TW202113424A - Optical member and camera module to provide an optical member which selectively reflects visible light in a specific wavelength region but suppresses the reflection of light in a specific wavelength region - Google Patents

Abstract

The object of the present invention is to provide an optical member which selectively reflects visible light in a specific wavelength region but suppresses a reflection of lights in the specific wavelength region in order to improve the problems of poor image and thinning of an existing optical filter. The optical member of the present invention comprises a reflecting surface. The average reflectivity of the unpolarized light rays incident at 45° from the vertical to the reflecting surface is more than 80% in the wavelength region of more than 400 nm and less than 640 nm, and less than 8% in the wavelength region of more than 700 nm and less than 1150 nm. The optical member reflects the lights in the wavelength region of more than 400 nm and less than 640 nm, but suppresses the reflection of the lights in the wavelength region of more than 700 nm and less than 1150 nm.

Description

Optical component and camera module

The invention relates to an optical component and a camera module using the optical component.

In solid-state photography devices such as video cameras, digital still cameras, and mobile phones with camera functions, charge coupled devices (CCD) or complementary metal oxide semiconductors (complementary metal oxide semiconductors) are used. , CMOS) and other image sensors. For these image sensors, silicon photodiodes, which are sensitive to near-infrared light that human eyes cannot perceive, are used in their light-receiving parts. In these image sensors, it is necessary to perform a visual sensitivity correction that presents a natural hue to the human eye, and optical filters that selectively transmit or block light in a specific wavelength region, such as a near-infrared cut filter, are often used.

As such optical filters, filters manufactured by various methods have been used since the past. For example, various filters are known as follows: an absorbing glass type infrared cut filter in which copper oxide is dispersed in phosphoric acid glass (Patent Document 1); or a resin type having a layer in which a pigment that absorbs in the near-infrared band is dispersed Infrared cut filter (Patent Document 2); a glass substrate coated infrared cut filter with a transparent dielectric substrate (glass substrate), an infrared reflective layer, and an infrared absorbing layer (Patent Document 3); using a transparent resin as the base A resin-type near-infrared cut filter (patented) containing a pigment that has a maximum absorption in the region of 600 nm or more and 800 nm or less in a transparent resin, and a dielectric multilayer film with near-infrared reflection performance is used on both sides of the substrate. Document 4); A glass substrate coated infrared cut filter in which a resin layer containing a pigment is provided on a glass substrate, and the pigment has absorption in the vicinity of a region having a wavelength of 695 nm or more and 720 nm or less (Patent Document 5).

In recent years, the thinning of camera modules has continued to develop, requiring further thinning and optical telescope functions. There is known a reflection type imaging camera module that can ensure a long optical path length of an optical telephoto even if it is thin (Patent Document 6). [Prior Art Literature]

[Patent Literature] [Patent Document 1] International Publication No. 2011/071157 [Patent Document 2] Japanese Patent Laid-Open No. 2008-303130 [Patent Document 3] Japanese Patent Laid-Open No. 2014-52482 [Patent Document 4] Japanese Patent Laid-Open No. 2011-100084 [Patent Document 5] Japanese Patent Laid-Open No. 2014-63144 [Patent Document 6] Japanese Patent Laid-Open No. 2007-19860

[The problem to be solved by the invention] As the optical filter described in the above-mentioned publication, in an optical filter having near-infrared light reflection performance on the surface of a substrate, the light reflected on the surface of the optical filter may be incident on the image sensor again. , The so-called ghosting. That is, image defects may sometimes occur in photography using a camera module including the optical filter. In particular, near-infrared rays, which have a low human visual sensitivity, form an image different from the image visible to the human eye, and therefore cause serious image defects.

In order to prevent such image defects, an anti-reflection layer is sometimes provided in the optical filter. However, in this case, the influence on the thickness of the optical filter is large. In recent years, camera modules have been required to achieve both thinning and high-performance optical telephoto functions. However, when the optical filter or zoom lens is installed in the optical path for high-performance, thinning becomes difficult.

The present invention is based on the above circumstances, and its problem is to provide a method for selectively reflecting visible light in a specific wavelength region while suppressing the problem of image defects and thinning of existing optical filters. An optical member that reflects light and a camera module using the optical member. [Technical means to solve the problem]

The invention to solve the above-mentioned problem is an optical member including a reflective surface, and the average reflectance of unpolarized light rays incident on the reflective surface at 45° from vertical is a wavelength of 400 nm or more and 640 nm or less. The area is 80% or more, and the wavelength area of 700 nm or more and 1150 nm or less is 8% or less.

Another invention to solve the problem is a camera module, which includes an optical member. In the camera module, the optical member includes a reflective surface, and the reflective surface is incident at 45° from vertical. The average reflectivity of the unpolarized light is 80% or more in the wavelength region of 400 nm or more and 640 nm or less, and 8% or less in the wavelength region of 700 nm or more and 1150 nm or less.

Here, the "average reflectance" refers to specular reflection, that is, the ratio of the light amount of unpolarized light rays reflected at the same angle as the incident angle of the unpolarized light rays to the light amount of incident unpolarized light rays. [Effects of the invention]

In the optical member of the present invention, the incident light in the wavelength region of 400 nm or more and 640 nm or less is reflected and the optical path is converted, but it is possible to suppress the incident on the optical member in the wavelength region of 700 nm or more and 1150 nm or less. The reflection of light. The optical member selectively reflects visible light in a specific wavelength region, but can suppress reflection of light in a specific wavelength region. In addition, the camera module of the present invention can achieve thinning while suppressing image defects.

[Optical components] The optical member includes a reflective surface, and the average reflectivity of unpolarized light incident at 45° from vertical to the reflective surface is 80% or more in the wavelength region of 400 nm or more and 640 nm or less, and 700 nm or more and 1150 The wavelength range below nm is 8% or less.

The optical member reflects light in a wavelength region of 400 nm or more and 640 nm or less, but suppresses reflection of light in a wavelength region of 700 nm or more and 1150 nm or less. Here, the “reflection” refers to a reflectance of 65% or more in specular reflection, and the “reflection suppression” refers to a reflectance of 20% or less in specular reflection. The light in the wavelength region of 400 nm or more and 640 nm or less that is incident on the optical member is reflected by the reflection surface, and the optical path is converted. In addition, the reflection of light in the wavelength region of 700 nm or more and 1150 nm or less incident on the optical member is suppressed, and the unreflected light passes through the optical member or is absorbed by the optical member. For example, when light is incident at 45° from perpendicular to the reflecting surface, light in the wavelength region of 400 nm or more and 640 nm or less is reflected by specular reflection at a reflection angle of 45°, relative to the direction of incidence of the optical path The 90° conversion is performed. On the other hand, the optical path conversion is suppressed in light in the wavelength region of 700 nm or more and 1150 nm or less. With the optical member, for example, a single member can be used to have both the function of a mirror that reflects visible light and the function of an optical filter that shields near-infrared light.

The optical member can specularly reflect light in a wavelength region of 400 nm or more and 640 nm or less, and can perform optical path conversion of the visible light through the specular reflection. For example, when the optical member is used in a camera module, a sufficient optical path length can be ensured by performing the optical path conversion, so a zoom lens or the like can be incorporated in the optical path.

In addition, the optical member can suppress reflection of light in the wavelength region of 700 nm or more and 1150 nm or less, which has high sensitivity to the silicon photodiode used in the optical sensor and low human visual sensitivity. When the optical member is used in a camera module, the reflection of light in the wavelength region of 700 nm or more and 1150 nm or less can be suppressed, thereby hindering the perception in the silicon photodiode. As a result, in the camera module, the visual sensitivity correction that makes red a natural hue for human eyes becomes better. In addition, it is possible to suppress the occurrence of image defects such as ghosting of reflected light from the optical filter that occurs when the optical filter is used.

The maximum reflectivity of the unpolarized light rays incident on the reflecting surface at 45° from the vertical in the optical member may be 20% or less in the wavelength region of 700 nm or more and 1150 nm or less. As a result, it is possible to suppress reflection of light in the wavelength region of 700 nm or more and 1150 nm or less.

The reflectivity of the unpolarized light rays incident on the reflecting surface at 45° from vertical in the optical member may be 65% or more at a wavelength of 650 nm. As a result, light with a wavelength of 650 nm can be specularly reflected, and through the specular reflection, the optical path of light with a wavelength of 650 nm, which has a high human visual sensitivity, can be converted.

[Reflective surface] The embodiment of the reflective surface is not limited. For example, the reflective surface may be formed on the base material, or the reflective surface may be formed on the inclined surface of the prism. In the case where the inclined surface of the prism constitutes the reflecting surface, the shape of the prism is not limited. In addition, the reflective surface may be formed on the surface of a single-layer resin or a laminated film, or may be formed by coating on a base material.

[Substrate] The optical member may include a substrate and a reflective layer constituting the reflective surface, the substrate containing a compound having a maximum absorption in a wavelength region of 680 nm or more and 1200 nm or less. Since the compound contained in the base material absorbs light in the region of 680 nm or more and 1200 nm or less, the optical member can suppress the high sensitivity to silicon photodiodes and low human visual sensitivity of 700 nm or more and 1150 nm. The reflection of light in the wavelength region below nm. As long as the effect of the present invention is not impaired, the material, shape, etc. of the substrate are not particularly limited, and transparent inorganic materials, transparent resins, etc. can be used. The optical member may be formed of one substrate as shown in FIG. 5A or FIG. 5B, may also be formed of multiple substrates as shown in FIG. 5C, FIG. 5D, or FIG. 5E, or may be formed of a substrate having a curved surface as shown in FIG. 5F .

[Reflective layer] The embodiment of the reflective layer is not limited. For example, it can be a dielectric multilayer film, a high refractive index material layer containing a high refractive index material, a medium refractive index material layer containing a medium refractive index material, a low refractive index material layer containing a low refractive index material, a metal layer, a semiconductor layer, a dispersion There are embodiments such as high refractive index materials, medium refractive index materials, and resin layers of low refractive index materials. In addition, it may be an embodiment in which a plurality of reflective layers are combined. Furthermore, the reflective layer may be layered on one area of the base material, or the reflective layer may be layered on a plurality of areas. In the case of the above-mentioned base material laminated reflective layer, the reflective surface may be formed on the surface of the reflective layer, or the reflective surface may be formed on the surface where the reflective layer is in contact with the base material.

[Compound] The compound is not particularly limited as long as it has a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. Examples include: squaraine-based compounds, phthalocyanine-based compounds, naphthalocyanine-based compounds, croconium-based compounds, hexaphyrin-based compounds, azo-based compounds, and naphthoquinone-based compounds , Polymethine-based compounds, oxocyanine-based compounds, pyrrolopyrrole-based compounds, triarylmethane-based dyes, diiminium-based compounds, dithiol complex-based compounds, dithiol-ene complex-based compounds , Dipyrromethene-based compounds, mercaptophenol complex-based compounds, mercapto-naphthol complex-based compounds, etc. In addition, the compounds may be used alone or in combination of two or more.

The compound is preferably contained in the range of 0.01% by mass or more and 80.0% by mass or less with respect to the substrate. If the content of the substrate is within the above range, it is easy to obtain appropriate optical properties.

[Prism] The optical member may include a prism having a triangular cross section with an apex angle of 70° or more and 120° or less. In this case, an inclined surface facing the vertex angle of the prism constitutes the reflecting surface. As a result, specular reflection can be performed at a certain reflection angle without changing the oblique angle of the reflection surface. The apex angle is more preferably 80° or more and 110° or less, and still more preferably approximately a right angle.

[Light incident surface] The prism may further include a light incident surface through which light incident toward the reflection surface passes. As the optical characteristics of the light incident surface, the average reflectance of unpolarized light rays incident on the light incident surface at 5° from vertical is more preferably 20% or less in the wavelength region of 400 nm or more and 640 nm or less. If the optical characteristics of the light incident surface are within the above range, when light is incident in a direction substantially perpendicular to the light incident surface, the light incident surface can be prevented from facing wavelengths of 400 nm or more and 640 nm or less. The reflection of visible light in the area.

Regarding the optical characteristics of the light incident surface, the average reflectance of unpolarized light rays incident on the light incident surface at 5° from vertical is preferably 20% or less in the wavelength region of 700 nm or more and 1150 nm or less, and more Preferably it is 10% or less, More preferably, it is 5% or less. If the optical characteristics of the light incident surface are within the above range, when light is incident in a direction substantially perpendicular to the light incident surface, the light incident surface can be prevented from facing wavelengths of 700 nm or more and 1150 nm or less. The reflection of light in the area.

[Light exit surface] The prism may further include a light exit surface through which the light reflected on the reflective surface transmits. As the optical characteristics of the light exit surface, the average reflectance of unpolarized light rays incident on the light exit surface at 5° from vertical is preferably 20% or less in the wavelength region of 750 nm or more and 1150 nm or less, and more Preferably it is 10% or less, More preferably, it is 5% or less. If the optical characteristics of the light exit surface are within the range, when the light reflected by the reflective surface is incident in a direction substantially perpendicular to the light exit surface, the light exit surface can be prevented from opposing 750 The reflection of light in the wavelength range from nm to 1150 nm.

