1312440 九、發明說明： '【發明所屬之技術領域】 ' 本發明係關於一種鏡頭模組，尤其係關於一種有利於 縮小體積及減輕重量，同時亦可確保良好性能之鏡頭模組。 【先前技術】 目前絕大多數數位相機鏡頭模組由鏡片組、鏡筒及影 像感測器等部件構成。其具體構造可參閱圖1，一種習知 之鏡頭模組100包括一鏡片組12、一鏡筒14及一影像感 • 測器16。鏡片組12包括一用於聚焦之鏡片121及一用於 濾除光學影像訊號中紅外線之紅外截止濾光片（IR-cut filter)122,該鏡片121及紅外截止濾光片122均收容於鏡 筒14之内部。影像感測器16包括一影像感測晶片161、 一蓋板162及一基板163，其中影像感測晶片161固定於 基板163上；蓋板162係由玻璃等透明材料製成，該蓋板 162之邊緣固定於基板163之邊緣上，將影像感測晶片161 封裝於蓋板162與基板163之間。該影像感測器16裝設於 ® 鏡筒12—端，並將蓋板162及影像感測晶片161依次位於 鏡片組12之出射光路上。進入鏡筒14之光學影像訊號經 過鏡片121之聚焦及紅外截止濾光片122之過濾後穿過蓋 板162到達影像感測晶片161，影像感測晶片161將光學 影像訊號轉換為電子影像訊號。 由於該鏡頭模組100之鏡片121、紅外截止濾光片122 及蓋板162—般均係由玻璃或塑膠製成，重量及體積均較 大，需要佔據較大之裝配空間而於使用上帶來不便，同時 6 1312440 f增加該鏡頭模組100之生產成本。 【發明内容】 有鑒於此，有必要提供一種既可縮小體積及減輕重 量，亦可確保良好性能之鏡頭模組。 一種鏡頭模組，該鏡頭模組包括一鏡筒、—鏡片及〜 影像感測器’其中鏡片收容於鏡筒内部，影像感測器裝敦 於鏡筒一端；該影像感測器包括一影像感測晶片、〜荖 板、一基板及一紅外截止濾光膜，影像感測晶片固定於基 • 板上，蓋板亦固定於基板上並將影像感測晶片封裝於蓋板 與基板之間，紅外截止濾光膜佈設於蓋板之表面。 相較於習知技術，所述鏡頭模組以紅外截止濾光犋代 替紅外截止濾光片，能夠有效地縮小鏡頭模紐'之體積及滅 輕鏡頭模組之重量；以影像感測器之蓋板作為裳設紅外哉 止濾光膜之媒介，有利於對影像感測晶片及紅外截止據光 膜加以保護。1312440 IX. Description of the invention: '[Technical field to which the invention pertains] The present invention relates to a lens module, and more particularly to a lens module which is advantageous for reducing the volume and weight while ensuring good performance. [Prior Art] At present, most digital camera lens modules are composed of a lens group, a lens barrel, and an image sensor. For a specific configuration, reference may be made to FIG. 1. A conventional lens module 100 includes a lens group 12, a lens barrel 14, and an image sensor 16. The lens group 12 includes a lens 121 for focusing and an IR-cut filter 122 for filtering infrared rays in the optical image signal. The lens 121 and the infrared cut filter 122 are housed in the mirror. The inside of the barrel 14. The image sensor 16 includes an image sensing chip 161, a cover 162 and a substrate 163. The image sensing wafer 161 is fixed on the substrate 163. The cover 162 is made of a transparent material such as glass. The edge is fixed on the edge of the substrate 163, and the image sensing wafer 161 is packaged between the cover 162 and the substrate 163. The image sensor 16 is mounted on the end of the ® lens barrel 12, and the cover plate 162 and the image sensing wafer 161 are sequentially located on the outgoing light path of the lens group 12. The optical image signal entering the lens barrel 14 is filtered by the focus of the lens 121 and the infrared cut filter 122, and then passes through the cover plate 162 to the image sensing wafer 161. The image sensing wafer 161 converts the optical image signal into an electronic image signal. Since the lens 121, the infrared cut filter 122 and the cover 162 of the lens module 100 are generally made of glass or plastic, the weight and the volume are large, and it is required to occupy a large assembly space and be used in use. Inconvenience, while 6 1312440 f increases the production cost of the lens module 100. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a lens module that can reduce the volume, reduce the weight, and ensure good performance. A lens module includes a lens barrel, a lens, and an image sensor. The lens is received in the lens barrel, and the image sensor is mounted on one end of the lens barrel. The image sensor includes an image. a sensing chip, a 荖 plate, a substrate and an infrared cut filter film, the image sensing chip is fixed on the base plate, the cover plate is also fixed on the substrate, and the image sensing chip is packaged between the cover plate and the substrate The infrared cut filter film is disposed on the surface of the cover plate. Compared with the prior art, the lens module replaces the infrared cut filter with an infrared cut filter, which can effectively reduce the volume of the lens mold and the weight of the light lens module; The cover plate serves as a medium for the infrared ray stop filter film, which is beneficial for protecting the image sensing chip and the infrared cut-off light film.
【實施方式】 請參閱圖2,本發明之第一較佳實施例提供—鏡顯才 組200包括一鏡筒2、一鏡片3及一影像感測器4。其中 片3收容於鏡筒2内部，影像感測器4裴設於鏡辑 鏡筒2係一中空圓枉體，可由塑膠等材料通過 ^ 型等方式製成。該鏡筒2包括一内圓柱面201、〜出； 21及一與該拍攝端21相對設置之封裝端22。尨奴攝! 中心開設有一開口 23。 ’ 鏡片3係一透鏡，該鏡片3收容於鏡筒2内 。’鏡. 7 1312440 $之邊緣與内圓杈面201緊密配合，以卡配或膠合之方式 固定於鏡筒2内部。可以理解，鏡筒2内可採用同樣方式 收容複數片鏡片3。 影像感測器4包括一影像感測晶片41、一蓋板42、 一基板43及一奴外截止濾光膜44。影像感測晶片41固定 於基板43上；蓋板42係由玻璃等透明材料製成之平板或 透鏡’製造時可根據實際應用之需要選擇不同種類之蓋板 42 °該蓋板42之邊緣固定於基板43之邊緣上，並將影像 ® 感測晶片41封裝於蓋板42與基板43之間。紅外截止濾光 膜44以鍍覆或膠合等方式佈設於蓋板42之外表面，即將 蓋板42置於該紅外截止濾光膜44與影像感測晶片41之 間。 級裝時’將影像感測器4固定於鏡筒2之封裝端22 上’令紅外截止濾光膜44、蓋板42及影像感測晶片41依 二欠位於鏡片3之出射光路上，即完成所述鏡頭模組200之 φ 組裝。使用該鏡頭模組200進行拍攝時，光學影像訊號從 開設於拍攝端21之開口 23進入鏡筒2，經過鏡片3聚焦 後從封襄端22射出，然後經過紅外截止濾光膜44之過濾， 穿過蓋板42到達影像感測晶片41。 可以理解，由於該鏡頭模組200以紅外截止濾光膜44 代替習知鏡頭模組之紅外截止濾光片，因此能夠有效地縮 小體積及減輕重量。 請參閱圖3,本發明之第二較佳實施例提供一鏡頭模 組3⑻，該鏡頭模組3〇〇之部件與上述鏡頭模組200相同， 8 1312440 其區別在於該鏡頭模組300中紅外截止濾光膜44佈設於蓋 板42之内表面，即將該紅外截止濾光膜44置於蓋板42 與影像感測晶片41之間，從而使蓋板42、紅外截止濾光 膜44及影像感測晶片41依次位於鏡片3之出射光路上。 其他部件之組裝方式均與鏡頭模組200相同。使用該鏡頭 模組300進行拍攝時，光學影像訊號從開設於拍攝端21 之開口 23進入鏡筒2，經過鏡片3聚焦後從封裝端22射 出，然後穿過蓋板42，經過紅外截止濾光膜44之過濾後 • 到達影像感測晶片41。 可以理解，與上述鏡頭模組200相似，該鏡頭模組300 以紅外截止濾光膜44代替習知鏡頭模組之紅外截止濾光 片，能夠有效地縮小體積及減輕重量；另外，由於紅外截 止濾光膜44佈設於蓋板42内表面並與影像感測晶片41 同樣被封裝於蓋板42與基板43之間，因此該鏡頭模組300 能夠有效地防止紅外截止濾光膜44於組裝及使用過程受 ^ 到外界之灰塵、水分等雜物之污染。 請參閱圖4,本發明之第三較佳實施例提供一鏡頭模 組400,該鏡頭模組400包括一鏡筒2、一鏡片3及一影像 感測器5。鏡筒2及鏡片3之構造及組裝方式與上述鏡頭 模組200及鏡頭模組300相同。影像感測器5包括一影像 感測晶片51、一蓋板52、一基板53、一紅外截止濾光膜 54及一結合部55。影像感測晶片51固定於基板53上。蓋 板52係由玻璃等透明材料製成之平板或透鏡，結合部55 係由塑膠或金屬等材料形成且具有台階孔之環狀連接部 9 1312440 知，蓋板52之邊緣通過卡配或膠合等方式固定於結合部 55上’結合部55通過膠合或焊接等方式固定於基板53之 邊緣上，將影像感測晶片51封裝於蓋板52與基板53之 間。、红外截止濾光膜54以鍍覆或膠合等方式佈設於蓋板 52之内表面，即將該紅外截止濾光膜54置於蓋板52與影 像感洌晶片51之間。[Embodiment] Referring to FIG. 2, a first preferred embodiment of the present invention provides a mirror assembly 200 including a lens barrel 2, a lens 3, and an image sensor 4. The film 3 is housed inside the lens barrel 2, and the image sensor 4 is disposed in the mirror barrel 2, which is a hollow circular body, and can be made of a plastic or the like by a type or the like. The lens barrel 2 includes an inner cylindrical surface 201, an output 21, and a package end 22 disposed opposite the imaging end 21.尨 摄 Photo! The center has an opening 23 . The lens 3 is a lens which is housed in the lens barrel 2. 'Mirror. 7 1312440 $ The edge is closely matched with the inner circular surface 201, and is fixed to the inside of the lens barrel 2 by snapping or gluing. It can be understood that the plurality of lenses 3 can be accommodated in the same manner in the lens barrel 2. The image sensor 4 includes an image sensing wafer 41, a cover 42 , a substrate 43 and an external cut filter film 44 . The image sensing wafer 41 is fixed on the substrate 43; the cover 42 is a flat plate or a lens made of a transparent material such as glass. When manufacturing, a different type of cover 42 can be selected according to the needs of the actual application. On the edge of the substrate 43, the image sensor 34 is packaged between the cover 42 and the substrate 43. The infrared cut filter film 44 is disposed on the outer surface of the cover 42 by plating or gluing, that is, the cover 42 is placed between the infrared cut filter film 44 and the image sensing wafer 41. When the stage is mounted, the image sensor 4 is fixed on the package end 22 of the lens barrel 2, so that the infrared cut filter film 44, the cover 42 and the image sensing wafer 41 are located on the exit light path of the lens 3, that is, The φ assembly of the lens module 200 is completed. When the lens module 200 is used for photographing, the optical image signal enters the lens barrel 2 from the opening 23 opened at the photographing end 21, is focused by the lens 3, is emitted from the sealing end 22, and then filtered by the infrared cut filter film 44. The image sensing wafer 41 is passed through the cover 42. It can be understood that since the lens module 200 replaces the infrared cut filter of the conventional lens module with the infrared cut filter film 44, the volume can be effectively reduced and the weight can be reduced. Referring to FIG. 3, a second preferred embodiment of the present invention provides a lens module 3 (8). The components of the lens module 3 are the same as the lens module 200, and 8 1312440 is different in the infrared of the lens module 300. The cut-off filter film 44 is disposed on the inner surface of the cover 42 , that is, the infrared cut filter film 44 is disposed between the cover 42 and the image sensing wafer 41 , so that the cover 42 , the infrared cut filter 44 and the image The sensing wafers 41 are sequentially located on the outgoing light path of the lens 3. The other components are assembled in the same manner as the lens module 200. When the lens module 300 is used for photographing, the optical image signal enters the lens barrel 2 from the opening 23 opened at the photographing end 21, is focused by the lens 3, is emitted from the package end 22, and then passes through the cover 42 through the infrared cut filter. After filtering of the film 44, the image sensing wafer 41 is reached. It can be understood that, similar to the lens module 200 described above, the lens module 300 replaces the infrared cut filter of the conventional lens module with the infrared cut filter film 44, which can effectively reduce the volume and reduce the weight; The filter film 44 is disposed on the inner surface of the cover 42 and is encapsulated between the cover 42 and the substrate 43 in the same manner as the image sensing wafer 41. Therefore, the lens module 300 can effectively prevent the infrared cut filter film 44 from being assembled. The use process is contaminated by foreign matter such as dust, moisture and the like. Referring to FIG. 4, a third preferred embodiment of the present invention provides a lens module 400. The lens module 400 includes a lens barrel 2, a lens 3, and an image sensor 5. The structure and assembly of the lens barrel 2 and the lens 3 are the same as those of the lens module 200 and the lens module 300 described above. The image sensor 5 includes an image sensing chip 51, a cover 52, a substrate 53, an infrared cut filter film 54, and a bonding portion 55. The image sensing wafer 51 is fixed to the substrate 53. The cover plate 52 is a flat plate or a lens made of a transparent material such as glass, and the joint portion 55 is an annular joint portion 9 1312440 formed of a material such as plastic or metal and having a stepped hole. The edge of the cover plate 52 is engaged or glued. The bonding portion 55 is fixed to the edge of the substrate 53 by gluing or soldering, and the image sensing wafer 51 is encapsulated between the cover 52 and the substrate 53. The infrared cut filter film 54 is disposed on the inner surface of the cover 52 by plating or gluing, that is, the infrared cut filter film 54 is placed between the cover 52 and the image sensing wafer 51.
級裴時，將影像感測器5固定於鏡筒2之封裝端22 上’令蓋板52、紅外截止濾光膜54及影像感測晶片51依 —人位於鏡片3之出射光路上，即完成所述鏡頭模組400之 組農。使用該鏡頭模組400進行拍攝時，光學影像訊號從 開叹於拍攝端21之開口 23進入鏡筒2，經過鏡片3聚焦 後從封裝端22射出，然後穿過蓋板52，經過紅外截止濾 光膜54之過濾後到達影像感測晶片51。 可以理解，所述鏡頭模組400通過結合部55將蓋板 口疋於基板53上，相較於將蓋板52佈設有紅外截止濾 54之内表面直接膠合或焊接於基板54上之組裝方 :種、且裝方式更易於實現’亦有利於加強影像感測器 之牛固程度及加強對紅外截止渡光膜54與蓋板％之保 \ ^時’該鏡頭模組蝴以紅外截止濾光膜Μ代替習知 =拉組之紅外截止濾、光片’能夠有效地縮小體積及減輕 靈置。 选據實際生產應用中之不同情況，亦可將該紅外 截慮先膜54佈設於蓋板％之外表面，或於蓋板52内部 形成該紅外#，再通過結合部％將蓋板^固 1312440 %年曰修正補充 定於基板53上。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，本發 明之範圍並不以上述實施例為限，舉凡熟習本案技藝之人 士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 【圖式簡單說明】 圖1係一種習知鏡頭模組之示意圖。 圖2係本發明鏡頭模組第一較佳實施例之示意圖。 圖3係本發明鏡頭模組第二較佳實施例之示意圖。 圖4係本發明鏡頭模組第三較佳實施例之示意圖。 【主要元件符號說明】 (習知） 鏡頭模組 100 鏡片組 12 鏡片 121 紅外截止濾光片 122 鏡筒 14 影像感測器 16 影像感測晶片 161 蓋板 162 基板 163 (本發明） 鏡頭模組 200,300,400 aJl. 鏡向 2 内圓柱面 201 拍攝端 21 封裝端 22 開口 23 鏡片 3 影像感測器 4,5 影像感測晶片 41,51 蓋板 42,52 11 1312440 44,54 基板 43,53 紅外截止濾光膜 結合部 55The image sensor 5 is fixed on the package end 22 of the lens barrel 2, so that the cover 52, the infrared cut filter film 54 and the image sensing wafer 51 are located on the exit light path of the lens 3, that is, The group of the lens module 400 is completed. When the lens module 400 is used for photographing, the optical image signal enters the lens barrel 2 from the opening 23 of the photographing end 21, is focused by the lens 3, is emitted from the package end 22, and then passes through the cover 52 through the infrared cut filter. The light film 54 is filtered and reaches the image sensing wafer 51. It can be understood that the lens module 400 is attached to the substrate 53 through the joint portion 55, and is assembled or welded directly to the substrate 54 by the inner surface of the infrared cut filter 54 disposed on the cover 52. : Kind, and the installation method is easier to implement' is also beneficial to strengthen the image sensor's solidity and strengthen the protection of the infrared cut-off light film 54 and the cover plate. The light film Μ replaces the conventional = infrared cut filter of the pull group, the light sheet 'can effectively reduce the volume and reduce the flexibility. According to different conditions in the actual production application, the infrared intercepting film 54 may be disposed on the outer surface of the cover plate %, or the infrared # may be formed inside the cover plate 52, and then the cover plate is fixed by the joint portion %. The 1312440% annual correction is fixed on the substrate 53. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional lens module. 2 is a schematic view of a first preferred embodiment of a lens module of the present invention. 3 is a schematic view of a second preferred embodiment of the lens module of the present invention. 4 is a schematic view of a third preferred embodiment of the lens module of the present invention. [Main component symbol description] (General) Lens module 100 Lens group 12 Lens 121 Infrared cut filter 122 Lens tube 14 Image sensor 16 Image sensing wafer 161 Cover plate 162 Substrate 163 (Invention) Lens module 200,300,400 aJl. Mirror 2 Inner cylindrical surface 201 Shooting end 21 Package end 22 Opening 23 Lens 3 Image sensor 4,5 Image sensing wafer 41, 51 Cover 42, 52 11 1312440 44, 54 Substrate 43, 53 IR cutoff Filter film bonding portion 55
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