TW200420206A - Printed circuit board and manufacturing method thereof - Google Patents

Printed circuit board and manufacturing method thereof

Info

Publication number
TW200420206A
TW200420206A TW092130223A TW92130223A TW200420206A TW 200420206 A TW200420206 A TW 200420206A TW 092130223 A TW092130223 A TW 092130223A TW 92130223 A TW92130223 A TW 92130223A TW 200420206 A TW200420206 A TW 200420206A
Authority
TW
Taiwan
Prior art keywords
conductor
circuit board
printed circuit
insulating layer
manufacturing
Prior art date
Application number
TW092130223A
Other languages
Chinese (zh)
Other versions
TWI228022B (en
Inventor
Hiroyuki Mori
Yutaka Tsukada
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200420206A publication Critical patent/TW200420206A/en
Application granted granted Critical
Publication of TWI228022B publication Critical patent/TWI228022B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Abstract

To prevent occurrence of electrical connection failure between conductor layers that is caused by a difference in thermal expansion between an insulating layer and the conductor layer in a via hole of a printed circuit board. In a printed circuit board of the present invention, an area of a joining surface 18 between a first conductor 12 and a second conductor 15 at a bottom portion of a via is increased, and further, the second conductor 15 has a fringe (flange) region 21 joining a surface 20 of a second insulating layer 14 at an outer peripheral portion around an opening of the second insulating layer 14 at the bottom portion of the via. Therefore, the printed circuit board is stable against a tensile stress generated due to a difference in thermal expansion between the insulating layer and the conductor layer, and hence, failure in electrical connection between the conductor in the via does not occur.
TW092130223A 2002-11-07 2003-10-30 Printed circuit board and manufacturing method thereof TWI228022B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002324098A JP2004158703A (en) 2002-11-07 2002-11-07 Printed wiring board and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200420206A true TW200420206A (en) 2004-10-01
TWI228022B TWI228022B (en) 2005-02-11

Family

ID=32310434

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092130223A TWI228022B (en) 2002-11-07 2003-10-30 Printed circuit board and manufacturing method thereof

Country Status (7)

Country Link
JP (1) JP2004158703A (en)
KR (1) KR20050059246A (en)
CN (1) CN1706230A (en)
AU (1) AU2003277566A1 (en)
DE (1) DE10393589T5 (en)
TW (1) TWI228022B (en)
WO (1) WO2004043121A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006101134A1 (en) * 2005-03-24 2006-09-28 Ibiden Co., Ltd. Multi-layer printed circuit board
JP6383519B2 (en) * 2011-06-17 2018-08-29 住友ベークライト株式会社 Printed wiring board and manufacturing method
JP2016051756A (en) * 2014-08-29 2016-04-11 日本ゼオン株式会社 Multilayer printed wiring board and method of manufacturing the same
KR102450597B1 (en) * 2017-09-29 2022-10-07 삼성전기주식회사 Coil component and method for manufacturing the same
WO2024071007A1 (en) * 2022-09-30 2024-04-04 京セラ株式会社 Wiring board and circuit structure obtained using same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826330A (en) * 1995-12-28 1998-10-27 Hitachi Aic Inc. Method of manufacturing multilayer printed wiring board
JPH09283933A (en) * 1996-04-10 1997-10-31 Cmk Corp Printed wiring board
JP2000244127A (en) * 1998-12-24 2000-09-08 Ngk Spark Plug Co Ltd Wiring board and its manufacture

Also Published As

Publication number Publication date
DE10393589T5 (en) 2005-12-22
KR20050059246A (en) 2005-06-17
CN1706230A (en) 2005-12-07
TWI228022B (en) 2005-02-11
JP2004158703A (en) 2004-06-03
WO2004043121A1 (en) 2004-05-21
AU2003277566A1 (en) 2004-06-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees