TWI784676B - Plastic light-folding element, imaging lens assembly module and electronic device - Google Patents
Plastic light-folding element, imaging lens assembly module and electronic device Download PDFInfo
- Publication number
- TWI784676B TWI784676B TW110130558A TW110130558A TWI784676B TW I784676 B TWI784676 B TW I784676B TW 110130558 A TW110130558 A TW 110130558A TW 110130558 A TW110130558 A TW 110130558A TW I784676 B TWI784676 B TW I784676B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical film
- turning element
- optical
- light
- layer
- Prior art date
Links
Images
Abstract
Description
本揭示內容係關於一種塑膠光學轉折元件與成像鏡頭模組,且特別是一種應用在可攜式電子裝置上的塑膠光學轉折元件與成像鏡頭模組。The disclosure relates to a plastic optical turning element and an imaging lens module, and in particular to a plastic optical turning element and an imaging lens module applied to a portable electronic device.
近年來,可攜式電子裝置發展快速,例如智慧型電子裝置、平板電腦等,已充斥在現代人的生活中,而裝載在可攜式電子裝置上的成像鏡頭模組與其塑膠光學轉折元件也隨之蓬勃發展。但隨著科技愈來愈進步,使用者對於塑膠光學轉折元件的品質要求也愈來愈高。因此,發展一種可增加影像還原度的塑膠光學轉折元件遂成為產業上重要且急欲解決的問題。In recent years, portable electronic devices have developed rapidly, such as smart electronic devices, tablet computers, etc., which have flooded the lives of modern people, and the imaging lens modules and plastic optical transition elements loaded on portable electronic devices are also Then it flourished. However, with the advancement of technology, users have higher and higher requirements for the quality of plastic optical transition components. Therefore, the development of a plastic optical transition element that can increase the degree of image restoration has become an important and urgent problem in the industry.
本揭示內容提供一種塑膠光學轉折元件、成像鏡頭模組及電子裝置,藉由反射光學膜層可有助於提升對成像光線的影像還原度。The present disclosure provides a plastic optical turning element, an imaging lens module and an electronic device, which can help improve the image restoration degree of imaging light by reflecting the optical film layer.
依據本揭示內容一實施方式提供一種塑膠光學轉折元件,包含一入光面、一出光面、一反射面及一反射光學膜層。入光面用以使一成像光線入射塑膠光學轉折元件。出光面用以使成像光線出射塑膠光學轉折元件。反射面用以轉折成像光線。反射光學膜層設置於反射面的一表面,且包含一銀原子層、一底層光學膜及一頂層光學膜。銀原子層用以將進入入光面的成像光線反射至出光面。底層光學膜與銀原子層直接接觸,且底層光學膜較銀原子層靠近塑膠光學轉折元件的反射面。頂層光學膜的折射率低於底層光學膜的折射率,頂層光學膜不與銀原子層直接接觸,且頂層光學膜較銀原子層遠離塑膠光學轉折元件的反射面。底層光學膜的折射率為Nb,底層光學膜的厚度為db,頂層光學膜的折射率為Nt,頂層光學膜的厚度為dt,銀原子層的厚度為dAg,其滿足下列條件:1.4 < Nt < Nb < 2.1;1.6 < Nb < 2.1;1.4 < Nt < 1.58;0.05 < db/dAg < 1.2;以及0.2 < dAg/dt < 3.5。According to an embodiment of the present disclosure, a plastic optical turning element is provided, which includes a light incident surface, a light exit surface, a reflective surface and a reflective optical film layer. The light incident surface is used for making an imaging light incident into the plastic optical turning element. The light exit surface is used to make the imaging light exit the plastic optical turning element. The reflective surface is used to deflect imaging light. The reflective optical film layer is arranged on one surface of the reflective surface, and includes a silver atomic layer, a bottom optical film and a top optical film. The silver atomic layer is used to reflect the imaging light entering the light incident surface to the light exit surface. The bottom optical film is in direct contact with the silver atomic layer, and the bottom optical film is closer to the reflective surface of the plastic optical turning element than the silver atomic layer. The refractive index of the top optical film is lower than that of the bottom optical film, the top optical film is not in direct contact with the silver atomic layer, and the top optical film is farther away from the reflective surface of the plastic optical turning element than the silver atomic layer. The refractive index of the bottom optical film is Nb, the thickness of the bottom optical film is db, the refractive index of the top optical film is Nt, the thickness of the top optical film is dt, and the thickness of the silver atomic layer is dAg, which meets the following conditions: 1.4<Nt < Nb < 2.1; 1.6 < Nb < 2.1; 1.4 < Nt < 1.58; 0.05 < db/dAg < 1.2; and 0.2 < dAg/dt < 3.5.
依據前段所述實施方式的塑膠光學轉折元件,可更包含一連接面與一注料痕結構,其中連接面連接入光面、出光面及反射面,且注料痕結構設置於連接面上。According to the above-mentioned embodiment, the plastic optical turning element may further include a connection surface and an injection mark structure, wherein the connection surface connects the light incident surface, the light output surface and the reflection surface, and the injection mark structure is disposed on the connection surface.
依據前段所述實施方式的塑膠光學轉折元件,其中底層光學膜可為一金屬氧化物層。According to the plastic optical turning element of the embodiment described in the preceding paragraph, the underlying optical film may be a metal oxide layer.
依據前段所述實施方式的塑膠光學轉折元件,可更包含至少一中間夾層,其中中間夾層設置於頂層光學膜與銀原子層之間。The plastic optical turning element according to the embodiment described in the preceding paragraph may further include at least one intermediate interlayer, wherein the intermediate interlayer is disposed between the top optical film and the silver atomic layer.
依據前段所述實施方式的塑膠光學轉折元件,其中中間夾層可包含一金屬層,且金屬層不包含銀原子。According to the plastic optical turning element described in the preceding paragraph, the intermediate interlayer may include a metal layer, and the metal layer does not include silver atoms.
依據前段所述實施方式的塑膠光學轉折元件,其中銀原子層的厚度為dAg,其可滿足下列條件:75 nm < dAg < 200 nm。According to the plastic optical turning element described in the preceding paragraph, wherein the thickness of the silver atomic layer is dAg, which can satisfy the following condition: 75 nm < dAg < 200 nm.
依據前段所述實施方式的塑膠光學轉折元件,其中底層光學膜可與塑膠光學轉折元件的反射面直接接觸。According to the plastic optical turning element of the embodiment described in the preceding paragraph, the underlying optical film can be in direct contact with the reflective surface of the plastic optical turning element.
依據前段所述實施方式的塑膠光學轉折元件,其中底層光學膜的厚度為db,頂層光學膜的厚度為dt,其可滿足下列條件:0.05 < db/dt < 1.1。According to the plastic optical turning element of the embodiment described in the preceding paragraph, wherein the thickness of the bottom optical film is db, and the thickness of the top optical film is dt, which can satisfy the following conditions: 0.05 < db/dt < 1.1.
依據前段所述實施方式的塑膠光學轉折元件,其中反射光學膜層的反射率在波長540 nm~590 nm之間的最低反射率為R5459,其可滿足下列條件:94.0% < R5459 < 99.99%。According to the plastic optical turning element of the embodiment described in the preceding paragraph, the reflectance of the reflective optical film layer has a minimum reflectance of R5459 at a wavelength of 540 nm to 590 nm, which can meet the following conditions: 94.0% < R5459 < 99.99%.
依據本揭示內容一實施方式提供一種成像鏡頭模組,包含如前述實施方式的塑膠光學轉折元件與一光學成像透鏡組,其中塑膠光學轉折元件設置於光學成像透鏡組的物側和像側其中一側。According to an embodiment of the present disclosure, an imaging lens module is provided, which includes the plastic optical turning element and an optical imaging lens group as in the foregoing embodiment, wherein the plastic optical turning element is arranged on one of the object side and the image side of the optical imaging lens group side.
依據本揭示內容一實施方式提供一種電子裝置,包含前述實施方式的成像鏡頭模組與一電子感光元件,其中電子感光元件設置於成像鏡頭模組的一成像面。According to an embodiment of the present disclosure, an electronic device is provided, including the imaging lens module of the aforementioned embodiment and an electronic photosensitive element, wherein the electronic photosensitive element is disposed on an imaging surface of the imaging lens module.
本揭示內容提供一種塑膠光學轉折元件,包含一入光面、一出光面、一反射面及一反射光學膜層。入光面用以使一成像光線入射塑膠光學轉折元件。出光面用以使成像光線出射塑膠光學轉折元件。反射面用以轉折成像光線。反射光學膜層設置於反射面的一表面,且包含一銀原子層、一底層光學膜及一頂層光學膜。銀原子層用以將進入入光面的成像光線反射至出光面。底層光學膜與銀原子層直接接觸,且底層光學膜較銀原子層靠近塑膠光學轉折元件的反射面。頂層光學膜的折射率低於底層光學膜的折射率,頂層光學膜不與銀原子層直接接觸,且頂層光學膜較銀原子層遠離塑膠光學轉折元件的反射面。底層光學膜的折射率為Nb,底層光學膜的厚度為db,頂層光學膜的折射率為Nt,頂層光學膜的厚度為dt,銀原子層的厚度為dAg,其滿足下列條件:1.4 < Nt < Nb < 2.1;1.6 < Nb < 2.1;1.4 < Nt < 1.58;0.05 < db/dAg < 1.2;以及0.2 < dAg/dt < 3.5。The disclosure provides a plastic optical turning element, which includes a light incident surface, a light exit surface, a reflective surface and a reflective optical film layer. The light incident surface is used for making an imaging light incident into the plastic optical turning element. The light exit surface is used to make the imaging light exit the plastic optical turning element. The reflective surface is used to deflect imaging light. The reflective optical film layer is arranged on one surface of the reflective surface, and includes a silver atomic layer, a bottom optical film and a top optical film. The silver atomic layer is used to reflect the imaging light entering the light incident surface to the light exit surface. The bottom optical film is in direct contact with the silver atomic layer, and the bottom optical film is closer to the reflective surface of the plastic optical turning element than the silver atomic layer. The refractive index of the top optical film is lower than that of the bottom optical film, the top optical film is not in direct contact with the silver atomic layer, and the top optical film is farther away from the reflective surface of the plastic optical turning element than the silver atomic layer. The refractive index of the bottom optical film is Nb, the thickness of the bottom optical film is db, the refractive index of the top optical film is Nt, the thickness of the top optical film is dt, and the thickness of the silver atomic layer is dAg, which meets the following conditions: 1.4<Nt < Nb < 2.1; 1.6 < Nb < 2.1; 1.4 < Nt < 1.58; 0.05 < db/dAg < 1.2; and 0.2 < dAg/dt < 3.5.
具體而言,本案的塑膠光學轉折元件為一種光學元件設置銀原子層於塑膠材質的反射面上以轉折成像光線。藉由底層光學膜增加銀原子層與塑膠材質的反射面之間的物理附著度,且底層光學膜可維持較高的折射率以減少塑膠光學轉折元件內部不必要的反射而增加對成像光線的影像還原度。Specifically, the plastic optical turning element of this case is an optical element with a silver atomic layer on the reflective surface of the plastic material to bend the imaging light. The physical adhesion between the silver atomic layer and the reflective surface of the plastic material is increased by the underlying optical film, and the underlying optical film can maintain a high refractive index to reduce unnecessary reflection inside the plastic optical turning element and increase the imaging light Image restoration.
塑膠光學轉折元件可更包含一連接面與一注料痕結構,其中連接面連接入光面、出光面及反射面,且注料痕結構設置於連接面上。透過注料痕結構設置在連接面上,可增加射出成型的注塑效率,並透過同時成型入光面、出光面及反射面,可讓入光面、出光面及反射面的光學平整性與圓對稱一致性較佳。The plastic optical turning element may further include a connection surface and a injection mark structure, wherein the connection surface connects the light incident surface, the light output surface and the reflection surface, and the injection mark structure is arranged on the connection surface. By setting the injection mark structure on the connection surface, the injection molding efficiency of injection molding can be increased, and by simultaneously forming the light incident surface, light exit surface and reflective surface, the optical flatness and roundness of the light incident surface, light exit surface and reflective surface can be improved. Symmetrical consistency is better.
底層光學膜可為一金屬氧化物層。具體來說,因金屬氧化物層含有金屬材質,金屬氧化物層可同時與銀原子層之間以及與塑膠材質之間有較佳的結合力,故金屬氧化物層的底層光學膜較非金屬氧化物的底層光學膜對金屬材質有較佳的結合力。換言之,金屬氧化物層可以讓銀原子層在塑膠材質上有較佳的附著度。必須說明的是,一般的附著度測試方法可為使用膠帶貼蓋在設置光學膜層的表面上,並於撕下膠帶後檢查光學膜層的表面狀況來判定附著度的優劣,其中可透過增加重複貼蓋與撕下膠帶的次數以達到較嚴苛的測試條件,但並不以此為限。具體而言,底層光學膜的材質可為Al 2O 3,頂層光學膜的材質可以是非金屬氧化物,如SiO 2。 The underlying optical film can be a metal oxide layer. Specifically, because the metal oxide layer contains metal materials, the metal oxide layer can have a better bonding force with the silver atomic layer and with the plastic material at the same time, so the underlying optical film of the metal oxide layer is better than the non-metallic film. The underlying optical film of oxide has better bonding force to metal materials. In other words, the metal oxide layer can allow the silver atom layer to have better adhesion on the plastic material. It must be noted that the general adhesion test method is to use adhesive tape to cover the surface of the optical film layer, and check the surface condition of the optical film layer after tearing off the tape to determine the quality of the adhesion. Repeat the number of times the cover is attached and the tape is removed to achieve more stringent test conditions, but it is not limited thereto. Specifically, the material of the bottom optical film may be Al 2 O 3 , and the material of the top optical film may be non-metal oxide, such as SiO 2 .
塑膠光學轉折元件可更包含至少一中間夾層,其中中間夾層設置於頂層光學膜與銀原子層之間。透過中間夾層可保護銀原子層,使銀原子層不易氧化,並可提高銀原子層抗酸鹼腐蝕的能力,但中間夾層的功效並不以上述的功效為限。The plastic optical turning element may further include at least one interlayer, wherein the interlayer is disposed between the top optical film and the silver atomic layer. The silver atomic layer can be protected through the intermediate interlayer, so that the silver atomic layer is not easily oxidized, and the ability of the silver atomic layer to resist acid and alkali corrosion can be improved, but the effect of the intermediate interlayer is not limited to the above-mentioned effects.
中間夾層可包含一金屬層,且金屬層不包含銀原子。具體而言,金屬層的材質可為Ti、Cr、Ni等,但並不以此為限。不包含銀原子的金屬層可增加銀原子層的表面安定性,使其不易受外界環境影響,且與銀原子層的結合性較佳。The interlayer may include a metal layer, and the metal layer does not include silver atoms. Specifically, the material of the metal layer may be Ti, Cr, Ni, etc., but not limited thereto. The metal layer that does not contain silver atoms can increase the surface stability of the silver atomic layer, making it less susceptible to external environmental influences, and has a better combination with the silver atomic layer.
底層光學膜可與塑膠光學轉折元件的反射面直接接觸。藉此,可增加銀原子層的光學反射程度以維持較高的光學反射率。具體而言,銀原子的反射程度較鋁原子的反射程度佳,且設置底層光學膜可使銀原子層的反射效果不易受塑膠材質的影響而下降。The underlying optical film can be in direct contact with the reflective surface of the plastic optical turning element. Thereby, the degree of optical reflection of the silver atomic layer can be increased to maintain a high optical reflectivity. Specifically, the reflection degree of silver atoms is better than that of aluminum atoms, and the provision of the underlying optical film can make the reflection effect of the silver atom layer less susceptible to degradation due to the influence of plastic materials.
銀原子層的厚度為dAg,其可滿足下列條件:75 nm < dAg < 200 nm。透過適當的銀原子層的厚度可使成像光線反射效果較佳,也使不同成像光線波段的光波長反射程度較一致。藉此,可使成像光線的還原影像程度較佳,且可使反射的影像更細緻、寫實及柔和。必須說明的是,過厚的銀原子層容易厚度不均勻,可能使反射的影像產生扭曲。The thickness of the silver atomic layer is dAg, which can satisfy the following conditions: 75 nm < dAg < 200 nm. Through the appropriate thickness of the silver atomic layer, the imaging light reflection effect is better, and the light wavelength reflection degree of different imaging light bands is more consistent. In this way, the degree of restoration of the imaging light can be better, and the reflected image can be made more detailed, realistic and soft. It must be noted that an overly thick silver atomic layer tends to be uneven in thickness, which may distort the reflected image.
底層光學膜的厚度為db,頂層光學膜的厚度為dt,其可滿足下列條件:0.05 < db/dt < 1.1。透過較薄的底層光學膜可使塑膠光學轉折元件的光學特性更佳。具體來說,光學特性可以是影像光線的演色性、影像光線的還原程度或影像光線的細節,但並不以此為限。The thickness of the bottom optical film is db, and the thickness of the top optical film is dt, which can satisfy the following conditions: 0.05 < db/dt < 1.1. Through the thinner underlying optical film, the optical characteristics of the plastic optical turning element can be improved. Specifically, the optical characteristic may be the color rendering of the image light, the restoration degree of the image light, or the details of the image light, but is not limited thereto.
反射光學膜層的反射率在波長540 nm~590 nm之間的最低反射率為R5459,其可滿足下列條件:94.0% < R5459 < 99.99%。透過在可見光波段的高反射率,可忠實呈現影像的真實性,減少塑膠光學轉折元件對原始光線的額外耗損,提高成像品質。The reflectance of the reflective optical film layer has a minimum reflectance of R5459 between the wavelength of 540 nm and 590 nm, which can meet the following conditions: 94.0% < R5459 < 99.99%. Through the high reflectivity in the visible light band, it can faithfully present the authenticity of the image, reduce the additional loss of the original light caused by the plastic optical turning element, and improve the imaging quality.
上述本揭示內容塑膠光學轉折元件中的各技術特徵皆可組合配置,而達到對應之功效。All the technical features of the above-mentioned plastic optical turning elements in the disclosure can be combined and configured to achieve corresponding functions.
本揭示內容提供一種成像鏡頭模組,包含前述的塑膠光學轉折元件與一光學成像透鏡組,其中塑膠光學轉折元件設置於光學成像透鏡組的物側和像側其中一側。具體而言,塑膠光學轉折元件的配置可使成像鏡頭模組適合應用於攝遠(即全視角小於40度),藉以有效縮減成像鏡頭模組的體積。The present disclosure provides an imaging lens module, which includes the aforementioned plastic optical turning element and an optical imaging lens group, wherein the plastic optical turning element is disposed on one of the object side and the image side of the optical imaging lens group. Specifically, the configuration of the plastic optical turning element can make the imaging lens module suitable for telephoto application (that is, the full viewing angle is less than 40 degrees), so as to effectively reduce the volume of the imaging lens module.
