JP3155951B1 - Method for removing warpage of film carrier tape for mounting electronic components and apparatus for removing warpage of film carrier tape for mounting electronic components therefor - Google Patents

Abstract

The present invention provides a method for removing a warpage of a film carrier tape for mounting an electronic component and a device for removing the warpage of the film carrier tape for mounting an electronic component. A leveler unit comprising leveler rollers alternately displaced up and down, and a reverse warpage restraint that restrains the electronic component mounting film carrier tape in the width direction and reversely warps the reverse direction. The members are used in various combinations in the heating step and the cooling step, and the warpage generated in the film carrier tape for mounting electronic components is corrected by the leveler unit and the reverse warp imparting restraining member, and the solder resist, the adhesive, and the base are used. A material such as a material film is brought into a cured state, and a flat state is maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier tape (TAB) for mounting electronic parts.
g) Tape, T-BGA (Tape Ball Grid Array) tape,
CSP (Chip Size Package) tape, ASIC (Appl
ication Specific Integrated Circuit) tape etc.)
The present invention relates to a method for removing a warp of a film carrier tape for mounting an electronic component and a device for removing a warp of the film carrier tape for mounting an electronic component for removing a warp (hereinafter, simply referred to as “film carrier tape for mounting an electronic component”).

[0002]

2. Description of the Related Art With the development of the electronics industry,
The demand for printed wiring boards on which electronic components such as C (integrated circuits) and LSIs (large-scale integrated circuits) are mounted has been rapidly increasing, but there has been a demand for smaller, lighter, and more sophisticated electronic devices. Recently, TAB has been used as a mounting method for these electronic components.
A mounting method using a film carrier tape for mounting electronic components such as a tape, a T-BGA tape, a CSP and an ASIC tape has been adopted. In particular, liquid crystal display elements (LCDs), such as personal computers, which are required to have higher definition, thinner, and smaller frame areas of liquid crystal screens
Is increasingly important in the electronics industry that uses it.

Conventionally, such a film carrier tape for mounting electronic components has been manufactured through the following steps as a method of manufacturing a TAB tape, for example. That is, first, an insulating film serving as a base material such as a polyimide film is subjected to pattern punching by a press machine, and then a copper foil is adhered to the insulating film via an adhesive by thermocompression bonding. Then, a photoresist is applied to the entire upper surface of the copper foil, the photoresist is exposed to ultraviolet rays in a desired pattern shape using a photoresist mask, and the exposed photoresist portions are dissolved by a developer. Remove. The copper foil that is not covered with the photoresist is removed by chemically dissolving (etching) with an acid as an etchant, and the photoresist is dissolved and removed with an alkaline solution to remain on the insulating film. A desired wiring pattern is formed with the copper foil.

[0004] Among the wiring patterns, inner leads connected to devices (electronic parts) such as ICs and LSIs for preventing short circuits due to dust, whiskers, and migration during mounting, and for protecting and insulating between wirings. Except for the lead parts such as the outer leads connected to the liquid crystal display element, etc., a solder resist such as an epoxy resin as an insulating resin is applied through a screen on which a coating pattern is formed using a squeegee by screen printing. After being applied, it is dried and cured to form a solder resist coating layer.

[0005] Thereafter, in order to prevent oxidation and discoloration of the exposed lead portion and to secure adhesion strength to a connection portion such as a bump of a device connected to the lead portion, the lead portion is made of, for example, tin plating or gold plating. And tin-lead eutectic alloy plating. Then, the inner lead of the TAB tape and I
A method such as gang bonding (inner lead) is used to connect electrodes on electronic components such as C chips via bumps such as gold.
Bonding).

A film carrier tape to which electronic components such as an IC chip are connected is sealed with an epoxy resin or the like by potting or transfer molding to protect the electronic components such as the IC chip, and then the resin is cured by heating. Is done. On the other hand, the outer lead of TAB tape is
Thermo-compression bonding or connection to a printed circuit board such as a liquid crystal display element by anisotropic conductive film, soldering, etc. (Outer Lead
Bonding).

On the other hand, T-BGA tapes are often the same as TAB tapes from inner lead bonding to resin encapsulation. However, instead of outer lead bonding, solder balls are arranged in a matrix, and these solder balls are used. The connection with the printed circuit board is performed via the. For such solder ball connection, a large number of micropores having a diameter of 100 to 800 μmφ are formed in the solder resist layer two-dimensionally and horizontally at a pitch of 0.5 to 2.0 mm. In such a solder ball connection of the T-BGA tape, the wiring pitch is coarser than that of the outer lead bonding, and the IC having a larger number of pins is used.
In recent years, adoption has increased.

The size of an IC called a CSP (Chip Size Package) and the size of a package of a film carrier tape are the same, and the connection method is mainly B
CSPs, which are the same as GAs, have recently been receiving attention as well as BGA tapes. Such a T-BGA tape and CSP can be manufactured by substantially the same process and material as the conventional TAB tape. TAB tape, TB
Both GA tape and CSP have a tape width of 35m
m to 70 mm, and the thickness of the tape is 20 to 125 μm for the resin film, and the thickness of the copper layer is 12 to 35 μm.
μm is often used.

[0009]

As described above, since the main component of the solder resist such as an epoxy resin is mainly a thermosetting resin, after the solder resist is applied, the solder resist is used for mounting electronic parts. It is necessary to cure the solder resist by drying the film carrier tape in a heating furnace or a hot air drying furnace.

However, TAB tape, T-BGA
Tapes, film carrier tapes for mounting electronic components such as CSP, base tapes such as polyimide film, adhesives, copper foil, differences in the coefficient of thermal expansion between materials such as solder resist, adhesives, Due to the thermal shrinkage of the solder resist, a concave warpage occurs on the solder resist side.

That is, in the film carrier tape for mounting electronic parts having the above-described structure, since the characteristics of the materials forming each layer are completely different, the resulting film carrier tape for mounting electronic parts warps. . Such warping deformation is caused by water absorption and expansion of the flexible insulating film,
Curing shrinkage of the adhesive layer, thermal expansion and shrinkage of the conductive metal,
It is considered that the curing shrinkage of the solder resist and the like act in a complex manner. Then, in the width direction of the film carrier tape for mounting electronic components, it is easy to bend and deform so that the side on which the wiring pattern is formed becomes concave. The warp deformation in the tape width direction such that the surface on which such a wiring pattern is formed becomes concave is 1 to the tape width.
It can be as low as 0%.

In recent years, wiring patterns formed on electronic parts have become very fine pitch. In the case of inner leads having the narrowest wiring pattern width, those having a very fine pitch lead width of not more than tens of μm are used. Are also manufactured. In such a fine pitch electronic component mounting film carrier tape, if the warpage of the tape width is as large as 10%, the position of the bump electrode formed on the electronic component to be mounted and the electronic component mounting film carrier are determined. In many cases, the position of the inner lead of the tape does not match, and normal bonding cannot be performed. In addition, as the fine pitch progresses as described above, the thickness of a member that has a function of holding the form of the electronic component mounting film carrier tape such as a flexible insulating film and a conductive metal foil to be used is reduced. As the pitch becomes finer from this aspect, warpage deformation is likely to occur, and the situation is increasing.

In particular, the film carrier tape for mounting electronic parts after the solder resist is dried and cured (cured) in a heating furnace, a hot air drying furnace, or the like, as shown in FIG. The tape 200 is curved upward and warped so that the solder resist processed surface 202 of the tape 200 becomes concave. Such a warp generated in the drying and curing steps of the solder resist cannot be removed in a subsequent plating step, a drying step after a cleaning step, etc., and the warpage tends to increase due to its thermal influence. .

[0014] In the case of a TAB tape, the warped film carrier tape for mounting electronic parts is as follows.
In the outer lead bonding step, the accuracy of the alignment is reduced, the workability is deteriorated, and the bonding performance is affected. Also, T-BG
In the case of the tape for A, in the mounting stage from the inner lead bonding of the IC to the bonding of the stiffener for reinforcement and the like, cutting of the inner lead, cracking of the sealing resin, and the like occur.

As methods for preventing such warpage of the film carrier tape, the following various methods have been conventionally proposed. That is, (1) a method of using a polyimide-based resin in which tape warpage due to heat shrinkage after heat curing is small as a solder resist, and (2) an insulating protective layer so as not to cover a predetermined area instead of the solder resist. A method in which a punched heat-resistant protective film is attached (Japanese Patent Application Laid-Open No. 9-64112). (3) The conductor pattern forming surface is curled in a direction perpendicular to the longitudinal direction and raised (bent so as to expand). And applying a heat to the film carrier tape for a certain period of time to reduce warpage (Japanese Patent Application Laid-Open Nos. 8-451984 and 10-1).
78051 (Japanese Patent No. 2816841). However, the polyimide resin of the above (1) is slightly inferior in adhesion to a conductor surface such as copper to a conventional epoxy resin. like,
Since the polyimide resin and the epoxy resin are selectively used depending on the portion of the film carrier tape, the process is complicated.

In the above method (2), voids are apt to be generated in the adhesive layer, which causes a decrease in reliability. In addition, it is not suitable for TAB tapes, which are becoming narrower in recent years, because of problems such as exudation of adhesives. Furthermore, it cannot be applied to a T-BGA tape that requires micro holes for solder ball bonding. Further, in the method (3), too effectiveness warp due to the curvature, with warp may occur in the opposite direction rather, the film carrier tape
As shown in FIG. 14, the loop may be bent into a mountain shape via the device hole, which causes cutting of the inner lead, cracking of the sealing resin, bonding failure, and the like, which is not preferable.

[0017] An object of the present invention is to provide a solder resist without lowering its adhesion in consideration of the current situation.
It has good applicability to narrow patterns of solder resist layers and fine patterns such as micro holes.In mounting and assembling electronic components such as ICs, there are no problems such as cutting of inner leads and cracking of sealing resin. In addition, even when mounting on a printed circuit board such as a liquid crystal display element, the warping of the film carrier tape for mounting electronic components can be removed so that accurate positioning can be performed without causing misalignment or the like. An object of the present invention is to provide a method for removing warpage of a film carrier tape for mounting components and an apparatus for removing warpage of a film carrier tape for mounting electronic components.

[0018]

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned problems and objects in the prior art, and is intended to provide a method for removing warpage of a film carrier tape for mounting electronic parts according to the present invention. The electronic component mounting film carrier tape, in a heated state, constrained in the direction opposite to the warp in the width direction of the electronic component mounting film carrier tape, after imparting reverse warpage, the electronic component mounting film carrier tape In the feeding direction, the film carrier tape for electronic component mounting is cooled while passing the film carrier tape for electronic component mounting between a plurality of leveler rollers arranged alternately and vertically. It is characterized in that the warpage is removed and the state in which the warp is removed is maintained.

Further, the device for removing warpage of a film carrier tape for mounting an electronic component is characterized in that the film carrier tape for mounting an electronic component of the present invention is restrained in a heated state in a direction opposite to the direction of warping in the width direction of the film carrier tape for mounting an electronic component. do it,
A heating reverse warp applying portion provided with a reverse warp applying restraining member for applying a reverse warp, and a plurality of leveler rollers disposed so as to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting electronic components. The electronic component mounting film carrier tape to which the reverse warpage is applied by the heating reverse warpage applying section between the leveler rollers in a cooled state, so that the warped state is maintained. And a warp removal cooling unit.

With this configuration, after the solder resist is dried and cured (cured) in a heating furnace, a hot air drying furnace, or the like, the solder resist is curved upward so that the processed surface of the solder resist becomes concave. The warpage that has occurred in the electronic component mounting film carrier tape is such that the electronic component mounting film carrier tape is heated in a reverse direction by a reverse warp imparting restricting member, and is upward in a direction opposite to the width direction of the electronic component mounting film carrier tape. It will bend and be constrained. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

Then, the film carrier tape for mounting electronic components passes vertically between the leveler rollers arranged alternately displaced up and down in a cooled state. The flat surfaces are alternately corrected by the peripheral surfaces having the curvature of the facing leveler rollers. Therefore, the electronic component mounting film carrier tape that has passed through these leveler rollers eventually becomes entirely flat.
Then, in this state, the materials such as the solder resist, the adhesive, and the base film are cured, and the flat state is maintained.

Further, the method for removing warpage of a film carrier tape for mounting electronic parts according to the present invention is directed to a method for removing a warpage of a film carrier tape for mounting electronic parts. After passing through the electronic component mounting film carrier tape in a heated state to remove the warpage of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape is inverted in the width direction. It is characterized in that the film carrier tape for mounting electronic components is cooled to maintain a state in which the warpage is removed, while the film carrier tape for mounting electronic components is constrained in the direction to give a reverse warp.

The device for removing warpage of a film carrier tape for mounting an electronic component is provided with a plurality of leveler rollers which are disposed so as to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting an electronic component. Between the leveler rollers, by passing the electronic component mounting film carrier tape in a heated state, thereby removing the warpage of the electronic component mounting film carrier tape; and a heating warp removing unit configured to remove the warpage of the electronic component mounting film carrier tape. The electronic component mounting film carrier tape from which the warp has been removed is provided with a reverse warp imparting restricting member that constrains the electronic component mounting film carrier tape in the width direction of the electronic component mounting film carrier tape in a cooling direction in a direction opposite to the warpage, and imparts reverse warpage. And a cooling reverse warpage imparting section.

[0024] With this configuration, the film carrier tape for mounting electronic parts passes vertically between the leveler rollers that are alternately displaced up and down while being heated. Due to the curved surfaces of the leveler rollers that are alternately facing each other, plastic deformation occurs in the softened state of materials such as solder resist, adhesive, and base film, and is alternately corrected to a flat state become. Therefore, the electronic component mounting film carrier tape that has passed through these leveler rollers is in a flat state as a whole.

The film carrier tape for mounting electronic parts, which is in a flat state as a whole, is as follows.
In the cooled state, the film carrier tape for mounting electronic components is restrained in the width direction by the reverse warp imparting restraint member in the opposite direction to the warpage, and is corrected in a state where the reverse warpage is imparted. Therefore, the warpage generated in the electronic component mounting film carrier tape by the reverse warpage is offset,
In this state, the materials such as the solder resist, the adhesive, and the base film are cured, and a substantially flat state is maintained.

In the method for removing warpage of a film carrier tape for mounting electronic components according to the present invention, the film carrier tape for mounting electronic components is restrained in a heated state in a direction opposite to the warpage in the width direction of the film carrier tape for mounting electronic components. do it,
The film carrier tape for mounting an electronic component in a heated state is provided between a plurality of leveler rollers arranged to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting an electronic component. To remove the warpage of the electronic component mounting film carrier tape, and constraining the electronic component mounting film carrier tape in the width direction of the film carrier tape in the opposite direction to that of the electronic component mounting tape, thereby providing the electronic component mounting. And cooling the film carrier tape to maintain a state in which the warpage is removed.

Further, the device for removing warpage of a film carrier tape for mounting an electronic component restrains the film carrier tape for mounting an electronic component in a heated state in a direction opposite to the warpage in the width direction of the film carrier tape for mounting an electronic component. A heating reverse warp applying portion provided with a reverse warp applying restraining member for applying a reverse warp, and a plurality of leveler rollers disposed so as to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting electronic components. The electronic component mounting film carrier tape to which the warpage of the electronic component mounting is applied in a heated state, between the leveler rollers, by passing the electronic component mounting film carrier tape to which the reverse warpage is applied by the heating reverse warpage applying unit, thereby reducing the warpage of the electronic component mounting film carrier tape. A heating warp removing portion configured to be removed, and an electronic component mounting film carrier tape from which the warpage has been removed by the heating warp removing portion , To restrain the warp direction opposite the cooling conditions in the width direction of the film carrier tape,
And a cooling reverse warpage imparting portion having a reverse warpage imparting restraint member for imparting a reverse warpage.

With this configuration, the warpage generated in the electronic component mounting film carrier tape is caused by the fact that the electronic component mounting film carrier tape is heated by the reverse warp imparting and restraining member. It is bent upward in the direction opposite to the warp in the width direction and is constrained. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

Then, the film carrier tape for mounting electronic components, which is in a state in which reverse warpage has been applied, passes between the leveler rollers arranged alternately and displaced up and down alternately in a heated state. Due to the curved peripheral surfaces of the leveler rollers, which are located alternately above and below the leveler rollers, plastic deformation occurs in a softened state of materials such as solder resist, adhesive, and base film, and alternately to a flat state Will be corrected. Therefore,
The electronic component mounting film carrier tape that has passed through these leveler rollers is entirely flat.

The film carrier tape for mounting electronic components, which is in a flat state as a whole in this way, is cooled by a reverse warp imparting restraining member so that it is warped in the width direction of the film carrier tape for mounting electronic components and in the opposite direction. It will be restrained and will be corrected in a state where reverse warpage has been given.
Therefore, the warpage generated in the film carrier tape for mounting electronic components is offset by the reverse warpage, and in this state, the material such as the solder resist, the adhesive, and the base film is hardened, and is almost flat. The state will be maintained.

In the method for removing warpage of a film carrier tape for mounting electronic components according to the present invention, the film carrier tape for mounting electronic components is restrained in a heated state while being warped in the width direction of the film carrier tape for mounting electronic components. do it,
The film carrier tape for mounting an electronic component in a heated state is provided between a plurality of leveler rollers arranged to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting an electronic component. After removing the warpage of the electronic component mounting film carrier tape, the feeding direction of the electronic component mounting film carrier tape, the plurality of leveler rollers disposed alternately displaced up and down alternately. While passing through the electronic component mounting film carrier tape, the electronic component mounting film carrier tape is cooled to remove the warp and maintain the state where the warp is removed. .

Further, the device for removing warpage of a film carrier tape for mounting an electronic component is configured to restrain the film carrier tape for mounting an electronic component in a heated state while restraining the film carrier tape in the width direction of the film carrier tape in the width direction. And a plurality of leveler rollers disposed alternately and displaced up and down with respect to the feeding direction of the electronic component mounting film carrier tape. And removing the warpage of the electronic component mounting film carrier tape by passing the electronic component mounting film carrier tape to which the reverse warpage has been applied by the heating reverse warpage applying section between the leveler rollers in a heated state. The warp removing unit configured as described above and the feed direction of the film carrier tape for mounting electronic components are alternately displaced up and down. A plurality of leveler rollers disposed in a horizontal direction, and the electronic component mounting film carrier tape from which the warp was removed by the heating warp removing section was passed between the leveler rollers in a cooled state to remove the warp. A warp removal cooling unit configured to maintain a state.

With such a configuration, the warpage of the film carrier tape for mounting the electronic component is caused by the film carrier tape for mounting the electronic component being heated by the reverse warp imparting restraining member in the heated state. It is bent upward in the direction opposite to the warp in the width direction and is constrained. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

Then, the film carrier tape for mounting electronic components, which is in a state in which reverse warpage is applied, passes between the leveler rollers which are alternately displaced up and down in a heated state. Due to the curved peripheral surfaces of the leveler rollers, which are located alternately above and below the leveler rollers, plastic deformation occurs in a softened state of materials such as solder resist, adhesive, and base film, and alternately to a flat state Will be corrected. Therefore,
The electronic component mounting film carrier tape that has passed through these leveler rollers is entirely flat.

The film carrier tape for mounting electronic parts, which is in a flat state as a whole, passes vertically through leveler rollers which are alternately displaced up and down in a cooled state. Due to the peripheral surfaces having the curvature of the leveler rollers facing each other which are located alternately on the upper and lower sides, the flattened state is corrected alternately. Therefore, the electronic component mounting film carrier tape that has passed through these leveler rollers eventually becomes flatter overall. Then, in this state, the materials such as the solder resist, the adhesive, and the base film are in a cured state, and an extremely flat state is maintained.

The method for removing warpage of a film carrier tape for mounting an electronic component according to the present invention is directed to a method of removing a plurality of leveler rollers which are disposed so as to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting an electronic component. In between, passing the electronic component mounting film carrier tape in a heated state, removing the warpage of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape,
After being restrained in the opposite direction to the warp in the width direction of the film carrier tape for mounting electronic components in a heated state and imparting a reverse warp,
The electronic component mounting film carrier tape is constrained in a direction opposite to the warp in the width direction to impart a reverse warp, while cooling the electronic component mounting film carrier tape to maintain a state in which the warp is removed. It is characterized by the following.

Further, the device for removing warpage of a film carrier tape for mounting an electronic component is provided with a plurality of leveler rollers which are disposed so as to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting an electronic component. Between the leveler rollers, by passing the electronic component mounting film carrier tape in a heated state, thereby removing the warpage of the electronic component mounting film carrier tape; and a heating warp removing unit configured to remove the warpage of the electronic component mounting film carrier tape. The electronic component mounting film carrier tape from which the warp has been removed is provided with a reverse warp imparting restricting member that constrains the electronic component mounting film carrier tape in the width direction of the electronic component mounting film carrier tape in a direction opposite to the warp in a heated state, and imparts a reverse warp. The heated reverse warp imparting section and the electronic component mounting film carrier tape to which reverse warpage has been imparted by the heated reverse warp imparting section are cooled. Characterized in that it comprises a cooling inverse warp applying portion having a reverse warp applying restraining member for applying an inverse warp constraining the warp direction opposite to the width direction of the film carrier tape for mounting electronic components in the state.

With such a configuration, the warpage generated in the film carrier tape for mounting electronic components is in a state in which reverse warpage is applied between the leveler rollers disposed alternately and vertically. The electronic component mounting film carrier tape is passed through up and down in a heated state, so that the peripheral surfaces having the curvatures of the leveler rollers facing each other are alternately positioned above and below the leveler rollers, so that a solder resist, an adhesive, and a base film are formed. Plastic deformation occurs when the material is softened, and the material is alternately corrected to a flat state. Therefore, the electronic component mounting film carrier tape that has passed through these leveler rollers is in a flat state as a whole.

The film carrier tape for mounting electronic parts, which is in a flat state as a whole, is as follows.
In the heated state, the film carrier tape for mounting electronic components is curved upward and in the opposite direction to the warp in the width direction of the film carrier tape for mounting electronic components and is restrained by the reverse warp imparting and restraining member. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

The electronic component mounting film carrier tape in the state in which the reverse warpage has been applied as described above is reversely warped in the width direction of the electronic component mounting film carrier tape in the cooled state by the reverse warp application restricting member. It is constrained in the direction and is corrected in a state where the reverse warpage is given.
Therefore, the warpage generated in the film carrier tape for mounting electronic components is offset by the reverse warpage, and in this state, the material such as the solder resist, the adhesive, and the base film is hardened, and is almost flat. The state will be maintained.

Further, the method of removing warpage of a film carrier tape for mounting electronic components according to the present invention is directed to a method of removing a plurality of leveler rollers which are disposed so as to be alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting electronic components. In between, passing the electronic component mounting film carrier tape in a heated state, removing the warpage of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape,
After being restrained in the opposite direction to the warp in the width direction of the film carrier tape for mounting electronic components in a heated state and imparting a reverse warp,
In the feeding direction of the electronic component mounting film carrier tape, between a plurality of leveler rollers arranged alternately displaced up and down, while passing the electronic component mounting film carrier tape, the electronic component mounting It is characterized in that the film carrier tape is cooled to remove the warp and to maintain the state where the warp has been removed.

The device for removing warpage of a film carrier tape for mounting an electronic component is provided with a plurality of leveler rollers which are alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting an electronic component. Between the leveler rollers, by passing the electronic component mounting film carrier tape in a heated state, thereby removing the warpage of the electronic component mounting film carrier tape; and a heating warp removing unit configured to remove the warpage of the electronic component mounting film carrier tape. The electronic component mounting film carrier tape from which the warp was removed was provided with a reverse warp imparting restraint member for imparting a reverse warp by constraining the electronic component mounting film carrier tape in the width direction of the electronic component mounting film carrier tape in a heating direction in the opposite direction. The heating reverse warpage imparting section and the electronic component mounting film carrier tape are arranged so as to be alternately displaced up and down with respect to the feeding direction. A plurality of leveler rollers, and a film carrier tape for mounting electronic components to which a reverse warp has been applied by the heating reverse warp applying section, in a cooled state, between the leveler rollers, thereby removing the warp. And a warp removal cooling unit configured to hold

With this configuration, the warpage generated in the film carrier tape for mounting electronic components is in a state in which reverse warpage is applied between the leveler rollers disposed alternately up and down. The electronic component mounting film carrier tape is passed through up and down in a heated state, so that the peripheral surfaces having the curvatures of the leveler rollers facing each other are alternately positioned above and below the leveler rollers, so that a solder resist, an adhesive, and a base film are formed. Plastic deformation occurs when the material is softened, and the material is alternately corrected to a flat state. Therefore, the electronic component mounting film carrier tape that has passed through these leveler rollers is in a flat state as a whole.

The film carrier tape for mounting electronic parts, which is in a flat state as a whole, is as follows.
In the heated state, the film carrier tape for mounting electronic components is curved upward and in the opposite direction to the warp in the width direction of the film carrier tape for mounting electronic components and is restrained by the reverse warp imparting and restraining member. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

The film carrier tape for mounting electronic components in the state in which the reverse warpage has been imparted as described above, passes vertically between the leveler rollers that are alternately displaced up and down in a cooled state. As a result, the leveler rollers are alternately corrected into a flatter state by the peripheral surfaces having the curvatures of the leveler rollers facing each other which are alternately positioned vertically. Therefore, the electronic component mounting film carrier tape that has passed through these leveler rollers eventually becomes flatter overall. And in this state, solder resist, adhesive,
The material such as the base film is in a cured state, and an extremely flat state is maintained.

[0046]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings. FIG. 1 is an overall schematic view of a first embodiment of a device for removing warpage of a film carrier tape for mounting electronic components according to the present invention, and FIG. 2 is a diagram showing heating of the device for removing warpage of a film carrier tape for mounting electronic components of FIG. FIG. 3 is a cross-sectional view schematically illustrating a main part of the reverse warp imparting unit. FIG. 3 is a top view of a warp removing cooling unit of the warp removing device of the electronic component mounting film carrier tape of FIG.
Is a side view in the direction A in FIG. 3, and FIG. 5 is a cross-sectional view taken along line BB in FIG.

As shown in FIG. 1, reference numeral 10 denotes a warp removing device (hereinafter, simply referred to as a "warp removing device") of the film carrier tape for mounting electronic components of the present invention. As shown in FIG. 1, the warp removing device 10 includes a sending-out unit 12, a heating reverse warpage applying unit 14, a warp removing cooling unit 16, and a winding unit 18. Delivery unit 1
2 is a film carrier tape for mounting electronic components such as CSP and BGA, for example, a base tape in which an adhesive layer is applied to a film such as a polyimide film, and a solder resist as a circuit pattern and a protective insulating layer. A reel R on which a film carrier tape T for mounting electronic components provided with a layer is wound via a spacer S
Are mounted on the delivery drive shaft 20.

Then, by driving a drive motor (not shown), the feed drive shaft 20 rotates, and the film carrier tape T for mounting electronic components is fed out from the reel R together with the spacer S, and is heated via the guide roller 22. It is supplied to the reverse warpage imparting section 14. As shown in FIG. 1, the heating reverse warpage imparting section 14 includes a heating reverse warpage imparting chamber 13, and inside the heating reverse warpage imparting chamber 13, in the transport direction of the electronic component mounting film carrier tape T. Along the way, a reverse warp imparting restraint member 11 is arranged.

As shown in FIG. 2, the reverse warp imparting restraining member 11 is provided with inner side walls 13 on both sides of the heating reverse warp imparting chamber 13.
a, a pair of rails 15 extending in the direction of transport of the film carrier tape T for mounting electronic components. These rails 15 are formed with guide grooves 17 that are inclined upward and guide the ends T ′ in the width direction of the film carrier tape T for mounting electronic components.

The distance between the guide grooves 17 is set so as to be smaller than the width of the film carrier tape T for mounting electronic components, and as a result, as shown in FIG. The inserted electronic component mounting film carrier tape T is guided to be curved upward. Although not shown, the heating reverse warpage imparting chamber 13 is connected to a heat source such as hot air so that the inside of the heating reverse warpage imparting chamber 13 can be heated to a constant temperature. The method of heating the inside of the heating reverse warp imparting chamber 13 is not limited, and various methods such as an electric furnace, a hot blast furnace, and an infrared heating furnace can be adopted.

With this configuration, after the solder resist is dried and cured (cured) in a heating furnace, a hot air drying furnace, or the like, the solder resist is bent upward so that the processed surface of the solder resist becomes concave. The warpage generated in the film carrier tape T for mounting electronic components is caused by the fact that the film carrier tape T for mounting electronic components is heated by the guide grooves 17 of the reverse warp imparting and restraining member 11 as shown in FIG. The film carrier tape for mounting T is curved upward in the direction opposite to the warp in the width direction, that is, in a state in which the surface on which the wiring pattern of the film carrier tape T for mounting electronic components is formed is upwardly curved. You will be bound.

Therefore, plastic deformation occurs in a softened state of the material such as the solder resist, the adhesive, and the base film, so that the film carrier tape for mounting electronic components is warped in the width direction and in the opposite direction. State. In this case, the degree to which the film carrier tape T for mounting electronic components is bent by the reverse warp restraining member 11 depends on the thickness, width, material such as solder resist of the film carrier tape T for mounting electronic components. As shown in FIG. 2, the warp distance Z at the center of the film carrier tape T for mounting electronic components is 2 to 15 mm, preferably 5 to 15 mm.
It is desirable to set the ratio to 10 mm and 10 to 20% of the width of the film carrier tape T for mounting electronic components.

The temperature in the heating and reverse warpage applying chamber 13 depends on the kind of the material such as the solder resist, the adhesive, and the base film, but at least the solder resist must be softened. When the temperature of the surface of the component mounting film carrier tape T is, for example, 80 to 300 ° C. when the solder resist is epoxy-based,
Preferably, the temperature is set to 150 to 200 ° C.

The time required for the electronic component mounting film carrier tape T to pass through the heating reverse warp imparting chamber 13 depends on the thickness, width and material of the electronic component mounting film carrier tape T. In order to impart the warp removing effect, the feed speed is 1 to 5 m / min, the time of 30 to 150 seconds, and particularly, the time of passing through the reverse warp restraining member 11 is 30 minutes.
It is desirable to set it to 60 seconds.

As described above, the electronic component mounting film carrier tape T in a state in which the reverse warpage has been imparted subsequently passes through the warp removal cooling unit 16 so that the electronic component mounting film carrier tape T is formed. Upon cooling, the materials such as the solder resist, the adhesive, and the base film are in a hardened state, and are kept flat.

The warp removing cooling section 16 has a cooling warp removing chamber 24, and a cooling warp removing leveler unit 26 is disposed inside the cooling warp removing chamber 24. The cooling / warping removal leveler unit 26 is shown in FIGS.
As shown in FIG. 5, between the pair of side plates 30 fixed by the support rod member 28, the introduction roller 32, the plurality of leveler rollers 34 to 40, and the discharge roller 42 are mounted via the rotation support shaft 44, respectively. ing. The introduction roller 32, the leveler rollers 34 to 40, and the output roller 42 are rotatably mounted on a rotation support shaft 44 via a bearing 41.

Steps 45 for guiding the film carrier tape T for mounting electronic components are formed on the introduction roller 32, the leveler rollers 34 to 40, and the lead-out roller 42, respectively. Also, on the side plate 30,
Engaging flanges 46 are protrudingly provided at four places, and these flanges 46 are detachably engaged with flanges 50 formed on the inner wall 48 of the cooling warp removing chamber 24, whereby a cooling warp removing leveler unit is provided. 26 can be removed from the cooling warp removal chamber 24.

In the cooling warp removing leveler unit 26, as shown in FIG. 4, the electronic component mounting film carrier tape T supplied to the cooling warp removing chamber 24 is dashed and dotted inside the cooling warp removing chamber 24. As shown in the drawing, it is introduced into the introduction roller 32, and the leveler rollers 34 to
Numerals 40 are alternately arranged in the vertical direction.

Then, as shown by a dashed line D in FIG.
The electronic component mounting film carrier tape T introduced into the introduction roller 32 is wound so as to pass between the outer peripheral surfaces 34a to 40a located outside the leveler rollers 34 to 40, respectively. The cooling warp removal chamber 24
Although not shown, air may be blown into the cooling warp removal chamber 24 to perform forced cooling, or may be naturally cooled.

With this configuration, the film carrier tape T for mounting electronic components to which the reverse warp is applied by passing through the heating reverse warp applying section 14 is alternately displaced up and down. Leveler roller 3
It passes between 4 and 40 in the cooled state up and down. Thereby, the outer peripheral surface 3 having the curvature of the leveler rollers 34 to 40 which are located alternately in the upper and lower directions and which face each other.
By 4a-40a, it will be alternately corrected to a flat state. Therefore, these leveler rollers 34
The electronic component mounting film carrier tape that has passed through 40 finally becomes entirely flat. In this state, the electronic component mounting film carrier tape T
Is cooled, the material such as the solder resist, the adhesive, and the base film is in a cured state, and a flat state is maintained.

In this case, in order to impart the above-described warp removing effect, depending on the thickness, width and material of the film carrier tape T for mounting electronic components, as shown in FIG. The curvature radius R is 10 to 50 mm, preferably 15 to 30 mm, and the amount of vertical displacement of the leveler rollers 34 to 40 with respect to the feeding direction C of the film carrier tape T for mounting electronic components, that is, the pushing amount X is , 0-100 mm, preferably 10-30 m
m, the distance Y between the leveler rollers 34 to 40 is 3
It is desirably set to 0 to 100 mm, preferably 50 to 80 mm.

Although not shown, a groove is provided in the side plate 30 so that the distance between the leveler rollers 34 to 40 and the amount of vertical displacement can be freely adjusted. The rotation support shaft 44 may be moved in position. The temperature in the cooling and warp removal chamber 24 depends on the type of material such as a solder resist, an adhesive, and a base film, but at least the solder resist is cured to fix the warped state. For example, when the temperature of the surface of the electronic component mounting film carrier tape T is, for example, 80 to 300 ° C., preferably 150 to 20 ° C. when the solder resist is epoxy-based,
It is desirable that the temperature be 0 ° C.

In this case, although not shown, the introduction roller 32, the leveler rollers 34 to 40, and the discharge roller 42 themselves are used as cooling rollers connected to a refrigerant, and the surface of the film carrier tape T for mounting electronic components is used. You may make it cool directly. The time required for the electronic component mounting film carrier tape T to pass through the cooling warp removal chamber 24 depends on the thickness, width, and material of the electronic component mounting film carrier tape T. To apply, feed speed of 1-5m / min,
It is desirable that the time of 30 to 120 seconds, particularly the time of passing through the cooling warp removing leveler unit 26 be 30 to 60 seconds.

