TW200531535A - Digital still camera module - Google Patents

Digital still camera module Download PDF

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Publication number
TW200531535A
TW200531535A TW93106151A TW93106151A TW200531535A TW 200531535 A TW200531535 A TW 200531535A TW 93106151 A TW93106151 A TW 93106151A TW 93106151 A TW93106151 A TW 93106151A TW 200531535 A TW200531535 A TW 200531535A
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Taiwan
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lens
digital camera
camera module
scope
patent application
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TW93106151A
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Chinese (zh)
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TWI264222B (en
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Ga-Lane Chen
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Hon Hai Prec Ind Co Ltd
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Publication of TWI264222B publication Critical patent/TWI264222B/en

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Abstract

A digital still camera module disposed in a mobile phone includes a barrel, a first lens disposed in the barrel, a holder, an image pick-up element located at the back of the barrel. The portion of the barrel is received in the holder. The first lens is fixed in the barrel via a specific glue. The image pick-up element is packaged on the printed circuit board via a ceramic leaded chip carrier.

Description

200531535200531535

【發明所屬之技術領域】 尤其係關於一種具 本發明係關於一種數位相機模組 可防止鏡片污染之數位相機模組。 【先前技術】 著多媒體 費者青睞 ,同時由 夠於行動 面,由此* 數位相機 數位相機 用之數位 影像質量 之影像畫 決於數位 件0 隨 廣大消 小型化 希望能 清晰晝 話内之 其内之 動電話 物體之 攝物體 度上取 感測元 技術的 ,人們 於行動 電話上 需要設 模組。 模組之 相機模 提出更 面仍然 相機内 發展, 對數位 電話之 實現擷 計及製 因行動 體積提 組體積 高之要 清晰, 各光學 數位相 相機、 輕薄短 取物體 造出能 電話體 出了更 需更小 求,即 而物體 器件之 機、攝 攝影機 小、攜 影像之 夠方便 積較小 高之要 ,由此 體積縮 之成像 優劣, 影機越 愈來愈 帶方便 功能, 安裝於 ,故對 求,即 將對其 小之同 質量於 如鏡片 來越為 追求其 ,人們 且獲得 行動電 安裝於 此種行 拍攝出 時其拍 很大程 及影像 習知數位相機模組通常包括一鏡頭座、一鏡筒、複數 鏡片及置於鏡片後之影像感測元件,該複數鏡片通常藉 $膠黏劑固定於鏡筒内,該影像感測元件藉由塑膠有引線 心片載具(Plastic Leaded Chip Carrier,簡稱PLCC)等 封裝後與印刷電路板電性連接。雖該種數位相機模組可實 現擷,影像之功能,然因其採用一般膠黏劑如快干膠、去 氧膠等將鏡片固定於鏡筒内,該種膠黏劑於點膠過程中及 點膠後之固化過程中,易於揮發,其蒸氣易固結於鏡片之[Technical field to which the invention belongs] In particular, the present invention relates to a digital camera module capable of preventing lens contamination. [Previous technology] It is favored by multimedia users, and at the same time it is enough to be mobile, so the digital image quality of digital camera digital camera depends on the digital piece. If the sensing element technology of the mobile phone object is taken from the inside, people need to set up a module on the mobile phone. The camera module of the module is still more developed in the camera. The realization of digital phones and the reasons for the increase in volume of mobile phones must be clear. The optical digital cameras and thin and short objects can be used to make phone calls. More needs to be smaller, that is, the device of the object device, the camera is small, the convenience of carrying the image is small, and the height is small. Therefore, the size of the image is good and bad. The camera is increasingly equipped with convenient functions. Therefore, the demand is that the same quality as the lens will be pursued more and more. People and mobile phones are installed in this type of photography. Their shooting distance and image are familiar. Digital camera modules usually include a lens. Base, a lens barrel, a plurality of lenses, and an image sensing element placed behind the lens. The plurality of lenses are usually fixed in the lens barrel by using an adhesive. The image sensing element is a plastic leaded core sheet carrier (Plastic Leaded Chip Carrier (PLCC) and other packages are electrically connected to the printed circuit board after packaging. Although this digital camera module can achieve the functions of capturing and imaging, it uses ordinary adhesives such as quick-drying glue, deoxidizing glue, etc. to fix the lens in the lens barrel. This kind of adhesive is used in the dispensing process. During the curing process after dispensing, it is easy to volatilize, and its vapor is easy to condense to the lens.

