CN107592749A - The bottom plate and camera module of a kind of camera module - Google Patents
The bottom plate and camera module of a kind of camera module Download PDFInfo
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- CN107592749A CN107592749A CN201710842955.5A CN201710842955A CN107592749A CN 107592749 A CN107592749 A CN 107592749A CN 201710842955 A CN201710842955 A CN 201710842955A CN 107592749 A CN107592749 A CN 107592749A
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- bottom plate
- camera module
- conductive layer
- insulating barrier
- filling glue
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Abstract
This application discloses a kind of bottom plate of camera module, the bottom plate includes conductive layer and insulating layer, the circuit of each component in connection camera module is provided with the conductive layer, the insulating barrier is fixed on the conductive layer surface, and the surface of insulating layer is covered with filling glue.By on the camera module bottom plate comprising conductive layer and insulating layer, filling glue is spread in covering painting, it is i.e. by filling glue that the bottom plate comprising conductive layer and insulating layer and the sensitive chip that should be arranged on the bottom plate and other components is closely coupled, fix their relative position, to increase the bulk strength of bottom plate and whole camera module, so that the base plate strength is high, while also improve the bulk strength for the camera module for applying the bottom plate；The application further simultaneously discloses a kind of camera module, has above-mentioned beneficial effect.
Description
Technical field
The application is related to camera module technical field, the bottom plate and camera module of more particularly to a kind of camera module.
Background technology
Applied as intelligent mobile terminal is more and more extensive in our daily life, on intelligent mobile terminal
Camera function requirement also more and more higher, thus applied to the camera module on intelligent mobile terminal constantly meet it is high performance simultaneously
Also to reduce the size as far as possible, and also need to while size diminishes to keep original intensity.
In the prior art, generally from bottom plate of the larger printed circuit board (PCB) of thickness as camera module, including PCB, R-
The combination of PCB and FPC+ reinforcement steel discs ensures camera module, and a problem existing for combinations thereof is can not to reduce bottom plate
Thickness, and the Ultrathin bottom plate for the FPC being used only has can not ensure normal intensity.
So how to design a kind of higher camera module bottom plate of overall construction intensity that can make camera module is this area
Technical staff's urgent problem to be solved.
The content of the invention
The purpose of the application is to provide the bottom plate and camera module of a kind of camera module, and the base plate strength is high, while also carries
Height applies the bulk strength of the camera module of the bottom plate.
In order to solve the above technical problems, the application provides a kind of bottom plate of camera module, the bottom plate is including conductive layer and absolutely
Edge layer, the circuit of each component in connection camera module is provided with the conductive layer, and the insulating barrier is fixed on the conduction
Layer surface, the surface of insulating layer is covered with filling glue.
Preferably, the surface of insulating layer is provided with the electrode of each component in connection camera module, and the electrode passes through
Gold thread connects the conductive layer, and the insulating barrier is all covered with the filling glue with the gold thread.
Preferably, the filling glue is to carry out dispensing in the dispensing region of the upper and lower ends of the backplate surface, so that institute
Filling glue is stated to flow to middle part before curing until covering the filling glue of the bottom plate.
Preferably, the conductive layer includes：Kapton printed circuit board (PCB) or polyester film printed circuit board (PCB).
Preferably, the insulating barrier is PI films.
Preferably, the surface of insulating layer is provided with the groove of predetermined depth, the apparent height after the filling adhesive curing
With the surface flush of the insulating barrier.
Preferably, the filling glue includes：Hot-setting adhesive.
Present invention also provides a kind of camera module, the camera module includes the bottom of the camera module as described in above-mentioned content
Plate.
A kind of bottom plate of camera module provided herein, the bottom plate include conductive layer and insulating layer, the conductive layer
In be provided with the circuit of each component in connection camera module, the insulating barrier is fixed on the conductive layer surface, the insulation
Layer surface is covered with filling glue.
Obviously, technical scheme provided herein, the application pass through in the camera module comprising conductive layer and insulating layer
On bottom plate, filling glue is spread in covering painting, i.e., by filling glue by the bottom plate comprising conductive layer and insulating layer and should be arranged at this
Sensitive chip and other components on bottom plate is closely coupled, fixes their relative position, to increase bottom plate and whole shooting
The bulk strength of module.The base plate strength is high, while also improves the bulk strength for the camera module for applying the bottom plate.The application
A kind of camera module is additionally provided simultaneously, there is above-mentioned beneficial effect, will not be repeated here.
Brief description of the drawings
, below will be to embodiment or existing in order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of application, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
A kind of overlooking the structure diagram of the bottom plate for camera module that Fig. 1 is provided by the embodiment of the present application；
Fig. 2 for second of camera module bottom plate of institute of embodiment of the present invention drawings side block diagram.
Embodiment
The core of the application is to provide the bottom plate and camera module of a kind of camera module, and the base plate strength is high, while also carries
Height applies the bulk strength of the camera module of the bottom plate.
In existing camera module, generally use adds printed circuit board or flexible printed circuit board the group of reinforcement steel disc
Cooperate to use for the conductive layer of bottom plate, conductive layer, which is increase service efficiency, reduces thickness can use sandwich construction, different layers
It is mutually nested between secondary so that only take up one layer of thickness and reach multilayer using effect, and in order to ensure the click on conductive layer,
The junction that stitch slot etc. should not have electrical connection keeps mutually insulated, it is also necessary to covers insulating barrier on the electrically conductive.
Insulating barrier of the prior art is typically to use spraying coating process, by dielectric ink spraying on the electrically conductive, is come with this
Insulating barrier is formed, after insulating barrier is formed, the bottom plate of camera module is completed.And then, set on the insulating barrier of bottom plate corresponding
Other Important Components such as sensitive chip, IR pieces and camera lens, and connect sensitive chip and it is other need to realize electrically connect
The component connect and bottom plate conductive layer are exactly connecting line.
Specifically, connecting line selection in terms of, multiple choices scheme be present, for example, gold thread, silver wire, golden contracted payment alloy wire,
Copper cash, aluminum steel, why be this different materials, be because in the periodic table of elements, gold, silver in transition group metallic element, copper and
Four kinds of metallic elements of aluminium have higher electric conductivity.And under normal circumstances, due to gold thread have electrical conductivity is big, thermal conductivity is good,
The advantages that corrosion-resistant, good toughness, fabulous chemical stability, typically from pure gold thread.
Pure gold thread is formed by the material wire drawing that golden purity is more than 99.99%, wherein containing micro Ag/
The trace elements such as Cu/Si/Ca/Mg, applying the gold thread in camera module to have, 0.9mil, 1.0mil, 1.2mil etc. are several, mil
(mil, being a kind of line footpath unit)=0.001 inch, with reference to inch and the reduction formula of international long measure, i.e. 1mil
=1/1000 inch=0.0254mm, why a diameter of 0.9mil, 1.0mil, 1.2mil of conventional gold thread, be because examining
Consider the camera module and be typically used in intelligent mobile terminal, and intelligent mobile terminal is with the difference of extraneous actual environment, can not
The meeting avoided is rocked, collided, i.e., to meet under extraneous various environment to the push-pull effort toughness for connecting gold thread, therefore gold thread
Diameter needs to meet above-mentioned requirements.
After connection being realized by gold thread, it is believed that camera module is assembled and finished substantially, but the above lacks in the presence of some
Point, wherein, the characteristics of using the dielectric ink of spraying coating process due to spraying coating process, spraying uniformity is not high, can be brought for bottom plate
Poor flatness, and poor bottom plate flatness can directly affect the sensitive chip being arranged on bottom plate, IR pieces and camera lens
Flatness, poor flatness can hide some dangers for the bulk strength of camera module, cause junction space, cavity to be present
Deng influenceing the tightness degree of connection, phenomena such as under extraneous actual scene chip, camera lens being caused to come off.
Therefore how camera module to be transformed in minimum degree so that the bulk strength increase of camera module, is this
Apply connect it is lower in embodiment conducted in the content that illustrates.
To make the purpose, technical scheme and advantage of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application
In accompanying drawing, the technical scheme in the embodiment of the present application is clearly and completely described, it is clear that described embodiment is
Some embodiments of the present application, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art
The all other embodiment obtained under the premise of creative work is not made, belong to the scope of the application protection.
Below in conjunction with Fig. 1, a kind of plan structure signal of the bottom plate for camera module that Fig. 1 is provided by the embodiment of the present application
Figure.
The bottom plate includes conductive layer and insulating layer, and the circuit of each component in connection camera module is provided with conductive layer,
Insulating barrier is fixed on conductive layer surface, and surface of insulating layer is covered with filling glue 200.
After the setting of bottom plate conductive layer, insulating barrier is completed, due to the needs in connection, first device on conductive layer can be caused
Some electrodes of part expose on the surface of bottom plate, for being electrically connected with sensitive chip and other Important Components, just
As shown in fig. 1, electrode, stitch slot and sensitive chip collectively form junction 100, and passing through for the present embodiment creativeness will
The region generally similar to " work " shape that filling glue 200 shown in Fig. 1 surrounds junction 100, with filling glue 200
It is after being fully cured, junction 100 is closely coupled, strengthen the intensity of camera module bottom plate, each component thereon with this,
It is final to realize the intensity for strengthening whole camera module.
Further, the dispensing mode for filling glue can be that horizontal stroke is carried out at the motor, stitch slot of sensitive chip upper and lower
To smearing into two horizontal lines, and filling glue is guided to be flowed according to actual conditions, finally to realize the area of coverage as shown in Figure 1
Domain.It is also possible to cover gold thread simultaneously, the push-pull effort toughness of gold thread can be strengthened simultaneously.
Wherein, the selection of material of bottom plate conductive layer includes：Kapton printed circuit board (PCB) or polyester film printing electricity
Road plate.
Further, it is also contemplated that the thickness problem after solidifying to filling glue 200, be provided with surface of insulating layer pre-
If the groove of depth, so that the surface flush of the apparent height and insulating barrier after the filling solidification of glue 200.And fill glue 200
From also very flexibly, can including hot-setting adhesive etc. other epoxylite chemical glues.
Based on above-mentioned technical proposal, the embodiment of the present application provides a kind of bottom plate of camera module, and the application is by wrapping
On camera module bottom plate containing conductive layer and insulating layer, covering painting spread filling glue, i.e., by fill glue will include conductive layer and
The bottom plate of insulating barrier and the sensitive chip that should be arranged on the bottom plate and other components are closely coupled, fix the relative of them
Position, to increase the bulk strength of bottom plate and whole camera module.The base plate strength is high, while also improves and apply the bottom plate
The bulk strength of camera module.
Refer to Fig. 2, Fig. 2 for second of camera module bottom plate of institute of embodiment of the present invention drawings side block diagram.
In embodiments of the present invention, (PolyimideFilm, Chinese are entitled for the creative PI films 300 that use：Polyimides
Film) spray oil ink present in prior art is replaced to form the insulating barrier of covering on the electrically conductive.
Wherein, Kapton is the film class insulating materials that performance is best in the world, by pyromellitic acid anhydride
(PMDA) formed again through imidization through polycondensation and casting film-forming in intensive polar solvent with diaminodiphenyl ether (DDE).Polyamides is sub-
Amine film is generally in yellow transparent, relative density 1.39~1.45, has excellent resistant of high or low temperature, electric insulating quality, bonding
Property, radiation resistance, resistance to medium, can be long-term use of within the temperature range of -269 DEG C~280 DEG C, can reach 400 DEG C in short-term
High temperature.Its is particularly suitable to be used as flexible circuit board base material and various heat resisting motor electrical apparatus insulation materials.
And polyimides is generally divided into two major classes：(1) TPI, such as imines film, coating, fiber and modern times
Microelectronics polyimides etc.；(2) Thermocurable polyimide, mainly including BMI (BMI) type and monomer reactant
It polymerize (PMR) type polyimides and its each modified product, BMI easy processings but fragility is larger.It is referred to as " gold film "
Kapton has remarkable performance, and it is widely used in space technology, F, H level motor, the insulation of electrical equipment, PTC electricity
Hotting mask, TAB (pressure sensitive adhesive tape base material), space flight, aviation, computer, electromagnetic wire, transformer, sound equipment, mobile phone, computer, smelt, adopt
The electronic enterprises such as the industry of ore deposit electronic component, automobile, communications and transportation, atomic energy industry.
It is considered that the effect of Kapton is to form the insulating barrier of covering on the electrically conductive, the scope of its thickness exists
0.008mm possesses good insulation effect between 0.125mm.Particularly, it is contemplated that the practical application field of camera module
Scape, generally from thermoplastic polyimide film.Meanwhile the dielectric ink using spraying coating process is different from, polyimides is thin
Film covering on the electrically conductive mode generally use high pressure fitting mode, i.e., using the pressure far above normal atmospheric pressure by
Kapton overlays conjunction on the electrically conductive, and this mode is not in showing for fold or bubble substantially due to uniform stressed
As also and then next with the flatness significantly improved for being different from prior art.
Because Kapton is on the premise of functional requirement is met, thickness can be made thin, can not generally incite somebody to action
It calculates the thickness of bottom plate, meanwhile, FPC is used alone, (Flexible Printed Circuit, Chinese are entitled：Flexible electrical
Road plate) when, on the basis of a flood Kapton can have been covered on FPC surfaces, by setting plastic packaging layer to strengthen bottom
The intensity of plate.Further, it is contemplated that to meet the modeling seal coat thickness used needed for intensity requirement, plastic packaging layer can only be set
In the surrounding of PI films 300, i.e. need to only be paved and thickness identical height, next side by being arranged on the plastic packaging layer of the surrounding of PI films 300
The sensitive chip of intermediate region is just set.
Wherein, FPC is that have height reliability to be a kind of made of base material using polyimides or polyester film, and excellent can
Flexible print wiring board.With the characteristics of Distribution density is high, in light weight, thickness of thin, good bending property；The use that plastic packaging layer uses can
Think most common epoxy-plastic packaging material；Conductive layer can also use out printed circuit board beyond FPC or FPC to add reinforcement
Steel disc combination etc., herein and is not specifically limited, most suitable selection should be made depending on actual conditions.
Based on above-mentioned technical proposal, a kind of bottom plate for camera module that the embodiment of the present application provides, creative uses
PI films 300 replace spraying ink layer usually used in the prior art, and while ink layer insulation effect is served, there is provided
More preferable bottom plate flatness.The bottom plate flatness is more preferable, and camera lens is taken pictures better.
Present invention also provides a kind of camera module, the camera module includes the bottom of the camera module as described in above-mentioned content
Plate.The embodiment of the present invention fills the coverage mode of glue through the above way, is solidifying to borrow the chemical characteristic of filling glue with it
Connectivity afterwards, realize the purpose of enhancing camera module bulk strength.
Further, those skilled in the art should be able to recognize that the basic skills principle that more the application provides combines reality
Situation may have many examples, should be in the protection domain of the application in the case where not paying enough creative works.
Each embodiment is described by the way of progressive in specification, and what each embodiment stressed is and other realities
Apply the difference of example, between each embodiment identical similar portion mutually referring to.
Specific case used herein is set forth to the principle and embodiment of the application, and above example is said
It is bright to be only intended to help and understand the present processes and its core concept.It should be pointed out that the ordinary skill for the art
For personnel, on the premise of the application principle is not departed from, some improvement and modification, these improvement can also be carried out to the application
Also fallen into modification in the application scope of the claims.
Claims (8)
1. a kind of bottom plate of camera module, it is characterised in that the bottom plate includes conductive layer and insulating layer, is set in the conductive layer
The circuit of each component in connection camera module is equipped with, the insulating barrier is fixed on the conductive layer surface, the insulating barrier table
Face is covered with filling glue.
2. bottom plate according to claim 1, it is characterised in that the surface of insulating layer is provided with each in connection camera module
The electrode of component, the electrode connect the conductive layer by gold thread, and the insulating barrier is all covered with described with the gold thread
Fill glue.
3. bottom plate according to claim 2, it is characterised in that the filling glue is the upper and lower ends in the backplate surface
Dispensing region carry out dispensing so that the filling glue flows to middle part until covering the filling of the bottom plate before curing
Glue.
4. bottom plate according to claim 3, it is characterised in that the conductive layer includes：Kapton printed circuit
Plate or polyester film printed circuit board (PCB).
5. bottom plate according to claim 1, it is characterised in that the insulating barrier is PI films.
6. according to the bottom plate described in any one of claim 1 to 5 claim, it is characterised in that the surface of insulating layer is set
There are the groove of predetermined depth, the surface flush of apparent height and the insulating barrier after the filling adhesive curing.
7. camera module according to claim 6, it is characterised in that the filling glue includes：Hot-setting adhesive.
8. a kind of camera module, it is characterised in that including the bottom plate as described in any one of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710842955.5A CN107592749A (en) | 2017-09-18 | 2017-09-18 | The bottom plate and camera module of a kind of camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710842955.5A CN107592749A (en) | 2017-09-18 | 2017-09-18 | The bottom plate and camera module of a kind of camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107592749A true CN107592749A (en) | 2018-01-16 |
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ID=61047277
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710842955.5A Pending CN107592749A (en) | 2017-09-18 | 2017-09-18 | The bottom plate and camera module of a kind of camera module |
Country Status (1)
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| CN (1) | CN107592749A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117278826A (en) * | 2023-10-27 | 2023-12-22 | 荣耀终端有限公司 | Glue pressing jig and glue pressing method for camera shell |
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| CN103635028A (en) * | 2012-08-22 | 2014-03-12 | 健鼎（无锡）电子有限公司 | Embedded type component circuit board and manufacturing method thereof |
| CN205336387U (en) * | 2015-12-21 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Make a video recording module and photosensitive device who seals is glued to routing |
| CN107094229A (en) * | 2017-06-30 | 2017-08-25 | 珠海市魅族科技有限公司 | Assemble method, camera module and the mobile terminal of camera module |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1075096A (en) * | 1996-09-02 | 1998-03-17 | Matsushita Electric Ind Co Ltd | Mounter of flip chip parts |
| TWI264222B (en) * | 2004-03-09 | 2006-10-11 | Hon Hai Prec Ind Co Ltd | Digital still camera module |
| US20080309805A1 (en) * | 2007-06-14 | 2008-12-18 | Hon Hai Precision Industry Co., Ltd. | Image sensor package |
| CN103635028A (en) * | 2012-08-22 | 2014-03-12 | 健鼎（无锡）电子有限公司 | Embedded type component circuit board and manufacturing method thereof |
| CN203313286U (en) * | 2013-06-14 | 2013-11-27 | 南昌欧菲光电技术有限公司 | Camera assembly |
| CN205336387U (en) * | 2015-12-21 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Make a video recording module and photosensitive device who seals is glued to routing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117278826A (en) * | 2023-10-27 | 2023-12-22 | 荣耀终端有限公司 | Glue pressing jig and glue pressing method for camera shell |
| CN117278826B (en) * | 2023-10-27 | 2024-05-10 | 荣耀终端有限公司 | Glue pressing jig and glue pressing method for camera shell |
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Application publication date: 20180116 |