TW200520915A - Laser-assisted cutting device - Google Patents

Laser-assisted cutting device Download PDF

Info

Publication number
TW200520915A
TW200520915A TW92136646A TW92136646A TW200520915A TW 200520915 A TW200520915 A TW 200520915A TW 92136646 A TW92136646 A TW 92136646A TW 92136646 A TW92136646 A TW 92136646A TW 200520915 A TW200520915 A TW 200520915A
Authority
TW
Taiwan
Prior art keywords
cutting
laser
tool
temperature
tool holder
Prior art date
Application number
TW92136646A
Other languages
Chinese (zh)
Other versions
TWI222399B (en
Inventor
Jinn-Fa Wu
Yu-Pin Ku
Ming-Fong Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW92136646A priority Critical patent/TWI222399B/en
Application granted granted Critical
Publication of TWI222399B publication Critical patent/TWI222399B/en
Publication of TW200520915A publication Critical patent/TW200520915A/en

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Turning (AREA)

Abstract

A laser-assisted cutting device, including a laser head and cutting bits spray-off device provided on a tool turret, so as to use laser beam to soften the material instantaneously to facilitate feeding and cutting of a cutting tool; a cooling nozzle provided on the nozzle for spraying low temperature fluid on the cutting tool to reduce the temperature of the cutting tool. Accordingly, the temperature of the tool tip can be maintained within an appropriate temperature range by the cooling nozzle, so as to ensure the rigidity of the tool thereby effectively increasing cutting efficiency and prolonging the lifespan of the tool.

Description

200520915 五、發明說明(1) 【發明所屬之技術領域】 本發明係提供一種於有 刀具上设一冷卻裝置,以石害 射輔助切削裝置。 【先前技術】 按,目前於不易切削之 合金等)進行切削製程中, 工的表面精度不佳;以陶堯 加工方式,有研磨加工、超 工、離子束加工等,這些加 然法取得較佳之移除率,就 本卻也佔陶瓷元件總成本的 件進行研磨加工,仍是耗力 而’陶变是繼金屬、塑膠之 性、耐I虫性及硬質性,這些 性’因此陶瓷也將是高科技 的元件將快速成長,故發展 前首要的課題。 為此,本發明人先前提 「脈衝雷射輔助微精細切削 請芩閱第1 、2圖所示,該 (例如精密車床或銑床等切 刀具2裝設於側方之刀具座 具座3上,並位於切削刀具 效提高切削效率之要件下,於 保刀具剛性延長使用壽命之雷 材料(如陶瓷、玻璃、鎳基超 刀具會產生嚴重的磨耗,且加 材料為例,目前其加工使用的 音波加工、雷射加工、放電加 工方式雖然各有優缺點,但均 以研磨加工而言,其加工的成 〜80%,因此陶瓷元 費時’無法降低製造成本;然 f的第三材料,其兼具有耐熱 ^屬於高科技材料必要的特 日寸代的新訴求,以陶瓷為素材 更高效率的加工方、式,將是目 出台灣專利申請第9 2 1 2 9 1 2 2號 之加工方法及裝置」申請案, 陶究工件1係裝設於工具機 削工具機)之夾頭上,而切削 3上’一雷射頭4係裝設在刀 2之側方,且將雷射光束調整200520915 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention is to provide a cooling device on a cutting tool to assist the cutting device with stone damage. [Previous technology] According to the current cutting process of alloys that are not easy to cut, etc., the surface accuracy of the tool is not good; the Tao Yao processing methods include grinding, superwork, ion beam processing, etc. These additive methods have achieved relatively The best removal rate, grinding the parts that also account for the total cost of ceramic components, is still labor-intensive, and the 'ceramic change is after metal, plastic properties, I insect resistance, and rigidity. These properties' Will be high-tech components will grow rapidly, so the primary issue before development. For this reason, the inventor previously mentioned "Pulse laser assisted micro-fine cutting, please refer to Figures 1 and 2. The cutting tool 2 (such as a precision lathe or milling machine) is installed on the side of the tool holder 3 And it is located under the requirement of cutting tools to improve cutting efficiency, and mine materials (such as ceramic, glass, nickel-based ultra-tools) that maintain the tool's rigidity and extend the service life will cause severe wear. Adding materials as an example, the current use of sound waves Although processing, laser processing, and electrical discharge machining have their own advantages and disadvantages, in terms of grinding processing, the processing is ~ 80%, so ceramics take time to 'cannot reduce manufacturing costs; however, the third material of f, which also has It has the new requirements of special heat generation which is necessary for high-tech materials. The more efficient processing method using ceramics as the material will be the processing of Taiwan Patent Application No. 9 2 1 2 9 1 2 2 "Method and device" application, the research work 1 is installed on the chuck of the tool (machine tool machine), while the cutting 3 'a laser head 4 is installed on the side of the knife 2 and the laser beam Adjustment

第5頁 200520915 ' ·................. 五、發明說明(2) — 聚焦至切削刀具2之刀口正前方,而切削刀 座3上則裝設一可回饋傳輸至系統 ,、2内或刀/、 5 ,利用雷射光束於切削刀二Λ二如6之數位溫度計 熱即切,瞬間熱到那梗(微局部) j 亦即即 ),熱量不累積"的切削機制,& P夂你+到那裡(微局部 ⑴械制,u降低切削材粗 另於刀具座3上裝攻一切屑喷除器7 ,於刀呈仏又 時,以高壓噴射流體吹離切屑而迅速移除,^,、.,δ切削 蔽到雷射光束,由於雷射光束Υ隹_ 1、 σ防止切屑遮 田W尤术永焦處的咼溫切削 具2與工件間的磨擦熱仍會熱傳導至切削刀具 削刀具2累積熱量而逐漸升高溫度,卩c Β ;(氮化Τ 切削刀具為例,在溫度超過i 4 7 〇艺時,氮化硼曰 由立方體轉為六方體,強度將會大幅降低,而在溫卢、、°曰曰 1 5 7 0 °C時,將會超過刀具變弱的溫度,而缩短=亘 使用壽命,因此,該切削裝置即再透過數位溫度計=抻 切削刀具2之刀尖溫度,並即時回饋至系統控制^ 糸統控制器6進行雷射參數的自動調控,來改變带 = 料的加熱溫度,以修正因高溫切削及摩擦熱對、切^ 1 生的溫度變化量,使得刀尖溫度能保持在適溫範 了 — 此,即可有效提高切削效率及表面精度。 精 、,該裝置以數位溫度計5監控切削刀具2之刀"、、w 並於溫度超過1 4 7 0 t時,以改變雷射光束對二=又勒 溫度的方式,而修正因高溫切削及摩擦熱對切削刀且:、 生的溫度變化量,使得刀尖溫度能保持在適溫範圍;, 當刀尖溫度過高時,即修正雷射光束的參數,進而降低對Page 5 200520915 '......... 5. Description of the invention (2) — focus on the front edge of the cutting tool 2 and install it on the cutting tool holder 3. One can feed back to the system, within 2 or knife /, 5 and use the laser beam to cut the digital thermometer of the cutting blade two Λ 2 such as 6 to cut instantly, and instantly heat to the stem (micro-local) j (that is)), The heat does not accumulate the "cutting mechanism," P 夂 you + go there (micro-localized mechanical system, u reduce the thickness of the cutting material, and install all the chip ejector 7 on the tool holder 3, when the knife is 仏 and time) , The high-pressure jet fluid is blown away from the chips and quickly removed. ^ ,,,, δ cutting is shielded to the laser beam, because the laser beam Υ 隹 _ 1, σ prevents the chip from covering the field, especially at the hot focal point. The frictional heat between the tool 2 and the workpiece will still be thermally conducted to the cutting tool 2 and the cumulative heat of the cutting tool 2 will gradually increase the temperature, 卩 c Β; When boron is changed from cube to hexagon, the strength will be greatly reduced, and at Wenlu, °° 15 ° C, it will exceed the temperature at which the tool weakens, and Shorten = 亘 service life, therefore, the cutting device will then pass the digital thermometer = 刀具 cutting tool 2 tip temperature, and immediately feed back to the system control ^ System controller 6 performs automatic adjustment of laser parameters to change the belt = The heating temperature of the material is adjusted to correct the temperature change caused by high-temperature cutting and frictional heat pairing and cutting, so that the tip temperature can be maintained at an appropriate temperature range—this can effectively improve cutting efficiency and surface accuracy. , The device uses a digital thermometer 5 to monitor the cutting tool of the cutting tool 2 ",, w, and when the temperature exceeds 1 4 7 0 t, in order to change the laser beam to two = the temperature, and correct the high temperature cutting and friction The thermal change of the cutting blade and the temperature of the cutting edge keeps the tip temperature within a suitable temperature range; when the tip temperature is too high, the parameters of the laser beam are corrected, thereby reducing the

第6頁 200520915 五、發明說明(3) 材料之加熱溫度,在降低切 對的增加切削刀具2之切削卩且=枓之加熱軟化 此’以調整雷射參數來作為確:切:::切削 式,將難以同時兼顧到切削效率=刀,、在適 需加以研究思考。 表面精度之 【發明内容】 本發明之主要目的係提供一種帝 Λ 77且座上F今帝身+ -5 η 田射辅助切削』 在 ί认 田射頭及切屑噴除器,而可利戶 瞬間加权化材#,俾利刀具進給切肖卜 設,冷卻喷器,將冷卻喷器之低溫流體噴灑於: 上’以冷卻刀尖所產生之高溫,進而使 溫範圍内’藉此’即可利用雷射光束使切削:: 溫的加熱軟化岔狀態下’並同時確保切削刀具: 到不僅有效提高切削效率及表面精度外,且二 具使用壽命之雙重效益。 本發明之次一目的係提供一種雷射辅助切 ,該切削刀具之刀把内部可設有冷卻液楯去 洛於七77 &1 77目咖“ 一时. ^ /;,! 度下,相 率,因 範圍的方 求,故仍 中 一,…「Μ 石又V,口7狀循王| 卻液於切削刀具内部循環流動,以降低刀尖因 摩檫熱所產生之尚溫,進而使刀尖溫度維持在 内,以確保切削刀具之剛性,達到有效提高女 面精度,同時兼具延長刀具使用壽命之雙重^ [實施方式】 j 為使貴審查委員對本發明作更進一步之 一較佳實施例並配合圖式,詳述如后: 置,其係 雷射光束 具座上裝 削刀具 维持在適 保持在高 剛性,達 具延長刀 裝置,其 路,將冷 溫切削及 溫範圍 效率及表 解,茲舉 200520915 五、發明說明(4) … 請參閱第3 、4圖所示,太駐 裝設於工具機之夾頭上,而切=置之工件8 (如陶瓷)係 座1 0上,一雷射頭1 1係袈設在具9裝設於側方之刀具 切削刀具9之側方,且將雷射弁 ^具座1 〇上,並位於 刀口正前方(即加熱區E ) 调整聚焦至切削刀具9 屑喷除器1 2 ,其以高壓的噴射^具座1 〇上裝設有一切 切屑,防止切屑遮蔽到雷射光束机a (如氣體或液體)噴除 一可喷灑如冷凍氣體或液態惰性二=刀具座1 0上装設 器1 5 ;請參閱第5 、6圖,當工^荨低溫流體之冷卻噴 即啟動切屑喷除器1 2及雷射二丄8,始進行切削時,、 在刀口正前方處’並使該處之材料妒t雷射光束先照射 切削刀具9係直接接觸高溫軟化材2 ^,材料F,由於該 過程中’ t射聚焦處的高溫切削及目在高速切削的 的磨擦熱會熱傳導至切削刀具9上, /、9與工件8間 升高溫度,為了預防切削刀具9產生:,切削刀具9逐漸 成切削刀具9提前損毀,本發明於切:ς ^高的情形,造 料之同時,以冷卻喷器i 5對切削刀具二9進行切削材 溫流體的持續噴灑(如冷凍氣體或液態 j,位置進行低 體),以直接冷卻切削刀具9之刀尖^ ^ 氣體等低溫流 度維持在適溫範圍内(不得超過1 4 7 f t進而使刀尖溫 削刀具9之剛性;此外,由於冷卻噴器丄1,以確保切 流體,因此以噴灑高壓之低溫流體時,亦係^噴灑低溫 屑及冷卻切削刀具,而兼具切屑喷除器的作同時作噴除切 卻裝設切屑噴除器;請參閱第7圖,切削用,此即可省 200520915 五、發明說明(5) 入工件8 ^使刀口前的南溫軟化材料F直接被切削剝離5 由於高溫軟化材料F已被瞬間加熱軟化,進而可大幅減少 切削阻力,使切削刀具9可提高切削速度及切削精度。 請參閱第8圖,此外,為了避免切削刀具9在冷卻過 程中,因其他因素的影響而造成冷卻效果的不確定,本發 明亦可於切削刀具9之刀把内輔助裝設數位溫度計1 3 , 以數位溫度計1 3作為線上監測刀尖溫度,並即時回饋至 . 系統控制器1 4 ,若發生刀具無法以低溫流體降溫至適溫 時,即經系統控制器1 4進行雷射參數的自動調控,來改 ’ 變雷射對材料的加熱溫度,使刀尖溫度保持在適溫範圍 ® 内,以確保切削刀具9的使用壽命,進而輔助提供刀具冷 卻的第二道防線; 請參閱第9圖,係本發明之另一實施例,該工件8係 裝設於工具機之夾頭上,而切削刀具9裝設於側方之刀具 座1 0上,一雷射頭1 1係裝設在刀具座1 0上,且將雷 射光束調整聚焦至切削刀具9刀口正前方,另於刀具座 1 0上裝設有一切屑喷除器1 2 ,其以高壓喷'射流體以喷 除切屑,防止切屑遮蔽到雷射光束,另於該切削刀具9之 内部設有冷卻液循環流路1 6 ,該冷卻液循環流路1 6之 入、出水口 1 7、1 8係連接一冷凍機1 9 ;請參閱第 1 0圖,當工件8開始進行切削時,即啟動切屑喷除器 - 1 2及雷射頭1 1 ,令雷射光束先照射在刀口正前方處以 軟化材料’於切削刀具9之刀尖因雷射聚焦處的南溫切削 及切削刀具9與工件8間的磨擦熱而逐漸升高溫度時,即 200520915 五、發明說明(6) 可利用切削刀具9内部之冷卻液循環流路1 6 ,以低溫流 體間接冷卻切削刀具9 ,使刀尖之溫度維持在適溫範圍 内,以確保切削刀具9之剛性,進而有效延長切削刀具9 之使用壽命。 請參閱第1 1圖,相同的為了避免切削刀具9在冷卻 過程中,因其他因素的影響而造成冷卻效果的不確定,本 實施例亦可於切削刀具9之刀把内輔助裝設數位溫度計 1 3 ,以數位溫度計1 3作為線上監測刀尖溫度,並即時 回饋至系統控制器1 4 ,若發生刀具無法以低溫流體降溫 至適溫時,即經系統控制器1 4進行雷射參數的自動調 控,來改變雷射對材料的加熱溫度,使刀尖溫度保持在適 溫範圍内,以確保切削刀具9的使用壽命,進而辅助提供 刀具冷卻的第二道防線。 綜上所述,本發明為一深具實用性及進步性之設計, 然未見有相同之產品及刊物公開,從而允符發明專利申請 要件,爰依法提出申請。Page 6 200520915 V. Description of the invention (3) The heating temperature of the material is reduced by increasing the cutting temperature of the cutting tool 2 and the heating of the cutting tool 2 is softened to adjust the laser parameters to determine: cutting ::: cutting Formula, it will be difficult to take into account both cutting efficiency = cutter, and to study and consider where appropriate. [Inventive content of the surface] The main purpose of the present invention is to provide an emperor Λ 77 with F Jin emperor's body + -5 η field shot auxiliary cutting.重量 化 材 #, the cutting tool feeds Cheshbo, cooling the sprayer, sprays the low-temperature fluid of the cooling sprayer on: 'to cool the high temperature generated by the knife tip, and then make the temperature range' by this' namely The laser beam can be used to make cutting :: Warm heating softens the fork state and at the same time ensure the cutting tool: In addition to effectively improving the cutting efficiency and surface accuracy, it also has the dual benefit of service life. A secondary object of the present invention is to provide a laser assisted cutting. The cutting tool can be provided with a cooling liquid inside the handle of the cutting tool. It is for a moment. ^ /;,! Degree, phase rate , Because of the range requirement, so it is still in the first one ... "M Shi You V, mouth 7 shape follows the king | but the fluid circulates inside the cutting tool to reduce the temperature of the blade tip due to friction heat, and thus make The temperature of the tip is maintained to ensure the rigidity of the cutting tool, to effectively improve the accuracy of the female face, and to simultaneously double the life of the tool ^ [Embodiment] j It is better to make your reviewing committee take the invention one step further. The embodiment and the drawings are detailed as follows: The cutting tool is installed on the laser beam holder to maintain a high rigidity, and an extended knife device is provided. Its path will cut cold and warm and the temperature range efficiency. And the explanation, here are 200520915 V. Description of the invention (4)… Please refer to Figures 3 and 4, as shown in Figures 3 and 4, the cutting tool is installed on the chuck of the machine tool, and the cutting part 8 (such as ceramic) is set 1 On the 0, a laser head 1 1 system is installed on the tool 9 installed on the side Side of the cutting tool 9 and place the laser cutting tool holder 10 on the front of the cutting edge (ie, heating zone E). Adjust the focus to the cutting tool 9 chip sprayer 1 2, which sprays with high pressure ^ The tool holder 1 〇 is equipped with all the chips to prevent the chips from being blocked by the laser beam machine a (such as gas or liquid). One can be sprayed such as refrigerated gas or liquid inert. Please refer to Figures 5 and 6, when the cooling spray of the low-temperature fluid is activated, the chip ejector 12 and the laser 2 are started, and when cutting is started, it is directly in front of the knife edge 'and made there. The material laser beam irradiates the cutting tool 9 directly to the high-temperature softening material 2 ^, material F. Due to the high-temperature cutting at the focal point and the high-speed cutting friction heat during this process, heat will be transmitted to the cutting tool 9 In order to prevent the cutting tool 9 from rising, the cutting tool 9 gradually becomes the cutting tool 9 and the cutting tool 9 is damaged in advance. The present invention is used to cut the high-cut situation. Sprayer i 5 continuously sprays cutting tool two 9 warm fluid of cutting material (Such as frozen gas or liquid j, the position is lowered), to directly cool the cutting edge of cutting tool 9 ^ ^ gas and other low-temperature fluidity is maintained within the appropriate temperature range (not exceeding 1 4 7 ft to warm the cutting edge of the tool The rigidity of 9; In addition, because the cooling sprayer 丄 1 is used to ensure the cutting fluid, when spraying high-temperature low-temperature fluid, it is also ^ spraying low-temperature chips and cooling cutting tools, and the chip sprayer can also be used for spraying at the same time. In addition to cutting, a chip sprayer is installed; please refer to Figure 7, for cutting, which can save 200520915 V. Description of the invention (5) Insert the workpiece 8 ^ The south temperature softening material F in front of the knife edge is directly cut and peeled 5 because The high-temperature softening material F has been instantaneously heated and softened, so that cutting resistance can be greatly reduced, so that the cutting tool 9 can improve cutting speed and cutting accuracy. Please refer to FIG. 8. In addition, in order to avoid the uncertainty of the cooling effect caused by other factors during the cooling process of the cutting tool 9, the present invention can also be equipped with a digital thermometer 1 3 in the handle of the cutting tool 9. Digital thermometer 1 3 is used to monitor the temperature of the tool tip and feedback immediately. The system controller 1 4 will automatically adjust the laser parameters through the system controller 14 if the tool cannot be cooled to a proper temperature with a low-temperature fluid. To change the heating temperature of the material by changing the laser to keep the tip temperature within the proper temperature range ® to ensure the service life of the cutting tool 9 and to help provide a second line of defense for tool cooling; see Figure 9 This is another embodiment of the present invention. The workpiece 8 is installed on the chuck of the machine tool, the cutting tool 9 is installed on the side tool holder 10, and a laser head 11 is installed on the tool. On the base 10, the laser beam is adjusted to focus directly in front of the cutting edge of the cutting tool 9, and a chip ejector 12 is installed on the tool base 10, which sprays fluid at high pressure to remove chips. Prevent chips from being covered by The beam is radiated, and a coolant circulation flow path 16 is provided inside the cutting tool 9, and the coolant circulation flow path 16 is connected to a freezer 19 at its inlet and outlet 17 and 18, respectively; Fig. 10, when the workpiece 8 starts cutting, the chip ejector-1 2 and the laser head 1 1 are activated, so that the laser beam is irradiated directly in front of the knife edge to soften the material 'at the tip of the cutting tool 9 When the temperature in the south of the laser focus and the frictional heat between the cutting tool 9 and the workpiece 8 gradually increase the temperature, that is, 200520915 V. Description of the invention (6) The coolant circulation flow path 16 inside the cutting tool 9 can be used. The cutting tool 9 is indirectly cooled with a low-temperature fluid, so that the temperature of the cutting edge is maintained within a proper temperature range to ensure the rigidity of the cutting tool 9 and thereby effectively extend the service life of the cutting tool 9. Please refer to FIG. 11. In order to avoid the uncertainty of the cooling effect caused by other factors during the cooling process of the cutting tool 9 during the cooling process, a digital thermometer 1 may be additionally installed in the handle of the cutting tool 9. 3, using a digital thermometer 1 3 as an online monitoring tool tip temperature, and immediately feedback to the system controller 14, if the tool can not be cooled to a suitable temperature with a low temperature fluid, the system controller 14 automatically performs laser parameters Control to change the heating temperature of the laser to the material, keep the tip temperature within a suitable temperature range, to ensure the service life of the cutting tool 9, and then provide a second line of defense for tool cooling. To sum up, the present invention is a design with deep practicality and advancement. However, the same products and publications have not been disclosed, so that it meets the requirements for the patent application for invention, and applies according to law.

第10頁 200520915 一 二三 C ( (( ffl 。 圖。圖。。圖圖 意 圖 意圖意} }意意 示 意 示意示一二示示 置 示。置示之置置。配 置圖配之態圖圖配配圖之 配意之態狀意意之之意置 之示置狀用示示置置示裝 置之裝用使動動裝裝用工 裝工工使器作作工工使加 工加加頭喷削削加加之削 加細削射卻切切削削圖切 削精切雷冷之之切切9明 切微明明明明明明明第發 式式發發發發發發發係本 習習本本本本本本本...... 月..................圖圖引 說圖圖圖圖圖圖圖圖圖οι索 ϋ曰一 ffi°12345678911 號 式第第第第第第第第第第第件 圖 3 CO r-H LO 2 : 9 1—1:1—- 7 9 : 4ii: 1 : 1 1 具:制 具:度器 :: 刀頭控 刀頭溫喷口機 势射統 削射位卻水珠 切雷系 切雷數冷入冷 6 2 4: 5 7 1 1 路 1—I : : OW · · :流 00 :3計器 J 1器器環1 一^^件:度除明8: 除制循: 式工座溫喷發:座喷控液口 習瓷具位屑本件具屑統卻水 C陶刀數切t 工刀切系冷出 200520915Page 10 200520915 One Two Three C (((ffl. Figure. Figure. Figure Figure Intention Intent Intent}} Intentionally Schematic Show One or Two Show Placement. Placement Placement. Configuration Diagram Configuration State Diagram Distribution The meaning of the figure, the meaning of the meaning, the meaning of the display, the installation of the display, the installation of the display device, the mobile device, the tool, the tool, the work, the processing, plus the spraying, plus Cut and fine cut, but cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut, cut. Month ........ Introduction Diagram Diagram Diagram Diagram Diagram Diagram Diagram The first and third pieces of figure 3 CO rH LO 2: 9 1—1: 1—- 7 9: 4ii: 1: 1 1 Tools: Tooling: Protractor :: Tool head control and nozzle head temperature nozzle machine potential shooting system cutting The number of water droplets is mined. The mined number is cold and cold. 6 2 4: 5 7 1 1 Road 1—I:: OW · ·: Stream 00: 3 counter J 1 counter ring 1 1 ^^ 8: In addition to the system: the type seat temperature eruption: the seat spray control liquid mouth to learn the porcelain with bits Chips but water C potter knife cutting t knife cutting system cold out 200520915

圖式簡單說明 加熱區· E 軟化材料· FBrief description of the drawing Heating zone · E softening material · F

ΙΙΙ·! 第12頁ΙΙΙ ·! Page 12

Claims (1)

200520915 六、申請專利範圍 1 · 一種雷射輔助切削裝置,包含有: 刀具座; 切削刀具:係裝設於刀具座上; 雷射頭:係裝設於刀具座上,其雷射光束可聚焦至 加工材料上’並瞬間加熱軟化材料, 冷卻喷器:係裝設於刀具座上,以低溫之高壓流體喷 灑切削刀具。 2 ·依申請專利範圍第1項所述之雷射輔助切削裝置,其 中,該刀具座上係裝設有一切屑喷除器,以高壓流體 喷除切屑。 · 3 ·依申請專利範圍第1項所述之雷射輔助切削裝置,其 中,該切削刀具之刀把内輔助設有一數位溫度計,以 監測刀尖溫度,並以一系統控制器接收數位溫度計回 饋之刀尖溫度,而進行雷射參數的自動調控,以修正 雷射光束對材料的加熱溫度。 4 · 一種雷射輔助切削裝置,包含有: 刀具座; ' 切削刀具:係裝設於刀具座上; 雷射頭:係裝設於刀具座上,其雷射光東可聚焦至 φ 加工材料上,並瞬間加熱軟化材料; 切屑喷除器:係設於刀具座上,以高壓流體喷除切 屑; 冷卻液循環流路:係設於切削刀具之内部,供低溫流 體循環流動。200520915 VI. Scope of patent application 1 · A laser-assisted cutting device, including: a tool holder; cutting tools: installed on the tool holder; laser head: installed on the tool holder, the laser beam can be focused To the processing material 'and instantly heat and soften the material. Cooling sprayer: It is installed on the tool holder and sprays the cutting tool with low temperature and high pressure fluid. 2. The laser-assisted cutting device according to item 1 of the scope of the patent application, wherein the tool holder is equipped with all chip ejectors to eject chips with a high-pressure fluid. · 3 · The laser-assisted cutting device according to item 1 of the scope of the patent application, wherein a digital thermometer is provided inside the cutting tool holder of the cutting tool to monitor the temperature of the tip and a system controller receives the digital thermometer's feedback The temperature of the blade is adjusted automatically by laser parameters to correct the heating temperature of the laser beam on the material. 4 · A laser-assisted cutting device comprising: a tool holder; 'cutting tools: mounted on the tool holder; laser heads: mounted on the tool holder, whose laser light can be focused on the φ processing material , And instantaneously heat and soften the material; Chip sprayer: set on the tool holder, spray chips with high pressure fluid; Coolant circulation flow path: Set inside the cutting tool for low-temperature fluid circulation. 第13頁 200520915 六、申請專利範圍 5 ·依申請專利範圍第4項所述之雷射輔助切削裝置,其 中,該冷卻液循環流路之入、出水口係連接一冷凍 機。 6 ·依申請專利範圍第4項所述之雷射輔助切削裝置,其 中,該切削刀具之刀把内輔助設有一數位溫度計,以 監測刀尖溫度,並以一系統控制器接收數位溫度計回 饋之刀尖溫度,而進行雷射參數的自動調控,以修正 雷射光束對材料的加熱溫度。Page 13 200520915 VI. Scope of patent application 5. The laser auxiliary cutting device according to item 4 of the scope of patent application, in which the inlet and outlet of the coolant circulation flow path are connected to a refrigerator. 6. The laser-assisted cutting device according to item 4 of the scope of the patent application, wherein a digital thermometer is provided inside the blade of the cutting tool to monitor the tip temperature and a system controller receives the digital thermometer feedback from the knife Temperature, and automatic adjustment of laser parameters to correct the heating temperature of the laser beam on the material.
TW92136646A 2003-12-23 2003-12-23 Laser-assisted cutting device TWI222399B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92136646A TWI222399B (en) 2003-12-23 2003-12-23 Laser-assisted cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92136646A TWI222399B (en) 2003-12-23 2003-12-23 Laser-assisted cutting device

