TW200500285A - Inspection apparatus and method for film carrier tape for mounting electronic parts - Google Patents

Inspection apparatus and method for film carrier tape for mounting electronic parts

Info

Publication number
TW200500285A
TW200500285A TW093116913A TW93116913A TW200500285A TW 200500285 A TW200500285 A TW 200500285A TW 093116913 A TW093116913 A TW 093116913A TW 93116913 A TW93116913 A TW 93116913A TW 200500285 A TW200500285 A TW 200500285A
Authority
TW
Taiwan
Prior art keywords
carrier tape
film carrier
electronic parts
mounting electronic
tape
Prior art date
Application number
TW093116913A
Other languages
Chinese (zh)
Other versions
TWI266740B (en
Inventor
Kota Hagiwara
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200500285A publication Critical patent/TW200500285A/en
Application granted granted Critical
Publication of TWI266740B publication Critical patent/TWI266740B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Wire Bonding (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Packages (AREA)

Abstract

An inspection apparatus for film carrier tape for mounting electronic parts is used for detecting the defects of a wiring pattern of a film carrier tape for mounting electronic parts. The apparatus comprises an aperture gate portion in which the conveyed film carrier tape for mounting electronic parts is supported and guided and the aperture portion for inspection is formed. The aperture mentioned above is in touch with the surface of the film carrier tape across the whole width thereof. And, a plate-like correction element is used to press the film carrier tape in the direction of the contact. According to the present invention, the whole bottom of the correction element is contacted with the film carrier tape. Because the tape is pressed in the direction or the contact, even if a film carrier tape carrier tape such as a thin film like COF is used, curling and limping are not yielded in the direction of conveying and width. Therefore, the accurate and quick quality inspection can be practiced because no influence to the inspection from the curling and limping of the tape.
TW093116913A 2003-06-13 2004-06-11 Inspection apparatus and method for film carrier tape for mounting electronic parts TWI266740B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003169419A JP3716413B2 (en) 2003-06-13 2003-06-13 Inspection device and inspection method for film carrier tape for mounting electronic components

Publications (2)

Publication Number Publication Date
TW200500285A true TW200500285A (en) 2005-01-01
TWI266740B TWI266740B (en) 2006-11-21

Family

ID=34094561

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116913A TWI266740B (en) 2003-06-13 2004-06-11 Inspection apparatus and method for film carrier tape for mounting electronic parts

Country Status (4)

Country Link
JP (1) JP3716413B2 (en)
KR (1) KR100618254B1 (en)
CN (1) CN1298039C (en)
TW (1) TWI266740B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586449B1 (en) * 2004-04-27 2006-06-08 미래산업 주식회사 Method for correcting accuracy of feeder
CN101167417B (en) * 2005-05-23 2010-08-18 松下电器产业株式会社 Electronic components carrier tape package and electronic components feeding apparatus
KR100772608B1 (en) * 2006-05-29 2007-11-02 아주하이텍(주) System for optical automated inspection
US7961299B2 (en) 2007-11-08 2011-06-14 Orc Manufacturing Co., Ltd. Transfer device
EP2521169B1 (en) * 2009-12-31 2015-05-13 Ocean's King Lighting Science&Technology Co., Ltd. White light luminescent device based on purple light leds
JP7026297B2 (en) * 2016-06-03 2022-02-28 有限会社ヤスコーポレーション Roll-shaped inspection device for objects to be inspected
CN111232709A (en) * 2020-03-11 2020-06-05 中山市尚研自动化设备有限公司 Label detection connecting machine

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3536728B2 (en) * 1998-07-31 2004-06-14 セイコーエプソン株式会社 Semiconductor device, tape carrier, manufacturing method thereof, circuit board, electronic device, and tape carrier manufacturing apparatus
JP3155951B1 (en) * 2000-01-31 2001-04-16 三井金属鉱業株式会社 Method for removing warpage of film carrier tape for mounting electronic components and apparatus for removing warpage of film carrier tape for mounting electronic components therefor
JP2001351951A (en) * 2000-06-08 2001-12-21 Sumitomo 3M Ltd Apparatus and method for correcting warp of semiconductor carrier tape
JP4729789B2 (en) * 2000-12-26 2011-07-20 住友金属鉱山株式会社 Thin plate warpage correction device
JP2003045919A (en) * 2001-07-31 2003-02-14 Ando Electric Co Ltd Handler for tcp

Also Published As

Publication number Publication date
JP2005005586A (en) 2005-01-06
KR20040107440A (en) 2004-12-20
KR100618254B1 (en) 2006-09-01
TWI266740B (en) 2006-11-21
CN1298039C (en) 2007-01-31
CN1574266A (en) 2005-02-02
JP3716413B2 (en) 2005-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees