TW200517815A - Heat sink device of computer case - Google Patents
Heat sink device of computer caseInfo
- Publication number
- TW200517815A TW200517815A TW092133524A TW92133524A TW200517815A TW 200517815 A TW200517815 A TW 200517815A TW 092133524 A TW092133524 A TW 092133524A TW 92133524 A TW92133524 A TW 92133524A TW 200517815 A TW200517815 A TW 200517815A
- Authority
- TW
- Taiwan
- Prior art keywords
- computer case
- heat
- inlet
- heat sink
- mother board
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092133524A TW200517815A (en) | 2003-11-28 | 2003-11-28 | Heat sink device of computer case |
US10/709,073 US20050117294A1 (en) | 2003-11-28 | 2004-04-12 | Heat sink device of computer case |
JP2004133532A JP2005166006A (ja) | 2003-11-28 | 2004-04-28 | コンピュータケースの冷却装置 |
FR0451144A FR2863068A1 (fr) | 2003-11-28 | 2004-06-09 | Dissipateur thermique d'un boitier d'ordinateur |
DE102004030574A DE102004030574A1 (de) | 2003-11-28 | 2004-06-24 | Wärmeabführungseinrichtung für ein Computergehäuse |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092133524A TW200517815A (en) | 2003-11-28 | 2003-11-28 | Heat sink device of computer case |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200517815A true TW200517815A (en) | 2005-06-01 |
Family
ID=34568686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092133524A TW200517815A (en) | 2003-11-28 | 2003-11-28 | Heat sink device of computer case |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050117294A1 (zh) |
JP (1) | JP2005166006A (zh) |
DE (1) | DE102004030574A1 (zh) |
FR (1) | FR2863068A1 (zh) |
TW (1) | TW200517815A (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM300959U (en) * | 2006-04-18 | 2006-11-11 | Enermax Technology Corp | Fan fixing structure on the housing of computer |
CN101377705B (zh) * | 2007-08-30 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | 电脑 |
JP6078278B2 (ja) * | 2012-09-19 | 2017-02-08 | 小島プレス工業株式会社 | 給電ユニット |
CN104615024B (zh) * | 2015-01-05 | 2017-05-03 | 浪潮电子信息产业股份有限公司 | 一种间接进行进风温度检测功能开发的方法 |
US10536690B2 (en) | 2016-01-29 | 2020-01-14 | Magic Leap, Inc. | Display for three-dimensional image |
KR102627882B1 (ko) | 2017-05-30 | 2024-01-22 | 매직 립, 인코포레이티드 | 전자 디바이스를 위한 팬 조립체를 갖는 전력 공급기 조립체 |
CN107977058A (zh) * | 2017-07-10 | 2018-05-01 | 常州信息职业技术学院 | 计算机机箱 |
CA3068612A1 (en) * | 2017-07-28 | 2019-01-31 | Magic Leap, Inc. | Fan assembly for displaying an image |
CN107894816A (zh) * | 2018-01-05 | 2018-04-10 | 山东大学 | 一种快速散热的计算机机箱 |
CN109613961A (zh) * | 2018-11-20 | 2019-04-12 | 赖成凤 | 一种便于散热防尘的电脑主机箱 |
USD1012922S1 (en) * | 2019-08-26 | 2024-01-30 | Hewlett-Packard Development Company, L.P. | Computer chassis |
USD944243S1 (en) * | 2020-01-31 | 2022-02-22 | Hewlett-Packard Development Company, L.P. | Computer |
USD1042437S1 (en) * | 2022-01-05 | 2024-09-17 | Burak Barmanbek | Casing |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5440450A (en) * | 1990-09-14 | 1995-08-08 | Next, Inc. | Housing cooling system |
US6914779B2 (en) * | 2002-02-15 | 2005-07-05 | Microsoft Corporation | Controlling thermal, acoustic, and/or electromagnetic properties of a computing device |
-
2003
- 2003-11-28 TW TW092133524A patent/TW200517815A/zh unknown
-
2004
- 2004-04-12 US US10/709,073 patent/US20050117294A1/en not_active Abandoned
- 2004-04-28 JP JP2004133532A patent/JP2005166006A/ja active Pending
- 2004-06-09 FR FR0451144A patent/FR2863068A1/fr not_active Withdrawn
- 2004-06-24 DE DE102004030574A patent/DE102004030574A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2863068A1 (fr) | 2005-06-03 |
JP2005166006A (ja) | 2005-06-23 |
US20050117294A1 (en) | 2005-06-02 |
DE102004030574A1 (de) | 2005-08-04 |
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