Publications (2)

Publication Number Publication Date
TWI222399B TWI222399B (en) 2004-10-21
TW200520915A true TW200520915A (en) 2005-07-01

Family

ID=34546544

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92136646A TWI222399B (en) 2003-12-23 2003-12-23 Laser-assisted cutting device

Country Status (1)

Country Link
TW (1) TWI222399B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103753223A (en) * 2013-12-11 2014-04-30 广州中国科学院先进技术研究所 Laser-assisted drilling method and device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399258B (en) * 2007-11-23 2013-06-21 Hon Hai Prec Ind Co Ltd Precision machining device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103753223A (en) * 2013-12-11 2014-04-30 广州中国科学院先进技术研究所 Laser-assisted drilling method and device

Also Published As

Publication number Publication date
TWI222399B (en) 2004-10-21

Similar Documents

Publication Publication Date Title
CN100374243C (en) Laser-auxiliary cutting device
US7002100B2 (en) Laser assisted machining method and device
Chang et al. Evaluation of surface roughness in laser-assisted machining of aluminum oxide ceramics with Taguchi method
JP4337050B2 (en) Glass plate cutting device {GLASS-PLATECHTINGMACHINE}
CN1512928B (en) Apparatus and method for machining with cryogenically cooling oxide-containing ceramic cutting tools
CN107127459A (en) A kind of laser accurate processing method of diamond cutter
CN101444875A (en) Cutting method of fragile material substrate
CN102528280A (en) Laser-water jet composite micromachining process and device
US5592863A (en) Cryogenic machining of soft/ductile materials
JP2018187765A (en) Dry ice powder injection type cooling method, and cooling apparatus
CN109048054B (en) Multi-axis laser-abrasive water jet precise polishing synchronous processing method
CN104999176A (en) Method for machining cutting edge
JP2016055360A (en) Byte holder and cutting tool
JPH0631502A (en) Cutting tool
CN101462205A (en) Laser cutting method of amorphous alloy strip steel rolled stock
WO2022198998A1 (en) Metal surface layer low-temperature cutting machining method and device
CN107442791A (en) Lathe
TW200520915A (en) Laser-assisted cutting device
JP6266129B2 (en) Cutting device
CN219094052U (en) Cooling device for laser cutting machine
CN103658996A (en) Nitrogen laser cutting machining device for saw blade base body
JIANG et al. Femtosecond laser processing technology of diamond micro-channel heat sink based on radar power module
Ravi et al. Experimental study on internal cooling system in hard turning of HCWCI using CBN tools
TWI232144B (en) Processing method and device using pulse laser to assist in precise cutting
CN103659211B (en) A kind of method of processing silicon carbide blade

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees