TW200504875A - Pressure reduction apparatus, pressure reduction method, and pressure regulation valve - Google Patents

Pressure reduction apparatus, pressure reduction method, and pressure regulation valve

Info

Publication number
TW200504875A
TW200504875A TW093119647A TW93119647A TW200504875A TW 200504875 A TW200504875 A TW 200504875A TW 093119647 A TW093119647 A TW 093119647A TW 93119647 A TW93119647 A TW 93119647A TW 200504875 A TW200504875 A TW 200504875A
Authority
TW
Taiwan
Prior art keywords
valve
pressure reduction
valve body
pressure
gas
Prior art date
Application number
TW093119647A
Other languages
English (en)
Other versions
TWI366874B (zh
Inventor
Hiroyuki Matsuura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200504875A publication Critical patent/TW200504875A/zh
Application granted granted Critical
Publication of TWI366874B publication Critical patent/TWI366874B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K25/00—Details relating to contact between valve members and seats
    • F16K25/02—Arrangements using fluid issuing from valve members or seats
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0402—Cleaning, repairing, or assembling
    • Y10T137/0419—Fluid cleaning or flushing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
    • Y10T137/4245—Cleaning or steam sterilizing
    • Y10T137/4259—With separate material addition

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Details Of Valves (AREA)
TW093119647A 2003-07-03 2004-06-30 Pressure reduction apparatus, pressure reduction method, and pressure regulation valve TW200504875A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003191225A JP4187599B2 (ja) 2003-07-03 2003-07-03 減圧処理装置及び減圧処理方法並びに圧力調整バルブ

Publications (2)

Publication Number Publication Date
TW200504875A true TW200504875A (en) 2005-02-01
TWI366874B TWI366874B (zh) 2012-06-21

Family

ID=33562352

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119647A TW200504875A (en) 2003-07-03 2004-06-30 Pressure reduction apparatus, pressure reduction method, and pressure regulation valve

Country Status (5)

Country Link
US (1) US8051870B2 (zh)
JP (1) JP4187599B2 (zh)
KR (1) KR101108379B1 (zh)
TW (1) TW200504875A (zh)
WO (1) WO2005004219A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111334774A (zh) * 2018-12-18 2020-06-26 夏泰鑫半导体(青岛)有限公司 气体反应装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4517924B2 (ja) * 2005-04-04 2010-08-04 Ｓｍｃ株式会社 真空調圧バルブ
US8122903B2 (en) 2007-07-26 2012-02-28 Parker-Hannifin Corporation Close-coupled purgeable vaporizer valve
DE102007050086A1 (de) * 2007-10-19 2009-04-23 Alfa Laval Kolding A/S Verfahren zum Betrieb eines Ventils
JP4961381B2 (ja) * 2008-04-14 2012-06-27 株式会社日立国際電気 基板処理装置、基板処理方法及び半導体装置の製造方法
JP4924676B2 (ja) * 2009-08-13 2012-04-25 東京エレクトロン株式会社 ガスポート構造及び処理装置
US9091371B2 (en) * 2010-12-27 2015-07-28 Kenneth K L Lee Single axis gate valve for vacuum applications
KR101528458B1 (ko) * 2013-01-18 2015-06-18 (주) 유앤아이솔루션 슬라이딩 역압 차단 밸브
US20170162366A1 (en) * 2015-12-08 2017-06-08 Asm Ip Holding B.V. Film forming apparatus, recording medium, and film forming method
KR101828427B1 (ko) * 2017-11-22 2018-03-29 주식회사 보야 파우더 프로텍팅 3웨이 밸브
JP2023108407A (ja) 2022-01-25 2023-08-04 東京エレクトロン株式会社 圧力調整弁、および半導体製造装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2254472A (en) * 1939-04-28 1941-09-02 Mason Neilan Regulator Company Combination control and quench valve
US3133554A (en) * 1961-12-08 1964-05-19 Ladish Co Valve having a seat cleaning feature
US4174728A (en) * 1977-11-14 1979-11-20 The United States Of America As Represented By The United States Department Of Energy Sliding-gate valve
JPS56105183A (en) 1980-01-23 1981-08-21 Kubota Ltd Valve for metal vapor-contained high temperature gas
US4383546A (en) * 1980-12-01 1983-05-17 Ecolaire Incorporated High temperature, high pressure valve
US4554942A (en) * 1983-09-06 1985-11-26 Advanced Micro Devices, Inc. Process gas controller
JP3005449B2 (ja) * 1995-04-11 2000-01-31 シーケーディ株式会社 ヒーティング機能付真空弁
JPH08285133A (ja) 1995-04-17 1996-11-01 Nec Kansai Ltd 真空プロセス装置用ゲートバルブ
JP3032708B2 (ja) * 1995-09-25 2000-04-17 シーケーディ株式会社 真空用開閉弁
US5678595A (en) * 1995-12-21 1997-10-21 Benkan Corporation Vacuum exhaust valve
JP3406528B2 (ja) 1996-01-31 2003-05-12 株式会社キッツエスシーティー 半導体製造装置用無摺動ゲートバルブ
US5755255A (en) 1996-10-29 1998-05-26 Benkan Corporation Gate valve for regulating gas flow in semiconductor manufacturing
TW471031B (en) 1997-01-08 2002-01-01 Ebara Corp Vapor feed supply system
JPH1183309A (ja) 1997-09-04 1999-03-26 Nippon Air Rikiide Kk アルゴン精製方法及び装置
JP3891682B2 (ja) * 1998-01-05 2007-03-14 株式会社荏原製作所 弁装置及び開閉弁の洗浄方法
JPH11214317A (ja) 1998-01-27 1999-08-06 Kokusai Electric Co Ltd 基板処理装置および基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111334774A (zh) * 2018-12-18 2020-06-26 夏泰鑫半导体(青岛)有限公司 气体反应装置

Also Published As

Publication number Publication date
KR101108379B1 (ko) 2012-01-30
TWI366874B (zh) 2012-06-21
US8051870B2 (en) 2011-11-08
KR20060035576A (ko) 2006-04-26
JP4187599B2 (ja) 2008-11-26
US20060162780A1 (en) 2006-07-27
JP2005026516A (ja) 2005-01-27
WO2005004219A1 (ja) 2005-01-13

Similar Documents

Publication Publication Date Title
TW200504875A (en) Pressure reduction apparatus, pressure reduction method, and pressure regulation valve
AU2003222164A1 (en) Feeder assembly for particle blast system
HK1080927A1 (en) Fluid control valve
TW200629358A (en) Gate valve device, treatment system and seal member replacing method
TW200619534A (en) Static-pressure type non-contacting gas seal
CN104100739A (zh) 气控组合阀及其使用方法
DE502005002416D1 (de) Sicherheitsventil für einen Druckgasbehälter
SG137731A1 (en) Process apparatuses
CN104405939A (zh) 一种三级减压器
CN202001647U (zh) 一种新型的真空连续炉插板阀
CN103527802B (zh) 真空喷涂机高密封插板阀
CN201461825U (zh) 压力可调气弹簧
CN100596324C (zh) 静音型调压阀组
CN211738073U (zh) 一种有效减少磨损的插板阀
CN201030429Y (zh) 钢包底挠性密封导流套装置
CN103225699A (zh) 眼镜阀及其阀板导向驱动机构
CN202493684U (zh) 膜片式减压阀
CN206130146U (zh) 一种青铜截止阀
CN110335838A (zh) 传输装置、传输腔室及防止机械手腐蚀的方法
CN110822098A (zh) 一种轴密封失效用防护结构及其使用方法
CN204477330U (zh) 一种三偏心金属密封蝶阀
GB2332939B (en) Means for testing a fluid valve and method therefor
CN218954127U (zh) 一种应用于水煤浆气化系统中的改进型弹簧式安全阀
RU2215224C1 (ru) Бескорпусной затвор с криволинейной траекторией перемещения
CN219888786U (zh) 一种轴向密封浮动球阀

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees