TW200524515A - Ceramic heat sink with composite multi-layered porous structure - Google Patents
Ceramic heat sink with composite multi-layered porous structure Download PDFInfo
- Publication number
- TW200524515A TW200524515A TW93100710A TW93100710A TW200524515A TW 200524515 A TW200524515 A TW 200524515A TW 93100710 A TW93100710 A TW 93100710A TW 93100710 A TW93100710 A TW 93100710A TW 200524515 A TW200524515 A TW 200524515A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- layer
- ceramic
- heat dissipation
- dissipation
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 60
- 239000002131 composite material Substances 0.000 title claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims abstract description 98
- 239000000843 powder Substances 0.000 claims abstract description 19
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000007769 metal material Substances 0.000 claims abstract description 3
- 238000000465 moulding Methods 0.000 claims description 10
- 239000002002 slurry Substances 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- -1 heat sinks Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 229920000609 methyl cellulose Polymers 0.000 claims 1
- 239000001923 methylcellulose Substances 0.000 claims 1
- 235000010981 methylcellulose Nutrition 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000004014 plasticizer Substances 0.000 claims 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 8
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract 3
- 239000011799 hole material Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 235000005206 Hibiscus Nutrition 0.000 description 1
- 235000007185 Hibiscus lunariifolius Nutrition 0.000 description 1
- 241001075721 Hibiscus trionum Species 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93100710A TW200524515A (en) | 2004-01-12 | 2004-01-12 | Ceramic heat sink with composite multi-layered porous structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93100710A TW200524515A (en) | 2004-01-12 | 2004-01-12 | Ceramic heat sink with composite multi-layered porous structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200524515A true TW200524515A (en) | 2005-07-16 |
| TWI299975B TWI299975B (https=) | 2008-08-11 |
Family
ID=45069844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93100710A TW200524515A (en) | 2004-01-12 | 2004-01-12 | Ceramic heat sink with composite multi-layered porous structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200524515A (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7913749B2 (en) | 2007-06-22 | 2011-03-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module with porous type heat dissipater |
| US7922362B2 (en) | 2007-10-19 | 2011-04-12 | Au Optronics Corp. | Circuit board assembly and backlight module comprising the same |
| CN112105216A (zh) * | 2019-05-30 | 2020-12-18 | Oppo广东移动通信有限公司 | 散热器的制作方法、散热器及电子设备 |
| CN112361309A (zh) * | 2020-11-27 | 2021-02-12 | 浙江工业大学 | 一种圆锥形的金属塑料复合散热器 |
| TWI804930B (zh) * | 2021-07-26 | 2023-06-11 | 艾姆勒科技股份有限公司 | 浸沒式散熱結構 |
-
2004
- 2004-01-12 TW TW93100710A patent/TW200524515A/zh not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7913749B2 (en) | 2007-06-22 | 2011-03-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module with porous type heat dissipater |
| US7922362B2 (en) | 2007-10-19 | 2011-04-12 | Au Optronics Corp. | Circuit board assembly and backlight module comprising the same |
| CN112105216A (zh) * | 2019-05-30 | 2020-12-18 | Oppo广东移动通信有限公司 | 散热器的制作方法、散热器及电子设备 |
| CN112361309A (zh) * | 2020-11-27 | 2021-02-12 | 浙江工业大学 | 一种圆锥形的金属塑料复合散热器 |
| TWI804930B (zh) * | 2021-07-26 | 2023-06-11 | 艾姆勒科技股份有限公司 | 浸沒式散熱結構 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI299975B (https=) | 2008-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |