TWM403670U - Image sensing device - Google Patents
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- TWM403670U TWM403670U TW99219616U TW99219616U TWM403670U TW M403670 U TWM403670 U TW M403670U TW 99219616 U TW99219616 U TW 99219616U TW 99219616 U TW99219616 U TW 99219616U TW M403670 U TWM403670 U TW M403670U
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100年02月17 0梭正替換頁 五、新型說明: 【新型所屬之技術領域】 [〇⑻1]本創作係有關於-種影像感測裝置封裝結構’尤指一種 薄型化之影像感測裝置之封裝結構。 【先前技術】 闕1¾著科技的進步’各種手持式的行動裝置皆整合有數位 攝像功能,如:行動電話、個人數位化助理(pDA)、數位 相機,以滿足人們想隨時隨地記錄生活點滴的渴望。 [0003] 這些數位攝像功能的主要核心元件為影像感測模組,影 像感測模組至少包含有一影像感測單元,以及一鏡片組 。其中該影像感測單元是一種將光學影像轉換成電子信 號的半導體元件,該鏡片组係用以將外界景物成像於該 影像感測單元上。 [0004] 配合參閱第一圖,為習知之彩像感測模組之剖視圖。該 影像感測模組包含一基板91、一影像感測晶片92、複數 條金屬引線93、一透光蓋片94、一鏡座95及一鏡片組96 。該影像感測晶片92係設置於該基板91上,該等金屬引 線93係電連接地跨設於該基板91與該影像感測晶片92之 間,以提供該影像感測晶片92運作時之一電力提供。該 透明蓋片94設置於該支撐座95内部,以封閉該影像感測 晶片92,避免該影像感測晶片92受外界微粉細著於該 影像感測晶片92,該鏡片組96係設置於該鏡座95内,並 且,該鏡座95連同該鏡片組96係精確定位地設置於該影 像感測晶片9 2上方。 20 % 表單编號A0101 M403670 100年02月17日修正替换頁 [0005] 該影像感測模組90係利用固定於鏡座95中之鏡片組96將 外界影像光線會聚後,經該透明蓋片94成像於該影像感 測晶片92之一感測區,使該影像感測單元92擷取到一影 [0006] 然而,用以支撐該鏡片組96之鏡座95多為塑膠殼體,於 封裝過程中,易有微粉塵污染該影像感測晶片92,造成 良率上的損失;且該鏡座95的體積大,無法符合市場上 薄型化手持裝置的需求。並且,習知為使得該鏡片組96 精確地定位於該影像感測晶片92時,必須額外透過一精 確度極高之定位治具完成該鏡片組之定位,其整體100 years, February, 17th, the shuttle is replacing page five, the new description: [New technology field] [〇(8)1] This creation is about a kind of image sensing device package structure', especially a thin image sensing device The package structure. [Prior Art] 科技13⁄4 advances in technology'' Handheld mobile devices are integrated with digital camera functions such as mobile phones, personal digital assistants (PDAs) desire. [0003] The main core component of these digital camera functions is an image sensing module, and the image sensing module includes at least one image sensing unit and a lens group. The image sensing unit is a semiconductor component that converts an optical image into an electronic signal, and the lens group is used to image an external scene onto the image sensing unit. [0004] Referring to the first figure, it is a cross-sectional view of a conventional color image sensing module. The image sensing module comprises a substrate 91, an image sensing chip 92, a plurality of metal leads 93, a transparent cover sheet 94, a mirror holder 95 and a lens assembly 96. The image sensing chip 92 is disposed on the substrate 91. The metal wires 93 are electrically connected between the substrate 91 and the image sensing chip 92 to provide operation of the image sensing chip 92. A power supply. The transparent cover sheet 94 is disposed inside the support base 95 to close the image sensing chip 92 to prevent the image sensing chip 92 from being finely affixed to the image sensing wafer 92. The lens group 96 is disposed on the image sensing chip 92. In the lens holder 95, the lens holder 95 and the lens unit 96 are accurately positioned above the image sensing wafer 92. 20% Form No. A0101 M403670 Correction Replacement Page on February 17, 100 [0005] The image sensing module 90 converges external image light through the lens group 96 fixed in the lens holder 95, and passes through the transparent cover sheet. 94 is imaged in one of the sensing regions of the image sensing chip 92, so that the image sensing unit 92 captures a shadow. [0006] However, the lens holder 95 for supporting the lens assembly 96 is mostly a plastic housing. During the packaging process, the image sensing wafer 92 is easily contaminated by the fine dust, causing a loss in yield; and the lens holder 95 is bulky and cannot meet the demand of the thinned handheld device on the market. Moreover, in order to accurately position the lens group 96 on the image sensing chip 92, the positioning of the lens group must be completed through a highly accurate positioning fixture.
製儕成本極高 【新型内容】 [0007] 鑒於先前技術所述,本創作之一目的,在於提供一種影 像感測裝置,該影像感測裝置之整體厚度極為薄小,以 適用於薄型化之手持裝置。 [0008] 為達上述目的,本創作提供一種影像感測裝置,該影像 感測裝置包含一影像感測單元、一光學蓋體及一膠材。 該光學蓋體設置於該影像感測單元上,該膠材佈設於該 影像感測單元與該光學蓋體四周圍,以將該光學蓋體固 定於該影像感測單元上。The manufacturing cost is extremely high [new content] [0007] In view of the prior art, an object of the present invention is to provide an image sensing device, the overall thickness of the image sensing device is extremely thin, and is suitable for thinning Handheld device. In order to achieve the above object, the present invention provides an image sensing device including an image sensing unit, an optical cover, and a glue. The optical cover is disposed on the image sensing unit, and the adhesive material is disposed around the image sensing unit and the optical cover to fix the optical cover to the image sensing unit.
[0009] 根據本創作之一具體實施例,其令該影像感測單元包含 一基板及一影像感測晶片,該基板包含一上表面及一下 表面,該影像感測晶片包含一感測面及一相對於該感測 面之背面,該背面係設置於該基板之上表面,該影像感 表單編珑A0101 第4頁/共20頁 100年02月17日核正替換頁 測單元之感測面具有一感測區。 [〇〇1〇] 根據本創作之一具體實施例,其中該影像感測單元更包 含複數條金屬引線,電連接地跨設於該基板與該影像感 測晶片, [0011] 根據本創作之一具體實施例,其中該光學蓋體包含一透 光基部及一透鏡部,該透鏡部凸設於該基部之一上表面 ,該透光基部之一下表面係貼設於該感測面; [0012] 根據本創作之一具體實施例,其中該光學蓋體包含一透 光基部、一透鏡部及一支撐部,該透鏡部設置於該透光 基部之一上表面,該支撐部設置於該透光基部之一下表 面,且該支撐部係貼設於該感測面; [0013] 根據本創作之一具體實施例,其中該光學蓋體可以為一 抗紅外線穿透片或一抗反射片; [0014] 根據本創作之一具體實施例,其中該影像感測裝置更包 含一鏡片組,設置於該光學蓋體上,且該鏡片組之一焦 點位於該感測區; [0015] 根據本創作之一具體實施例,其中該膠材係佈設於該影 像感測單元、該光學蓋體與該鏡片組四周圍,以將該光 學蓋體及該鏡片組固定於該影像感測單元上; [0016] 根據本創作之一具體實施例,其中該鏡片組包含一鏡筒 ,以及複數個嵌固於該鏡筒内之透鏡; [0017] 根據本創作之一具體實施例,其中該影像感測裝置更包 含一載板及一支撐座,該支撐座之一側係夾固該鏡片組 表單編號A0101 第5頁/共20頁 M403670 100年02月17日修正替換頁 ,其另一側係沿著該影像感測單元邊緣地設置於該載板 上。 [0018] 相較於先前技術,本創作之影像感測裝置係藉由膠材以 達到該影像感測晶片與該光學透鏡組之固定與定位,其 可有效地降低整體影像感測裝置之高度,以適用於現今 薄型化之手持裝置。 【實施方式】 [0019]According to an embodiment of the present invention, the image sensing unit includes a substrate and an image sensing chip, the substrate includes an upper surface and a lower surface, and the image sensing wafer includes a sensing surface and With respect to the back surface of the sensing surface, the back surface is disposed on the upper surface of the substrate, and the image sensing form is edited. A0101 Page 4 / Total 20 pages, February 17, 100, the replacement of the page sensing unit is sensed. The mask has a sensing area. According to a specific embodiment of the present invention, the image sensing unit further includes a plurality of metal leads electrically connected across the substrate and the image sensing wafer, [0011] according to the present invention. In one embodiment, the optical cover includes a light-transmissive base and a lens portion, and the lens portion is protruded from an upper surface of the base, and a lower surface of the transparent base is attached to the sensing surface; According to a specific embodiment of the present invention, the optical cover includes a transparent base, a lens portion and a support portion, and the lens portion is disposed on an upper surface of the transparent base, and the support portion is disposed on the optical cover a lower surface of the light-transmitting base, and the support portion is attached to the sensing surface; [0013] According to a specific embodiment of the present invention, the optical cover may be an anti-infrared penetrating sheet or an anti-reflecting sheet [0014] According to one embodiment of the present invention, the image sensing device further includes a lens set disposed on the optical cover, and one of the focus of the lens set is located in the sensing area; [0015] One of the creations For example, the adhesive material is disposed around the image sensing unit, the optical cover, and the lens assembly to fix the optical cover and the lens assembly to the image sensing unit; [0016] A specific embodiment, wherein the lens set comprises a lens barrel, and a plurality of lenses embedded in the lens barrel; [0017] According to an embodiment of the present invention, the image sensing device further comprises a lens The carrier board and a support base, one side of the support base is clamped to the lens group form No. A0101, page 5 / total 20 pages, M403670, revised on February 17, 100, the other side is along the image sense The measuring unit is disposed on the carrier edge. Compared with the prior art, the image sensing device of the present invention achieves the fixing and positioning of the image sensing chip and the optical lens group by using a glue material, which can effectively reduce the height of the overall image sensing device. For use in today's thin handheld devices. Embodiments [0019]
配合參閱第二圖,為本創作第一實施例之影像感測裝置 封裝結構之剖視圖。讓影像感測裝置包含一影像感測單 • Λ* ,Referring to the second figure, a cross-sectional view of the image sensing device package structure of the first embodiment of the present invention is shown. Let the image sensing device include an image sensing list • Λ*,
體20係設置 影像感測 學蓋體20固 元10、一光學蓋體发一獲 於該影像感測單元10上, 單元10與該光學蓋體20四 定於該影像感測單元10上。 [0020] 該影像感測單元10包含一基板12、一影像感測晶片14及 複數條金屬引線16,該基滅宥一iL表面122及一相對 於該上表面122之下表面124,其中該基板12可以為玻璃 纖維板(FR-4)、耐高溫環氧玻璃纖維板(FR-5)或陶瓷基 板。 [0021] 該影像感測晶片1 4包含一感測面1 4 2及一相對該感測面 142之背面144,該感測面142係包含有一感測區143 ;該 影像感測晶片14之背面14 4係貼設於該基板1 2之上表面 1 22,且該影像感測晶片1 4可以為感光耦合元件(Charge Coupled Device, CCD)或互補性金屬氧化半導體 (Complementary Metal-Ox i de Semi conductor, 表單編號Λ0101 第6頁/共20頁 [0022] 100年02月17日庚正替換頁 COMS)。 該等金屬引線16電連接地跨接於該基板12與該影像感測 晶片1 4之間,用以提供該影像感測晶片14操作時之一電 力提供’其中該等金屬引線16可以為金、錯或銀等金屬 所構成之引線。 [0023] 該光學蓋體20包含一透光基部22及一透鏡部24,該透光 基部22之一下表面係貼設於該感測面1 42,以有效地阻隔 外界微粉塵進入該感測區143而影響該影像感測裝置之成 像品質。該透鏡部24係凸設於該透光基部22之一上表面 ,且該透鏡部24之一焦點係位於該感測區143,用以將外 界景^像光線聚焦並成像於該影像感測晶片14之感測區14 3 ,使該影像感測單元1 〇得以擷取到一清晰影像,其中該 光學蓋體20係可以為玻璃或塑膠材質製作而成,且具有 抗紅外線或抗反射功能,其中抗红外線功能係用以有效 地阻隔紅外線,避免紅外線影響該影像感測裝置的成像 σσ貝,抗反射功能係用以增加外部光線的穿透率,以提 升該影像感測裝置之成像品質。 [0024] 另外,该影像感測裝置更可以包含有一透光片3 5,如第 三圖所示,該透光片35可以對應該光學蓋體2〇具有之抗 紅外線功能而為一抗反射片(anti reflecti〇n fi卜 ter,AR filter)’或該透光片35可以對應該光學蓋體 2〇具有之抗反射功能而為—抗紅外線穿透片…⑽^ filter, IR filter)。 [0025] 該膝材30㈣設該料相單㈣㈣光學蓋㈣四周 表單编號A0101 第7頁/共20頁 M403670 100年02月17日修正替換頁 圍,以密封該等金屬引線16,並將該光學蓋體20固定於 該影像感測單元10上,以避免該透鏡部24之該焦點偏移 ;其中該膠材3 0可以為紫外線固化膠、高黏度之市溫固 化膠或其他具有黏著效果之膠材。 [0026] 上述第一實施例係將先前所述之透光蓋片與該鏡片組結 合而為一光學蓋體20,該光學蓋體20可有效地避免微粉 塵近入該感測區143,以提升該影像感測裝置之良率,並 可有效地降低該影像感測裝置之高度,使整體體積更為The body 20 and the optical cover 20 are disposed on the image sensing unit 10, and the optical cover 20 is disposed on the image sensing unit 10. The image sensing unit 10 includes a substrate 12, an image sensing wafer 14 and a plurality of metal leads 16, a surface of the substrate 12 and a surface 124 opposite to the upper surface 122. The substrate 12 may be a fiberglass board (FR-4), a high temperature resistant epoxy glass fiber board (FR-5) or a ceramic substrate. [0021] The image sensing chip 14 includes a sensing surface 142 and a back surface 144 opposite to the sensing surface 142. The sensing surface 142 includes a sensing region 143. The image sensing wafer 14 The back surface 14 4 is attached to the upper surface 222 of the substrate 1 2 , and the image sensing wafer 14 can be a photosensitive coupled device (CCD) or a complementary metal oxide semiconductor (Complementary Metal-Ox i de Semi conductor, Form No. Λ0101 Page 6 of 20 [0022] On February 17, 100, Geng Zheng replaced page COMS). The metal leads 16 are electrically connected between the substrate 12 and the image sensing wafer 14 for providing power supply during operation of the image sensing wafer 14 wherein the metal leads 16 can be gold Leads made of metals such as silver or silver. [0023] The optical cover 20 includes a transparent base portion 22 and a lens portion 24, and a lower surface of the transparent base portion 22 is attached to the sensing surface 142 to effectively block external micro dust from entering the sensing. The area 143 affects the imaging quality of the image sensing device. The lens portion 24 is disposed on an upper surface of the transparent base portion 22, and a focus of the lens portion 24 is located in the sensing region 143 for focusing and imaging the external scene light to the image sensing. The sensing area 14 3 of the chip 14 enables the image sensing unit 1 to capture a clear image, wherein the optical cover 20 can be made of glass or plastic material and has anti-infrared or anti-reflection function. The anti-infrared function is used to effectively block infrared rays, and the infrared rays are prevented from affecting the imaging σσ shell of the image sensing device, and the anti-reflection function is used to increase the transmittance of external light to improve the imaging quality of the image sensing device. . [0024] In addition, the image sensing device may further include a light transmissive sheet 35. As shown in the third figure, the light transmissive sheet 35 may be an anti-infrared function corresponding to the anti-infrared function of the optical cover 2 The light transmissive sheet 35 can correspond to the anti-reflection function of the optical cover 2, which is an anti-infrared penetrating sheet (10) filter (IR filter). [0025] The knee material 30 (four) is provided with the material phase single (four) (four) optical cover (four) around the form number A0101 page 7 / total 20 pages M403670 100 February 17, revised replacement page to seal the metal lead 16 and The optical cover 20 is fixed on the image sensing unit 10 to avoid the focus shift of the lens portion 24; wherein the adhesive 30 can be a UV-curable adhesive, a high-viscosity thermosetting adhesive or other adhesive. The effect of the glue. The first embodiment combines the previously described transparent cover sheet with the lens set to form an optical cover 20, and the optical cover 20 can effectively prevent micro dust from entering the sensing area 143. In order to improve the yield of the image sensing device, and effectively reduce the height of the image sensing device, the overall volume is more
薄小,以適用於薄型化的手持裝置,且可有效地降低整 I 體製作成本 四圖,為本創作 該影像感測裝Thin and small, suitable for thin-type handheld devices, and can effectively reduce the overall manufacturing cost of the whole body.
感測裝置 元 1 0、一 [0027] 配合參閱第 之剖視圖。 膠材30及一光學蓋體40,其中該影像感鰣罩元10係與上 述第一實施例相同,在此則不予贅述。 [0028] 該光學蓋體40設置於該影彳14i方,且係包含 一透光基部42、一透鏡部奴及一支#部46,該支撐部46 設置於該透光基部42之一下表面,該透鏡部44係凸設於 該透光基部42之一上表面,且該透鏡部44之一焦點係位 於該感測區143 ;其中該透光基部42與該透鏡部44係可以 為玻璃或塑膠材質製作而成,且具有抗紅外線或抗反射 功能,其中抗紅外線功能係用以有效地阻隔紅外線,避 免紅外線影響該影像感測裝置的成像品質;抗反射功能 係用以增加外部光線的穿透率,以提升該影像感測裝置 之成像品質。 表單編號A0101 第8頁/共20頁 M403670 100年02月17日核正替換頁 [0029] 該支撐部46係貼設於該影像感測晶片14之感測面142,以 使該透光基部4 2具有一間隙的位於該影像感測晶片14上 方,使得外界影像光線得以準確地聚焦於該感測區143。 並且,該支撐部46之設置高度可以視該透鏡部44之焦距 大小而做調整。其中該支撐部46可以利用射出或模造方 式成型於該光學蓋體40,且對應該透光基部42與該透鏡 部44之製材而為塑膠材質或玻璃材質;或者,該支撐部 46可以為一環狀光阻材質,且該光阻材質可以為乾式蝕 刻之光阻材質或濕式蝕刻之光阻材質。 [0030] 該膠材30係佈設於該影像感測單元1 0與該光學蓋體40四 周圍,以有效地將該光學蓋體40固定於該影像感測單元 10上方,避免該透鏡部44之該焦點偏移,其中該膠材30 可以為紫外線固化膠、高黏度之市溫固化膠或其他具有 黏著效果之膠材。 [0031] 上述第二實施例相較於第一實施例係於該光學透鏡組之 基部設置有該支撐部46,該支撐部46係環繞於該影像感 測晶片14之感測區143,可有效地阻檔該膠材30滲入該感 測區143而影響該影像感測裝置的成像品質;並且,該支 撐部46之高度係可配合該透鏡部44之焦距設計,以使外 界光線精確地聚焦於該感測區143。 [0032] 配合參閱第五圖,為本創作第三實施例之影像感測裝置 之剖視圖。該影像感測裝置包含一影像感測單元10、一 膠材30、一光學蓋體50及一鏡片組60。 [0033] 該影像感測單元10包含一基板12、一影像感測晶片14及 表箪編號A0101 第9頁/共20頁 脚3670 100年02月17日 複數條金屬引線16,該基板12包含一上表面122及一相對 於該上表面122之下表面124,其t該基板12可以為玻璃 纖維板、耐高溫環氧玻璃纖維板或陶瓷基板。 [0034] 該影像感測晶片1 4包含一感測面14 2,及一相對於該感測 面142之背面144 *且該感測面142包含有一感測區143。 該影像感測晶片14之背面144係貼設於該基板12之上表面 122 ’且該影像感測晶片14可以為感光耦合元件或互補性 金屬氧化半導體。Sensing device element 10, a [0027] with reference to the cross-sectional view of the first. The adhesive material 30 and an optical cover 40 are the same as the first embodiment described above, and are not described herein. The optical cover 40 is disposed on the side of the shadow frame 14i, and includes a transparent base portion 42, a lens portion and a portion 46. The support portion 46 is disposed on a lower surface of the transparent base portion 42. The lens portion 44 is protruded from the upper surface of the light-transmitting base portion 42, and a focus of the lens portion 44 is located in the sensing region 143. The light-transmitting base portion 42 and the lens portion 44 may be glass. It is made of plastic material and has anti-infrared or anti-reflection function. The anti-infrared function is used to effectively block infrared rays, avoiding infrared rays affecting the image quality of the image sensing device; anti-reflection function is used to increase external light. The penetration rate to improve the image quality of the image sensing device. Form No. A0101 Page 8 of 20 M403670 February 17th, 100th, Nuclear Replacement Page [0029] The support portion 46 is attached to the sensing surface 142 of the image sensing wafer 14 to make the transparent base 4 2 has a gap above the image sensing wafer 14 so that the external image light is accurately focused on the sensing region 143. Further, the height of the support portion 46 can be adjusted depending on the focal length of the lens portion 44. The support portion 46 can be formed on the optical cover 40 by injection or molding, and is made of a plastic material or a glass material corresponding to the material of the transparent base portion 42 and the lens portion 44. Alternatively, the support portion 46 can be a The ring photoresist material, and the photoresist material can be a dry etching photoresist material or a wet etching photoresist material. [0030] The adhesive material 30 is disposed around the image sensing unit 10 and the optical cover 40 to effectively fix the optical cover 40 to the image sensing unit 10 to avoid the lens portion 44. The focus is offset, wherein the glue 30 can be a UV-curable adhesive, a high-viscosity municipal cured adhesive or other adhesive having an adhesive effect. The support portion 46 is disposed around the sensing portion 143 of the image sensing wafer 14 in the second embodiment. The support portion 46 is disposed on the base of the optical lens unit. Effectively blocking the penetration of the glue 30 into the sensing area 143 to affect the imaging quality of the image sensing device; and the height of the support portion 46 can be matched with the focal length of the lens portion 44 to accurately align the external light. Focusing on the sensing region 143. [0032] Referring to FIG. 5, a cross-sectional view of the image sensing device of the third embodiment of the present invention is shown. The image sensing device comprises an image sensing unit 10, a glue 30, an optical cover 50 and a lens set 60. [0033] The image sensing unit 10 includes a substrate 12, an image sensing wafer 14 and a surface number A0101, a page 9 of a total of 20 legs, 3670, and a plurality of metal leads 16 on February 17, 100. The substrate 12 includes An upper surface 122 and a lower surface 124 of the upper surface 122, the substrate 12 may be a fiberglass board, a high temperature resistant epoxy fiberglass board or a ceramic substrate. The image sensing wafer 14 includes a sensing surface 14 2 and a back surface 144 * relative to the sensing surface 142 and the sensing surface 142 includes a sensing region 143. The back surface 144 of the image sensing wafer 14 is attached to the upper surface 122' of the substrate 12 and the image sensing wafer 14 may be a photosensitive coupling element or a complementary metal oxide semiconductor.
[0035] 該等金屬引線16係電速接地跨設於該基板12與該影像感 測晶片14,其中該等金屬 屬所構成之引線。 [0036] 該光學蓋體50係設置於該 外界微粉塵污染該感洌區143,而影響譏影像感測裝置之 成像品質。其中該光學蓋體5 〇可以為抗紅外線穿透片以 有效地阻隔紅外線’避免紅并?埭尜游彰腺感測裝置的 成像品質;又,該光學蓋讀5〇;^讦以爲抗反射片,以增 加外部光線的穿透率,提升成像品質。 [0037] 該鏡片組60設置於該影像感測單元1〇上,且該鏡片組6〇 之一焦點係位於該影像感測晶片14之一感測區143,該鏡 片組60包含一鏡筒62及複數個透鏡64,該等透鏡64係嵌 固於該鏡筒62内部,用以將一外部影像聚焦於該影像感 測單元10之感測區143,使該影像感測單元1〇得以擷取到 一清晰影像’其中該等透鏡64係可以為玻璃或塑膠材質 製作而成。 表單编號A0101 第10頁/共20頁 M403670 100年02月17日按正替換頁 [0038] 該膠材30佈設於該影像感測單元10、該光學蓋體50與該 鏡片組60四周圍,用以將該光學蓋體50及該鏡片組60固 定於該影像感測單元10上,以避免外界微粉塵污染該影 像感測晶片14及避免該鏡片組60之該焦點偏移。其中該 膠材30可以為紫外線固化膠、高黏度之市溫固化膠或其 他具有黏著效果之膠材。 [0039] 上述第三實施例所述之影像感測晶片係將該光學蓋體50 與該鏡片組60藉由該膠材30以固定於該影像感測晶片14 上方,可有效地降低該影像感測裝置之高度及製作成本 〇 [0040] 配合參閱第六圖,為本創作第四實施例之影像感測裝置 之剖視圖。該影像感測裝置包含一影像感測單元10、一 膠材30、一光學蓋體50、一鏡片組60、一載板70及一支 撐座80,該影像感測單元10係設置於該載板70之一上表 面,該影像感測單元10包含一基板12、一影像感測晶片 14及複數條金屬引線16。 [0041] 該基板包含一上表面122及一相對於該上表面122之下表 面124,其中該基板12可以為玻璃纖維板、耐高溫環氧玻 璃纖維板或陶瓷基板。 [0042] 該影像感測晶片14包含一感測面142、一相對於該感測面 142之背面144及一位於該感測面142之感測區143。該影 像感測晶片14之背面144貼設於該基板12之上表面122, 且該影像感測晶片14可以為感光耦合元件或互補性金屬 氧化半導體。 表單編號A0101 第11頁/共20頁 M403670 100年02月17日按正替換頁 [0043] 該等金屬引線16係電連接地跨設於該基板12與該影像或 測晶片14,其中該等金屬引線1 6可以為金、鉛或銀等金 屬所構成之引線。 [0044] [0045][0035] The metal leads 16 are electrically grounded across the substrate 12 and the image sensing wafer 14, wherein the metal is formed by the leads. [0036] The optical cover 50 is disposed on the external dust to contaminate the sensing area 143, and affects the imaging quality of the image sensing device. Wherein the optical cover 5 〇 can be an anti-infrared penetrating sheet to effectively block the infrared ray to avoid the red and the imaging quality of the sacral sensing device; in addition, the optical cover reads 5 〇; Film to increase the penetration of external light and improve image quality. The lens group 60 is disposed on the image sensing unit 1 , and one of the lens groups 6 is located in a sensing area 143 of the image sensing wafer 14 , and the lens group 60 includes a lens barrel. 62 and a plurality of lenses 64 are embedded in the lens barrel 62 for focusing an external image on the sensing area 143 of the image sensing unit 10, so that the image sensing unit can be A clear image is captured in which the lenses 64 can be made of glass or plastic. Form No. A0101 Page 10/Total 20 pages M403670 On February 17, 100, according to the replacement page [0038] The glue 30 is disposed around the image sensing unit 10, the optical cover 50 and the lens group 60. The optical cover 50 and the lens assembly 60 are fixed to the image sensing unit 10 to prevent the external micro dust from contaminating the image sensing wafer 14 and avoiding the focus shift of the lens group 60. The glue 30 may be a UV-curable adhesive, a high-viscosity municipal cured adhesive or other adhesive having an adhesive effect. The image sensing chip of the third embodiment is configured to fix the optical cover 50 and the lens assembly 60 to the image sensing wafer 14 by the adhesive 30, thereby effectively reducing the image. The height of the sensing device and the manufacturing cost 〇 [0040] Referring to the sixth drawing, a cross-sectional view of the image sensing device according to the fourth embodiment of the present invention is shown. The image sensing device 10 includes an image sensing unit 10, a glue 30, an optical cover 50, a lens assembly 60, a carrier 70, and a support base 80. The image sensing unit 10 is disposed on the image sensing unit 10 The image sensing unit 10 includes a substrate 12, an image sensing wafer 14 and a plurality of metal leads 16 . [0041] The substrate includes an upper surface 122 and a lower surface 124 opposite the upper surface 122, wherein the substrate 12 can be a fiberglass board, a high temperature resistant epoxy glass board or a ceramic substrate. The image sensing chip 14 includes a sensing surface 142, a back surface 144 opposite to the sensing surface 142, and a sensing region 143 on the sensing surface 142. The back surface 144 of the image sensing wafer 14 is attached to the upper surface 122 of the substrate 12, and the image sensing wafer 14 can be a photosensitive coupling element or a complementary metal oxide semiconductor. Form No. A0101 Page 11 / Total 20 pages M403670 On February 17, 100, according to the replacement page [0043] The metal leads 16 are electrically connected across the substrate 12 and the image or wafer 14, wherein The metal lead 16 may be a lead made of a metal such as gold, lead or silver. [0045] [0045]
該光學蓋體50係設置於該影像感測晶片14上方,該光學 蓋體50可有效地避免外界微粉塵附著於該影像感測晶片 14上,以影響該影像感測裝置之成像品質。其中該光學 蓋體5 0可以為抗紅外線穿透片以有效地阻隔紅外線,避 免紅外線影像該影像感測裝置的成像品質;又,該光學 蓋體50亦可以為抗反射片,以增加外部光線的穿透率, 提升成像品質。The optical cover 50 is disposed above the image sensing wafer 14. The optical cover 50 can effectively prevent external dust from adhering to the image sensing wafer 14 to affect the imaging quality of the image sensing device. The optical cover 50 can be an anti-infrared penetrating sheet to effectively block infrared rays and avoid imaging quality of the image sensing device of the infrared image. Moreover, the optical cover 50 can also be an anti-reflection sheet to increase external light. The penetration rate improves image quality.
該膠材30佈設於該影像感測光壩體50與該 鏡片組&〇四周圍,用以將鏡片組6〇固 定於該影像感測單元10上,以避免外黑微粉塵污染該影 像感測晶片14及避免該鏡片組60之該焦點偏移;其中該 膠材30可以為紫外線固化膠、高:私A之、市.溫固化膠或其 他具有黏著效果之膠材。 [0046] 該鏡片組60包含一鏡筒62及複數個嵌固於該鏡筒62内部 之透鏡64,該鏡筒62係固設於該支撐座80,該支撐座80 係設置於該載板7 0上,並包覆該影像感測晶片1 4 ’且該 支撐座80之内表面係切齊於該膠材30與該影像感測晶片 1 4之邊緣,以達到直接定位之功能。 [0047] 上述第四實施例之影像感測裝置係利用該膠材30以固定 該光學蓋體50,以有效地避免外界微粉塵污染該感測區 143而影響該影像感測裝置的成像品質;該支撐座80以將 表單編號A0101 第丨2頁/共20頁 M403670 [0048] 100年02月17日按正替换頁The adhesive material 30 is disposed around the image sensing light dam body 50 and the lens group & ,4, and is used for fixing the lens group 6〇 to the image sensing unit 10 to prevent the external black dust from contaminating the image sense. The wafer 14 is tested and the focus shift of the lens set 60 is avoided; wherein the adhesive material 30 can be a UV curable adhesive, a high: private A, a warm adhesive, or other adhesive having an adhesive effect. [0046] The lens assembly 60 includes a lens barrel 62 and a plurality of lenses 64 embedded in the lens barrel 62. The lens barrel 62 is fixed to the support base 80. The support base 80 is disposed on the carrier board. The image sensing wafer 14 4 is covered and the inner surface of the support base 80 is aligned with the edge of the adhesive material 30 and the image sensing wafer 14 to achieve the function of direct positioning. [0047] The image sensing device of the fourth embodiment uses the adhesive material 30 to fix the optical cover 50 to effectively prevent the external dust from contaminating the sensing region 143 and affecting the image quality of the image sensing device. ; the support base 80 to be the form number A0101 page 2 / 20 pages M403670 [0048] 100 years of February 17, the replacement page
[0049] [0050] [0051] [0052] [0053][0053] [0053] [0053]
[0054] [0055] [0056] [0057] [0058] [0059] 該鏡片組60固定於該影像感測晶片14上方,其中該支撐 座80係透過該影像感測單元10之邊緣以完成定位,因此 ,不需額外使用高價之自動定位裝置即可達成該鏡片組 60之對位精確度的問題,有效地降低製作成本。 然以上所述者,僅為本創作之較佳實施例,當不能限定 本創作實施之範圍,即凡依本創作申請專利範圍所作之 均等變化與修飾等,皆應仍屬本創作之專利涵蓋範圍意 圖保護之範嘴。 【圖式簡單說明】 第一圖為習知之影像感測模組之剖視圖。 第二圖為本創作第一實施例之影像感測裝置之剖視圖。 第三圖為本創作第一實施例之影像感測裝置之另一剖視 圖。 第四圖為本創作第二實施例之影像感測裝置之剖視圖。 第五圖為本創作第三實施例之影像感測裝置之剖視圓。 第六圖為本創作第四實施例之影像感測裝置之剖視圖。 【主要元件符號說明】 〈先前技術〉 90影像感測模組 91基板 92影像感測晶片 93金屬引線 表單編號A0101 第丨3頁/共20頁 M403670 [0060] 94 透明蓋片 [0061] 95 鏡座 [0062] 96 鏡片組 [0063] 〈本創作〉 [0064] 10 影像感測單元 [0065] 12 基板 [0066] 122 上表面 [0067] 124 下表面 [0068] 14 影像感測晶片 [0069] 142 感測面 [0070] 143 丨感測區 [0071] IA4 :背面 [0072] 16 金屬引線 [0073] 20 ' 40 ' 50光學蓋體 [0074] 22 、42基部 [0075] 24 、44透鏡部 [0076] 30 膠材 [0077] 35 透光片 [0078] 46 支撐部 表單編號A0101 100年02月17日修正替换頁[0059] [0059] [0059] The lens set 60 is fixed on the image sensing wafer 14, wherein the support 80 is transmitted through the edge of the image sensing unit 10 to complete positioning. Therefore, the problem of the alignment accuracy of the lens group 60 can be achieved without additionally using an expensive automatic positioning device, thereby effectively reducing the manufacturing cost. However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited, that is, the equal changes and modifications made by the scope of the patent application of the present invention should still be covered by the patent of the present invention. The scope is intended to protect the mouth. [Simple Description of the Drawings] The first figure is a cross-sectional view of a conventional image sensing module. The second figure is a cross-sectional view of the image sensing device of the first embodiment of the present invention. The third figure is another cross-sectional view of the image sensing apparatus of the first embodiment of the present invention. The fourth figure is a cross-sectional view of the image sensing device of the second embodiment of the present invention. The fifth figure is a cross-sectional circle of the image sensing device of the third embodiment of the present invention. Figure 6 is a cross-sectional view showing the image sensing device of the fourth embodiment of the present invention. [Major component symbol description] <Prior Art> 90 image sensing module 91 substrate 92 image sensing wafer 93 metal lead form number A0101 page 3 / total 20 pages M403670 [0060] 94 transparent cover sheet [0061] 95 mirror Block [0062] 96 Lens Set [0063] <This Creation> [0064] 10 Image Sensing Unit [0065] 12 Substrate [0066] 122 Upper Surface [0067] 124 Lower Surface [0068] 14 Image Sensing Wafer [0069] 142 Sensing surface [0070] 143 丨 sensing area [0071] IA4: back [0072] 16 metal lead [0073] 20 ' 40 ' 50 optical cover [0074] 22, 42 base [0075] 24, 44 lens [0076] 30 glue material [0077] 35 light-transmissive sheet [0078] 46 support part form number A0101 100 years of February 17, revised replacement page
第14頁/共20頁 M403670 [0079] 60 鏡片組 [0080] 62 鏡筒 [0081] 64 透鏡 [0082] 70 載板 [0083] 80 支撐座 表單編號A0101 第15頁/共20頁Page 14 of 20 M403670 [0079] 60 Lens Set [0080] 62 Lens Tube [0081] 64 Lens [0082] 70 Carrier [0083] 80 Support Base Form No. A0101 Page 15 of 20
100年02月17日後正替換"SReplaced "S after February 17, 100
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TWI637209B (en) * | 2016-03-08 | 2018-10-01 | 光寶電子(廣州)有限公司 | Image alignment structure |
TWI659648B (en) * | 2013-03-25 | 2019-05-11 | 新力股份有限公司 | Solid-state imaging device and camera module, and electronic device |
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TWI659648B (en) * | 2013-03-25 | 2019-05-11 | 新力股份有限公司 | Solid-state imaging device and camera module, and electronic device |
TWI637209B (en) * | 2016-03-08 | 2018-10-01 | 光寶電子(廣州)有限公司 | Image alignment structure |
US10353166B2 (en) * | 2016-03-08 | 2019-07-16 | Lite-On Electronics (Guangzhou) Limited | Image focus alignment structure having two layers of sealant |
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