TWM403670U - Image sensing device - Google Patents

Description

100 years, February, 17th, the shuttle is replacing page five, the new description: [New technology field] [〇(8)1] This creation is about a kind of image sensing device package structure', especially a thin image sensing device The package structure. [Prior Art] 科技13⁄4 advances in technology'' Handheld mobile devices are integrated with digital camera functions such as mobile phones, personal digital assistants (PDAs) desire. [0003] The main core component of these digital camera functions is an image sensing module, and the image sensing module includes at least one image sensing unit and a lens group. The image sensing unit is a semiconductor component that converts an optical image into an electronic signal, and the lens group is used to image an external scene onto the image sensing unit. [0004] Referring to the first figure, it is a cross-sectional view of a conventional color image sensing module. The image sensing module comprises a substrate 91, an image sensing chip 92, a plurality of metal leads 93, a transparent cover sheet 94, a mirror holder 95 and a lens assembly 96. The image sensing chip 92 is disposed on the substrate 91. The metal wires 93 are electrically connected between the substrate 91 and the image sensing chip 92 to provide operation of the image sensing chip 92. A power supply. The transparent cover sheet 94 is disposed inside the support base 95 to close the image sensing chip 92 to prevent the image sensing chip 92 from being finely affixed to the image sensing wafer 92. The lens group 96 is disposed on the image sensing chip 92. In the lens holder 95, the lens holder 95 and the lens unit 96 are accurately positioned above the image sensing wafer 92. 20% Form No. A0101 M403670 Correction Replacement Page on February 17, 100 [0005] The image sensing module 90 converges external image light through the lens group 96 fixed in the lens holder 95, and passes through the transparent cover sheet. 94 is imaged in one of the sensing regions of the image sensing chip 92, so that the image sensing unit 92 captures a shadow. [0006] However, the lens holder 95 for supporting the lens assembly 96 is mostly a plastic housing. During the packaging process, the image sensing wafer 92 is easily contaminated by the fine dust, causing a loss in yield; and the lens holder 95 is bulky and cannot meet the demand of the thinned handheld device on the market. Moreover, in order to accurately position the lens group 96 on the image sensing chip 92, the positioning of the lens group must be completed through a highly accurate positioning fixture.

The manufacturing cost is extremely high [new content] [0007] In view of the prior art, an object of the present invention is to provide an image sensing device, the overall thickness of the image sensing device is extremely thin, and is suitable for thinning Handheld device. In order to achieve the above object, the present invention provides an image sensing device including an image sensing unit, an optical cover, and a glue. The optical cover is disposed on the image sensing unit, and the adhesive material is disposed around the image sensing unit and the optical cover to fix the optical cover to the image sensing unit.

According to an embodiment of the present invention, the image sensing unit includes a substrate and an image sensing chip, the substrate includes an upper surface and a lower surface, and the image sensing wafer includes a sensing surface and With respect to the back surface of the sensing surface, the back surface is disposed on the upper surface of the substrate, and the image sensing form is edited. A0101 Page 4 / Total 20 pages, February 17, 100, the replacement of the page sensing unit is sensed. The mask has a sensing area. According to a specific embodiment of the present invention, the image sensing unit further includes a plurality of metal leads electrically connected across the substrate and the image sensing wafer, [0011] according to the present invention. In one embodiment, the optical cover includes a light-transmissive base and a lens portion, and the lens portion is protruded from an upper surface of the base, and a lower surface of the transparent base is attached to the sensing surface; According to a specific embodiment of the present invention, the optical cover includes a transparent base, a lens portion and a support portion, and the lens portion is disposed on an upper surface of the transparent base, and the support portion is disposed on the optical cover a lower surface of the light-transmitting base, and the support portion is attached to the sensing surface; [0013] According to a specific embodiment of the present invention, the optical cover may be an anti-infrared penetrating sheet or an anti-reflecting sheet [0014] According to one embodiment of the present invention, the image sensing device further includes a lens set disposed on the optical cover, and one of the focus of the lens set is located in the sensing area; [0015] One of the creations For example, the adhesive material is disposed around the image sensing unit, the optical cover, and the lens assembly to fix the optical cover and the lens assembly to the image sensing unit; [0016] A specific embodiment, wherein the lens set comprises a lens barrel, and a plurality of lenses embedded in the lens barrel; [0017] According to an embodiment of the present invention, the image sensing device further comprises a lens The carrier board and a support base, one side of the support base is clamped to the lens group form No. A0101, page 5 / total 20 pages, M403670, revised on February 17, 100, the other side is along the image sense The measuring unit is disposed on the carrier edge. Compared with the prior art, the image sensing device of the present invention achieves the fixing and positioning of the image sensing chip and the optical lens group by using a glue material, which can effectively reduce the height of the overall image sensing device. For use in today's thin handheld devices. Embodiments [0019]

Referring to the second figure, a cross-sectional view of the image sensing device package structure of the first embodiment of the present invention is shown. Let the image sensing device include an image sensing list • Λ*,

The body 20 and the optical cover 20 are disposed on the image sensing unit 10, and the optical cover 20 is disposed on the image sensing unit 10. The image sensing unit 10 includes a substrate 12, an image sensing wafer 14 and a plurality of metal leads 16, a surface of the substrate 12 and a surface 124 opposite to the upper surface 122. The substrate 12 may be a fiberglass board (FR-4), a high temperature resistant epoxy glass fiber board (FR-5) or a ceramic substrate. [0021] The image sensing chip 14 includes a sensing surface 142 and a back surface 144 opposite to the sensing surface 142. The sensing surface 142 includes a sensing region 143. The image sensing wafer 14 The back surface 14 4 is attached to the upper surface 222 of the substrate 1 2 , and the image sensing wafer 14 can be a photosensitive coupled device (CCD) or a complementary metal oxide semiconductor (Complementary Metal-Ox i de Semi conductor, Form No. Λ0101 Page 6 of 20 [0022] On February 17, 100, Geng Zheng replaced page COMS). The metal leads 16 are electrically connected between the substrate 12 and the image sensing wafer 14 for providing power supply during operation of the image sensing wafer 14 wherein the metal leads 16 can be gold Leads made of metals such as silver or silver. [0023] The optical cover 20 includes a transparent base portion 22 and a lens portion 24, and a lower surface of the transparent base portion 22 is attached to the sensing surface 142 to effectively block external micro dust from entering the sensing. The area 143 affects the imaging quality of the image sensing device. The lens portion 24 is disposed on an upper surface of the transparent base portion 22, and a focus of the lens portion 24 is located in the sensing region 143 for focusing and imaging the external scene light to the image sensing. The sensing area 14 3 of the chip 14 enables the image sensing unit 1 to capture a clear image, wherein the optical cover 20 can be made of glass or plastic material and has anti-infrared or anti-reflection function. The anti-infrared function is used to effectively block infrared rays, and the infrared rays are prevented from affecting the imaging σσ shell of the image sensing device, and the anti-reflection function is used to increase the transmittance of external light to improve the imaging quality of the image sensing device. . [0024] In addition, the image sensing device may further include a light transmissive sheet 35. As shown in the third figure, the light transmissive sheet 35 may be an anti-infrared function corresponding to the anti-infrared function of the optical cover 2 The light transmissive sheet 35 can correspond to the anti-reflection function of the optical cover 2, which is an anti-infrared penetrating sheet (10) filter (IR filter). [0025] The knee material 30 (four) is provided with the material phase single (four) (four) optical cover (four) around the form number A0101 page 7 / total 20 pages M403670 100 February 17, revised replacement page to seal the metal lead 16 and The optical cover 20 is fixed on the image sensing unit 10 to avoid the focus shift of the lens portion 24; wherein the adhesive 30 can be a UV-curable adhesive, a high-viscosity thermosetting adhesive or other adhesive. The effect of the glue. The first embodiment combines the previously described transparent cover sheet with the lens set to form an optical cover 20, and the optical cover 20 can effectively prevent micro dust from entering the sensing area 143. In order to improve the yield of the image sensing device, and effectively reduce the height of the image sensing device, the overall volume is more

Thin and small, suitable for thin-type handheld devices, and can effectively reduce the overall manufacturing cost of the whole body.