[Spectral transmission efficiency] The prism has an average transmission efficiency of 400 nm or more and 640 nm or less of the unpolarized light rays that are reflected on the reflective surface at an angle of 45° from vertical and transmitted through the light exit surface after incident on the light incident surface. The area is 80% or more, the wavelength area of 700 nm or more and 1150 nm or less is 8% or less, the transmittance is 80% or more at the wavelength of 600 nm, and the wavelength area where the maximum transmission efficiency is 700 nm or more and 1150 nm or less is 20% or less. Here, the so-called "average transmission efficiency" refers to the amount of unpolarized light emitted from the light exit surface after being reflected by the reflective surface relative to the amount of unpolarized light incident on the light incident surface ratio. If the optical characteristics of the prism are within the above range, the light incident on the prism can pass through the reflection caused by the reflecting surface and the transmission from the light exit surface, suppressing the low visual sensitivity of people from 700 nm or more and 1150 nm The transmission of light in the following wavelength regions transmits light in the wavelength region of 400 nm or more and 640 nm or less, which is high in human visual sensitivity.

[Camera Module] The camera module is a camera module that includes an optical member, the optical member includes a reflective surface, and the average reflectance of unpolarized light incident at 45° from vertical to the reflective surface is 400 nm or more and 640 nm or less The wavelength range of is 80% or more, and the wavelength range of 700 nm or more and 1150 nm or less is 8% or less.

According to the camera module, for light in the wavelength region of 700 nm or more and 1150 nm or less, where the human visual sensitivity is low, the reflection of the reflective surface is suppressed, so that red becomes a visual sensitivity that presents a natural hue to the human eye The correction becomes good. In addition, the camera module can ensure a sufficient optical path length by converting the optical path of light in the wavelength region of 400 nm or more and 640 nm or less. Therefore, a zoom lens or the like can be incorporated into the optical path to realize optical The high performance of the telescope function. Furthermore, the camera module can reduce the number of optical filters that shield near-infrared light, and can suppress the occurrence of image defects such as ghosts due to reflected light when the optical filter is used. The camera module can easily be thinned by reducing the optical filter.

The camera module may further include an optical sensor. The optical sensor may include, for example, a light receiving surface in which a plurality of light diodes are arranged in a matrix. The optical sensor can receive the light reflected by the optical member, perform photoelectric conversion, and output a photographic signal.

The camera module may further include a lens, and there may be no optical filter between the lens and the optical sensor. By reducing the optical filter, it is easy to reduce the thickness of the camera module.

The camera module may further include an optical system storage unit in the shape of a periscope. In the optical system storage unit, a plurality of the optical members are arranged such that the optical path is at a substantially right angle. As a result, a longer optical path length can be ensured, and therefore, high performance and thinning of the optical telephoto function can be achieved. In addition, the optical system storage unit may arrange the lens, a planar optical member, and the like between one optical member and the other optical member.

The camera module is useful in solid-state photography devices such as digital still cameras, mobile phone cameras, digital cameras, surveillance cameras, in-vehicle cameras, and web cameras. With the optical member included in the camera module, the optical path conversion of visible light and the shielding of near-infrared light can be taken into account. Therefore, the camera module is easy to implement the miniaturization and thinning of the exemplified solid-state imaging device. At the same time of the design, it takes into account the high performance of the optical telescope function.

The camera module may include an absorber that absorbs light in a specific wavelength region. The absorber is provided on the optical path of the light that is incident on the optical member and passes through the reflective surface without being reflected. As the optical characteristic of the absorber, the average reflectance of unpolarized light incident on the absorber at 5° from the vertical direction is preferably 10% or less in the wavelength region of 700 nm or more and 1150 nm or less, and more preferably It is less than 5%. If the optical characteristic of the absorber is within the range, it can absorb the light that has not been reflected but passes through the reflective surface, preventing diffuse reflection in the camera module.

The camera module may include a near infrared sensor that receives light in a specific wavelength region. The near-infrared sensor is provided on the optical path of the light that is incident on the optical member and passes through the reflective surface without being reflected. The light that is not reflected but passes through the reflective surface can be received, and the brightness around the camera module can be sensed. As a result, the light receiving unit for solid-state photography and the light receiving unit for ambient light can be provided as one, and a camera module with high design can be provided.

[Details of the embodiment of the present invention] Hereinafter, an optical member and a camera module according to an embodiment of the present invention will be described in detail with reference to the drawings.

[Details of the embodiment of the optical member] The optical member 1 shown in FIG. 1 includes a prism 5 having a right-angled isosceles triangle cross-section. The prism 5 has a right-angled triangular column shape, and includes a reflective surface 2, a light incident surface 3, and a light exit surface 4. The two orthogonal planes constitute the light incident surface 3 and the light exit surface 4, and the inclined surfaces that form an acute angle (45° in the embodiment of FIG. 1) with the light incident surface 3 and the light exit surface 4 constitute the reflective surface 2.

The light incident from the light incident surface 3 of the optical member 1 passes through the light incident surface 3 and is reflected by the reflective surface 2. The light reflected by the reflective surface 2 passes through the light exit surface 4 and exits the optical member 1. As an optical characteristic of the reflective surface 2, the average reflectance of unpolarized light incident on the reflective surface 2 at 45° from vertical is 80% or more in the wavelength region of 400 nm or more and 640 nm or less, and 700 nm or more and 1150 nm. The following wavelength range is 8% or less.

The optical member 1 can use the reflective surface 2 to specularly reflect the visible light of 400 nm or more and 640 nm or less, and the optical path can be converted by the specular reflection. In addition, the optical member 1 can suppress the reflection of light in the wavelength region of 700 nm or more and 1150 nm or less, which has high sensitivity to the silicon photodiode and low human visual sensitivity. Furthermore, the optical member 1 can suppress the loss of the light amount accompanying optical path conversion in visible light of 400 nm or more and 640 nm or less.

In addition, regarding the optical characteristics of the reflective surface 2 in the optical member 1, the maximum reflectance of unpolarized light incident at 45° from the vertical to the reflective surface 2 can be 20% or less in the wavelength region of 700 nm or more and 1150 nm or less. . When the light incident on the optical member 1 enters the reflective surface 2 at 45° from vertical, the optical member 1 can prevent the reflective surface 2 from reflecting light in the wavelength region of 700 nm or more and 1150 nm or less. Thereby, the optical member 1 can suppress specular reflection and optical path conversion of light in the wavelength region of 700 nm or more and 1150 nm or less, which is highly sensitive to the silicon photodiode used in the optical sensor.

Furthermore, regarding the optical characteristics of the reflective surface 2 in the optical member 1, the reflectance of unpolarized light rays incident on the reflective surface 2 at 45° from vertical can be 65% or more at a wavelength of 650 nm. When the light incident on the optical member 1 enters the reflective surface 2 at 45° from the vertical, the optical member 1 can perform optical path conversion on light of 650 nm wavelength with high human visual sensitivity by specular reflection.

According to the optical member 1, a single member is used to balance the optical path conversion of visible light and the shielding performance of near-infrared light. Furthermore, according to the optical member 1, for example, a single member can have both the function of a mirror that reflects visible light and the function of an optical filter that blocks near-infrared light.

In the above-mentioned embodiment, the case where the prism 5 has a right-angled isosceles triangular cross-section is described, but the shape of the prism 5 is not limited to this as long as it has a triangular cross-section. One of the apex angles in the triangular cross-section may be 70° or more and 120° or less, more preferably 80° or more and 110° or less, and still more preferably approximately a right angle. When the prism 5 has a right-angled triangular cross-section, the two sides forming the right angle may have the same length or different lengths. In addition, as the material of the prism 5, the material used for the base material described later can be used.

In the embodiment of the optical member 1 shown in FIG. 1, the form including the prism having a right-angled triangular cross-section has been described, but the shape of the prism is not limited to the triangular prism shape, and may be a quadrilateral or other polygonal shapes. It can be in the form of a film, a film, a flat plate, a single-layer resin, a laminated structure, and the like. For example, the optical member 11 shown in FIG. 2 may be in the form of a flat plate including the reflective surface 12.

In the case where the optical member 11 is in the shape of a plate, the thickness is not particularly limited as long as it is appropriately selected according to the desired use, and is preferably 0.01 mm or more and 0.2 mm or less, more preferably 0.015 mm or more and 0.15 mm or less, especially Preferably it is 0.02 mm or more and 0.1 mm or less. If the thickness of the optical member is in the above range, the ease of handling is excellent, and it is possible to further reduce camera modules and the like using the obtained optical member.

Like the optical member 21 shown in FIG. 3, it may have a reflective layer 23 constituting the reflective surface 22. For example, the reflective layer 23 may be laminated on the substrate 24. The substrate 24 may contain a compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. Since the compound absorbs light in the region from 680 nm to 1200 nm, the optical member 21 can suppress light in the wavelength region from 700 nm to 1150 nm, which has high sensitivity to silicon photodiodes and low human visual sensitivity. reflection.

The compound is not particularly limited as long as it has a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. Examples include: squaraine-based compounds, phthalocyanine-based compounds, naphthalocyanine-based compounds, croconium-based compounds, six-membered porphyrin-based compounds, azo-based compounds, naphthoquinone-based compounds, and polymethine-based compounds Compounds, oxocyanine compounds, pyrrolopyrrole compounds, diiminium compounds, dithiol complex compounds, dithiolene complex compounds, dipyrromethene compounds, mercaptophenol aluminum Complex compound, mercapto naphthol complex compound, copper oxide compound, copper phosphate compound, copper phosphonate compound, etc. The compound is preferably contained in the range of 0.01% by mass or more and 80.0% by mass or less with respect to the substrate 24.

The squaraine compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include a squaraine dye having a squaraine structure. Squaraine ylide compounds include those that do not have a maximum absorption in the wavelength range of 680 nm or more and 1200 nm or less. By selecting a squaraine ylide compound that has a maximum absorption in the wavelength range of 680 nm or more and 1200 nm or less , Or a combination of a squarylium compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the substrate 24.

The phthalocyanine-based compound or the naphthalocyanine-based compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include metal phthalocyanine and metal naphthalocyanine. As the central metal, copper, zinc, cobalt, vanadium, iron, nickel, tin, silver, magnesium, sodium, lithium, lead, etc. can be used. Phthalocyanine-based compounds or naphthalocyanine-based compounds include those that do not have maximum absorption in the wavelength range from 680 nm to 1200 nm. By selecting phthalocyanines that have maximum absorption in the wavelength range from 680 nm to 1200 nm. A compound or a naphthalocyanine compound, or a phthalocyanine compound or a naphthalocyanine compound that has a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less, can be used as the compound contained in the substrate 24 .

The croconium-based compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include croconium-based dyes having a croconium structure. A part of the croconium-based compound also includes those that do not have a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. By selecting a croconium-based compound that has a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less, or A croconium-based compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the substrate 24 in combination.

The six-membered porphyrin-based compound is not particularly limited as long as it does not impair the effects of the present invention, and examples thereof include six-membered porphyrins, florin-type six-membered porphyrins, and the like. Some of the six-membered porphyrin-based compounds also include those that do not have a maximum absorption in the wavelength range from 680 nm to 1200 nm. By selecting a six-membered porphyrin-based compound that has a maximum absorption in the wavelength range from 680 nm to 1200 nm. , Or a combination of a six-membered porphyrin-based compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the substrate 24.

The azo compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include diazo dyes, trisazo dyes, and the like. Some azo compounds include those that do not have maximum absorption in the wavelength range from 680 nm to 1200 nm. By selecting azo compounds with maximum absorption in the wavelength range from 680 nm to 1200 nm, or using them in combination An azo compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the base material 24.

The naphthoquinone compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include 1,4-disubstituted 5,8-naphthoquinone derivatives. Some of the naphthoquinone compounds also include those that do not have maximum absorption in the wavelength range from 680 nm to 1200 nm. By selecting naphthoquinone compounds with maximum absorption in the wavelength range from 680 nm to 1200 nm, or using them in combination A naphthoquinone compound having a great absorption in the wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the substrate 24.

The polymethine compound is not particularly limited as long as it does not impair the effects of the present invention. Examples include cyanines, merocyanines, carbocyanines, azacyanines, and thiocyanines. Cyanine (thiacyanine), Brooker's merocyanine, etc. The oxocyanine compound is not particularly limited as long as the effect of the present invention is not impaired, and oxocyanines such as oxocyanine VI and the like can be mentioned. Some of the polymethine-based compounds or oxonine-based compounds also include those that do not have maximum absorption in the wavelength range from 680 nm to 1200 nm. By selecting those that have maximum absorption in the wavelength range from 680 nm to 1200 nm. Polymethine-based compounds or oxonine-based compounds, or polymethine-based compounds or oxonine-based compounds that have a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less, can be used as the substrate 24 The compound contained.

The pyrrolopyrrole-based compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include compounds having a diketopyrrolopyrrole structure. Some of the pyrrolopyrrole-based compounds also include those that do not have maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. By selecting pyrrolopyrrole-based compounds that have a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less, or A pyrrolopyrrole-based compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the substrate 24 in combination.

The diiminium-based compound is not particularly limited as long as it does not impair the effects of the present invention. Examples include bis(trifluoromethanesulfonyl)imidate ion, periodate ion, and tetrafluoroborate ion. Diiminium salts such as ions, diiminium compounds described in paragraphs [0049] to [0061] of International Publication No. 2018/043564, and the like. A part of the diimonium compound also includes those that do not have a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. By selecting a diimonium compound that has a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less, or The diiminium-based compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the substrate 24 in combination.

The dithiol complex compound-based compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include dithiol metal complexes. As said dithiolene complex compound, for example, a dithiolene metal complex compound, etc. are mentioned. As the central metal, transition metals and the like can be used together. The dithiol complex compound or a part of the dithiol ene complex compound also includes those that do not have a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. By selecting those having a wavelength of 680 nm or more and 1200 nm or less Dithiol complex compound or dithiol ene complex compound with maximum absorption in the wavelength range, or dithiol complex compound with maximum absorption in the wavelength range from 680 nm to 1200 nm Or a dithiolene complex-based compound can be used as the compound contained in the substrate 24.

The dipyrromethene-based compound is not particularly limited as long as it does not impair the effects of the present invention, and examples thereof include dipyrromethene-based boron complex compounds. Some dipyrromethene compounds include those that do not have maximum absorption in the wavelength range from 680 nm to 1200 nm. By selecting the dipyrromethene group that has maximum absorption in the wavelength range from 680 nm to 1200 nm. A compound or a dipyrromethene compound having a maximum absorption in a wavelength region of 680 nm or more and 1200 nm or less can be used as the compound contained in the substrate 24 in combination.

The mercaptophenol complex compound-based compound is not particularly limited as long as the effect of the present invention is not impaired, and examples thereof include metal complexes of mercaptophenol derivatives. Examples of the mercapto naphthol complex compound-based compound include metal complexes of mercapto naphthol derivatives and the like. As the central metal, transition metals and the like can be used together. A part of mercaptophenol complex compounds or mercaptonaphthol complex compounds is also included in the wavelength range from 680 nm to 1200 nm that does not have a maximum absorption. By selecting the wavelength range from 680 nm to 1200 nm Mercaptophenol complex compounds or mercaptonaphthol complex compounds with maximum absorption, or mercaptophenol complex compounds or mercaptonaphthol complexes with maximum absorption in the wavelength range from 680 nm to 1200 nm A compound-based compound can be used as the compound contained in the substrate 24.

The compound can be synthesized using generally known methods. As the synthesis method, for example, Japanese Patent Laid-Open No. 60-228448, Japanese Patent Laid-Open No. 1-146846, Japanese Patent Laid-Open No. 1-228960, Japanese Patent No. 4081149, Japanese Patent No. Publication No. 63-124054, "Phthalocyanine-Chemistry and Function-" (IPC, 1997), Japanese Patent Application Publication No. 2007-169315, Japanese Patent Application Publication No. 2009-108267, Japanese Patent Application Publication No. 2010- The methods described in 241873, Japanese Patent No. 3699464, and Japanese Patent No. 4740631.

[Substrate] The substrate 24 may be a transparent inorganic material. The transparent inorganic material is not particularly limited, and examples include quartz, borosilicate glass, silicate glass, chemically strengthened glass, physically strengthened glass, soda glass, phosphate glass, alumina glass, and sapphire glass. , Colored glass, etc. Examples of these commercially available products include: D263, BK7, B270, KG1 manufactured by SCHOTT Corporation, or those obtained by cutting KG1 into the shape of the base material, and KG3 or cutting KG3 into the base material. KG5 or KG5 is cut into the shape of the base material; C5000 manufactured by HOYA (stock) is cut into the shape of the base material, and CD5000 is cut into The shape of the base material, the shape of the base material is cut E-CM500S; Corning (Corning) Gorilla Glass (Gorilla Glass), Willow Glass (Willow Glass); Songlang Glass Industry ( Stock) BS1 to BS11 manufactured by cutting BS1 to BS11 into the shape of the base material; Hiceram manufactured by NGK Insulators (stock), etc. Among these, in terms of high visible light transmittance and excellent near-infrared shielding performance, borosilicate-based glass or phosphate-based glass is preferred. The borosilicate-based glass is not particularly limited, and examples thereof include The above-mentioned D263, BK7, B270, KG1, KG3, KG5, etc. are not particularly limited as the phosphate-based glass, and copper phosphate-based glass containing copper atoms and the like can be mentioned. The copper phosphate-based glass containing copper atoms can be obtained, for example, by the methods described in Japanese Patent Publication No. 2015-522500, International Publication No. 2011/071157, and International Publication No. 2017/208679. As the phosphate-based glass, a fluorophosphate-based glass that tends to have little change in optical properties under a high-temperature and high-humidity environment and contains fluorine atoms is preferable.

In addition, the material of the substrate 24 may be a transparent resin. The transparent resin is not particularly limited as long as it does not impair the effects of the present invention. For example, it can be manufactured at a vapor deposition temperature of 100°C or higher to ensure thermal stability and formability to a plate-shaped body. The substrate for forming a dielectric multilayer film by high-temperature vapor deposition includes a glass transition temperature (Tg) of preferably 110°C or higher and 380°C or lower, more preferably 110°C or higher and 370°C or lower, and still more preferably 120°C or higher and 360°C. Resin below ℃. In addition, if the Tg of the resin is 150°C or higher, even when additives are added to the resin at a high concentration to reduce the Tg, it becomes a substrate that can be vapor-deposited to form a dielectric multilayer film at a high temperature, so it is particularly preferred .

As the transparent resin, in the case of forming a resin plate with a thickness of 0.05 mm containing only the resin, it is desirable to use the total light transmittance of the resin plate (Japanese Industrial Standards (JIS) K7375). ) It is preferably 50% or more and 96% or less, more preferably 60% or more and 96% or less, particularly preferably 70% or more and 96% or less resin. If a resin whose total light transmittance falls within this range is used, the obtained substrate will exhibit good transparency as an optical film.

The weight average molecular weight (Mw) of the transparent resin in terms of polystyrene as measured by gel permeation chromatography (GPC) method is usually 15,000 or more and 350,000 or less, preferably 30,000 or more and 250,000 or less, and the number is average The molecular weight (Mn) is usually 10,000 or more and 150,000 or less, preferably 20,000 or more and 100,000 or less.

Examples of the transparent resin include: cyclic polyolefin resins, aromatic polyether resins, polyimide resins, fluorene polyester resins, polycarbonate resins, polyamide resins, aromatic resins Group polyamide resins, polyvinyl resins, polyether ether resins, polyparaphenylene resins, polyamide imide resins, polyethylene naphthalate resins, fluorinated aromatic polymers Resins, (modified) acrylic resins, epoxy resins, silsesquioxane UV curable resins, maleimide resins, alicyclic epoxy thermosetting resins, polyether ether ketone resins , Polyarylate resins, allyl ester curable resins, acrylic ultraviolet curable resins, vinyl ultraviolet curable resins, resins formed by the sol-gel method with silica as the main component, etc. Among these, it is preferable to use cyclic polyolefin resins, aromatic polyether resins, and fluorene in terms of obtaining optical members having a more excellent balance of transparency (optical properties), heat resistance, and reflow resistance. Polyester resin, polycarbonate resin, polyimide resin, fluorinated aromatic polymer resin, acrylic ultraviolet curable resin. One type of transparent resin may be used alone, or two or more types may be used.

The base material can be used to form a prism like the optical member 1 shown in FIG. 4. In the optical member 1, the length L of FIG. 4 may be 0.5 mm or more and 100 mm or less, the width W may be 0.5 mm or more and 100 mm or less, and the height H may be 0.5 mm or more and 100 mm or less, more preferably the length L is 0.5 mm Above and 50 mm, the width W is 0.5 mm or more and 50 mm or less, the height H is 0.5 mm or more and 50 mm or less, and the length L is 0.5 mm or more and 20 mm or less, and the width W is 0.5 mm or more and 20 mm. mm or less, the height H is 0.5 mm or more and 20 mm or less.

[Method of manufacturing base material] In the case where the substrate 24 is a plate-shaped substrate containing the transparent resin, the substrate 24 can be formed by, for example, melt molding or casting, and further, if necessary, an anti-reflective agent or a hard coat agent is applied after the molding. , Antistatic agent and other coating agents, etc., so that the base material laminated with the outer coating can be produced.

When the substrate 24 is a substrate in which a transparent resin layer containing additives or the transparent resin is laminated on a transparent inorganic material support or a resin support, for example, a transparent inorganic material support or a resin support The resin solution containing the additives is melt-molded or cast-molded on the body, and it is preferably applied by spin coating, slit coating, inkjet, etc., and then the solvent is dried and removed, and light irradiation or heating is further performed as necessary. Thereby, a base material in which the transparent resin layer is formed on a transparent inorganic material support or a resin support can be manufactured.

[Melt forming] As the melt molding, specifically, the following method may be mentioned: when the base material 24 contains a resin and an additive, a method of melting and kneading a pellet obtained by melting and kneading the resin and the additive; A method of melt-molding the resin composition; a method of melt-molding pellets obtained by removing the solvent from a resin composition containing additives, resins, solvents, and the like. Examples of melt molding methods include injection molding, melt extrusion molding, blow molding, and the like. In the case where the base material 24 contains a transparent inorganic material, the following method may be mentioned: a platinum crucible, a platinum-rhodium crucible, a gold crucible, an iridium crucible, a crucible made of alumina porcelain, etc. are used according to the melting point or releasability of the inorganic material, and After melting the transparent inorganic material in the crucible, it is formed by overflow method, float method, etc.

[Casting] As the casting, a method of casting a resin composition containing additives, resins, solvents, etc. on a suitable support to remove the solvent can be mentioned. In addition, the following method may also be used: a curable composition containing additives, photocurable resin, thermosetting resin, etc., is cast on an appropriate support to remove the solvent, and then cured by an appropriate method such as ultraviolet radiation and heating. .

In the case where the substrate 24 is a plate-shaped substrate including the transparent resin layer containing an additive, the substrate 24 can be obtained by peeling the coating film from the support after casting. When the substrate 24 is a plate-shaped substrate in which a transparent resin layer such as an overcoat layer containing additives, curable resin, etc., is laminated on a support made of a transparent inorganic material or a support made of resin, the substrate 24 For example, it can be obtained by not peeling off the coating film after casting.

Examples of the support body include a support body made of a glass plate, a steel strip, a steel tube, and a transparent resin (for example, a polyester film, a cyclic olefin resin film).

Furthermore, a method of coating the resin composition on an optical member made of a transparent inorganic material or a transparent resin to dry the solvent, or a method of coating the curable composition, curing and drying, etc. may also be used. A transparent resin layer is formed on the optical member.

When the substrate is a prismatic substrate including a transparent resin layer containing an additive, it can be obtained by melt molding.

The amount of residual solvent in the substrate obtained by the method is preferably as small as possible. Specifically, with respect to 100% by mass of the transparent resin layer or the transparent resin base material, the residual solvent amount is preferably 3% by mass or less, more preferably 1% by mass or less, and even more preferably 0.5% by mass or less. If the amount of the residual solvent is in the above range, a transparent resin layer or a transparent resin base material that deforms or hardly changes in characteristics and can easily perform the required functions can be easily obtained.

[additive] The base 24 may contain additives such as antioxidants, light stabilizers, fluorescence quenchers, and ultraviolet absorbers within a range that does not impair the effects of the present invention. One of these additives may be used alone, or two or more of them may be used.

Examples of the antioxidant include: 2,6-di-tert-butyl-4-methylphenol, 2,2'-dioxy-3,3'-di-tert-butyl-5,5' -Dimethyldiphenylmethane, tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane, tris(2,4-di-tert-butyl Phenyl) phosphite.

Examples of the ultraviolet absorber include azomethine-based compounds, indole-based compounds, triazole-based compounds, triazine-based compounds, oxazole-based compounds, merocyanine-based compounds, cyanine-based compounds, and naphthalene Dimethimide-based compounds, oxadiazole-based compounds, oxazine-based compounds, oxazolidine-based compounds, naphthalenedicarboxylic acid-based compounds, styryl-based compounds, anthracene-based compounds, cyclic carbonyl-based compounds, and the like.

The ultraviolet absorber desirably has an absorption maximum wavelength in the range of preferably 350 nm or more and 410 nm or less, more preferably 350 nm or more and 405 nm or less, and still more preferably 360 nm or more and 400 nm or less. . By having the maximum absorption wavelength in the above-mentioned range, an optical member with more excellent visual sensitivity correction can be easily obtained. In addition, the maximum absorption wavelength can be measured using a solution in which an ultraviolet absorber is dissolved in dichloromethane.

[Dielectric multilayer film] The reflective layer constituting the reflective surface in the optical member of the present invention may be a dielectric multilayer film. The dielectric multilayer film may be multiple. For example, the reflective layer constituting the reflective surface 32 in the optical member 31 shown in FIG. 5A is a dielectric multilayer film 36a, and the substrate 35 has a dielectric multilayer film 36b on the other surface. The optical member 31 may have the dielectric multilayer film 36 a only on the surface constituting the reflective surface of the base 35. In terms of suppressing warpage, the optical member 31 preferably has a dielectric multilayer film 36a and a dielectric multilayer film 36b on both sides of the base material, and the absolute difference of the total physical film thickness of the dielectric multilayer film 36a and the dielectric multilayer film 36b is absolute. The value is more preferably less than 5.0 μm. It is more preferably less than 4.0 μm, still more preferably less than 3.0 μm, still more preferably less than 2.0 μm, particularly preferably less than 1.5 μm, and most preferably less than 1.0 μm. When the absolute value of the difference between the total physical film thickness of the dielectric multilayer film 36a and the dielectric multilayer film 36b is 0.1 μm or more and less than 5.0 μm, in terms of suppressing warpage, it is preferable to form the dielectric The temperature when the multilayer film is formed is different from the temperature when the dielectric multilayer film on the other side is formed in the range of about 10°C to about 80°C.

Like the optical member 41a shown in FIG. 5B, the dielectric multilayer film 46a may constitute the reflective surface 42 included in the prismatic base material 45. In addition, the light incident surface 43 may be formed in the dielectric multilayer film 46b, and the light exit surface 44 may be formed in the dielectric multilayer film 46c. As shown in FIGS. 6A and 6B, the light L incident from the light incident surface 43 of the optical member 41 a passes through the light incident surface 43 and is reflected by the reflective surface 42. The reflected light L1 reflected by the reflective surface 42 passes through the light exit surface 44 and exits from the optical member 41a. In addition, the transmitted light L2 that is not reflected by the reflective surface 42 passes through the reflective surface 42 and exits from the optical member 41a. The optical member of the present invention may be formed of a plurality of base materials 45 as shown in FIG. 5C, FIG. 5D or FIG. 5E, or the base material 45 may have a curved surface as shown in FIG. 5F.

The dielectric multilayer film may include, for example, a high refractive index material layer, a low refractive index material layer, a medium refractive index material layer, and the like.

As a material constituting the high refractive index material layer, a material having a refractive index of 2.0 or more is mentioned, and a material having a refractive index of 2.0 or more and 3.6 or less is usually selected. In addition, the refractive index represents a value under light with a wavelength of 550 nm.

As a material constituting the high refractive index material layer, for example, titanium oxide, zirconium oxide, tantalum oxide, niobium oxide, lanthanum oxide, zinc oxide, zinc sulfide, barium titanate, silicon, etc. are used as main components, and relatively In the main component, for example, materials containing hydrogen, titanium oxide, niobium oxide, hafnium oxide, tin oxide, and cerium oxide in an amount exceeding 0% by mass and 10% by mass or less; make titanium oxide, zirconium oxide, tantalum oxide, niobium oxide, A material in which lanthanum oxide, zinc oxide, zinc sulfide, barium titanate, or silicon is dispersed in a resin such as the transparent resin.

As a material constituting the low refractive index material layer, a material having a refractive index of less than 1.6 can be cited, and a material having a refractive index of 1.2 or more and less than 1.6 is usually selected. Examples of such materials include silicon dioxide, lanthanum fluoride, magnesium fluoride, sodium aluminum hexafluoride, and the like. In addition, a material obtained by dispersing silicon dioxide, lanthanum fluoride, magnesium fluoride, sodium aluminum hexafluoride, and the like in the transparent resin can be cited.

As a material constituting the medium refractive index material layer, a material having a refractive index of 1.6 or more and less than 2.0 can be cited. Examples of such materials include aluminum oxide, bismuth oxide, europium oxide, yttrium oxide, ytterbium oxide, samarium oxide, indium oxide, magnesium oxide, and molybdenum oxide. In addition, a material obtained by mixing these materials with the material constituting the high refractive index material layer and the material constituting the low refractive index material layer; and combining the material constituting the high refractive index material layer with the material constituting the low refractive index material layer. The material of the high-efficiency material layer, a material obtained by mixing these materials in a resin such as the above-mentioned transparent resin, and the like.

The dielectric multilayer film may have a metal layer or a semiconductor layer of about 1 nm to 100 nm. Examples of materials constituting these layers include materials having a refractive index of about 0.1 to 5.0. Examples of such materials include gold, silver, copper, zinc, aluminum, tungsten, titanium, magnesium, nickel, silicon, silicon hydride, germanium, and the like.

The method of forming the dielectric multilayer film is not particularly limited as long as the dielectric multilayer film formed by laminating these materials can be formed. For example, chemical vapor deposition (chemical vapor deposition, CVD) method, sputtering method, vacuum vapor deposition method, ion assisted vapor deposition method, ion plating method, etc. can be used to directly form alternating layers with high refractive index on the substrate. A dielectric multilayer film consisting of a low refractive index material layer and a low refractive index material layer, or a dielectric multilayer film consisting of a high refractive index material layer, a medium refractive index material layer, and a low refractive index material layer alternately laminated. When a layer containing a transparent resin is laminated, melt molding or cast molding can be used in the same manner as the molding method of the substrate, and preferably, spin coating, dip coating, slit coating, or gravure coating can be used. And so on.

Among these, the sputtering method, the ion-assisted vapor deposition method, or the ion plating method is preferable from the viewpoints of the adhesion to the substrate and the low change in the optical properties of the dielectric multilayer film due to humidity.

For example, as a device that can perform the ion-assisted vapor deposition, SYRUSpro series manufactured by Buhler Leybold Optics, OTFC series manufactured by Optorun (stock), Shincoron (shincron) ) (Stock) MIC series, EPD series, Shinmeiwa Industry (Stock) VCD series, Showa Vacuum (Stock) Sapio (Sapio) series, etc.

In the ion-assisted vapor deposition, it is preferable to use a crystal oscillator to control the deposition rate of vapor deposition, and to use an optical monitor estimated from the reflection intensity to control the optical film thickness of each layer of the dielectric multilayer film. In the case of forming a layer with a physical film thickness of 60 nm or less, it is preferable to control the film thickness using the integrated value of the film formation rate of the crystal oscillator. By using the integrated value of the film formation rate of the crystal oscillator to control the film thickness, it is possible to reduce the deviation of the optical film thickness control by the optical monitor.

The formation of the dielectric multilayer film is preferably performed at 90°C or higher. By setting it as 90 degreeC or more, the film peeling when the obtained optical member is heated to 90 degreeC, the crack of the obtained dielectric multilayer film, and the generation of a crack are reduced. From the viewpoint of increasing the heat-resistant temperature of the optical member, etc., the formation temperature of the dielectric multilayer film is more preferably 120° C. or higher.

When the dielectric multilayer film is formed by vapor deposition, the degree of vacuum at the start of vapor deposition is preferably 0.01 Pa or less, more preferably 0.005 Pa or less, and still more preferably 0.001 Pa or less. By further setting the degree of vacuum at the start of vapor deposition to a high vacuum, the moisture content in the obtained dielectric multilayer film can be reduced, and the phenomenon that the optical properties of the obtained optical member change according to humidity can be reduced. In the case of forming the dielectric multilayer film by the ion-assisted vapor deposition, the degree of vacuum in the formation of the dielectric multilayer film is preferably 0.05 Pa or less. By setting it to 0.05 Pa or less, the smoothness of the obtained dielectric multilayer film is good, and the optical member with low haze can be obtained.

In addition, the gas introduced into the ion gun that is the ion supply device in the ion-assisted vapor deposition is preferably oxygen or a mixed gas of oxygen and a rare gas. By using oxygen or a mixed gas of oxygen and a rare gas, a dielectric multilayer film having a film with less absorption of the dielectric multilayer film, good smoothness, and less crystallinity can be obtained.

By appropriately setting the structure of the dielectric multilayer film, specifically, by appropriately selecting the types of materials constituting the high refractive index material layer, the medium refractive index material layer, the low refractive index material layer, etc., the high refractive index material layer, the medium The thickness of each layer, such as the refractive index material layer and the low refractive index material layer, the order of layering, the number of layers, etc., can obtain the optical member of the present invention.

[Reflection Band] In the above-mentioned dielectric multilayer film, a reflection band is formed by optical interference by appropriately setting the film thickness of each layer of the laminate. Here, the "reflection band" refers to a wavelength band in which the reflectance is 80% or more when incident from an angle of 45° from the surface where the dielectric multilayer film is formed. In order to efficiently reach the sensor in the visible light wavelength region of 400 nm or more and 640 nm or less, the optical member of the present invention includes a reflective surface having the reflection band with a reflectivity of 80% or more in the wavelength region. In order to make visible rays reach the sensor more efficiently, the reflectance is 85% or more, and more preferably 90% or more. In addition, in order to prevent the near-infrared wavelength region of 700 nm or more and 1150 nm or less, which is a cause of noise or ghosting, from intruding into the sensor, the near-infrared wavelength region with low visual sensitivity of the human eye does not have a reflection band in the wavelength region. The reflectance in the wavelength region of 700 nm or more and 1150 nm or less is 8% or less, and from the viewpoint of further reducing noise, it is 6% or less, and more preferably 4% or less.

[Other functional film] The optical member of the present invention can be used for the purpose of improving the surface hardness of the substrate or the dielectric multilayer film, improving chemical resistance, antistatic, and eliminating damage within the range that does not impair the effects of the present invention. Between the substrate and the dielectric multilayer film, the surface of the substrate and the surface on which the dielectric multilayer film is provided on the opposite side, or the dielectric multilayer film and the surface on which the substrate is provided The surface on the opposite side preferably has a functional film such as an anti-reflection layer, a hard coat film, and an antistatic film. The optical member of the present invention may include one layer of the functional film, or may include two or more layers. When the optical member of the present invention includes two or more layers of the functional film, it may include two or more of the same layer, or may include two or more different layers.

The method of laminating the functional film is not particularly limited, and examples include: coating the substrate or the dielectric multilayer film with an anti-reflective agent, a hard coat agent, an antistatic agent, etc., in the same manner as described above. Methods such as melt molding or cast molding. In addition, it can also be manufactured by applying a curable composition containing the coating agent or the like on the substrate or the dielectric multilayer film using a bar coater or the like, and then curing by ultraviolet irradiation or the like .

Examples of the coating agent include ultraviolet (ultraviolet, UV)/electron beam (EB) curable resins or thermosetting resins. Specifically, examples include vinyl compounds or urethanes. Ester type, acrylic urethane type, acrylate type, epoxy type, epoxy acrylate type resin, etc. Examples of the curable composition containing these coating agents include: vinyl-based, urethane-based, acrylic urethane-based, acrylate-based, epoxy-based, and epoxy acrylate-based curing Sexual composition, etc.

The curable composition may also contain a polymerization initiator. As the polymerization initiator, a known photopolymerization initiator, thermal polymerization initiator, or the like can be used, and a photopolymerization initiator and a thermal polymerization initiator can also be used in combination. The polymerization initiator may be used singly, or two or more may be used.

In the curable composition, when the total amount of the curable composition is 100% by mass, the blending ratio of the polymerization initiator is preferably 0.1% by mass or more and 10% by mass or less, and more Preferably it is 0.5 mass% or more and 10 mass% or less, Especially preferably, it is 1 mass% or more and 5 mass% or less. If the blending ratio of the polymerization initiator is in the above range, the curable composition obtained has excellent curing characteristics and handleability, and it is easy to obtain an anti-reflection layer, a hard coat film, and an antistatic layer having the required hardness. The functional film such as film.

An organic solvent can be added to the curable composition, and as the organic solvent, a known solvent can be used. Specific examples of the organic solvent include alcohols such as methanol, ethanol, isopropanol, butanol, and octanol, and ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. , Ethyl acetate, butyl acetate, ethyl lactate, γ-butyrolactone, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate and other esters, ethylene glycol monomethyl ether, diethylene glycol monobutyl Ethers such as ethers, aromatic hydrocarbons such as benzene, toluene, and xylene, amines such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. One of these solvents may be used alone, or two or more of them may be used.

The thickness of the functional film is preferably 0.9 μm or more and 30 μm or less, more preferably 0.9 μm or more and 20 μm or less, and particularly preferably 0.9 μm or more and 5 μm or less.

For the purpose of improving the adhesion between the substrate and the functional film or the dielectric multilayer film, or the adhesion between the functional film and the dielectric multilayer film, the substrate and the dielectric multilayer film may be The surface of the functional film or the dielectric multilayer film is subjected to surface treatment such as corona treatment, plasma treatment, and vacuum ultraviolet treatment.

[Shading Film] In addition, the optical member of the present invention may have a light-shielding film on the outermost layer or part of the layer. For example, the optical member 51 in FIG. 7A has a light-shielding film 52 on the surface of the base material 53. In addition, the optical member 61 of FIG. 7B has a light-shielding film 62a and a light-shielding film 62b on the light incident surface and the light exit surface of the base material 63. By having the light-shielding film in this manner, in a solid-state imaging device or camera module including the optical member 51 or the optical member 61, the light reflected by the frame or lens can be prevented from entering the sensor, and it is possible to easily obtain the suppression of ghost images. The image is therefore preferred.

Examples of materials for forming the light-shielding film include: resin materials such as thermosetting resins, ultraviolet curing resins, and thermoplastic resins, metal materials such as chromium, molybdenum, tungsten, iron, nickel, titanium, and chromium, and oxides of the metal materials. , Graphite or carbon nanotubes, carbon materials such as fullerene, absorbing materials containing one or more pigments, one or more dyes, etc. Among these, it is preferable to include an ultraviolet curable resin in terms of ease of shape control and the like.

The thickness of the light-shielding film is preferably 0.1 μm or more and 10 μm or less. When the thickness of the light-shielding film is less than 0.1 μm, there is a tendency that it is difficult to obtain a sufficient optical density (Optical Density) (OD value), and when the thickness exceeds 10 μm, there are windings in the end face of the light-shielding film. The tendency of the influence of radiation or reflection to become greater. Preferably, the thickness is 0.5 μm or more and 4.0 μm or less.

The light-shielding film provided in the optical member of the present invention may be one site or a plurality of sites. Here, regarding the number of light-shielding films, a continuous frequency band is regarded as having one light-shielding film formed, and having a plurality of light-shielding films means having a plurality of discontinuous light-shielding films.

Regarding the light-shielding film, in the total light transmittance under the D65 light source (a standard light source defined by the International Commission on Illumination (CIE)), the OD value is preferably 3.0 or more, more preferably 4.0 or more. If the OD value is in the above range, stray light can be sufficiently blocked.

The method of forming the light-shielding film is not particularly limited, and examples thereof include coating methods, sputtering methods, vacuum vapor deposition methods, and screen printing methods. Examples of the coating method include: spin coating method, bar coating method, dip coating method, casting method, spray coating method, bead coating method, wire bar coating method, blade coating method, roll Coating method, curtain coating method, slot die coating method, gravure coating method, slit reverse coating method, micro gravure method, missing corner wheel coating method, etc. The coating in these methods can be divided into multiple implementations.

The light-shielding film can also cooperate with multiple light-shielding films to form a Fresnel zone plate or mosaic mask. The optical member constituting the Fresnel zone plate can be replaced by a lens, and the obtained solid-state imaging device, camera module, sensor module, etc. can be further reduced in thickness, which is preferable. The light-shielding film constituting the mosaic mask does not require a lens, and the image data capable of changing the focal distance can be obtained by performing calculation processing on the obtained image, which is therefore preferable.

The optical member of the present invention may have irregularities at positions not related to the optical path. FIG. 8A shows an example in which rectangular parallelepiped convex portions 72 a and convex portions 72 b are provided on both side surfaces of the optical member 71. In addition, FIG. 8B is a plan view of the optical member 71 viewed from a direction perpendicular to the light incident surface. FIG. 8C is a bottom view of the optical member 71 viewed from a direction perpendicular to the reflection surface. In the camera module including the optical member of the present invention, when the incident angle of light is shifted due to the shift of the optical member, the optical path of the light reaching the sensor may be skewed. From the viewpoint that it is possible to fix the angle of the optical member without reference to the uneven portion of the position of the optical path, the optical member of the present invention preferably has uneven portions, and more preferably contains convex portions with ribs. In addition, the concavo-convex portion may be a depression.

The optical member of the present invention has a thin and excellent visual sensitivity correction characteristic, and even if the incident light is at a high angle, the cutoff characteristic of the near-infrared band is excellent. Therefore, it is useful for the purpose of correcting the visual sensitivity of solid-state imaging devices such as solid-state imaging devices, camera modules, and sensors that are compatible with high-angle incidents.

[Details of the implementation of the camera module] The camera module 101a shown in FIG. 9A includes the optical member 1, and the optical member 1 includes a reflective surface 2. The camera module 101a further includes a lens 102, an optical filter 103a, and an optical sensor 104a. The camera module 101b shown in FIG. 9B includes the optical member 11, and the optical member 11 includes a reflective surface 12. In addition, the camera module of the present invention may not include an optical filter between the lens and the optical sensor. For example, in the camera module 101c of FIG. 9C, the optical filter 103a is not provided between the lens 102 and the optical sensor 104a, and a cover glass 107 is provided on the optical path before the light of the optical member 1 is incident.

The light incident to the camera module 101a shown in FIG. 9A is reflected by the reflective surface 2 and transmitted through the lens 102 to be received by the optical sensor 104a. The lens 102 may be one or more pieces. In addition, for the lens 102, a convex lens, a concave lens, etc. are appropriately set in accordance with the zoom performance of the camera module 101a and the like.

The camera module 101a can convert the optical path of the light incident on the optical member 1 by using the reflective surface 2 to ensure a sufficient optical path length. Therefore, multiple lenses 102 can be incorporated in the optical path. The camera module 101a may have a zoom function and the like through the lens 102. In addition, the camera module 101a can suppress the reflection of light in the wavelength region of 700 nm or more and 1150 nm or less, which is highly sensitive to silicon photodiodes, according to the optical characteristics of the reflective surface 2, thereby preventing the optical sensor 104a from reflecting Perceives light in the wavelength range from nm to 1150 nm. As a result, in the camera module 101a, the visual sensitivity correction to make red a natural hue for human eyes becomes better. Furthermore, the camera module 101a can reduce the optical filter that shields near-infrared light from its structure, thereby suppressing the occurrence of image defects such as ghost due to reflected light when the optical filter is used.

The camera module 101d shown in FIG. 9D includes a lens 102, an optical member 1 arranged in front of the lens 102 in the optical path, and an optical member 1 arranged behind the lens 102 in the optical path. In addition, the camera module 101d further includes an optical system storage unit 108 in the shape of a periscope. The optical system storage unit 108 includes two optical members 1 and the two optical members 1 are arranged such that the optical path is substantially at right angles. By including the optical system storage unit 108 in the shape of a periscope, the light incident surface of the light is parallel to the sensor surface, so the width of the sensor is not limited by the thickness of the camera module, and a sensor with a larger area can be made preferably . The camera module 101d of the above-mentioned structure can ensure a long optical path length by bending the optical path twice, and thus can achieve high performance and thinner optical telephoto functions. There may be a lens 102 or a lens instead of the planar optical element 106 between one optical component 1 and another optical component 1. In addition, although not shown in FIG. 9D, the camera module 101d may include an optical filter, or may include a plurality of optical system storage units.

The camera module 101e shown in FIG. 9E includes an absorber 105 that absorbs light in a specific wavelength region. The absorber 105 may be provided on the optical path of the light incident on the optical member 1 and not reflected but transmitted through the reflective surface 2. As the optical characteristics of the absorber 105, the average reflectance of unpolarized light incident on the absorber 105 at 5° from the vertical direction is preferably 10% or less in the wavelength region of 700 nm or more and 1150 nm or less, and more preferably 5 %the following.

As the absorber 105, for example, a transparent resin containing a near-infrared light absorbing dye having a steep absorption characteristic can be used. As the near-infrared light-absorbing pigment, for example, metal complex compounds, dyes, and pigments that function as pigments that absorb near-infrared light can be used. Examples include phthalocyanine-based compounds, naphthalocyanine-based compounds, and polyoxocyanine compounds. Methyl-based dyes, cyanine-based dyes, squaraine-based dyes, crotonium-based dyes, dithiol metal complex-based compounds, etc.

The camera module 101f shown in FIG. 9F does not include an optical filter, and an optical sensor 104b is provided on the optical path of the light that is not reflected but passes through the reflective surface 2. The optical sensor 104b may be an ambient light sensor. The camera module of the structure can receive the light that is not reflected but passes through the reflective surface 2, so as to perceive the brightness of the surroundings of the camera module 101f. As a result, the light receiving unit for solid-state photography and the light receiving unit for ambient light can be provided in one module, so that a camera module with high design can be provided. The optical sensor 104b included in the camera module 101f may be a near infrared sensor. The near-infrared sensor can perform night vision photography or measure the distance to an object.

As shown in the camera module 101g of FIG. 9G, the camera module of the present invention can be provided with an optical filter 103b in front of the optical sensor 104b. In addition, an optical filter 103a may be provided in front of the optical sensor 104a. The camera module 101g includes at least one of an optical filter 103a and an optical filter 103b.

The camera module 101h of FIG. 9H, the camera module of the present invention can be provided between the optical sensor 104a and the optical filter 103a as a Fresnel zone plate, a Fresnel lens, a hyper lens (metalens), A lens that functions as a lens such as a mosaic mask replaces the flat optical element 106. In addition, the camera module 101i including the optical member 1 as shown in FIG. 9I may not incident light from the light incident surface of the optical member 1, but may be reflected by the reflective surface 2.

As shown in the camera module 101j of FIG. 9J, the camera module of the present invention may include the optical member 11 in a rotatable state. When the optical member 11 is fixed at an appropriate angle, the light is guided to the optical sensor 104a, and light is not guided at other angles, so the shutter function using the optical member 11 can be set.

As shown in FIG. 9K for the camera module 101k, the camera module of the present invention may have two optical members 1, and a lens 102 is further arranged between the second optical member 1 where light is reflected in the optical path and the optical sensor 104a.

In the camera module 101l of FIG. 9L, from the viewpoint of reducing noise and/or ghosting caused by near infrared rays, the camera module of the present invention preferably does not have an optical filter in front of the optical sensor 104a. It is more preferable to further have a cover glass 107 having a near-infrared cut-off performance on the front surface of the optical member 11. The cover glass 107 is not limited as long as it does not impair the effect of the present invention that transmits light of a specific wavelength, and the base material of the cover glass 107 can be made of the same raw materials as the optical member, including transparent inorganic materials and transparent resins, for example. From the viewpoint of being less susceptible to injury, a transparent inorganic material is preferred. From the viewpoint of improving the sensitivity of the optical sensor and reducing image defects, the cover glass 107 may also have an anti-reflection layer or a dielectric multilayer film. From the viewpoint of reducing image defects caused by near-infrared rays even when a light source that strongly emits near-infrared rays is incident on the optical sensor, the cover glass 107 is preferably a dielectric multilayer film with a near-infrared cut-off function. The average transmittance of light having a wavelength of 800 nm or more and 1150 nm or less of light incident in the vertical direction of the sheet 107 is preferably 10% or less. As such a dielectric multilayer film, the design (VII) of Table 7 mentioned later, etc. are mentioned, for example.

The camera module of the present invention may further include a focus adjustment mechanism, a phase detection mechanism, a distance measurement mechanism, an iris certification body, a vein certification body, a face certification body, a blood flow meter, an oxidized or reduced hemoglobin meter, and a vegetation index meter. Wait. Such a camera module can be preferably used in a device that outputs images or information as electrical signals. In addition, such a camera module may have a lens structure or a structure without a lens. In addition, from the viewpoint of obtaining an image with a shortened optical path and less aberration, it is preferable to use a reflective lens as the lens.

As a member constituting the solid-state imaging element, a photoelectric conversion element that converts light of a specific wavelength into electric charge, such as silicon, avalanche diode, black silicon, InGaAs, selenium, and organic photoelectric conversion film, is used.

[Black Silicon] Black silicon can be used in the light receiving part of a solid-state imaging device using this filter. Black silicon can be obtained, for example, by irradiating a silicon wafer with a laser in a specific environment, thereby forming tiny spikes on the surface of the silicon. In the case of using black silicon, compared to the case of using a silicon photodiode, the light receiving sensitivity in the near-infrared band becomes higher, etc., so black silicon can be more preferably used for imaging elements using near-infrared rays. As a commercially available product of CMOS using black silicon, the XQE series of American Night Vision Technology (SiOnyx), etc. can be cited.

[Other embodiments] The embodiment disclosed this time is an illustration and does not limit the structure of the present invention. Therefore, the above-mentioned embodiment may omit, replace, or add the structural elements of each part of the above-mentioned embodiment based on the description of this specification and technical common sense, and it should be understood that these all belong to the scope of the present invention.

[Example] Hereinafter, the present invention will be described more specifically based on examples, but the present invention is not limited to these examples at all. In addition, unless otherwise specified, "parts" means "parts by mass". In addition, the measuring method of each physical property value and the evaluation method of a physical property are as follows.

[Molecular Weight] Regarding the molecular weight of the resin, the GPC device (HLC-8220 type, column: TSKgel α-M, developing solvent: tetrahydrofuran (THF)) manufactured by Tosoh Co., Ltd. Weight average molecular weight (Mw) and number average molecular weight (Mn).

[Glass transition temperature (Tg)] Using a differential scanning calorimeter (DSC6200) manufactured by SII Nanotechnologies (stock), the measurement was performed at a heating rate: 20°C per minute under nitrogen flow.

[Resin Synthesis Example 1] The following formula (a) 8- methyl-8-methoxy represented carbonyl tetracyclo [4.4.0.1 ^2,5 .1 ^7,10] twelve-3-ene (hereinafter also referred to as "DNM (8-methyl-8 -methoxyl carbonyl tetracyclo [4.4.0.1 2,5 .1 7,10] dodeca-3-ene)") 100 parts of 1-hexene (molecular weight modifier) 18 parts And 300 parts of toluene (solvent for ring-opening polymerization) were put into the reaction vessel replaced with nitrogen, and the solution was heated to 80°C. Then, to the solution in the reaction vessel, 0.2 parts of a toluene solution (0.6 mol/liter) of triethylaluminum as a polymerization catalyst and a toluene solution of methanol-modified tungsten hexachloride (concentration 0.025 mol/liter) were added. 0.9 parts, and the solution was heated and stirred at 80°C for 3 hours, thereby proceeding a ring-opening polymerization reaction, thereby obtaining a ring-opening polymer solution. The polymerization conversion rate in the polymerization reaction was 97%.

[化1]

Thousand parts of the ring-opening polymer solution obtained in this manner were put into the autoclave, and 0.12 parts of RuHCl(CO)[P(C ₆ H ₅ ) ₃ ] ₃ was added to the ring-opening polymer solution, Under the conditions of a hydrogen pressure of 100 kg/cm ² and a reaction temperature of 165° C., the hydrogenation reaction was performed by heating and stirring for 3 hours. After cooling the obtained reaction solution (hydrogenated polymer solution), the hydrogen gas was released from the pressure. The reaction solution was poured into a large amount of methanol, the coagulum was separated and recovered, and dried to obtain a hydrogenated polymer (hereinafter also referred to as "resin A"). The number average molecular weight (Mn) of the obtained resin A was 32,000, the weight average molecular weight (Mw) was 137,000, and the glass transition temperature (Tg) was 165°C.

[Substrate A] 100 parts of Resin A obtained in Resin Synthesis Example 1 and dichloromethane were added to the container to prepare a solution with a resin concentration of 20% by weight. The obtained solution was cast on a smooth glass plate, dried at 20°C for 8 hours, and then peeled from the glass plate. Furthermore, the peeled coating film was dried under reduced pressure at 140° C. for 2 hours to obtain a substrate A including a transparent resin substrate having a thickness of 0.1 mm, a length of 60 mm, and a width of 60 mm.

[Substrate B] 100 parts of cycloolefin resin (Zeon (stock), ZEONEX) and cyclohexane were added to the container to prepare a solution with a resin concentration of 20% by weight. The obtained solution was cast on a smooth glass plate, dried at 20°C for 8 hours, and then peeled from the glass plate. Furthermore, the peeled coating film was dried under reduced pressure at 150° C. for 2 hours to obtain a substrate B including a transparent resin substrate having a thickness of 0.1 mm, a length of 60 mm, and a width of 60 mm.

[Substrate C] A glass substrate (manufactured by SCHOTT Co., Ltd., D263T eco) with a thickness of 0.1 mm was used as substrate C.

[Substrate D] 100 parts of resin A obtained in resin synthesis example 1, 0.04 parts of compound A, 0.08 parts of compound D described later, and dichloromethane were added to the container to prepare a solution with a resin concentration of 20% by weight. The obtained solution was cast on a smooth glass plate, dried at 20°C for 8 hours, and then peeled from the glass plate. Furthermore, the peeled coating film was dried under reduced pressure at 140° C. for 2 hours to obtain a substrate D including a transparent resin substrate having a thickness of 0.1 mm, a length of 60 mm, and a width of 60 mm.

[Substrate E] The triangular column type TECHSPEC (registered trademark) of length L 5.0 mm, width W 5.0 mm, and height H 5.0 mm shown in Figure 4 is synthesized into a quartz right-angle prism (Edmund Optics Japan ) Manufactured by Co., Ltd.) as the base material E.

[Injection molding base material] [Substrate F] For cycloolefin resin (ZEONEX T62R manufactured by Zeon Co., Ltd.), FANUC ROBOSHOT S-2000i30B is used as the injection molding machine, At a cylinder temperature of 320℃, a mold temperature of 160℃, a shooting speed of 20 mm/s, a pressure holding time of 6 minutes, and a cycle time of 20 minutes, the length L 5.0 mm, width W 5.0 mm, and height H 5.0 shown in Figure 4 are produced. mm to obtain a right-angle prism made of cycloolefin resin. The obtained right-angle prism was used as the substrate F.

[Substrate G] For the resin A obtained in Resin Synthesis Example 1, under the same injection conditions as the base material F, the length L 5.0 mm, the width W 5.0 mm, and the height H 5.0 mm shown in Fig. 4 were prepared to obtain a cycloolefin resin product. Right-angle prism. The obtained right-angle prism was used as the substrate G.

[Substrate H] For the resin A obtained in Resin Synthesis Example 1, a microwave molding device was used to preheat the resin A at 100°C for 1 hour, and the microwave irradiation intensity was set to 3 kW, the heating rate 5°C/min, and the target temperature 180 The temperature was maintained at a temperature of 10 minutes for 10 minutes to obtain a cycloolefin resin rectangular prism having a length L 5.0 mm, a width W 5.0 mm, and a height H 5.0 mm as shown in FIG. 4. Similarly, a cube A containing resin A with a length of 1.0 mm, a width of 1.0 mm, and a depth of 1.0 mm was formed. After coating dichloromethane on one surface of the obtained cube A, as shown in FIG. 8A, two crimped to the cycloolefin resin-made right-angle prism, and then dried at 150°C for 30 minutes, thereby As the base material H, a right-angle prism having irregularities at positions not related to the optical path is used.

[Substrate I] Weigh 41 parts of P ₂ O ₅ , 5 parts of Al ₂ O ₃ , 24 parts of Na ₂ O, 6 parts of MgF ₂ , 6 parts of CaO, 12 parts of BaO, 0.035 parts of CuO And mix. Put it in a platinum crucible and heat it to melt at a temperature of 1000°C. After being fully stirred and clarified, it was cast into a mold to obtain a copper phosphate glass right-angle prism with a length L 5.0 mm, a width W 5.0 mm, and a height H 5.0 mm as shown in FIG. 4. The obtained right-angle prism was used as the substrate I.

[Substrate J] Regarding the resin A obtained in resin synthesis example 1, and the compound A described later, the injection molding conditions were set to the length L 5.0 mm, the width W 5.0 mm, and the height H 5.0 mm as shown in FIG. 4 to obtain a cycloolefin resin right angle Prism. The obtained right-angle prism was used as the substrate J.

[Coating film A] After the following resin composition (1) was applied to the surface of the substrate shown in Table 8 below by spin coating, it was heated on a hot plate at 80° C. for 2 minutes to volatilize and remove the solvent, thereby forming a hardened layer. At this time, the coating conditions of the spin coater were adjusted so that the film thickness of the hardened layer became about 0.8 μm. Resin composition (1): Isocyanuric acid ethylene oxide modified triacrylate (trade name: Aronix (Aronix) M-315, manufactured by Toa Synthetic Chemical Co., Ltd.) 30 parts, 1,9- 20 parts of nonanediol diacrylate, 20 parts of methacrylic acid, 30 parts of glycidyl methacrylate, 5 parts of 3-glycidoxypropyl trimethoxysilane, 1-hydroxycyclohexyl benzophenone (commodity Name: IRGACURE 184, 5 copies of Ciba Specialty Chemical (manufactured by Ciba Specialty Chemical) and San-aid SI-110 main agent (manufactured by Sanxin Chemical Industry Co., Ltd.) One part is mixed and dissolved in propylene glycol monomethyl ether acetate so that the solid content concentration becomes 50% by weight, and then filtered with a millipore filter with a pore size of 0.2 μm.

Next, 100 parts of resin A obtained in Resin Synthesis Example 1, 0.48 parts of compound A described later, 0.8 parts of compound D described later, and dichloromethane were added to the container to obtain a solution (A) with a resin concentration of 15% by mass. . The solution (A) was coated on the hardened layer by a spin coater so that the film thickness after drying became 10 μm, and heated on a hot plate at 80°C for 30 minutes to volatilize and remove the solvent, thereby forming a transparent resin Floor. Then, exposure was performed from the glass plate side using a UV conveyor belt exposure machine (exposure amount: 500 mJ/cm ² , illuminance: 200 mW), and then sintered in an oven at 210° C. for 5 minutes, thereby obtaining a coating film A.

[Coating film B] In place of 0.4 part of compound A and 0.8 part of compound D in coating film A, 0.8 part of compound B described later was used, and coating film B was obtained in the same procedure except that.

[Coating film C] The coating film C was obtained in the same order except that 0.2 part of compound A, 0.68 part of compound C and 0.8 part of compound D mentioned later were used instead of 0.4 part of compound A and 0.8 part of compound D in the coating film A.

[Coating film D] The coating film D was obtained in the same order except for using 0.2 part of compound A instead of 0.4 part of compound A and 0.8 part of compound D in the coating film A.

[Coating film E] After coating the resin composition (1) with a spin coater so that the film thickness after drying becomes 0.002 mm each, use an inert oven (inert oven DN410I manufactured by Yamato Scientific Co., Ltd.) Dry at 80°C for 3 minutes. After crimping the resin-made near-infrared cut filter Lumicle UCF (Lumicle 100-132) to the coated film with a stress of 300 g/cm ^{2, use a UV conveyor belt type} Exposure machine (manufactured by Eyegraphics (stock), eye UV curing device, model US2-X0405, 60 Hz), with metal halide lamp illumination 270 mW/cm ² , exposure volume 500 mJ/cm ² UV curing is performed, and a coating film E is obtained.

[Coating film F] 100 parts of the resin A obtained in Resin Synthesis Example 1, 0.16 parts of the compound B described later, and dichloromethane were added to the container to prepare a solution with a resin concentration of 20% by weight. The obtained solution was cast on a smooth glass plate, dried at 20°C for 8 hours, and then peeled from the glass plate. Furthermore, the peeled coating film was dried under reduced pressure at 140° C. for 2 hours to obtain a transparent resin film having a thickness of 0.05 mm, a length of 60 mm, and a width of 60 mm. In addition, after the following resin composition (2) is applied to the substrate by spin coating, it is heated at 80° C. for 2 minutes on a hot plate to volatilize and remove the solvent, thereby forming a hardened layer. At this time, the coating conditions of the spin coater were adjusted so that the film thickness of the hardened layer became about 2 μm. Resin composition (2): Contains 60 parts of tricyclodecane dimethanol acrylate, 40 parts of dipentaerythritol hexaacrylate, 5 parts of 1-hydroxycyclohexyl phenyl ketone, and methyl ethyl ketone (with a solid content concentration of 30 parts) Mass%).

After crimping the transparent resin film onto the coated hardened layer with a load of 300 g/cm ² , a UV conveyor belt exposure machine (manufactured by Eyegraphics (stock), eye ultraviolet curing device, machine Model US2-X0405, 60 Hz), and UV curing was performed with a metal halide lamp illuminance of 270 mW/cm ² and an exposure amount of 500 mJ/cm ² to obtain a coating film F.

[Coating film G] The coating film G was obtained in the same procedure except that 0.04 part of the compound A, 0.14 part of the compound C, and 0.16 part of the compound D were used instead of 0.16 part of the compound B in the coating film F.

[Evaporation A] Use an ion-assisted vacuum evaporation device with a starting pressure of 0.0001 Pa, an evaporation temperature of 120°C, and use a mixed gas of oxygen and argon as the gas supply to the ion gun, and use the cumulative film thickness of the crystal oscillator To control the physical film thickness below 60 nm, the ion current density per unit area (μA/cm ² ) divided by the film formation rate (Å/sec) is the ion current density per unit film formation rate-area With 8 μA·sec/Å·cm ² ion assistance, a silicon dioxide layer is formed at the same time (SiO ₂ : the refractive index of light at 550 nm is 1.47), and the ion current density per unit film formation rate-area is 10 μA ·Second/Å·cm ² or more and 20 μA·sec/Å·cm ² or less ion assisted, while forming a titanium oxide layer (TiO ₂ : the refractive index of light at 550 nm is 2.48), thereby setting the silicon dioxide layer and The dielectric multilayer film of the design (I) shown below is formed by alternately laminating titanium oxide layers.

[Table 1] Design (I) Floor Membrane material Physical film thickness (nm) Substrate 1 TiO ₂ 10 2 SiO ₂ 42 3 TiO ₂ 25 4 SiO ₂ 17 5 TiO ₂ 111 6 SiO ₂ 20 7 TiO ₂ twenty one 8 SiO ₂ 108

[Evaporation B] The design (I) of vapor deposition A was changed to the design (II) shown in Table 2, except that the dielectric multilayer film was installed in the same order.

[Table 2] Design (II) Floor Membrane material Physical film thickness (nm) Substrate 1 TiO ₂ 35 2 SiO ₂ 99 3 TiO ₂ 56 4 SiO ₂ 94 5 TiO ₂ 40 6 SiO ₂ 72 7 TiO ₂ 30 8 SiO ₂ 84 9 TiO ₂ 51 10 SiO ₂ 100 11 TiO ₂ 53 12 SiO ₂ 108 13 TiO ₂ 61 14 SiO ₂ 92 15 TiO ₂ 59 16 SiO ₂ 117 17 TiO ₂ 56 18 SiO ₂ 72 19 TiO ₂ 96 20 SiO ₂ 93 twenty one TiO ₂ 27 twenty two SiO ₂ 203 twenty three TiO ₂ 60 twenty four SiO ₂ 19 25 TiO ₂ 125 26 SiO ₂ 124 27 TiO ₂ 5 28 SiO ₂ 248 29 TiO ₂ 55 30 SiO ₂ 56 31 TiO ₂ 114 32 SiO ₂ 49 33 TiO ₂ 64 34 SiO ₂ 207

[Evaporation C] The design (I) of vapor deposition A was changed to the design (III) shown in Table 3, and other than that, the dielectric multilayer film was installed in the same order.

[table 3] Design (III) Floor Membrane material Physical film thickness (nm) Substrate 1 SiO ₂ 111 2 TiO ₂ 29 3 SiO ₂ 110 4 TiO ₂ 51 5 SiO ₂ 97 6 TiO ₂ 47 7 SiO ₂ 87 8 TiO ₂ 40 9 SiO ₂ 97 10 TiO ₂ 47 11 SiO ₂ 101 12 TiO ₂ 54 13 SiO ₂ 117 14 TiO ₂ 37 15 SiO ₂ 97 16 TiO ₂ 50 17 SiO ₂ 33 18 TiO ₂ 103 19 SiO ₂ 68 20 TiO ₂ 2 twenty one SiO ₂ 7 twenty two TiO ₂ 36 twenty three SiO ₂ 140 twenty four TiO ₂ 91 25 SiO ₂ 36 26 TiO ₂ 71 27 SiO ₂ 191 28 TiO ₂ 39 29 SiO ₂ 72 30 TiO ₂ 97 31 SiO ₂ 118 32 TiO ₂ 31 33 SiO ₂ 123 34 TiO ₂ 17 35 SiO ₂ 34 36 TiO ₂ 55 37 SiO ₂ 98 38 TiO ₂ 45 39 SiO ₂ 93 40 TiO ₂ 30 41 SiO ₂ 34 42 TiO ₂ 57 43 SiO ₂ 119 44 TiO ₂ 19

[Evaporation D] Using an RF magnetron sputtering device, using silicon as the evaporation source, and using an RF power of 300 W while supplying a gas with a mixing ratio of 20 SCCM of oxygen/(argon + hydrogen + oxygen) of 20% A film is formed to obtain a silicon dioxide layer (SiO ₂ : the refractive index of light at 550 nm is 1.46), and the film is formed while supplying a gas with a mixing ratio of 20 SCCM of hydrogen/(argon + hydrogen) of 5% , Thereby obtaining an amorphous silicon layer (α-Si:H: the refractive index of light at 550 nm is 4.1), and setting the table 4 by alternately stacking the silicon dioxide layer and the amorphous silicon layer The dielectric multilayer film of the design (IV) shown.

[Table 4] Design (IV) Floor Membrane material Physical film thickness (nm) Substrate 1 SiO ₂ 388 2 Si 20 3 SiO ₂ 60 4 Si 58 5 SiO ₂ 43 6 Si 39 7 SiO ₂ 92 8 Si 27 9 SiO ₂ 99 10 Si 31 11 SiO ₂ 97 12 Si twenty three 13 SiO ₂ 407 14 Si 126 15 SiO ₂ 388 16 Si 17 17 SiO ₂ 213

[Evaporation E] The design (I) of vapor deposition A was changed to the design (V) shown in Table 5, and other than that, the dielectric multilayer film was installed in the same order.

[table 5] Design (V) Floor Membrane material Physical film thickness (nm) Substrate 1 TiO ₂ 32 2 SiO ₂ 57 3 TiO ₂ 186 4 SiO ₂ 45 5 TiO ₂ 38 6 SiO ₂ 175 7 TiO ₂ 19 8 SiO ₂ 148 9 TiO ₂ 31 10 SiO ₂ 105 11 TiO ₂ 28 12 SiO ₂ 91 13 TiO ₂ 65 14 SiO ₂ 32 15 TiO ₂ 117 16 SiO ₂ 106 17 TiO ₂ 28 18 SiO ₂ 159 19 TiO ₂ 83 20 SiO ₂ 33 twenty one TiO ₂ 96 twenty two SiO ₂ 88 twenty three TiO ₂ twenty three twenty four SiO ₂ twenty three 25 TiO ₂ 46 26 SiO ₂ 40 27 TiO ₂ 106 28 SiO ₂ 185

[Evaporation F] An RF magnetron sputtering device was used, Al was used as a vapor deposition source, and a film was formed at an RF power of 300 W, and the Al thus obtained was set as a 50 nm vapor deposition film.

[Evaporation G] Using an RF magnetron sputtering device, Ag was used as a vapor deposition source, and a film was formed at an RF power of 300 W, and the Ag thus obtained was set as a 100 nm vapor deposition film.

[Evaporation H] The design (I) of vapor deposition A was changed to the design (VI) shown in Table 6, except that the dielectric multilayer film was installed in the same order.

[Table 6] Design (VI) Floor Membrane material Physical film thickness (nm) Substrate 1 TiO ₂ 74 2 SiO ₂ twenty four 3 TiO ₂ 53 4 SiO ₂ 47 5 TiO ₂ 49 6 SiO ₂ 76 7 TiO ₂ 71 8 SiO ₂ 44 9 TiO ₂ 71 10 SiO ₂ 34 11 TiO ₂ 101 12 SiO ₂ 47 13 TiO ₂ 104 14 SiO ₂ 45 15 TiO ₂ 79 16 SiO ₂ 29 17 TiO ₂ 99 18 SiO ₂ 45 19 TiO ₂ 97 20 SiO ₂ 44 twenty one TiO ₂ 3 twenty two SiO ₂ 28 twenty three TiO ₂ 109 twenty four SiO ₂ 48 25 TiO ₂ 110 26 SiO ₂ twenty four 27 TiO ₂ 5 28 SiO ₂ 52 29 TiO ₂ 89 30 SiO ₂ 42 31 TiO ₂ 174 32 SiO ₂ 40

[Evaporation I] The design (I) of vapor deposition A was changed to the design (VII) shown in Table 7, except that the dielectric multilayer film was installed in the same order.

[Table 7] Design (VII) Floor Membrane material Physical film thickness (nm) Substrate 1 TiO ₂ 7 2 SiO ₂ 32 3 TiO ₂ 20 4 SiO ₂ 12 5 TiO ₂ 75 6 SiO ₂ 16 7 TiO ₂ 17 8 SiO ₂ 164 9 TiO ₂ 15 10 SiO ₂ 14 11 TiO ₂ 72 12 SiO ₂ 15 13 TiO ₂ 14 14 SiO ₂ 155 15 TiO ₂ 15 16 SiO ₂ 16 17 TiO ₂ 73 18 SiO ₂ 19 19 TiO ₂ 18 20 SiO ₂ 202 twenty one TiO ₂ 18 twenty two SiO ₂ 29 twenty three TiO ₂ 95 twenty four SiO ₂ 10 25 TiO ₂ 18 26 SiO ₂ 172 27 TiO ₂ 97 28 SiO ₂ 165 29 TiO ₂ 97 30 SiO ₂ 167 31 TiO ₂ 99 32 SiO ₂ 168 33 TiO ₂ 95 34 SiO ₂ 162 35 TiO ₂ 91 36 SiO ₂ 156 37 TiO ₂ 89 38 SiO ₂ 158 39 TiO ₂ twenty one 40 SiO ₂ 7 41 TiO ₂ 53 42 SiO ₂ 15 43 TiO ₂ 10 44 SiO ₂ 142 45 TiO ₂ 16 46 SiO ₂ 15 47 TiO ₂ 69 48 SiO ₂ twenty three 49 TiO ₂ 17 50 SiO ₂ 197 51 TiO ₂ 17 52 SiO ₂ twenty two 53 TiO ₂ 68 54 SiO ₂ 12 55 TiO ₂ 19 56 SiO ₂ 165 57 TiO ₂ twenty four 58 SiO ₂ 14 59 TiO ₂ 40 60 SiO ₂ 6 61 TiO ₂ 11 62 SiO ₂ 80

[Light-shielding film A] A UV curable light-shielding ink (UltraPackUVK+180 manufactured by Marabu) was applied to the outer periphery of the optical member by screen printing with a width of 1 mm and a thickness of 10 μm. Use UV conveyor belt exposure machine (made by Eyegraphics (stock), eye UV curing device, model US2-X0405, 60 Hz), and use metal halide lamp illumination 100 mW/cm ² , exposure 200 UV curing was performed at mJ/cm ² to obtain a light-shielding film A.

[Compound A] The compound A represented by the following chemical formula (A) is used as a compound. The maximum absorption wavelength of compound A when dissolved in dichloromethane is 698 nm.

[化2]

[Compound B] The compound B represented by the following chemical formula (B) is used as a compound. The maximum absorption wavelength of compound B in resin A is 1095 nm.

[化3]

[Compound C] The compound C represented by the following chemical formula (C) is used as the compound. The maximum absorption wavelength of compound C when dissolved in dichloromethane is 738 nm.

[化4]

＜Ultraviolet absorber＞ As an ultraviolet absorber, "BONASORB UA-3911" manufactured by Orient Chemical Industry Co., Ltd. was used as compound D. The maximum absorption wavelength of compound D when dissolved in dichloromethane is 391 nm.

[Example 1] The substrate A was prepared, and the dielectric multilayer film 36a (hereinafter, referred to as A side in Examples 1 to 5, Comparative Example 1 and Comparative Example 2) included in the optical member 31 shown in FIG. 5A In the vapor deposition B, the vapor deposition A is performed on the dielectric multilayer film 36b (hereinafter, referred to as surface B in Examples 1 to 5, Comparative Example 1, and Comparative Example 2), thereby obtaining an optical member.

[Example 2 to Example 5] The optical member was produced in the same manner as in Example 1 except that the substrate, the vapor deposition method, and the light-shielding film shown in Examples 2 to 5 in Table 8 below were used to prepare an optical member.

[Comparative Example 1 to Comparative Example 2] The optical member was produced in the same manner as in Example 1 except that the base material, the vapor deposition method, and the light-shielding film shown in Comparative Examples 1 to 2 in Table 8 below were used.

[Example 6] The substrate E was prepared, and the dielectric multilayer film 46a of the optical member 41a shown in FIG. 5B was applied to the dielectric multilayer film 46a (hereinafter, referred to as A in Examples 6 to 18 and Comparative Example 3) in the vapor deposition C. Surface). In the vapor deposition A, the dielectric multilayer film 46b (hereinafter, referred to as B surface in Examples 6 to 18 and Comparative Example 3) was vapor deposited, and in the vapor deposition A The dielectric multilayer film 46c (hereinafter, referred to as C surface in Examples 6 to 18 and Comparative Example 3) was vapor-deposited. Furthermore, an optical member is obtained by forming the light-shielding film A on the B surface and the C surface.

[Example 7] The substrate G is prepared, the coating film A is formed on the surface B, the surface A is vapor-deposited in the vapor deposition C, the surface B is vapor-deposited in the vapor deposition A, and the vapor-deposited In A, the surface C is vapor-deposited to obtain an optical member.

[Example 8 to Example 17, Comparative Example 3] The base material, light absorber, vapor deposition method, and light-shielding film shown in Examples 8 to 17 and Comparative Example 3 in Table 8 below were used to prepare optical members, except for the same as Example 6 or Example 7 To obtain an optical member. In addition, in Example 11 and Example 12, as shown in FIG. 9I, it is assumed that an optical member is used to produce an optical member.

[Example 18] In the same manner as in Example 17, an optical member was obtained. In addition, vapor deposition I was separately provided on one surface of the substrate C to obtain a cover glass.

[Table 8] Substrate A side B side C side Shading film Cover glass Substrate shape Coating film Evaporation Coating film Evaporation Coating film Evaporation Example 1 A membrane - B - A - - - - Example 2 B membrane - C - A - - - - Example 3 C membrane - D - A - - A - Example 4 D membrane - B - A - - - - Example 5 C membrane - E - A - - - - Example 6 E Prism - C - A - A A - Example 7 G Prism - C A A - A - - Example 8 E Prism - D B A - A - - Example 9 E Prism - D - A C A - - Example 10 E Prism - D D A D A A - Example 11 F Prism - C - A - - - - Example 12 E Prism - D - - - - - - Example 13 G Prism F B - A G A - - Example 14 H Prism - C - A E A - - Example 15 I Prism - D - A - - - - Example 16 J Prism - C - A - - - - Example 17 J Prism - E - A - A A - Example 18 J Prism - E - A - A A Substrate C and Evaporation I Comparative example 1 C membrane - F - - - - - - Comparative example 2 C membrane - G - - - - - - Comparative example 3 E membrane - H - - - - - -

[Evaluation of Optical Properties] With regard to the optical members produced in each of Example 1 to Example 18 and Comparative Example 1 to Comparative Example 3, the optical properties thereof were evaluated by the method shown in FIGS. 10A to 10G. Fig. 10A is a method of measuring the transmittance of unpolarized light incident at 45° to an optical member. Fig. 10B is a method of measuring the reflectance of unpolarized light incident at 45° to the optical member. Fig. 10C is a method of measuring the reflectance of unpolarized light incident at 5° of the optical member. Fig. 10D is a method of measuring the reflectance of unpolarized light incident at 45° of an optical member including a prismatic base material. In Example 11 and Example 12, it is assumed that optical members are used like the camera module shown in FIG. 9I, and the reflectance in FIG. 10D is set as the spectral transmission efficiency. 10E is a method of measuring the spectral transmission efficiency of optical members in Example 6 to Example 10, Example 13 to Example 17, and Comparative Example 3. FIG. FIG. 10F is a method of measuring 100% of the light amount used as a reference in the measurement of the spectral transmission efficiency. FIG. 10G is a method of measuring the spectral transmission efficiency obtained by interposing the cover glass of Example 18. FIG.

[Transmittance] The transmittance in each wavelength region of the optical member was measured using a spectrophotometer (V-7200) manufactured by JASCO Corporation and an automatic absolute reflectance measuring unit (V-7030). Here, the transmittance of light incident from the vertical direction at an angle of 45° with respect to the surface direction of the optical member is measured by the following method: as shown in FIG. 10A, the transmittance of light from the vertical direction to the surface direction of the optical member 11 is measured from the vertical direction. The incident light L (P-polarized light and S-polarized light) at an angle of 45° reflects the light transmitted in the vertical direction by the mirror 202, and then is condensed by the integrating sphere 201. In addition, the average transmittance of wavelengths A nm to B nm is measured by measuring the transmittance at each wavelength in the unit of 1 nm from A nm to B nm and dividing the total value of the transmittance by the measured value. Calculate the value obtained from the number of transmittances (wavelength range, B-A+1). The transmittance of unpolarized light is a value calculated from the average of the S-polarized transmittance and the P-polarized transmittance. In addition, the maximum transmittance of wavelengths A nm to B nm is measured by measuring the transmittance at each wavelength in the unit of 1 nm from A nm to B nm, and using the maximum value of the transmittance.

[Reflectivity] The reflectance of the optical member in each wavelength region was measured using a spectrophotometer (V-7200) manufactured by JASCO Corporation and an automatic absolute reflectance measuring unit (V-7030). Here, the reflectance of unpolarized light rays incident at an angle of 45° with respect to the vertical direction of the optical member 11 is measured as follows: as shown in FIG. 10B, the vertical direction with respect to the specific surface of the optical member 11 is The light L incident at an angle of 45° converges the light reflected by the optical member 11 by the integrating sphere 201 via the mirror 202. Similarly, the reflectance of unpolarized light rays incident at an angle of 5° with respect to the vertical direction of the optical member surface is measured as follows: as shown in FIG. 10C, the vertical direction with respect to the specific surface of the optical member is measured by 5 The light reflected by the incident unpolarized light at an angle of ° is condensed by the integrating sphere 201 via the mirror 202.

Similarly, when the optical member is not a flat plate, the reflectance of unpolarized light incident at an angle of 45° with respect to the vertical direction of the surface of the optical member is measured by the following method: The light rays L incident at an angle of 45° converge the light reflected by the optical member 1 by the integrating sphere 201 via the mirror 202.

The average reflectance of wavelengths A nm to B nm is measured by measuring the reflectance at each wavelength in the unit of 1 nm from A nm to B nm and dividing the total value of the reflectance by the measured reflectance. Calculate the value obtained from the quantity (reflectance, B-A+1). In addition, the maximum reflectance of the wavelengths A nm to B nm is to measure the reflectance at each wavelength in the unit of 1 nm from A nm to B nm, and use the maximum value of the reflectance.

[Spectral transmission efficiency] In Example 6 to Example 10, Example 13 to Example 17 and Comparative Example 3, the spectral transmission efficiency T(λ) of the optical member was measured by the following method: the light amount in FIG. 10F was set to 100% At this time, as shown in the position of FIG. 10E, with regard to the light L, the light reflected by the reflective surface after passing through the substrate is converged by the integrating sphere 201 via the mirror 202. In Example 11 and Example 12, it is assumed that the optical member is used like the camera module shown in FIG. 9I, and the reflectance obtained by the arrangement of the optical member 1 shown in FIG. 10D is set as the spectral transmission efficiency T(λ ). In Embodiment 18, assuming that the optical member is used via the cover glass like the camera module shown in FIG. 9C or 9L, the reflection obtained by the arrangement of the optical member 1 and the cover glass 203 shown in FIG. 10G The rate is defined as the spectral transmission efficiency T(λ). Regarding the optical member having a light-shielding film, the part where the light-shielding film was not provided in the inner part of the light-shielding film was evaluated. In addition, the average transmission efficiency of wavelengths A nm to B nm is measured by measuring the spectral transmission efficiency at each wavelength in units of 1 nm from A nm to B nm, and dividing the total value of the spectral transmission efficiency by the measurement. The value of the spectral transmission efficiency (reflectance, B-A+1) is calculated. In addition, the maximum transmission efficiency of wavelengths A nm to B nm is to measure the spectral transmission efficiency at each wavelength in the unit of 1 nm from A nm to B nm, and use the maximum value of the spectral transmission efficiency.

[Noise level evaluation] [N/S Sensitivity Evaluation] As an index for evaluating the amount of noise of an optical sensor including an optical member, the ratio of the noise N generated by near infrared rays to the signal S generated by visible light, and the N/S sensitivity were evaluated. The N/S sensitivity evaluation is based on the spectral transmission efficiency T(λ) of the optical component, the wavelength difference sensitivity B(λ) of the blue pixel in the sensor pixel, and the wavelength difference sensitivity G(λ) of the green pixel. The wavelength difference sensitivity R(λ) of the red pixel is calculated using the following formula. Furthermore, the signal intensity S is the calculated value of the wavelength range of 380 nm to 780 nm of the blue, green, and red pixels as the product of the different transmittance of the optical filter wavelength per 1 nm, and the pixel sensitivity of the sensor. Sum. The noise intensity N is the sum of the calculated values of the wavelength of the blue, green, and red pixels in the region from 781 nm to 1050 nm as the wavelength of the optical filter per 1 nm, and the product of the product of the sensor’s pixel sensitivity. . The N/S sensitivity evaluation uses these calculated values of N and S, and the value obtained by dividing the noise intensity N by the signal intensity S is used as an index. The wavelength-different sensitivity of each sensor pixel of blue, green, and red is based on the description in Japanese Patent Laid-Open No. 2017-216678, and the value shown in FIG. 11 is used.

[Number 1]

[Evaluation results of optical characteristics] For the optical members prepared as shown in Table 8 of Example 1 to Example 18 and Comparative Example 1 to Comparative Example 3, the above-mentioned optical characteristics were evaluated. The evaluation results are shown in Table 9.

[Table 9] A side B side C side Transmission characteristics of optical components Average reflectance (%) 45° 400 nm-640 nm Reflectance (%) 45° 650 nm Average reflectance (%) 45° 700 nm-1150 nm Maximum reflectance (%) 45° 700 nm-1150 nm. Average reflectance (%) 5° 400 nm-640 nm Average reflectance (%) 5° 750 nm-1150 nm Average reflectance (%) 5° 750 nm-1150 nm Average transmittance (%) or average transmittance (%) 400 nm-640 nm Transmission rate (%) or transmission efficiency (%) 600 nm Average transmittance (%) or average transmittance (%) 700 nm-1150 nm Maximum transmission rate (%) or maximum transmission efficiency (%) 700 nm-1150 nm N/S sensitivity evaluation (%) Example 1 97 75 2 5 - 2 - 96 99 2 5 0.5 Example 2 98 97 2 5 - 2 - 97 95 1 5 0.4 Example 3 99 83 2 13 - 5 - 97 98 2 12 0.4 Example 4 97 75 2 5 - 2 - 82 86 1 2 0.6 Example 5 90 89 1 9 - 2 - 89 87 1 9 0.3 Example 6 98 97 2 5 2 1 1 88 87 1 4 0.4 Example 7 98 97 2 5 2 1 1 82 82 1 3 0.5 Example 8 99 83 2 13 2 1 1 89 93 1 9 0.2 Example 9 99 83 2 13 2 1 1 82 83 1 11 0.5 Example 10 99 83 2 13 2 1 1 82 85 1 11 0.5 Example 11 98 97 2 5 2 1 1 98 96 2 5 0.4 Example 12 99 83 2 13 8 4 4 90 91 2 12 0.4 Example 13 97 75 2 5 2 1 1 76 80 0 1 0.3 Example 14 98 97 2 5 2 1 1 90 87 1 3 0.2 Example 15 99 83 2 13 8 4 4 80 69 0 3 0.0 Example 16 99 83 2 5 4 1 1 77 73 0 2 0.4 Example 17 99 83 1 9 2 1 1 74 67 1 3 0.3 Example 18 99 83 1 9 2 1 1 72 66 0 3 0.0 Comparative example 1 99 83 92 96 92 92 92 92 91 91 96 26.0 Comparative example 2 99 83 98 98 94 98 98 94 97 98 98 27.7 Comparative example 3 99 83 16 36 8 4 4 93 95 15 35 5.1

According to the results of Table 9, the optical member of the example can reflect light of a specific wavelength and has a low N/S sensitivity, so it is suitable as the optical member of the present invention. In addition, since the optical members of Comparative Examples 1 to 3 did not suppress the reflection of light in the wavelength region of 700 nm or more and 1150 nm or less, they had high N/S sensitivity and were not suitable for the optical members of the present invention. [Industrial availability]

The optical member of the present invention is particularly useful as an optical member constituting a camera module. In addition, the camera module of the present invention is particularly useful in digital still cameras, mobile phone cameras, smart phone cameras, digital cameras, personal computer (PC) cameras, surveillance cameras, automotive cameras, televisions, and car navigation systems. , Portable information terminals, personal computers, video game consoles, portable game consoles, fingerprint authentication systems, ambient light sensors, distance measurement sensors, iris authentication systems, facial authentication systems, distance measurement cameras, digital Useful in music players, etc.

1, 11, 21, 31, 41a～41e, 51, 61, 71: optical components 2, 12, 22, 32, 42: reflective surface 3.43: Light incident surface 4.44: Light exit surface 5: Prism 23: reflective layer 24, 35, 45, 53, 63, 73: base material 36a, 36b, 46a, 46b, 46c: dielectric multilayer film 52, 62a, 62b: shading film 72a, 72b: convex part 101a～101l: Camera module 102: lens 103a, 103b: optical filter 104a, 104b: optical sensor 105: Absorber 106: Lens instead of flat optics 107, 203: cover glass 108: Optical system storage unit 201: Integrating Sphere 202: mirror H: height L: light L: length L1: reflected light L2: transmitted light W: width

Fig. 1 is a schematic front view showing an optical member according to an embodiment of the present invention. Fig. 2 is a schematic front view showing an optical member according to another embodiment of the present invention. Fig. 3 is a schematic front view showing an optical member according to another embodiment of the present invention. Fig. 4 is a schematic perspective view showing the optical member of Fig. 1. Fig. 5A is a schematic front view showing an optical member having a dielectric multilayer film according to still another embodiment of the present invention. Fig. 5B is a schematic front view showing an optical member having a dielectric multilayer film according to still another embodiment of the present invention. Fig. 5C is a schematic front view showing an optical member having a dielectric multilayer film according to still another embodiment of the present invention. Fig. 5D is a schematic front view showing an optical member having a dielectric multilayer film according to still another embodiment of the present invention. Fig. 5E is a schematic front view showing an optical member having a dielectric multilayer film according to still another embodiment of the present invention. Fig. 5F is a schematic front view showing an optical member having a dielectric multilayer film according to still another embodiment of the present invention. Fig. 6A is a schematic front view showing an optical path in the optical member of Fig. 5B. FIG. 6B is a schematic perspective view showing the optical path in the optical member of FIG. 5B. Fig. 7A is a schematic front view showing an optical member having a light-shielding film according to still another embodiment of the present invention. Fig. 7B is a schematic perspective view showing an optical member having a light-shielding film according to still another embodiment of the present invention. Fig. 8A is a schematic perspective view showing an optical member having concavo-convex portions according to still another embodiment of the present invention. Fig. 8B is a schematic plan view showing an optical member having concavo-convex portions according to still another embodiment of the present invention. Fig. 8C is a schematic bottom view of an optical member having concavo-convex portions according to still another embodiment of the present invention, as viewed from the direction perpendicular to the inclined surface. Fig. 9A is a schematic plan view showing an embodiment of a camera module according to an embodiment of the present invention. 9B is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. 9C is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9D is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9E is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9F is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9G is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9H is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9I is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9J is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9K is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. Fig. 9L is a schematic plan view showing an embodiment of the camera module according to the embodiment of the present invention. 10A is a conceptual diagram showing a method of measuring the transmittance of unpolarized light incident at 45° of an optical member. 10B is a conceptual diagram showing a method of measuring the reflectance of unpolarized light rays incident at 45° to an optical member. 10C is a conceptual diagram showing a method of measuring the reflectance of unpolarized light rays incident at 5° to an optical member. 10D is a conceptual diagram showing a method of measuring the reflectance of unpolarized light incident at 45° of an optical member including a prismatic base material. Fig. 10E is a conceptual diagram showing a method of measuring the spectral transmission efficiency of an optical member. 10F is a conceptual diagram showing a method of measuring 100% of the light amount used as a reference in the measurement of the spectral transmission efficiency. Fig. 10G is a conceptual diagram showing a method of measuring the spectral transmission efficiency obtained by interposing a cover glass. Fig. 11 is a graph showing the wavelength difference sensitivity of each sensor pixel of blue, green, and red.

41a: Optical components

42: reflective surface

43: light incident surface

44: light exit surface

45: Substrate

46a, 46b, 46c: dielectric multilayer film

Claims (9)

An optical component including a reflective surface, The average reflectivity of the unpolarized light incident at 45° from the vertical to the reflecting surface is 80% or more in the wavelength region of 400 nm or more and 640 nm or less, and 8% in the wavelength region of 700 nm or more and 1150 nm or less the following. The optical member according to claim 1, wherein the maximum reflectance of unpolarized light rays incident on the reflecting surface at 45° from vertical is 20% or less in the wavelength region of 700 nm or more and 1150 nm or less. The optical member according to claim 1 or 2, wherein the reflectance of unpolarized light incident at 45° from vertical to the reflecting surface is 65% or more at a wavelength of 650 nm. The optical member according to claim 1 or claim 2, which includes a substrate, and a reflective layer constituting the reflective surface, The substrate contains a compound having a maximum absorption in the wavelength region of 680 nm or more and 1200 nm or less. The optical member according to claim 1 or claim 2, which includes a prism having a triangular cross section with an apex angle of 70° or more and 120° or less, An inclined surface facing the vertex angle of the prism constitutes the reflecting surface. A camera module includes an optical component, in the camera module, The optical member includes a reflective surface, The average reflectivity of the unpolarized light incident at 45° from the vertical to the reflecting surface is 80% or more in the wavelength region of 400 nm or more and 640 nm or less, and 8% in the wavelength region of 700 nm or more and 1150 nm or less the following. The camera module according to claim 6, which further includes an optical sensor. The camera module according to claim 7, which further includes a lens, No optical filter is included between the lens and the optical sensor. The camera module according to claim 7 or claim 8, which further includes an optical system storage unit in the shape of a periscope.

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