TW200512252A - Epoxy resin composition and manufacturing method of heat resisting laminated sheet - Google Patents

Epoxy resin composition and manufacturing method of heat resisting laminated sheet

Info

Publication number
TW200512252A
TW200512252A TW093123297A TW93123297A TW200512252A TW 200512252 A TW200512252 A TW 200512252A TW 093123297 A TW093123297 A TW 093123297A TW 93123297 A TW93123297 A TW 93123297A TW 200512252 A TW200512252 A TW 200512252A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
manufacturing
laminated sheet
heat resisting
Prior art date
Application number
TW093123297A
Other languages
English (en)
Inventor
Akira Ohbayashi
Kazutoshi Haraguchi
Original Assignee
Kawamura Inst Chem Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawamura Inst Chem Res filed Critical Kawamura Inst Chem Res
Publication of TW200512252A publication Critical patent/TW200512252A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4078—Curing agents not provided for by the groups C08G59/42 - C08G59/66 boron containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW093123297A 2003-08-05 2004-08-04 Epoxy resin composition and manufacturing method of heat resisting laminated sheet TW200512252A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003206012 2003-08-05

Publications (1)

Publication Number Publication Date
TW200512252A true TW200512252A (en) 2005-04-01

Family

ID=34113698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123297A TW200512252A (en) 2003-08-05 2004-08-04 Epoxy resin composition and manufacturing method of heat resisting laminated sheet

Country Status (6)

Country Link
US (1) US20060247334A1 (zh)
EP (1) EP1652869A4 (zh)
KR (1) KR101159549B1 (zh)
CN (1) CN100366656C (zh)
TW (1) TW200512252A (zh)
WO (1) WO2005012385A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005029146A1 (de) * 2005-06-23 2006-12-28 Cognis Ip Management Gmbh Härter für Überzugmassen (IV)
US8404310B2 (en) * 2007-08-02 2013-03-26 Dow Global Technologies Llc Thermoset dampener material
JP5136573B2 (ja) 2009-02-24 2013-02-06 日立化成工業株式会社 ワニス、プリプレグ、樹脂付きフィルム、金属箔張積層板、プリント配線板
WO2012151171A1 (en) * 2011-05-02 2012-11-08 Dow Global Technologies Llc Trimethyl borate in epoxy resins
FR3026340B1 (fr) * 2014-09-30 2017-03-17 Snecma Procede de moulage d'une resine thermodurcissable
CN114773578B (zh) * 2022-03-24 2023-12-26 武汉工程大学 一种环氧树脂共固化剂和制备方法及其应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001101A (en) * 1969-07-10 1977-01-04 Ppg Industries, Inc. Electrodeposition of epoxy compositions
US3738862A (en) 1971-11-08 1973-06-12 Shell Oil Co Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates
LU75333A1 (zh) * 1976-07-08 1978-02-08
SG43193A1 (en) * 1990-05-21 1997-10-17 Dow Chemical Co Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom
TW466256B (en) * 1995-11-24 2001-12-01 Ciba Sc Holding Ag Borate photoinitiator compounds and compositions comprising the same
JPH11343392A (ja) 1998-06-02 1999-12-14 Hitachi Chem Co Ltd テープキャリアパッケージ用エポキシ樹脂組成物
CA2322517C (en) * 1998-12-28 2008-10-14 Nof Corporation Thermosetting composition containing polyhemiacetal ester resin and powdery thermosetting composition
US6733698B2 (en) * 2001-02-15 2004-05-11 Pabu Services, Inc. Mixture of mono-, bis- and tris-(hydroxyaryl) phosphine oxides useful to make polyglycidyl ethers or in epoxy compositions
JP2002338787A (ja) * 2001-05-15 2002-11-27 Kawamura Inst Of Chem Res エポキシ樹脂組成物及びその硬化物
JP4011458B2 (ja) * 2001-10-31 2007-11-21 財団法人川村理化学研究所 硬化性エポキシ樹脂組成物およびその製造方法
CN1274760C (zh) * 2001-10-31 2006-09-13 财团法人川村理化学研究所 可固化环氧树脂组合物及其制造方法
JP4201632B2 (ja) * 2003-03-28 2008-12-24 株式会社Ａｄｅｋａ エポキシ樹脂用硬化剤組成物

Also Published As

Publication number Publication date
EP1652869A1 (en) 2006-05-03
CN100366656C (zh) 2008-02-06
KR101159549B1 (ko) 2012-06-26
KR20060069438A (ko) 2006-06-21
CN1829757A (zh) 2006-09-06
EP1652869A4 (en) 2006-08-02
US20060247334A1 (en) 2006-11-02
WO2005012385A1 (ja) 2005-02-10

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