The number of leveler rollers 34 to 40 is also
Depending on the type of material such as solder resist, adhesive, base film, etc., at least two at the top and bottom,
A value of 5 to 20 is desirable in order to prevent the electronic component mounting film carrier tape T from being damaged and to maintain a certain strength. As described above, the film carrier tape T for mounting electronic components, which has been corrected to be a flat state as a whole by passing through the cooling warp removing leveler unit 26 in the cooling warp removing chamber 24, is guided by the guide rollers 58. And is supplied to the next winding unit 18.

As shown in FIG. 1, the film carrier tape T for mounting electronic components supplied to the winding section 18 is
The film carrier tape T for mounting electronic components is wound on the reel R mounted on the winding drive shaft 56 by the drive of a drive motor (not shown) via the guide roller 58. At this time, the spacer S fed from the reel R of the sending section 12 is
It is supplied to the reel R of the winding unit 18 via the guide rollers 59 and 60 and the dancer roller (step roller) 62, is interposed between the electronic component mounting film carrier tapes T, and is mounted on the electronic component mounting film carrier tape. They are designed to protect them from contact and damage.

The warp removing apparatus 1 of the present invention having such a configuration
According to No. 0, the applicability to the narrow pattern of the solder resist layer and the fine pattern such as the fine hole are good without lowering the adhesiveness of the solder resist, and the inner lead is used for mounting and assembling electronic components such as ICs. It does not cause any trouble such as cutting of the sealing resin or cracking of the sealing resin, and can perform accurate positioning without causing a positioning defect or the like even when mounted on a printed circuit board such as a liquid crystal display element.

In the above embodiment, as shown in FIG. 6, the electronic component mounting film carrier tape T is passed between the outer peripheral surfaces 34a to 40a located outside the leveler rollers 34 to 40, respectively. Was wound around
When the warpage of the electronic component mounting film carrier tape T is small, as shown in FIG. 6, the electronic component mounting film carrier tape T is transferred to the inner peripheral surfaces 34b to 34h located inside the leveler rollers 34 to 40, respectively. It is also possible to wind so as to pass between 40b.

FIG. 7 is a schematic structural view similar to FIG. 1 showing a second embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention. The first embodiment described above,
Basically, the configuration is the same.
The same reference numerals to which 0 has been added are assigned, and description thereof is omitted.
In the warp removing device 110 of this embodiment, a heating warp removing unit 11 is used instead of the reverse warp imparting unit 14 of the first embodiment.
4 are provided.

The heating warp removing section 114 is provided with a heating warp removing chamber 113.
The heating / warping removal leveler unit 126 is disposed inside the unit 13. Heat warpage removal leveler unit 126
Has a configuration similar to that of the cooling warpage removal leveler unit 26 of the first embodiment. Further, in the warp removing device 110 of this embodiment, a cooling reverse warpage imparting unit 116 is provided instead of the warp removing cooling unit 16 of the first embodiment.

In the cooling reverse warpage providing section 116, a cooling warp removing chamber 124 and a reverse warp providing restraint member 111 are arranged. The reverse warp imparting restricting member 111 has the same configuration as the reverse warp imparting restricting member 11 of the first embodiment. With this configuration, after the solder resist is dried and cured in a heating furnace, a hot air drying furnace, or the like, an electronic component generated by curving upward so that the processed surface of the solder resist becomes concave. The warpage generated in the mounting film carrier tape T passes vertically between the leveler rollers 134 to 140 which are alternately displaced up and down in the heated state.

Thus, the leveler rollers 134-1
Due to the outer peripheral surfaces 134a to 140a having the curvature of the leveler rollers facing each other which are alternately located in the upper and lower positions of 40,
Plastic deformation occurs when the material such as the solder resist, the adhesive, and the base film is softened, and is alternately corrected to a flat state. Therefore, the film carrier tape for mounting electronic components, which has passed through these leveler rollers 134 to 140, eventually becomes entirely flat.

In this case, in order to impart the above-mentioned warpage removing effect, as shown in FIG. 5, the leveler rollers 134 to 140 depend on the thickness, width and material of the film carrier tape T for mounting electronic components. Radius of curvature R of 10 mm to 50 mm
mm, preferably 15 mm to 30 mm, the amount of vertical displacement of the leveler rollers 134 to 140 with respect to the feeding direction C of the film carrier tape T for mounting electronic components,
That is, the pushing amount X is 0 mm to 100 mm, preferably 10 mm to 30 mm, and the leveler rollers 134 to 14.
It is desirable to set the separation distance Y between 0 and 30 mm to 100 mm, preferably 50 to 80 mm.

The temperature in the heating and warping removal chamber 124 depends on the type of material such as a solder resist, an adhesive, and a base film. However, at least the solder resist must be softened. When the temperature of the surface of the mounting film carrier tape T is, for example, an epoxy-based solder resist,
Preferably, the temperature is set to 150 to 200 ° C.

The time required for the electronic component mounting film carrier tape T to pass through the heating / warping removal chamber 124 depends on the thickness, width and material of the electronic component mounting film carrier tape T. In order to provide the removal effect, it is desirable that the feeding speed is 1 to 5 m / min, the time of 30 to 100 seconds, and particularly the time of passing through the heating warp removal leveler unit 126 is 30 to 60 seconds.

The number of the leveler rollers 34 to 40 is also
Depending on the type of material such as solder resist, adhesive, base film, etc., at least two at the top and bottom,
It is desirable to use 5 to 20 pieces in order to prevent the film carrier tape T for mounting electronic components from being damaged and to maintain a certain strength. In this case, although not shown, these introduction rollers 132, leveler rollers 134 to 140,
In addition, the surface of the electronic component mounting film carrier tape T may be directly heated by using the discharge roller 142 itself as a heating roller.

Then, the film carrier tape T for mounting electronic components, which is in a flat state as described above,
Is passed through the reverse warp imparting restricting member 111 of the cooling reverse warpage imparting portion 116 in a cooled state, thereby being constrained in the width direction of the electronic component mounting film carrier tape T in a direction opposite to the warp direction, and the reverse warpage is imparted. It will be corrected in the state that it was. Therefore, the warpage generated in the electronic component mounting film carrier tape by the reverse warpage is offset,
In this state, the materials such as the solder resist, the adhesive, and the base film are cured, and a substantially flat state is maintained.

In this case, the degree to which the film carrier tape T for mounting an electronic component is curved by the reverse warp restraining member 111 depends on the thickness, width, material such as a solder resist of the film carrier tape T for mounting an electronic component. However, as in the case of FIG. 2, the warp distance Z at the central portion of the film carrier tape T for mounting electronic components is 2-15.
mm, preferably 5 to 10 mm, and 10 to 20 with respect to the width of the film carrier tape T for mounting electronic components.
% Is desirable.

The temperature inside the cooling and warping removing chamber 124 is as follows.
Depending on the type of material such as solder resist, adhesive, base film, etc., at least to cure the solder resist and fix the warped state,
The temperature of the surface of the electronic component mounting film carrier tape T is desirably 80 to 300 ° C., preferably 100 to 200 ° C., for example, when the solder resist is epoxy-based.

The time required for the electronic component mounting film carrier tape T to pass through the cooling / warping removing chamber 124 depends on the thickness of the electronic component mounting film carrier tape T,
Although it depends on the width and the material, in order to provide the above-described warpage removing effect, the feeding speed is 1 to 5 m / min, the time for 30 to 120 seconds, and especially the time for passing through the reverse warp restraining member 111 is 30 minutes.
It is desirable to set it to 60 seconds.

The apparatus for removing warpage of the film carrier tape for mounting electronic components and the method for removing the warpage of the film carrier tape for mounting electronic parts according to the present invention have been described with reference to the first and second embodiments. In the invention, as shown in Table 1 below, it is also possible to combine the first embodiment and the second embodiment. The combination will be described below. The conditions such as the detailed temperature in the following embodiments can be appropriately changed based on the first and second embodiments, and the detailed description thereof will be omitted.

[0081]

[Table 1]

FIG. 8 is a schematic structural view similar to FIG. 1 showing a third embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention. The first embodiment described above,
Basically, the configuration is the same.
The same reference numerals to which 0 has been added are assigned, and description thereof is omitted.
In the warp removing device 110 of this embodiment, as shown in Table 1 above, the electronic component mounting film carrier tape T is warped in the heating chamber 102 in the width direction of the electronic component mounting film carrier tape T in a heated state. And in the opposite direction,
A heating reverse warp imparting section 114 having a reverse warp imparting restraining member 111 for imparting a reverse warp is provided.

Further, in the heating chamber 102, there is provided a heating warp removing leveler unit 126 comprising a plurality of leveler rollers disposed alternately and vertically displaced with respect to the feeding direction of the film carrier tape T for mounting electronic components. The warp of the electronic component mounting film carrier tape T is removed by passing the electronic component mounting film carrier tape T, which has been provided with the reverse warp by the heating reverse warp applying portion, between the leveler rollers in a heated state. And a heating warp removing unit 114 ′ configured to perform heating.

Further, the warp removing device 110 of this embodiment
Then, the electronic component mounting film carrier tape T from which the warp has been removed by the heat warp removing portion 114 ′ is constrained in the cooling direction in the width direction of the electronic component mounting film carrier tape T in a direction opposite to the warp, and the reverse warp is generated. Is provided with a cooling reverse warpage imparting portion 116 provided with a reverse warpage imparting restraining member 111 ′ that imparts the following.

With this configuration, the warpage of the film carrier tape T for mounting an electronic component can be prevented by the film carrier tape T for mounting an electronic component being heated by the reverse warp imparting restricting member 111 in a heated state. The carrier tape T is bent upward in the direction opposite to the warp in the width direction of the carrier tape T and is restrained. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

[0086] The leveling unit 1 for removing warpage of heating, comprising leveler rollers arranged alternately vertically.
26, the film carrier tape for mounting electronic components in a state in which a reverse warp is applied passes upward and downward in a heated state, so that the leveler rollers which are alternately located above and below the leveler rollers are opposed to each other. Solder resist, adhesive,
Plastic deformation occurs when the material such as the base film is softened, and the material is alternately corrected to a flat state. Therefore, the electronic component mounting film carrier tape T that has passed through these leveler rollers is entirely flat.

The electronic component mounting film carrier tape which has become flat as a whole in this way is reversely warped in the width direction of the electronic component mounting film carrier tape by the reverse warp imparting restraining member 111 ′ in a cooled state. It is constrained in the direction and is corrected in a state where the reverse warpage is given. Therefore, the warpage generated in the electronic component mounting film carrier tape by the reverse warpage is offset,
In this state, the materials such as the solder resist, the adhesive, and the base film are cured, and a substantially flat state is maintained.

FIG. 9 is a schematic structural view similar to FIG. 1 showing a fourth embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention. The first embodiment described above,
Basically, the configuration is the same.
The same reference numerals to which 0 has been added are assigned, and description thereof is omitted.
In the warp removing device 110 of this embodiment, as shown in Table 1 above, the electronic component mounting film carrier tape T is warped in the heating chamber 102 in the width direction of the electronic component mounting film carrier tape T in a heated state. And in the opposite direction,
A heating reverse warp imparting section 114 having a reverse warp imparting restraining member 111 for imparting a reverse warp is provided.

Further, in the heating chamber 102, there is provided a heating warp removing leveler unit 126 composed of a plurality of leveler rollers disposed alternately up and down with respect to the feeding direction of the film carrier tape T for mounting electronic components. The warp of the electronic component mounting film carrier tape T is removed by passing the electronic component mounting film carrier tape T, which has been provided with the reverse warp by the heating reverse warp applying portion, between the leveler rollers in a heated state. And a heating warp removing unit 114 ′ configured to perform heating.

Further, the warp removing device 110 of this embodiment
Then, a cooling warp removing leveler unit 1 including a plurality of leveler rollers disposed alternately and vertically displaced with respect to a feeding direction of the film carrier tape T for mounting electronic components.
26 ′, the film carrier tape T for mounting electronic components, from which the warpage has been removed by the heating warp removing unit 114 ′, is passed between the leveler rollers in a cooled state, so that the warped state is maintained. It has a configured warp removal cooling unit 116.

With this configuration, the warpage of the electronic component mounting film carrier tape T is prevented by the electronic component mounting film carrier tape T when the electronic component mounting film carrier tape T is heated. The carrier tape T is bent upward in the direction opposite to the warp in the width direction of the carrier tape T and is restrained. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

Then, the leveling unit 1 for removing the warped heating, which is made up of leveling rollers alternately displaced up and down.
26, the film carrier tape for mounting electronic components in a state in which a reverse warp is applied passes upward and downward in a heated state, so that the leveler rollers which are alternately located above and below the leveler rollers are opposed to each other. Solder resist, adhesive,
Plastic deformation occurs when the material such as the base film is softened, and the material is alternately corrected to a flat state. Therefore, the electronic component mounting film carrier tape T that has passed through these leveler rollers is entirely flat.

The film carrier tape T for mounting electronic components, which is in a flat state as a whole as described above, is placed between the leveler rollers of the cooling warp removing leveler unit 126 'composed of leveler rollers arranged alternately up and down. Is cooled in the up and down direction, whereby the leveler roller is alternately corrected to a flatter state by the peripheral surfaces having the curvature of the leveler roller facing each other which are located alternately in the upper and lower directions. Therefore, the electronic component mounting film carrier tape that has passed through these leveler rollers eventually becomes flatter overall. Then, in this state, the materials such as the solder resist, the adhesive, and the base film are in a cured state, and an extremely flat state is maintained.

FIG. 10 is a schematic structural view similar to FIG. 1 showing a fifth embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention. The configuration is basically the same as that of the first embodiment, and the same constituent members include:
The same reference numerals as those obtained by adding 100 are assigned, and the description thereof is omitted. In the warp removing apparatus 110 of this embodiment, as shown in Table 1, the heating chamber 102 is disposed so as to be alternately displaced up and down with respect to the feeding direction of the film carrier tape T for mounting electronic components. Eliminating the warpage of the electronic component mounting film carrier tape T by providing a heating and warping removing leveler unit 126 composed of a plurality of leveler rollers and passing the electronic component mounting film carrier tape T between the leveler rollers in a heated state. And a heating warp removing unit 114 configured to perform the heating and warping.

In the heating chamber 102, the electronic component mounting film carrier tape T whose warpage has been removed by the heating warp removing section 114 is placed in a heated state opposite to the width of the electronic component mounting film carrier tape T in the width direction. A heating reverse warp imparting section 114 ′ having a reverse warp imparting restricting member 111 for imparting a reverse warp in a direction is provided. Further, in the warp removing device 110 of this embodiment, the heating reverse warp removing unit 11 is used.
The electronic component mounting film carrier tape T to which reverse warpage is applied in 4 'is restrained in the width direction of the electronic component mounting film carrier tape T in the width direction of the electronic component mounting film carrier T in a cooled state, and reverse warpage is applied. The cooling reverse warpage imparting section 116 having the imparting constraint member 111 'is provided.

With this configuration, the warpage generated in the film carrier tape T for mounting electronic components causes the leveling rollers between the leveling rollers 126 of the leveling unit 126, which is composed of leveling rollers alternately displaced up and down. When the electronic component mounting film carrier tape T in a state in which reverse warpage is applied passes upward and downward in a heated state, the peripheral carrier having the curvature of the leveler rollers opposite to each other, which is positioned alternately above and below the leveler rollers. Depending on the surface, plastic deformation occurs in a state where materials such as a solder resist, an adhesive, and a base film are softened, and are alternately corrected to a flat state. Therefore, the electronic component mounting film carrier tape T that has passed through these leveler rollers is entirely flat.

Then, the film carrier tape T for mounting electronic parts, which is in a flat state as a whole as described above, is obtained.
In the heating state, the warp is restrained by the reverse warp imparting restraining member 111 by bending upward in the direction opposite to the warp in the width direction of the film carrier tape T for mounting electronic components. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

The electronic component mounting film carrier tape T in the state in which the reverse warpage has been applied as described above is cooled by the reverse warp application restricting member 111 ′ in the width direction of the electronic component mounting film carrier tape T. In the direction opposite to the warpage, and is corrected in a state where the reverse warpage is given. Therefore, the warpage generated in the electronic component mounting film carrier tape is offset by the reverse warpage, and in this state, the solder resist, the adhesive,
The material such as the base film is in a cured state, and a substantially flat state is maintained.

FIG. 11 is a schematic diagram similar to FIG. 1 showing a sixth embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention. The configuration is basically the same as that of the first embodiment, and the same constituent members include:
The same reference numerals as those obtained by adding 100 are assigned, and the description thereof is omitted. In the warp removing apparatus 110 of this embodiment, as shown in Table 1, the heating chamber 102 is disposed so as to be alternately displaced up and down with respect to the feeding direction of the film carrier tape T for mounting electronic components. Eliminating the warpage of the electronic component mounting film carrier tape T by providing a heating and warping removing leveler unit 126 including a plurality of leveler rollers and passing the electronic component mounting film carrier tape T between the leveler rollers in a heated state. And a heating warp removing unit 114 configured to perform the heating and warping.

In the heating chamber 102, the electronic component mounting film carrier tape T whose warpage has been removed by the heating warp removing section 114 is heated in a state opposite to the width of the electronic component mounting film carrier tape T in the width direction. A heating reverse warp imparting section 114 ′ having a reverse warp imparting restricting member 111 for imparting a reverse warp in a direction is provided. Further, in the warp removing device 110 of this embodiment, the cooling warp removing leveler unit 126 composed of a plurality of leveler rollers disposed alternately up and down with respect to the feeding direction of the film carrier tape T for mounting electronic components. The electronic component mounting film carrier tape T provided with the reverse warp by the heating reverse warp applying section 114 ′ is provided between the leveler rollers, and is kept in a state where the warp is removed by passing the electronic component mounting film carrier tape T in a cooled state. The cooling unit 116 includes a warp removal cooling unit 116 configured to perform the above-described operation.

With this configuration, the warpage generated in the film carrier tape T for mounting electronic components causes the leveling between the leveler rollers of the heating warp removing leveler unit 126 including the leveler rollers that are alternately displaced up and down. When the electronic component mounting film carrier tape T in a state in which reverse warpage is applied passes upward and downward in a heated state, the peripheral carrier having the curvature of the leveler rollers opposite to each other, which is positioned alternately above and below the leveler rollers. Depending on the surface, plastic deformation occurs in a state where materials such as a solder resist, an adhesive, and a base film are softened, and are alternately corrected to a flat state. Therefore, the electronic component mounting film carrier tape T that has passed through these leveler rollers is entirely flat.

Then, the film carrier tape T for mounting electronic components, which is in a flat state as described above,
In the heating state, the warp is restrained by the reverse warp imparting restraining member 111 by bending upward in the direction opposite to the warp in the width direction of the film carrier tape T for mounting electronic components. Accordingly, plastic deformation occurs in a state in which the materials such as the solder resist, the adhesive, and the base film are softened, and a state in which a warp is applied in a direction opposite to the warp in the width direction of the film carrier tape for mounting electronic components is provided. .

The film carrier tape T for mounting electronic components in the state in which the reverse warp has been applied as described above is a leveler of the cooling warp removing leveler unit 126 ′ including leveler rollers disposed alternately vertically. By passing between the rollers up and down in a cooled state, the leveler rollers are alternately corrected to a flatter state by the peripheral surfaces having the curvatures of the leveler rollers facing each other which are located alternately in the upper and lower directions. . Therefore, the electronic component mounting film carrier tape T that has passed through these leveler rollers eventually becomes flatter overall. Then, in this state, the materials such as the solder resist, the adhesive, and the base film are in a cured state, and an extremely flat state is maintained.

By the above, the common leveler unit 26, the reverse warp imparting restricting member 11
Can be used interchangeably, so that its versatility is improved. In the above embodiment, the reverse warp imparting restraining member 11 is connected to the pair of rails 1 having the guide grooves 17.
5, the present invention is not limited to this. For example, instead of this, as shown in FIG. 12, a barrel shape is formed so that the diameter gradually increases toward the central portion. It is also possible to provide the reverse warpage imparting and restraining member 11 in which a plurality of rollers are arranged.

The preferred embodiments of the present invention have been described above. However, the present invention is not limited to these embodiments. For example, in the present invention, the leveler rollers 34 to 40 are alternately arranged one by one up and down. The present invention is applied to a vertical type in which the film carrier tape T for mounting electronic components is transported in a vertical direction. Various changes can be made without departing from the purpose of the invention.

[0106]

According to the present invention, a leveler unit composed of leveler rollers alternately displaced up and down and a film carrier tape for mounting electronic components are restrained in a direction opposite to a warp in a width direction, thereby causing a reverse warp. In the heating step and the cooling step, various combinations of the reverse warp imparting and restraining members for imparting the resin are used. After the solder resist is dried and cured (cured) in a heating furnace or a hot air drying furnace, the solder resist processing is performed. The warpage of the film carrier tape for mounting electronic components, which is curved upward so that the surface becomes concave, is corrected by the leveler unit and the reverse warpage imparting restraining member, and the solder resist, the adhesive, and the base are removed. The material such as the material film is in a cured state, and a flat state is maintained.

Therefore, according to the present invention, the applicability of the solder resist layer to narrow patterns and fine patterns such as micro holes is excellent without deteriorating the adhesiveness of the solder resist. Precise positioning that does not cause problems such as cutting of the inner leads and cracking of the sealing resin during mounting and assembly, and also does not cause poor positioning or the like when mounting on a printed circuit board such as a liquid crystal display element This is an extremely excellent invention that has many effects, such as the ability to work.

[Brief description of the drawings]

FIG. 1 is an overall schematic view of a first embodiment of a device for removing warpage of a film carrier tape for mounting electronic components according to the present invention.

FIG. 2 is a cross-sectional view schematically illustrating a main part of a heating reverse warpage imparting portion of the device for removing warpage of a film carrier tape for mounting electronic components of FIG. 1;

FIG. 3 is a top view of a warp removal cooling unit of the device for removing warpage of the film carrier tape for mounting electronic components of FIG. 1;

FIG. 4 is a side view in the direction A of FIG. 3;

FIG. 5 is a sectional view taken along line BB in FIG. 3;

FIG. 6 is a schematic view for explaining another embodiment of the arrangement of the rollers of the leveler unit for removing the warpage of the film carrier tape for mounting electronic components according to the present invention.

FIG. 7 is a schematic configuration diagram similar to FIG. 1 showing a second embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention.

FIG. 8 is a schematic configuration diagram similar to FIG. 1, showing a third embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention.

FIG. 9 is a schematic configuration diagram similar to FIG. 1 showing a fourth embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention.

FIG. 10 is a schematic configuration diagram similar to FIG. 1, showing a fifth embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention.

FIG. 11 is a schematic configuration diagram similar to FIG. 1, showing a sixth embodiment of the device for removing warpage of a film carrier tape for mounting electronic components according to the present invention.

FIG. 12 is a schematic view showing another embodiment of the reverse warp imparting restraining member of the device for removing warpage of the film carrier tape for mounting electronic components of the present invention.

FIG. 13 is a sectional view showing a warped state of the electronic component mounting film carrier tape.

FIG. 14 is a cross-sectional view showing a warped state of a film carrier tape for mounting electronic components by a conventional warping method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Warp removal apparatus 11 Reverse warp provision restraining member 12 Sending part 13a Inner side wall 13 Heat reverse warp provision room 14 Heat reverse warp provision part 15 Rail 16 Warp removal cooling part 17 Guide groove 18 Winding part 20 Drive shaft 22 Guide roller 24 Cooling Warp removal chamber 26 Cooling warp removal leveler unit 28 Support rod member 30 Side plate 32 Introducing roller 34-40 Leveler roller 34a-40a Outer peripheral surface 34b-40b Inner peripheral surface 41 Bearing 42 Outgoing roller 44 Rotary support shaft 45 Step 46 Engagement flange 48 inner wall 50 flange 54 guide roller 56 drive shaft 58 guide roller 62 dancer roller 102 heating chamber

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-260535 (JP, A) JP-A-64-51692 (JP, A) JP-A-5-36657 (JP, A) JP-A 63-26057 262227 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 311 B29C 53/18

Claims (12)

(57) [Claims] 1. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Film carrier for mounting electronic components provided with a dist layer
Warpage of film carrier tape for mounting electronic components on tape
A removing method, the film carrier tape for mounting electronic components, in the width direction of the film carrier tape to restrain the warp direction opposite in a heated state, after applying the inverse warping, the electronic component mounting The film carrier tape for electronic component mounting is passed while passing the film carrier tape for electronic component mounting between a plurality of leveler rollers arranged alternately displaced up and down with respect to the feeding direction of the film carrier tape for electronic component mounting. A method for removing a warp of a film carrier tape for mounting electronic components, wherein the warp is removed while cooling to remove the warp. 2. A base material comprising an adhesive layer applied to a film.
Solder pattern as a circuit pattern and protective insulating layer
Film carrier for mounting electronic components provided with a dist layer
Warpage of film carrier tape for mounting electronic components on tape
A removal method for feeding direction of the film carrier tape for mounting electronic components, between a plurality of leveler rollers arranged displaced alternately up and down, the film carrier tape in a heated state After removing the warpage of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape is constrained in the width direction and in the opposite direction to the warpage to impart the reverse warp, A method for removing warpage of a film carrier tape for mounting electronic components, wherein the film carrier tape for mounting is cooled to maintain a state in which the warpage has been removed. 3. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Film carrier for mounting electronic components provided with a dist layer
Warpage of film carrier tape for mounting electronic components on tape
A removing method, the electronic components mounting film heating state carrier tape, to restrain the warp direction opposite to the width direction of the film carrier tape, to impart the inverse warp, the electronic component mounting The film carrier tape for electronic component mounting is passed by passing the film carrier tape for electronic component mounting in a heated state between a plurality of leveler rollers arranged alternately displaced up and down with respect to the feeding direction of the film carrier tape. After removing the warp, the electronic component mounting film carrier tape is constrained in the direction opposite to the warp in the width direction to impart a reverse warp, while cooling the electronic component mounting film carrier tape to reduce the warpage. A method for removing warpage of a film carrier tape for mounting electronic components, characterized by maintaining the removed state. 4. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Film carrier for mounting electronic components provided with a dist layer
Warpage of film carrier tape for mounting electronic components on tape
A removing method, the electronic components mounting film heating state carrier tape, to restrain the warp direction opposite to the width direction of the film carrier tape, to impart the inverse warp, the electronic component mounting By passing the film carrier tape for mounting electronic components in a heated state between a plurality of leveler rollers arranged alternately up and down with respect to the feeding direction of the film carrier tape, the film carrier for mounting electronic components After removing the warp of the tape, the electronic component mounting film carrier tape is moved between a plurality of leveler rollers arranged alternately up and down with respect to the feeding direction of the electronic component mounting film carrier tape. While passing, the film carrier tape for mounting electronic components is cooled to remove the warp and maintain the state where the warp is removed. The film carrier tape bowing method which is characterized in that the. 5. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Film carrier for mounting electronic components provided with a dist layer
Warpage of film carrier tape for mounting electronic components on tape
A removal method for feeding direction of the film carrier tape for mounting electronic components, between a plurality of leveler rollers arranged displaced alternately up and down, the film carrier tape in a heated state To remove the warpage of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape is restrained in a direction opposite to the warp in the width direction of the electronic component mounting film carrier tape in a heated state. After applying the reverse warp, the electronic component mounting film carrier tape is cooled in the electronic component mounting film carrier tape while applying the reverse warp by constraining the electronic component mounting film carrier tape in the width direction and the reverse direction. A method for removing warpage of a film carrier tape for mounting electronic components, characterized by maintaining a state in which the film carrier tape has been removed. 6. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Film carrier for mounting electronic components provided with a dist layer
Warpage of film carrier tape for mounting electronic components on tape
A removal method for feeding direction of the film carrier tape for mounting electronic components, between a plurality of leveler rollers arranged displaced alternately up and down, the film carrier tape in a heated state To remove the warpage of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape is restrained in a direction opposite to the warp in the width direction of the electronic component mounting film carrier tape in a heated state. After imparting the reverse warp, between the plurality of leveler rollers arranged alternately displaced up and down with respect to the feeding direction of the electronic component mounting film carrier tape, the electronic component mounting film carrier tape While passing, the film carrier tape for mounting electronic components is cooled to remove the warp and maintain the state where the warp is removed. The film carrier tape bowing method which is characterized in that the. 7. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Electronic component mounting fill-time carriers resist layer is provided
Warpage of film carrier tape for mounting electronic components on tape
A removal device, wherein the electronic component mounting film carrier tape, in a heated state, constrained in the width direction of the electronic component mounting film carrier tape in a direction opposite to the warp, a reverse warp imparting restraint member for imparting a reverse warp. The provided heating reverse warp imparting section, with respect to the feeding direction of the electronic component mounting film carrier tape, comprising a plurality of leveler rollers arranged alternately displaced up and down, between the leveler rollers, The electronic component mounting film carrier tape to which the reverse warpage has been applied by the heating reverse warp applying section, by passing the film carrier tape in a cooled state, so as to maintain a state where the warp has been removed, and a warp removing cooling section. Characteristic device for removing warpage of film carrier tape for mounting electronic components. 8. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Film carrier for mounting electronic components provided with a dist layer
Warpage of film carrier tape for mounting electronic components on tape
A removal device, comprising: a plurality of leveler rollers disposed alternately displaced up and down with respect to the feeding direction of the electronic component mounting film carrier tape, and between the leveler rollers, for mounting electronic components. A heating warp removing unit configured to remove the warpage of the electronic component mounting film carrier tape by passing the film carrier tape in a heated state, and an electronic component mounting film from which the warping has been removed by the heating warp removing unit A cooling reverse warpage imparting portion having a reverse warpage imparting restraint member for imparting a reverse warp by constraining the carrier tape in a cooling state in a width direction of the electronic component mounting film carrier tape in a width direction. An apparatus for removing warpage of a film carrier tape for mounting electronic components. 9. A base plate obtained by applying an adhesive layer to a film.
Solder pattern as a circuit pattern and protective insulating layer
Electronic component mounting fill-time carriers resist layer is provided
Warpage of film carrier tape for mounting electronic components on tape
A removal device, wherein the electronic component mounting film carrier tape, in a heated state, constrained in the width direction of the electronic component mounting film carrier tape in a direction opposite to the warp, a reverse warp imparting restraint member for imparting a reverse warp. The provided heating reverse warp imparting section, with respect to the feeding direction of the electronic component mounting film carrier tape, comprising a plurality of leveler rollers arranged alternately displaced up and down, between the leveler rollers, A heating warp removing unit configured to remove the warpage of the electronic component mounting film carrier tape by passing the electronic component mounting film carrier tape to which the reverse warpage has been applied in the heating reverse warpage applying unit in a heated state. The electronic component-mounting film carrier tape from which the warp has been removed by the heating warp removing section is cooled and the electronic component-mounting film carrier tape is cooled. A cooling reverse warpage imparting portion having a reverse warpage imparting restraint member for imparting a reverse warp by being constrained in a direction opposite to the warp in the width direction of the electronic component mounting film carrier tape. apparatus. 10. A base obtained by applying an adhesive layer to a film.
Solder on tape as circuit pattern and protective insulating layer
Film carrier for electronic component mounting with resist layer
Of tape carrier for electronic component mounting film carrier tape
A device for removing warpage , wherein the electronic component mounting film carrier tape is in a heated state, and the electronic component mounting film carrier tape is provided with a reverse warp imparting restricting member that constrains in the direction opposite to the warp in the width direction of the film carrier tape and imparts reverse warpage. The provided heating reverse warp imparting section, with respect to the feeding direction of the electronic component mounting film carrier tape, comprising a plurality of leveler rollers arranged alternately displaced up and down, between the leveler rollers, By passing the electronic component mounting film carrier tape, to which the reverse warpage has been applied in the heating reverse warpage applying unit, in a heated state, a heating warp removing unit configured to remove the warpage of the electronic component mounting film carrier tape, A plurality of leveler rollers which are alternately displaced up and down with respect to a feeding direction of the film carrier tape for mounting electronic components; Between the roller, the electronic component mounting film carrier tape from which the warpage has been removed by the heating warp removing unit, by passing in a cooled state, a warp removal cooling unit configured to maintain the state where the warp is removed, An apparatus for removing warpage of a film carrier tape for mounting electronic components, comprising: 11. A base in which an adhesive layer is applied to a film
Solder on tape as circuit pattern and protective insulating layer
Film carrier for electronic component mounting with resist layer
Of tape carrier for electronic component mounting film carrier tape
A Ri removing device, with respect to the feeding direction of the film carrier tape, vertically displaced alternately provided with a plurality of leveler rollers disposed, between the leveler roller, the electronic component mounting By removing the warpage of the film carrier tape for mounting electronic components by passing the film carrier tape for heating in a heated state, and for mounting the electronic components from which the warping has been removed by the heating warp removing unit. A heating reverse warpage applying unit including a reverse warpage applying restricting member that constrains the film carrier tape in a heated state in a direction opposite to the warp in the width direction of the electronic component mounting film carrier tape, and applies a reverse warp; The electronic component mounting film carrier tape provided with the reverse warp in the reverse warp imparting section is cooled, and Conversely warp imparting a restraining member cooling inverse warp applying portion having, the film carrier tape of warp removal device, characterized in that it comprises the imparting reverse warp constraining the warp direction opposite to the direction. 12. A base in which an adhesive layer is applied to a film.
Solder on tape as circuit pattern and protective insulating layer
Film carrier for electronic component mounting with resist layer
Of tape carrier for electronic component mounting film carrier tape
A Ri removing device, with respect to the feeding direction of the film carrier tape, vertically displaced alternately provided with a plurality of leveler rollers disposed, between the leveler roller, the electronic component mounting By removing the warpage of the film carrier tape for mounting electronic components by passing the film carrier tape for heating in a heated state, and for mounting the electronic components from which the warpage has been removed by the heating warp removing portion. A heating and reverse warp applying portion provided with a reverse warp applying restraining member for applying a reverse warp by constraining the film carrier tape in a heated state to a direction opposite to the warp in the width direction of the electronic component mounting film carrier tape; and the electronic component. A plurality of leveler rollers disposed alternately and vertically displaced with respect to a feeding direction of the mounting film carrier tape; The warp removal cooling unit is configured to maintain the state where the warpage is removed by passing the electronic component mounting film carrier tape to which the reverse warpage has been applied by the heating reverse warp applying unit in a cooled state. A device for removing warpage of a film carrier tape for mounting electronic components, comprising: