US20220373715A1 - Plastic light-folding element, imaging lens assembly module and electronic device - Google Patents
Plastic light-folding element, imaging lens assembly module and electronic device Download PDFInfo
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- US20220373715A1 US20220373715A1 US17/711,168 US202217711168A US2022373715A1 US 20220373715 A1 US20220373715 A1 US 20220373715A1 US 202217711168 A US202217711168 A US 202217711168A US 2022373715 A1 US2022373715 A1 US 2022373715A1
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- Prior art keywords
- layer
- optical film
- folding element
- plastic light
- light
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/0065—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element having a beam-folding prism or mirror
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/04—Prisms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
- G02B5/085—Multilayer mirrors, i.e. having two or more reflecting layers at least one of the reflecting layers comprising metal
- G02B5/0858—Multilayer mirrors, i.e. having two or more reflecting layers at least one of the reflecting layers comprising metal the reflecting layers comprising a single metallic layer with one or more dielectric layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/17—Bodies with reflectors arranged in beam forming the photographic image, e.g. for reducing dimensions of camera
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H04N5/2254—
Definitions
- the present disclosure relates to a plastic light-folding element and an imaging lens assembly module. More particularly, the present disclosure relates to a plastic light-folding element and an imaging lens assembly module applicable to portable electronic devices.
- a plastic light-folding element includes an incident surface, an exit surface, a reflective surface and a reflective optical layer.
- the incident surface is configured to lead an imaging light enter the plastic light-folding element.
- the exit surface is configured to lead the imaging light exit the plastic light-folding element.
- the reflective surface is configured to fold the imaging light.
- the reflective optical layer is disposed on a surface of the reflective surface.
- the reflective optical layer includes an Ag layer, a bottom layer optical film and a top layer optical film.
- the Ag layer is configured to lead the imaging light, which enters the incident surface, reflect to the exit surface.
- the bottom layer optical film is directly contacted with the Ag layer, and the bottom layer optical film is closer to the reflective surface of the plastic light-folding element than the Ag layer to the reflective surface of the plastic light-folding element.
- a refractive index of the top layer optical film is lower than a refractive index of the bottom layer optical film, wherein the top layer optical film is not directly contacted with the Ag layer, and the top layer optical film is farther from the reflective surface of the plastic light-folding element than the Ag layer from the reflective surface of the plastic light-folding element.
- the refractive index of the bottom layer optical film is Nb
- a thickness of the bottom layer optical film is db
- the refractive index of the top layer optical film is Nt
- a thickness of the top layer optical film is dt
- a thickness of the Ag layer is dAg
- the following conditions are satisfied: 1.4 ⁇ Nt ⁇ Nb ⁇ 2.1; 1.6 ⁇ Nb ⁇ 2.1; 1.4 ⁇ Nt ⁇ 1.58; 0.05 ⁇ db/dAg ⁇ 1.2; and 0.2 ⁇ dAg/dt ⁇ 3.5.
- an imaging lens assembly module includes the plastic light-folding element of the aforementioned aspect and an optical imaging lens assembly, wherein the plastic light-folding element is disposed on one of an object side and an image side of the optical imaging lens assembly.
- an electronic device includes the imaging lens assembly module of the aforementioned aspect and an image sensor, wherein the image sensor is disposed on an image surface of the imaging lens assembly module.
- FIG. 1A is a three dimensional view of an electronic device according to the 1st example of the present disclosure.
- FIG. 1B is an exploded view of the electronic device according to the 1st example in FIG. 1A .
- FIG. 1C is another exploded view of the electronic device according to the 1st example in FIG. 1A .
- FIG. 1D is a schematic view of the electronic device according to the 1st example in FIG. 1A .
- FIG. 1E is a schematic view of the plastic light-folding element according to the 1st example in FIG. 1A .
- FIG. 1F is a schematic view of a reflectivity result according to the 1st example in FIG. 1A .
- FIG. 2 is a schematic view of an electronic device according to the 2nd example of the present disclosure.
- FIG. 3A is a schematic view of an electronic device according to the 3rd example of the present disclosure.
- FIG. 3B is a three dimensional view of the plastic light-folding element according to the 3rd example in FIG. 3A .
- FIG. 3C is another three dimensional view of the plastic light-folding element according to the 3rd example in FIG. 3A .
- FIG. 3D is a schematic view of an incident surface and a reflective surface of the plastic light-folding element according to the 3rd example in FIG. 3A .
- FIG. 4A is a schematic view of an electronic device according to the 4th example of the present disclosure.
- FIG. 4B is another schematic view of the electronic device according to the 4th example in FIG. 4A .
- FIG. 4C is a schematic view of an image according to the 4th example in FIG. 4A .
- FIG. 4D is another schematic view of an image according to the 4th example in FIG. 4A .
- FIG. 4E is still another schematic view of an image according to the 4th example in FIG. 4A .
- FIG. 5 is a schematic view of an electronic device according to the 5th example of the present disclosure.
- the present disclosure provides a plastic light-folding element, and the plastic light-folding element includes an incident surface, an exit surface, a reflective surface and a reflective optical layer.
- the incident surface is configured to lead an imaging light enter the plastic light-folding element.
- the exit surface is configured to lead the imaging light exit the plastic light-folding element.
- the reflective surface is configured to fold the imaging light.
- the reflective optical layer is disposed on a surface of the reflective surface, and the reflective optical layer includes an Ag layer, a bottom layer optical film and a top layer optical film.
- the Ag layer is configured to lead the imaging light, which enters the incident surface, reflect to the exit surface.
- the bottom layer optical film is directly contacted with the Ag layer, and the bottom layer optical film is closer to the reflective surface of the plastic light-folding element than the Ag layer to the reflective surface of the plastic light-folding element.
- a refractive index of the top layer optical film is lower than a refractive index of the bottom layer optical film, wherein the top layer optical film is not directly contacted with the Ag layer, and the top layer optical film is farther from the reflective surface of the plastic light-folding element than the Ag layer from the reflective surface of the plastic light-folding element.
- the refractive index of the bottom layer optical film is Nb
- a thickness of the bottom layer optical film is db
- the refractive index of the top layer optical film is Nt
- a thickness of the top layer optical film is dt
- a thickness of the Ag layer is dAg
- the plastic light-folding element of the present disclosure is an optical element disposing the Ag layer on the reflective surface made of a plastic material for folding the imaging light.
- the physical adhesion between the Ag layer and the reflective surface made of the plastic material is enhanced via the bottom layer optical film, and the higher refractive index can be maintained via the bottom layer optical film so as to reduce the unnecessary reflection inside the plastic light-folding element to increase the image restoration of the imaging light.
- the plastic light-folding element can further include a connecting surface and a gate vestige structure.
- the connecting surface is connected to the incident surface, the exit surface and the reflective surface.
- the gate vestige structure is disposed on the connecting surface. The injecting efficiency of the injection molding can be enhanced by disposing the gate vestige structure on the connecting surface, and the better optical flatness and the better circular symmetry consistency of the incident surface, the exit surface and the reflective surface can be obtained by simultaneously forming the incident surface, the exit surface and the reflective surface.
- the bottom layer optical film can be a metal oxide layer.
- the metal oxide layer includes a metal material, the stronger binding force between the metal oxide layer and the Ag layer and the stronger binding force between the metal oxide layer and the plastic material can be simultaneously obtained, and hence the binding force between the bottom layer optical film made of the metal oxide and the metal material is higher than the binding force between the bottom layer optical film made of the non-metal oxide and the metal material.
- the better adhesion of the Ag layer to the plastic material can be obtained via the metal oxide layer.
- the bottom layer optical film can be made of Al 2 O 3
- the top layer optical film can be made of a non-metal oxide, such as SiO 2 .
- the plastic light-folding element can further include at least one intermediate layer, wherein the intermediate layer is disposed between the top layer optical film and the Ag layer. Via the intermediate layer, the Ag layer can be protected so that the Ag layer is not easily oxidized, and the ability of the resistant to the corrosion of acid and alkali of the Ag layer can be enhanced, but the effect of the intermediate layer is not limited thereto.
- the intermediate layer can include a metal layer excluding a silver atom.
- the material of the metal layer can be Ti, Cr, Ni and so on, but the present disclosure is not limited thereto.
- the surface stability of the Ag layer can be enhanced via the metal layer excluding the silver atom so that the Ag layer is not easily influenced by the external environment, and the combination between the Ag layer and the metal layer excluding the silver atom is better.
- the bottom layer optical film can be directly contacted with the reflective surface of the plastic light-folding element. Therefore, the degree of the optical reflection of the Ag layer can be enhanced to maintain the higher optical reflectivity.
- the degree of the optical reflection of the silver atom is better than the degree of the optical reflection of the aluminum atom, and the reflecting effect of the Ag layer can be not easily influenced and decreased via the plastic material by disposing the bottom layer optical film.
- the thickness of the Ag layer is dAg
- the following condition can be satisfied: 75 nm ⁇ dAg ⁇ 200 nm.
- the reflecting effect of the imaging light can be better via the Ag layer with the proper thickness, and the degree of the reflection of the light wavelengths of the different imaging light bands can be more consistent. Therefore, the better degree of the restored image of the imaging light can be obtained, and the reflecting image can be more delicate, more realistic and gentler. It should be mentioned that the inconsistent thickness of the Ag layer with the excessively thick is easily obtained so that the distortion of the reflecting image is caused.
- the thickness of the bottom layer optical film is db
- the thickness of the top layer optical film is dt
- the following condition can be satisfied: 0.05 ⁇ db/dt ⁇ 1.1.
- the better optical characteristic of the plastic light-folding element can be obtained by the thinner bottom layer optical film.
- the optical characteristic can be the color rendering of the image light, the restoring degree of the image light or the detail of the image light, but the present disclosure is not limited thereto.
- the present disclosure provides an imaging lens assembly module, which includes the aforementioned plastic light-folding element and an optical imaging lens assembly, wherein the plastic light-folding element is disposed on one of an object side and an image side of the optical imaging lens assembly.
- the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees) by the disposition of the plastic light-folding element. Therefore, the volume of the imaging lens assembly module can be effectively reduced.
- the present disclosure provides an electronic device, which includes the aforementioned imaging lens assembly module and an image sensor, wherein the image sensor is disposed on an image surface of the imaging lens assembly module.
- FIG. 1A is a three dimensional view of an electronic device 10 according to the 1st example of the present disclosure.
- FIG. 1B is an exploded view of the electronic device 10 according to the 1st example in FIG. 1A .
- FIG. 1C is another exploded view of the electronic device 10 according to the 1st example in FIG. 1A .
- FIG. 1D is a schematic view of the electronic device 10 according to the 1st example in FIG. 1A .
- the electronic device 10 includes an imaging lens assembly module (its reference numeral is omitted) and an image sensor 180 , wherein the image sensor 180 is disposed on an image surface (its reference numeral is omitted) of the imaging lens assembly module.
- the electronic device 10 further includes a cover 150 , a first driving apparatus (its reference numeral is omitted), a second driving apparatus (its reference numeral is omitted), a carrier 160 and a flexible circuit board 170 , wherein the first driving apparatus includes a first driving member 131 , first magnets 132 , first rolling members 133 , magnetic members 134 and first coils 135 , and the second driving apparatus includes a second driving member 141 , second magnets 142 , a second rolling member 143 , an elastic member 144 and second coils 145 .
- the first driving apparatus and the second driving apparatus are configured to drive the imaging lens assembly module
- the imaging lens assembly module is disposed in the carrier 160
- the flexible circuit board 170 is disposed on a surface of the carrier 160
- the cover 150 is disposed on another surface of the carrier 160 .
- the imaging lens assembly module includes a plastic light-folding element 110 and an optical imaging lens assembly (its reference numeral is omitted), wherein the plastic light-folding element 110 is disposed an object side of the optical imaging lens assembly.
- the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees) by the disposition of the plastic light-folding element 110 . Therefore, the volume of the imaging lens assembly module can be effectively reduced.
- the optical imaging lens assembly in order from the object side to an image side, includes lens elements 121 a , 121 b , 121 c , 121 d and a retainer 123 , and the lens elements 121 a , 121 b , 121 c are disposed in a lens barrel 122 of the optical imaging lens assembly, and the lens element 121 d and the retainer 123 are disposed in the first driving member 131 , wherein the optical features such as numbers, structures, surface shapes and so on of the lens elements can be disposed according to different imaging demand, and the optical features are not limited thereto.
- FIG. 1E is a schematic view of the plastic light-folding element 110 according to the 1st example in FIG. 1A .
- the plastic light-folding element 110 includes an incident surface 111 , an exit surface 112 , a reflective surface 113 and a reflective optical layer 114 .
- the incident surface 111 is configured to lead an imaging light (its reference numeral is omitted) enter the plastic light-folding element 110
- the exit surface 112 is configured to lead the imaging light exit the plastic light-folding element 110
- the reflective surface 113 is configured to fold the imaging light
- the reflective optical layer 114 is disposed on a surface of the reflective surface 113 .
- the plastic light-folding element 110 can be a plastic lens element, and the incident surface 111 has an optical curved surface, but the present disclosure is not limited thereto.
- the reflective optical layer 114 includes an Ag layer 114 a , a bottom layer optical film 114 b and a top layer optical film 114 c , wherein the Ag layer 114 a is configured to lead the imaging light, which enters the incident surface 111 , reflect to the exit surface 112 ; the bottom layer optical film 114 b is directly contacted with the Ag layer 114 a , and the bottom layer optical film 114 b is closer to the reflective surface 113 of the plastic light-folding element 110 than the Ag layer 114 a to the reflective surface 113 of the plastic light-folding element 110 ; a refractive index of the top layer optical film 114 c is lower than a refractive index of the bottom layer optical film 114 b , wherein the top layer optical film 114 c is not directly contacted with the Ag layer 114 a , and the top layer optical film 114 c is farther from the reflective surface 113 of the plastic light-folding element 110 than the Ag layer 114 a from the reflective surface 113
- the plastic light-folding element 110 is an optical element disposing the Ag layer 114 a on the reflective surface 113 made of the plastic material for folding the imaging light.
- the physical adhesion between the Ag layer 114 a and the reflective surface 113 made of the plastic material is enhanced via the bottom layer optical film 114 b , and the higher refractive index can be maintained via the bottom layer optical film 114 b so as to reduce the unnecessary reflection inside the plastic light-folding element 110 to increase the image restoration of the imaging light.
- the plastic light-folding element 110 can further include at least one connecting surface 115 , a gate vestige structure 116 and at least one intermediate layer 117 .
- the connecting surface 115 is connected to the incident surface 111 , the exit surface 112 and the reflective surface 113 .
- the gate vestige structure 116 is disposed on the connecting surface 115 .
- the intermediate layer 117 is disposed between the top layer optical film 114 c and the Ag layer 114 a .
- the injecting efficiency of the injection molding can be enhanced by disposing the gate vestige structure 116 on the connecting surface 115 , and the better optical flatness and the better circular symmetry consistency of the incident surface 111 , the exit surface 112 and the reflective surface 113 can be obtained by simultaneously forming the incident surface 111 , the exit surface 112 and the reflective surface 113 . Furthermore, via the intermediate layer 117 , the Ag layer 114 a can be protected so that the Ag layer 114 a is not easily oxidized, and the ability of the resistant to the corrosion of acid and alkali of the Ag layer 114 a can be enhanced, but the effect of the intermediate layer 117 is not limited thereto. According to the 1st example, a number of the connecting surface 115 is two, a number of the gate vestige structure 116 is one, and a number of the intermediate layer 117 is two.
- the drawing number of the intermediate layer 117 is one, but the real number of the intermediate layer 117 can be two or more, and the present disclosure is not limited thereto.
- the bottom layer optical film 114 b is a metal oxide layer.
- the metal oxide layer includes a metal material, the stronger binding force between the metal oxide layer and the Ag layer 114 a and the stronger binding force between the metal oxide layer and the plastic material can be simultaneously obtained, and hence the binding force between the bottom layer optical film 114 b made of the metal oxide and the metal material is higher than the binding force between the bottom layer optical film made of the non-metal oxide and the metal material. In other words, the better adhesion of the Ag layer 114 a to the plastic material can be obtained via the metal oxide layer.
- the bottom layer optical film 114 b is made of Al 2 O 3
- the top layer optical film 114 c is made of SiO 2 .
- Each of the intermediate layers 117 includes a metal layer excluding a silver atom.
- the surface stability of the Ag layer can be enhanced via the metal layer excluding the silver atom so that the Ag layer is not easily influenced by the external environment, and the combination between the Ag layer and the metal layer excluding the silver atom is better.
- the material of the metal layer can be Ti, Cr, Ni and so on, but the present disclosure is not limited thereto.
- the bottom layer optical film 114 b is directly contacted with the reflective surface 113 of the plastic light-folding element 110 . Therefore, the degree of the optical reflection of the Ag layer 114 a can be enhanced to maintain the higher optical reflectivity. In particular, the degree of the optical reflection of the silver atom is better than the degree of the optical reflection of the aluminum atom, and the reflecting effect of the Ag layer 114 a can be not easily influenced and decreased via the plastic material by disposing the bottom layer optical film 114 b.
- the refractive index of the bottom layer optical film 114 b is Nb
- a thickness of the bottom layer optical film 114 b is db
- the refractive index of the top layer optical film 114 c is Nt
- a thickness of the top layer optical film 114 c is dt
- a refractive index of the Ag layer 114 a is NAg
- a thickness of the Ag layer 114 a is dAg
- the refractive index of the air is 1
- the refractive index of the plastic light-folding element 110 is 1.64678
- a thickness of each of the intermediate layers 117 is less than the thickness of the Ag layer 114 a.
- FIG. 1F is a schematic view of a reflectivity result according to the 1st example in FIG. 1A .
- Table 2 is a reflectivity result according to the 1st example.
- FIG. 2 is a schematic view of an electronic device 20 according to the 2nd example of the present disclosure.
- the electronic device 20 includes an imaging lens assembly module (its reference numeral is omitted) and an image sensor 280 , wherein the image sensor 280 is disposed on an image surface (its reference numeral is omitted) of the imaging lens assembly module.
- the imaging lens assembly module includes plastic light-folding elements 210 , 230 and an optical imaging lens assembly (its reference numeral is omitted), wherein the plastic light-folding element 210 is disposed on an object side of the optical imaging lens assembly, and the plastic light-folding element 230 is disposed on an image side of the optical imaging lens assembly.
- the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees) by the disposition of the plastic light-folding elements 210 , 230 . Therefore, the volume of the imaging lens assembly module can be effectively reduced.
- the optical imaging lens assembly in order from the object side to the image side, includes lens elements 221 a , 221 b , 221 c , 221 d and a retainer 223 , and the lens elements 221 a , 221 b , 221 c are disposed in a lens barrel 222 of the optical imaging lens assembly, and the lens element 221 d and the retainer 223 are disposed in a driving member 224 of the optical imaging lens assembly, wherein the optical features such as numbers, structures, surface shapes and so on of the lens elements can be disposed according to different imaging demand, and the optical features are not limited thereto.
- the plastic light-folding element 210 includes an incident surface 211 , an exit surface 212 , a reflective surface 213 and a reflective optical layer (its reference numeral is omitted), and the plastic light-folding element 230 includes an incident surface 231 , an exit surface 232 , a reflective surface 233 and a reflective optical layer (its reference numeral is omitted).
- the incident surfaces 211 , 231 are configured to lead an imaging light (its reference numeral is omitted) enter the plastic light-folding elements 210 , 230 , respectively.
- the exit surfaces 212 , 232 are configured to lead the imaging light exit the plastic light-folding elements 210 , 230 , respectively.
- the reflective surfaces 213 , 233 are configured to fold the imaging light.
- the reflective optical layers are disposed on surfaces of the reflective surfaces 213 , 233 , respectively.
- the plastic light-folding element 210 can be a plastic lens element, and each of the incident surface 211 and the exit surface 232 has an optical curved surface, but the present disclosure is not limited thereto.
- FIG. 3A is a schematic view of an electronic device 30 according to the 3rd example of the present disclosure.
- the electronic device 30 includes an imaging lens assembly module (its reference numeral is omitted) and an image sensor 380 , wherein the image sensor 380 is disposed on an image surface 381 of the imaging lens assembly module.
- the imaging lens assembly module includes a plastic light-folding element 310 and an optical imaging lens assembly 320 , wherein the plastic light-folding element 310 is disposed an image side of the optical imaging lens assembly 320 .
- the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees). Therefore, the volume of the imaging lens assembly module can be effectively reduced.
- FIG. 3B is a three dimensional view of the plastic light-folding element 310 according to the 3rd example in FIG. 3A .
- FIG. 3C is another three dimensional view of the plastic light-folding element 310 according to the 3rd example in FIG. 3A .
- FIG. 3D is a schematic view of an incident surface 311 and a reflective surface 313 of the plastic light-folding element 310 according to the 3rd example in FIG. 3A .
- the plastic light-folding element 310 includes the incident surface 311 , an exit surface 312 , the reflective surface 313 , a reflective optical layer (its reference numeral is omitted), at least one connecting surface 315 , at least one gate vestige structure 316 and at least one intermediate layer (its reference numeral is omitted).
- the incident surface 311 is configured to lead an imaging light (its reference numeral is omitted) enter the plastic light-folding element 310
- the exit surface 312 is configured to lead the imaging light exit the plastic light-folding element 310
- the reflective surface 313 is configured to fold the imaging light
- the reflective optical layer is disposed on a surface of the reflective surface 313
- the connecting surface 315 is connected to the incident surface 311 , the exit surface 312 and the reflective surface 313
- the gate vestige structure 316 is disposed on the connecting surface 315 .
- a number of the reflective surface 313 is four, a number of the connecting surface 315 is two, a number of the gate vestige structure 316 is two, a number of the intermediate layer is two, one of the reflective surfaces 313 and the incident surface 311 are coplanar, and another one of the reflective surfaces 313 and the exit surface 312 are coplanar, wherein the real number of the intermediate layer can be two or more, but the present disclosure is not limited thereto.
- the reflective optical layer includes an Ag layer (its reference numeral is omitted), a bottom layer optical film (its reference numeral is omitted) and a top layer optical film (its reference numeral is omitted), wherein the Ag layer is configured to lead the imaging light, which enters the incident surface 311 , reflect to the exit surface 312 ; the bottom layer optical film is directly contacted with the Ag layer, and the bottom layer optical film is closer to each of the reflective surfaces 313 of the plastic light-folding element 310 than the Ag layer to each of the reflective surfaces 313 of the plastic light-folding element 310 ; a refractive index of the top layer optical film is lower than a refractive index of the bottom layer optical film, wherein the top layer optical film is not directly contacted with the Ag layer, and the top layer optical film is farther from each of the reflective surfaces 313 of the plastic light-folding element 310 than the Ag layer from each of the reflective surfaces 313 of the plastic light-folding element 310 .
- the bottom layer optical film is made of Al 2 O 3
- the top layer optical film is made of SiO 2 .
- each of the incident surface 311 , the exit surface 312 and the reflective surfaces 313 includes an optical portion (its reference numeral is omitted) and an arc step structure (its reference numeral is omitted), wherein the arc step structure is disposed on a periphery of the optical portion, and an arc is formed by the arc step structure centered on the optical portion.
- the refractive index of the bottom layer optical film is Nb
- a thickness of the bottom layer optical film is db
- the refractive index of the top layer optical film is Nt
- a thickness of the top layer optical film is dt
- a refractive index of the Ag layer is NAg
- a thickness of the Ag layer is dAg
- the refractive index of the air is 1
- the refractive index of the plastic light-folding element 310 is 1.64678
- a thickness of each of the intermediate layers is less than the thickness of the Ag layer.
- FIG. 4A is a schematic view of an electronic device 40 according to the 4th example of the present disclosure.
- FIG. 4B is another schematic view of the electronic device 40 according to the 4th example in FIG. 4A .
- the electronic device 40 according to the 4th example is a smart phone, and includes an imaging lens assembly module (its reference numeral is omitted), an image sensor (not shown) and a user interface 41 , wherein the image sensor is disposed on an image surface (not shown) of the imaging lens assembly module, and the imaging lens assembly module includes an ultra-wide angle camera module 42 , a high resolution camera module 43 and a telephoto camera module 44 , and the user interface 41 is a touch screen, but the present disclosure is not limited thereto.
- the imaging lens assembly module includes a plastic light-folding element (not shown) and an optical imaging lens assembly (not shown), wherein the plastic light-folding element is disposed on one of an object side and an image side of the optical imaging lens assembly.
- the telephoto camera module 44 can be one of the imaging lens assembly modules according to the aforementioned 1st example to the 3rd example, but the present disclosure is not limited thereto. Therefore, it is favorable for satisfying the requirements of the mass production and the appearance of the imaging lens assembly module mounted on the electronic devices according to the current marketplace of the electronic device.
- users enter a shooting mode via the user interface 41 wherein the user interface 41 is configured to display the scene and have the touch function, and the shooting angle can be manually adjusted to switch the ultra-wide angle camera module 42 , the high resolution camera module 43 and the telephoto camera module 44 .
- the imaging light is gathered on the image sensor via the imaging lens assembly module, and an electronic signal about an image is output to an image signal processor (ISP) 45 .
- ISP image signal processor
- the electronic device 40 can further include an optical anti-shake mechanism (not shown). Furthermore, the electronic device 40 can further include at least one focusing assisting module (its reference numeral is omitted) and at least one sensing element (not shown).
- the focusing assisting module can be a flash module 46 for compensating a color temperature, an infrared distance measurement component, a laser focus module and so on.
- the sensing element can have functions for sensing physical momentum and kinetic energy, such as an accelerator, a gyroscope, a Hall Effect Element, to sense shaking or jitters applied by hands of the users or external environments.
- the electronic device 40 equipped with an auto-focusing mechanism and the optical anti-shake mechanism can be enhanced to achieve the superior image quality.
- the electronic device 40 according to the present disclosure can have a capturing function with multiple modes, such as taking optimized selfies, high dynamic range (HDR) under a low light condition, 4K resolution recording and so on.
- the users can visually see a captured image of the camera through the user interface 41 and manually operate the view finding range on the user interface 41 to achieve the autofocus function of what you see is what you get.
- the imaging lens assembly module, the image sensor, the optical anti-shake mechanism, the sensing element and the focusing assisting module can be disposed on a flexible printed circuit board (FPC) (not shown) and electrically connected to the associated components, such as the imaging signal processor 45 , via a connector (not shown) to perform a capturing process.
- FPC flexible printed circuit board
- the way of firstly disposing the imaging lens assembly module and related components on the flexible printed circuit board and secondly integrating the circuit thereof into the main board of the electronic device via the connector can satisfy the requirements of the mechanical design and the circuit layout of the limited space inside the electronic device, and obtain more margins.
- the electronic device 40 includes a plurality of sensing elements and a plurality of focusing assisting modules.
- the sensing elements and the focusing assisting modules are disposed on the flexible printed circuit board and at least one other flexible printed circuit board (not shown) and electrically connected to the associated components, such as the image signal processor 45 , via corresponding connectors to perform the capturing process.
- the sensing elements and the focusing assisting modules can also be disposed on the main board of the electronic device or carrier boards of other types according to requirements of the mechanical design and the circuit layout.
- the electronic device 40 can further include, but not be limited to, a display, a control unit, a storage unit, a random access memory (RAM), a read-only memory (ROM), or the combination thereof.
- FIG. 4C is a schematic view of an image according to the 4th example in FIG. 4A .
- the larger range of the image can be captured via the ultra-wide angle camera module 42 , and the ultra-wide angle camera module 42 has the function of accommodating more wide range of the scene.
- FIG. 4D is another schematic view of an image according to the 4th example in FIG. 4A .
- the image of the certain range with the high resolution can be captured via the high resolution camera module 43 , and the high resolution camera module 43 has the function of the high resolution and the low deformation.
- FIG. 4E is still another schematic view of an image according to the 4th example in FIG. 4A .
- the telephoto camera module 44 has the enlarging function of the high magnification, and the distant image can be captured and enlarged with high magnification via the telephoto camera module 44 .
- the zooming function can be obtained via the electronic device 40 , when the scene is captured via the imaging lens assembly module with different focal lengths cooperated with the function of image processing.
- FIG. 5 is a schematic view of an electronic device 50 according to the 5th example of the present disclosure.
- the electronic device 50 is a smart phone, and includes an imaging lens assembly module (its reference numeral is omitted) and an image sensor (not shown), wherein the image sensor is disposed on an image surface (not shown) of the imaging lens assembly module, and the imaging lens assembly module includes ultra-wide angle camera modules 511 , 512 , wide angle camera modules 513 , 514 , telephoto camera modules 515 , 516 , 517 , 518 and a Time-Of-Flight (TOF) module 519 .
- the TOF module 519 can be another type of the imaging apparatus, and the disposition is not limited thereto.
- the telephoto camera modules 515 , 516 , 517 , 518 can be one of the imaging lens assembly modules according to the aforementioned 1st example to the 3rd example, but the present disclosure is not limited thereto. Therefore, it is favorable for satisfying the requirements of the mass production and the appearance of the imaging lens assembly module mounted on the electronic devices according to the current marketplace of the electronic device.
- telephoto camera modules 517 , 518 are configured to fold the light, but the present disclosure is not limited thereto.
- the electronic device 50 can further include an optical anti-shake mechanism (not shown). Furthermore, the electronic device 50 can further include at least one focusing assisting module (not shown) and at least one sensing element (not shown).
- the focusing assisting module can be a flash module 520 for compensating a color temperature, an infrared distance measurement component, a laser focus module and so on.
- the sensing element can have functions for sensing physical momentum and kinetic energy, such as an accelerator, a gyroscope, a Hall Effect Element, to sense shaking or jitters applied by hands of the users or external environments. Accordingly, the electronic device 50 equipped with an auto-focusing mechanism and the optical anti-shake mechanism can be enhanced to achieve the superior image quality.
- the electronic device 50 according to the present disclosure can have a capturing function with multiple modes, such as taking optimized selfies, High Dynamic Range (HDR) under a low light condition, 4K Resolution recording and so on.
- HDR High Dynamic Range
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Abstract
A plastic light-folding element includes an incident surface, an exit surface, a reflective surface and a reflective optical layer. The incident surface and the exit surface are configured to lead an imaging light enter and exit the plastic light-folding element, respectively. The reflective surface is configured to fold the imaging light. The reflective optical layer is disposed on the reflective surface, and includes an Ag layer, a bottom layer optical film and a top layer optical film. The bottom layer optical film is contacted with the Ag layer, and the bottom layer optical film is closer to the reflective surface than the Ag layer to the reflective surface. A refractive index of the top layer optical film is lower than a refractive index of the bottom layer optical film, and the top layer optical film is not contacted with the Ag layer.
Description
- This application claims priority to U.S. Provisional Application Ser. No. 63/191,366, filed May 21, 2021 and Taiwan Application Serial Number 110130558, filed Aug. 18, 2021, which are herein incorporated by reference.
- The present disclosure relates to a plastic light-folding element and an imaging lens assembly module. More particularly, the present disclosure relates to a plastic light-folding element and an imaging lens assembly module applicable to portable electronic devices.
- In recent years, portable electronic devices have developed rapidly. For example, intelligent electronic devices and tablets have been filled in the lives of modern people, and imaging lens assembly modules and plastic light-folding elements thereof mounted on portable electronic devices have also prospered. However, as technology advances, the quality requirements of the plastic light-folding elements are becoming higher and higher. Therefore, a plastic light-folding element, which can enhance the degree of the image restoration, needs to be developed.
- According to one aspect of the present disclosure, a plastic light-folding element includes an incident surface, an exit surface, a reflective surface and a reflective optical layer. The incident surface is configured to lead an imaging light enter the plastic light-folding element. The exit surface is configured to lead the imaging light exit the plastic light-folding element. The reflective surface is configured to fold the imaging light. The reflective optical layer is disposed on a surface of the reflective surface. The reflective optical layer includes an Ag layer, a bottom layer optical film and a top layer optical film. The Ag layer is configured to lead the imaging light, which enters the incident surface, reflect to the exit surface. The bottom layer optical film is directly contacted with the Ag layer, and the bottom layer optical film is closer to the reflective surface of the plastic light-folding element than the Ag layer to the reflective surface of the plastic light-folding element. A refractive index of the top layer optical film is lower than a refractive index of the bottom layer optical film, wherein the top layer optical film is not directly contacted with the Ag layer, and the top layer optical film is farther from the reflective surface of the plastic light-folding element than the Ag layer from the reflective surface of the plastic light-folding element. When the refractive index of the bottom layer optical film is Nb, a thickness of the bottom layer optical film is db, the refractive index of the top layer optical film is Nt, a thickness of the top layer optical film is dt, a thickness of the Ag layer is dAg, and the following conditions are satisfied: 1.4<Nt<Nb<2.1; 1.6<Nb<2.1; 1.4<Nt<1.58; 0.05<db/dAg<1.2; and 0.2<dAg/dt<3.5.
- According to one aspect of the present disclosure, an imaging lens assembly module includes the plastic light-folding element of the aforementioned aspect and an optical imaging lens assembly, wherein the plastic light-folding element is disposed on one of an object side and an image side of the optical imaging lens assembly.
- According to one aspect of the present disclosure, an electronic device includes the imaging lens assembly module of the aforementioned aspect and an image sensor, wherein the image sensor is disposed on an image surface of the imaging lens assembly module.
-
FIG. 1A is a three dimensional view of an electronic device according to the 1st example of the present disclosure. -
FIG. 1B is an exploded view of the electronic device according to the 1st example inFIG. 1A . -
FIG. 1C is another exploded view of the electronic device according to the 1st example inFIG. 1A . -
FIG. 1D is a schematic view of the electronic device according to the 1st example inFIG. 1A . -
FIG. 1E is a schematic view of the plastic light-folding element according to the 1st example inFIG. 1A . -
FIG. 1F is a schematic view of a reflectivity result according to the 1st example inFIG. 1A . -
FIG. 2 is a schematic view of an electronic device according to the 2nd example of the present disclosure. -
FIG. 3A is a schematic view of an electronic device according to the 3rd example of the present disclosure. -
FIG. 3B is a three dimensional view of the plastic light-folding element according to the 3rd example inFIG. 3A . -
FIG. 3C is another three dimensional view of the plastic light-folding element according to the 3rd example inFIG. 3A . -
FIG. 3D is a schematic view of an incident surface and a reflective surface of the plastic light-folding element according to the 3rd example inFIG. 3A . -
FIG. 4A is a schematic view of an electronic device according to the 4th example of the present disclosure. -
FIG. 4B is another schematic view of the electronic device according to the 4th example inFIG. 4A . -
FIG. 4C is a schematic view of an image according to the 4th example inFIG. 4A . -
FIG. 4D is another schematic view of an image according to the 4th example inFIG. 4A . -
FIG. 4E is still another schematic view of an image according to the 4th example inFIG. 4A . -
FIG. 5 is a schematic view of an electronic device according to the 5th example of the present disclosure. - The present disclosure provides a plastic light-folding element, and the plastic light-folding element includes an incident surface, an exit surface, a reflective surface and a reflective optical layer. The incident surface is configured to lead an imaging light enter the plastic light-folding element. The exit surface is configured to lead the imaging light exit the plastic light-folding element. The reflective surface is configured to fold the imaging light. The reflective optical layer is disposed on a surface of the reflective surface, and the reflective optical layer includes an Ag layer, a bottom layer optical film and a top layer optical film. The Ag layer is configured to lead the imaging light, which enters the incident surface, reflect to the exit surface. The bottom layer optical film is directly contacted with the Ag layer, and the bottom layer optical film is closer to the reflective surface of the plastic light-folding element than the Ag layer to the reflective surface of the plastic light-folding element. A refractive index of the top layer optical film is lower than a refractive index of the bottom layer optical film, wherein the top layer optical film is not directly contacted with the Ag layer, and the top layer optical film is farther from the reflective surface of the plastic light-folding element than the Ag layer from the reflective surface of the plastic light-folding element. When the refractive index of the bottom layer optical film is Nb, a thickness of the bottom layer optical film is db, the refractive index of the top layer optical film is Nt, a thickness of the top layer optical film is dt, and a thickness of the Ag layer is dAg, the following conditions are satisfied: 1.4<Nt<Nb<2.1; 1.6<Nb<2.1; 1.4<Nt<1.58; 0.05<db/dAg<1.2; and 0.2<dAg/dt<3.5.
- In particular, the plastic light-folding element of the present disclosure is an optical element disposing the Ag layer on the reflective surface made of a plastic material for folding the imaging light. The physical adhesion between the Ag layer and the reflective surface made of the plastic material is enhanced via the bottom layer optical film, and the higher refractive index can be maintained via the bottom layer optical film so as to reduce the unnecessary reflection inside the plastic light-folding element to increase the image restoration of the imaging light.
- The plastic light-folding element can further include a connecting surface and a gate vestige structure. The connecting surface is connected to the incident surface, the exit surface and the reflective surface. The gate vestige structure is disposed on the connecting surface. The injecting efficiency of the injection molding can be enhanced by disposing the gate vestige structure on the connecting surface, and the better optical flatness and the better circular symmetry consistency of the incident surface, the exit surface and the reflective surface can be obtained by simultaneously forming the incident surface, the exit surface and the reflective surface.
- The bottom layer optical film can be a metal oxide layer. In particular, the metal oxide layer includes a metal material, the stronger binding force between the metal oxide layer and the Ag layer and the stronger binding force between the metal oxide layer and the plastic material can be simultaneously obtained, and hence the binding force between the bottom layer optical film made of the metal oxide and the metal material is higher than the binding force between the bottom layer optical film made of the non-metal oxide and the metal material. In other words, the better adhesion of the Ag layer to the plastic material can be obtained via the metal oxide layer. It should be mentioned that an ordinary adhesive test is to stick the tape on a surface of the optical layer and then tear off the tape to check the surface condition of the optical layer, and the quality of the adhesion is determined via the surface condition of the optical layer, wherein the more serious test condition can be obtained by increasing the numbers of sticking and tearing off the tape, but the present disclosure is not limited thereto. In particular, the bottom layer optical film can be made of Al2O3, the top layer optical film can be made of a non-metal oxide, such as SiO2.
- The plastic light-folding element can further include at least one intermediate layer, wherein the intermediate layer is disposed between the top layer optical film and the Ag layer. Via the intermediate layer, the Ag layer can be protected so that the Ag layer is not easily oxidized, and the ability of the resistant to the corrosion of acid and alkali of the Ag layer can be enhanced, but the effect of the intermediate layer is not limited thereto.
- The intermediate layer can include a metal layer excluding a silver atom. In particular, the material of the metal layer can be Ti, Cr, Ni and so on, but the present disclosure is not limited thereto. The surface stability of the Ag layer can be enhanced via the metal layer excluding the silver atom so that the Ag layer is not easily influenced by the external environment, and the combination between the Ag layer and the metal layer excluding the silver atom is better.
- The bottom layer optical film can be directly contacted with the reflective surface of the plastic light-folding element. Therefore, the degree of the optical reflection of the Ag layer can be enhanced to maintain the higher optical reflectivity. In particular, the degree of the optical reflection of the silver atom is better than the degree of the optical reflection of the aluminum atom, and the reflecting effect of the Ag layer can be not easily influenced and decreased via the plastic material by disposing the bottom layer optical film.
- When the thickness of the Ag layer is dAg, the following condition can be satisfied: 75 nm<dAg<200 nm. The reflecting effect of the imaging light can be better via the Ag layer with the proper thickness, and the degree of the reflection of the light wavelengths of the different imaging light bands can be more consistent. Therefore, the better degree of the restored image of the imaging light can be obtained, and the reflecting image can be more delicate, more realistic and gentler. It should be mentioned that the inconsistent thickness of the Ag layer with the excessively thick is easily obtained so that the distortion of the reflecting image is caused.
