MX2007003606A - Portador al vacio para unidades de circuito integrado. - Google Patents

Portador al vacio para unidades de circuito integrado.

Info

Publication number
MX2007003606A
MX2007003606A MX2007003606A MX2007003606A MX2007003606A MX 2007003606 A MX2007003606 A MX 2007003606A MX 2007003606 A MX2007003606 A MX 2007003606A MX 2007003606 A MX2007003606 A MX 2007003606A MX 2007003606 A MX2007003606 A MX 2007003606A
Authority
MX
Mexico
Prior art keywords
integrated circuit
recesses
circuit units
recess
vacuum holder
Prior art date
Application number
MX2007003606A
Other languages
English (en)
Inventor
Hae Choon Yang
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Publication of MX2007003606A publication Critical patent/MX2007003606A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

Un dispositivo de soporte para soportar un conjunto de unidades (65) de circuito integrado, el dispositivo comprende: un miembro de soporte que tiene una superficie metalica, la superficie tiene una serie de rebajos (27); una capa de material suave, que subyace los rebajos de la superficie metalica, para proteger las unidades (65) del dano provocado por el contacto con la superficie metalica, y; un medio (35) al vacio en comunicacion con los rebajos (27), de modo que el medio al vacio soporta cada unidad dentro de un rebajo respectivo, en donde la capa de material suave se forma de una pluralidad de insertos (40) independientes, cada inserto es capaza de acoplar con al menos un rebajo utilizando medios (50, 55) de acoplamiento para acoplar cada inserto (40) con al menos un rebajo (27).
MX2007003606A 2004-09-27 2005-07-19 Portador al vacio para unidades de circuito integrado. MX2007003606A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200405927A SG121019A1 (en) 2004-09-27 2004-09-27 A conversion kit
PCT/SG2005/000240 WO2006036126A1 (en) 2004-09-27 2005-07-19 Vacuum holder for integrated circuit units

Publications (1)

Publication Number Publication Date
MX2007003606A true MX2007003606A (es) 2007-06-05

Family

ID=36119180

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2007003606A MX2007003606A (es) 2004-09-27 2005-07-19 Portador al vacio para unidades de circuito integrado.

Country Status (9)

Country Link
US (1) US7540503B2 (es)
EP (1) EP1800328B1 (es)
JP (1) JP4852045B2 (es)
KR (1) KR101109247B1 (es)
CN (1) CN101031994B (es)
MX (1) MX2007003606A (es)
MY (1) MY148114A (es)
SG (1) SG121019A1 (es)
WO (1) WO2006036126A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2001642C2 (nl) * 2008-05-30 2009-12-01 Fico Bv Inrichting en werkwijze voor het drogen van gesepareerde elektronische componenten.
JP2011253841A (ja) * 2010-05-31 2011-12-15 Sumco Corp ウェーハ保持具
CN105359264B (zh) 2013-04-08 2019-04-19 先进装配系统新加坡有限公司 用于引用由工件载体所支撑的工件的工件引用系统和方法
CN103264362A (zh) * 2013-05-06 2013-08-28 苏州金牛精密机械有限公司 一种真空吸盘定位治具
JP6173168B2 (ja) * 2013-10-29 2017-08-02 株式会社ディスコ レーザー加工装置
KR102202068B1 (ko) * 2014-05-29 2021-01-12 세메스 주식회사 반도체 패키지 고정용 흡착 패드
TWM527411U (zh) * 2016-05-06 2016-08-21 Fivetech Technology Inc 滾動裝置、滾動裝置包裝體及滾動模組
CN107689689A (zh) * 2017-11-10 2018-02-13 李志勇 一种电动真空吸纳无线充电器及其使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0456426B1 (en) 1990-05-07 2004-09-15 Canon Kabushiki Kaisha Vacuum type wafer holder
JPH07136885A (ja) * 1993-06-30 1995-05-30 Toshiba Corp 真空チャック
US5882055A (en) 1996-02-12 1999-03-16 Aetrium Incorporated Probe for handling microchips
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US5953540A (en) 1997-06-26 1999-09-14 Compaq Computer Corporation SCSI cable with two cable segments having a first resistor coupled to a Y-connection from each segment and a second resistor coupled to one corresponding conductor
US6196532B1 (en) 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members
US20060196532A1 (en) * 2003-09-15 2006-09-07 Benson Tung Sunshade with radio device

Also Published As

Publication number Publication date
EP1800328B1 (en) 2014-01-01
KR20070083598A (ko) 2007-08-24
MY148114A (en) 2013-02-28
KR101109247B1 (ko) 2012-01-30
CN101031994A (zh) 2007-09-05
JP2008515187A (ja) 2008-05-08
US20080118997A1 (en) 2008-05-22
EP1800328A1 (en) 2007-06-27
JP4852045B2 (ja) 2012-01-11
SG121019A1 (en) 2006-04-26
US7540503B2 (en) 2009-06-02
CN101031994B (zh) 2010-08-11
WO2006036126A1 (en) 2006-04-06

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Legal Events

Date Code Title Description
FG Grant or registration
HH Correction or change in general