原子を有する基を意味する。例えば、シクロプロピルメチル、シクロブチルメチル、シクロペンチルメチル、シクロヘキシルメチル、シクロヘプチルメチル、シクロオクチルメチル、シクロノニルメチル、シクロデシルメチル、2-シクロブチルエチル、2-シクロペンチルエチル、2-シクロヘキシルエチル、2-シクロヘプチルエチル、2-シクロオクチルエチル、2-シクロノニルエチル、2-シクロデシルエチル、3-シクロブチルプロピル、3-シクロペンチルプロピル、3-シクロヘキシルプロピル、3-シクロヘプチルプロピル、3-シクロオクチルプロピル、3-シクロノニルプロピル、3-シクロデシルプロピル、4-シクロブチルブチル、4-シクロペンチルブチル、4-シクロヘキシルブチル、4-シクロヘプチルブチル、4-シクロオクチルブチル、4-シクロノニルブチル、4-シクロデシルブチル、3-3-アダマンチルプロピル及びデカハイドロナフチルプロピル等が挙げられる。上記炭素原子数4~10のシクロアルキルアルキル基としては、例えば、シクロプロピルメチル、シクロブチルメチル、シクロペンチルメチル、シクロヘキシルメチル、シクロヘプチルメチル、シクロオクチルメチル、シクロノニルメチル、2-シクロブチルエチル、2-シクロペンチルエチル、2-シクロヘキシルエチル、2-シクロヘプチルエチル、2-シクロオクチルエチル、3-シクロブチルプロピル、3-シクロペンチルプロピル、3-シクロヘキシルプロピル、3-シクロヘプチルプロピル、4-シクロブチルブチル、4-シクロペンチルブチル及び4-シクロヘキシルブチル等が挙げられる。 The above-mentioned cycloalkyl alkyl group having 4 to 20 carbon atoms means a group having 4 to 20 carbon atoms in which the hydrogen atom of the alkyl group is substituted with a cycloalkyl group. For example, cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclononylmethyl, cyclodecylmethyl, 2-cyclobutylethyl, 2-cyclopentylethyl, 2-cyclohexylethyl, 2- Cycloheptylethyl, 2-cyclooctylethyl, 2-cyclononylethyl, 2-cyclodecylethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 3-cyclooctylpropyl, 3-Cyclononylpropyl, 3-Cyclodecylpropyl, 4-Cyclobutylbutyl, 4-Cyclopentylbutyl, 4-Cyclohexylbutyl, 4-Cycloheptylbutyl, 4-CyclooctylB Le, 4-cyclopropyl-nonyl-butyl, 4-cyclopropyl-decyl-butyl, 3-3-adamantyl propyl and deca hydro-naphthylpropyl and the like. Examples of the above cycloalkyl group having 4 to 10 carbon atoms include cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclononylmethyl, 2-cyclobutylethyl, -Cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 4-cyclobutylbutyl, 4 And -cyclopentylbutyl and 4-cyclohexylbutyl and the like.
 上記炭素原子数6~20のアリール基としては、例えば、フェニル、トリル、キシリル、エチルフェニル、ナフチル、アンスリル、フェナントレニル等や、上記アルキル基、上記アルケニル基やカルボキシル基、ハロゲン原子等で1つ以上置換されたフェニル、ビフェニリル、ナフチル、アンスリル等、例えば、4-クロロフェニル、4-カルボキシルフェニル、4-ビニルフェニル、4-メチルフェニル、2,4,6-トリメチルフェニル等が挙げられる。上記炭素原子数6~10のアリール基としては、例えば、フェニル、トリル、キシリル、エチルフェニル及びナフチル等や、上記アルキル基、上記アルケニル基やカルボキシル基、ハロゲン原子等で1つ以上置換されたフェニル、ビフェニリル、ナフチル、アンスリル等、例えば、4-クロロフェニル、4-カルボキシルフェニル、4-ビニルフェニル、4-メチルフェニル、2,4,6-トリメチルフェニル等が挙げられる。 Examples of the aryl group having 6 to 20 carbon atoms include one or more of phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthryl, phenanthrenyl and the like, the above alkyl group, the above alkenyl group, carboxyl group, halogen atom and the like Substituted phenyl, biphenylyl, naphthyl, anthryl and the like, for example, 4-chlorophenyl, 4-carboxyphenyl, 4-vinylphenyl, 4-methylphenyl, 2,4,6-trimethylphenyl and the like can be mentioned. Examples of the aryl group having 6 to 10 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl and naphthyl and the like, and phenyl substituted with one or more of the above alkyl group, the above alkenyl group, carboxyl group, halogen atom and the like. And biphenylyl, naphthyl, anthryl and the like, for example, 4-chlorophenyl, 4-carboxyphenyl, 4-vinylphenyl, 4-methylphenyl, 2,4,6-trimethylphenyl and the like.
 上記炭素原子数7~20のアリールアルキル基とは、アルキル基の水素原子が上記炭素原子数6~20のアリール基のうち、炭素原子数6~19のアリール基で置き換えられた、7~20個の炭素原子を有する基を意味する。例えば、ベンジル、α-メチルベンジル、α、α-ジメチルベンジル、フェニルエチル及びナフチルプロピル等が挙げられる。上記炭素原子数7~10のアリールアルキル基としては、アルキル基の水素原子が上記炭素原子数6~20のアリール基のうち、炭素原子数6~9のアリール基で置き換えられた、7~10個の炭素原子を有する基を意味し、例えば、ベンジル、α-メチルベンジル、α、α-ジメチルベンジル及びフェニルエチル等が挙げられる。 The above-mentioned arylalkyl group having 7 to 20 carbon atoms means 7 to 20 in which the hydrogen atom of the alkyl group is replaced with an aryl group having 6 to 19 carbon atoms among the above-mentioned aryl groups having 6 to 20 carbon atoms. Means a group having two carbon atoms. For example, benzyl, α-methylbenzyl, α, α-dimethylbenzyl, phenylethyl and naphthylpropyl and the like can be mentioned. The arylalkyl group having 7 to 10 carbon atoms is exemplified by 7 to 10 in which a hydrogen atom of the alkyl group is replaced with an aryl group having 6 to 9 carbon atoms among the aryl groups having 6 to 20 carbon atoms. Means a group having one carbon atom, and examples thereof include benzyl, α-methylbenzyl, α, α-dimethylbenzyl and phenylethyl.
 上記一般式(I)中のR及びRで表される複素環を含有する炭素原子数2~20の基並びにR及びRで表される基中の水素原子が置換される場合がある、複素環を含有する炭素原子数2~20の基は、特に限定されるものではないが、例えば、ピロリル、ピリジル、ピリジルエチル、ピリミジル、ピリダジル、ピペラジル、ピペリジル、ピラニル、ピラニルエチル、ピラゾリル、トリアジル、トリアジルメチル、ピロリジル、キノリル、イソキノリル、イミダゾリル、ベンゾイミダゾリル、トリアゾリル、フリル、フラニル、ベンゾフラニル、チエニル、チオフェニル、ベンゾチオフェニル、チアジアゾリル、チアゾリル、ベンゾチアゾリル、オキサゾリル、ベンゾオキサゾリル、イソチアゾリル、イソオキサゾリル、インドリル、モルフォリニル、チオモルフォリニル、2-ピロリジノン-1-イル、2-ピペリドン-1-イル、2,4-ジオキシイミダゾリジン-3-イル及び2,4-ジオキシオキサゾリジン-3-イル等が挙げられ、置換基等を含めて具体的に記載すると下記の構造を有する基等が挙げられる。 When a hydrogen atom in a group having 2 to 20 carbon atoms containing a heterocyclic ring represented by R 1 and R 2 in the general formula (I) and a group represented by R 1 and R 2 is substituted The heterocyclic group having 2 to 20 carbon atoms is not particularly limited, and examples thereof include pyrrolyl, pyridyl, pyridylethyl, pyrimidyl, pyridazyl, piperazyl, piperidyl, pyranyl, pyranylethyl, pyrazolyl, and the like. Triazyl, triazylmethyl, pyrrolidinyl, quinolyl, isoquinolyl, imidazolyl, benzimidazolyl, triazolyl, furyl, furanyl, benzofuranyl, thienyl, thiophenyl, benzothiophenyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, isoxazolyl, indolyl , Morpholinyl, thiomorpholinyl, 2-pyrrolidin-1-yl, 2-piperidone-1-yl, 2,4-dioxyimidazolidin-3-yl, 2,4-dioxazolidin-3-yl and the like When it is specifically described including substituents and the like, groups having the following structures and the like can be mentioned.
Figure JPOXMLDOC01-appb-C000011
(上記式中、Rはそれぞれ独立して、水素原子又は炭素原子数1~6のアルキル基を表し、Zは直接結合又は炭素原子数1~6のアルキレン基を表す。尚、式中の*は、これらの式で表される基が、*部分で、結合手を意味する。)
Figure JPOXMLDOC01-appb-C000011
(In the above formulae, each R independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and Z represents a direct bond or an alkylene group having 1 to 6 carbon atoms. Means that the group represented by these formulas is a bond at * part.)
 上記式中のRで表される炭素原子数1~6のアルキル基としては、上述した炭素原子数1~20のアルキル基として例示したものの中の炭素原子数1~6のものを挙げることができる。
 上記式中のZで表される炭素原子数1~6のアルキレン基としては、メチレン、エチレン、プロピレン、メチルエチレン、ブチレン、1-メチルプロピレン、2-メチルプロピレン、1,2-ジメチルプロピレン、1,3-ジメチルプロピレン、1-メチルブチレン、2-メチルブチレン、3-メチルブチレン、4-メチルブチレン、2,4-ジメチルブチレン、1,3-ジメチルブチレン、ペンチレン、へキシレン等の直鎖又は分岐のアルキレン基を挙げることができる。
Examples of the alkyl group having 1 to 6 carbon atoms represented by R in the above-mentioned formula include those having 1 to 6 carbon atoms in the above-mentioned alkyl group having 1 to 20 carbon atoms. it can.
As the alkylene group having 1 to 6 carbon atoms represented by Z in the above formula, methylene, ethylene, propylene, methylethylene, butylene, 1-methylpropylene, 2-methylpropylene, 1,2-dimethylpropylene, 1 , 3-dimethylpropylene, 1-methylbutylene, 2-methylbutylene, 3-methylbutylene, 4-methylbutylene, 2,4-dimethylbutylene, 1,3-dimethylbutylene, pentylene, hexylene, etc. And an alkylene group of
 一般式(I)及び(III)の注釈に記載された各ハロゲン原子としては、フッ素、塩素、臭素、ヨウ素が挙げられる。 As each halogen atom described in the notes of the general formulas (I) and (III), fluorine, chlorine, bromine and iodine can be mentioned.
 本明細書中、各一般式(I)又は(IV)の注釈に記載された基中のメチレン基を置換する場合のある不飽和結合としては、-C=C-、-C≡C-等が挙げられる。 In the present specification, as an unsaturated bond which may substitute a methylene group in the group described in the annotation of each of the general formulas (I) or (IV), -C = C-, -C≡C-, etc. Can be mentioned.
 上記一般式(I)で表される基を有する化合物の中でも下記一般式(III)で表される化合物は、特に感度が高いことから、本発明の重合性組成物に用いることが好ましい。 Among the compounds having a group represented by the above general formula (I), a compound represented by the following general formula (III) is preferably used in the polymerizable composition of the present invention since the sensitivity is particularly high.
Figure JPOXMLDOC01-appb-C000012
(式中、R、R及びmは、それぞれ一般式(I)におけるR、R及びmと同一であり、
 R21及びR22は、それぞれ独立に、水素原子、ニトロ基、シアノ基、炭素原子数1~20のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は複素環を含有する炭素原子数2~20の基を表し、
 Xは、酸素原子、硫黄原子、セレン原子、CR2324、CO、NR25又はPR26を表し、
 Xは、無結合、直接結合、炭素原子数1~20の炭化水素基、COを表し、R23~R26は、それぞれ独立に、水素原子、炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、R21~R26で表される基中の水素原子は、ハロゲン原子、ニトロ基、シアン基、水酸基、カルボキシル基又は複素環基で置換される場合もあり、
 R21~R26で表される基中のメチレン基は、酸素が隣り合わない条件で-O-又は-CO-に置換される場合もあり、
 R21~R26は、それぞれ独立に、隣接するどちらかのベンゼン環と一緒になって環を形成する場合もあり、
 gは、0~4の数を表し、
 hは、0~3の数を表す。)
Figure JPOXMLDOC01-appb-C000012
(Wherein, R 1, R 2 and m are the same as R 1, R 2 and m, respectively, in formula (I),
R 21 and R 22 each independently represent a hydrogen atom, a nitro group, a cyano group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an arylalkyl group having 7 to 20 carbon atoms Or a group having 2 to 20 carbon atoms containing a heterocycle,
X 1 represents an oxygen atom, a sulfur atom, a selenium atom, CR 23 R 24 , CO, NR 25 or PR 26 ,
X 2 represents non-bonding, direct bonding, a hydrocarbon group having 1 to 20 carbon atoms, CO, and R 23 to R 26 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or And a hydrogen atom in the group represented by R 21 to R 26 is a halogen atom, a nitro group, a cyan group, a hydroxyl group, a carboxyl group or a heterocyclic group. May be replaced,
The methylene group in the groups represented by R 21 to R 26 may be substituted by —O— or —CO— under the condition that oxygen is not adjacent to each other,
R 21 to R 26 may independently form a ring together with either of adjacent benzene rings,
g represents a number from 0 to 4;
h represents a number of 0 to 3; )
 上記一般式(III)中のR23~R26で表される炭素原子数1~20の炭化水素基は、それぞれ一般式(I)のR~Rで表される炭素原子数1~20の炭化水素基と同様である。また、一般式(III)中のXで表される炭素原子数1~20の炭化水素基としては、一般式(I)のR~Rで表される炭素原子数1~20の炭化水素基として挙げた各基から水素原子を一つ除いた二価の基が挙げられる。
 上記一般式(III)中のR21及びR22で表される炭素原子数1~20のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基はそれぞれ、R~Rで表される炭素原子数1~20の炭化水素基の例である上記炭素原子数1~20のアルキル基、上記炭素原子数6~20のアリール基、上記炭素原子数7~20のアリールアルキル基について上記で述べたものと同様である。
The hydrocarbon group having 1 to 20 carbon atoms represented by R 23 to R 26 in the general formula (III) has 1 to 20 carbon atoms represented by R 1 to R 3 in the general formula (I) It is similar to 20 hydrocarbon groups. Further, in the general formula (III) having 1 to 20 carbon atoms represented by X 2 in Examples of the hydrocarbon group, the general formula of R 1 ~ 1 to 20 carbon atoms represented by R 3 in (I) The bivalent group which removed one hydrogen atom from each group mentioned as a hydrocarbon group is mentioned.
The alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, and the arylalkyl group having 7 to 20 carbon atoms represented by R 21 and R 22 in the general formula (III) are respectively The alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, which is an example of the hydrocarbon group having 1 to 20 carbon atoms represented by R 1 to R 3 , and the above 7 carbon atoms The same as described above for the -20 arylalkyl group.
 上記一般式(III)中のR21~R26で表される、複素環を含有する炭素原子数2~20の基は、R及びRで表される、複素環を含有する炭素原子数2~20の基と同様である。 The heterocyclic ring-containing group having 2 to 20 carbon atoms represented by R 21 to R 26 in the general formula (III) is a heterocyclic ring-containing carbon atom represented by R 1 and R 2 The same applies to the groups of 2 to 20.
 上記オキシムエステル化合物(A2)としては、例えば下記に示す化合物No.A2-1~No.A2-14が挙げられる。但し、本発明で用いられるオキシムエステル化合物(A2)は、以下の化合物により何ら制限を受けるものではない。 Examples of the oxime ester compound (A2) include the compound No. 1 shown below. A2-1 to No. A2-14 can be mentioned. However, the oxime ester compound (A2) used in the present invention is not limited at all by the following compounds.
Figure JPOXMLDOC01-appb-C000013
Figure JPOXMLDOC01-appb-C000013
Figure JPOXMLDOC01-appb-C000014
Figure JPOXMLDOC01-appb-C000014
 その他のラジカル重合開始剤としては、2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド等のホスフィンオキサイド系化合物及びビス(シクロペンタジエニル)-ビス[2,6-ジフルオロ-3-(ピル-1-イル)]チタニウム等のチタノセン系化合物等が挙げられる。 Other radical polymerization initiators include phosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenyl phosphine oxide and bis (cyclopentadienyl) -bis [2,6-difluoro-3- (pill-1) -Yl)] Titanocene compounds such as titanium etc. may be mentioned.
 市販のラジカル開始剤としては、アデカオプトマーN-1414、N-1717、N-1919、アデカアークルズNCI-831、NCI-930(以上、ADEKA社製);IRGACURE184、IRGACURE369、IRGACURE651、IRGACURE907、IRGACURE OXE 01、IRGACURE OXE 02、IRGACURE784(以上、BASF社製);TR-PBG-304、TR-PBG-305、TR-PBG-309及びTR-PBG-314(以上、TRONLY社製);等が挙げられる。 Commercially available radical initiators include Adeka Optomer N-1414, N-1717, N-1919, Adeka Arkles NCI-831, NCI-930 (all manufactured by ADEKA Corporation); IRGACURE 184, IRGACURE 369, IRGACURE 651, IRGACURE 907, IRGACURE OXE 01, IRGACURE OXE 02, IRGACURE 784 (above, made by BASF Corporation); TR-PBG-304, TR-PBG-305, TR-PBG-309 and TR-PBG-314 (above, made by TRONLY); Be
 熱ラジカル重合開始剤としては、加熱によりラジカルを発生するものであれば特に制限されず従来既知の化合物を用いることが可能であり、例えば、アゾ系化合物、過酸化物及び過硫酸塩等を好ましいものとして例示することができる。 The thermal radical polymerization initiator is not particularly limited as long as it generates radicals by heating, and conventionally known compounds can be used. For example, azo compounds, peroxides and persulfates are preferable. It can be illustrated as a thing.
 アゾ系化合物としては、2,2′-アゾビスイソブチロニトリル、2,2′-アゾビス(メチルイソブチレ-ト)、2,2’-アゾビス-2,4-ジメチルバレロニトリル、1,1’-アゾビス(1-アセトキシ-1-フェニルエタン)等が挙げられる。 Examples of azo compounds include 2,2'-azobisisobutyronitrile, 2,2'-azobis (methylisobutyrate), 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'- And azobis (1-acetoxy-1-phenylethane) and the like.
 過酸化物としては、ベンゾイルパーオキサイド、ジ-t-ブチルベンゾイルパーオキサイド、t-ブチルパーオキシピバレート及びジ(4-t-ブチルシクロヘキシル)パーオキシジカーボネート等が挙げられる。 Examples of peroxides include benzoyl peroxide, di-t-butyl benzoyl peroxide, t-butyl peroxypivalate and di (4-t-butylcyclohexyl) peroxy dicarbonate.
 過硫酸塩としては、過硫酸アンモニウム、過硫酸ナトリウム及び過硫酸カリウム等の過硫酸塩等が挙げられる。 Persulfates include persulfates such as ammonium persulfate, sodium persulfate and potassium persulfate.
 (A1)成分以外の上記重合開始剤(A)としては、水酸基を有する重合開始剤が、液晶汚染性が低く、電気特性の優れるディスプレイ表示装置を提供できることから特に好ましい。 As the above-mentioned polymerization initiator (A) other than the component (A1), a polymerization initiator having a hydroxyl group is particularly preferable because it can provide a display having low liquid crystal contamination and excellent electrical characteristics.
 一般式(III)において、Xが、硫黄原子で、Xが、無結合の場合、例えば上記化合物No.A2-1~A2-7で表されるジフェニルスルフィド骨格を有したオキシムエステル系化合物となり、重合開始剤として併用することで感度が良好な重合性組成物がえられる点で好ましい。 In the case where X 1 is a sulfur atom and X 2 is non-bonding in the general formula (III), for example, compound No. 1 described above may be used. It is an oxime ester compound having a diphenyl sulfide skeleton represented by A2-1 to A2-7, and is preferably used in combination as a polymerization initiator from the viewpoint that a polymerizable composition having good sensitivity can be obtained.
 一般式(III)において、Xが、NR55で、Xが、直接結合の場合、例えば上記化合物No.A2-8~A2-14で表されるカルバゾール骨格を有したオキシムエステル系化合物となり、感度が良好な重合性組成物がえられる点で特に好ましい。 In the case where X 1 is NR 55 and X 2 is a direct bond in the general formula (III), for example, the compound No. 1 mentioned above may be used. It is an oxime ester compound having a carbazole skeleton represented by A2-8 to A2-14, which is particularly preferable in that a polymerizable composition having good sensitivity can be obtained.
 上記重合開始剤(A)は、これまでに例示した一種又は二種以上を混合して用いることができる。 The said polymerization initiator (A) can be mixed and used 1 type, or 2 or more types illustrated until now.
 本発明の重合性組成物において、上記重合開始剤(A)の含有量は、特に限定されるものではないが、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、硬化性が良好なことから好ましくは0.1~20質量部、より好ましくは0.3~10質量部、より好ましくは0.3~5質量部である。重合開始剤(A)の含有量が、上記の範囲内の場合、硬化性が良好で重合開始剤の析出を伴わない保存安定性に優れる重合性組成物が得られるので好ましい。
 例えば厚さ2~5μmの硬化膜を形成する場合には、重合開始剤(A)の含有量は、特に限定されるものではないが、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、好ましくは0.1~20質量部、より好ましくは0.3~10質量部、より好ましくは0.3~5質量部である。
 また、弾性回復、誘電率、電気特性等の点から、上記重合開始剤(A)中、(A1)成分の割合は、30質量%以上が好ましく、50質量%以上85質量%以下が好ましい。また、(A1)成分と式(I)で表される基を有する化合物とを併用する場合には、(A1)成分:式(I)で表される基を有する化合物との質量比(前者:後者)が、2~5:1であることが好ましく、2~3:1であることがより好ましい。
In the polymerizable composition of the present invention, the content of the polymerization initiator (A) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali developable compound (C) And preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, and more preferably 0 based on 100 parts by mass of a total of 100 parts by mass of the ethylenically unsaturated compound (D). 3 to 5 parts by mass. When the content of the polymerization initiator (A) is in the above range, a polymerizable composition having excellent curability and excellent storage stability without precipitation of the polymerization initiator can be obtained, which is preferable.
For example, in the case of forming a cured film having a thickness of 2 to 5 μm, the content of the polymerization initiator (A) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali The amount is preferably 0.1 to 20 parts by mass, more preferably 0.3 to 10 parts by mass, more preferably 0. It is 3 to 5 parts by mass.
Further, in view of elastic recovery, dielectric constant, electrical properties, etc., the proportion of the component (A1) in the polymerization initiator (A) is preferably 30% by mass or more, and more preferably 50% by mass to 85% by mass. When the component (A1) and the compound having a group represented by formula (I) are used in combination, the mass ratio of the component (A1) to the compound having a group represented by formula (I) (the former : The latter is preferably 2 to 5: 1, more preferably 2 to 3: 1.
<着色剤(B)>
 本発明の重合性組成物に用いられる着色剤(B)としては、顔料や染料を用いることができる。顔料及び染料としては、それぞれ、無機色材又は有機色材を用いることができる。これらを単独で又は2種以上を混合して用いることができる。ここで、顔料とは、後述する溶剤に不溶の着色剤を意味し、無機又は有機色材の中でも溶剤に不溶であるもの、或いは無機又は有機染料をレーキ化したものも含まれる。
<Colorant (B)>
As the colorant (B) used in the polymerizable composition of the present invention, pigments and dyes can be used. As the pigment and the dye, an inorganic color material or an organic color material can be used, respectively. These can be used alone or in combination of two or more. Here, the pigment means a coloring agent insoluble in a solvent described later, and among inorganic or organic coloring materials, those insoluble in a solvent, and those obtained by laked inorganic or organic dyes are also included.
 上記顔料としては、ファーネス法、チャンネル法又はサーマル法によって得られるカーボンブラック、或いはアセチレンブラック、ケッチェンブラック又はランプブラック等のカーボンブラック、上記カーボンブラックをエポキシ樹脂で調整又は被覆したもの、上記カーボンブラックを予め溶剤中で樹脂に分散処理し、20~200mg/gの樹脂で被覆したもの、上記カーボンブラックを酸性又はアルカリ性表面処理したもの、平均粒径が8nm以上でDBP吸油量が90ml/100g以下のカーボンブラック、950℃における揮発分中のCO及びCOから算出した全酸素量が、表面積100m当たり9mg以上であるカーボンブラック、黒鉛化カーボンブラック、黒鉛、活性炭、炭素繊維、カーボンナノチューブ、カーボンマイクロコイル、カーボンナノホーン、カーボンエアロゲル、フラーレン、アニリンブラック、ピグメントブラック7、チタンブラック、ラクタムブラック及びペリレンブラック等に代表される黒色顔料、酸化クロム緑、ミロリブルー、コバルト緑、コバルト青、マンガン系、フェロシアン化物、リン酸塩群青、紺青、ウルトラマリン、セルリアンブルー、ピリジアン、エメラルドグリーン、硫酸鉛、黄色鉛、亜鉛黄、べんがら(赤色酸化鉄(III))、カドミウム赤、合成鉄黒、アンバー、レーキ顔料等の有機又は無機顔料が挙げられる。 Examples of the pigment include carbon black obtained by the furnace method, channel method or thermal method, carbon black such as acetylene black, ketjen black or lamp black, carbon black prepared or coated with epoxy resin, the above carbon black Prepared by dispersing the resin in a solvent in advance and coating with 20 to 200 mg / g of resin, acid or alkaline surface treatment of the carbon black, average particle diameter of 8 nm or more and DBP oil absorption of 90 ml / 100 g or less of carbon black, the total amount of oxygen calculated from CO and CO 2 in the volatile content at 950 ° C. is, carbon black is surface area 100 m 2 per 9mg above, graphitized carbon black, graphite, activated carbon, carbon fibers, carbon nanotubes, Kabonma Black pigments represented by crocoyl, carbon nanohorn, carbon aerogel, fullerene, aniline black, pigment black 7, titanium black, lactam black and perylene black etc., chromium oxide green, miloli blue, cobalt green, cobalt blue, manganese based, ferrocyan , Phosphate blue, bitumen, ultramarine, cerulian blue, pyridinium, emerald green, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron oxide (III)), cadmium red, synthetic iron black, amber, lake pigment And organic or inorganic pigments such as
 上記顔料の中でも、遮光性が高いことから黒色顔料を用いることが好ましく、液晶汚染性が低いことからラクタムブラック及びペリレンブラック等に代表される有機系の黒色顔料を用いることが更に好ましい。 Among the above pigments, it is preferable to use a black pigment because of high light shielding property, and it is more preferable to use an organic black pigment represented by lactam black and perylene black because of low liquid crystal contamination.
 上記顔料としては、市販品を用いることもでき、例えば、ピグメントレッド1、2、3、9、10、14、17、22、23、31、38、41、48、49、88、90、97、112、119、122、123、144、149、166、168、169、170、171、177、179、180、184、185、192、200、202、209、215、216、217、220、223、224、226、227、254、228、240及び254;ピグメントオレンジ13、31、34、36、38、43、46、48、49、51、52、55、59、60、61、62、64、65及び71;ピグメントイエロー1、3、12、13、14、16、17、20、24、55、60、73、81、83、86、93、95、97、98、100、109、110、113、114、117、120、125、126、127、129、137、138、139、147、148、150、151、152、153、154、166、168、175、180及び185;ピグメントグリ-ン7、10、36及び58;ピグメントブルー15、15:1、15:2、15:3、15:4、15:5、15:6、22、24、56、60、61、62及び64;ピグメントバイオレット1、19、23、27、29、30、32、37、40及び50等が挙げられる。 A commercial item can also be used as said pigment, For example, pigment red 1, 2, 3, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48, 49, 88, 90, 97 , 112, 119, 122, 123, 144, 149, 166, 168, 169, 170, 171, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223 , 224, 226, 227, 254, 228, 240 and 254; pigment orange 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64 65 and 71; pigment yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86, 93, 5, 97, 98, 100, 109, 110, 113, 114, 117, 120, 125, 126, 127, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 166, 168, 175, 180 and 185; pigment green 7, 10, 36 and 58; pigment blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 5, 15: 6, 22, 24, 56, 60, 61, 62 and 64; pigment violet 1, 19, 23, 27, 29, 30, 32, 37, 40 and 50 and the like.
 上記染料としては、例えば、ニトロソ化合物、ニトロ化合物、アゾ化合物、ジアゾ化合物、キサンテン化合物、キノリン化合物、アントラキノン化合物、クマリン化合物、シアニン化合物、フタロシアニン化合物、イソインドリノン化合物、イソインドリン化合物、キナクリドン化合物、アンタンスロン化合物、ペリノン化合物、ペリレン化合物、ジケトピロロピロール化合物、チオインジゴ化合物、ジオキサジン化合物、トリフェニルメタン化合物、キノフタロン化合物、ナフタレンテトラカルボン酸、アゾ染料、シアニン染料の金属錯体化合物等が挙げられる。 Examples of the dye include nitroso compounds, nitro compounds, azo compounds, diazo compounds, xanthene compounds, quinoline compounds, anthraquinone compounds, coumarin compounds, cyanine compounds, phthalocyanine compounds, isoindolinone compounds, isoindoline compounds, quinacridone compounds, anthantrone Examples thereof include compounds, perinone compounds, perylene compounds, diketopyrrolopyrrole compounds, thioindigo compounds, dioxazine compounds, triphenylmethane compounds, quinophthalone compounds, naphthalenetetracarboxylic acids, azo dyes, metal complex compounds of cyanine dyes, and the like.
 本発明の重合性組成物において、上記着色剤(B)の含有量は、特に限定されるものではないが、下記アルカリ現像性化合物(C)100質量部に対して、好ましくは10~500質量部、より好ましくは10~300質量部、更に好ましくは10~200質量部である。着色剤(B)の含有量が上記の範囲内である場合、重合性組成物が着色剤の凝集を伴わない保存安定性に優れたものとなり、重合性組成物の硬化物の遮光性が高くなることから好ましい。
 例えば厚さ1~3μmの硬化物を形成する場合には、着色剤(B)の含有量は、特に限定されるものではないが、アルカリ現像性化合物(C)100質量部に対して、好ましくは、10~500質量部、より好ましくは10~300質量部、更に好ましくは10~200質量部である。
In the polymerizable composition of the present invention, the content of the colorant (B) is not particularly limited, but preferably 10 to 500 parts by weight with respect to 100 parts by weight of the following alkali developable compound (C). The amount is preferably 10 to 300 parts by mass, more preferably 10 to 200 parts by mass. When the content of the colorant (B) is within the above range, the polymerizable composition becomes excellent in storage stability without aggregation of the colorant, and the light shielding property of the cured product of the polymerizable composition is high. It is preferable because it becomes.
For example, in the case of forming a cured product with a thickness of 1 to 3 μm, the content of the colorant (B) is not particularly limited, but is preferably based on 100 parts by mass of the alkali developable compound (C). Is 10 to 500 parts by mass, more preferably 10 to 300 parts by mass, and still more preferably 10 to 200 parts by mass.
<アルカリ現像性化合物(C)>
 本発明に係るアルカリ現像性化合物(C)は、親水性基を有し、且つ、アルカリ現像性を示す化合物である。本発明においては、アルカリ現像性化合物(C)として、上記の条件を満たしている限り、従来用いられている化合物を用いることができる。
 上記親水性基としては、水酸基、チオール基、カルボキシル基、スルホ基、アミノ基、アミド基又はその塩等が挙げられ、水酸基及びカルボキシル基が、アルカリ現像性化合物(C)のアルカリへの現像性が高いため好ましい。
 アルカリ現像性化合物(C)における親水性基の好ましい官能基当量(親水性基1当量を含む高分子化合物の質量)は、50~10000である。
 アルカリ現像性化合物(C)の好ましい分子量は、重量平均分子量が、2000~10000であり、3000~6000が特に好ましい。又数平均分子量が、1000~8000であり、特に2000~5000である。アルカリ現像性化合物(C)の分子量が上記の範囲である場合、現像性に優れ、かつ耐薬品性に優れる硬化物が得られることから好ましい。
<Alkali developable compound (C)>
The alkali developable compound (C) according to the present invention is a compound having a hydrophilic group and exhibiting alkali developability. In the present invention, conventionally used compounds can be used as the alkali-developable compound (C) as long as the above conditions are satisfied.
Examples of the hydrophilic group include a hydroxyl group, a thiol group, a carboxyl group, a sulfo group, an amino group, an amido group or a salt thereof, and the hydroxyl group and the carboxyl group are the developability of the alkali developable compound (C) to an alkali. Is preferable because it is high.
The preferred functional group equivalent of the hydrophilic group in the alkali developable compound (C) (the mass of the polymer compound containing one equivalent of the hydrophilic group) is 50 to 10,000.
The weight average molecular weight of the alkali developable compound (C) is preferably 2,000 to 10,000, and particularly preferably 3,000 to 6,000. In addition, the number average molecular weight is from 1000 to 8000, in particular from 2000 to 5000. When the molecular weight of the alkali developable compound (C) is in the above range, a cured product which is excellent in developability and excellent in chemical resistance is preferably obtained.
 上記アルカリ現像性化合物(C)は、酸価が、好ましくは10~200mg/KOH、さらに好ましくは30~150mg/KOHである。酸価が10mg/KOH未満であると、アルカリ現像性が十分に得られない場合があり、200mg/KOHより大きいと、高分子化合物の製造が困難である恐れがある。ここで、酸価とは、JIS K 0050及びJIS K 0211によるものである。 The alkali developable compound (C) preferably has an acid value of 10 to 200 mg / KOH, more preferably 30 to 150 mg / KOH. If the acid value is less than 10 mg / KOH, the alkali developability may not be sufficiently obtained, and if it is more than 200 mg / KOH, production of the polymer compound may be difficult. Here, the acid value is in accordance with JIS K 0050 and JIS K 0211.
 アルカリ現像性化合物(C)としては、具体的には、上記一般式(II)で表される化合物、アクリル酸エステルの共重合体;フェノール及び/又はクレゾールノボラックエポキシ樹脂;多官能エポキシ基を有するポリフェニルメタン型エポキシ樹脂;エポキシアクリレート樹脂;下記一般式(IV)で表されるエポキシ化合物等に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物;下記一般式(IV)で表されるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物と、多塩基酸無水物とのエステル化反応により得られる構造を有する樹脂(不飽和化合物)等を用いることができる。 Specifically, as the alkali developable compound (C), a compound represented by the above general formula (II), a copolymer of acrylic acid ester, a phenol and / or cresol novolac epoxy resin, and a polyfunctional epoxy group Polyphenylmethane type epoxy resin; epoxy acrylate resin; epoxy addition compound having a structure in which unsaturated monobasic acid is added to an epoxy compound etc. represented by the following general formula (IV); It is represented by the following general formula (IV) A resin (unsaturated compound) having a structure obtained by the esterification reaction of an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound and a polybasic acid anhydride can be used.
Figure JPOXMLDOC01-appb-C000015
(式中、Mは直接結合、炭素原子数1~20の炭化水素基、-O-、-S-、-SO2-、-SS-、-SO-、-CO-、-OCO-又は下記式(a)、(b)、(c)又は(d)で表される群から選ばれる置換基を表し、
 Mで表される炭素原子数1~20の炭化水素基中の水素原子はハロゲン原子で置換される場合があり、R31、R32、R33、R34、R35、R36、R37及びR38(以下、R31~R38とも記載)は、それぞれ独立に、水素原子、炭素原子数1~20の炭化水素基、又はハロゲン原子を表し、kは0~10の数であり、k≧1の場合、複数存在するR31~R38及びMは、それぞれ、同一である場合も、異なる場合もある。)
Figure JPOXMLDOC01-appb-C000015
(Wherein, M 4 is a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, -O-, -S-, -SO 2- , -SS-, -SO-, -CO-, -OCO- or Represents a substituent selected from the group represented by the following formulas (a), (b), (c) or (d),
The hydrogen atom in the C1-C20 hydrocarbon group represented by M 4 may be substituted by a halogen atom, and R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 and R 38 (hereinafter also described as R 31 to R 38 ) each independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, or a halogen atom, and k is a number of 0 to 10, , K ≧ 1, the plurality of R 31 to R 38 and M 4 may be identical to or different from each other. )
Figure JPOXMLDOC01-appb-C000016
(式中、R39は、炭素原子数1~20の炭化水素基を表し、
 R40、R41、R42、R43、R44、R45、R46、R47、R48、R49、R50、R51、R52、R53、R54、R55、R56、R57、R58、R59、R60、R61、R62、R63、R64、R65、R66、R67及びR68(以下、R40~R68とも記載)は、それぞれ独立に、水素原子、炭素原子数1~20の炭化水素基、複素環を含有する炭素原子数2~20の基、又はハロゲン原子を表し、
 R31~R38及びR40~R68で表される基中のメチレン基は、不飽和結合、-O-又は-S-で置換される場合があり、
 R40とR41、R41とR42、R42とR43、R43とR44、R45とR46、R46とR47、R47とR48、R53とR54、R54とR55、R55とR56、R61とR62、R62とR63、R63とR64、R65とR66、R66とR67
及びR67とR68は結合して環を形成する場合があり、
(a)、(b)、(c)及び(d)で表される基中の*は、結合手を表す。)
Figure JPOXMLDOC01-appb-C000016
(Wherein, R 39 represents a hydrocarbon group having 1 to 20 carbon atoms,
R 40 , R 41 , R 42 , R 43 , R 44 , R 45 , R 46 , R 47 , R 48 , R 49 , R 50 , R 51 , R 52 , R 53 , R 54 , R 55 , R 56 , R 57 , R 58 , R 59 , R 60 , R 61 , R 62 , R 63 , R 64 , R 65 , R 66 , R 67 and R 68 (hereinafter also referred to as R 40 to R 68 ) are each Independently represent a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, a group having 2 to 20 carbon atoms containing a heterocycle, or a halogen atom,
The methylene group in the group represented by R 31 to R 38 and R 40 to R 68 may be substituted by an unsaturated bond, -O- or -S-.
R 40 and R 41 , R 41 and R 42 , R 42 and R 43 , R 43 and R 44 , R 45 and R 46 , R 46 and R 47 , R 47 and R 48 , R 53 and R 54 , R 54 And R 55 , R 55 and R 56 , R 61 and R 62 , R 62 and R 63 , R 63 and R 64 , R 65 and R 66 , R 66 and R 67
And R 67 and R 68 may combine to form a ring,
In the groups represented by (a), (b), (c) and (d), * represents a bond. )
 上記一般式(II)で表されるアルカリ現像性化合物を用いることで、重合性組成物から得られる硬化物が、耐薬品性に優れることから好ましい。 By using the alkali developable compound represented by the above general formula (II), a cured product obtained from the polymerizable composition is preferable because it is excellent in chemical resistance.
 上記一般式(IV)で表されるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物;又は、上記一般式(IV)で表されるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物と、多塩基酸無水物とのエステル化反応により得られる反応生成物であるアルカリ現像性化合物を用いると、重合性組成物の感度が高くなり、該重合性組成物から得られる硬化物が弾性回復率にすぐれることから好ましい。 An epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the above general formula (IV); or an unsaturated monobasic acid to an epoxy compound represented by the above general formula (IV) The use of an alkali developable compound which is a reaction product obtained by the esterification reaction of an epoxy adduct compound having an adduct structure with a polybasic acid anhydride increases the sensitivity of the polymerizable composition, and the polymerizability is raised. A cured product obtained from the composition is preferred because of its excellent elastic recovery.
 着色剤(B)の分散性が良好になり、且つ、耐熱性が良好なことから、上記アルカリ現像性化合物(C)が、上記一般式(IV)で表されるエポキシ化合物;上記一般式(IV)で表されるエポキシ化合物に不飽和一塩基酸を付加させた、下記構造[(e)]を有するエポキシ化合物;又は、斯かる不飽和化合物と多塩基酸無水物とのエステル化反応により得られる、下記構造[(f)]を有する不飽和化合物であることが望ましい。 An epoxy compound in which the alkali developable compound (C) is represented by the above general formula (IV), because the dispersibility of the coloring agent (B) is good and the heat resistance is good; Epoxy compound having the following structure [(e)] in which unsaturated monobasic acid is added to the epoxy compound represented by IV); or by esterification reaction of such unsaturated compound and polybasic acid anhydride It is desirable that it is the unsaturated compound which has the following structure [(f)] obtained.
Figure JPOXMLDOC01-appb-C000017
(式中、Yは不飽和一塩基酸の残基を表し、Yは多塩基酸無水物の残基を表し、
 *は結合手を意味する。)
Figure JPOXMLDOC01-appb-C000017
(Wherein, Y 7 represents a residue of unsaturated monobasic acid, Y 8 represents a residue of polybasic acid anhydride,
* Means a bond. )
 上記一般式(IV)で表されるアルカリ現像性化合物において、Mが(b)又は(c)で表される基である場合、該重合性組成物から得られる硬化物の耐溶剤性が良好になることから特に好ましい。 In the alkali developable compound represented by the above general formula (IV), when M 4 is a group represented by (b) or (c), the solvent resistance of the cured product obtained from the polymerizable composition is It is particularly preferable because it becomes good.
 上記一般式(II)中のR12、R14、R16、Y~Y及びZ~Zで表される炭素原子数1~20の炭化水素基は、一般式(I)の説明で上述した炭素原子数1~20の炭化水素基と同様のものが挙げられる。 The hydrocarbon group having 1 to 20 carbon atoms represented by R 12 , R 14 , R 16 , Y 1 to Y 3 and Z 1 to Z 3 in the above general formula (II) has the general formula (I) The same ones as the above-mentioned hydrocarbon group having 1 to 20 carbon atoms can be mentioned.
 上記一般式(II)中のR12、R14、R16、Y~Y及びZ~Zで表される複素環を含有する炭素原子数2~20の基並びにR12、R14、R16、Y、Y、Y、Z、Z及びZで表される基中の水素原子が置換される場合がある、複素環を含有する炭素原子数2~20の基は、一般式(I)の説明で上述した複素環を含有する炭素原子数2~20の基と同様のものが挙げられる。 Groups having 2 to 20 carbon atoms containing the heterocycles represented by R 12 , R 14 , R 16 , Y 1 to Y 3 and Z 1 to Z 3 in the above general formula (II), R 12 , R The hydrogen atom in the group represented by 14 , R 16 , Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 may be substituted, and has 2 to 20 carbon atoms containing a heterocycle The same groups as the groups having 2 to 20 carbon atoms containing the heterocyclic ring described above in the description of the general formula (I) can be mentioned as the group of the above.
 上記一般式(IV)中のM及びR31~R68で表される炭素原子数1~20の炭化水素基は、一般式(I)の説明で上述した炭素原子数1~20の炭化水素基と同様のものが挙げられる。 The hydrocarbon group having 1 to 20 carbon atoms represented by M 4 and R 31 to R 68 in the general formula (IV) is a carbon having 1 to 20 carbon atoms as described in the description of the general formula (I) The same thing as a hydrogen group is mentioned.
 上記一般式(IV)中のR40~R68で表される複素環を含有する炭素原子数2~20の基としては、一般式(I)の説明で上述した複素環を含有する炭素原子数2~20の基と同様のものが挙げられる。 As the group having 2 to 20 carbon atoms containing a heterocycle represented by R 40 to R 68 in the above general formula (IV), a carbon atom containing the heterocycle described above in the description of the general formula (I) The same groups as those of the formulas 2 to 20 can be mentioned.
 上記一般式(IV)中のMで表される炭素原子数1~20の炭化水素基の水素原子を置換するハロゲン原子及びR31~R68で表されるハロゲン原子としては、フッ素、塩素、臭素、ヨウ素が挙げられる。 The halogen atom for substituting the hydrogen atom of the hydrocarbon group having 1 to 20 carbon atoms represented by M 4 in the general formula (IV) and the halogen atom represented by R 31 to R 68 include fluorine and chlorine , Bromine and iodine.
 上記一般式(IV)中のR40とR41、R41とR42、R42とR43、R43とR44、R45とR46、R46とR47、R47とR48、R53とR54、R54とR55、R55とR56、R61とR62、R62とR63、R63とR64、R65とR66、R66とR67及びR67とR68が結合して形成する環としては、例えば、シクロペンタン、シクロヘキサン、シクロペンテン、ベンゼン、ピロリジン、ピロール、ピペラジン、モルホリン、チオモルホリン、テトラヒドロピリジン、ラクトン環及びラクタム環等の5~7員環並びにナフタレン及びアントラセン等の縮合環等が挙げられる。 R 40 and R 41 , R 41 and R 42 , R 42 and R 43 , R 43 and R 44 , R 45 and R 46 , R 46 and R 47 , R 47 and R 48 in the above general formula (IV) R 53 and R 54 , R 54 and R 55 , R 55 and R 56 , R 61 and R 62 , R 62 and R 63 , R 63 and R 64 , R 65 and R 66 , R 66 and R 67 and R 67 Examples of the ring formed by combining R 68 and R 68 include 5- to 7-membered rings such as cyclopentane, cyclohexane, cyclopentene, benzene, pyrrolidine, pyrrole, piperazine, morpholine, thiomorpholine, tetrahydropyridine, lactone ring and lactam ring And fused rings such as naphthalene and anthracene.
 上記不飽和一塩基酸とは、構造中に不飽和結合を有し、電離して水素イオンになることのできる水素原子を1分子あたり1個もつ酸を表す。
 上記不飽和一塩基酸としては、例えば、アクリル酸、メタクリル酸、クロトン酸、桂皮酸、ソルビン酸及びヒドロキシエチルメタクリレート・マレート、ヒドロキシプロピルメタクリレート・マレート、ヒドロキシプロピルアクリレート・マレート及びジシクロペンタジエン・マレート等が挙げられる。
The unsaturated monobasic acid means an acid having an unsaturated bond in the structure and having one hydrogen atom per molecule which can be ionized to be a hydrogen ion.
Examples of the unsaturated monobasic acids include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, sorbic acid and hydroxyethyl methacrylate malate, hydroxypropyl methacrylate malate, hydroxypropyl acrylate malate and dicyclopentadiene malate, etc. Can be mentioned.
 また、上記不飽和一塩基酸を作用させた後に作用させる上記多塩基酸無水物としては、ビフェニルテトラカルボン酸二無水物、テトラヒドロ無水フタル酸、無水コハク酸、ビフタル酸無水物、無水マレイン酸、トリメリット酸無水物、ピロメリット酸無水物、2,2’-3,3’-ベンゾフェノンテトラカルボン酸無水物、エチレングリコールビスアンヒドロトリメリテート、グリセロールトリスアンヒドロトリメリテート、ヘキサヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、ナジック酸無水物、メチルナジック酸無水物、トリアルキルテトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、5-(2,5-ジオキソテトラヒドロフリル)-3-メチル-3-シクロヘキセン-1,2-ジカルボン酸無水物、トリアルキルテトラヒドロ無水フタル酸-無水マレイン酸付加物、ドデセニル無水コハク酸、無水メチルハイミック酸等が挙げられる。 Moreover, as said polybasic acid anhydride made to act after making said unsaturated monobasic acid act, biphenyl tetracarboxylic acid dianhydride, tetrahydrophthalic anhydride, succinic anhydride, biphthalic anhydride, maleic anhydride, Trimellitic anhydride, pyromellitic anhydride, 2,2'-3,3'-benzophenonetetracarboxylic acid anhydride, ethylene glycol bisanhydrotrimellitate, glycerol trisanehydrotrimellitate, hexahydrophthalic anhydride Methyltetrahydrophthalic anhydride, nadic anhydride, methyl nadic anhydride, trialkyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene -1,2-dicarboxylic anhydride, trialkylte Rahidoro phthalic anhydride - maleic acid adduct, dodecenyl succinic anhydride, and anhydride and methyl high Mick acid.
 上記エポキシ化合物、上記不飽和一塩基酸及び上記多塩基酸無水物の反応モル比は、以下の通りとすることが好ましい。
 即ち、上記エポキシ付加化合物は、上記エポキシ化合物のエポキシ基1個に対し、上記不飽和一塩基酸のカルボキシル基が0.1~1.0個の比率となるように付加させるのが好ましく、また上記反応生成物は、上記エポキシ付加物の水酸基1個に対し、上記多塩基酸無水物の酸無水物構造が0.1~1.0個となる比率となるようにするのが好ましい。
 上記一般式(IV)で表されるエポキシ化合物、上記不飽和一塩基酸及び上記多塩基酸無水物の反応は、常法に従って行なうことができる。
It is preferable that the reaction molar ratio of the said epoxy compound, the said unsaturated monobasic acid, and the said polybasic acid anhydride be as follows.
That is, it is preferable to add the above-mentioned epoxy addition compound so that the carboxyl group of the above-mentioned unsaturated monobasic acid is in a ratio of 0.1 to 1.0 per one epoxy group of the above-mentioned epoxy compound. It is preferable that the reaction product be in a ratio such that the acid anhydride structure of the polybasic acid anhydride is 0.1 to 1.0 per hydroxyl group of the epoxy adduct.
The reaction of the epoxy compound represented by the above general formula (IV), the above unsaturated monobasic acid and the above polybasic acid anhydride can be carried out according to a conventional method.
 酸価調整して本発明の重合性組成物、BM用感光性組成物及びBCS用感光性組成物の現像性を改良するため、上記アルカリ現像性化合物(C)と共に、更に単官能又は多官能エポキシ化合物を反応させることができる。上記アルカリ現像性化合物(C)は、固形分の酸価が5~120mgKOH/gの範囲であることが好ましく、単官能又は多官能エポキシ化合物の使用量は、上記酸価を満たすように選択するのが好ましい。 In order to adjust the acid value and improve the developability of the polymerizable composition of the present invention, the photosensitive composition for BM and the photosensitive composition for BCS, a monofunctional or polyfunctional compound is further added together with the above alkali developable compound (C). Epoxy compounds can be reacted. The acid value of the solid content of the above alkali developable compound (C) is preferably in the range of 5 to 120 mg KOH / g, and the amount of the monofunctional or polyfunctional epoxy compound used is selected so as to satisfy the above acid value. Is preferred.
 上記単官能エポキシ化合物としては、グリシジルメタクリレート、メチルグリシジルエーテル、エチルグリシジルエーテル、プロピルグリシジルエーテル、イソプロピルグリシジルエーテル、ブチルグリシジルエーテル、イソブチルグリシジルエーテル、t-ブチルグリシジルエーテル、ペンチルグリシジルエーテル、ヘキシルグリシジルエーテル、ヘプチルグリシジルエーテル、オクチルグリシジルエーテル、ノニルグリシジルエーテル、デシルグリシジルエーテル、ウンデシルグリシジルエーテル、ドデシルグリシジルエーテル、トリデシルグリシジルエーテル、テトラデシルグリシジルエーテル、ペンタデシルグリシジルエーテル、ヘキサデシルグリシジルエーテル、2-エチルヘキシルグリシジルエーテル、アリルグリシジルエーテル、プロパルギルグリシジルエーテル、p-メトキシエチルグリシジルエーテル、フェニルグリシジルエーテル、p-メトキシグリシジルエーテル、p-ブチルフェノールグリシジルエーテル、クレジルグリシジルエーテル、2-メチルクレジルグリシジルエーテル、4-ノニルフェニルグリシジルエーテル、ベンジルグリシジルエーテル、p-クミルフェニルグリシジルエーテル、トリチルグリシジルエーテル、2,3-エポキシプロピルメタクリレート、エポキシ化大豆油、エポキシ化アマニ油、グリシジルブチレート、ビニルシクロヘキサンモノオキシド、1,2-エポキシ-4-ビニルシクロヘキサン、スチレンオキシド、ピネンオキシド、メチルスチレンオキシド、シクロヘキセンオキシド、プロピレンオキシド、下記エポキシ化合物No.E1、No.E2等が挙げられる。 As the monofunctional epoxy compound, glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, isobutyl glycidyl ether, t-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl Glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, undecyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, hexadecyl glycidyl ether, 2-ethylhexyl glycidyl ether, Allyl glycidyl agent , Propargyl glycidyl ether, p-methoxyethyl glycidyl ether, phenyl glycidyl ether, p-methoxy glycidyl ether, p-butylphenol glycidyl ether, cresyl glycidyl ether, 2-methyl cresyl glycidyl ether, 4-nonylphenyl glycidyl ether, benzyl Glycidyl ether, p-cumylphenyl glycidyl ether, trityl glycidyl ether, 2,3-epoxypropyl methacrylate, epoxidized soybean oil, epoxidized linseed oil, glycidyl butyrate, vinylcyclohexane monoxide, 1,2-epoxy-4- Vinylcyclohexane, styrene oxide, pinene oxide, methylstyrene oxide, cyclohexene oxide, propylene oxide, following epoxidation Things No. E1, No. E2 etc. are mentioned.
Figure JPOXMLDOC01-appb-C000018
Figure JPOXMLDOC01-appb-C000018
Figure JPOXMLDOC01-appb-C000019
Figure JPOXMLDOC01-appb-C000019
 上記多官能エポキシ化合物としては、ビスフェノール型エポキシ化合物及びグリシジルエーテル類からなる群から選択される一種以上の化合物を用いると、特性の一層良好な重合性組成物を得ることができるので好ましい。
 上記ビスフェノール型エポキシ化合物としては、上記一般式(IV)で表されるエポキシ化合物を用いることができる他、例えば、水添ビスフェノール型エポキシ化合物等のビスフェノール型エポキシ化合物も用いることができる。
 また上記グリシジルエーテル類としては、エチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、1,4-ブタンジオールジグリシジルエーテル、1,6-ヘキサンジオールジグリシジルエーテル、1,8-オクタンジオールジグリシジルエーテル、1,10-デカンジオールジグリシジルエーテル、2,2-ジメチル-1,3-プロパンジオールジグリシジルエーテル、ジエチレングリコールジグリシジルエーテル、トリエチレングリコールジグリシジルエーテル、テトラエチレングリコールジグリシジルエーテル、ヘキサエチレングリコールジグリシジルエーテル、1,4-シクロヘキサンジメタノールジグリシジルエーテル、1,1,1-トリ(グリシジルオキシメチル)プロパン、1,1,1-トリ(グリシジルオキシメチル)エタン、1,1,1-トリ(グリシジルオキシメチル)メタン、1,1,1,1-テトラ(グリシジルオキシメチル)メタン等を用いることができる。
 その他、フェノールノボラック型エポキシ化合物、ビフェニルノボラック型エポキシ化合物、クレゾールノボラック型エポキシ化合物、ビスフェノールAノボラック型エポキシ化合物、ジシクロペンタジエンノボラック型エポキシ化合物等のノボラック型エポキシ化合物;3,4-エポキシ-6-メチルシクロヘキシルメチル-3,4-エポキシ-6-メチルシクロヘキサンカルボキシレート、3,4-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート、1-エポキシエチル-3,4-エポキシシクロヘキサン等の脂環式エポキシ化合物;フタル酸ジグリシジルエステル、テトラヒドロフタル酸ジグリシジルエステル、ダイマー酸グリシジルエステル等のグリシジルエステル類;テトラグリシジルジアミノジフェニルメタン、トリグリシジルP-アミノフェノール、N,N-ジグリシジルアニリン等のグリシジルアミン類;1,3-ジグリシジル-5,5-ジメチルヒダントイン、トリグリシジルイソシアヌレート等の複素環式エポキシ化合物;ジシクロペンタジエンジオキシド等のジオキシド化合物;ナフタレン型エポキシ化合物;トリフェニルメタン型エポキシ化合物;ジシクロペンタジエン型エポキシ化合物等を用いることもできる。
It is preferable to use one or more compounds selected from the group consisting of bisphenol type epoxy compounds and glycidyl ethers as the above-mentioned polyfunctional epoxy compound, because a polymerizable composition having better properties can be obtained.
As the above-mentioned bisphenol type epoxy compound, in addition to the epoxy compound represented by the above general formula (IV), for example, a bisphenol type epoxy compound such as a hydrogenated bisphenol type epoxy compound can also be used.
Further, as the above glycidyl ethers, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, 1,8-octanediol diglycidyl ether, 1,10-decanediol diglycidyl ether, 2,2-dimethyl-1,3-propanediol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether, tetraethylene glycol diglycidyl ether, hexaethylene glycol diglycidyl Ether, 1,4-cyclohexanedimethanol diglycidyl ether, 1,1,1-tri (glycidyloxymethyl) propane, 1,1,1-to (Glycidyloxymethyl) ethane, 1,1,1-tri (glycidyloxymethyl) methane, 1,1,1,1- tetra (glycidyloxymethyl) can be used such as methane.
In addition, novolac epoxy compounds such as phenol novolac epoxy compounds, biphenyl novolac epoxy compounds, cresol novolac epoxy compounds, bisphenol A novolac epoxy compounds, dicyclopentadiene novolac epoxy compounds, etc .; Alicyclic epoxy such as cyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane Compounds; Glycidyl esters such as phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, dimer acid glycidyl ester; tetraglycidyl diamino acid Glycidyl amines such as phenylmethane, triglycidyl P-aminophenol, N, N-diglycidyl aniline, etc .; Heterocyclic epoxy compounds such as 1,3-diglycidyl-5, 5-dimethyl hydantoin, triglycidyl isocyanurate; Dioxide compounds such as pentadiene dioxide; naphthalene type epoxy compounds; triphenylmethane type epoxy compounds; dicyclopentadiene type epoxy compounds etc. can also be used.
 アルカリ現像性化合物(C)としては、市販品も好適に用いることができる。
 該市販品としては、例えば、SPC1000、SPC-2000、SPC-3000、SPRR-1X、SPRR-2X、SPRR-3X、SPRR-5X、SPRR-6X、SPRR-7X、SPRR-8X、SPRR-9X、SPRR-10X、SPRR-11X、SPRR-12X、SPRR-13X、SPRR-14X、SPRR-15X、SPRR-16X、SPRR-17X、SPRR-18X、SPRR-19X、SPRR-20X、SPRR-21X(以上、昭和電工社製)、JET2000、AGOR1060、AGOR3060、ORGA1060、ORGA2060(以上、大阪有機化学社製)、CCR-1171H(日本化薬社製)等が挙げられる。
A commercial item can also be used suitably as an alkali developable compound (C).
Examples of the commercially available product include SPC1000, SPC-2000, SPC-3000, SPRR-1X, SPRR-2X, SPRR-3X, SPRR-5X, SPRR-6X, SPRR-7X, SPRR-8X, SPRR-9X, and the like. SPRR-10X, SPRR-11X, SPRR-12X, SPRR-13X, SPRR-14X, SPRR-15X, SPRR-16X, SPRR-17X, SPRR-18X, SPRR-19X, SPRR-20X, SPRR-21X Showa Denko KK, JET 2000, AGOR 1060, AGOR 3060, ORGA 1060, ORGA 2060 (above, Osaka Organic Chemical Company), CCR-1171H (Nippon Kayaku Co., Ltd.), and the like.
 本発明の重合性組成物において、アルカリ現像性化合物(C)の含有量は、特に限定されるものではないが、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、好ましくは、10~90質量部、より好ましくは、20~80質量部であり、更に好ましくは、30~80質量部である。アルカリ現像性化合物(C)の含有量が、上記の範囲内である場合、重合性組成物のアルカリ現像性が良好なことから好ましい。
 例えば厚さ2~5μmの硬化膜を形成する場合には、アルカリ現像性化合物(C)の含有量は、特に限定されるものではないが、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、好ましくは、10~90質量部、より好ましくは、20~80質量部であり、更に好ましくは、30~80質量部である。
 またアルカリ現像性化合物(C)が、一般式(II)で表される化合物を含有する場合、その量は、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、好ましくは、10~60質量部、より好ましくは、20~50質量部である。また、上記一般式(IV)で表されるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物、又は該エポキシ付加化合物と、多塩基酸無水物とのエステル化反応により得られる反応生成物を含有する場合、その量は、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、好ましくは、5~80質量部、より好ましくは、5~40質量部である。上記のエポキシ付加化合物及び該エポキシ付加化合物と多塩基酸無水物とのエステル化反応により得られる反応生成物の含有量とは、該エポキシ付加化合物及び該反応生成物の一方のみを含有する場合はその量であり、両方を含有する場合はその合計量である。
In the polymerizable composition of the present invention, the content of the alkali developable compound (C) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali developable compound (C) And preferably from 10 to 90 parts by mass, more preferably from 20 to 80 parts by mass, still more preferably from 30 to 80 parts by mass, based on 100 parts by mass of the total of the above and the ethylenically unsaturated compound (D). . When content of an alkali developable compound (C) is in said range, it is preferable from the alkali developability of a polymeric composition being favorable.
For example, in the case of forming a cured film having a thickness of 2 to 5 μm, the content of the alkali developable compound (C) is not particularly limited, but the polymerization initiator (A), the colorant (B), The amount is preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, still more preferably, 100 parts by mass in total of the alkali developable compound (C) and the ethylenically unsaturated compound (D). 30 to 80 parts by mass.
When the alkali developable compound (C) contains a compound represented by the general formula (II), the amount thereof is as follows: polymerization initiator (A), colorant (B), alkali developable compound (C) and The amount is preferably 10 to 60 parts by mass, more preferably 20 to 50 parts by mass, based on 100 parts by mass of the ethylenically unsaturated compound (D) in total. Further, it is obtained by an esterification reaction of an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to the epoxy compound represented by the above general formula (IV), or the epoxy addition compound and a polybasic acid anhydride. When the reaction product is contained, the amount thereof is 100 parts by mass in total based on the polymerization initiator (A), the colorant (B), the alkali developable compound (C) and the ethylenically unsaturated compound (D). Preferably, it is 5 to 80 parts by mass, more preferably 5 to 40 parts by mass. The above-mentioned epoxy addition compound and the content of the reaction product obtained by the esterification reaction of the epoxy addition compound with the polybasic acid anhydride refer to the case where only one of the epoxy addition compound and the reaction product is contained. If it contains both, it is the total amount.
<エチレン性不飽和化合物(D)>
 本発明で用いられるエチレン性不飽和化合物(D)は、エチレン性不飽和結合を有し、且つ、上記アルカリ現像性化合物(C)ではない化合物である。エチレン性不飽和化合物(D)としては、例えば、エチレン、プロピレン、ブチレン、イソブチレン、塩化ビニル、塩化ビニリデン、フッ化ビニリデン、テトラフルオロエチレン等の不飽和脂肪族炭化水素;(メタ)アクリル酸、αークロルアクリル酸、イタコン酸、マレイン酸、シトラコン酸、フマル酸、ハイミック酸、クロトン酸、イソクロトン酸、ビニル酢酸、アリル酢酸、桂皮酸、ソルビン酸、メサコン酸、コハク酸モノ[2-(メタ)アクリロイロキシエチル]、フタル酸モノ[2-(メタ)アクリロイロキシエチル]、ω-カルボキシポリカプロラクトンモノ(メタ)アクリレート等の両末端にカルボキシ基と水酸基とを有するポリマーのモノ(メタ)アクリレート;ヒドロキシエチル(メタ)アクリレート・マレート、ヒドロキシプロピル(メタ)アクリレート・マレート、ジシクロペンタジエン・マレート或いは1個のカルボキシル基と2個以上の(メタ)アクリロイル基とを有する多官能(メタ)アクリレート等の不飽和多塩基酸;(メタ)アクリル酸-2-ヒドロキシエチル、(メタ)アクリル酸-2-ヒドロキシプロピル、(メタ)アクリル酸グリシジル、下記アクリル化合物No.1~No.4、(メタ)アクリル酸メチル、(メタ)アクリル酸ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸-t-ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸n-オクチル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸ステアリル、(メタ)アクリル酸ラウリル、(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸ジメチルアミノメチル、(メタ)アクリル酸ジメチルアミノエチル、(メタ)アクリル酸アミノプロピル、(メタ)アクリル酸ジメチルアミノプロピル、(メタ)アクリル酸エトキシエチル、(メタ)アクリル酸ポリ(エトキシ)エチル、(メタ)アクリル酸ブトキシエトキシエチル、(メタ)アクリル酸エチルヘキシル、(メタ)アクリル酸フェノキシエチル、(メタ)アクリル酸テトラヒドロフリル、(メタ)アクリル酸ビニル、(メタ)アクリル酸アリル、(メタ)アクリル酸ベンジル、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリシクロデカンジメチロールジ(メタ)アクリレート、トリ[(メタ)アクリロイルエチル]イソシアヌレート、ポリエステル(メタ)アクリレートオリゴマー等の不飽和一塩基酸及び多価アルコール又は多価フェノールのエステル;(メタ)アクリル酸亜鉛、(メタ)アクリル酸マグネシウム等の不飽和多塩基酸の金属塩;マレイン酸無水物、イタコン酸無水物、シトラコン酸無水物、メチルテトラヒドロ無水フタル酸、テトラヒドロ無水フタル酸、トリアルキルテトラヒドロ無水フタル酸、5-(2,5-ジオキソテトラヒドロフリル)-3-メチル-3-シクロヘキセン-1,2-ジカルボン酸無水物、トリアルキルテトラヒドロ無水フタル酸-無水マレイン酸付加物、ドデセニル無水コハク酸、無水メチルハイミック酸等の不飽和多塩基酸の酸無水物;(メタ)アクリルアミド、メチレンビス-(メタ)アクリルアミド、ジエチレントリアミントリス(メタ)アクリルアミド、キシリレンビス(メタ)アクリルアミド、α-クロロアクリルアミド、N-2-ヒドロキシエチル(メタ)アクリルアミド等の不飽和一塩基酸及び多価アミンのアミド;アクロレイン等の不飽和アルデヒド;(メタ)アクリロニトリル、α-クロロアクリロニトリル、シアン化ビニリデン、シアン化アリル等の不飽和ニトリル;スチレン、4-メチルスチレン、4-エチルスチレン、4-メトキシスチレン、4-ヒドロキシスチレン、4-クロロスチレン、ジビニルベンゼン、ビニルトルエン、ビニル安息香酸、ビニルフェノール、ビニルスルホン酸、4-ビニルベンゼンスルホン酸、ビニルベンジルメチルエーテル、ビニルベンジルグリシジルエーテル等の不飽和芳香族化合物;メチルビニルケトン等の不飽和ケトン;ビニルアミン、アリルアミン、N-ビニルピロリドン、ビニルピペリジン等の不飽和アミン化合物;アリルアルコール、クロチルアルコール等のビニルアルコール;ビニルメチルエーテル、ビニルエチルエーテル、n-ブチルビニルエーテル、イソブチルビニルエーテル、アリルグリシジルエーテル等のビニルエーテル;マレイミド、N-フェニルマレイミド、N-シクロヘキシルマレイミド等の不飽和イミド類;インデン、1-メチルインデン等のインデン類;1,3-ブタジエン、イソプレン、クロロプレン等の脂肪族共役ジエン類;ポリスチレン、ポリメチル(メタ)アクリレート、ポリ-n-ブチル(メタ)アクリレート、ポリシロキサン等の重合体分子鎖の末端にモノ(メタ)アクリロイル基を有するマクロモノマー類;ビニルクロリド、ビニリデンクロリド、ジビニルスクシナート、ジアリルフタラート、トリアリルホスファート、トリアリルイソシアヌラート、ビニルチオエーテル、ビニルイミダゾール、ビニルオキサゾリン、ビニルカルバゾール、ビニルピロリドン、ビニルピリジン、水酸基含有ビニルモノマー及びポリイソシアネート化合物のビニルウレタン化合物、水酸基含有ビニルモノマー及びポリエポキシ化合物のビニルエポキシ化合物が挙げられる。
 上記エチレン性不飽和化合物(D)は、単独で又は2種以上を混合して使用することができる。
<Ethylenically unsaturated compound (D)>
The ethylenically unsaturated compound (D) used in the present invention is a compound having an ethylenically unsaturated bond and which is not the above-mentioned alkali developable compound (C). Examples of the ethylenically unsaturated compound (D) include unsaturated aliphatic hydrocarbons such as ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride and tetrafluoroethylene; (meth) acrylic acid, α -Chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinylacetic acid, allylacetic acid, cinnamic acid, sorbic acid, mesaconic acid, succinic acid mono [2- (meth) acryloylate Mono (meth) acrylate of a polymer having a carboxy group and a hydroxyl group at both ends, such as hydroxyethyl, phthalic acid mono [2- (meth) acryloyloxyethyl], ω-carboxypolycaprolactone mono (meth) acrylate; Ethyl (meth) acrylate malate, hydroxide Unsaturated polybasic acids such as cyclopropyl (meth) acrylate malate, dicyclopentadiene malate or polyfunctional (meth) acrylate having one carboxyl group and two or more (meth) acryloyl groups; (meth) acrylic Acid 2-hydroxyethyl, (meth) acrylic acid 2-hydroxypropyl, (meth) acrylic acid glycidyl, the following acrylic compound No. 1 1 to No. 4, methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate ( (Meth) acrylate isooctyl, (meth) acrylate isononyl, (meth) acrylate stearyl, (meth) acrylate lauryl, (meth) acrylate methoxyethyl, (meth) acrylate dimethylaminomethyl, (meth) acrylate dimethyl (meth) acrylate Aminoethyl, aminopropyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, ethoxyethyl (meth) acrylate, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, (meth ) Ethyl hexyl acrylate, (meth) acrylic acid Noxyethyl, tetrahydrofuryl (meth) acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (Meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolethane tri ( Meta) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol ester Unsaturated monobasic acids such as la (meth) acrylate, pentaerythritol tri (meth) acrylate, tricyclodecane dimethylol di (meth) acrylate, tri [(meth) acryloylethyl] isocyanurate, polyester (meth) acrylate oligomers, etc. Polyhydric alcohol or ester of polyhydric phenol; Metal salt of unsaturated polybasic acid such as zinc (meth) acrylate and magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyl Tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrofuran Phthalic anhydride-Male anhydride Acid anhydride, acid anhydride of unsaturated polybasic acid such as dodecenyl succinic anhydride, methyl hymic acid anhydride; (meth) acrylamide, methylene bis (meth) acrylamide, diethylene triamine tris (meth) acrylamide, xylylene bis (meth) Unsaturated monobasic acids such as acrylamide, α-chloroacrylamide, N-2-hydroxyethyl (meth) acrylamide and amides of polyhydric amines; unsaturated aldehydes such as acrolein; (meth) acrylonitrile, α-chloroacrylonitrile, cyanation Unsaturated nitriles such as vinylidene and allyl cyanide; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene, vinylbenzoic acid, vinyl Unsaturated aromatic compounds such as phenol, vinyl sulfonic acid, 4-vinyl benzene sulfonic acid, vinyl benzyl methyl ether, vinyl benzyl glycidyl ether; unsaturated ketones such as methyl vinyl ketone; vinyl amine, allylamine, N-vinyl pyrrolidone, vinyl piperidine Unsaturated amine compounds such as vinyl alcohol such as allyl alcohol and crotyl alcohol; vinyl ethers such as vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether, isobutyl vinyl ether and allyl glycidyl ether; maleimide, N-phenyl maleimide, N- Unsaturated imides such as cyclohexyl maleimide; Indens such as indene and 1-methyl indene; Aliphatic conjugated dienes such as 1,3-butadiene, isoprene and chloroprene; Macromonomers having a mono (meth) acryloyl group at the end of the polymer molecular chain, such as polystyrene, polymethyl (meth) acrylate, poly-n-butyl (meth) acrylate and polysiloxane; vinyl chloride, vinylidene chloride, divinyl succinyl And diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, vinyl urethane compounds of hydroxyl group-containing vinyl monomers and polyisocyanate compounds, hydroxyl group-containing Mention may be made of vinyl epoxy compounds of vinyl monomers and polyepoxy compounds.
The said ethylenically unsaturated compound (D) can be used individually or in mixture of 2 or more types.
 上記エチレン性不飽和化合物としては、市販品を用いることもできる。該市販品としては、例えば、カヤラッドDPHA、DPEA-12、PEG400DA、THE-330、RP-1040、NPGDA、PET30、R-684(以上、日本化薬社製);アロニックスM-215、M-350(以上、東亞合成社製);NKエステルA-DPH、A-TMPT、A-DCP、A-HD-N、TMPT、DCP、NPG及びHD-N(以上、新中村化学工業社製);SPC-1000、SPC-3000(以上、昭和電工社製);NKオリゴU-4HA、U-4H、U-6HA、U-15HA、U-108A、U-1084A、U-200AX、U-122A、U-340A、U-324A、UA-53H、UA-100、AH-600(以上、新中村化学工業社製)、UA-306H、AI-600、UA-101T、UA-101I、UA-306T、UA-306I(以上、共栄社化学社製)、アートレジンUN-9200A、UN-3320HA、UN-3320HB、UN-3320HC、UN-3320HS、SH-380G、SH-500、SH-9832、UN-901T、UN-904、UN-905、UN-906、UN-906S、UN-907、UN-952、UN-953、UN-954、H-91、H-135(以上、根上工業社製)、サートマーCN968、CN975、CN989、CN9001、CN9010、CN9025、CN9029、CN9165、CN2260(以上、サートマー社製)、EBECRYL8810(ダイセル社製)等が挙げられる。 A commercial item can also be used as said ethylenically unsaturated compound. Examples of the commercially available product include Kayalad DPHA, DPEA-12, PEG400DA, THE-330, RP-1040, NPGDA, PET30, R-684 (manufactured by Nippon Kayaku Co., Ltd.); Alonix M-215, M-350. NK ester A-DPH, A-TMPT, A-DCP, A-HD-N, TMPT, DCP, NPG and HD-N (all available from Shin-Nakamura Chemical Co., Ltd.); NK oligo U-4HA, U-4H, U-6HA, U-15HA, U-108A, U-1084A, U-200AX, U-122A, U-1000, SPC-3000 (all manufactured by Showa Denko KK); -340A, U-324A, UA-53H, UA-100, AH-600 (all available from Shin-Nakamura Chemical Co., Ltd.), UA-306H, AI-600, UA 101T, UA-101I, UA-306T, UA-306I (above, Kyoeisha Chemical Co., Ltd.), Art resin UN-9200A, UN-3320HA, UN-3320HB, UN-3320HC, UN-3320HS, SH-380G, SH- 500, SH-9832, UN-901T, UN-904, UN-905, UN-906, UN-906S, UN-952, UN-953, UN-953, UN-954, H-91, H-135 ( As described above, Netogami Kogyo Co., Ltd.), Sartomer CN 968, CN 975, CN 989, CN 9001, CN 9010, CN 9025, CN 9029, CN 9165, CN 2260 (all manufactured by Sartmar Corporation), EBECRYL 8810 (manufactured by Daicel Corporation), etc. may be mentioned.
Figure JPOXMLDOC01-appb-C000020
Figure JPOXMLDOC01-appb-C000020
Figure JPOXMLDOC01-appb-C000021
Figure JPOXMLDOC01-appb-C000021
Figure JPOXMLDOC01-appb-C000022
Figure JPOXMLDOC01-appb-C000022
Figure JPOXMLDOC01-appb-C000023
Figure JPOXMLDOC01-appb-C000023
 本発明の重合性組成物において、エチレン性不飽和化合物(D)の含有量は、特に限定されるものではないが、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、好ましくは、1~50質量部、より好ましくは、1~30質量部であり、更に好ましくは、5~20質量部である。エチレン性不飽和化合物(D)の含有量が、上記の範囲内である場合、得られる硬化物が硬化性及び遮光性に優れることから好ましい。
 例えば厚さ1~3μmの硬化膜を形成する場合には、エチレン性不飽和化合物(D)の含有量は、特に限定されるものではないが、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、エチレン性不飽和化合物(D)が好ましくは、1~50質量部、より好ましくは、1~30質量部であり、更に好ましくは、5~20質量部である。
In the polymerizable composition of the present invention, the content of the ethylenically unsaturated compound (D) is not particularly limited, but the polymerization initiator (A), the colorant (B), the alkali developable compound (C) 1 to 50 parts by mass, more preferably 1 to 30 parts by mass, and still more preferably 5 to 20 parts by mass, based on 100 parts by mass of the total of the ethylenic unsaturated compounds (D) is there. When content of an ethylenically unsaturated compound (D) is in said range, since the hardened | cured material obtained is excellent in curability and light-shielding property, it is preferable.
For example, in the case of forming a cured film having a thickness of 1 to 3 μm, the content of the ethylenically unsaturated compound (D) is not particularly limited, but the polymerization initiator (A), the colorant (B) The ethylenically unsaturated compound (D) is preferably 1 to 50 parts by mass, more preferably 1 to 50 parts by mass with respect to a total of 100 parts by mass of the alkali developable compound (C) and the ethylenically unsaturated compound (D). The amount is 30 parts by mass, more preferably 5 to 20 parts by mass.
 本発明の重合性組成物には、更に溶剤を加えることができる。該溶剤としては、通常、必要に応じて上記の各成分(重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)等)を溶解又は分散しえる溶剤を用いることができる。例えば、メチルエチルケトン、メチルアミルケトン、ジエチルケトン、アセトン、メチルイソプロピルケトン、メチルイソブチルケトン、シクロヘキサノン及び2-ヘプタノン等のケトン系溶剤;エチルエーテル、ジオキサン、テトラヒドロフラン、1,2-ジメトキシエタン、1,2-ジエトキシエタン及びジプロピレングリコールジメチルエーテル等のエーテル系溶剤;酢酸メチル、酢酸エチル、酢酸-n-プロピル、酢酸イソプロピル、酢酸n-ブチル、3-メトキシブチルアセテート、酢酸シクロヘキシル、乳酸エチル、コハク酸ジメチル及びテキサノール等のエステル系溶剤;エチレングリコールモノメチルエーテル及びエチレングリコールモノエチルエーテル等のセロソルブ系溶剤;メタノール、エタノール、イソ-又はn-プロパノール、イソ-又はn-ブタノール及びアミルアルコール等のアルコール系溶剤;エチレングリコールモノメチルアセテート、エチレングリコールモノエチルアセテート、プロピレングリコール-1-モノメチルエーテル(PGM)、プロピレングリコール-1-モノメチルエーテル-2-アセテート(PGMEA)、ジプロピレングリコールモノメチルエーテルアセテート、3-メトキシブチルアセテート及びエトキシエチルプロピオネート等のエーテルエステル系溶剤;ベンゼン、トルエン及びキシレン等のBTX系溶剤;ヘキサン、ヘプタン、オクタン及びシクロヘキサン等の脂肪族炭化水素系溶剤;テレピン油、D-リモネン及びピネン等のテルペン系炭化水素油;ミネラルスピリット、スワゾール#310(以上、コスモ松山石油社製);及びソルベッソ#100(以上、エクソン化学社製);等のパラフィン系溶剤;四塩化炭素、クロロホルム、トリクロロエチレン、塩化メチレン及び1,2-ジクロロエタン等のハロゲン化脂肪族炭化水素系溶剤;クロロベンゼン等のハロゲン化芳香族炭化水素系溶剤;カルビトール系溶剤、アニリン、トリエチルアミン、ピリジン、酢酸、アセトニトリル、二硫化炭素、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、N-メチルピロリドン、ジメチルスルホキシド及び水等が挙げられ、これらの溶剤は1種又は2種以上の混合溶剤として使用することができる。 A solvent can be further added to the polymerizable composition of the present invention. As the solvent, usually, the above-mentioned respective components (polymerization initiator (A), coloring agent (B), alkali developable compound (C) and ethylenic unsaturated compound (D), etc.) are dissolved or optionally, if necessary. Dispersible solvents can be used. For example, ketone solvents such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2- Ether solvents such as diethoxyethane and dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, 3-methoxybutyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate and the like Ester solvents such as texanol; cellosolv solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, iso- or n- ester Alcohol solvents such as methanol, iso- or n-butanol and amyl alcohol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether (PGM), propylene glycol-1-monomethyl ether-2-acetate Ether ester solvents such as (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate and ethoxyethyl propionate; BTX solvents such as benzene, toluene and xylene; fats such as hexane, heptane, octane and cyclohexane Group hydrocarbon solvents; terpene hydrocarbon oils such as turpentine oil, D-limonene and pinene; mineral spirit, swasol # 310 (more, Cosmo Matsuyama Paraffin solvents such as Oil Co., Ltd .; and Solvesso # 100 (all, Exxon Chemical Co., Ltd.); Halogenated aliphatic hydrocarbon solvents such as carbon tetrachloride, chloroform, trichloroethylene, methylene chloride and 1,2-dichloroethane Halogenated aromatic hydrocarbon solvents such as chlorobenzene; carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone And dimethylsulfoxide, water and the like, and these solvents can be used as one or more mixed solvents.
 これらの中でもケトン系溶剤、エステル系溶剤及びエーテルエステル系溶剤等、特にシクロヘキサノン、3-メトキシブチルアセテート、コハク酸ジメチル及びPGMEA等が、重合性組成物においてレジストと重合開始剤の相溶性がよいので好ましい。 Among them, ketone solvents, ester solvents, ether ester solvents, etc., in particular cyclohexanone, 3-methoxybutyl acetate, dimethyl succinate and PGMEA etc., have good compatibility between the resist and the polymerization initiator in the polymerizable composition. preferable.
 PGMEA、3-メトキシブチルアセテート、コハク酸ジメチルを併用すると均一な塗工面が得られるため、好ましい、さらに上記溶剤の質量基準の比率(PGMEA:3-メトキシブチルアセテート:コハク酸ジメチル)が15~25:2~5:1である場合が特に好ましい。 A combination of PGMEA, 3-methoxybutyl acetate and dimethyl succinate is preferable because a uniform coated surface can be obtained, so that the weight ratio of the above solvent (PGMEA: 3-methoxybutyl acetate: dimethyl succinate) is 15 to 25. The case of 2 to 5: 1 is particularly preferred.
 本発明の重合性組成物において、上記溶剤の含有量は、特に限定されるものではないが、重合性組成物全量100質量%中30~95質量%になることが好ましく、より好ましくは、50~95質量%である。
 溶剤の含有量が上記範囲の場合、ハンドリング性(重合性組成物の粘度や濡れ性)、乾燥時のムラの低減及び液安定性(組成物に含まれる成分の析出や沈降を伴わない)に優れる重合性組成物となり、硬化物を得る際に硬化物の厚さを適切にコントロールできることから好ましい。
In the polymerizable composition of the present invention, the content of the solvent is not particularly limited, but it is preferably 30 to 95% by mass in 100% by mass of the total amount of the polymerizable composition, more preferably 50 It is ̃95 mass%.
When the content of the solvent is in the above range, the handling property (viscosity and wettability of the polymerizable composition), unevenness of drying reduction and liquid stability (without precipitation and sedimentation of components contained in the composition) It is preferable because it becomes an excellent polymerizable composition, and the thickness of the cured product can be appropriately controlled when obtaining the cured product.
 本発明の重合性組成物には、必要に応じて、更にエポキシ化合物、アルカリ現像性付与剤、分散剤、潜在性添加剤、有機重合体、無機化合物、カップリング剤、連鎖移動剤、増感剤、界面活性剤及びメラミン化合物、p-アニソール、ハイドロキノン、ピロカテコール、t-ブチルカテコール及びフェノチアジン等の熱重合抑制剤;可塑剤;接着促進剤;充填剤;消泡剤;レベリング剤;表面調整剤;酸化防止剤;紫外線吸収剤;分散助剤;凝集防止剤;触媒;効果促進剤;架橋剤;増粘剤等の慣用の添加物を加えることができる。 In the polymerizable composition of the present invention, if necessary, an epoxy compound, an alkali developability imparting agent, a dispersant, a latent additive, an organic polymer, an inorganic compound, a coupling agent, a chain transfer agent, and a sensitization. Polymerization inhibitors such as surfactants, surfactants and melamine compounds, p-anisole, hydroquinone, pyrocatechol, t-butyl catechol and phenothiazine; plasticizers; adhesion promoters; fillers; antifoams; leveling agents; Antioxidants; UV absorbers; dispersing aids; flocculants; catalysts; effect accelerators; crosslinking agents; conventional additives such as thickeners may be added.
 上記エポキシ化合物としては、例えば、メチルグリシジルエーテル、2-エチルヘキシルグリシジルエーテル、ブチルグリシジルエーテル、デシルグリシジルエーテル、C12~13混合アルキルグリシジルエーテル、フェニル-2-メチルグリシジルエーテル、セチルグリシジルエーテル、ステアリルグリシジルエーテル、グリシジルメタクリレート、イソプロピルグリシジルエーテル、アリルグリシジルエーテル、エチルグリシジルエーテル、2-メチルオクチルグリシジルエーテル、フェニルグリシジルエーテル、4-n-ブチルフェニルグリシジルエーテル、4-フェニルフェノールグリシジルエーテル、クレジルグリシジルエーテル、ジブロモクレジルグリシジルエーテル、デシルグリシジルエーテル、メトキシポリエチレングリコールモノグリシジルエーテル、エトキシポリエチレングリコールモノグリシジルエーテル、ブトキシポリエチレングリコールモノグリシジルエーテル、フェノキシポリエチレングリコールモノグリシジルエーテル、ジブロモフェニルグリシジルエーテル、1,4-ブタンジオールジグリシジルエーテル、1,5-ペンタンジオールジグリシジルエーテル、1,6-ヘキサンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、1,1,2,2-テトラキス(グリシジルオキシフェニル)エタン及びペンタエリスリトールテトラグリシジルエーテル等のグリシジルエーテル化物;グリシジルアセテート、グリシジルステアレート等のグリシジルエステル類;2-(3,4-エポキシシクロヘキシル-5,5-スピロ-3,4-エポキシ)シクロヘキサン-メタジオキサン、メチレンビス(3,4-エポキシシクロヘキサン)、プロパン-2,2-ジイル-ビス(3,4-エポキシシクロヘキサン)、2,2-ビス(3,4-エポキシシクロヘキシル)プロパン、エチレンビス(3,4-エポキシシクロヘキサンカルボキシレート)、ビス(3,4-エポキシシクロヘキシルメチル)アジペート、3,4-エポキシシクロヘキシルメチル 3,4-エポキシシクロヘキサンカルボキシレート、3,4-エポキシ-1-メチルシクロヘキシル 3,4-エポキシ-1-メチルヘキサンカルボキシレート、6-メチル-3,4-エポキシシクロヘキシルメチル 6-メチル-3,4-エポキシシクロヘキサンカルボキシレート、3,4-エポキシ-3-メチルシクロヘキシルメチル 3,4-エポキシ-3-メチルシクロヘキサンカルボキシレート、3,4-エポキシ-5-メチルシクロヘキシルメチル 3,4-エポキシ-5-メチルシクロヘキサンカルボキシレート、1-エポキシエチル-3,4-エポキシシクロヘキサン、1,2-エポキシ-2-エポキシエチルシクロヘキサン、ジシクロペンタジエンジエポキサイド、3,4-エポキシ-6-メチルシクロヘキシルカルボキシレート、α-ピネンオキシド、スチレンオキシド、シクロヘキセンオキサイド及びシクロペンテンオキサイド等のエポキシシクロアルキル型化合物及びN-グリシジルフタルイミド等が挙げられる。 Examples of the above epoxy compounds include methyl glycidyl ether, 2-ethylhexyl glycidyl ether, butyl glycidyl ether, decyl glycidyl ether, C12 to 13 mixed alkyl glycidyl ether, phenyl 2-methyl glycidyl ether, cetyl glycidyl ether, stearyl glycidyl ether, Glycidyl methacrylate, isopropyl glycidyl ether, allyl glycidyl ether, ethyl glycidyl ether, 2-methyloctyl glycidyl ether, phenyl glycidyl ether, 4-n-butylphenyl glycidyl ether, 4-phenylphenol glycidyl ether, cresyl glycidyl ether, dibromocresyl Glycidyl ether, decyl glycidyl ether, methoxypolyethylene glycol Cole monoglycidyl ether, ethoxy polyethylene glycol monoglycidyl ether, butoxy polyethylene glycol monoglycidyl ether, phenoxy polyethylene glycol monoglycidyl ether, dibromophenyl glycidyl ether, 1,4-butanediol diglycidyl ether, 1,5-pentanediol diglycidyl ether Glycidyl ether compounds such as 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,1,2,2-tetrakis (glycidyloxyphenyl) ethane and pentaerythritol tetraglycidyl ether; glycidyl acetate, glycidyl stear Glycidyl esters such as acrylate; 2- (3,4-epoxycyclohexyl-5,5-spi -3,4-Epoxy) cyclohexane-metadioxane, methylene bis (3,4-epoxycyclohexane), propane-2,2-diyl-bis (3,4-epoxycyclohexane), 2,2-bis (3,4-) Epoxycyclohexyl) propane, ethylenebis (3,4-epoxycyclohexanecarboxylate), bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexyl Epoxy-1-methylcyclohexyl 3,4-epoxy-1-methylhexane carboxylate, 6-methyl-3,4-epoxycyclohexylmethyl 6-methyl-3,4-epoxycyclohexane carboxylate, 3,4-epoxy-3 -Methyl Chlorohexylmethyl 3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl 3,4-epoxy-5-methylcyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxy Epoxy cyclos such as cyclohexane, 1,2-epoxy-2-epoxyethyl cyclohexane, dicyclopentadiene diepoxide, 3,4-epoxy-6-methylcyclohexyl carboxylate, α-pinene oxide, styrene oxide, cyclohexene oxide and cyclopentene oxide Alkyl type compounds and N-glycidyl phthalimide etc. may be mentioned.
 上記エポキシ化合物としては、エポキシ化ポリオレフィンを用いることもできる。エポキシ化ポリオレフィンとは、ポリオレフィンをエポキシ基含有単量体で変性して、エポキシ基を導入したポリオレフィンである。エチレン又は炭素数3~20のα-オレフィンと、エポキシ基含有単量体と、必要に応じて他のモノマーとを、共重合法又はグラフト法のいずれかにより共重合させることによって製造することができる。エチレン又は炭素数3~20のα-オレフィン、エポキシ基含有単量体及び他のモノマーは、それぞれ単独で重合させてもよく、他の単量体と複数で重合させてもよい。また、末端に水酸基を有する非共役のポリブタジエンの二重結合を、過酢酸法によりエポキシ化して得ることもでき、分子内に水酸基を持つものを使用してもよい。また、水酸基をイソシアネートでウレタン化し、ここに1級水酸基含有エポキシ化合物を反応させてエポキシ基を導入することもできる。 An epoxidized polyolefin can also be used as said epoxy compound. The epoxidized polyolefin is a polyolefin in which an epoxy group is introduced by modifying the polyolefin with an epoxy group-containing monomer. Producing by copolymerizing ethylene or an α-olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer, and, if necessary, another monomer by either a copolymerization method or a graft method it can. Ethylene or an α-olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer and another monomer may be polymerized alone or in combination with other monomers. Also, the double bond of a non-conjugated polybutadiene having a hydroxyl group at the end can be obtained by epoxidation by the peracetic acid method, and one having a hydroxyl group in the molecule may be used. Moreover, a hydroxyl group can be urethane-ized with isocyanate, and a primary hydroxyl group-containing epoxy compound can be made to react here, and an epoxy group can be introduce | transduced.
 上記エチレン又は炭素数3~20のα-オレフィンとしては、エチレン、プロピレン、ブチレン、イソブチレン、1,3-ブタジエン、1,4-ブタジエン、1,3-ペンタジエン、2,3-ジメチル-1,3-ブタジエン、ピペリレン、3-ブチル-1,3-オクタジエン及びイソプレン等が挙げられる。 Examples of ethylene or α-olefins of 3 to 20 carbon atoms include ethylene, propylene, butylene, isobutylene, 1,3-butadiene, 1,4-butadiene, 1,3-pentadiene, 2,3-dimethyl-1,3 -Butadiene, piperylene, 3-butyl-1,3-octadiene, isoprene and the like can be mentioned.
 上記エポキシ基含有単量体としては、たとえばα,β-不飽和酸のグリシジルエステル、ビニルベンジルグリシジルエーテル及びアリルグリシジルエーテル等が挙げられる。α,β-不飽和酸のグリシジルエステルとしては、具体的にはアクリル酸グリシジル、メタクリル酸グリシジル及びエタクリル酸グリシジル等が挙げられ、特にメタクリル酸グリシジルが好ましい。 Examples of the epoxy group-containing monomer include glycidyl esters of α, β-unsaturated acids, vinyl benzyl glycidyl ether and allyl glycidyl ether. Specific examples of glycidyl esters of α, β-unsaturated acids include glycidyl acrylate, glycidyl methacrylate and glycidyl ethacrylic acid, with glycidyl methacrylate being particularly preferred.
 上記エポキシ化合物としては、市販品も使用することができる。好適な市販品としては、例えば、エポライト40E、1500NP、1600、80MF、4000及び3002(以上、共栄社化学社製);アデカグリシロールED-503、ED-503D、ED-503G、ED-523T、ED-513、ED-501、ED-502、ED-509、ED-518、ED-529、アデカレジンEP-4000、EP-4005、EP-4080及びEP-4085(以上、ADEKA社製);デナコールEX-201、EX-203、EX-211、EX-212、EX-221、EX-251、EX-252、EX-711、EX-721、デナコールEX-111、EX-121、EX-141、EX-142、EX-145、EX-146、EX-147、EX-171、EX-192及びEX-731(以上、ナガセケムテックス社製);EHPE-3150、セロキサイド2021P、2081、2000及び3000(以上、ダイセル社製);エピオールM、EH、L-41、SK、SB、TB及びOH(以上、日油社製);エポライトM-1230及び100MF(以上、共栄社化学社製);アロンオキセタンOXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211及びOXT-212(以上、東亞合成社製);エタナコールOXBP及びOXTP(以上、宇部興産社製);2-ヒドロキシエチルビニルエーテル、ジエチレングリコールモノビニルエーテル及び4-ヒドロキシブチルビニルエーテル(以上、丸善石油化学社製);デナコールEX-121、EX-141、EX-142、EX-145、EX-146、EX-147、EX-201、EX-203、EX-711、EX-721、オンコートEX-1020、EX-1030、EX-1040、EX-1050、EX-1051、EX-1010、EX-1011及び1012(以上、ナガセケムテックス社製);オグソールPG-100、EG-200、EG-210及びEG-250(以上、大阪ガスケミカル社製);HP4032、HP4032D及びHP4700(以上、DIC社製);ESN-475V(東都化成社製);マープルーフG-0105SA及びG-0130SP(以上、日油社製);エピクロンN-665及びHP-7200(以上、DIC社製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H及びNC-7000L(以上、日本化薬社製)等が挙げられる。 A commercial item can also be used as said epoxy compound. Suitable commercial products include, for example, Epolight 40E, 1500 NP, 1600, 80 MF, 4000 and 3002 (all, manufactured by Kyoeisha Chemical Co., Ltd.); Adeka Glycyrol ED-503, ED-503 D, ED-503 G, ED-523 T, ED -513, ED-501, ED-502, ED-509, ED-518, ED-529, Adeka Resin EP-4000, EP-4005, EP-4080 and EP-4085 (all from Adeka); Denacol EX- 201, EX-203, EX-211, EX-212, EX-221, EX-251, EX-252, EX-711, EX-721, Denacol EX-111, EX-121, EX-141, EX-142 , EX-145, EX-146, EX-147, EX-171, EX-192 and EX-731 (above, Nagase ChemteX Corporation); EHPE-3150, Celoxides 2021 P, 2081, 2000 and 3000 (above, Daicel Corporation); Epiol M, EH, L-41, SK, SB, TB and OH ( Above, manufactured by NOF Corporation; Epolight M-1230 and 100 MF (all, manufactured by Kyoeisha Chemical Co., Ltd.); Aron oxetane OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211 and OXT-212 Etanacol OXBP and OXTP (above, Ube Industries, Ltd.); 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether and 4-hydroxybutyl vinyl ether (above, Maruzen Petrochemical Co., Ltd.); 121, EX-141, EX- 42, EX-145, EX-146, EX-147, EX-201, EX-203, EX-711, EX-721, On Coat EX-1020, EX-1030, EX-1040, EX-1050, EX- 1051, EX-1010, EX-1011 and 1012 (all manufactured by Nagase ChemteX Corp.); Ogsol PG-100, EG-200, EG-210 and EG-250 (all manufactured by Osaka Gas Chemical Co., Ltd.); HP4032, HP4032D And HP 4700 (all manufactured by DIC); ESN-475V (manufactured by Tohto Kasei Co., Ltd.); Marproof G-0105SA and G-0130SP (all manufactured by NOF Corporation); Epiclon N-665 and HP-7200 (all manufactured by DIC) EOCN-1020, EOCN-102S, EOCN-103S, EOCN 104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H and NC-7000L (manufactured by Nippon Kayaku Co., Ltd.).
 上記アルカリ現像性付与剤とは、ラジカル重合性を有さず、アルカリ現像性を付与する化合物であり、そのような化合物としては、酸価を有することでアルカリ水溶液に可溶な化合物であれば特に限定されないが、代表的なものとしてアルカリ可溶性ノボラック樹脂(以下、単に「ノボラック樹脂」という)が挙げられる。ノボラック樹脂は、フェノール類とアルデヒド類とを酸触媒の存在下に重縮合して得られる。 The above-mentioned alkali developing property imparting agent is a compound which does not have radical polymerizability and imparts alkali developing property, and as such a compound, it is a compound which is soluble in an aqueous alkali solution by having an acid value. Although not particularly limited, alkali-soluble novolak resins (hereinafter simply referred to as "novolak resins") are mentioned as typical ones. Novolak resins are obtained by polycondensation of phenols and aldehydes in the presence of an acid catalyst.
 上記フェノール類としては、例えばフェノール、o-クレゾール、m-クレゾール、p-クレゾール、o-エチルフェノール、m-エチルフェノール、p-エチルフェノール、o-ブチルフェノール、m-ブチルフェノール、p-ブチルフェノール、2,3-キシレノール、2,4-キシレノール、2,5-キシレノール、3,4-キシレノール、3,5-キシレノール、2,3,5-トリメチルフェノール、p-フェニルフェノール、ヒドロキノン、カテコール、レゾルシノール、2-メチルレゾルシノール、ピロガロール、α-ナフトール、ビスフェノールA、ジヒドロキシ安息香酸エステル及び没食子酸エステル等が用いられ、これらのフェノール類のうちフェノール、o-クレゾール、m-クレゾール、p-クレゾール、2,5-キシレノール、3,5-キシレノール、2,3,5-トリメチルフェノール、レゾルシノール、2-メチルレゾルシノール及びビスフェノールA等が好ましい。これらのフェノール類は、単独で又は2種以上混合して用いられる。 Examples of the above-mentioned phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butylphenol, 3-xylenol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, p-phenylphenol, hydroquinone, catechol, resorcinol, 2- Methyl resorcinol, pyrogallol, α-naphthol, bisphenol A, dihydroxybenzoic acid ester, gallic acid ester and the like are used. Among these phenols, phenol, o-cresol, m-cresol, p-cresol, 2,5- Shirenoru, 3,5-xylenol, 2,3,5-trimethylphenol, resorcinol, 2-methyl resorcinol and bisphenol A are preferable. These phenols may be used alone or in combination of two or more.
 上記アルデヒド類としては、例えばホルムアルデヒド、パラホルムアルデヒド、アセトアルデヒド、プロピルアルデヒド、ベンズアルデヒド、フェニルアセトアルデヒド、α-フェニルプロピルアルデヒド、β-フェニルプロピルアルデヒド、o-ヒドロキシベンズアルデヒド、m-ヒドロキシベンズアルデヒド、p-ヒドロキシベンズアルデヒド、o-クロロベンズアルデヒド、m-クロロベンズアルデヒド、p-クロロベンズアルデヒド、o-ニトロベンズアルデヒド、m-ニトロベンズアルデヒド、p-ニトロベンズアルデヒド、o-メチルベンズアルデヒド、m-メチルベンズアルデヒド、p-メチルベンズアルデヒド、p-エチルベンズアルデヒド及びp-n-ブチルベンズアルデヒド等が用いられ、これらの化合物のうちホルムアルデヒド、アセトアルデヒド及びベンズアルデヒド等が好ましい。これらのアルデヒド類は、単独で又は2種以上混合して用いられる。アルデヒド類はフェノール類1モル当たり、好ましくは0.7~3モル、特に好ましくは0.7~2モルの割合で使用される。 Examples of the aldehyde include formaldehyde, paraformaldehyde, acetaldehyde, propylaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropylaldehyde, β-phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o -Chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methyl benzaldehyde, m-methyl benzaldehyde, p-methyl benzaldehyde, p-ethyl benzaldehyde and p -N-butyl benzaldehyde etc. are used, and of these compounds Aldehyde, acetaldehyde and benzaldehyde are preferred. These aldehydes may be used alone or in combination of two or more. The aldehydes are preferably used in a proportion of 0.7 to 3 moles, particularly preferably 0.7 to 2 moles, per mole of phenols.
 上記酸触媒としては、例えば塩酸、硝酸、硫酸等の無機酸、又は蟻酸、蓚酸、酢酸等の有機酸が用いられる。これらの酸触媒の使用量は、フェノール類1モル当たり、1×10-4~5×10-1モルが好ましい。縮合反応においては、通常、反応媒質として水が用いられるが、縮合反応に用いられるフェノール類がアルデヒド類の水溶液に溶解せず、反応初期から不均一系になる場合には、反応媒質として親水性溶媒を使用することもできる。これらの親水性溶媒としては、例えばメタノール、エタノール、プロパノール及びブタノール等のアルコール類、又はテトラヒドロフラン及びジオキサン等の環状エーテル類が挙げられる。これらの反応媒質の使用量は、通常、反応原料100質量部当たり、20~1000質量部である。縮合反応の反応温度は、反応原料の反応性に応じて適宜調整することができるが、通常、10~200℃、好ましくは70~150℃である。縮合反応終了後、系内に存在する未反応原料、酸触媒及び反応媒質を除去するため、一般的には内温を130~230℃に上昇させ、減圧下に揮発分を留去し、次いで溶融したノボラック樹脂をスチール製ベルト等の上に流涎して回収する。
 また縮合反応終了後に、前記親水性溶媒に反応混合物を溶解し、水、n-ヘキサン及びn-ヘプタン等の沈殿剤に添加することにより、ノボラック樹脂を析出させ、析出物を分離し、加熱乾燥することにより回収することもできる。
As the acid catalyst, for example, an inorganic acid such as hydrochloric acid, nitric acid or sulfuric acid, or an organic acid such as formic acid, oxalic acid or acetic acid is used. The amount of these acid catalysts used is preferably 1 × 10 -4 to 5 × 10 -1 mol per mole of phenol. In the condensation reaction, water is usually used as the reaction medium, but when the phenols used in the condensation reaction do not dissolve in the aqueous solution of aldehydes and become heterogeneous from the initial stage of the reaction, they are hydrophilic as the reaction medium Solvents can also be used. These hydrophilic solvents include, for example, alcohols such as methanol, ethanol, propanol and butanol, or cyclic ethers such as tetrahydrofuran and dioxane. The amount of the reaction medium used is usually 20 to 1000 parts by mass per 100 parts by mass of the reaction raw material. The reaction temperature of the condensation reaction can be appropriately adjusted depending on the reactivity of the reaction raw material, but it is usually 10 to 200 ° C., preferably 70 to 150 ° C. After completion of the condensation reaction, the internal temperature is generally raised to 130 to 230 ° C. in order to remove unreacted raw materials, acid catalyst and reaction medium present in the system, and volatile components are distilled off under reduced pressure, and then The molten novolak resin is collected by flowing on a steel belt or the like.
After completion of the condensation reaction, the reaction mixture is dissolved in the hydrophilic solvent and added to a precipitant such as water, n-hexane and n-heptane to precipitate the novolac resin, and the precipitate is separated and dried by heating. It can also be collected by
 上記ノボラック樹脂以外の例としては、ポリヒドロキシスチレン又はその誘導体、スチレン-無水マレイン酸共重合体及びポリビニルヒドロキシベンゾエート等が挙げられる。 As examples other than the above novolak resin, polyhydroxystyrene or a derivative thereof, styrene-maleic anhydride copolymer, polyvinyl hydroxybenzoate and the like can be mentioned.
 上記分散剤としては、着色剤(B)を分散、安定化できるものであれば何でも良く、市販の分散剤、例えばビックケミー社製、BYKシリーズ等を用いることができ、塩基性官能基を有するポリエステル、ポリエーテル、ポリウレタンからなる高分子分散剤、塩基性官能基として窒素原子を有し、窒素原子を有する官能基がアミン、及び/又はその四級塩であり、アミン価が1~100mgKOH/gのものが好適に用いられる。 Any dispersant may be used as the dispersant, as long as it can disperse and stabilize the colorant (B), and commercially available dispersants such as BYK series manufactured by Bick Chemie Co., Ltd. can be used, and polyester having a basic functional group , A polymer dispersant comprising a polyether, a polyurethane, a nitrogen atom as a basic functional group, and a functional group having a nitrogen atom is an amine and / or a quaternary salt thereof, and has an amine value of 1 to 100 mg KOH / g Is preferably used.
 上記潜在性添加剤とは、常温、光露光工程及びプリベーク工程では不活性であり、100~250℃で加熱するか、又は酸/塩基触媒存在下で80~200℃で加熱することにより保護基が脱離して活性化するものである。活性化したことにより得られる効果としては、酸化防止、紫外線吸収、防汚性、リコート性及び密着性等が挙げられる。
 上記潜在性添加剤としてはWO2014/021023号パンフレットに記載されているものを好ましく使うことができる。
The latent additive is inert at room temperature, in the light exposure step and the pre-bake step, and is heated at 100 to 250 ° C. or protected at 80 to 200 ° C. in the presence of an acid / base catalyst. Is to be desorbed and activated. As an effect obtained by having activated, oxidation prevention, ultraviolet-ray absorption, antifouling property, recoat property, adhesiveness, etc. are mentioned.
As the latent additive, those described in WO 2014/021023 can be preferably used.
 上記潜在性添加剤としては市販品を用いることができ、例えば、アデカアークルズGPA-5001等が挙げられる。 A commercial item can be used as the latent additive, and examples thereof include Adeka Arkles GPA-5001 and the like.
 上記有機重合体としては、例えば、ポリスチレン、ポリメチルメタクリレート、メチルメタクリレート-エチルアクリレート共重合体、ポリ(メタ)アクリル酸、スチレン-(メタ)アクリル酸共重合体、(メタ)アクリル酸-メチルメタクリレート共重合体、エチレン-塩化ビニル共重合体、エチレン-ビニル共重合体、ポリ塩化ビニル樹脂、ABS樹脂、ナイロン6、ナイロン66、ナイロン12、ウレタン樹脂、ポリカーボネートポリビニルブチラール、セルロースエステル、ポリアクリルアミド、飽和ポリエステル、フェノール樹脂、フェノキシ樹脂、ポリアミドイミド樹脂、ポリアミック酸樹脂、エポキシ樹脂等が挙げられ、これらの中でも、ポリスチレン、(メタ)アクリル酸-メチルメタクリレート共重合体、エポキシ樹脂が好ましい。
 上記アルカリ現像性化合物(C)と共に、上記有機重合体を用いることによって、硬化物の特性を改善することもできる。
 有機重合体を使用する場合、その使用量は、上記アルカリ現像性化合物(C)100質量部に対して、好ましくは10~500質量部である。
Examples of the organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymer, poly (meth) acrylic acid, styrene-(meth) acrylic acid copolymer, (meth) acrylic acid-methyl methacrylate Copolymer, ethylene-vinyl chloride copolymer, ethylene-vinyl copolymer, polyvinyl chloride resin, ABS resin, nylon 6, nylon 66, nylon 12, urethane resin, polycarbonate polyvinyl butyral, cellulose ester, polyacrylamide, saturated Polyester, phenol resin, phenoxy resin, polyamide imide resin, polyamic acid resin, epoxy resin, etc. may be mentioned. Among these, polystyrene, (meth) acrylic acid-methyl methacrylate copolymer, epoxy resin Masui.
The properties of the cured product can also be improved by using the organic polymer together with the alkali developable compound (C).
When an organic polymer is used, the amount thereof used is preferably 10 to 500 parts by mass with respect to 100 parts by mass of the alkali developable compound (C).
 上記無機化合物としては、例えば、酸化ニッケル、酸化鉄、酸化イリジウム、酸化チタン、酸化亜鉛、酸化マグネシウム、酸化カルシウム、酸化カリウム、シリカ及びアルミナ等の金属酸化物;層状粘土鉱物、ミロリブルー、炭酸カルシウム、炭酸マグネシウム、コバルト系、マンガン系、ガラス粉末、マイカ、タルク、カオリン、フェロシアン化物、各種金属硫酸塩、硫化物、セレン化物、アルミニウムシリケート、カルシウムシリケート、水酸化アルミニウム、白金、金、銀及び銅等が挙げられ、これらの中でも、酸化チタン、シリカ、層状粘土鉱物、及び銀等が好ましい。 Examples of the above-mentioned inorganic compounds include nickel oxide, iron oxide, iridium oxide, titanium oxide, zinc oxide, magnesium oxide, calcium oxide, potassium oxide, metal oxides such as silica and alumina; layered clay mineral, miloli blue, calcium carbonate, Magnesium carbonate, cobalt, manganese, glass powder, mica, talc, kaolin, ferrocyanide, various metal sulfates, sulfides, selenide, aluminum silicate, calcium silicate, aluminum silicate, aluminum hydroxide, platinum, gold, silver and copper Among these, titanium oxide, silica, layered clay minerals, silver and the like are preferable.
 本発明の重合性組成物に無機化合物を含有させることで、感光性ペースト組成物として用いることができる。該感光性ペースト組成物は、プラズマディスプレイパネルの隔壁パターン、誘電体パターン、電極パターン及びブラックマトリクスパターンなどの焼成物パターンを形成するために用いられる。
 また、これら無機化合物は、例えば、充填剤、反射防止剤、導電剤、安定剤、難燃剤、機械的強度向上剤、特殊波長吸収剤及び撥インク剤等としても好適に用いられる。
By incorporating an inorganic compound in the polymerizable composition of the present invention, it can be used as a photosensitive paste composition. The photosensitive paste composition is used to form fired product patterns such as partition patterns, dielectric patterns, electrode patterns and black matrix patterns of plasma display panels.
These inorganic compounds are also suitably used as, for example, fillers, antireflective agents, conductive agents, stabilizers, flame retardants, mechanical strength improvers, special wavelength absorbers, ink repellents, and the like.
 本発明の重合性組成物において、無機化合物が添加される場合、無機化合物の含有量は、上記アルカリ現像性化合物(C)100質量部に対して、好ましくは0.1~50質量部、より好ましくは0.5~20質量部であり、これらの無機化合物は1種又は2種以上を使用することができる。 In the polymerizable composition of the present invention, when an inorganic compound is added, the content of the inorganic compound is preferably 0.1 to 50 parts by mass, relative to 100 parts by mass of the alkali developable compound (C). The amount is preferably 0.5 to 20 parts by mass, and these inorganic compounds may be used alone or in combination of two or more.
 上記カップリング剤としては、例えば、ジメチルジメトキシシラン、ジメチルジエトキシシラン、メチルエチルジメトキシシラン、メチルエチルジエトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリメトキシシラン等のアルキル官能性アルコキシシラン、ビニルトリクロロシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、アリルトリメトキシシラン等のアルケニル官能性アルコキシシラン、3-メタクリロキシプロピルトリエトキシシラン、3-メタクリロキシプロピルトリメトキシシラン、3-メタクリロキシプロピルメチルジエトキシシラン、3-メタクリロキシプロピルメチルジメトキシシラン、2-メタクリロキシプロピルトリメトキシシラン等の(メタ)アクリル酸エステル官能性アルコキシシラン、γ-グリシドキシプロピルトリメトキシシラン、γ-グリシドキシプロピルメチルジエトキシシラン、β-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン、γ-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン等のエポキシ官能性アルコキシシラン、N-β(アミノエチル)-γ-アミノプロピルトリメトキシシラン、γ-アミノプロピルトリエトキシシラン、N-フェニル-γ-アミノプロピルトリメトキシシラン等のアミノ官能性アルコキシシラン、γ-メルカプトプロピルトリメトキシシラン等のメルカプト官能性アルコキシシラン、3-イソシアネートプロピルトリエトキシシラン等のイソシアネート官能性アルコキシシラン、3-ウレイドプロピルトリアルコキシシラン等のウレイド官能性アルコキシシラン、トリス-(トリメトキシシリルプロピル)イソシアヌレート等のイソシアヌレート官能性アルコキシシラン、チタンテトライソプロポキシド、チタンテトラノルマルブトキシド等のチタンアルコキシド類、チタンジオクチロキシビス(オクチレングリコレート)、チタンジイソプロポキシビス(エチルアセトアセテート)等のチタンキレート類、ジルコニウムテトラアセチルアセトネート、ジルコニウムトリブトキシモノアセチルアセトネート等のジルコニウムキレート類、ジルコニウムトリブトキシモノステアレート等のジルコニウムアシレート類、メチルトリイソシアネートシラン等のイソシアネートシラン類等を用いることができる。
 カップリング剤を添加することにより、硬化物と基材間(特にガラス)の密着性を向上するので好ましい。
Examples of the coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane and the like. Alkenyl functional alkoxysilanes such as alkyl functional alkoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane, etc. Ta) Acrylic ester functional alkoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (3 Epoxy functional alkoxysilanes such as (4,4-epoxycyclohexyl) propyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyl Aminofunctional alkoxysilanes such as trimethoxysilane, mercaptofunctional alkoxysilanes such as γ-mercaptopropyltrimethoxysilane, isocyanate functional alkoxysilanes such as 3-isocyanatopropyltriethoxysilane, 3-ureidopropyl Ureido functional alkoxysilanes such as alkoxysilanes, isocyanurate functional alkoxysilanes such as tris- (trimethoxysilylpropyl) isocyanurate, titanium alkoxides such as titanium tetraisopropoxide, titanium tetranormal butoxide, titanium dioctyloxy Titanium chelates such as bis (octylene glycolate), titanium diisopropoxy bis (ethyl acetoacetate), zirconium chelates such as zirconium tetraacetylacetonate, zirconium tributoxy monoacetylacetonate, zirconium tributoxy monostearate, etc. Zirconium acylates, and isocyanate silanes such as methyl triisocyanate silane can be used.
The addition of a coupling agent is preferable because it improves the adhesion between the cured product and the substrate (particularly glass).
 上記カップリング剤としては市販品を用いることができ、例えば、KA-1003、KBM-1003、KBE-1003、KBM-303、KBM-403、KBE-402、KBE-403、KBM-1403、KBM-502、KBM-503、KBE-502、KBE-503、KBM-5103、KBM-602、KBM-603、KBE-603,KBM-903,KBE-903,KBE-9103,KBM-573、KBM-575、KBM-6123、KBE-585、KBM-703、KBM-802、KBM-803、KBE-846、KBE-9007、KBM-04、KBE-04、KBM-13、KBE-13、KBE-22、KBE-103、HMDS-3、KBM-3063、KBM-3103C、KPN-3504及びKF-99(以上、信越シリコーン社製)等が挙げられる。 A commercial item can be used as said coupling agent, For example, KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-403, KBM- 502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-9103, KBM-573, KBM-575, KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007, KBM-04, KBE-04, KBM-13, KBE-13, KBE-22, KBE-KBE 103, HMDS-3, KBM-3063, KBM-3103C, KP -3504 and KF-99 (or, Shin-Etsu Silicone Co., Ltd.).
 上記連鎖移動剤及び増感剤としては、一般的に硫黄原子含有化合物が用いられる。例えばチオグリコール酸、チオリンゴ酸、チオサリチル酸、2-メルカプトプロピオン酸、3-メルカプトプロピオン酸、3-メルカプト酪酸、N-(2-メルカプトプロピオニル)グリシン、2-メルカプトニコチン酸、3-[N-(2-メルカプトエチル)カルバモイル]プロピオン酸、3-[N-(2-メルカプトエチル)アミノ]プロピオン酸、N-(3-メルカプトプロピオニル)アラニン、2-メルカプトエタンスルホン酸、3-メルカプトプロパンスルホン酸、4-メルカプトブタンスルホン酸、ドデシル(4-メチルチオ)フェニルエーテル、2-メルカプトエタノール、3-メルカプト-1,2-プロパンジオール、1-メルカプト-2-プロパノール、3-メルカプト-2-ブタノール、メルカプトフェノール、2-メルカプトエチルアミン、2-メルカプトイミダゾール、2-メルカプトベンゾイミダゾール、2-メルカプト-3-ピリジノール、2-メルカプトベンゾチアゾール、メルカプト酢酸、トリメチロールプロパントリス(3-メルカプトプロピオネート)及びペンタエリスリトールテトラキス(3-メルカプトプロピオネート)等のメルカプト化合物;該メルカプト化合物を酸化して得られるジスルフィド化合物、ヨード酢酸、ヨードプロピオン酸、2-ヨードエタノール、2-ヨードエタンスルホン酸及び3-ヨードプロパンスルホン酸等のヨード化アルキル化合物;トリメチロールプロパントリス(3-メルカプトイソブチレート)、ブタンジオールビス(3-メルカプトイソブチレート)、ヘキサンジチオール、デカンジチオール、1,4-ジメチルメルカプトベンゼン、ブタンジオールビスチオプロピオネート、ブタンジオールビスチオグリコレート、エチレングリコールビスチオグリコレート、トリメチロールプロパントリスチオグリコレート、ブタンジオールビスチオプロピオネート、トリメチロールプロパントリスチオプロピオネート、トリメチロールプロパントリスチオグリコレート、ペンタエリスリトールテトラキスチオプロピオネート、ペンタエリスリトールテトラキスチオグリコレート、トリスヒドロキシエチルトリスチオプロピオネート、下記化合物No.C1、昭和電工社製カレンズPEー1及びNR1等が挙げられる。 A sulfur atom-containing compound is generally used as the chain transfer agent and the sensitizer. For example, thioglycolic acid, thiomalic acid, thiosalicylic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, N- (2-mercaptopropionyl) glycine, 2-mercaptonicotinic acid, 3- [N- ( 2-mercaptoethyl) carbamoyl] propionic acid, 3- [N- (2-mercaptoethyl) amino] propionic acid, N- (3-mercaptopropionyl) alanine, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, 4-Mercaptobutanesulfonic acid, dodecyl (4-methylthio) phenyl ether, 2-mercaptoethanol, 3-mercapto-1,2-propanediol, 1-mercapto-2-propanol, 3-mercapto-2-butanol, mercaptophenol , 2-me Captoethylamine, 2-mercaptoimidazole, 2-mercaptobenzimidazole, 2-mercapto-3-pyridinol, 2-mercaptobenzothiazole, mercaptoacetic acid, trimethylolpropane tris (3-mercaptopropionate) and pentaerythritol tetrakis (3- 3- Mercapto compounds such as mercapto propionate); Disulfide compounds obtained by oxidizing the mercapto compounds; iodoacetic acid, iodoacetic acid, iodopropionic acid, 2-iodoethanol, 2-iodoethanesulfonic acid and iodomethane such as 3-iodopropanesulfonic acid Alkylated compounds; trimethylolpropane tris (3-mercaptoisobutyrate), butanediol bis (3-mercaptoisobutyrate), hexanedithiol, decanedithiol, 1, -Dimethylmercaptobenzene, butanediol bisthiopropionate, butanediol bisthioglycolate, ethylene glycol bisthioglycolate, trimethylolpropane tristhioglycolate, butanediol bisthiopropionate, trimethylolpropane tristhiopropio , Trimethylolpropane tristhioglycolate, pentaerythritol tetrakisthiopropionate, pentaerythritol tetrakisthioglycolate, tris hydroxyethyl tris thiopropionate, compound No. 1 below. C1, Karens PE-1 and NR1 manufactured by Showa Denko K. K.
 
Figure JPOXMLDOC01-appb-C000024
 
Figure JPOXMLDOC01-appb-C000024
 上記連鎖移動剤及び増感剤を添加することで得られる硬化物のパターンが高精細になるので好ましい。 It is preferable because the pattern of the cured product obtained by adding the above-mentioned chain transfer agent and sensitizer becomes high definition.
 上記界面活性剤としては、パーフルオロアルキルリン酸エステル、パーフルオロアルキルカルボン酸塩等のフッ素界面活性剤、高級脂肪酸アルカリ塩、アルキルスルホン酸塩、アルキル硫酸塩等のアニオン系界面活性剤、高級アミンハロゲン酸塩、第四級アンモニウム塩等のカチオン系界面活性剤、ポリエチレングリコールアルキルエーテル、ポリエチレングリコール脂肪酸エステル、ソルビタン脂肪酸エステル、脂肪酸モノグリセリド等の非イオン界面活性剤、両性界面活性剤及びシリコーン系界面活性剤等の界面活性剤を用いることができ、これらは組み合わせて用いてもよい。 Examples of the surfactant include fluorine surfactants such as perfluoroalkyl phosphates and perfluoroalkyl carboxylates, anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates and alkyl sulfates, and higher amines Cationic surfactants such as halides and quaternary ammonium salts, polyethylene glycol alkyl ethers, polyethylene glycol fatty acid esters, sorbitan fatty acid esters, nonionic surfactants such as fatty acid monoglycerides, amphoteric surfactants and silicone surfactants Surfactants such as agents can be used, and these may be used in combination.
 上記メラミン化合物としては、(ポリ)メチロールメラミン、(ポリ)メチロールグリコールウリル、(ポリ)メチロールベンゾグアナミン及び(ポリ)メチロールウレア等の窒素化合物中の活性メチロール基(CHOH基)の全部又は一部(少なくとも2つ)がアルキルエーテル化された化合物を挙げることができる。ここで、アルキルエーテルを構成するアルキル基としては、メチル基、エチル基及びブチル基が挙げられ、互いに同一であってもよいし、異なっていてもよい。また、アルキルエーテル化されていないメチロール基は、一分子内で自己縮合していてもよく、二分子間で縮合して、その結果オリゴマー成分が形成されていてもよい。具体的には、ヘキサメトキシメチルメラミン、ヘキサブトキシメチルメラミン、テトラメトキシメチルグリコールウリル及びテトラブトキシメチルグリコールウリル等を用いることができる。これらのなかでも、ヘキサメトキシメチルメラミン及びヘキサブトキシメチルメラミン等のアルキルエーテル化されたメラミンが好ましい。 Examples of the melamine compound, (poly) methylol melamine, (poly) methylol glycoluril, all or part of the (poly) methylol benzoguanamine and (poly) active methylol groups of the nitrogen compound such as methylol urea (CH 2 OH groups) Mention may be made of compounds in which (at least two) are alkyletherified. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group and a butyl group, which may be identical to or different from each other. Moreover, the methylol group which is not alkyletherified may be self-condensing within one molecule, or may be condensed between two molecules to form an oligomer component as a result. Specifically, hexamethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylglycoluril and tetrabutoxymethylglycoluril can be used. Among these, alkyletherified melamines such as hexamethoxymethylmelamine and hexabutoxymethylmelamine are preferable.
 本発明の重合性組成物において、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)、エチレン性不飽和化合物(D)、溶剤及び無機化合物以外の任意成分の含有量は、その使用目的に応じて適宜選択され、本発明の効果を損なわない限りにおいては、特に制限されないが、好ましくは、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)の合計100質量部に対して、合計で20質量部以下である。 In the polymerizable composition of the present invention, the content of optional components other than the polymerization initiator (A), the colorant (B), the alkali developing compound (C), the ethylenically unsaturated compound (D), the solvent and the inorganic compound Is appropriately selected depending on the purpose of use, and is not particularly limited as long as the effects of the present invention are not impaired, but preferably, polymerization initiator (A), colorant (B), alkali developable compound (C) The total amount is 20 parts by mass or less based on 100 parts by mass of the total of 100 parts by mass of the ethylenically unsaturated compound (D).
 本発明のBM用感光性組成物は、必須成分として、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)を含有し、感光性及びアルカリ現像性を有し、BMを形成することに特に適した組成物である。 The photosensitive composition for BM according to the present invention contains, as essential components, a polymerization initiator (A), a colorant (B), an alkali developing compound (C) and an ethylenically unsaturated compound (D), and is photosensitive. And alkali developability, and is a composition particularly suitable for forming a BM.
 本発明のBCS用感光性組成物は、必須成分として、重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及びエチレン性不飽和化合物(D)を含有し、感光性及びアルカリ現像性を有し、BCSを形成することに特に適した組成物である。 The photosensitive composition for BCS of the present invention contains, as essential components, a polymerization initiator (A), a colorant (B), an alkali developable compound (C) and an ethylenically unsaturated compound (D), and is photosensitive. And alkali developability, and is a composition particularly suitable for forming BCS.
 本発明の重合性組成物、BM用感光性組成物又はBCS用感光性組成物並びに硬化物は、硬化性塗料、ワニス、硬化性接着剤、プリント基板、ディスプレイ表示装置(カラーテレビ、PCモニタ、携帯情報端末及びデジタルカメラ等のカラー表示の液晶表示パネルにおけるカラーフィルタ、種々の表示用途用のカラーフィルタ、CCDイメージセンサのカラーフィルタ、タッチパネル、電気発光表示装置(マイクロLEDの隔壁材)、プラズマ表示パネル、有機ELの黒色隔壁、粉末コーティング、印刷インク、印刷版、接着剤、ゲルコート、電子工学用のフォトレジスト、電気メッキレジスト、エッチングレジスト、はんだレジスト、絶縁膜、ブラックマトリクス、及びLCDの製造工程において構造を形成するためのレジスト、電気及び電子部品を封入するための組成物、ソルダーレジスト、磁気記録材料、微小機械部品、導波路、光スイッチ、めっき用マスク、エッチングマスク、カラー試験系、ガラス繊維ケーブルコーティング、スクリーン印刷用ステンシル、ステレオリトグラフィによって三次元物体を製造するための材料、ホログラフィ記録用材料、画像記録材料、微細電子回路、脱色材料、画像記録材料のための脱色材料、マイクロカプセルを使用する画像記録材料用の脱色材料、印刷配線板用フォトレジスト材料、UV及び可視レーザー直接画像系用のフォトレジスト材料、プリント回路基板の逐次積層における誘電体層形成に使用するフォトレジスト材料及び保護膜等の各種の用途に使用することができ、その用途に特に制限はないが、上記用途の中でもディスプレイ表示装置には、特に好適に用いることがでる。 The polymerizable composition of the present invention, the photosensitive composition for BM or the photosensitive composition for BCS and the cured product are curable paint, varnish, curable adhesive, printed circuit board, display device (color TV, PC monitor, Color filters in color display liquid crystal display panels such as portable information terminals and digital cameras, color filters for various display applications, color filters for CCD image sensors, touch panels, electroluminescent display devices (partition materials for micro LEDs), plasma display Manufacturing process of panel, organic EL black partition, powder coating, printing ink, printing plate, adhesive, gel coat, photoresist for electronics, electroplating resist, etching resist, solder resist, insulating film, black matrix, and LCD Resists to form structures in Composition for Encapsulating Electronic Component, Solder Resist, Magnetic Recording Material, Micro Mechanical Component, Waveguide, Optical Switch, Plating Mask, Etching Mask, Color Test System, Glass Fiber Cable Coating, Stencil for Screen Printing, Stereolithograph Materials for producing three-dimensional objects, materials for holographic recording, image recording materials, microelectronic circuits, bleaching materials, bleaching materials for image recording materials, bleaching materials for image recording materials using microcapsules, Use in various applications such as photoresist materials for printed wiring boards, photoresist materials for UV and visible laser direct imaging systems, and photoresist materials and protective films used for dielectric layer formation in successive lamination of printed circuit boards There are no particular restrictions on its use, but there are The play display, out be particularly suitably used.
 本発明のディスプレイ表示装置は、本発明の硬化物(特にBCS)を備える以外は従来公知の表示装置と同じ構成であるが、BCSは、セルとセルの間に設けるのがよい。 The display device of the present invention has the same structure as a conventionally known display device except that it comprises the cured product of the present invention (in particular, BCS), but BCS may be provided between cells.
 有機ELの黒色隔壁として本発明の重合性組成物を用いる場合、パターン形状の垂直化、現像密着性の向上、耐熱性が向上することから重量平均分子量5000以上のアルカリ現像性化合物を用いることが好ましく、更に好ましくは重量平均分子量7000~15000のアルカリ現像性化合物を用いることが好ましい。更に、アルカリ現像性化合物が、上記一般式(IV)で表されるエポキシ化合物に不飽和一塩基酸を付加させた構造を有するエポキシ付加化合物と、多塩基酸無水物とのエステル化反応により得られる構造を有する不飽和化合物である場合が特に好ましい。 When the polymerizable composition of the present invention is used as a black partition wall of an organic EL, an alkali developable compound having a weight average molecular weight of 5000 or more may be used because the pattern shape is verticalized, the development adhesion is improved, and the heat resistance is improved. It is preferable to use an alkali developable compound having a weight average molecular weight of 7000 to 15,000. Further, it is obtained by an esterification reaction between an epoxy addition compound having a structure in which an unsaturated monobasic acid is added to an epoxy compound represented by the above general formula (IV), and an polybasic acid anhydride. Particularly preferred is the unsaturated compound having the following structure.
 本発明の重合性組成物、BM用感光性組成物及びBCS用感光性組成物を用いて硬化物を製造する方法について、以下に詳細に説明する。 The method for producing a cured product using the polymerizable composition of the invention, the photosensitive composition for BM and the photosensitive composition for BCS will be described in detail below.
 本発明の重合性組成物、BM用感光性組成物及びBCS用感光性組成物は、スピンコーター、ロールコーター、バーコーター、ダイコーター、カーテンコーター、各種の印刷、浸漬等の公知の手段で、ソーダガラス、石英ガラス、半導体基板、金属、紙、プラスチック等の支持基体上に適用することができる。また、一旦フィルム等の支持基体上に施した後、他の支持基体上に転写することもでき、その適用方法に制限はない。 The polymerizable composition of the present invention, the photosensitive composition for BM and the photosensitive composition for BCS can be prepared by a known method such as spin coater, roll coater, bar coater, die coater, curtain coater, various printing, immersion and the like. It can be applied on a supporting substrate such as soda glass, quartz glass, semiconductor substrate, metal, paper, plastic and the like. In addition, once applied on a supporting substrate such as a film, it can be transferred onto another supporting substrate, and the method of application is not limited.
 また、本発明の重合性組成物及びBCS用感光性組成物を硬化させる際に用いられるエネルギー線の光源としては、超高圧水銀ランプ、高圧水銀ランプ、中圧水銀ランプ、低圧水銀ランプ、水銀蒸気アーク灯、キセノンアーク灯、カーボンアーク灯、メタルハライドランプ、蛍光灯、タングステンランプ、エキシマーランプ、殺菌灯、発光ダイオード、CRT光源等から得られる2000オングストロームから7000オングストロームの波長を有する電磁波エネルギーや電子線、X線、放射線等の高エネルギー線を利用することができるが、好ましくは、波長300~450nmの光を発光する超高圧水銀ランプ、水銀蒸気アーク灯、カーボンアーク灯、キセノンアーク灯等が挙げられる。 Moreover, as a light source of energy rays used when curing the polymerizable composition of the present invention and the photosensitive composition for BCS, an ultra high pressure mercury lamp, a high pressure mercury lamp, a medium pressure mercury lamp, a low pressure mercury lamp, mercury vapor Electromagnetic wave energy or electron beam having a wavelength of 2000 angstrom to 7000 angstrom obtained from arc lamp, xenon arc lamp, carbon arc lamp, metal halide lamp, fluorescent lamp, tungsten lamp, excimer lamp, germicidal lamp, light emitting diode, CRT light source etc. Although high energy rays such as X-rays and radiation can be used, preferably, ultra-high pressure mercury lamps that emit light with a wavelength of 300 to 450 nm, mercury vapor arc lamps, carbon arc lamps, xenon arc lamps and the like can be mentioned. .
 更に、露光光源にレーザー光を用いることにより、マスクを用いずに、コンピューター等のデジタル情報から直接画像を形成するレーザー直接描画法が、生産性のみならず、解像性や位置精度等の向上も図れることから有用であり、そのレーザー光としては、340~430nmの波長の光が好適に使用されるが、エキシマーレーザー、窒素レーザー、アルゴンイオンレーザー、ヘリウムカドミウムレーザー、ヘリウムネオンレーザー、クリプトンイオンレーザー、各種半導体レーザー及びYAGレーザー等の可視から赤外領域の光を発するものも用いられる。これらのレーザーを使用する場合には、可視から赤外の当該領域を吸収する増感色素が加えられる。 Furthermore, by using a laser beam as an exposure light source, a laser direct writing method of directly forming an image from digital information of a computer or the like without using a mask improves not only productivity but also resolution and positional accuracy. It is useful because it can also be used, and light with a wavelength of 340 to 430 nm is suitably used as the laser light, but excimer lasers, nitrogen lasers, argon ion lasers, helium cadmium lasers, helium neon lasers, krypton ion lasers Also usable are those emitting light in the visible to infrared region such as various semiconductor lasers and YAG lasers. When using these lasers, sensitizing dyes that absorb the relevant region of visible to infrared are added.
 本発明の硬化物はBCSとして特に有用である。BCSは、(1)本発明のBCS用感光性組成物の塗膜を基板上に形成する工程、(2)該塗膜に所定のパターン形状を有するマスクを介して放射線を照射する工程、(3)露光後のベーク工程、(4)露光後の該被膜を現像する工程、(5)現像後の該被膜を加熱する工程により好ましく形成される。
 上記マスクとしては、ハーフトーンマスク又はグレースケールマスク等の多階調マスクを用いることもできる。
The cured products of the present invention are particularly useful as BCS. (1) forming a coating film of the photosensitive composition for BCS of the present invention on a substrate, (2) irradiating the coating film with radiation through a mask having a predetermined pattern shape, 3) Baking step after exposure, (4) Step of developing the film after exposure, (5) Step of heating the film after development
As the mask, a multi-tone mask such as a halftone mask or a gray scale mask can also be used.
 以下、実施例及び比較例を挙げて本発明を更に詳細に説明するが、本発明はこれらの実施例等に限定されるものではない。 Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to these examples and the like.
[製造例1]ラクタムブラック分散液B-1の調製
 有機系の黒色顔料(ラクタムブラックとしてブラック582;BASF社製)、分散剤(BYK-167)及び分散物のためのポリマー(後述するアルカリ現像性化合物PGMEA溶液C-2)を、それぞれ、16質量部、3.2質量部及び3.6質量部で混合した後で、この混合物にプロピレングリコールモノメチルエーテルアセタート(PGMEA)を固形分濃度25質量%となるよう秤量して添加し、混合物を作成した。
 上記混合物をスターラーにより予備混合した後、直径0.3mmのジルコニアビーズを分散物(混合物から溶剤であるPGMEAを除いたもの)と同じ重量で添加し、25~60℃の温度で6時間にわたってペイントシェーカーによる分散物処理にかけたのち、フィルタを用いてジルコニアビーズを取り除き、分散液を得た。得られた分散液にPGMEAを追加し、分散物濃度が20質量%となるように調整し、スターラーにより均一にした後、ラクタムブラック分散液B-1を得た。
Preparation Example 1 Preparation of Lactam Black Dispersion B-1 Organic Black Pigment (Black 582 as Lactam; manufactured by BASF), Dispersant (BYK-167), Polymer for Dispersion (Alkali Development Described Below) Functional compound PGMEA solution C-2) in 16 parts by mass, 3.2 parts by mass and 3.6 parts by mass, respectively, to this mixture are added propylene glycol monomethyl ether acetate (PGMEA) at a solid concentration of 25 The mixture was weighed and added so as to be% by mass.
After the above mixture is premixed with a stirrer, 0.3 mm diameter zirconia beads are added in the same weight as the dispersion (the mixture minus the solvent PGMEA) and painted for 6 hours at a temperature of 25 to 60 ° C. After the dispersion was treated with a shaker, the zirconia beads were removed using a filter to obtain a dispersion. PGMEA was added to the obtained dispersion, and the dispersion concentration was adjusted to 20% by mass, and after making uniform with a stirrer, lactam black dispersion B-1 was obtained.
[製造例2]ペリレンブラック分散液B-2の調製
 有機系の黒色顔料[ペリレンブラックとしてC.I.ピグメントブラック31(PalIogenBlackS0084;BASF社製)]、分散剤(BYK-167)及び分散物のためのポリマー(後述するアルカリ現像性化合物PGMEA溶液C-2)を、それぞれ、12質量部、3.6質量部及び8質量部で混合した後で、この混合物にプロピレングリコールモノメチルエーテルアセタート(PGMEA)を固形分濃度25質量%となるよう秤量して添加し、混合物を作成した。
 上記混合物をスターラーにより予備混合した後、直径0.3mmのジルコニアビーズを分散物(混合物から溶剤であるPGMEAを除いたもの)と同じ重量で添加し、25~60℃の温度で6時間にわたってペイントシェーカーによる分散物処理にかけたのち、フィルタを用いてジルコニアビーズを取り除き、分散液を得た。得られた分散液にPGMEAを追加し、分散物濃度が20質量%となるように調整し、スターラーにより均一にした後、ペリレンブラック分散液B-2を得た。
Preparation Example 2 Preparation of Perylene Black Dispersion B-2 Organic Black Pigment [C. I. Pigment black 31 (PalIogenBlackS0084; manufactured by BASF Corp.)], dispersant (BYK-167) and polymer for dispersion (alkaline developable compound PGMEA solution C-2 described later) each in 12 parts by mass, 3.6 parts After mixing in parts by mass and 8 parts by mass, propylene glycol monomethyl ether acetate (PGMEA) was weighed and added to this mixture so as to have a solid content concentration of 25% by mass to prepare a mixture.
After the above mixture is premixed with a stirrer, 0.3 mm diameter zirconia beads are added in the same weight as the dispersion (the mixture minus the solvent PGMEA) and painted for 6 hours at a temperature of 25 to 60 ° C. After the dispersion was treated with a shaker, the zirconia beads were removed using a filter to obtain a dispersion. PGMEA was added to the obtained dispersion, and the dispersion concentration was adjusted to 20% by mass, and after making uniform using a stirrer, a perylene black dispersion B-2 was obtained.
[製造例3]カーボンブラック分散液B-3の調製
 カーボンブラックとしてMA100(三菱化学社製)を20質量部、分散剤としてBYK161(ビックケミー(BYK)社製)12.5質量部(固形分濃度40質量%)、溶媒としてプロピレングリコールモノメチルエーテルアセテート67.5質量部を混合し、ビーズミルにより処理して、カーボンブラック分散液Bー3を調製した。
Preparation Example 3 Preparation of Carbon Black Dispersion B-3 20 parts by mass of MA100 (manufactured by Mitsubishi Chemical Corporation) as carbon black, and 12.5 parts by mass of BYK 161 (manufactured by BIC Chemie (BYK)) as a dispersing agent (solid content concentration 40 mass%) and 67.5 parts by mass of propylene glycol monomethyl ether acetate as a solvent were mixed and treated by a bead mill to prepare carbon black dispersion liquid B-3.
[製造例4]アルカリ現像性化合物PGMEA溶液C-2の調製
 1,1-ビス〔4-(2,3-エポキシプロピルオキシ)フェニル〕インダンの184g、アクリル酸58g、2,6-ジ-tert-ブチル-p-クレゾール0.26g、テトラ-n-ブチルアンモニウムブロミド0.11g及びPGMEA105gを仕込み、120℃で16時間撹拌した。反応液を室温まで冷却し、PGMEA160g、ビフタル酸無水物59g及びテトラ-n-ブチルアンモニウムブロミド0.24gを加えて、120℃で4時間撹拌した。更に、テトラヒドロ無水フタル酸20gを加え、120℃で4時間、100℃で3時間、80℃で4時間、60℃で6時間、40℃で11時間撹拌した後、PGMEA128gを加えて、PGMEA溶液としてアルカリ現像性化合物C-2を得た(Mw=5000、Mn=2100、酸価(固形分)92.7mgKOH/g)。アルカリ現像性化合物PGMEA溶液C-2におけるアルカリ現像性化合物の含有率は45質量%であった。
Preparation Example 4 Preparation of Alkali Developing Compound PGMEA Solution C-2 184 g of 1,1-bis [4- (2,3-epoxypropyloxy) phenyl] indane, 58 g of acrylic acid, 2,6-di-tert 0.26 g of -butyl-p-cresol, 0.11 g of tetra-n-butylammonium bromide and 105 g of PGMEA were charged and stirred at 120 ° C. for 16 hours. The reaction solution was cooled to room temperature, 160 g of PGMEA, 59 g of biphthalic anhydride and 0.24 g of tetra-n-butylammonium bromide were added, and the mixture was stirred at 120 ° C. for 4 hours. Further, 20 g of tetrahydrophthalic anhydride is added, and the mixture is stirred at 120 ° C. for 4 hours, 100 ° C. for 3 hours, 80 ° C. for 4 hours, 60 ° C. for 6 hours, 40 ° C. for 11 hours. As a result, an alkali developable compound C-2 was obtained (Mw = 5000, Mn = 2100, acid value (solid content) 92.7 mg KOH / g). The content of the alkali developable compound in the alkali developable compound PGMEA solution C-2 was 45% by mass.
[製造例5]アルカリ現像性化合物PGMEA溶液C-3の製造
 9,9-ビス(4-グリシジルオキシフェニル)フルオレン75.0g、アクリル酸23.8g、2,6-ジ-t-ブチル-p-クレゾール0.273g、テトラブチルアンモニウムクロリド0.585g、及びPGMEA65.9gを仕込み、90℃で1時間、100℃で1時間、110℃で1時間及び120℃で14時間撹拌した。室温まで冷却し、無水コハク酸25.9g、テトラブチルアンモニウムクロリド0.427g、及びPGMEA1.37gを加えて、100℃で5時間撹拌した。さらに、9,9-ビス(4-グリシジルオキシフェニル)フルオレン30.0g、2,6-ジ-t-ブチル-p-クレゾール0.269g、及びPGMEA1.50gを加えて、90℃で90分、120℃で4時間撹拌後、PGMEA122.2gを加えて、PGMEA溶液として目的物であるアルカリ現像性化合物C-3を得た(Mw=4190、Mn=2170,酸価(固形分)52mg・KOH/g)。アルカリ現像性化合物PGMEA溶液C-3におけるアルカリ現像性化合物の含有率は45質量%であった。
Preparation Example 5 Preparation of Alkali-Developable Compound PGMEA Solution C-3 75.0 g of 9,9-bis (4-glycidyloxyphenyl) fluorene, 23.8 g of acrylic acid, 2,6-di-t-butyl-p 0.273 g of cresol, 0.585 g of tetrabutylammonium chloride and 65.9 g of PGMEA are charged and stirred at 90 ° C. for 1 hour, 100 ° C. for 1 hour, 110 ° C. for 1 hour and 120 ° C. for 14 hours. The mixture was cooled to room temperature, 25.9 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride and 1.37 g of PGMEA were added, and the mixture was stirred at 100 ° C. for 5 hours. Furthermore, 30.0 g of 9,9-bis (4-glycidyloxyphenyl) fluorene, 0.269 g of 2,6-di-t-butyl-p-cresol, and 1.50 g of PGMEA are added, and the mixture is heated at 90 ° C. for 90 minutes. After stirring for 4 hours at 120 ° C., 122.2 g of PGMEA was added to obtain an alkali developable compound C-3 as a target product as a PGMEA solution (Mw = 4190, Mn = 2170, acid value (solid content) 52 mg · KOH) / G). The content of the alkali developable compound in the alkali developable compound PGMEA solution C-3 was 45% by mass.
[実施例1~14及び比較例1~5]重合性組成物の調製
 [表1]~[表4]の配合に従って各成分を混合し、重合性組成物(実施例1~12及び比較例1~5)を得た。尚、表中の配合の数値は質量部を表す。
 また、表中の各成分の符号は、下記の成分を表す。
A1-1 化合物No.A1-1  [(A1)成分に属する重合開始剤]
A2-1 化合物No.A2-1  [(A2)成分に属する重合開始剤]
A2-2 化合物No.A2-8  [(A2)成分に属する重合開始剤]
A2-3 化合物No.A2-14 [(A2)成分に属する重合開始剤]
A3-1 IRGACURE907  
    (水酸基を有さないα-アミノアセトフェノン化合物;BASF社製)
B-1 ラクタムブラック分散液B-1
B-2 ペリレンブラック分散液B-2
B-3 カーボンブラック分散液B-3
C-1 CCR-1171H
    (一般式(II)で表されるアルカリ現像性化合物PGMEA溶液 固形分69.5質量%;  日本化薬社製
C-2 アルカリ現像性化合物PGMEA溶液C-2
C-3 アルカリ現像性化合物PGMEA溶液C-3
D-1 カヤラッドDPHA(エチレン性不飽和化合物;日本化薬社製)
D-2 UA-306H(ウレタンモノマー、PETA+HDI)
E-1 γ-グリシドキシプロピルトリメトキシシラン(カップリング剤)
E-2 カレンズPE-1(チオール化合物;昭和電工社製)
G-1 PGMEA
G-2 3-メトキシブチルアセテート
G-3 コハク酸ジメチル
[Examples 1 to 14 and Comparative Examples 1 to 5] Preparation of Polymerizable Composition Each component is mixed according to the composition of [Table 1] to [Table 4], and polymerizable compositions (Examples 1 to 12 and Comparative Example) I got 1 to 5). In addition, the numerical value of the composition in a table represents a mass part.
Moreover, the code | symbol of each component in a table | surface represents the following components.
A1-1 Compound No. A1-1 [polymerization initiator belonging to component (A1)]
A2-1 Compound No. A2-1 [polymerization initiator belonging to (A2) component]
A2-2 Compound No. A2-8 [polymerization initiator belonging to (A2) component]
A2-3 Compound No. A2-14 [polymerization initiator belonging to (A2) component]
A3-1 IRGACURE 907
(Α-Aminoacetophenone compound having no hydroxyl group; manufactured by BASF)
B-1 Lactam black dispersion B-1
B-2 Perylene Black Dispersion B-2
B-3 Carbon Black Dispersion B-3
C-1 CCR-1171H
(Alkali Developing Compound PGMEA Solution Represented by General Formula (II) Solid Content 69.5% by Mass; Nippon Kayaku Co., Ltd. C-2 Alkaline Developing Compound PGMEA Solution C-2
C-3 Alkali developable compound PGMEA solution C-3
D-1 Kayarad DPHA (ethylenically unsaturated compound; manufactured by Nippon Kayaku Co., Ltd.)
D-2 UA-306H (urethane monomer, PETA + HDI)
E-1 γ-Glycidoxypropyltrimethoxysilane (Coupling Agent)
E-2 Karenz PE-1 (thiol compound; manufactured by Showa Denko)
G-1 PGMEA
G-2 3-methoxybutyl acetate G-3 dimethyl succinate
[重合性組成物から得られる硬化物の評価]
 実施例1~14及び比較例1~5の重合性組成物から得られる硬化物について、弾性回復率、遮光性(OD値)、比誘電率、液晶汚染性(VHR)及び耐薬品性の評価を、下記の手順で行った。結果を[表1]~[表4]に併記する。
[Evaluation of Cured Product Obtained from Polymerizable Composition]
Evaluation of elastic recovery factor, light blocking property (OD value), relative dielectric constant, liquid crystal contamination (VHR) and chemical resistance of cured products obtained from the polymerizable compositions of Examples 1 to 14 and Comparative Examples 1 to 5. The following procedure was followed. The results are shown in [Table 1] to [Table 4].
(弾性回復率)
 ガラス基板上に実施例1~14の重合性組成物及び比較例1~5の比較重合性組成物をスピンコート(3μm厚,300rpm×7秒)により塗布し、乾燥した後90℃において100秒間プリベークを行い、溶剤を除去した後、フォトマスクを使用して高圧水銀ランプにて100mJ/cm露光後、0.04質量%KOH水溶液を用いてで現像を行った後、230℃にて30分加熱し、パターンを作成した。得られたパターンの20μm部分で、島津社ダイナミック微小硬度計DUH-211を用いて、40mNにて荷重を負荷-除荷試験をおこなった。弾性回復率(%)を下記の計算式によって算出した。
 
弾性回復率(%)=[(回復距離/圧縮変位)×100]
 
 弾性回復率(%)が、60%以上の硬化物はBCSとして使用することができ、弾性回復率(%)が、70%以上の硬化物はBCSとして好ましく使用することができ、弾性回復率(%)が、80%以上の硬化物はBCSとして特に好ましく使用することができる。
(Elastic recovery rate)
The polymerizable compositions of Examples 1 to 14 and the comparative polymerizable compositions of Comparative Examples 1 to 5 are applied by spin coating (3 μm thickness, 300 rpm × 7 seconds) on a glass substrate and dried for 100 seconds at 90 ° C. After pre-baking and removing the solvent, after exposure with a photomask using a high pressure mercury lamp at 100 mJ / cm 2 and development using a 0.04 mass% KOH aqueous solution, 30 at 230 ° C. Heated for a minute to create a pattern. A 20 μm portion of the obtained pattern was subjected to a load-unload test at 40 mN using a Shimadzu dynamic microhardness tester DUH-211. The elastic recovery rate (%) was calculated by the following formula.

Elastic recovery rate (%) = [(recovery distance / compression displacement) x 100]

A cured product having an elastic recovery rate (%) of 60% or more can be used as BCS, a cured product having an elastic recovery rate (%) of 70% or more can be preferably used as BCS, and an elastic recovery rate Cured products having (%) of 80% or more can be particularly preferably used as BCS.
(OD値)
 ガラス基板上に実施例1~14の重合性組成物及び比較例1~5の比較重合性組成物をスピンコート(300rpm、7秒間)し乾燥させた後、90℃で100秒間プリベークを行った。光源として超高圧水銀ランプを用いて露光後した後、230℃で30分間ベークして硬化物を作成した。得られた膜のOD値を、マクベス透過濃度計を用いて測定し、該OD値をポストベーク後の膜厚で割って、膜厚あたりのOD値を算出した。
 膜厚あたりのOD値が1.0以上の硬化物は、遮光性が高いため、BCSとして使用することができ、膜厚あたりのOD値が1.5以上の硬化物はBCSとして好ましく使用することができ、膜厚あたりのOD値が2.0以上の硬化物はBCSとして特に好ましく使用できる。膜厚あたりのOD値が1.0未満の硬化物はBCSとして使用できない。
(OD value)
The polymerizable compositions of Examples 1 to 14 and the comparative polymerizable compositions of Comparative Examples 1 to 5 were spin-coated (300 rpm, 7 seconds) and dried on a glass substrate, and then prebaked at 90 ° C. for 100 seconds. . After exposure using an ultra-high pressure mercury lamp as a light source, a cured product was formed by baking at 230 ° C. for 30 minutes. The OD value of the obtained film was measured using a Macbeth permeation densitometer, and the OD value was divided by the film thickness after post-baking to calculate the OD value per film thickness.
A cured product having an OD value per film thickness of 1.0 or more can be used as a BCS because the light shielding property is high, and a cured product having an OD value per film thickness of 1.5 or more is preferably used as a BCS A cured product having an OD value per film thickness of 2.0 or more can be particularly preferably used as BCS. A cured product having an OD value of less than 1.0 per film thickness can not be used as a BCS.
(比誘電率)
 ガラス基板上に実施例1~14の重合性組成物及び比較例1~5の比較重合性組成物をスピンコート(3μm厚,300rpm×7秒間)し、乾燥させた後、90℃で100秒間プリベークを行ない、マスクを使用せず高圧水銀ランプにて100mJ/cm露光した後、230℃×180分間加熱し、上記評価サンプルを作成した。(評価法)上記評価サンプルについて、LCRメーター、アジレント社4284Aを用いて、AC1V、1kHz印加し測定を行った。
 比誘電率が5.0未満の硬化物はBCSとして使用することができ、比誘電率が4.5以下の硬化物はBCSとして好ましく使用でき、比誘電率が4.0以下の硬化物はBCSとして特に好ましく使用できる。比誘電率が5.0以上の硬化物はBCSとして使用できない。
(Dielectric constant)
After spin coating (3 μm thickness, 300 rpm × 7 seconds) of the polymerizable compositions of Examples 1 to 14 and the comparative polymerizable compositions of Comparative Examples 1 to 5 on a glass substrate and drying, they are then subjected to 100 seconds at 90 ° C. After prebaking and exposing with a high pressure mercury lamp at 100 mJ / cm 2 without using a mask, the sample was heated at 230 ° C. for 180 minutes to form the above evaluation sample. (Evaluation Method) The above-mentioned evaluation sample was measured by applying an AC of 1 V and 1 kHz using an LCR meter, Agilent 4284A.
A cured product having a dielectric constant of less than 5.0 can be used as BCS, a cured product having a dielectric constant of 4.5 or less can be preferably used as a BCS, and a cured product having a dielectric constant of 4.0 or less It can be particularly preferably used as BCS. A cured product having a relative dielectric constant of 5.0 or more can not be used as a BCS.
(VHR)
 実施例1~14で得られた重合性組成物及び比較例1~5で得られた比較重合性組成物を、ガラス基板(100mm×100mm)上にスピンコーターを用いて塗布し、90℃で100秒間プリベークを行い、膜厚3.0μmの塗膜を形成した。次いで、ミラープロジェクションアライナー(製品名:TME-150RTO、株式会社トプコン製)を使用し、マスクを介さず塗膜に紫外線を照射量200mJ/cmで照射した。その後、230℃で30分間、ポストベークを行った。
 ポストベーク後の塗膜の1質量部を40質量部のADEKA社製の液晶「RS-182」と混合し、120℃で1時間保存した。これを室温に取り出し静置後、上澄み液を採取した。採取した液晶組成物のVHR(電圧保持率)を測定した。詳細な評価方法は、下記の通りである。液晶組成物を液晶評価用TNセル(セル厚5μm、電極面積8mm×8mm配向膜JALS2096)に注入し、VHRをVHR-1A(東陽テクニカ社製)を用い測定した。(測定条件:パルス電圧幅60μs、フレーム周期16.7ms、波高±5V、測定温度60℃)
 VHRが、90%以上の硬化物は、低液晶汚染性であり、BCSとして使用することができ、VHRが、95%以上の硬化物は、BCSとして好ましく使用することができ、VHRが、98%以上の硬化物は、BCSとして特に好ましく使用することができる。
 VHRが90%未満の硬化物は、BCSとして使用できない。
(VHR)
The polymerizable compositions obtained in Examples 1 to 14 and the comparative polymerizable compositions obtained in Comparative Examples 1 to 5 were coated on a glass substrate (100 mm × 100 mm) using a spin coater and at 90 ° C. Pre-baking was performed for 100 seconds to form a coating having a thickness of 3.0 μm. Then, using a mirror projection aligner (product name: TME-150RTO, manufactured by Topcon Co., Ltd.), the coating film was irradiated with ultraviolet light at an irradiation amount of 200 mJ / cm 2 without using a mask. Thereafter, post-baking was performed at 230 ° C. for 30 minutes.
One part by mass of the post-baked coating was mixed with 40 parts by mass of liquid crystal “RS-182” manufactured by ADEKA Corporation, and stored at 120 ° C. for 1 hour. This was taken out to room temperature and allowed to stand, and then the supernatant was collected. The VHR (voltage holding ratio) of the collected liquid crystal composition was measured. The detailed evaluation method is as follows. The liquid crystal composition was injected into a TN cell for liquid crystal evaluation (cell thickness 5 μm, electrode area 8 mm × 8 mm alignment film JALS 2096), and VHR was measured using VHR-1A (manufactured by Toyo Corporation). (Measurement conditions: Pulse voltage width 60 μs, frame period 16.7 ms, wave height ± 5 V, measurement temperature 60 ° C.)
Cured products with VHR of 90% or more are low in liquid crystal stain and can be used as BCS, and cured products with VHR of 95% or more can be preferably used as BCS, and VHR is 98 or less. % Or more of the cured product can be particularly preferably used as BCS.
Cured products with VHR less than 90% can not be used as BCS.
 <NMP耐薬品性>
 N-メチルピロリドン(NMP)溶出試験は以下の手順にて行った。
 まず、調製した実施例1~14で得られた重合性組成物及び比較例1~5で得られた比較重合性組成物を最終的な膜厚が3μmとなるようにスピンコーターにてガラス基板に塗布し、1分間減圧乾燥した後にホットプレート90℃で120秒間乾燥した。高圧水銀ランプにて50mJ/cm露光後に現像工程を経てからオーブン230℃で40分間加熱してレジスト塗工基板を得た。作製したレジスト塗工基板から測定用基板(25mm×35mm角)2枚を切り出してN-メチルピロリドン(NMP)8mL入りの10mL用バイアル瓶に浸漬した。そして、その測定用基板入りのバイアル瓶を90℃のクリーンオーブンに、60分間静置した状態でNMP溶出試験を実施した。40分静置後に熱浴からバイアル瓶を取り出して、そのNMP溶出溶液を分光光度計(島津製作所社製「UV-3100PC」)により300~800nmの波長範囲で1nmおきに吸光度を測定した。光源には、ハロゲンランプ及び重水素ランプ(切り替え波長360nm)を使用して、検出器には、フォトマルを使用しており、スリット幅2nmを測定条件としている。また、試料溶液は1cm角の石英セルに入れて測定する。吸光度とは、分光法において、ある物体を光が通過した際に光強度がどの程度減衰するかを示す無次元量であり、以下の式で定義される。
<NMP chemical resistance>
The N-methyl pyrrolidone (NMP) dissolution test was performed according to the following procedure.
First, the prepared polymerizable compositions obtained in Examples 1 to 14 and the comparative polymerizable compositions obtained in Comparative Examples 1 to 5 were treated with a spin coater to obtain a glass substrate with a final film thickness of 3 μm. And dried for 1 minute and then dried on a hot plate at 90.degree. C. for 120 seconds. After exposure with a high-pressure mercury lamp at 50 mJ / cm 2 and development, the substrate was heated at an oven temperature of 230 ° C. for 40 minutes to obtain a resist coated substrate. Two substrates for measurement (25 mm × 35 mm square) were cut out from the produced resist-coated substrate and immersed in a 10 mL vial containing 8 mL of N-methylpyrrolidone (NMP). And the NMP elution test was implemented in the state which left the vial bottle containing the substrate for measurement in a clean oven of 90 degreeC for 60 minutes. After standing for 40 minutes, the vial was removed from the heat bath, and the NMP-eluted solution was measured for absorbance at 1 nm intervals in a wavelength range of 300 to 800 nm using a spectrophotometer (“UV-3100 PC” manufactured by Shimadzu Corporation). A halogen lamp and a deuterium lamp (switching wavelength: 360 nm) are used as a light source, and a photomar is used as a detector, and a slit width of 2 nm is used as a measurement condition. The sample solution is placed in a 1 cm square quartz cell and measured. Absorbance is a dimensionless quantity that indicates how much the light intensity attenuates when light passes through an object in spectroscopy, and is defined by the following equation.
 A(吸光度)=-log10(I/I) (I:透過光強度、I:入射光強度) A (absorbance) = -log 10 (I / I 0 ) (I: transmitted light intensity, I 0 : incident light intensity)
 また上記の入射光強度及び透過光強度は、同じ光源から試料溶液とNMP単独へそれぞれ光を入射させた際、NMP単独を透過してきた光強度Iと試料溶液を透過してきた光強度Iと見なすことができる。したがって、上式の(I/I)は光透過率を表しており、吸光度Aは、透過率の逆数を対数表現した値ということになる。吸光度Aは、試料溶液に含有する物質の濃度などを算出する際に用いられる表記である。吸光度A=0の場合は、全く光を吸収しない状態(透過率100%)を示しており、吸光度A=∞の場合は、全く光を透過しない状態(透過率0%)を示していることになる。つまり、吸光度が強いほど、レジスト塗膜成分が多くNMPへ溶出しており、NMP耐性が悪いことを示している。測定した吸光度のスペクトル面積(nm)を算出して、下記の基準で評価を行った。
 NMP耐薬品性評価基準:NMP溶出溶液の吸収スペクトルの面積値による判定(波長300~800nm)
 ○: 20(nm)未満
 △: 20(nm)以上60(nm)未満
 ×: 60(nm)以上
 NMP耐薬品性評価が〇であるものは、BCSとして特に好ましく使用でき、△であるものは、BCSとして使用でき、×のものは、BCSとして使用できない。
 本評価基準である吸光度のスペクトル面積は、各波長における吸光度の和で表すことができ、溶出したレジスト成分の総和を意味していることになる。
Further, the incident light intensity and the transmitted light intensity described above are the light intensity I 0 transmitted through NMP alone and the light intensity I transmitted through the sample solution when light is made incident respectively to the sample solution and NMP alone from the same light source It can be considered. Therefore, (I / I 0 ) in the above equation represents the light transmittance, and the absorbance A is a value obtained by logarithmically expressing the reciprocal of the transmittance. The absorbance A is a notation used when calculating the concentration or the like of a substance contained in a sample solution. In the case of the absorbance A = 0, it shows a state of not absorbing light at all (transmission rate 100%), and in the case of the absorbance A = ∞, it shows a state of not transmitting light at all (transmission rate 0%). become. That is, the stronger the absorbance, the more the resist coating component dissolves into NMP, indicating that the NMP resistance is worse. The spectral area (nm) of the measured absorbance was calculated, and the evaluation was performed based on the following criteria.
NMP chemical resistance evaluation criteria: Determination by the area value of the absorption spectrum of NMP elution solution (wavelength 300 to 800 nm)
○: less than 20 (nm) Δ: 20 (nm) or more and 60 (nm) or less ×: 60 (nm) or more NMP chemical resistance evaluation is ○ that can be particularly preferably used as BCS, those that are Δ , Can be used as BCS, those of x can not be used as BCS.
The spectral area of the absorbance, which is the evaluation criterion, can be represented by the sum of absorbance at each wavelength, and means the sum of the eluted resist components.
Figure JPOXMLDOC01-appb-T000025
Figure JPOXMLDOC01-appb-T000025
Figure JPOXMLDOC01-appb-T000026
Figure JPOXMLDOC01-appb-T000026
Figure JPOXMLDOC01-appb-T000027
Figure JPOXMLDOC01-appb-T000027
Figure JPOXMLDOC01-appb-T000028
Figure JPOXMLDOC01-appb-T000028
 [表1]~[表4]から明らかなように、本発明の重合性組成物より得られる硬化物は、遮光性(OD値)、比誘電率、低液晶汚染性(VHR)、耐薬品性を高いレベルで満たしたうえで、弾性回復率に優れるため、BCSとして有用なものである。 As apparent from [Table 1] to [Table 4], the cured product obtained from the polymerizable composition of the present invention has a light shielding property (OD value), a relative dielectric constant, low liquid crystal contamination (VHR), and chemical resistance. It is useful as BCS because it has excellent elasticity recovery rate after satisfying the properties at a high level.
 本発明の重合性組成物、BM用感光性組成物又はBCS用感光性組成物より得られる硬化物は、弾性回復、遮光性、耐薬品性に優れ、誘電率が低く、電気特性が良好な硬化物であり、特にBCSに好適である。該硬化物はディスプレイ表示装置等に、特に有用である。
 
The cured product obtained from the polymerizable composition of the present invention, the photosensitive composition for BM or the photosensitive composition for BCS is excellent in elastic recovery, light shielding property, chemical resistance, low dielectric constant, and good electrical characteristics. It is a cured product, particularly suitable for BCS. The cured product is particularly useful for display devices and the like.

Claims (9)

  1.  重合開始剤(A)、着色剤(B)、アルカリ現像性化合物(C)及び該アルカリ現像性化合物(C)を除くエチレン性不飽和化合物(D)を含有する重合性組成物であって、
     上記重合開始剤(A)が水酸基を有するα-アミノアセトフェノン化合物(A1)を含有する重合性組成物。
    A polymerizable composition comprising a polymerization initiator (A), a colorant (B), an alkali developable compound (C) and an ethylenically unsaturated compound (D) excluding the alkali developable compound (C),
    A polymerizable composition, wherein the polymerization initiator (A) contains an α-aminoacetophenone compound (A1) having a hydroxyl group.
  2.  上記重合開始剤(A)が、水酸基を有するα-アミノアセトフェノン化合物(A1)に加えて下記一般式(I)で表される基を有するオキシムエステル化合物(A2)を含有する請求項1に記載の重合性組成物。
    Figure JPOXMLDOC01-appb-C000001
    (式中、R及びRは、それぞれ独立に水素原子、ハロゲン原子、ニトロ基、シアノ基、炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
     R及びRで表される基中の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、ビニルエーテル基、メルカプト基、イソシアネート基又は複素環を含有する炭素原子数2~20の基で置換される場合があり、R及びRで表される基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-NR-、-NRCO-、-S-、-CS-、-SO-、-SCO-、-COS-、-OCS-、不飽和結合又はCSO-で置換される場合があり、
     Rは、水素原子、炭素原子数1~20の炭化水素基を表し、
     mは0又は1を表し、
     式中の*は、結合手を表す。)
    The said polymerization initiator (A) is added to the alpha-amino acetophenone compound (A1) which has a hydroxyl group, and contains the oxime ester compound (A2) which has a group represented with the following general formula (I). Polymerizable composition.
    Figure JPOXMLDOC01-appb-C000001
    (Wherein, R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a nitro group, a cyano group, a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a heterocycle) Represents
    The hydrogen atom in the group represented by R 1 and R 2 is a halogen atom, nitro group, cyano group, hydroxyl group, amino group, carboxyl group, methacryloyl group, acryloyl group, epoxy group, vinyl group, vinyl ether group, mercapto group, It may be substituted with an isocyanate group or a group having 2 to 20 carbon atoms containing a heterocycle, and the methylene group in the groups represented by R 1 and R 2 is —O—, —CO—, —COO— , -OCO -, - NR 3 - , - NR 3 CO -, - S -, - CS -, - SO 2 -, - SCO -, - COS -, - OCS-, substituted with an unsaturated bond or CSO- In some cases,
    R 3 represents a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms,
    m represents 0 or 1;
    * In the formula represents a bond. )
  3.  着色剤(B)が黒色顔料である請求項1又は2に記載の重合性組成物。 The polymerizable composition according to claim 1 or 2, wherein the colorant (B) is a black pigment.
  4.  アルカリ現像性化合物(C)が、下記一般式(II)で表されるアルカリ現像性化合物である請求項1~3の何れか一項に記載の重合性組成物。
    Figure JPOXMLDOC01-appb-C000002
    (式中、R11、R13及びR15は、それぞれ独立に水素原子又はメチル基を表し、R12、R14及びR16は、それぞれ独立に炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
     R13及びR14が、複数存在する場合、同一の場合も異なる場合もあり、
     Y、Y及びYは、直接結合、炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
     Yが、複数存在する場合、同一の場合も異なる場合もあり、
     Z、Z及びZは、炭素原子数1~20の炭化水素基又は複素環を含有する炭素原子数2~20の基を表し、
     Zが、複数存在する場合、同一の場合も異なる場合もあり、
     R12、R14、R16、Y、Y、Y、Z、Z及びZで表される基中の水素原子はハロゲン原子、ニトロ基、シアノ基、水酸基、アミノ基、カルボキシル基、メタクリロイル基、アクリロイル基、エポキシ基、ビニル基、メルカプト基、イソシアネート基又は複素環を含有する炭素原子数2~20の基で置換される場合があり、R12、R14、R16、Y、Y、Y、Z、Z及びZで表される基中のメチレン基は-O-、-CO-、-COO-、-OCO-、-S-、-SO-、-SCO-又は-COS-で置換される場合もあり、
     nは0又は10以下の正の数を表し、aは、0又は4以下の正の数を表し、bは、0又は3以下の正の数を表し、cは、0又は4以下の正の数を表し、
    nが2以上の場合、bは同一の場合も異なる場合もある。)
    The polymerizable composition according to any one of claims 1 to 3, wherein the alkali developable compound (C) is an alkali developable compound represented by the following general formula (II).
    Figure JPOXMLDOC01-appb-C000002
    (Wherein, R 11 , R 13 and R 15 each independently represent a hydrogen atom or a methyl group, and R 12 , R 14 and R 16 each independently represent a hydrocarbon group having 1 to 20 carbon atoms or a complex) Represents a group having 2 to 20 carbon atoms containing a ring,
    When a plurality of R 13 and R 14 exist, they may be the same or different,
    Y 1 , Y 2 and Y 3 each represents a direct bond, a hydrocarbon group having 1 to 20 carbon atoms, or a group having 2 to 20 carbon atoms containing a heterocycle,
    When two or more Y 2 exist, they may be the same or different,
    Z 1 , Z 2 and Z 3 each represent a hydrocarbon group having 1 to 20 carbon atoms or a group having 2 to 20 carbon atoms containing a heterocyclic ring,
    When two or more Z 2 exist, they may be the same or different,
    The hydrogen atom in the group represented by R 12 , R 14 , R 16 , Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 is a halogen atom, a nitro group, a cyano group, a hydroxyl group, an amino group, It may be substituted by a group having 2 to 20 carbon atoms containing a carboxyl group, methacryloyl group, acryloyl group, epoxy group, vinyl group, mercapto group, isocyanate group or heterocyclic group, and R 12 , R 14 and R 16 And methylene groups in the groups represented by Y 1 , Y 2 , Y 3 , Z 1 , Z 2 and Z 3 are —O—, —CO—, —COO—, —OCO—, —S— or —SO 2- , -SCO- or -COS- may be substituted,
    n represents a positive number of 0 or 10 or less, a represents a positive number of 0 or 4 or less, b represents a positive number of 0 or 3 or less, and c is a positive number of 0 or 4 or less Represents the number of
    When n is 2 or more, b may be the same or different. )
  5.  請求項1~4の何れか一項に記載の重合性組成物を含有するブラックマトリクス用感光性組成物。 A photosensitive composition for a black matrix comprising the polymerizable composition according to any one of claims 1 to 4.
  6.  請求項1~4の何れか一項に記載の重合性組成物を含有するブラックカラムスペーサ用感光性組成物。 A photosensitive composition for a black column spacer comprising the polymerizable composition according to any one of claims 1 to 4.
  7.  請求項1~4の何れか一項に記載の重合性組成物、請求項5に記載のブラックマトリクス用感光性組成物又は請求項6に記載のブラックカラムスペーサ用感光性組成物に対し、光照射又は加熱することにより硬化物を製造する方法。 A polymerizable composition according to any one of claims 1 to 4, a photosensitive composition for a black matrix according to claim 5, or a photosensitive composition for a black column spacer according to claim 6 A method of producing a cured product by irradiation or heating.
  8.  請求項1~4の何れか一項に記載の重合性組成物、請求項5に記載のブラックマトリクス用感光性組成物又は請求項6に記載のブラックカラムスペーサ用感光性組成物の硬化物。 A cured product of the polymerizable composition according to any one of claims 1 to 4, the photosensitive composition for a black matrix according to claim 5, or the photosensitive composition for a black column spacer according to claim 6.
  9.  請求項8に記載の硬化物を含有するディスプレイ表示装置。 A display apparatus comprising the cured product according to claim 8.
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