第5頁 200531535 五、發明說明(2) 表面’導致該鏡片表面模糊不清,使其透光率降低,嚴重 降低進入數位相機模組内由被攝物反射之光線,從而降低 被攝物之光學影像訊號使影像感測元件感測之光學影像訊 號不兀整’降低该數位相機拍攝影像之成像品質,另此種 膠黏劑黏結元件之可靠度不佳。 另’習知數位相機模組之影像感測器之封裝通常藉由 PLCC技術,該種封裝技術較為繁雜且成本較高,另因塑膠 之防潮、防腐蝕及去氧能力較差,故使得於該數位相機模 組使用過程中,影響影像感測元件之使用。 、 此外,習知數位相機模組之鏡片是鍍氟化鎂膜(簡稱Page 5 200531535 V. Description of the invention (2) The surface 'causes the lens surface to be blurred, which reduces its light transmittance, which seriously reduces the light reflected by the object entering the digital camera module, thereby reducing the The optical image signal makes the optical image signal sensed by the image sensing element inconsistent, which reduces the imaging quality of the image captured by the digital camera, and the reliability of this adhesive bonding element is not good. In addition, the packaging of image sensors of conventional digital camera modules usually uses PLCC technology. This kind of packaging technology is more complicated and costly. In addition, plastics have poor moisture resistance, corrosion resistance, and deoxidation capabilities. The use of digital camera modules affects the use of image sensing elements. In addition, the lens of the conventional digital camera module is a magnesium fluoride film (referred to as

MgF2),該種膜抗腐蝕性較差且易於吸附水滴等問題,同 樣會造成鏡片之污染。 口所有ΐ於此’提供一種能夠可防止鏡片$亏染、提高影像 口口貝之數位相機模組。 【發明内容】 旦”象目的在於提供一種能夠防止透鏡污染、提高 〜像口口貝之數位相機模組。 本發明係一種數位相機模組,可置於行動電話内, J位相機模組包括一鏡筒;一第—鏡片,置二亥 :頭:於之部分固定於鏡頭座内;-影像感測元 定於於二兄冋後。該鏡片係採用膠黏劑0PT〇CAST 3410固 (Ce;二同c V f影像感測元件係藉由陶瓷有引線晶片載具 丄Leaded Chip Carrier)封裝於電路板上。 目較習知技術,本發明數位相機模組藉由膠黏劑 200531535MgF2), this kind of film has poor corrosion resistance and is easy to absorb water droplets. It also causes lens pollution. I want to provide a digital camera module that can prevent the lens from being damaged and improve the image. [Summary of the Invention] The purpose of "Dan" is to provide a digital camera module capable of preventing lens contamination and improving mouthpieces. The present invention is a digital camera module that can be placed in a mobile phone. The J-bit camera module includes A lens barrel; a first lens-placed Erhai: the head: the part fixed in the lens holder;-the image sensor is set after the second brother. The lens is adhesive 0PT〇CAST 3410 solid ( Ce; the same c V f image sensing element is packaged on a circuit board by a ceramic leaded chip carrier (Leaded Chip Carrier). Compared with the conventional technology, the digital camera module of the present invention uses an adhesive 200531535

0PT0CAST 黏劑所導 鏡筒連接 及其使用 藉由採用 晶片載具 像感測元 一鏡片之 之設置, 置於行動 【實施方 34 10將鏡片置於鏡筒内 致之鏡片污染問題,提高 之可罪度’從而提高本數 壽命;另,本發明數位相 陶瓷有引線晶片載具,克 塑膠之防潮、防腐蝕及去 件之感測能力;此外,本 至少表面鍍覆有紅外截止 大大降低本發明數位相機 電話内。 式】 ’防止習知採用一般膠 鏡片之透光率及鏡片與 位相機模組之成像品質 機模組之影像感測元件 服習知採用塑膠有引線 氧能力較差,提高該影 發明數位相機模組於第 濾膜,避免額外濾光片 模組之高度,使其方便 請參閱第一圖,本發明數位相機模組丨0包括一頂蓋 11、一鏡筒12、一第一鏡片122、一第二鏡片124、」玻璃 片1 3、一影像感測元件1 4及一鏡頭座1 5。該影像感測元件 1 4包括一成像面1 4 1,其藉由一陶瓷有引線芯片載具 (Ceramic Leaded Chip Carrier,簡稱CLCC) 1 6 封裝於軟 性印刷電路板(Flexiable Printed Circuit Board,簡稱 FPC) 1 7上,從而可佈設控制電路傳輸訊號。該鏡筒1 2之部 份嵌入鏡頭座15内且與之相配合,該第一鏡片122及第二 鏡片124收容於鏡筒12内。 頂蓋1 1係一環狀蓋板,其包括二開口端1 1 2、1 1 4,以 便使被攝物(圖未示)反射之光線入射至鏡筒1 2内之第一 鏡片122及第二鏡片124上,於開口端112、114形成之通道 内(未標示)可置放一保護鏡(未標示),防止外界灰塵落入0PT0CAST Adhesive-guided lens barrel connection and use By using the chip carrier image sensor element lens set, put into action [Implementation method 34 10 lens contamination caused by placing the lens in the lens barrel, improve the The guilty degree 'improves the life of the digital device. In addition, the digital phase ceramic leaded chip carrier of the present invention can prevent moisture, corrosion, and parts from being damaged. In addition, the infrared cut-off on at least the surface is greatly reduced. The digital camera phone of the present invention. [Formula] 'Prevent the use of ordinary plastic lens light transmittance and the imaging quality of the lens and camera module image quality sensor module service is known to use plastic with poor oxygen capacity, improve the digital camera module of the invention It is assembled on the first filter film to avoid the height of the additional filter module. It is convenient to refer to the first figure. The digital camera module of the present invention includes a top cover 11, a lens barrel 12, a first lens 122, A second lens 124, a glass sheet 1 3, an image sensing element 14 and a lens holder 15. The image sensing element 14 includes an imaging surface 1 41, which is packaged in a Flexible Printed Circuit Board (FPC) by a Ceramic Leaded Chip Carrier (CLCC) 16. ) 1 7 so that the control circuit can be arranged to transmit signals. A part of the lens barrel 12 is embedded in the lens holder 15 and cooperates therewith. The first lens 122 and the second lens 124 are housed in the lens barrel 12. The top cover 11 is a ring-shaped cover, which includes two open ends 1 1 2, 1 1 4 so that the light reflected by the subject (not shown) enters the first lens 122 in the lens barrel 12 and A protective lens (not labeled) can be placed on the second lens 124 in the channel (not labeled) formed by the open ends 112 and 114 to prevent outside dust from falling into it.

200531535 五、發明說明(4) 第一鏡片122上,頂蓋11固定於鏡筒12之頂部。 鏡筒12係一中空圓柱’其内置放第一鏡片122及第二鏡片 1 24,該鏡筒1 2之部份嵌入鏡頭座1 2内且與之相緊密配 合。 請同時參閱第二圖,第一鏡片122及第二鏡片124皆用 於聚焦由被攝物入射之光線,皆收容於鏡筒1 2内,其外徑 分別配合鏡筒12之内徑。第一鏡片122及第二鏡片124皆藉 由膠黏劑1 8固定於鏡筒1 2内,本發明數位相機模組所用之 膠黏劑18係0PT0CAST 3410,0PT0CAST 3410係由英國公司 Electronic Material Inc·(簡稱EMI)開發研製之紫外膠 黏劑,本發明將第一鏡片122及第二鏡片124固定於鏡筒12 内時,採用0PT0CAST 3410,首先藉由紫外線照射1〇秒 鐘,然後進行二次焙燒,第一次焙燒係於75它至85 〇c溫度 條件下培燒2 0至3 0分鐘,第二焙燒係於9 〇 °c至1 〇 〇 °c溫度 條件下培燒20至30分鐘,因0PT0CAST 3410揮發性低、穩 定性好、防濕及防潮性好,於點膠過程中,不會產生蒸 氣’由此可防止習知技術中因一般膠黏劑之蒸氣附著於鏡 片上’使鏡片表面被污染及氧化,由此導致鏡片模糊,降 低光線之穿透率及降低影像品質。200531535 V. Description of the invention (4) On the first lens 122, the top cover 11 is fixed on the top of the lens barrel 12. The lens barrel 12 is a hollow cylinder 'which contains the first lens 122 and the second lens 1 24, and a part of the lens barrel 12 is embedded in the lens holder 12 and closely fits it. Please refer to the second figure at the same time. Both the first lens 122 and the second lens 124 are used to focus the light incident from the subject, and both are housed in the lens barrel 12, and the outer diameters thereof respectively match the inner diameter of the lens barrel 12. The first lens 122 and the second lens 124 are fixed in the lens barrel 12 with an adhesive 18. The adhesive 18 used in the digital camera module of the present invention is 0PT0CAST 3410, and 0PT0CAST 3410 is by the British company Electronic Material Inc. · (Abbreviated as EMI) UV adhesive developed by the present invention. When the first lens 122 and the second lens 124 are fixed in the lens barrel 12 in the present invention, 0PT0CAST 3410 is used, firstly irradiated with ultraviolet rays for 10 seconds, and then two Secondary roasting, the first roasting is performed at a temperature of 75 to 85 ° c for 20 to 30 minutes, and the second roasting is performed at a temperature of 90 ° to 100 ° c for 20 to 30 minutes Minutes, because 0PT0CAST 3410 has low volatility, good stability, moisture resistance and moisture resistance, during the dispensing process, no vapor will be generated ', which can prevent the vapor of ordinary adhesives from attaching to the lens in the conventional technology. 'The lens surface is contaminated and oxidized, which causes the lens to be blurred, reduces the transmittance of light, and reduces image quality.

第一鏡片122為半月形狀,包括二非球面1222、 1224 ’其中非球面表面1222凸向物方,該第一鏡片丨22係 由玻璃製成’因而可耐外界濕度、高溫及可防止鏡頭被刮 傷。第二鏡片i 24係一非球面透鏡且由光學塑膠材質製 成’其置於第一鏡片122之後,第二鏡片124之非球面形狀The first lens 122 has a half-moon shape and includes two aspheric surfaces 1222 and 1224 'where the aspherical surface 1222 is convex toward the object side, and the first lens 22 is made of glass' so that it can withstand external humidity, high temperature and prevent the lens from being damaged. Scratched. The second lens i 24 is an aspheric lens and is made of optical plastic material. It is placed behind the first lens 122 and the aspheric shape of the second lens 124

第8頁 200531535 五、發明說明(5) 與弟一鏡片1 2 2之非球面形狀相似且二者成對稱狀,以消 除像差,提而本數位相機模組之成像品質。光學塑膠材質 因具有低雙折射從而能呈現高分辨率,第二鏡片丨24所用 之光學塑膠材質可為丙稀酸樹脂(acrylic resin)、聚甲 基丙稀酸曱醋(polymethyl methacrylate,簡稱PMMA)、 聚碳酸(polycarbonate,簡稱PC)等之任一種。 另,於第一鏡片122之非球面表面1222上鍍覆有一二 氧化娃(Si02)與五氧化二鈕(Ta2〇5)薄膜相互間隔堆疊而 成之抗反射膜(AR-Coating),以此增加第一鏡片122之 透光率及減少光線反射’於該第一鏡片1 2 2之另一非球面 表面1224上鑛覆有一紅外截止濾膜(IR —cut c〇ating), 用以阻止來自於被攝物入射之光線中之紅外線進入影像感 測元件14,避免於正常拍攝時紅外線入射至影像感測元& 1 4之影像感測面1 4 1上,造成干擾從而產生噪點,同時可 省卻數位相機模組1 〇内之濾光片之設置,使數位相機模組 1 0之高度降低,使之可更好地應用於各種攜帶式電子產品 中 〇 鏡頭座1 5係中空圓柱狀,其包括二開口端(未標 示)’其中一開口端用以容置鏡筒1 2,而另一開口端沿内 圓週避縱向開設有一凹槽(未標示),用以容置影像^測 兀件1 4及陶瓷有引線芯片載具i 6,玻璃片i 3收容於鏡頭座 15内且與鏡頭座15之圓週面相配合,置於鏡筒12後及影像 感測元件14前,用以保護影像感測元件H之成像面141。 影像感測元件1 4為一補充性氧化金屬半導體Page 8 200531535 V. Description of the invention (5) The aspheric shape of the lens 1 and 2 is similar and the two are symmetrical to eliminate aberration and improve the imaging quality of the digital camera module. The optical plastic material can exhibit high resolution due to its low birefringence. The optical plastic material used in the second lens 24 can be acrylic resin, polymethyl methacrylate (PMMA for short) ), Any of polycarbonate (PC). In addition, the aspherical surface 1222 of the first lens 122 is plated with an anti-reflection film (AR-Coating) formed by stacking silicon dioxide (Si02) and second pentoxide (Ta205) films at intervals. This increases the light transmittance and reduces light reflection of the first lens 122. An infrared cut filter (IR-cut coating) is coated on the other aspheric surface 1224 of the first lens 1 2 2 to prevent Infrared rays from the incident light of the subject enter the image sensing element 14 to prevent infrared rays from incident on the image sensing surface 1 4 1 of the image sensing element & 14 during normal shooting, causing interference and generating noise, At the same time, the filter settings in the digital camera module 10 can be omitted, the height of the digital camera module 10 can be reduced, and it can be better applied to various portable electronic products. The lens holder 15 series of hollow cylinders Shape, which includes two open ends (not labeled). One of the open ends is used to receive the lens barrel 12 and the other open end is provided with a groove (not labeled) along the inner circumference to avoid longitudinally ^ Test piece 14 and ceramic leaded chip carrier i 6, I 3 glass sheet received in and cooperate with the circumferential surface of the lens holder 15 within lens holder 15, placed on the imaging surface of the rear barrel 12 and before the image sensing element 14 to protect the image sensing element 141 H. The image sensing element 14 is a complementary metal oxide semiconductor

200531535 五、發明說明(6) (Coniplementary Meta 卜 0xide Semic〇nduct〇r,下200531535 V. Description of the invention (6) (Coniplementary Meta bu 0xide Semic〇nduct〇r, the next

CMOS )影像感測器,用於將外部被攝物人射之 號轉換為電子影後訊轳,1v泣 〜像口fL 引η ::二 鏡頭座15内。因陶莞有 引線心片載具16之封裝尺寸較小,其上方為扁平, :!可ί:狀,故封裝時高度較為㈣,使光學之調整ί ’、速及f早,該種封裝技術具備較佳之熱性能,可於較廣 之溫度II圍條件下達到車交高之操作穩定度,&本發明數^ 相機模組之影像感測元件14藉由陶瓷有引線芯片載呈丨6 裝於軟性印刷電路板17上,該陶瓷有引線芯片載具16之 兩端部上設置有引腳162,影像感測元件14藉由引線 (Wire Bonding)接合方式與陶瓷有引線芯片載具16連接, 错由引腳162與軟性印刷電路板17連接導通,從而佈設栌 制電路以傳輸訊號,其中引線接合係指首先將晶片固定^ 導線架上,再以細金屬線將芯片上的電路和導線架上 腳相連接。 組裝日守’先將玻璃片13置於鏡頭座15内且使兩者緊密 配合,然後將封裝好之影像感測元件14由鏡頭座15之二^ 開口端放置於鏡頭座丨5内,使陶瓷有引線芯片載具丨6嵌入 鏡頭座15之凹槽内且與之配合,同時將固定有第一鏡片 122及第二透鏡124之鏡筒12之部分由鏡頭座15之一開口端 内置於鏡頭座15内,最後將頂蓋η置於鏡筒12之頂部。 本發明數位相機鏡頭模組1 〇亦影像感測元件丨4亦可由 其它光電轉換元件或影像感測元件如電荷耦合器(Charge Coupled Device,簡稱CCD)替代。本發明數位相機鏡頭模 200531535 ____ 五、發明說明(7) 組1 0不僅可内置於行動電話内’亦可内置於其他便攜式電 子裝置内如個人數位助理内。本發明數位相機鏡頭模組1 0 之頂蓋1 1可省卻’其亦可由一保護鏡替代。 綜上所述,本發明符合發明專利要件,爰依法提出 專利申請。惟,以 凡熟悉本案技藝之 修飾或變化,皆應 之較佳實施例,舉 明精神所作之等效 利範圍内。 上所述者僅為本發明 人士,在援依本案發 包含於以下之申請專CMOS) image sensor, which is used to convert the number of shots from an external subject into an electronic video signal, 1v ~ ~ fL of the image port η :: two lens holder 15. Because the package size of Tao Wan's leaded core carrier 16 is small, and the upper part is flat,:! Can ί: shape, so the height of the package is relatively sloppy, so that the optical adjustment is very fast, and this type of package is early. The technology has better thermal performance, and can achieve high operation stability under a wide range of temperature II. &Amp; The image sensing element 14 of the camera module of the present invention is presented by a ceramic leaded chip 丨6 is mounted on a flexible printed circuit board 17, pins 162 are provided on both ends of the ceramic leaded chip carrier 16, and the image sensing element 14 is connected to the ceramic leaded chip carrier by a wire bonding method 16 is connected, and the pin 162 is connected to the flexible printed circuit board 17 by mistake, so that a circuit is formed to transmit the signal. The wire bonding means that the chip is first fixed on the lead frame, and then the circuit on the chip is thin metal wire. Connect with the feet on the lead frame. Assembling the day guard 'first put the glass sheet 13 in the lens holder 15 and make the two fit tightly, and then place the packaged image sensing element 14 from the lens holder 15 bis ^ The open end is placed in the lens holder 丨 5 so that The ceramic lead chip carrier 6 is embedded in the groove of the lens holder 15 and cooperates with it. At the same time, the part of the lens barrel 12 to which the first lens 122 and the second lens 124 are fixed is built in one of the open ends of the lens holder 15 In the lens mount 15, the top cover η is finally placed on the top of the lens barrel 12. The digital camera lens module 100 and the image sensing element of the present invention may also be replaced by other photoelectric conversion elements or image sensing elements such as a charge coupled device (Charge Coupled Device, CCD for short). Digital camera lens module of the present invention 200531535 ____ V. Description of the invention (7) Group 10 can be built not only in mobile phones' but also in other portable electronic devices such as personal digital assistants. The top cover 11 of the digital camera lens module 10 of the present invention may be omitted, and it may also be replaced by a protective lens. To sum up, the present invention complies with the elements of the invention patent, and a patent application is filed according to law. However, any modification or change familiar with the skill of the case should be a preferred embodiment, and it is within the scope of the equivalent benefits of the spirit. The above are only the inventors of the present invention.

第11頁 200531535_ 圖式簡單說明 【圖式簡單說明】 第一圖係本發明數位相機模組之結構示意圖; 第二圖係本發明用數位相機模組之第一鏡片及第二鏡片之 結構示意圖。 【主要元件符號說明】 數位相機模組 10 頂蓋 11 鏡筒 12 第一鏡片 122 第二鏡片 124 玻璃片 13 影像感測元件 14 成像面 141 鏡頭座 15 陶瓷引線晶片載具 16 軟性印刷電路板 17 開口端 112、 114 螺紋 121 膠黏劑 18 非球面表面 1222 > 1224 引線 182 引腳 162Page 11 200531535_ Brief description of the drawings [Simplified description of the drawings] The first diagram is a schematic diagram of the structure of the digital camera module of the present invention; the second diagram is the diagram of the first lens and the second lens of the digital camera module of the present invention . [Description of main component symbols] Digital camera module 10 Top cover 11 Lens barrel 12 First lens 122 Second lens 124 Glass sheet 13 Image sensing element 14 Imaging surface 141 Lens holder 15 Ceramic lead wafer carrier 16 Flexible printed circuit board 17 Open ends 112, 114 Thread 121 Adhesive 18 Aspherical surface 1222 > 1224 Lead 182 Pin 162

第12頁Page 12

Claims (1)

200531535_______ 六、申請專利範圍 1. 一種數位相機模組,可置於行動電話内,該數位相機模 組包括: _ hiL· · 一鏡同, 一第一鏡片,置於鏡筒内; 一鏡頭座’該鏡筒之部份固定於鏡頭座内; 一影像感測元件,位於鏡筒後; 其中,該鏡片係採用膠黏劑0PT0CAST 3410固定於鏡筒 内,該影像感測元件係藉由陶瓷有引線芯片载具 (Ceramic Leaded Chip Carrier)封裝。 2 ·如申請專利範圍第1項所述之數位相機模組,其中數位 相機鏡頭模組進一步包括一第二鏡片,其由膠黏劑 OPTOCAST 3410固定於鏡筒内,且位於第一鏡片後。 3·如申請專利範圍第2項所述之數位相機模組,其中該第 一鏡片係一非球面玻璃鏡片。 4 ·如申請專利範圍第3項所述之數位相機模組,其中該第 二鏡片係一非球面塑膠鏡片,其形狀與第一鏡片對稱。 5、如申請專利範圍第2或3項所述之數位相機模組,其中該 第一鏡片之一表面鍍覆有抗反射膜(AR-Coating)。 6·如申請專利範圍第5項所述之數位相機模組,其中該抗 反射膜係由—氧化硅與五氧化二鈕薄膜相互間隔堆疊而 成。 7 ·如申明專利範圍第5項所述之數位相機模組,其中該第 一鏡片之另—表面鍍覆有紅外截止濾膜(IR-Cut Coating) 〇200531535_______ 6. Scope of patent application 1. A digital camera module that can be placed in a mobile phone. The digital camera module includes: _ hiL · · A mirror, a first lens, placed in the lens barrel; a lens holder 'The part of the lens barrel is fixed in the lens holder; an image sensing element is located behind the lens barrel; wherein, the lens is fixed in the lens barrel with an adhesive 0PT0CAST 3410, and the image sensing element is made of ceramic Ceramic Leaded Chip Carrier package. 2 · The digital camera module according to item 1 of the scope of patent application, wherein the digital camera lens module further includes a second lens, which is fixed in the lens barrel by the adhesive OPTOCAST 3410 and is located behind the first lens. 3. The digital camera module according to item 2 of the scope of patent application, wherein the first lens is an aspherical glass lens. 4. The digital camera module according to item 3 of the scope of patent application, wherein the second lens is an aspherical plastic lens and its shape is symmetrical to the first lens. 5. The digital camera module according to item 2 or 3 of the scope of patent application, wherein one surface of the first lens is plated with an anti-reflection film (AR-Coating). 6. The digital camera module according to item 5 of the scope of patent application, wherein the anti-reflection film is formed by stacking silicon oxide and two pentoxide films at a distance from each other. 7 · The digital camera module according to item 5 of the declared patent scope, wherein the other surface of the first lens is coated with an IR-Cut Coating. 〇 200531535 六、申請專利範圍 8. 如申請專利範圍第7項所述之數位相機模組,其中該數 位相機模組進一步包括一玻璃片,固定於鏡頭座内,位 於鏡筒與影像感測元件之間。 9. 如申請專利範圍第8項所述之數位相機模組,其中該數 位相機模組進一步包括一頂蓋,固定於鏡筒之頂部。 1 0.如申請專利範圍第7項所述之數位相機模組,其中該數 位相機模組進一步包括一保護鏡,固定於鏡筒之頂部。 11.如申請專利範圍第1項所述之數位相機模組,其中該影 像感測元件係一CCD (電荷耦合器)影像感測器。200531535 6. Scope of patent application 8. The digital camera module described in item 7 of the scope of patent application, wherein the digital camera module further includes a glass sheet fixed in the lens holder and located between the lens barrel and the image sensing element. between. 9. The digital camera module according to item 8 of the scope of patent application, wherein the digital camera module further includes a top cover fixed on the top of the lens barrel. 10. The digital camera module according to item 7 of the scope of patent application, wherein the digital camera module further includes a protective lens fixed on the top of the lens barrel. 11. The digital camera module according to item 1 of the patent application scope, wherein the image sensing element is a CCD (Charge Coupled Device) image sensor. 1 2.如申請專利範圍第1項所述之數位相機模組,其中該影 像感測元件係一CMOS (補充性氧化金屬半導體)影像感 測器。1 2. The digital camera module according to item 1 of the patent application scope, wherein the image sensing element is a CMOS (complementary metal oxide semiconductor) image sensor. 第14頁Page 14
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