本揭示內容提供一種電子裝置,包含前述的成像鏡頭模組與一電子感光元件,其中電子感光元件設置於成像鏡頭模組的一成像面。The present disclosure provides an electronic device including the aforementioned imaging lens module and an electronic photosensitive element, wherein the electronic photosensitive element is disposed on an imaging surface of the imaging lens module.
根據上述實施方式,以下提出具體實施例並配合圖式予以詳細說明。According to the above-mentioned implementation manners, specific embodiments are proposed below and described in detail with reference to the drawings.
<第一實施例><First embodiment>
請參照第1A圖至第1D圖,其中第1A圖繪示依照本揭示內容第一實施例中電子裝置10的立體圖,第1B圖繪示依照第1A圖第一實施例中電子裝置10的分解圖,第1C圖繪示依照第1A圖第一實施例中電子裝置10的另一分解圖,第1D圖繪示依照第1A圖第一實施例中電子裝置10的示意圖。由第1A圖至第1D圖可知,電子裝置10包含一成像鏡頭模組(圖未標示)與一電子感光元件180,其中電子感光元件180設置於成像鏡頭模組的一成像面(圖未標示)。Please refer to FIG. 1A to FIG. 1D, wherein FIG. 1A shows a perspective view of the
進一步來說,電子裝置10更包含一殼體150、一第一驅動機構(圖未標示)、一第二驅動機構(圖未標示)、一載體160及一軟性電路板170,其中第一驅動機構包含一第一驅動件131、第一磁石132、第一滾動元件133、磁性件134及第一線圈135,且第二驅動機構包含一第二驅動件141、第二磁石142、一第二滾動元件143、彈性元件144及第二線圈145。具體而言,第一驅動機構與第二驅動機構用以驅動成像鏡頭模組,成像鏡頭模組設置於載體160內,軟性電路板170設置於載體160的一面,而殼體150設置於載體160的另一面。Furthermore, the
成像鏡頭模組包含一塑膠光學轉折元件110與一光學成像透鏡組(圖未標示),其中塑膠光學轉折元件110設置於光學成像透鏡組的物側。具體而言,塑膠光學轉折元件110的配置可使成像鏡頭模組適合應用於攝遠(即全視角小於40度),藉以有效縮減成像鏡頭模組的體積。The imaging lens module includes a plastic
由第1D圖可知,光學成像透鏡組由物側至像側依序包含透鏡121a、121b、121c、121d及一固定環123,透鏡121a、121b、121c設置於光學成像透鏡組的一鏡筒122中,且透鏡121d與固定環123設置於第一驅動件131中,其中透鏡的數量、結構、面形等光學特徵可依照不同成像需求配置,並不以此為限。It can be seen from Figure 1D that the optical imaging lens group includes
請參照第1E圖,其繪示依照第1A圖第一實施例中塑膠光學轉折元件110的示意圖。由第1A圖至第1E圖可知,塑膠光學轉折元件110包含一入光面111、一出光面112、一反射面113及一反射光學膜層114。詳細來說,入光面111用以使一成像光線(圖未標示)入射塑膠光學轉折元件110,出光面112用以使成像光線出射塑膠光學轉折元件110,反射面113用以轉折成像光線,且反射光學膜層114設置於反射面113的一表面。第一實施例中,塑膠光學轉折元件110可為塑膠透鏡,且入光面111具有光學曲面,但並不以此為限。Please refer to FIG. 1E , which shows a schematic diagram of the plastic
反射光學膜層114包含一銀原子層114a、一底層光學膜114b及一頂層光學膜114c,其中銀原子層114a用以將進入入光面111的成像光線反射至出光面112;底層光學膜114b與銀原子層114a直接接觸,且底層光學膜114b較銀原子層114a靠近塑膠光學轉折元件110的反射面113;頂層光學膜114c的折射率低於底層光學膜114b的折射率,頂層光學膜114c不與銀原子層114a直接接觸,且頂層光學膜114c較銀原子層114a遠離塑膠光學轉折元件110的反射面113。The reflective
具體而言,塑膠光學轉折元件110為一種光學元件設置銀原子層114a於塑膠材質的反射面113上以轉折成像光線。藉由底層光學膜114b增加銀原子層114a與塑膠材質的反射面113之間的物理附著度,且底層光學膜114b可維持較高的折射率以減少塑膠光學轉折元件110內部不必要的反射而增加對成像光線的影像還原度。Specifically, the plastic
由第1B圖與第1E圖可知,塑膠光學轉折元件110更包含一連接面115、一注料痕結構116及至少一中間夾層117,其中連接面115連接入光面111、出光面112及反射面113,注料痕結構116設置於連接面115上,中間夾層117設置於頂層光學膜114c與銀原子層114a之間。透過注料痕結構116設置在連接面115上,可增加射出成型的注塑效率,並透過同時成型入光面111、出光面112及反射面113,可讓入光面111、出光面112及反射面113的光學平整性與圓對稱一致性較佳。再者,透過中間夾層117可保護銀原子層114a,使銀原子層114a不易氧化,並可提高銀原子層114a抗酸鹼腐蝕的能力,但中間夾層117的功效並不以上述的功效為限。第一實施例中,連接面的數量為二,注料痕結構的數量為一,且中間夾層117的數量為二。From Figure 1B and Figure 1E, it can be seen that the plastic
必須說明的是,第1E圖中的中間夾層117的繪製數量為一,但中間夾層117的實際數量可為二或以上,並不以此為限。It must be noted that the number of
底層光學膜114b為一金屬氧化物層。具體來說,因金屬氧化物層含有金屬材質,金屬氧化物層可同時與銀原子層114a之間以及與塑膠材質之間有較佳的結合力,故金屬氧化物層的底層光學膜114b較非金屬氧化物層的底層光學膜對金屬材質有較佳的結合力。換言之,金屬氧化物層可以讓銀原子層114a在塑膠材質上有較佳的附著度。必須說明的是,一般的附著度測試方法可為使用膠帶貼蓋在設置光學膜層的表面上,並於撕下膠帶後檢查光學膜層的表面狀況來判定附著度的優劣,其中可透過增加重複貼蓋與撕下膠帶的次數以達到較嚴苛的測試條件,但並不以此為限。第一實施例中,底層光學膜114b的材質為Al
2O
3,頂層光學膜114c的材質為SiO
2。
The underlying
中間夾層117包含一金屬層,且金屬層不包含銀原子。不包含銀原子的金屬層可增加銀原子層的表面安定性,使其不易受外界環境影響,且與銀原子層的結合性較佳。具體而言,金屬層的材質可為Ti、Cr、Ni等,但並不以此為限。The
底層光學膜114b與塑膠光學轉折元件110的反射面113直接接觸。藉此,可增加銀原子層114a的光學反射程度以維持較高的光學反射率。具體而言,銀原子的反射程度較鋁原子的反射程度佳,且設置底層光學膜114b可使銀原子層114a的反射效果不易受塑膠材質的影響而下降。The bottom
底層光學膜114b的折射率為Nb,底層光學膜114b的厚度為db,頂層光學膜114c的折射率為Nt,頂層光學膜114c的厚度為dt,銀原子層114a的折射率為NAg,銀原子層114a的厚度為dAg,所述參數滿足下列表一條件。
必須說明的是,空氣的折射率為1,塑膠光學轉折元件110的折射率為1.64678,且各中間夾層117的厚度小於銀原子層114a的厚度。It must be noted that the refractive index of air is 1, the refractive index of the plastic
請參照第1F圖與表二,其中第1F圖繪示依照第1A圖第一實施例之反射率結果示意圖,表二為第一實施例的反射率結果。
<第二實施例><Second embodiment>
請參照第2圖,其繪示依照本揭示內容第二實施例中電子裝置20的示意圖。由第2圖可知,電子裝置20包含一成像鏡頭模組(圖未標示)與一電子感光元件280,其中電子感光元件280設置於成像鏡頭模組的一成像面(圖未標示)。Please refer to FIG. 2 , which shows a schematic diagram of an
成像鏡頭模組包含塑膠光學轉折元件210、230及一光學成像透鏡組(圖未標示),其中塑膠光學轉折元件210設置於光學成像透鏡組的物側,而塑膠光學轉折元件230設置於光學成像透鏡組的像側。具體而言,塑膠光學轉折元件210、230的配置可使成像鏡頭模組適合應用於攝遠(即全視角小於40度),藉以有效縮減成像鏡頭模組的體積。The imaging lens module includes plastic
光學成像透鏡組由物側至像側依序包含透鏡221a、221b、221c、221d及一固定環223,透鏡221a、221b、221c設置於光學成像透鏡組的一鏡筒222中,且透鏡221d與固定環223設置於光學成像透鏡組的一驅動件224中,其中透鏡的數量、結構、面形等光學特徵可依照不同成像需求配置,並不以此為限。The optical imaging lens group includes
塑膠光學轉折元件210包含一入光面211、一出光面212、一反射面213及一反射光學膜層(圖未標示),且塑膠光學轉折元件230包含一入光面231、一出光面232、一反射面233及一反射光學膜層(圖未標示)。詳細來說,入光面211、231分別用以使一成像光線(圖未標示)入射塑膠光學轉折元件210、230,出光面212、232分別用以使成像光線出射塑膠光學轉折元件210、230,反射面213、233用以轉折成像光線,且反射光學膜層分別設置於反射面213、233的一表面。第二實施例中,塑膠光學轉折元件210可為塑膠透鏡,入光面211與出光面232具有光學曲面,但並不以此為限。The plastic
另外,第二實施例與第一實施例其餘的元件之結構及配置關係皆相同,在此將不另贅述。In addition, the structure and arrangement relationship of the remaining elements of the second embodiment and the first embodiment are the same, and will not be repeated here.
<第三實施例><Third Embodiment>
請參照第3A圖,其繪示依照本揭示內容第三實施例中電子裝置30的示意圖。由第3A圖可知,電子裝置30包含一成像鏡頭模組(圖未標示)與一電子感光元件380,其中電子感光元件380設置於成像鏡頭模組的一成像面381。Please refer to FIG. 3A , which shows a schematic diagram of an
成像鏡頭模組包含一塑膠光學轉折元件310與一光學成像透鏡組320,其中塑膠光學轉折元件310設置於光學成像透鏡組320的像側。具體而言,適合應用於攝遠的成像鏡頭模組(全視角小於40度),藉以有效縮減成像鏡頭模組的體積。The imaging lens module includes a plastic
請參照第3B圖至第3D圖,其中第3B圖繪示依照第3A圖第三實施例中塑膠光學轉折元件310的立體圖,第3C圖繪示依照第3A圖第三實施例中塑膠光學轉折元件310的另一立體圖,第3D圖繪示依照第3A圖第三實施例中塑膠光學轉折元件310的入光面311與反射面313的示意圖。由第3A圖至第3D圖可知,塑膠光學轉折元件310包含一入光面311、一出光面312、反射面313、一反射光學膜層(圖未標示)、連接面315、注料痕結構316及至少一中間夾層(圖未標示)。詳細來說,入光面311用以使一成像光線(圖未標示)入射塑膠光學轉折元件310,出光面312用以使成像光線出射塑膠光學轉折元件310,反射面313用以轉折成像光線,反射光學膜層設置於反射面313的一表面,連接面315連接入光面311、出光面312及反射面313,且注料痕結構316設置於連接面315上。第三實施例中,反射面313的數量為四,連接面315的數量為二,注料痕結構316的數量為二,中間夾層的數量為二,反射面313中其中二者分別與入光面311和出光面312共用平面,其中中間夾層的實際數量可為二或以上,但並不以此為限。Please refer to Figures 3B to 3D, wherein Figure 3B shows a perspective view of the plastic
反射光學膜層包含一銀原子層(圖未標示)、一底層光學膜(圖未標示)及一頂層光學膜(圖未標示),其中銀原子層用以將進入入光面311的成像光線反射至出光面312;底層光學膜與銀原子層直接接觸,且底層光學膜較銀原子層靠近塑膠光學轉折元件310的反射面313;頂層光學膜的折射率低於底層光學膜的折射率,頂層光學膜不與銀原子層直接接觸,且頂層光學膜較銀原子層遠離塑膠光學轉折元件310的反射面313。The reflective optical film layer includes a silver atomic layer (not shown in the figure), a bottom optical film (not shown in the figure) and a top layer of optical film (not shown in the figure), wherein the silver atomic layer is used to divert the imaging light entering the
第三實施例中,底層光學膜的材質為Al 2O 3,頂層光學膜的材質為SiO 2。 In the third embodiment, the material of the bottom optical film is Al 2 O 3 , and the material of the top optical film is SiO 2 .
進一步來說,入光面311、出光面312及反射面313分別包含一光學部(圖未標示)與一圓弧階差結構(圖未標示),其中圓弧階差結構設置於光學部的外周,且圓弧階差結構是以光學部的中心形成一圓弧。Further, the
底層光學膜的折射率為Nb,底層光學膜的厚度為db,頂層光學膜的折射率為Nt,頂層光學膜的厚度為dt,銀原子層的折射率為NAg,銀原子層的厚度為dAg,所述參數滿足下列表三條件。
必須說明的是,空氣的折射率為1,塑膠光學轉折元件310的折射率為1.64678,且各中間夾層的厚度小於銀原子層的厚度。It must be noted that the refractive index of air is 1, the refractive index of the plastic
另外,第三實施例與第一實施例其餘的元件之結構及配置關係皆相同,在此將不另贅述。In addition, the third embodiment is the same as the first embodiment in terms of structure and arrangement of other components, and will not be repeated here.
<第四實施例><Fourth embodiment>
第4A圖繪示依照本揭示內容第四實施例中電子裝置40的示意圖,第4B圖繪示依照第4A圖第四實施例中電子裝置40的另一示意圖。由第4A圖與第4B圖可知,第四實施例的電子裝置40係一智慧型手機,電子裝置40包含一成像鏡頭模組(圖未標示)、一電子感光元件(圖未繪示)及一使用者介面41,其中電子感光元件設置於成像鏡頭模組的一成像面(圖未繪示),成像鏡頭模組為超廣角相機模組42、高畫素相機模組43及攝遠相機模組44,且使用者介面41為觸控螢幕,但並不以此為限。再者,成像鏡頭模組包含一塑膠光學轉折元件(圖未繪示)與一光學成像透鏡組(圖未繪示),其中塑膠光學轉折元件設置於光學成像透鏡組的物側與像側其中一者。FIG. 4A shows a schematic diagram of the
進一步來說,攝遠相機模組44可為前述第一實施例至第三實施例中的任一成像鏡頭模組,但本揭示內容不以此為限。藉此,有助於滿足現今電子裝置市場對於搭載於其上的成像鏡頭模組的量產及外觀要求。Further, the
進一步來說,使用者透過使用者介面41進入拍攝模式,其中使用者介面41用以顯示畫面並具備觸控功能,且可用以手動調整拍攝視角以切換不同的成像鏡頭模組。此時成像鏡頭模組匯集成像光線在電子感光元件上,並輸出有關影像的電子訊號至成像訊號處理元件(Image Signal Processor,ISP)45。Furthermore, the user enters the shooting mode through the
由第4B圖可知,因應電子裝置40的相機規格,電子裝置40可更包含光學防手震組件(圖未繪示),進一步地,電子裝置40可更包含至少一個對焦輔助模組(圖未標示)及至少一個感測元件(圖未繪示)。對焦輔助模組可以是補償色溫的閃光燈模組46、紅外線測距元件、雷射對焦模組等,感測元件可具有感測物理動量與作動能量的功能,如加速計、陀螺儀、霍爾元件(Hall Effect Element),以感知使用者的手部或外在環境施加的晃動及抖動,進而有利於電子裝置40中成像鏡頭模組配置的自動對焦功能及光學防手震組件的發揮,以獲得良好的成像品質,有助於依據本揭示內容的電子裝置40具備多種模式的拍攝功能,如優化自拍、低光源HDR(High Dynamic Range,高動態範圍成像)、高解析4K(4K Resolution)錄影等。此外,使用者可由使用者介面41直接目視到相機的拍攝畫面,並在使用者介面41上手動操作取景範圍,以達成所見即所得的自動對焦功能。It can be seen from FIG. 4B that in response to the camera specification of the
進一步來說,成像鏡頭模組、電子感光元件、光學防手震組件、感測元件及對焦輔助模組可設置在一軟性電路板(Flexible Printed Circuitboard,FPC)(圖未繪示)上,並透過一連接器(圖未繪示)電性連接成像訊號處理元件45等相關元件以執行拍攝流程。當前的電子裝置如智慧型手機具有輕薄的趨勢,將成像鏡頭模組與相關元件配置於軟性電路板上,再利用連接器將電路彙整至電子裝置的主板,可滿足電子裝置內部有限空間的機構設計及電路佈局需求並獲得更大的裕度,亦使得其成像鏡頭模組的自動對焦功能藉由電子裝置的觸控螢幕獲得更靈活的控制。第四實施例中,電子裝置40可包含複數感測元件及複數對焦輔助模組,感測元件及對焦輔助模組設置在軟性電路板及另外至少一個軟性電路板(圖未繪示),並透過對應的連接器電性連接成像訊號處理元件45等相關元件以執行拍攝流程。在其他實施例中(圖未繪示),感測元件及輔助光學元件亦可依機構設計及電路佈局需求設置於電子裝置的主板或是其他形式的載板上。Furthermore, the imaging lens module, electronic photosensitive element, optical anti-shake component, sensing element and focusing auxiliary module can be arranged on a flexible printed circuit board (Flexible Printed Circuitboard, FPC) (not shown in the figure), and The imaging
此外,電子裝置40可進一步包含但不限於顯示單元(Display)、控制單元(Control Unit)、儲存單元(Storage Unit)、暫儲存單元(RAM)、唯讀儲存單元(ROM)或其組合。In addition, the
第4C圖繪示依照第4A圖第四實施例中的影像示意圖。由第4C圖可知,以超廣角相機模組42可拍攝到較大範圍的影像,具有容納更多景色的功能。FIG. 4C shows a schematic view of the image in the fourth embodiment according to FIG. 4A. As can be seen from FIG. 4C , the ultra-wide-
第4D圖繪示依照第4A圖第四實施例中的另一影像示意圖。由第4D圖可知,以高畫素相機模組43可拍攝一定範圍且兼具高畫素的影像,具有高解析低變形的功能。FIG. 4D is a schematic diagram of another image according to the fourth embodiment in FIG. 4A. It can be seen from FIG. 4D that the high-
第4E圖繪示依照第4A圖第四實施例中的再一影像示意圖。由第4E圖可知,以攝遠相機模組44具有高倍數的放大功能,可拍攝遠處的影像並放大至高倍。FIG. 4E shows still another image schematic diagram in the fourth embodiment according to FIG. 4A. It can be seen from FIG. 4E that the
由第4C圖至第4E圖可知,由具有不同焦距的成像鏡頭模組進行取景,並搭配影像處理的技術,可於電子裝置40實現變焦的功能。It can be seen from FIG. 4C to FIG. 4E that the
<第五實施例><Fifth Embodiment>
請參照第5圖,其繪示依照本揭示內容第五實施例中電子裝置50的示意圖。由第5圖可知,電子裝置50係一智慧型手機,且電子裝置50包含一成像鏡頭模組(圖未標示)與一電子感光元件(圖未繪示),其中電子感光元件設置於成像鏡頭模組的一成像面(圖未繪示),且成像鏡頭模組包含超廣角相機模組511、512、廣角相機模組513、514、攝遠相機模組515、516、517、518及TOF模組(Time-Of-Flight:飛時測距模組)519,而TOF模組519另可為其他種類的取像裝置,並不限於此配置方式。Please refer to FIG. 5 , which shows a schematic diagram of an
進一步來說,攝遠相機模組515、516、517、518可為前述第一實施例至第三實施例中的任一成像鏡頭模組,但本揭示內容不以此為限。藉此,有助於滿足現今電子裝置市場對於搭載於其上的成像鏡頭模組的量產及外觀要求。Further, the
再者,攝遠相機模組517、518用以轉折光線,但本揭示內容不以此為限。Furthermore, the
因應電子裝置50的相機規格,電子裝置50可更包含光學防手震組件(圖未繪示),進一步地,電子裝置50可更包含至少一個對焦輔助模組(圖未繪示)及至少一個感測元件(圖未繪示)。對焦輔助模組可以是補償色溫的閃光燈模組520、紅外線測距元件、雷射對焦模組等,感測元件可具有感測物理動量與作動能量的功能,如加速計、陀螺儀、霍爾元件(Hall Effect Element),以感知使用者的手部或外在環境施加的晃動及抖動,進而有利於電子裝置50中成像鏡頭模組配置的自動對焦功能及光學防手震組件的發揮,以獲得良好的成像品質,有助於依據本揭示內容的電子裝置50具備多種模式的拍攝功能,如優化自拍、低光源HDR(High Dynamic Range,高動態範圍成像)、高解析4K(4K Resolution)錄影等。According to the camera specifications of the
另外,第五實施例與第四實施例其餘的元件之結構及配置關係皆相同,在此將不另贅述。In addition, the structure and arrangement relationship of the remaining components of the fifth embodiment and the fourth embodiment are the same, and will not be repeated here.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.
10,20,30,40,50:電子裝置10,20,30,40,50: electronic devices
110,210,230,310:塑膠光學轉折元件110,210,230,310: plastic optical transition elements
111,211,231,311:入光面111,211,231,311: light incident surface
112,212,232,312:出光面112,212,232,312: light-emitting surface
113,213,233,313:反射面113,213,233,313: reflective surface
114:反射光學膜層114: reflective optical film layer
114a:銀原子層114a: silver atomic layer
114b:底層光學膜114b: Underlying optical film
114c:頂層光學膜114c: Top optical film
115,315:連接面115,315: connecting surface
116,316:注料痕結構116,316: injection mark structure
117:中間夾層117: middle interlayer
121a,121b,121c,121d,221a,221b,221c,221d:透鏡121a, 121b, 121c, 121d, 221a, 221b, 221c, 221d: lens
122,222:鏡筒122,222: lens barrel
123,223:固定環123,223: fixed ring
131:第一驅動件131: the first driving member
132:第一磁石132: The first magnet
133:第一滾動元件133: first rolling element
134:磁性件134: Magnetic parts
135:第一線圈135: the first coil
141:第二驅動件141: the second driving member
142:第二磁石142: second magnet
143:第二滾動元件143: second rolling element
144:彈性元件144: elastic element
145:第二線圈145: second coil
150:殼體150: shell
160:載體160: carrier
170:軟性電路板170: flexible circuit board
180,280,380:電子感光元件180,280,380: electronic photosensitive element
224:驅動件224: Driver
320:光學成像透鏡組320: optical imaging lens group
381:成像面381: imaging surface
41:使用者介面41: User Interface
42,511,512:超廣角相機模組42,511,512: Super wide-angle camera modules
43:高畫素相機模組43:High resolution camera module
44,515,516,517,518:攝遠相機模組44,515,516,517,518: telephoto camera modules
45:成像訊號處理元件45: Imaging signal processing components
46,520:閃光燈模組46,520: flash module
513,514:廣角相機模組513,514: Wide-angle camera modules
519:TOF模組519:TOF module
Nb:底層光學膜的折射率Nb: Refractive index of underlying optical film
db:底層光學膜的厚度db: the thickness of the underlying optical film
Nt:頂層光學膜的折射率Nt: Refractive index of the top optical film
dt:頂層光學膜的厚度dt: the thickness of the top optical film
NAg:銀原子層的折射率NAg: Refractive index of silver atomic layer
dAg:銀原子層的厚度dAg: the thickness of the silver atomic layer
R5459:反射光學膜層的反射率在波長540 nm~590 nm之間的最低反射率R5459: The minimum reflectance of the reflective optical film layer between the wavelength of 540 nm and 590 nm
第1A圖繪示依照本揭示內容第一實施例中電子裝置的立體圖; 第1B圖繪示依照第1A圖第一實施例中電子裝置的分解圖; 第1C圖繪示依照第1A圖第一實施例中電子裝置的另一分解圖; 第1D圖繪示依照第1A圖第一實施例中電子裝置的示意圖; 第1E圖繪示依照第1A圖第一實施例中塑膠光學轉折元件的示意圖; 第1F圖繪示依照第1A圖第一實施例之反射率結果示意圖; 第2圖繪示依照本揭示內容第二實施例中電子裝置的示意圖; 第3A圖繪示依照本揭示內容第三實施例中電子裝置的示意圖; 第3B圖繪示依照第3A圖第三實施例中塑膠光學轉折元件的立體圖; 第3C圖繪示依照第3A圖第三實施例中塑膠光學轉折元件的另一立體圖; 第3D圖繪示依照第3A圖第三實施例中塑膠光學轉折元件的入光面與反射面的示意圖; 第4A圖繪示依照本揭示內容第四實施例中電子裝置的示意圖; 第4B圖繪示依照第4A圖第四實施例中電子裝置的另一示意圖; 第4C圖繪示依照第4A圖第四實施例中的影像示意圖; 第4D圖繪示依照第4A圖第四實施例中的另一影像示意圖; 第4E圖繪示依照第4A圖第四實施例中的再一影像示意圖;以及 第5圖繪示依照本揭示內容第五實施例中電子裝置的示意圖。 FIG. 1A shows a perspective view of an electronic device according to a first embodiment of the disclosure; FIG. 1B shows an exploded view of the electronic device in the first embodiment according to FIG. 1A; FIG. 1C shows another exploded view of the electronic device according to the first embodiment of FIG. 1A; FIG. 1D shows a schematic diagram of the electronic device in the first embodiment according to FIG. 1A; FIG. 1E shows a schematic diagram of the plastic optical turning element in the first embodiment according to FIG. 1A; Fig. 1F shows a schematic diagram of reflectance results according to the first embodiment of Fig. 1A; FIG. 2 shows a schematic diagram of an electronic device according to a second embodiment of the disclosure; FIG. 3A shows a schematic diagram of an electronic device according to a third embodiment of the disclosure; FIG. 3B shows a perspective view of the plastic optical turning element in the third embodiment according to FIG. 3A; FIG. 3C shows another perspective view of the plastic optical turning element in the third embodiment according to FIG. 3A; FIG. 3D shows a schematic diagram of the light incident surface and the reflective surface of the plastic optical turning element in the third embodiment according to FIG. 3A; FIG. 4A shows a schematic diagram of an electronic device according to a fourth embodiment of the disclosure; FIG. 4B shows another schematic diagram of the electronic device in the fourth embodiment according to FIG. 4A; FIG. 4C shows a schematic view of the image in the fourth embodiment according to FIG. 4A; FIG. 4D shows another image diagram according to the fourth embodiment in FIG. 4A; FIG. 4E shows a schematic diagram of still another image in the fourth embodiment according to FIG. 4A; and FIG. 5 is a schematic diagram of an electronic device according to a fifth embodiment of the disclosure.
110:塑膠光學轉折元件 110:Plastic optical turning element
111:入光面 111: light incident surface
112:出光面 112: light emitting surface
113:反射面 113: reflective surface
114:反射光學膜層 114: reflective optical film layer
114a:銀原子層 114a: silver atomic layer
114b:底層光學膜 114b: Underlying optical film
114c:頂層光學膜 114c: top optical film
117:中間夾層 117: middle interlayer
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202122619345.3U CN216210000U (en) | 2021-05-21 | 2021-10-29 | Plastic optical turning element, imaging lens module and electronic device |
CN202111268390.7A CN115390168A (en) | 2021-05-21 | 2021-10-29 | Plastic optical turning element, imaging lens module and electronic device |
US17/711,168 US20220373715A1 (en) | 2021-05-21 | 2022-04-01 | Plastic light-folding element, imaging lens assembly module and electronic device |
EP22169886.3A EP4092455A1 (en) | 2021-05-21 | 2022-04-26 | Plastic light-folding element, imaging lens assembly module and electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202163191366P | 2021-05-21 | 2021-05-21 | |
US63/191,366 | 2021-05-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI784676B true TWI784676B (en) | 2022-11-21 |
TW202246815A TW202246815A (en) | 2022-12-01 |
Family
ID=85793783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110130558A TWI784676B (en) | 2021-05-21 | 2021-08-18 | Plastic light-folding element, imaging lens assembly module and electronic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI784676B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201832923A (en) * | 2017-03-08 | 2018-09-16 | 揚明光學股份有限公司 | Reflective element and reflective mirror |
US20200012021A1 (en) * | 2018-07-03 | 2020-01-09 | Seiko Epson Corporation | Cross dichroic prism, image display module, and image display device |
TW202113424A (en) * | 2019-09-19 | 2021-04-01 | 日商Jsr股份有限公司 | Optical member and camera module to provide an optical member which selectively reflects visible light in a specific wavelength region but suppresses the reflection of light in a specific wavelength region |
-
2021
- 2021-08-18 TW TW110130558A patent/TWI784676B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201832923A (en) * | 2017-03-08 | 2018-09-16 | 揚明光學股份有限公司 | Reflective element and reflective mirror |
US20200012021A1 (en) * | 2018-07-03 | 2020-01-09 | Seiko Epson Corporation | Cross dichroic prism, image display module, and image display device |
TW202113424A (en) * | 2019-09-19 | 2021-04-01 | 日商Jsr股份有限公司 | Optical member and camera module to provide an optical member which selectively reflects visible light in a specific wavelength region but suppresses the reflection of light in a specific wavelength region |
Also Published As
Publication number | Publication date |
---|---|
TW202246815A (en) | 2022-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI707188B (en) | Camera module and electronic device | |
TWI596417B (en) | Light blocking sheet, imaging lens module and electronic apparatus | |
US10701252B2 (en) | Imaging optical system, imaging system, and imaging apparatus | |
EP4092455A1 (en) | Plastic light-folding element, imaging lens assembly module and electronic device | |
US20210026227A1 (en) | Optical system, and imaging apparatus | |
TW202132885A (en) | Camera module and electronic device | |
TWI759835B (en) | Imaging lens assembly module, camera module and electronic device | |
TWI784676B (en) | Plastic light-folding element, imaging lens assembly module and electronic device | |
TW202206885A (en) | Imaging lens assembly, image capturing device and electronic device | |
CN114859538B (en) | Plastic light turning element, imaging lens module and electronic device | |
TW202046003A (en) | Camera module | |
TWI625587B (en) | Light blocking sheet, imaging lens module and electronic apparatus | |
TWI728769B (en) | Lens driving apparatus and electronic device | |
JP2005037764A (en) | Image pickup optical system and imaging apparatus using same | |
JP4136399B2 (en) | Wide-angle lens system and imaging device | |
TWI819526B (en) | Optical reflecting assembly, optical lens element module and electronic device | |
TWI822079B (en) | Imaging optical system, camera module and electronic device | |
TWI784743B (en) | Camera module and electronic device | |
CN210781025U (en) | Camera module and electronic equipment | |
CN114167569B (en) | Optical lens, camera module and electronic equipment | |
WO2024040993A1 (en) | Camera lens, camera module and electronic device | |
TWM604892U (en) | Imaging lens assembly, camera module and electronic device | |
TW202340839A (en) | Imaging lens assembly and electronic device | |
TW202307499A (en) | Camera module, imaging module and electronic device | |
CN114002814A (en) | Optical lens, camera module and electronic equipment |