Sensing device element 10, a [0027] with reference to the cross-sectional view of the first. The adhesive material 30 and an optical cover 40 are the same as the first embodiment described above, and are not described herein. The optical cover 40 is disposed on the side of the shadow frame 14i, and includes a transparent base portion 42, a lens portion and a portion 46. The support portion 46 is disposed on a lower surface of the transparent base portion 42. The lens portion 44 is protruded from the upper surface of the light-transmitting base portion 42, and a focus of the lens portion 44 is located in the sensing region 143. The light-transmitting base portion 42 and the lens portion 44 may be glass. It is made of plastic material and has anti-infrared or anti-reflection function. The anti-infrared function is used to effectively block infrared rays, avoiding infrared rays affecting the image quality of the image sensing device; anti-reflection function is used to increase external light. The penetration rate to improve the image quality of the image sensing device. Form No. A0101 Page 8 of 20 M403670 February 17th, 100th, Nuclear Replacement Page [0029] The support portion 46 is attached to the sensing surface 142 of the image sensing wafer 14 to make the transparent base 4 2 has a gap above the image sensing wafer 14 so that the external image light is accurately focused on the sensing region 143. Further, the height of the support portion 46 can be adjusted depending on the focal length of the lens portion 44. The support portion 46 can be formed on the optical cover 40 by injection or molding, and is made of a plastic material or a glass material corresponding to the material of the transparent base portion 42 and the lens portion 44. Alternatively, the support portion 46 can be a The ring photoresist material, and the photoresist material can be a dry etching photoresist material or a wet etching photoresist material. [0030] The adhesive material 30 is disposed around the image sensing unit 10 and the optical cover 40 to effectively fix the optical cover 40 to the image sensing unit 10 to avoid the lens portion 44. The focus is offset, wherein the glue 30 can be a UV-curable adhesive, a high-viscosity municipal cured adhesive or other adhesive having an adhesive effect. The support portion 46 is disposed around the sensing portion 143 of the image sensing wafer 14 in the second embodiment. The support portion 46 is disposed on the base of the optical lens unit. Effectively blocking the penetration of the glue 30 into the sensing area 143 to affect the imaging quality of the image sensing device; and the height of the support portion 46 can be matched with the focal length of the lens portion 44 to accurately align the external light. Focusing on the sensing region 143. [0032] Referring to FIG. 5, a cross-sectional view of the image sensing device of the third embodiment of the present invention is shown. The image sensing device comprises an image sensing unit 10, a glue 30, an optical cover 50 and a lens set 60. [0033] The image sensing unit 10 includes a substrate 12, an image sensing wafer 14 and a surface number A0101, a page 9 of a total of 20 legs, 3670, and a plurality of metal leads 16 on February 17, 100. The substrate 12 includes An upper surface 122 and a lower surface 124 of the upper surface 122, the substrate 12 may be a fiberglass board, a high temperature resistant epoxy fiberglass board or a ceramic substrate. The image sensing wafer 14 includes a sensing surface 14 2 and a back surface 144 * relative to the sensing surface 142 and the sensing surface 142 includes a sensing region 143. The back surface 144 of the image sensing wafer 14 is attached to the upper surface 122' of the substrate 12 and the image sensing wafer 14 may be a photosensitive coupling element or a complementary metal oxide semiconductor.

[0035] The metal leads 16 are electrically grounded across the substrate 12 and the image sensing wafer 14, wherein the metal is formed by the leads. [0036] The optical cover 50 is disposed on the external dust to contaminate the sensing area 143, and affects the imaging quality of the image sensing device. Wherein the optical cover 5 〇 can be an anti-infrared penetrating sheet to effectively block the infrared ray to avoid the red and the imaging quality of the sacral sensing device; in addition, the optical cover reads 5 〇; Film to increase the penetration of external light and improve image quality. The lens group 60 is disposed on the image sensing unit 1 , and one of the lens groups 6 is located in a sensing area 143 of the image sensing wafer 14 , and the lens group 60 includes a lens barrel. 62 and a plurality of lenses 64 are embedded in the lens barrel 62 for focusing an external image on the sensing area 143 of the image sensing unit 10, so that the image sensing unit can be A clear image is captured in which the lenses 64 can be made of glass or plastic. Form No. A0101 Page 10/Total 20 pages M403670 On February 17, 100, according to the replacement page [0038] The glue 30 is disposed around the image sensing unit 10, the optical cover 50 and the lens group 60. The optical cover 50 and the lens assembly 60 are fixed to the image sensing unit 10 to prevent the external micro dust from contaminating the image sensing wafer 14 and avoiding the focus shift of the lens group 60. The glue 30 may be a UV-curable adhesive, a high-viscosity municipal cured adhesive or other adhesive having an adhesive effect. The image sensing chip of the third embodiment is configured to fix the optical cover 50 and the lens assembly 60 to the image sensing wafer 14 by the adhesive 30, thereby effectively reducing the image. The height of the sensing device and the manufacturing cost 〇 [0040] Referring to the sixth drawing, a cross-sectional view of the image sensing device according to the fourth embodiment of the present invention is shown. The image sensing device 10 includes an image sensing unit 10, a glue 30, an optical cover 50, a lens assembly 60, a carrier 70, and a support base 80. The image sensing unit 10 is disposed on the image sensing unit 10 The image sensing unit 10 includes a substrate 12, an image sensing wafer 14 and a plurality of metal leads 16 . [0041] The substrate includes an upper surface 122 and a lower surface 124 opposite the upper surface 122, wherein the substrate 12 can be a fiberglass board, a high temperature resistant epoxy glass board or a ceramic substrate. The image sensing chip 14 includes a sensing surface 142, a back surface 144 opposite to the sensing surface 142, and a sensing region 143 on the sensing surface 142. The back surface 144 of the image sensing wafer 14 is attached to the upper surface 122 of the substrate 12, and the image sensing wafer 14 can be a photosensitive coupling element or a complementary metal oxide semiconductor. Form No. A0101 Page 11 / Total 20 pages M403670 On February 17, 100, according to the replacement page [0043] The metal leads 16 are electrically connected across the substrate 12 and the image or wafer 14, wherein The metal lead 16 may be a lead made of a metal such as gold, lead or silver. [0045] [0045]

The optical cover 50 is disposed above the image sensing wafer 14. The optical cover 50 can effectively prevent external dust from adhering to the image sensing wafer 14 to affect the imaging quality of the image sensing device. The optical cover 50 can be an anti-infrared penetrating sheet to effectively block infrared rays and avoid imaging quality of the image sensing device of the infrared image. Moreover, the optical cover 50 can also be an anti-reflection sheet to increase external light. The penetration rate improves image quality.

The adhesive material 30 is disposed around the image sensing light dam body 50 and the lens group & ,4, and is used for fixing the lens group 6〇 to the image sensing unit 10 to prevent the external black dust from contaminating the image sense. The wafer 14 is tested and the focus shift of the lens set 60 is avoided; wherein the adhesive material 30 can be a UV curable adhesive, a high: private A, a warm adhesive, or other adhesive having an adhesive effect. [0046] The lens assembly 60 includes a lens barrel 62 and a plurality of lenses 64 embedded in the lens barrel 62. The lens barrel 62 is fixed to the support base 80. The support base 80 is disposed on the carrier board. The image sensing wafer 14 4 is covered and the inner surface of the support base 80 is aligned with the edge of the adhesive material 30 and the image sensing wafer 14 to achieve the function of direct positioning. [0047] The image sensing device of the fourth embodiment uses the adhesive material 30 to fix the optical cover 50 to effectively prevent the external dust from contaminating the sensing region 143 and affecting the image quality of the image sensing device. ; the support base 80 to be the form number A0101 page 2 / 20 pages M403670 [0048] 100 years of February 17, the replacement page

[0053] [0053] [0053]

[0059] [0059] [0059] The lens set 60 is fixed on the image sensing wafer 14, wherein the support 80 is transmitted through the edge of the image sensing unit 10 to complete positioning. Therefore, the problem of the alignment accuracy of the lens group 60 can be achieved without additionally using an expensive automatic positioning device, thereby effectively reducing the manufacturing cost. However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited, that is, the equal changes and modifications made by the scope of the patent application of the present invention should still be covered by the patent of the present invention. The scope is intended to protect the mouth. [Simple Description of the Drawings] The first figure is a cross-sectional view of a conventional image sensing module. The second figure is a cross-sectional view of the image sensing device of the first embodiment of the present invention. The third figure is another cross-sectional view of the image sensing apparatus of the first embodiment of the present invention. The fourth figure is a cross-sectional view of the image sensing device of the second embodiment of the present invention. The fifth figure is a cross-sectional circle of the image sensing device of the third embodiment of the present invention. Figure 6 is a cross-sectional view showing the image sensing device of the fourth embodiment of the present invention. [Major component symbol description] <Prior Art> 90 image sensing module 91 substrate 92 image sensing wafer 93 metal lead form number A0101 page 3 / total 20 pages M403670 [0060] 94 transparent cover sheet [0061] 95 mirror Block [0062] 96 Lens Set [0063] <This Creation> [0064] 10 Image Sensing Unit [0065] 12 Substrate [0066] 122 Upper Surface [0067] 124 Lower Surface [0068] 14 Image Sensing Wafer [0069] 142 Sensing surface [0070] 143 丨 sensing area [0071] IA4: back [0072] 16 metal lead [0073] 20 ' 40 ' 50 optical cover [0074] 22, 42 base [0075] 24, 44 lens [0076] 30 glue material [0077] 35 light-transmissive sheet [0078] 46 support part form number A0101 100 years of February 17, revised replacement page

Page 14 of 20 M403670 [0079] 60 Lens Set [0080] 62 Lens Tube [0081] 64 Lens [0082] 70 Carrier [0083] 80 Support Base Form No. A0101 Page 15 of 20

Replaced &quot;S after February 17, 100

Claims (1)

M403670 Modified on February 17, 100, the patent application scope: An image sensing device comprising: an image sensing unit; an optical cover disposed on the image sensing unit; and a glue material disposed on The image sensing unit and the periphery of the optical cover are used to fix the optical cover to the image sensing unit. The image sensing device of claim 1, wherein the image sensing unit comprises: a substrate comprising an upper surface and a lower surface; and an image sensing chip comprising a sensory S and a thumb : On the back of the sensing surface of the powder • - -ννΛΑ».- The sensing layer of the back surface of the substrate sensing unit has a sensing area. The image sensing device of claim 2, wherein the image sensing unit further comprises a plurality of metal leads electrically connected across the substrate and the image sensing wafer. The optical cover body includes a light-transmitting base portion and a lens 凸, the lens portion is protruded from an upper surface of the light-transmitting base portion, and the lens cover portion is provided on the upper surface of the light-transmitting base portion. One of the lower surfaces of the light base is attached to the sensing surface. 5. The image sensing device of claim 2, wherein the optical cover comprises a light transmissive base, a lens portion and a support portion, the lens portion protruding from an upper surface of the light transmissive base The support portion is disposed on a lower surface of the light transmissive base, and the support portion is attached to the sensing surface. 6. The image sensing device of claim 1, wherein the optical cover is an anti-infrared penetrating sheet or an anti-reflecting sheet. 099219616 Form No. 1010101 Page 16 of 20 1003052753-0 M403670 _ 100 years of February 17th, the replacement of the page is as shown in Figure 2. The image sensing device according to claim 2, further includes a lens group, setting On the optical cover, and one of the focus of the lens group is located in the sensing area. 8. The image sensing device of claim 7, wherein the adhesive material is disposed around the image sensing unit, the optical cover and the lens group to cover the optical cover and the lens. The group is fixed on the image sensing unit. 9. The image sensing device of claim 7, wherein the lens group comprises a lens barrel and a plurality of lenses embedded in the lens barrel. The image sensing device of claim 7, further comprising a carrier plate and a support base, one side of the support base is for clamping the lens group, and the other side is along the same The image sensing unit is disposed on the carrier edge. The image sensing device of claim 2, further comprising a light transmissive sheet disposed between the image sensing wafer and the optical cover, and the light transmissive sheet may be an anti-infrared Transmissive or anti-reflective sheeting. 099219616 Form number A0101 Page/total 20 pages 1003052753-0