- When the thickness of the bottom layer optical film is db, and the thickness of the top layer optical film is dt, the following condition can be satisfied: 0.05<db/dt<1.1. The better optical characteristic of the plastic light-folding element can be obtained by the thinner bottom layer optical film. In particular, the optical characteristic can be the color rendering of the image light, the restoring degree of the image light or the detail of the image light, but the present disclosure is not limited thereto.
- When a lowest reflectivity of a reflectivity of the reflective optical layer between wavelengths of 540 nm to 590 nm is R5459, the following condition can be satisfied: 94.0%<R5459<99.99%. By the high reflectivity of the visible light band, the authenticity of the image can be faithfully presented, and the addition loss of the original light by the plastic light-folding element can be reduced to enhance the imaging quality.
- Each of the aforementioned features of the plastic light-folding element can be utilized in various combinations for achieving the corresponding effects.
- The present disclosure provides an imaging lens assembly module, which includes the aforementioned plastic light-folding element and an optical imaging lens assembly, wherein the plastic light-folding element is disposed on one of an object side and an image side of the optical imaging lens assembly. In particular, the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees) by the disposition of the plastic light-folding element. Therefore, the volume of the imaging lens assembly module can be effectively reduced.
- The present disclosure provides an electronic device, which includes the aforementioned imaging lens assembly module and an image sensor, wherein the image sensor is disposed on an image surface of the imaging lens assembly module.
- According to the aforementioned embodiment, specific examples are provided, and illustrated via figures.
- <1st Example>
-
FIG. 1A is a three dimensional view of anelectronic device 10 according to the 1st example of the present disclosure.FIG. 1B is an exploded view of theelectronic device 10 according to the 1st example inFIG. 1A .FIG. 1C is another exploded view of theelectronic device 10 according to the 1st example inFIG. 1A .FIG. 1D is a schematic view of theelectronic device 10 according to the 1st example inFIG. 1A . InFIGS. 1A to 1D , theelectronic device 10 includes an imaging lens assembly module (its reference numeral is omitted) and animage sensor 180, wherein theimage sensor 180 is disposed on an image surface (its reference numeral is omitted) of the imaging lens assembly module. - Moreover, the
electronic device 10 further includes acover 150, a first driving apparatus (its reference numeral is omitted), a second driving apparatus (its reference numeral is omitted), acarrier 160 and aflexible circuit board 170, wherein the first driving apparatus includes afirst driving member 131,first magnets 132, first rollingmembers 133,magnetic members 134 andfirst coils 135, and the second driving apparatus includes asecond driving member 141,second magnets 142, a second rollingmember 143, anelastic member 144 andsecond coils 145. In particular, the first driving apparatus and the second driving apparatus are configured to drive the imaging lens assembly module, the imaging lens assembly module is disposed in thecarrier 160, theflexible circuit board 170 is disposed on a surface of thecarrier 160, and thecover 150 is disposed on another surface of thecarrier 160. - The imaging lens assembly module includes a plastic light-
folding element 110 and an optical imaging lens assembly (its reference numeral is omitted), wherein the plastic light-folding element 110 is disposed an object side of the optical imaging lens assembly. In particular, the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees) by the disposition of the plastic light-folding element 110. Therefore, the volume of the imaging lens assembly module can be effectively reduced. - In
FIG. 1D , the optical imaging lens assembly, in order from the object side to an image side, includeslens elements retainer 123, and thelens elements lens barrel 122 of the optical imaging lens assembly, and thelens element 121 d and theretainer 123 are disposed in the first drivingmember 131, wherein the optical features such as numbers, structures, surface shapes and so on of the lens elements can be disposed according to different imaging demand, and the optical features are not limited thereto. -
FIG. 1E is a schematic view of the plastic light-folding element 110 according to the 1st example inFIG. 1A . InFIGS. 1A to 1E , the plastic light-folding element 110 includes anincident surface 111, anexit surface 112, areflective surface 113 and a reflectiveoptical layer 114. In detail, theincident surface 111 is configured to lead an imaging light (its reference numeral is omitted) enter the plastic light-folding element 110, theexit surface 112 is configured to lead the imaging light exit the plastic light-folding element 110, thereflective surface 113 is configured to fold the imaging light, and the reflectiveoptical layer 114 is disposed on a surface of thereflective surface 113. According to the 1st example, the plastic light-folding element 110 can be a plastic lens element, and theincident surface 111 has an optical curved surface, but the present disclosure is not limited thereto. - The reflective
optical layer 114 includes anAg layer 114 a, a bottom layeroptical film 114 b and a top layeroptical film 114 c, wherein theAg layer 114 a is configured to lead the imaging light, which enters theincident surface 111, reflect to theexit surface 112; the bottom layeroptical film 114 b is directly contacted with theAg layer 114 a, and the bottom layeroptical film 114 b is closer to thereflective surface 113 of the plastic light-folding element 110 than theAg layer 114 a to thereflective surface 113 of the plastic light-folding element 110; a refractive index of the top layeroptical film 114 c is lower than a refractive index of the bottom layeroptical film 114 b, wherein the top layeroptical film 114 c is not directly contacted with theAg layer 114 a, and the top layeroptical film 114 c is farther from thereflective surface 113 of the plastic light-folding element 110 than theAg layer 114 a from thereflective surface 113 of the plastic light-folding element 110. - In particular, the plastic light-
folding element 110 is an optical element disposing theAg layer 114 a on thereflective surface 113 made of the plastic material for folding the imaging light. The physical adhesion between theAg layer 114 a and thereflective surface 113 made of the plastic material is enhanced via the bottom layeroptical film 114 b, and the higher refractive index can be maintained via the bottom layeroptical film 114 b so as to reduce the unnecessary reflection inside the plastic light-folding element 110 to increase the image restoration of the imaging light. - In
FIGS. 1B and 1E , the plastic light-folding element 110 can further include at least one connectingsurface 115, agate vestige structure 116 and at least oneintermediate layer 117. The connectingsurface 115 is connected to theincident surface 111, theexit surface 112 and thereflective surface 113. Thegate vestige structure 116 is disposed on the connectingsurface 115. Theintermediate layer 117 is disposed between the top layeroptical film 114 c and theAg layer 114 a. The injecting efficiency of the injection molding can be enhanced by disposing thegate vestige structure 116 on the connectingsurface 115, and the better optical flatness and the better circular symmetry consistency of theincident surface 111, theexit surface 112 and thereflective surface 113 can be obtained by simultaneously forming theincident surface 111, theexit surface 112 and thereflective surface 113. Furthermore, via theintermediate layer 117, theAg layer 114 a can be protected so that theAg layer 114 a is not easily oxidized, and the ability of the resistant to the corrosion of acid and alkali of theAg layer 114 a can be enhanced, but the effect of theintermediate layer 117 is not limited thereto. According to the 1st example, a number of the connectingsurface 115 is two, a number of thegate vestige structure 116 is one, and a number of theintermediate layer 117 is two. - It should be mentioned that the drawing number of the
intermediate layer 117 is one, but the real number of theintermediate layer 117 can be two or more, and the present disclosure is not limited thereto. - The bottom layer
optical film 114 b is a metal oxide layer. In particular, the metal oxide layer includes a metal material, the stronger binding force between the metal oxide layer and theAg layer 114 a and the stronger binding force between the metal oxide layer and the plastic material can be simultaneously obtained, and hence the binding force between the bottom layeroptical film 114 b made of the metal oxide and the metal material is higher than the binding force between the bottom layer optical film made of the non-metal oxide and the metal material. In other words, the better adhesion of theAg layer 114 a to the plastic material can be obtained via the metal oxide layer. It should be mentioned that an ordinary adhesive test is to stick the tape on a surface of the optical layer and then tear off the tape to check the surface condition of the optical layer, and the quality of the adhesion is determined via the surface condition of the optical layer, wherein the serious test condition can be obtained by increasing the numbers of sticking and tearing off the tape, but the present disclosure is not limited thereto. According to the 1st example, the bottom layeroptical film 114 b is made of Al2O3, and the top layeroptical film 114 c is made of SiO2. - Each of the
intermediate layers 117 includes a metal layer excluding a silver atom. The surface stability of the Ag layer can be enhanced via the metal layer excluding the silver atom so that the Ag layer is not easily influenced by the external environment, and the combination between the Ag layer and the metal layer excluding the silver atom is better. In particular, the material of the metal layer can be Ti, Cr, Ni and so on, but the present disclosure is not limited thereto. - The bottom layer
optical film 114 b is directly contacted with thereflective surface 113 of the plastic light-folding element 110. Therefore, the degree of the optical reflection of theAg layer 114 a can be enhanced to maintain the higher optical reflectivity. In particular, the degree of the optical reflection of the silver atom is better than the degree of the optical reflection of the aluminum atom, and the reflecting effect of theAg layer 114 a can be not easily influenced and decreased via the plastic material by disposing the bottom layeroptical film 114 b. - When the refractive index of the bottom layer
optical film 114 b is Nb, a thickness of the bottom layeroptical film 114 b is db, the refractive index of the top layeroptical film 114 c is Nt, a thickness of the top layeroptical film 114 c is dt, a refractive index of theAg layer 114 a is NAg, and a thickness of theAg layer 114 a is dAg, the following conditions of the Table 1 are satisfied. -
TABLE 1 1st example Nb 1.6726 db (nm) 20 Nt 1.4618 dt (nm) 65 NAg 0.051 dAg (nm) 100 - It should be mentioned that the refractive index of the air is 1, the refractive index of the plastic light-
folding element 110 is 1.64678, and a thickness of each of theintermediate layers 117 is less than the thickness of theAg layer 114 a. -
FIG. 1F is a schematic view of a reflectivity result according to the 1st example inFIG. 1A . Table 2 is a reflectivity result according to the 1st example. -
TABLE 2 wavelength (nm) reflectivity (%) 380 92.88095 381 92.86194 382 92.84323 383 92.82481 384 92.80669 385 92.78886 386 92.77169 387 92.75479 388 92.73817 389 92.72181 390 92.70572 391 92.6899 392 92.67434 393 92.65904 394 92.64399 395 92.6292 396 92.61466 397 92.60037 398 92.58631 399 92.57251 400 92.55895 401 92.6218 402 92.71196 403 92.79902 404 92.86623 405 92.92973 406 93.01429 407 93.08696 408 93.15476 409 93.22368 410 93.29611 411 93.37138 412 93.43712 413 93.51066 414 93.57662 415 93.64599 416 93.71353 417 93.78017 418 93.84982 419 93.91608 420 93.98196 421 94.05391 422 94.11569 423 94.17811 424 94.24311 425 94.30622 426 94.37049 427 94.43313 428 94.49608 429 94.55893 430 94.61788 431 94.68102 432 94.74079 433 94.79897 434 94.86155 435 94.91983 436 94.97828 437 95.03615 438 95.09356 439 95.15109 440 95.20763 441 95.26249 442 95.32109 443 95.37639 444 95.43024 445 95.48506 446 95.54042 447 95.59198 448 95.64536 449 95.69852 450 95.75127 451 95.77848 452 95.80676 453 95.83338 454 95.86246 455 95.88948 456 95.91631 457 95.94362 458 95.96984 459 95.9968 460 96.02327 461 96.04878 462 96.07622 463 96.10215 464 96.12655 465 96.15248 466 96.17751 467 96.20257 468 96.22835 469 96.25341 470 96.27808 471 96.30277 472 96.32669 473 96.35085 474 96.37608 475 96.3987 476 96.4226 477 96.44644 478 96.46936 479 96.4925 480 96.51593 481 96.53862 482 96.56162 483 96.58405 484 96.60665 485 96.62932 486 96.65138 487 96.67279 488 96.69484 489 96.71672 490 96.73787 491 96.75943 492 96.78084 493 96.80189 494 96.82331 495 96.84414 496 96.86485 497 96.88529 498 96.9058 499 96.92585 500 96.94614 501 96.95403 502 96.96276 503 96.97102 504 96.97887 505 96.987 506 96.99552 507 97.00351 508 97.01161 509 97.01959 510 97.02776 511 97.03577 512 97.0435 513 97.05177 514 97.05945 515 97.06723 516 97.07502 517 97.08307 518 97.09087 519 97.09856 520 97.10637 521 97.11406 522 97.12172 523 97.12935 524 97.13686 525 97.14451 526 97.15197 527 97.15956 528 97.16702 529 97.1744 530 97.18201 531 97.18959 532 97.19693 533 97.20424 534 97.21165 535 97.21893 536 97.22616 537 97.23347 538 97.24069 539 97.24789 540 97.25507 541 97.26222 542 97.26933 543 97.27646 544 97.28353 545 97.29051 546 97.29762 547 97.30452 548 97.31151 549 97.3185 550 97.32532 551 97.3317 552 97.33801 553 97.34424 554 97.35054 555 97.35677 556 97.36297 557 97.3692 558 97.37532 559 97.3815 560 97.38758 561 97.39369 562 97.39979 563 97.40586 564 97.41191 565 97.41795 566 97.42395 567 97.42994 568 97.43589 569 97.44183 570 97.44776 571 97.45365 572 97.45954 573 97.4654 574 97.47123 575 97.47704 576 97.48284 577 97.48861 578 97.49437 579 97.50011 580 97.50582 581 97.51151 582 97.51718 583 97.52284 584 97.52848 585 97.53409 586 97.53969 587 97.54527 588 97.55082 589 97.55638 590 97.56187 591 97.56738 592 97.57285 593 97.57832 594 97.58374 595 97.58918 596 97.59457 597 97.59995 598 97.60531 599 97.61067 600 97.61598 601 97.61791 602 97.61987 603 97.62181 604 97.62378 605 97.62574 606 97.62776 607 97.62964 608 97.63166 609 97.63365 610 97.63568 611 97.6377 612 97.63972 613 97.64172 614 97.64372 615 97.64581 616 97.64788 617 97.64988 618 97.65198 619 97.65404 620 97.65608 621 97.6582 622 97.66026 623 97.66242 624 97.66447 625 97.6665 626 97.66864 627 97.67075 628 97.67282 629 97.67486 630 97.67703 631 97.67912 632 97.68129 633 97.68341 634 97.68553 635 97.68773 636 97.6898 637 97.69189 638 97.69413 639 97.69624 640 97.69838 641 97.70052 642 97.70271 643 97.70492 644 97.70698 645 97.70915 646 97.71131 647 97.71355 648 97.71569 649 97.71783 650 97.7201 651 97.7248 652 97.72953 653 97.73418 654 97.73895 655 97.74347 656 97.74824 657 97.75285 658 97.75745 659 97.76207 660 97.76665 661 97.77129 662 97.77568 663 97.78039 664 97.78488 665 97.78938 666 97.79385 667 97.79835 668 97.80278 669 97.80724 670 97.81164 671 97.81608 672 97.82047 673 97.82499 674 97.82919 675 97.83356 676 97.83794 677 97.84223 678 97.84665 679 97.8509 680 97.85517 681 97.85935 682 97.86372 683 97.86791 684 97.87209 685 97.87644 686 97.88042 687 97.88473 688 97.88885 689 97.89285 690 97.89718 691 97.90112 692 97.90534 693 97.90941 694 97.91344 695 97.91744 696 97.92157 697 97.92559 698 97.92974 699 97.93355 700 97.9375 701 97.94164 702 97.94578 703 97.94993 704 97.95395 705 97.95823 706 97.96229 707 97.96615 708 97.97025 709 97.97426 710 97.97814 711 97.98222 712 97.98633 713 97.99027 714 97.99426 715 97.99808 716 98.00194 717 98.00593 718 98.00982 719 98.01382 720 98.01767 721 98.02146 722 98.0254 723 98.02911 724 98.03285 725 98.03685 726 98.04048 727 98.04435 728 98.04789 729 98.05155 730 98.05551 731 98.05912 732 98.0628 733 98.06649 734 98.07038 735 98.07401 736 98.07774 737 98.08132 738 98.0849 739 98.08864 740 98.09204 741 98.09587 742 98.09918 743 98.10295 744 98.10648 745 98.10989 746 98.11354 747 98.11677 748 98.12041 749 98.12405 750 98.12733 751 98.1283 752 98.12883 753 98.12947 754 98.13053 755 98.13129 756 98.13211 757 98.13278 758 98.13417 759 98.13471 760 98.13531 761 98.13634 762 98.13677 763 98.13797 764 98.13857 765 98.13929 766 98.14027 767 98.14106 768 98.14193 769 98.14279 770 98.14357 771 98.14444 772 98.14547 773 98.14606 774 98.14698 775 98.14778 776 98.14869 777 98.14976 778 98.15024 779 98.15114 780 98.15214 781 98.15301 782 98.15388 783 98.15475 784 98.15563 785 98.15651 786 98.15739 787 98.15827 788 98.15916 789 98.16005 790 98.16094 791 98.16184 792 98.16273 793 98.16363 794 98.16454 795 98.16544 796 98.16635 797 98.16726 798 98.16817 799 98.16908 800 98.17 801 98.17092 802 98.17184 803 98.17276 804 98.17369 805 98.17461 806 98.17554 807 98.17647 808 98.17741 809 98.17834 810 98.17928 811 98.18022 812 98.18116 813 98.18211 814 98.18305 815 98.184 816 98.18495 817 98.18589 818 98.18684 819 98.1878 820 98.18875 821 98.1897 822 98.19066 823 98.19162 824 98.19258 825 98.19354 826 98.19451 827 98.19547 828 98.19644 829 98.1974 830 98.19837 831 98.19935 832 98.20032 833 98.20129 834 98.20227 835 98.20324 836 98.20422 837 98.2052 838 98.20618 839 98.20716 840 98.20815 841 98.20913 842 98.21012 843 98.21111 844 98.21209 845 98.21308 846 98.21408 847 98.21507 848 98.21606 849 98.21706 850 98.21805 851 98.22043 852 98.22281 853 98.22518 854 98.22754 855 98.2299 856 98.23225 857 98.2346 858 98.23694 859 98.23927 860 98.2416 861 98.24393 862 98.24624 863 98.24855 864 98.25085 865 98.25315 866 98.25545 867 98.25773 868 98.26001 869 98.26229 870 98.26456 871 98.26683 872 98.26908 873 98.27134 874 98.27359 875 98.27583 876 98.27807 877 98.2803 878 98.28252 879 98.28474 880 98.28696 881 98.28917 882 98.29137 883 98.29357 884 98.29577 885 98.29796 886 98.30014 887 98.30232 888 98.30449 889 98.30666 890 98.30882 891 98.31098 892 98.31313 893 98.31527 894 98.31742 895 98.31955 896 98.32168 897 98.32381 898 98.32593 899 98.32805 900 98.33016 901 98.33195 902 98.33374 903 98.33552 904 98.3373 905 98.33908 906 98.34085 907 98.34262 908 98.34438 909 98.34614 910 98.3479 911 98.34965 912 98.35141 913 98.35315 914 98.3549 915 98.35664 916 98.35837 917 98.36011 918 98.36184 919 98.36356 920 98.36529 921 98.36701 922 98.36872 923 98.37043 924 98.37214 925 98.37385 926 98.37555 927 98.37725 928 98.37894 929 98.38063 930 98.38232 931 98.38401 932 98.38569 933 98.38737 934 98.38904 935 98.39071 936 98.39238 937 98.39405 938 98.39571 939 98.39737 940 98.39902 941 98.40067 942 98.40232 943 98.40396 944 98.40561 945 98.40724 946 98.40888 947 98.41051 948 98.41214 949 98.41376 950 98.41539 951 98.41241 952 98.40944 953 98.40648 954 98.40354 955 98.4006 956 98.39768 957 98.39477 958 98.39187 959 98.38898 960 98.3861 961 98.38323 962 98.38037 963 98.37752 964 98.37469 965 98.37186 966 98.36904 967 98.36624 968 98.36345 969 98.36066 970 98.35789 971 98.35513 972 98.35238 973 98.34964 974 98.34691 975 98.34419 976 98.34148 977 98.33879 978 98.3361 979 98.33342 980 98.33075 981 98.32809 982 98.32545 983 98.32281 984 98.32018 985 98.31756 986 98.31495 987 98.31235 988 98.30977 989 98.30719 990 98.30462 991 98.30206 992 98.29951 993 98.29697 994 98.29444 995 98.29192 996 98.28941 997 98.28691 998 98.28442 999 98.28193 1000 98.27946 1001 98.27847 1002 98.27748 1003 98.2765 1004 98.27554 1005 98.27457 1006 98.27362 1007 98.27268 1008 98.27174 1009 98.27081 1010 98.26989 1011 98.26897 1012 98.26807 1013 98.26717 1014 98.26628 1015 98.2654 1016 98.26452 1017 98.26366 1018 98.2628 1019 98.26194 1020 98.2611 1021 98.26026 1022 98.25943 1023 98.25861 1024 98.2578 1025 98.25699 1026 98.25619 1027 98.25539 1028 98.25461 1029 98.25383 1030 98.25306 1031 98.25229 1032 98.25154 1033 98.25078 1034 98.25004 1035 98.2493 1036 98.24857 1037 98.24785 1038 98.24713 1039 98.24642 1040 98.24572 1041 98.24502 1042 98.24433 1043 98.24365 1044 98.24297 1045 98.2423 1046 98.24164 1047 98.24098 1048 98.24033 1049 98.23969 1050 98.23905 - <2nd Example>
-
FIG. 2 is a schematic view of anelectronic device 20 according to the 2nd example of the present disclosure. InFIG. 2 , theelectronic device 20 includes an imaging lens assembly module (its reference numeral is omitted) and animage sensor 280, wherein theimage sensor 280 is disposed on an image surface (its reference numeral is omitted) of the imaging lens assembly module. - The imaging lens assembly module includes plastic light-
folding elements folding element 210 is disposed on an object side of the optical imaging lens assembly, and the plastic light-folding element 230 is disposed on an image side of the optical imaging lens assembly. In particular, the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees) by the disposition of the plastic light-folding elements - The optical imaging lens assembly, in order from the object side to the image side, includes
lens elements retainer 223, and thelens elements lens barrel 222 of the optical imaging lens assembly, and thelens element 221 d and theretainer 223 are disposed in a drivingmember 224 of the optical imaging lens assembly, wherein the optical features such as numbers, structures, surface shapes and so on of the lens elements can be disposed according to different imaging demand, and the optical features are not limited thereto. - The plastic light-
folding element 210 includes anincident surface 211, anexit surface 212, areflective surface 213 and a reflective optical layer (its reference numeral is omitted), and the plastic light-folding element 230 includes anincident surface 231, anexit surface 232, areflective surface 233 and a reflective optical layer (its reference numeral is omitted). In detail, the incident surfaces 211, 231 are configured to lead an imaging light (its reference numeral is omitted) enter the plastic light-folding elements folding elements reflective surfaces reflective surfaces folding element 210 can be a plastic lens element, and each of theincident surface 211 and theexit surface 232 has an optical curved surface, but the present disclosure is not limited thereto. - Further, all of other structures and dispositions according to the 2nd example are the same as the structures and the dispositions according to the 1st example, and will not be described again herein.
- <3rd Example>
-
FIG. 3A is a schematic view of anelectronic device 30 according to the 3rd example of the present disclosure. InFIG. 3A , theelectronic device 30 includes an imaging lens assembly module (its reference numeral is omitted) and animage sensor 380, wherein theimage sensor 380 is disposed on animage surface 381 of the imaging lens assembly module. - The imaging lens assembly module includes a plastic light-
folding element 310 and an opticalimaging lens assembly 320, wherein the plastic light-folding element 310 is disposed an image side of the opticalimaging lens assembly 320. In particular, the imaging lens assembly module can be applied to the telephoto (that is, the full view is less than 40 degrees). Therefore, the volume of the imaging lens assembly module can be effectively reduced. -
FIG. 3B is a three dimensional view of the plastic light-folding element 310 according to the 3rd example inFIG. 3A .FIG. 3C is another three dimensional view of the plastic light-folding element 310 according to the 3rd example inFIG. 3A .FIG. 3D is a schematic view of anincident surface 311 and areflective surface 313 of the plastic light-folding element 310 according to the 3rd example inFIG. 3A . InFIGS. 3A to 3D , the plastic light-folding element 310 includes theincident surface 311, anexit surface 312, thereflective surface 313, a reflective optical layer (its reference numeral is omitted), at least one connectingsurface 315, at least onegate vestige structure 316 and at least one intermediate layer (its reference numeral is omitted). In detail, theincident surface 311 is configured to lead an imaging light (its reference numeral is omitted) enter the plastic light-folding element 310, theexit surface 312 is configured to lead the imaging light exit the plastic light-folding element 310, thereflective surface 313 is configured to fold the imaging light, and the reflective optical layer is disposed on a surface of thereflective surface 313, the connectingsurface 315 is connected to theincident surface 311, theexit surface 312 and thereflective surface 313, and thegate vestige structure 316 is disposed on the connectingsurface 315. According to the 3rd example, a number of thereflective surface 313 is four, a number of the connectingsurface 315 is two, a number of thegate vestige structure 316 is two, a number of the intermediate layer is two, one of thereflective surfaces 313 and theincident surface 311 are coplanar, and another one of thereflective surfaces 313 and theexit surface 312 are coplanar, wherein the real number of the intermediate layer can be two or more, but the present disclosure is not limited thereto. - The reflective optical layer includes an Ag layer (its reference numeral is omitted), a bottom layer optical film (its reference numeral is omitted) and a top layer optical film (its reference numeral is omitted), wherein the Ag layer is configured to lead the imaging light, which enters the
incident surface 311, reflect to theexit surface 312; the bottom layer optical film is directly contacted with the Ag layer, and the bottom layer optical film is closer to each of thereflective surfaces 313 of the plastic light-folding element 310 than the Ag layer to each of thereflective surfaces 313 of the plastic light-folding element 310; a refractive index of the top layer optical film is lower than a refractive index of the bottom layer optical film, wherein the top layer optical film is not directly contacted with the Ag layer, and the top layer optical film is farther from each of thereflective surfaces 313 of the plastic light-folding element 310 than the Ag layer from each of thereflective surfaces 313 of the plastic light-folding element 310. - According to the 3rd example, the bottom layer optical film is made of Al2O3, and the top layer optical film is made of SiO2.
- Furthermore, each of the
incident surface 311, theexit surface 312 and thereflective surfaces 313 includes an optical portion (its reference numeral is omitted) and an arc step structure (its reference numeral is omitted), wherein the arc step structure is disposed on a periphery of the optical portion, and an arc is formed by the arc step structure centered on the optical portion. - When the refractive index of the bottom layer optical film is Nb, a thickness of the bottom layer optical film is db, the refractive index of the top layer optical film is Nt, a thickness of the top layer optical film is dt, a refractive index of the Ag layer is NAg, and a thickness of the Ag layer is dAg, the following conditions of the Table 3 are satisfied.
-
TABLE 3 3rd example Nb 1.6726 db (nm) 20 Nt 1.4618 dt (nm) 65 NAg 0.051 dAg (nm) 100 - It should be mentioned that the refractive index of the air is 1, the refractive index of the plastic light-
folding element 310 is 1.64678, and a thickness of each of the intermediate layers is less than the thickness of the Ag layer. - Further, all of other structures and dispositions according to the 3rd example are the same as the structures and the dispositions according to the 1st example, and will not be described again herein.
- <4th Example>
-
FIG. 4A is a schematic view of anelectronic device 40 according to the 4th example of the present disclosure.FIG. 4B is another schematic view of theelectronic device 40 according to the 4th example inFIG. 4A . InFIGS. 4A and 4B , theelectronic device 40 according to the 4th example is a smart phone, and includes an imaging lens assembly module (its reference numeral is omitted), an image sensor (not shown) and auser interface 41, wherein the image sensor is disposed on an image surface (not shown) of the imaging lens assembly module, and the imaging lens assembly module includes an ultra-wideangle camera module 42, a highresolution camera module 43 and atelephoto camera module 44, and theuser interface 41 is a touch screen, but the present disclosure is not limited thereto. Furthermore, the imaging lens assembly module includes a plastic light-folding element (not shown) and an optical imaging lens assembly (not shown), wherein the plastic light-folding element is disposed on one of an object side and an image side of the optical imaging lens assembly. - Moreover, the
telephoto camera module 44 can be one of the imaging lens assembly modules according to the aforementioned 1st example to the 3rd example, but the present disclosure is not limited thereto. Therefore, it is favorable for satisfying the requirements of the mass production and the appearance of the imaging lens assembly module mounted on the electronic devices according to the current marketplace of the electronic device. - Moreover, users enter a shooting mode via the
user interface 41, wherein theuser interface 41 is configured to display the scene and have the touch function, and the shooting angle can be manually adjusted to switch the ultra-wideangle camera module 42, the highresolution camera module 43 and thetelephoto camera module 44. At this moment, the imaging light is gathered on the image sensor via the imaging lens assembly module, and an electronic signal about an image is output to an image signal processor (ISP) 45. - In
FIG. 4B , to meet a specification of theelectronic device 40, theelectronic device 40 can further include an optical anti-shake mechanism (not shown). Furthermore, theelectronic device 40 can further include at least one focusing assisting module (its reference numeral is omitted) and at least one sensing element (not shown). The focusing assisting module can be aflash module 46 for compensating a color temperature, an infrared distance measurement component, a laser focus module and so on. The sensing element can have functions for sensing physical momentum and kinetic energy, such as an accelerator, a gyroscope, a Hall Effect Element, to sense shaking or jitters applied by hands of the users or external environments. Accordingly, theelectronic device 40 equipped with an auto-focusing mechanism and the optical anti-shake mechanism can be enhanced to achieve the superior image quality. Furthermore, theelectronic device 40 according to the present disclosure can have a capturing function with multiple modes, such as taking optimized selfies, high dynamic range (HDR) under a low light condition, 4K resolution recording and so on. Furthermore, the users can visually see a captured image of the camera through theuser interface 41 and manually operate the view finding range on theuser interface 41 to achieve the autofocus function of what you see is what you get. - Moreover, the imaging lens assembly module, the image sensor, the optical anti-shake mechanism, the sensing element and the focusing assisting module can be disposed on a flexible printed circuit board (FPC) (not shown) and electrically connected to the associated components, such as the
imaging signal processor 45, via a connector (not shown) to perform a capturing process. Since the current electronic devices, such as smart phones, have a tendency of being compact, the way of firstly disposing the imaging lens assembly module and related components on the flexible printed circuit board and secondly integrating the circuit thereof into the main board of the electronic device via the connector can satisfy the requirements of the mechanical design and the circuit layout of the limited space inside the electronic device, and obtain more margins. The autofocus function of the imaging lens assembly module can also be controlled more flexibly via the touch screen of the electronic device. According to the 4th example, theelectronic device 40 includes a plurality of sensing elements and a plurality of focusing assisting modules. The sensing elements and the focusing assisting modules are disposed on the flexible printed circuit board and at least one other flexible printed circuit board (not shown) and electrically connected to the associated components, such as theimage signal processor 45, via corresponding connectors to perform the capturing process. In other examples (not shown herein), the sensing elements and the focusing assisting modules can also be disposed on the main board of the electronic device or carrier boards of other types according to requirements of the mechanical design and the circuit layout. - Furthermore, the
electronic device 40 can further include, but not be limited to, a display, a control unit, a storage unit, a random access memory (RAM), a read-only memory (ROM), or the combination thereof. -
FIG. 4C is a schematic view of an image according to the 4th example inFIG. 4A . InFIG. 4C , the larger range of the image can be captured via the ultra-wideangle camera module 42, and the ultra-wideangle camera module 42 has the function of accommodating more wide range of the scene. -
FIG. 4D is another schematic view of an image according to the 4th example inFIG. 4A . InFIG. 4D , the image of the certain range with the high resolution can be captured via the highresolution camera module 43, and the highresolution camera module 43 has the function of the high resolution and the low deformation. -
FIG. 4E is still another schematic view of an image according to the 4th example inFIG. 4A . InFIG. 4E , thetelephoto camera module 44 has the enlarging function of the high magnification, and the distant image can be captured and enlarged with high magnification via thetelephoto camera module 44. - In
FIGS. 4C to 4E , the zooming function can be obtained via theelectronic device 40, when the scene is captured via the imaging lens assembly module with different focal lengths cooperated with the function of image processing. - <5th Example>
-
FIG. 5 is a schematic view of anelectronic device 50 according to the 5th example of the present disclosure. InFIG. 5 , theelectronic device 50 is a smart phone, and includes an imaging lens assembly module (its reference numeral is omitted) and an image sensor (not shown), wherein the image sensor is disposed on an image surface (not shown) of the imaging lens assembly module, and the imaging lens assembly module includes ultra-wideangle camera modules angle camera modules telephoto camera modules module 519. TheTOF module 519 can be another type of the imaging apparatus, and the disposition is not limited thereto. - Moreover, the
telephoto camera modules - Further, the
telephoto camera modules - To meet a specification of the
electronic device 50, theelectronic device 50 can further include an optical anti-shake mechanism (not shown). Furthermore, theelectronic device 50 can further include at least one focusing assisting module (not shown) and at least one sensing element (not shown). The focusing assisting module can be aflash module 520 for compensating a color temperature, an infrared distance measurement component, a laser focus module and so on. The sensing element can have functions for sensing physical momentum and kinetic energy, such as an accelerator, a gyroscope, a Hall Effect Element, to sense shaking or jitters applied by hands of the users or external environments. Accordingly, theelectronic device 50 equipped with an auto-focusing mechanism and the optical anti-shake mechanism can be enhanced to achieve the superior image quality. Furthermore, theelectronic device 50 according to the present disclosure can have a capturing function with multiple modes, such as taking optimized selfies, High Dynamic Range (HDR) under a low light condition, 4K Resolution recording and so on. - Further, all of other structures and dispositions according to the 5th example are the same as the structures and the dispositions according to the 4th example, and will not be described again herein.
- The foregoing description, for purpose of explanation, has been described with reference to specific examples. It is to be noted that Tables show different data of the different examples; however, the data of the different examples are obtained from experiments. The examples were chosen and described in order to best explain the principles of the disclosure and its practical applications, to thereby enable others skilled in the art to best utilize the disclosure and various examples with various modifications as are suited to the particular use contemplated. The examples depicted above and the appended drawings are exemplary and are not intended to be exhaustive or to limit the scope of the present disclosure to the precise forms disclosed. Many modifications and variations are possible in view of the above teachings.
Claims (11)
1. A plastic light-folding element, comprising:
an incident surface configured to lead an imaging light enter the plastic light-folding element;
an exit surface configured to lead the imaging light exit the plastic light-folding element;
a reflective surface configured to fold the imaging light; and
a reflective optical layer disposed on a surface of the reflective surface, and comprising:
an Ag layer configured to lead the imaging light, which enters the incident surface, reflect to the exit surface;
a bottom layer optical film directly contacted with the Ag layer, and the bottom layer optical film closer to the reflective surface of the plastic light-folding element than the Ag layer to the reflective surface of the plastic light-folding element; and
a top layer optical film, a refractive index of the top layer optical film lower than a refractive index of the bottom layer optical film, wherein the top layer optical film is not directly contacted with the Ag layer, and the top layer optical film is farther from the reflective surface of the plastic light-folding element than the Ag layer from the reflective surface of the plastic light-folding element;
wherein the refractive index of the bottom layer optical film is Nb, a thickness of the bottom layer optical film is db, the refractive index of the top layer optical film is Nt, a thickness of the top layer optical film is dt, a thickness of the Ag layer is dAg, and the following conditions are satisfied:
1.4<Nt<Nb<2.1;
1.6<Nb<2.1;
1.4<Nt<1.58;
0.05<db/dAg<1.2; and
0.2<dAg/dt<3.5.
2. The plastic light-folding element of claim 1 , further comprising:
a connecting surface connected to the incident surface, the exit surface and the reflective surface; and
a gate vestige structure disposed on the connecting surface.
3. The plastic light-folding element of claim 2 , wherein the bottom layer optical film is a metal oxide layer.
4. The plastic light-folding element of claim 2 , further comprising:
at least one intermediate layer disposed between the top layer optical film and the Ag layer.
5. The plastic light-folding element of claim 4 , wherein the at least one intermediate layer comprises a metal layer excluding a silver atom.
6. The plastic light-folding element of claim 2 , wherein the thickness of the Ag layer is dAg, and the following condition is satisfied:
75 nm<dAg<200 nm.
7. The plastic light-folding element of claim 2 , wherein the bottom layer optical film is directly contacted with the reflective surface of the plastic light-folding element.
8. The plastic light-folding element of claim 2 , wherein the thickness of the bottom layer optical film is db, the thickness of the top layer optical film is dt, and the following condition is satisfied:
0.05<db/dt<1.1.
9. The plastic light-folding element of claim 2 , wherein a lowest reflectivity of a reflectivity of the reflective optical layer between wavelengths of 540 nm to 590 nm is R5459, and the following condition is satisfied:
94.0%<R5459<99.99%.
10. An imaging lens assembly module, comprising:
the plastic light-folding element of claim 1 ; and
an optical imaging lens assembly, the plastic light-folding element disposed on one of an object side and an image side of the optical imaging lens assembly.
11. An electronic device, comprising:
the imaging lens assembly module of claim 10 ; and
an image sensor disposed on an image surface of the imaging lens assembly module.
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US17/711,168 US20220373715A1 (en) | 2021-05-21 | 2022-04-01 | Plastic light-folding element, imaging lens assembly module and electronic device |
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US202163191366P | 2021-05-21 | 2021-05-21 | |
TW110130558A TWI784676B (en) | 2021-05-21 | 2021-08-18 | Plastic light-folding element, imaging lens assembly module and electronic device |
TW110130558 | 2021-08-18 | ||
US17/711,168 US20220373715A1 (en) | 2021-05-21 | 2022-04-01 | Plastic light-folding element, imaging lens assembly module and electronic device |
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US20230288679A1 (en) * | 2014-08-10 | 2023-09-14 | Corephotonics Ltd. | Zoom dual-aperture camera with folded lens |
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US20220373724A1 (en) * | 2021-05-21 | 2022-11-24 | Largan Precision Co., Ltd. | Optical lens assembly, imaging apparatus and electronic device |
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JP2002048904A (en) * | 2000-08-03 | 2002-02-15 | Canon Inc | Resin molded prism and die therefor |
JP2007052100A (en) * | 2005-08-16 | 2007-03-01 | Konica Minolta Opto Inc | Optical reflection member |
JP5853638B2 (en) * | 2011-11-24 | 2016-02-09 | セイコーエプソン株式会社 | Half mirror and image display device |
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2021
- 2021-10-29 CN CN202111268390.7A patent/CN115390168A/en active Pending
- 2021-10-29 CN CN202122619345.3U patent/CN216210000U/en active Active
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2022
- 2022-04-01 US US17/711,168 patent/US20220373715A1/en active Pending
- 2022-04-26 EP EP22169886.3A patent/EP4092455A1/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230288679A1 (en) * | 2014-08-10 | 2023-09-14 | Corephotonics Ltd. | Zoom dual-aperture camera with folded lens |
US20230350167A1 (en) * | 2014-08-10 | 2023-11-02 | Corephotonics Ltd. | Zoom dual-aperture camera with folded lens |
US11982796B2 (en) * | 2014-08-10 | 2024-05-14 | Corephotonics Ltd. | Zoom dual-aperture camera with folded lens |
US12007537B2 (en) * | 2014-08-10 | 2024-06-11 | Corephotonics Lid. | Zoom dual-aperture camera with folded lens |
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Publication number | Publication date |
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CN115390168A (en) | 2022-11-25 |
EP4092455A1 (en) | 2022-11-23 |
CN216210000U (en) | 2022-04-05 |
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