200428001 (1) 玖、發明說明 【發明所屬之技術領域】 本發明關於一種電性地檢查TAB(Tape Autom ated Bonding)或COF(chip On Film)等晶片安裝用帶的方法及使 用該檢查方法的檢查用的測試裝置。 【先前技術】 對於TAB，COF等晶片安裝用帶（以下稱爲帶），利用 安裝1C晶片或LSI晶片等的晶片，而藉由樹脂密封晶片安 裝部分來製造包封體。帶是成爲較長者，形成多數電路圖 案形成領域以一定間隔能連續地形成於長度方向。在各電 路圖案形成領域爲了安裝晶片，與晶片電極相連接的內引 線及成爲外部引線形成於各電路圖案形成領域。必須把握 如此所形成的內引線或外引線的斷線，電阻値等特性或晶 片的作動特性等，爲此的電性檢查（探測測試）爲藉由將帶每 一捲軸裝設於處理機而在晶片安裝前或安裝後進行。 電性檢查是將與外引線連接的測試墊片平行排列或以 四列等錯開排列於各電路圖案形成領域，而將從測試裝置 所突出的探針接觸於各該測試墊片，藉由與測試器相連接 所進行。在該屬性檢查中，突出狀地設於測試裝置成爲使 得探針成爲大約垂直狀態而成爲大約垂直方向接觸觸於測 試墊片時，則測試單元與帶重疊而無法看到探針前端部分 之故’因而無法確認探針與測試墊片的接觸狀態，而有無 法進行測試裝置的探針與帶上的測試墊片的定位的情形。 -4 - (2) (2)200428001 所以，在習知，於測試裝置的帶側配置反射鏡之同時 ，於與反射鏡的對應部位朝厚度方向貫通透光用開口部， 經由該開口部來視認來自反射鏡的畫像而進行確認探針與 測試墊片的接觸狀態的檢查（例如參照專利文獻1)。 (專利文獻1:日本特許第3310930號公報（第3頁，第1 圖） 然而，在習知檢查中，於測試裝置安裝反射鏡之同時 ，能位於該反射鏡配置部位地須形成開口部。此種加工不 但煩雜，也使得測試裝置的構造變成複雜。又，如折彎的 TAB等電路圖案，有配置反射鏡上有空間上的困難。 本發明是考慮此些習知的缺點問題而創作者，其目的 是在於提供一種以不需要反射鏡等的附屬零件的簡單構造 ，確實地進行探針與測試墊片之良好接觸的檢查方法及使 用該檢査方法的測試裝置。 【發明內容】 爲了達成上述目的，申請專利範圍第1項發明的晶片 安裝用帶的檢查方法，屬於對於以一定間隔設於帶的電路 圖案形成領域的複數電極墊片，藉由以大約垂直狀態配置 於測試裝置的複數探針從大約垂直方向分別接觸俾進行電 性檢查的方法，其特徵爲：將與對應於上述各電路圖案形 成領域地形成的對位用對準標記相對應的標記確認孔設於 上述測試裝置，而在測試裝置與帶的相反側設置攝影機的 狀態下，一面經由攝影機進行觀察一面調整測試裝置與帶 -5- (3) (3)200428001 的相對位置使得對準位置位於標記確認孔的內部。 在申請專利範圍第1項的發明中，爲了晶片安裝時的 對位或安裝於液晶面板的對位而利用事先形成在帶的對準 標記者。對準標記是分別形成於帶的電路圖案形成領域之 同時，形成位置也成爲高精度。 在該發明中，將對應於該對準標記的標記確認孔，形 成於測試裝置，一面觀察一面移動測試裝置及帶的任一或 雙分使得對準標記位於標記確認孔的內部，藉由該移動進 行此些的位置調整。在此種位置調整中，爲了將位置成爲 高精度的對準標記調整作爲基準，可進行精度優異的調整 ，可確實地接觸電極墊片與探針，並可進行具可靠性的檢 查。又，對於測試單元，僅貫通標記確認孔就可以，成爲 也不需要其他煩雜的加工或是安裝附屬零件，使得測試單 元的加工成爲簡單。 申請專利範圍第2項的發明，是申請專利範圍第1項所 述的晶圓安裝用帶的檢查方法中，使用對於檢查對象的電 路圖案形成領域的標記確認孔，及對於下一電路圖案形成 領域的標記確認孔而進行測試裝置與帶的相對位置的調整 ，爲其特徵者。 在申請專利範圍第2項的發明中，使用對於鄰接的兩 個電路圖案形成領域的標記確認孔進行位置調整之故，因 而成爲使用偏離的位置的標記確認孔的位置調整，可進行 精度良好的位置調整。 申請專利範圍第3項的發明，是申請專利範圍第1項所 -6 - (4) (4)200428001 述的晶片安裝用帶的檢查方法，使用檢查對象的電路圖案 形成領域的對角位置的標記確認孔而進行測試裝置與帶的 相對位置的調整，爲其特徵者。 在申請專利範圍第3項的發明中，使用對角位置的標 記確認孔進行位置調整之故，因而成爲使用偏離的位置的 標記確認孔的位置調整，可進行精度良好的位置調整。 申請專利範圍第4項的發明，是申請專利範圍第1項至 第3項中任一項所述的晶片安裝用帶的檢查方法中，藉由 將上述標記確認孔成對的大徑孔及小徑孔所形成，經大徑 孔來進行測試裝置與帶的槪略對位之後，將小徑孔可進行 微細的對位，爲其特徵者。 在申請專利範圍第4項的發明中，經大徑孔的測試裝 置與帶的槪略對位時，視野較廣之故，因而可簡單地找出 對準標記。如此，經小徑孔的可進行後續的微細定位之故 ，因而在短時間可進行精度優異的對位。 申請專利範圍第5項發明的使用於晶片安裝用帶的檢 查的測試裝置，屬於對於以一定間隔設於帶的各電路圖案 形成領域的複數電極墊片’藉由從大約垂直方向分別接觸 進行電性檢查的複數探針以大約垂直狀態所配置的測試裝 置，其特徵爲：能對應於上述各電路圖案形成領域地對應 於形成在帶的對位用對準標記’而使得該對準標記位於內 部地形成有觀察所用的標記確認孔。 在申請專利範圍第5項的發明中，在使用於帶的檢査 的測試裝置形成標記確認孔之故’因而經由事先形成於帶 (5) (5)200428001 的對準標記可進行測試裝置及帶的位置調整。由此，可進 行精度優異的檢查之故，因而可確實地接觸電極墊片與探 針，可進行精度優異的檢查。又，僅將標記確認孔貫通測 試裝置就可以，成爲也不需要其他煩雜加工或附屬品的安 裝，可作成簡單的構造。 申請專利範圍第6項的發明，是申請專利範圍第5項所 述的使用於晶片安裝用帶的檢査的測試裝置中，上述標記 確認孔設於與檢查對象的電路圖案形成領域的對應位置及 與下一檢查對象的電路圖案形成領域的對應位置，爲其特 徵者。 在申請專利範圍第6項的發明中，在相鄰接的電路圖 案形成領域形成有標記確認孔之故，因而可進行使用鄰接 位置的電路圖案形成領域的標記確認孔的位置調整。因此 ，成爲使用偏離位置的標記確認孔的位置調整，可進行精 度優異的位置調整。 申請專利範圍第7項的發明，是申請專利範圍第5項所 述的使用於晶片安裝用帶的檢查的測試裝置中，上述標記 確認孔設置成爲電路圖案形成領域的對角位置，爲其特徵 者。 在申請專利範圍第7項所述的發明中，標記確認孔配 置於電路圖案形成領域的對角位置之故，因而可進行使用 對角位置的標記確認孔的位置調整。因此，成爲使用偏離 位置的標記確認孔的位置調整，可進行精度優異的位置調 整。 -8- (6) 200428001 申請專利範圍第8項的發明是申請專利範圍第5項至第 7項中任一項所述的使用於晶片安裝用帶的檢查的測試裝 置中，上述標記確認孔是帶側呈小徑，另一側呈大徑的具 階段的孔，爲其特徵者。200428001 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a method for electrically inspecting a wafer mounting tape such as TAB (Tape Automated Bonding) or COF (chip On Film), and a method using the inspection method. Test device for inspection. [Prior Art] For TAB, COF and other wafer mounting tapes (hereinafter referred to as tapes), a wafer is mounted with a 1C wafer, an LSI wafer, and the like, and the wafer mounting portion is resin-sealed to produce an envelope. The band becomes longer, and most of the circuit pattern formation areas can be continuously formed in the length direction at a certain interval. In order to mount a wafer in each circuit pattern formation area, internal leads and external leads connected to the wafer electrodes are formed in each circuit pattern formation area. It is necessary to grasp the breakage of the inner lead or the outer lead thus formed, the characteristics of the resistance, and the operating characteristics of the wafer. The electrical inspection (probe test) for this purpose is to mount each reel of the tape on a processor. Performed before or after wafer mounting. The electrical inspection is to arrange the test pads connected to the outer leads in parallel or staggered in four columns in the circuit pattern forming area, and contact the test pads protruding from the test device with each of the test pads. The tester is connected. In this property inspection, when the probe is provided in a protrusive state so that the probe becomes approximately vertical and contacts the test pad approximately vertically, the test unit overlaps with the tape and the front end portion of the probe cannot be seen. 'Therefore, the contact state between the probe and the test pad cannot be confirmed, and positioning of the probe of the test device and the test pad on the tape may not be performed. -4-(2) (2) 200428001 Therefore, while arranging a reflector on the belt side of the test device, it is known to penetrate the opening for light transmission in the thickness direction at a position corresponding to the reflector and pass through the opening. An inspection for confirming the contact state between the probe and the test pad is performed by recognizing the image from the mirror (for example, refer to Patent Document 1). (Patent Document 1: Japanese Patent No. 3310930 (Page 3, Fig. 1)) In conventional inspection, it is necessary to form an opening at a position where the mirror is installed while the mirror is installed in the test device. Such processing is not only cumbersome, but also complicates the structure of the test device. Also, circuit patterns such as bent TABs have spatial difficulties in arranging reflectors. The present invention was created in consideration of these conventional disadvantages. It is an object of the present invention to provide an inspection method that reliably performs good contact between a probe and a test pad with a simple structure that does not require accessory parts such as a mirror, and a test device using the inspection method. In order to achieve the above object, the method for inspecting a wafer mounting tape of the first invention in the scope of patent application belongs to a plurality of electrode pads arranged at a certain interval in a circuit pattern forming field. A method for electrically inspecting a plurality of probes by respectively contacting them from a vertical direction, characterized in that: The mark confirmation holes corresponding to the alignment marks formed in the pattern forming area are provided in the above-mentioned test device, and in a state where a camera is installed on the opposite side of the test device and the belt, the test device and the belt are adjusted while observing through the camera. The relative position of -5- (3) (3) 200428001 is such that the alignment position is located inside the mark confirmation hole. In the invention claimed in the first item of the patent application, for the alignment during wafer mounting or the alignment for liquid crystal panels The alignment mark is formed in advance on the tape. The alignment mark is formed in the circuit pattern forming area of the tape, and the formation position is also highly accurate. In this invention, the mark corresponding to the alignment mark is confirmed. The hole is formed in the test device, and one or both of the test device and the belt are moved while observing, so that the alignment mark is located inside the mark confirmation hole, and the position adjustment is performed by the movement. In this position adjustment, In order to use the positioning mark adjustment as a reference for high-precision positioning, it is possible to perform adjustment with excellent accuracy, and the electrode pad and the electrode pad can be reliably contacted. Needle can be used for reliable inspection. In addition, for the test unit, only the mark confirmation hole needs to be penetrated, and other complicated processing or attachment of attachment parts is not required, making the processing of the test unit simple. The second invention is the inspection method of the wafer mounting tape described in the first patent application, which uses a mark confirmation hole for a circuit pattern formation area to be inspected and a mark for a next circuit pattern formation area. The feature is to adjust the relative position of the test device and the belt by confirming the hole. In the invention of the second aspect of the patent application, the position adjustment is performed by using the mark confirming hole for two adjacent circuit pattern formation fields, Therefore, it is possible to adjust the position of the mark confirmation hole by using the misaligned position, and the position can be adjusted with high accuracy. The invention in the third scope of the patent application is described in the first scope of the patent scope-6-(4) (4) 200428001 Method for inspecting a wafer mounting tape using a mark at a diagonal position in a circuit pattern forming area of an inspection target Adjusting the relative position of the test device of the belt, its characteristics are. In the invention in the third scope of the patent application, the position of the mark confirmation hole at the diagonal position is used to adjust the position. Therefore, the position of the mark confirmation hole at the offset position is adjusted, and the position adjustment can be performed with high accuracy. The invention with the scope of patent application No. 4 is the method for inspecting the wafer mounting tape according to any one of the scope of patent applications No. 1 to No. 3, in which the large diameter holes and The small diameter hole is formed, and after the large diameter hole is used to perform a slight alignment of the test device and the belt, the small diameter hole can be finely aligned, which is its characteristic. In the invention in the fourth scope of the patent application, when the test device of the large-diameter hole is aligned with the tape, the field of view is wide, so the alignment mark can be easily found. In this way, the subsequent fine positioning can be performed through the small-diameter hole, so that the positioning can be performed with excellent accuracy in a short time. A test device for inspecting a wafer mounting tape according to the fifth invention of the patent application belongs to a plurality of electrode pads' for each circuit pattern forming area provided at a certain interval in the tape, and is electrically contacted from the vertical direction. A test device in which a plurality of probes for the property inspection are arranged in a vertical state is characterized in that it can correspond to each of the above-mentioned circuit pattern formation fields and correspond to an alignment mark 'for alignment formed on a tape so that the alignment mark is located at A mark confirmation hole for observation is formed internally. In the invention claimed in claim 5 of the scope of the patent, the mark confirmation hole is formed in the test device used for the inspection of the belt. Therefore, the test device and the belt can be performed through an alignment mark formed on the belt (5) (5) 200428001 in advance. Position adjustment. This makes it possible to perform an inspection with excellent accuracy, so that the electrode pad and the probe can be reliably contacted, and an inspection with excellent accuracy can be performed. In addition, only the mark confirmation hole penetrating test device is sufficient, and other complicated processing or attachment of accessories is not required, and a simple structure can be made. The invention according to claim 6 is a test device for inspecting a wafer mounting tape described in claim 5 in which the above-mentioned mark confirmation hole is provided at a position corresponding to the circuit pattern formation area of the inspection target and The characteristic position corresponds to the position corresponding to the circuit pattern formation area of the next inspection object. In the invention of claim 6 of the patent application, since the mark confirmation hole is formed in the adjacent circuit pattern formation area, the position of the mark confirmation hole in the circuit pattern formation area using adjacent positions can be adjusted. Therefore, it becomes possible to adjust the position of the confirmation hole using the mark that is out of position, and it is possible to perform position adjustment with excellent accuracy. The invention claimed in claim 7 is a test device for inspecting a wafer mounting tape described in claim 5 in which the above-mentioned mark confirmation hole is provided as a diagonal position in the field of circuit pattern formation, and is characterized in that By. In the invention described in claim 7 of the scope of patent application, since the mark confirmation holes are arranged at diagonal positions in the field of circuit pattern formation, the position of the mark confirmation holes using the diagonal positions can be adjusted. Therefore, it becomes possible to perform position adjustment using a mark confirming a deviation position, and position adjustment can be performed with excellent accuracy. -8- (6) 200428001 The invention claimed in item 8 of the scope of patent application is the test device for inspecting wafer mounting tapes described in any of claims 5 to 7 of the scope of patent application. It is a characteristic hole with a small diameter on the belt side and a large diameter on the other side.
在申請專利範圍第8項的發明中，形成具階段的孔的 標記確認孔的小徑側成爲對準標記觀察的基準。另一方面 ，在標記確認孔形成大徑的另一側配置有攝影機，經由攝 影機進行對準標記的觀察。如此地藉由攝影機側成爲大徑 ，可將充分光量導進標記確認孔，由此，可將來自攝影機 的光線良好地到達至對準標記側之故，因而可確實地進行 對準標記的觀察。又，在攝影機的透鏡徑爲大徑時，也可 藉由標記確認孔的攝影機側形成大徑而可鮮明地看到對準 標記的畫像。In the eighth invention of the patent application, the small-diameter side of the mark confirmation hole forming the stepped hole becomes the reference for the alignment mark observation. On the other hand, a camera is arranged on the other side where the mark confirmation hole forms a large diameter, and the alignment mark is observed through the camera. With the large diameter of the camera side in this way, a sufficient amount of light can be guided into the mark confirmation hole, so that the light from the camera can reach the alignment mark side well, so the observation of the alignment mark can be performed reliably . When the lens diameter of the camera is large, the image of the alignment mark can be clearly seen by forming the large diameter on the camera side of the mark confirmation hole.
申請專利範圍第9項的發明，是申請專利範圍第5項至 第7項中任一項所述的使用於晶片安裝用帶的檢查的測試 裝置中，上述標記確認孔藉由成對的大徑孔及小徑孔所形 成，爲其特徵者。 在申請專利範圍第9項的發明中，標記確認孔藉由成 對的大徑孔及小徑孔所構成之故，因而可經大徑孔進行測 試裝置與帶之間大約對位。在該對位中，視野較廣之故’ 因而可簡單地找出對準標記。又，經小徑孔可進行後續的 微細定位。因此，以短時間可進行精度優異的對位。 【實施方式】 -9- (7) (7)200428001 第1圖是表示本發明的實施形態的檢查狀態的立體@ ;第2圖是表示其斷面圖；第3圖是局部地表示測試裝置的 斷面圖；第4圖是表示測試裝置的俯視圖。在此些圖中’ 帶1與測試裝置2相對向，而在該相對向的狀態下’進行對 於帶1的電性檢查。 帶1是藉由薄膜狀地成形絕緣性樹脂所形成’在其長 度方向以一定間隔形成有電路圖案形成領域。10，i〇a是 鄰接在長度方向所形成的電路圖案形成領域。在以10 ’ 1 〇 a作爲開始的各電路圖案形成領域，形成有內引線及外 引線。又，在外引線也有連設測試墊片的情形。測試墊片 是以如兩列等平行狀態形成於各電路圖案形成領域。此些 內引線外引線及測試墊片是構成電路圖案形成領域的電極 墊片1 1者。 在各電路圖案形成領域安裝有晶片（未圖示），並連接 有晶片的電極與內引線。在該實施形態中，將安裝晶片前 的帶1供作檢查者。又，帶1是經由以一定間隔設在寬度方 向兩側的鏈輪12，進行依處理機的朝長度方向的移動。 又，在以1 0，1 〇a作爲開始的各電路圖案形成領域， 事先形成有對準標記。對準標記是爲了進行安裝晶片之際 與晶片相對向的定位，或是進行安裝於液晶面板之際的定 位而形成於各電路圖案形成領域者。該對準標記是爲了與 電極墊片1 1同樣地藉由印刷所形成；而形成位置成爲高精 度，同時爲了進行上述的定位而與電極墊片11的位置關係 也形成爲高精度。 -10 - (8) (8)200428001 在第1圖中’ 13a’ 13b’ 13c，13d是形成於電路圖案 形成領域1 〇的對準標記，1 3 a，1 3 b以接近狀態所形成， 而13c’ 13d以接近狀態所形成。14a，14b，14c，14d是 形成電路圖案形成領域1 0a的對準標記；1 4a，1 4b以接近 狀態所形成’而1 4c ’ 1 4d以接近狀態所形成。此些對準 標記內’任何一個或一對成爲如安裝晶片時的定位所用的 標記’而其他之一個或一對成爲如安裝於液晶面板之際的 定位所用的標記。各該對準標記是被成形成圓形，方形， 十字形，U字形等外形’藉由其外形成爲判別爲使用於那 一種定位。在本實施形態中，使用此些對準標記來進行帶 1與測試裝置2的位置調整者。 如第2圖所示地，測試裝置2是具備分別與電路圖案形 成領域10的電極墊片11(測試墊片16)接觸的複數探針21。 探針2 1是對於測試裝置2以大約垂直狀態所配置，而直接 以大約垂直狀態下成爲從大約垂直方向接觸於帶1的電極 墊片11(測試墊片16)。 第3圖及第4圖是表示使用於該實施形態的測試裝置2 的一例。具備層積複數絕緣性樹脂所構成的板材的保持件 22，及沿著保持件22的厚度方向所形成的複數收容孔；而 探針21被插入在各收容孔。收容孔23是按照成爲檢查對象 的帶11所形成者，在TAB等的帶中，作爲電極墊片11的 測試墊片列狀地形成之故，因而收容孔23也列狀地形成。 第5圖是表示形成於TAB的測試墊片15的配置的一例，矩 形狀地成形。又，在各列成爲大約等間隔地使得複數測試 -11 - (9) (9)200428001 墊片16形成三列，成爲探針21接觸於各該測試墊片16。各 測試墊片16是具有連接圖案16a，經由連接圖案16a連接 於外引線。 如第3圖所示地，探針2 1是具備：從保持件22突出而 面臨於帶1的導電性材料所構成的細徑接觸針2 1 a，及成爲 與接觸針2 1 a的相反側地插入於收容孔2 3的導電性材料所 構成的連接針21b，及插入於此些之間的導電性材料所構 成的彈簧21c。接觸針21a是利用從保持件22突出，與對 應的電極墊片11接觸，而利用該接觸進行電極墊片丨丨的電 性檢查。又，利用接觸針2 1 a的收容孔2 3側的部分成爲大 徑’成爲可從收容孔23抽出或插入接觸針21a，同時防止 與引線24的中心偏位。 在收容孔23，插入有搪瓷線等所構成的引線24的端部 24a而與連接針21b接觸。由此，引線24是經由連接針21b 及彈簧2 1 c而成爲與接觸針2 1 a電性地連接的狀態。又， 在該實施形態中，引線24的端部24利用壓碎加工，成爲防 止來自收容孔23脫落的構造。 此種測試裝置2是探針21配置成爲大約垂直狀態，且 從大約垂直方向接觸於帶1的電極墊片11者，並不被限定 於圖示形態者。例如作成省略連接針2 1 b而使得彈簧2 1 c 直接與引線24的端部24a接觸的構造也可以，或不是作成 接觸針21a，連接針21b，彈簧21c的三零件，而使用單一 的針狀體也可以。 測試裝置2是被設定在印刷配線的基板3的狀態下使用 -12- (10) (10)200428001 於帶1的檢查。在基板3的背面（從帶1遠離之面），圖案形 成有配線部3 a，來自各探針2 1的引線2 4軟焊於配線部3 a ° 在該配線部3 a ’面臨有來自測試器（未圖示）的測試探針’ 利用測試探針4接觸於配線部3 a ’成爲在各探針2 1與測試 器（未圖示）之間進行信號之授受。 在此種測試裝置2 ’對應於帶1的電路圖案形成領域（ 例如電路圖案形成領域1 0 ’ 1 0a的對準標記的標記確認孔 2 5，2 6形成朝厚度方向貫通之狀態（參照第2圖）°標記確 認孔25是在第1圖的狀態中’對應於電路圖案形成領域W 的對準標記13a’ 13b，13c’ 13d者’藉由對應於此些的 四個確認孔25a’ 25b，25c，25d所構成。又’ 標記確認孔26是在第1圖的狀態中’對應於電路圖案形成 領域10的對準標記14a，14b，14c’ i4d者，藉由對應於 此些的四個確認孔26a，26b，26c，26d所構成。在檢査 時，電路圖案形成領域依次成爲與測試裝置2相對向的位 置般地間歇地搬運帶1者’所以在電路圖案形成領域1 〇被 搬到與測試裝置2相對向位置時’則成爲標記確認孔2 5的 四個確認孔25a，25b，25c’ 25d與電路圖案形成領域l〇a 的對準標記1 4a，1 4b，1 4c，1 4d相對應，而標記確認孔 26的四個確認孔26a，26b’ 26c’ 26d與連續於電路圖案 形成領域1 〇a的電路圖案形成領域的對準標記相對應。 此些標記確認孔25 ’ 26是依據對應於測試裝置2的電 路圖案形成領域的對準標記，爲了調整帶1與測試裝置2的 相對位置所使用。該調整是所對應的對準標記位於標記確 -13- (11) (11)200428001 認孔的內部地利用變更帶1及測試裝置2的相對位置所進行 。亦即，經標記確認孔來視認對準標記，調整成該對準標 記位於標記確認孔內者。爲了進行該調整，使用攝影機3 1 〇 攝影機3 1 ’是使用CCD攝影機等小型攝影機，以位 於與帶1相反側的狀態下成爲朝在一平面內正交的XY方 向可移動。該攝影機31是在與帶1之間以夾住測試裝置2的 狀態下，從標記確認孔2 5，2 6來觀察對準標記。在該實施 形態下，測試裝置2支持於基板3上，能將來自攝影機31的 光線引導至標記確認孔25，26所用的貫通孔3c形成於基 板3成爲對應於標記確認孔25，26者。 以下，說明帶1的檢查順序。在該實施形態中，標記 確認孔25，26的接近的兩個確認孔的徑不相同。亦即，如 第2圖及第4圖所示地，在標記確認孔2 5中，在帶1側以大 徑開設確認孔25b(25d)，而以小徑開設確認孔25a(25c)。 同樣地’在標記確認孔2 6中，在帶1側以大徑開設確認孔 26b(26d)，而以小徑開設確認孔26a(26c)。 在此種實施形態中，藉由調整使得測試裝置1 〇所對應 的對準標記13b(或/及確認孔13d)位於以大徑所開設的確認 孔25b(或/及確認孔25d)內，俾進行帶1與測試裝置2的槪略 對位。在該對位，視野較廣之故，因而可簡單地找出對準 標記1 3 b (或/及對準標記1 3 d)。之後，藉由調整使得所對應 的對準標記13a位於以小徑開設的確認孔25a(或/及確認孔 25c)內’俾進行微細的對位。 -14- (12) (12)200428001 藉由該位置調整，完成帶1與測試裝置2的初期對位。 之後’藉由將測i式裝置2接近於帶1，使得探針21從大約垂 直方向接觸於所對應的電極墊片11之故，因而可進行該電 性檢查。然後，完成帶1與測試裝置2的對位之故，因而藉 由進行使用鏈輪12的帶1的移動，使得下—電路圖案形成 領域l〇a成爲定位置可與測試裝置2相對向。由此，同樣 地可進行將探針21接觸於電極墊片11。 第6圖是表不以上調整時的標記確認孔25，26內部的 對準標記的畫像。在同圖中’ 17是對準標記，27是標記確 認孔。 對準標記17爲方形等多角形時，如第6(a)圖所示地標 記確認孔27成爲外接圓地進行位置調整。對準標記丨7爲L 形時，如第6 (b)圖所示地標記確認孔2 7外接於各邊地進行 位置調整。對準標記17爲十字形時，如第6(c)圖所示地， 十字中心爲位於標記確認孔2 7的中心地進行位置調整。標 記確認孔17爲圓形時，如第6(d)(e)圖所示地，使得與標記 確認孔2 7的中心成爲一致地進行位置調整，在其他形狀的 對準標記，利用進行同樣的位置調整，可進行帶1與測試 裝置2的位置調整。 在此種位置調整中，利用事先形成於帶1的對準標記 ，進行帶1與測試裝置2的相對位置的調整之故，因而可進 行高精度的位置調整。又’對於測試裝置2，僅形成能貫 通標記確認孔25，26就可以’因此不但不需要煩雜的加工 ，也不需要安裝反射鏡或該支持用托架等的附屬零件，而 -15- (13) (13)200428001 可成爲簡單的構造。 又，如第2圖所示地從測試裝置2的背面拉出與複數探 針2 1相連接的引線24，而可直接連接於基板3背面的背線 部3 a。所以，可使用印刷配線於一面的簡單構造的基板3 ，不必使用印刷配線於兩面的基板，或是爲了連接兩面的 印刷配線而形成貫通孔的基板，可作成低成本的基板。 又，在該實施形態中，進行依大徑及小徑的兩階段的 位置調整，因此在短時間且精度優異地進行帶1與測試裝 置2的對位。 第7圖是表示本發明的其他實施形態。在該實施形態 中，標記確認孔28成爲具階段的孔。亦即，標記確認孔28 是成爲大徑孔28a與小徑孔28b相連通的構造，小徑孔28b 位於帶1側，而大徑孔28a位於攝影機3 1側地決定方向性 而被使用。帶1爲TAB時，小徑孔28b的直徑R2是被設定 成0.2至1.5mm，而大徑孔28a的直徑R1是被設定成成1.5 至5.0mm時，小徑孔28b的長度L是被設定成0.5至2.0mm 等。 在此種具階段的孔，因由小徑孔28b視認帶1的對準 標記，因此與表示於第4圖的對準標記的調整是經由小徑 孔2 8b來進行。另一方面，攝影機31的光線是從大徑孔 28a被導入而進行觀察。在該實施形態，因攝影機這側成 爲大徑孔28a，因此可將充分光量導進標記確認孔28。所 以，經小徑孔2 8b可將光線達到對準標記，而可確實地進 行其觀察。 -16- (14) (14)200428001 又，在第2圖中，標記確認孔2 5，2 6的確認孔2 5 a ’ 26a成爲與該實施形態同樣的具階段的孔，惟將其他確認 孔同樣地作成具階段的孔也可以。 在本發明中，使用檢查對象及成爲下一檢查對象地鄰 接的電路圖案形成領域1 0，1 〇a的對準標記也可進行帶1 與測試裝置2的對位。亦即，進行調整電路圖案形成領域 1 〇所對應的對準標記1 3 a，1 3 b，1 3 c，1 3 d位於標記確認 孔25的確認孔25a，25b，25c，25d內之同時，進行調整 電路圖案形成領域l〇a所對應的對準標記14a，14b，14c ，1 4 d位於標記確認孔2 6的確認孔2 6 a，2 6 b，2 6 c，2 6 d內 ο 對著此種鄰接的兩個電路圖案形成領域10，10a的定 位，因電路圖案形成領域1 0，1 0a之間的對準標記有相隔 ，因此成爲可進行精度優異的調整。 又，在本發明中，對著各電路圖案形成領域，於對角 位置事先形成對準標記之同時，也可將觀察對角位置的對 準標記的標記確認孔貫通於測試裝置。這時候，利用經對 角位置的標記確認孔來觀察對角位置的對準標記，因進行 帶1與測試裝置2的位置調整，因此同樣地成爲對於相隔離 位置的位置調整。所以’也可進行精度優異的調整。 第8圖是表示本發明的另—實施形態的測試裝置4 1的 攝影機3 1這側（下面側）者；在與第1圖至第4圖相同構件附 於相同記號使之對應。 在該測試裝置4 1，大徑孔4 2 a，4 2 b與小徑孔4 3 a， -17- (15) (15)200428001 4 3 b形成貫通於厚度方向。此些大徑孔4 2 a ’ 4 2 b及小徑孔 4 3 a，4 3 b，是形成位於探針2 1的配置領域（亦即，收容孔 2 3的配置領域）的外側者，而大徑孔4 2 a，4 2 b是形成位於 對角線上；小徑孔4 3 a，4 3 b是形成位於與該對角線交叉 的對角線上。 大徑孔42a，42b是與帶1的電路圖案形成領域的對準 標記45相比較形成充分大的直徑。因此，在大徑孔42a ’ 4 2b，可充分地進入通過來自攝影機3 1的光線。由此，可 明確地進行攝影機3 1的畫像處理。小徑孔4 3 a，4 3 b是形 成與對準標記45同等或稍大的直徑。小徑孔43a，43b是 用以帶1的定位者。 該實施形態的帶1與測試裝置4 1的對位，是首先進行 帶1的對準標記45位於大徑孔42a，42b內的槪略對位。藉 由該對位，對準標記45大約一致於小徑孔43a，43b。所以 ，藉由小徑孔4 3 a，4 3 b對位成爲對準標記4 5的外接圓而 可正確地對位帶1與測試裝置4 1。在該對位之後，藉由間 歇地搬運帶1使得對準標記45位於大徑孔42a，42b內，而 在與測試裝置4 1定位的狀態下可供給帶1，可連續地進行 帶1的電性檢查。 第9圖是表示僅藉由小徑孔43a進行帶1的定位時的囊 像處理狀態。這時候’因來自小徑孔43 a的光線不充分’ 因此發生影子50而成爲畫像處理的誤差。上述實施形態瘴 成爲有效率地可防止此種晝像處理誤差者。又，大徑孔 42a，42b及小徑孔43a ’ 43b是不必配置兩個，而分別具 -18 - (16) (16)200428001 有一個也可以。 本發明是並不被限定於以上實施形態，而可做各種更 。例如未將測試裝置2安裝於基板3而獨立地用於檢查也可 以。 依照本發明的檢查方法，進行以事先形成於帶的對準 標記作爲基準的調整之故，因而可進行精度優異的調整， 而且不必變更習知的處理機，可確實地接觸電極墊片與探 針，而可進行具有可靠性的檢查。 依照本發明的測試裝置，形成對應於事先形成於帶的 對準標記的標記確認孔，使用該標記確認孔進行與帶的位 置關調整之故，因而可確實地接觸電極墊片與探針，可進 行精度優異的檢查，而且僅貫通標記確認孔之故，因而成 爲也不必進行其他煩雜的加工或附屬零件的安裝，而可作 成簡單構造。 【圖式簡單說明】 第1圖是表示本發明的一實施形態的檢查狀態的立體 圖。 第2圖是表示檢查狀體的斷面圖。 第3圖是表示測試裝置內部的一例的斷面圖。 第4圖是表示測試裝置的一例的俯視圖。 第5圖是表示測試墊片的一例的俯視圖。 第6(a)圖至第6(e)圖是表示對準標記與標記確認孔之 關係的仰視圖。 -19- (17) 200428001 實施形態的標記確認孔的斷面圖。 明的另一實施形態的測試裝置的仰 處理誤差的放大圖。 第7圖是表示其他 第8圖是表示本蔡 視圖。 第9圖是表示畫像 [圖號說明] 1 2，41 3 10， 10a 11 12 13a〜13d ， 14a〜14d ， 1 16 16a 2 1 2 1a 2 1b 2 1c 22 23 24 24a 帶 測試裝置 基板 電路圖案形成領域 電極墊片 鍵輪 7，45 對準標記 測試墊片 連接圖案 探針 接觸針 連接針 彈簧 保持件 收容孔 引線 端部 配線部 -20- (18) 200428001 25， 25a 28a 28b 3 1 2 6，2 7，2 8 標記確認孔 j25d ， 26a〜26d 確認孔 ，42a，42b 大徑孔The invention in the ninth scope of the patent application is the test device for inspecting the wafer mounting tape described in any one of the fifth to the seventh scope of the patent application, and the above-mentioned mark confirms that the holes are formed in pairs. It is formed by diameter holes and small diameter holes. In the invention in the ninth scope of the patent application, the mark confirmation hole is formed by a pair of large-diameter holes and small-diameter holes. Therefore, the large-diameter hole can be used to perform approximate alignment between the test device and the belt. In this