TW200512058A - Electrolytic processing apparatus and electrolytic processing method - Google Patents

Electrolytic processing apparatus and electrolytic processing method

Info

Publication number
TW200512058A
TW200512058A TW093123170A TW93123170A TW200512058A TW 200512058 A TW200512058 A TW 200512058A TW 093123170 A TW093123170 A TW 093123170A TW 93123170 A TW93123170 A TW 93123170A TW 200512058 A TW200512058 A TW 200512058A
Authority
TW
Taiwan
Prior art keywords
substrate
processing
electrolytic processing
processing apparatus
electrolytic
Prior art date
Application number
TW093123170A
Other languages
English (en)
Inventor
Hozumi Yasuda
Ikutaro Noji
Kazuto Hirokawa
Takeshi Iizumi
Itsuki Kobata
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003206147A external-priority patent/JP2005054205A/ja
Priority claimed from JP2004082863A external-priority patent/JP2005264304A/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200512058A publication Critical patent/TW200512058A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
TW093123170A 2003-08-05 2004-08-03 Electrolytic processing apparatus and electrolytic processing method TW200512058A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003206147A JP2005054205A (ja) 2003-08-05 2003-08-05 電解加工装置及び電解加工方法
JP2004082863A JP2005264304A (ja) 2004-03-22 2004-03-22 電解加工装置

Publications (1)

Publication Number Publication Date
TW200512058A true TW200512058A (en) 2005-04-01

Family

ID=34117901

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123170A TW200512058A (en) 2003-08-05 2004-08-03 Electrolytic processing apparatus and electrolytic processing method

Country Status (3)

Country Link
US (1) US20070095659A1 (zh)
TW (1) TW200512058A (zh)
WO (1) WO2005012600A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103317197A (zh) * 2013-06-26 2013-09-25 大连理工大学 一种平面电化学加工装置
CN104152979A (zh) * 2014-09-04 2014-11-19 蒙家革 一种电解蚀刻头和数控电解蚀刻系统及蚀刻方法
CN114453689A (zh) * 2022-02-15 2022-05-10 南京工业大学 一种用于掩膜电解加工的柱塞式冲液加工装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7799200B1 (en) * 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US11487307B2 (en) * 2018-07-02 2022-11-01 Overcast Innovations Llc Method and system for providing a centralized appliance hub

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH462981A (fr) * 1967-04-28 1968-09-30 Charmilles Sa Ateliers Dispositif d'avance et de guidage rectilignes de l'électrode dans une machine à usiner par électro-érosion
EP0213825A3 (en) * 1985-08-22 1989-04-26 Molecular Devices Corporation Multiple chemically modulated capacitance
JP2001260012A (ja) * 2000-03-15 2001-09-25 Mitsubishi Materials Corp ウェーハ研磨用ヘッド及びこれを用いた研磨装置
FR2803284B1 (fr) * 2000-01-03 2002-04-12 Michel Bernard Dispositif automatique de purification d'eau potable
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7153410B2 (en) * 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
US6478937B2 (en) * 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
US7638030B2 (en) * 2001-06-18 2009-12-29 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
JP3995463B2 (ja) * 2001-12-13 2007-10-24 株式会社荏原製作所 電解加工方法
JP2004209588A (ja) * 2002-12-27 2004-07-29 Ebara Corp 研磨装置及び研磨方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103317197A (zh) * 2013-06-26 2013-09-25 大连理工大学 一种平面电化学加工装置
CN104152979A (zh) * 2014-09-04 2014-11-19 蒙家革 一种电解蚀刻头和数控电解蚀刻系统及蚀刻方法
CN104152979B (zh) * 2014-09-04 2017-02-01 蒙家革 一种电解蚀刻头和数控电解蚀刻系统及蚀刻方法
CN114453689A (zh) * 2022-02-15 2022-05-10 南京工业大学 一种用于掩膜电解加工的柱塞式冲液加工装置

Also Published As

Publication number Publication date
US20070095659A1 (en) 2007-05-03
WO2005012600A1 (en) 2005-02-10

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