alignment, since the field of view is wide, it is easy to find the alignment mark. In addition, subsequent fine positioning can be performed through the small-diameter hole. Therefore, it is possible to perform alignment with excellent accuracy in a short time. [Embodiment] -9- (7) (7) 200428001 Fig. 1 is a three-dimensional view showing the inspection status of the embodiment of the present invention; Fig. 2 is a cross-sectional view; and Fig. 3 is a partial view of a test device. Figure 4 is a plan view showing the test device. In these figures, 'the belt 1 is opposed to the test device 2, and the electrical inspection of the belt 1 is performed in this opposed state'. The tape 1 is formed by forming an insulating resin in a thin film shape, and a circuit pattern forming area is formed at regular intervals in its length direction. 10, i〇a is a circuit pattern forming area adjacent to the longitudinal direction. In each circuit pattern formation region starting with 10 '10a, an inner lead and an outer lead are formed. In addition, test pads may be connected to the outer leads. The test pads are formed in a parallel state such as two rows in each circuit pattern forming area. These inner leads, outer leads, and test pads are electrode pads 11 that constitute a circuit pattern forming area. A chip (not shown) is mounted in each circuit pattern forming area, and electrodes and inner leads of the chip are connected. In this embodiment, the tape 1 before the wafer is mounted is used as an inspector. The belt 1 is moved in the longitudinal direction by the processing machine via sprocket wheels 12 provided on both sides in the width direction at regular intervals. Moreover, in each circuit pattern formation area starting with 10, 10a, an alignment mark is formed in advance. The alignment marks are formed in each circuit pattern formation area for positioning facing the wafer when mounting the wafer or positioning for mounting on a liquid crystal panel. This alignment mark is formed by printing in the same manner as the electrode pad 11; the formation position is formed with high accuracy, and the positional relationship with the electrode pad 11 is also formed with high accuracy in order to perform the above-mentioned positioning. -10-(8) (8) 200428001 In the first figure, '13a', 13b ', 13c and 13d are alignment marks formed in the circuit pattern forming area 10, and 1 3a, 1 3b are formed in a close state, 13c '13d is formed in a close state. 14a, 14b, 14c, and 14d are alignment marks for forming a circuit pattern forming area 10a; 14a, 14b are formed in a close state '; and 1 4c' 14d are formed in a close state. Among these alignment marks, 'any one or a pair becomes a mark used for positioning when mounting a wafer' and the other one or a pair becomes a mark used for positioning when mounted on a liquid crystal panel. Each of the alignment marks is formed into a shape such as a circle, a square, a cross, a U-shape, and the like, to determine which type of positioning to use. In this embodiment, the position adjustment of the belt 1 and the test device 2 is performed using these alignment marks. As shown in Fig. 2, the test device 2 is provided with a plurality of probes 21 which are in contact with the electrode pads 11 (test pads 16) of the circuit pattern formation area 10, respectively. The probe 21 is disposed in an approximately vertical state with respect to the test device 2, and directly becomes an electrode pad 11 (test pad 16) which contacts the tape 1 from the approximately vertical direction in the approximately vertical state. 3 and 4 show an example of the test device 2 used in this embodiment. A holder 22 including a plate made of a plurality of laminated insulating resins, and a plurality of receiving holes formed along the thickness direction of the holder 22, and a probe 21 is inserted into each receiving hole. The receiving holes 23 are formed in accordance with the tape 11 to be inspected, and in the tape such as TAB, the test pads for the electrode pads 11 are formed in a row. Therefore, the receiving holes 23 are also formed in a row. Fig. 5 shows an example of the arrangement of the test pads 15 formed in the TAB, and is formed in a rectangular shape. In addition, the plural tests -11-(9) (9) 200428001 are formed in three rows at approximately equal intervals in each column, and the probes 21 contact each of the test pads 16. Each test pad 16 has a connection pattern 16a, and is connected to an outer lead via the connection pattern 16a. As shown in FIG. 3, the probe 21 is provided with a small-diameter contact pin 2 1 a made of a conductive material protruding from the holder 22 and facing the tape 1, and is opposite to the contact pin 2 1 a A connection pin 21b made of a conductive material inserted laterally into the accommodation hole 23, and a spring 21c made of a conductive material inserted between them. The contact pins 21a protrude from the holder 22 and come into contact with the corresponding electrode pads 11, and use this contact to perform the electrical inspection of the electrode pads. Further, the portion on the side of the receiving hole 23 using the contact pin 21a has a large diameter 'so that the contact pin 21a can be withdrawn or inserted from the receiving hole 23, and the center of the lead 24 is prevented from being offset. An end portion 24a of a lead 24 made of an enamel wire or the like is inserted into the accommodation hole 23 and is in contact with the connection pin 21b. Accordingly, the lead 24 is in a state of being electrically connected to the contact pin 2 1 a via the connection pin 21 b and the spring 2 1 c. Further, in this embodiment, the end portion 24 of the lead 24 is crushed to have a structure for preventing the end portion 24 from falling off from the receiving hole 23. Such a test device 2 is one in which the probe 21 is arranged in a substantially vertical state and is in contact with the electrode pad 11 of the tape 1 from a substantially vertical direction, and is not limited to the one shown in the figure. For example, a structure in which the connecting pin 2 1 b is omitted and the spring 2 1 c directly contacts the end portion 24 a of the lead 24 may be made, or instead of the three parts of the contact pin 21 a, the connecting pin 21 b, and the spring 21 c, a single piece may be used. Needle-shaped bodies are also possible. The test device 2 is used in a state where the printed circuit board 3 is set. -12- (10) (10) 200428001 Inspection of the tape 1. On the back surface of the substrate 3 (the side away from the tape 1), a wiring portion 3a is patterned, and leads 2 from each probe 2 1 are soldered to the wiring portion 3a. The test probe of a tester (not shown) is in contact with the wiring portion 3 a by the test probe 4, and signals are transmitted and received between each probe 21 and a tester (not shown). In such a test device 2 ′ corresponding to the circuit pattern forming area of the belt 1 (for example, the mark confirmation holes 2 5, 2 6 of the alignment marks in the circuit pattern forming area 1 0 ′ 1 0a are formed in a state penetrating in the thickness direction (see section (2)) The ° mark confirmation holes 25 are the alignment marks 13a ', 13b, 13c', and 13d 'corresponding to the circuit pattern forming area W in the state shown in FIG. 1 by the four confirmation holes 25a' corresponding to these. 25b, 25c, 25d. Also, the "mark confirmation hole 26 is in the state shown in Fig. 1" corresponding to the alignment marks 14a, 14b, 14c of the circuit pattern forming area 10, i4d, corresponding to these The four confirmation holes 26a, 26b, 26c, and 26d are formed. During the inspection, the circuit pattern forming area successively becomes the position facing the test device 2 intermittently carrying the belt 1 '. Therefore, the circuit pattern forming area 1 is When moved to the position opposite to the test device 2, 'the four confirmation holes 25a, 25b, 25c' which become the mark confirmation holes 25, and the alignment marks 1 4a, 1 4b, 1 4c of the circuit pattern forming area 10a , 1 4d corresponds to the four of the mark confirmation holes 26 The confirmation holes 26 a, 26 b ′ 26 c ′ 26 d correspond to the alignment marks continuous to the circuit pattern formation area of the circuit pattern formation area 10 a. These mark confirmation holes 25 ′ 26 are formed according to the circuit pattern corresponding to the test device 2. The alignment mark in the field is used to adjust the relative position of the belt 1 and the test device 2. This adjustment is the corresponding alignment mark located in the mark -13- (11) (11) 200428001 The use of the change belt inside the recognition hole 1 and the relative position of the test device 2. That is, the alignment mark is visually recognized through the mark confirmation hole, and adjusted so that the alignment mark is located in the mark confirmation hole. To perform this adjustment, a camera 3 1 〇 camera 3 1 'Using a small camera such as a CCD camera, the camera 31 is movable in the XY direction orthogonal to the plane in a state of being located on the side opposite to the belt 1. The camera 31 is sandwiched between the belt 1 and the test device 2 In the state, the alignment mark is observed from the mark confirmation holes 25, 26. In this embodiment, the test device 2 is supported on the substrate 3 and can guide the light from the camera 31 to the mark confirmation holes 25, 2 The through-holes 3c used in 6 are formed on the substrate 3 so as to correspond to the mark confirmation holes 25 and 26. The inspection sequence of the tape 1 will be described below. In this embodiment, the two confirmation holes of the mark confirmation holes 25 and 26 are close to each other. That is, as shown in FIG. 2 and FIG. 4, in the mark confirmation hole 25, the confirmation hole 25b (25d) is opened with a large diameter on the side of the band 1, and the confirmation hole 25a is opened with a small diameter. (25c). Similarly, in the mark confirmation hole 26, the confirmation hole 26b (26d) is opened with a large diameter on the side of the belt 1, and the confirmation hole 26a (26c) is opened with a small diameter. In this embodiment, the alignment mark 13b (or / and the confirmation hole 13d) corresponding to the test device 10 is located in the confirmation hole 25b (or / and the confirmation hole 25d) opened with a large diameter by adjustment.俾 Perform a rough alignment of the belt 1 and the test device 2. In this alignment, because the field of view is wide, the alignment mark 1 3 b (or / and the alignment mark 1 3 d) can be easily found. After that, the corresponding alignment mark 13a is positioned within the confirmation hole 25a (or / and the confirmation hole 25c) ', which is opened in a small diameter, to adjust the fine alignment. -14- (12) (12) 200428001 By this position adjustment, the initial alignment of the belt 1 and the test device 2 is completed. After that, by making the i-type device 2 close to the belt 1, the probe 21 is brought into contact with the corresponding electrode pad 11 from about a vertical direction, so that the electrical inspection can be performed. Then, the alignment of the belt 1 and the test device 2 is completed, so that by moving the belt 1 using the sprocket 12, the lower-circuit pattern forming area 10a becomes a fixed position and can face the test device 2. Thereby, the probe 21 can be brought into contact with the electrode pad 11 in the same manner. Fig. 6 is an image showing the alignment marks inside the mark confirmation holes 25 and 26 during the above adjustment. In the same figure, 17 is an alignment mark, and 27 is a mark confirmation hole. When the alignment mark 17 is a polygon such as a square, the position of the mark confirmation hole 27 is adjusted as shown in Fig. 6 (a). When the alignment mark 丨 7 is L-shaped, mark the confirmation holes 2 7 as shown in Fig. 6 (b) to adjust the position of the holes. When the alignment mark 17 has a cross shape, as shown in FIG. 6 (c), the center of the cross is positioned at the center of the mark confirmation hole 27, and the position is adjusted. When the mark confirmation hole 17 is circular, as shown in FIG. 6 (d) (e), position adjustment is performed so as to coincide with the center of the mark confirmation hole 27, and the alignment marks of other shapes are used to perform the same The position can be adjusted by adjusting the position of the belt 1 and the test device 2. In such a position adjustment, since the relative position of the belt 1 and the test device 2 is adjusted by using the alignment mark formed on the belt 1 in advance, the position adjustment can be performed with high accuracy. Also, 'for the test device 2, it is only necessary to form the mark confirmation holes 25, 26' so that not only does not require complicated processing, nor does it need to install mirrors or auxiliary components such as the support bracket, and -15- ( 13) (13) 200428001 Can be a simple structure. The lead wire 24 connected to the plurality of probes 21 is pulled out from the back surface of the test device 2 as shown in Fig. 2 and can be directly connected to the back line portion 3a on the back surface of the substrate 3. Therefore, a substrate 3 having a simple structure with printed wiring on one side can be used, and it is not necessary to use a substrate with printed wiring on both sides, or a substrate formed with through-holes for connecting printed wiring on both sides, and a low-cost substrate can be produced. Further, in this embodiment, since the position adjustment is performed in two steps according to the large diameter and the small diameter, the alignment of the belt 1 and the test device 2 is performed in a short time and with excellent accuracy. Fig. 7 shows another embodiment of the present invention. In this embodiment, the mark confirmation hole 28 is a stepped hole. That is, the mark confirmation hole 28 has a structure in which the large-diameter hole 28a and the small-diameter hole 28b communicate with each other. The small-diameter hole 28b is located on the belt 1 side, and the large-diameter hole 28a is located on the camera 31 side. When the band 1 is TAB, the diameter R2 of the small-diameter hole 28b is set to 0.2 to 1.5 mm, and the diameter R1 of the large-diameter hole 28a is set to 1.5 to 5.0 mm. The length L of the small-diameter hole 28b is Set to 0.5 to 2.0mm, etc. In such a stepped hole, since the alignment mark of the tape 1 is viewed through the small-diameter hole 28b, adjustment with the alignment mark shown in Fig. 4 is performed through the small-diameter hole 28b. On the other hand, the light from the camera 31 is guided through the large-diameter hole 28a and observed. In this embodiment, since the large-diameter hole 28a is formed on the camera side, a sufficient amount of light can be guided into the mark confirmation hole 28. Therefore, the light can reach the alignment mark through the small-diameter hole 28b, and its observation can be surely performed. -16- (14) (14) 200428001 In the second figure, the confirmation holes 2 5 and 2 6 are marked with the confirmation holes 2 5 a '26a, which are the same stepped holes as in this embodiment, but other confirmations are made. The holes may be formed in the same manner. In the present invention, alignment of the belt 1 and the test device 2 can also be performed using the alignment marks in the area 10, 10a formed by using the circuit pattern adjacent to the inspection object and the ground next to be inspected. That is, the alignment marks 1 3 a, 1 3 b, 1 3 c, and 1 3 d corresponding to the circuit pattern forming area 10 are adjusted while being located within the confirmation holes 25 a, 25 b, 25 c, and 25 d of the mark confirmation hole 25. To adjust the alignment marks 14a, 14b, 14c, and 1 4 d corresponding to the circuit pattern forming area 10 a within the confirmation holes 2 6 a, 2 6 b, 2 6 c, 2 6 d of the mark confirmation hole 26 ο The positioning of the two adjacent circuit pattern forming areas 10 and 10a is separated by the alignment marks between the circuit pattern forming areas 10 and 10a, so that it can be adjusted with excellent accuracy. Moreover, in the present invention, the alignment mark is formed in advance at the diagonal positions facing each circuit pattern formation area, and the mark confirmation hole for observing the alignment mark at the diagonal position can be penetrated through the test device. At this time, the alignment mark of the diagonal position is observed through the mark confirmation hole of the diagonal position, and since the position adjustment of the belt 1 and the test device 2 is performed, the position adjustment of the isolated position is similarly performed. Therefore, it is also possible to perform adjustment with excellent accuracy. Fig. 8 shows the camera 31 side (lower side) of the test device 41 according to another embodiment of the present invention; the same components as those in Figs. 1 to 4 are attached with the same symbols to correspond. In this test device 41, the large-diameter holes 4 2 a, 4 2 b and the small-diameter holes 4 3 a, -17- (15) (15) 200428001 4 3 b are formed to penetrate through the thickness direction. The large-diameter holes 4 2 a ′ 4 2 b and the small-diameter holes 4 3 a, 4 3 b are formed outside the arrangement area of the probe 21 (that is, the arrangement area of the receiving hole 23). The large-diameter holes 4 2 a and 4 2 b are formed on a diagonal line; the small-diameter holes 4 3 a and 4 3 b are formed on a diagonal line crossing the diagonal line. The large-diameter holes 42a, 42b are formed to have a sufficiently large diameter as compared with the alignment mark 45 in the circuit pattern forming area of the tape 1. Therefore, the large-diameter hole 42a '4 2b can sufficiently enter the light passing through the camera 31. Thereby, the image processing of the camera 31 can be performed clearly. The small-diameter holes 4 3 a and 4 3 b are formed to have a diameter equal to or slightly larger than that of the alignment mark 45. The small-diameter holes 43a, 43b are locators for the belt 1. The alignment of the belt 1 and the test device 41 in this embodiment is performed by first aligning the alignment marks 45 of the belt 1 in the large-diameter holes 42a, 42b. By this alignment, the alignment mark 45 approximately coincides with the small-diameter holes 43a, 43b. Therefore, by aligning the small-diameter holes 4 3 a and 4 3 b as the circumscribed circle of the alignment mark 4 5, the positioning band 1 and the test device 41 can be correctly aligned. After this alignment, the belt 1 is intermittently transported so that the alignment marks 45 are located in the large-diameter holes 42a, 42b, and the belt 1 can be supplied in a state of being positioned with the test device 41, and the belt 1 can be continuously carried out. Electrical inspection. Fig. 9 shows the state of the capsule image processing when the positioning of the belt 1 is performed only through the small-diameter hole 43a. At this time, "the light from the small-diameter hole 43a is insufficient", so that a shadow 50 occurs, which is an error in image processing. The above embodiment 者 effectively prevents such day image processing errors. In addition, it is not necessary to arrange two large-diameter holes 42a, 42b and small-diameter holes 43a '43b, and it is sufficient to have one each of -18-(16) (16) 200428001. The present invention is not limited to the above embodiments, but various modifications can be made. For example, the test device 2 may be independently used for inspection without being mounted on the substrate 3. According to the inspection method of the present invention, adjustment is performed with reference to an alignment mark formed on a tape in advance, so that adjustment can be performed with excellent accuracy, and without changing a conventional processing machine, the electrode pad and the probe can be reliably contacted. The needle can be inspected with reliability. According to the test device of the present invention, a mark confirmation hole corresponding to an alignment mark formed in advance on the tape is formed, and the mark confirmation hole is used to adjust the position of the tape, so that the electrode pad and the probe can be reliably contacted. The inspection can be performed with high accuracy, and only the mark confirmation hole is penetrated, so that it is not necessary to perform other complicated processing or attachment of accessory parts, and can be made into a simple structure. [Brief Description of the Drawings] Fig. 1 is a perspective view showing an inspection state according to an embodiment of the present invention. Fig. 2 is a cross-sectional view showing an inspection object. Fig. 3 is a sectional view showing an example of the inside of the test device. FIG. 4 is a plan view showing an example of a test device. Fig. 5 is a plan view showing an example of a test pad. Figures 6 (a) to 6 (e) are bottom views showing the relationship between the alignment mark and the mark confirmation hole. -19- (17) 200428001 A sectional view of a mark confirmation hole according to the embodiment. An enlarged view of a processing error of a test apparatus according to another embodiment of the invention. Fig. 7 is a view showing the other Fig. 8 is a view showing the present Tsai. Fig. 9 shows an image. [Illustration of drawing numbers] 1 2, 41 3 10, 10a 11 12 13a to 13d, 14a to 14d, 1 16 16a 2 1 2 1a 2 1b 2 1c 22 23 24 24a Circuit board pattern with test device Formation area electrode pad key wheel 7, 45 alignment mark test pad connection pattern probe contact pin connection pin spring holder receiving hole lead end wiring portion -20- (18) 200428001 25, 25a 28a 28b 3 1 2 6 , 2 7, 2 8 mark confirmation holes j25d, 26a ~ 26d confirmation holes, 42a, 42b large diameter holes
，4 3 a，4 3 b 小徑孑L 攝影機 -21 -, 4 3 a, 4 3 b Small Path 孑 L Camera -21-