AU2003277566A1 - Printed wiring board and process for producing the same - Google Patents
Printed wiring board and process for producing the sameInfo
- Publication number
- AU2003277566A1 AU2003277566A1 AU2003277566A AU2003277566A AU2003277566A1 AU 2003277566 A1 AU2003277566 A1 AU 2003277566A1 AU 2003277566 A AU2003277566 A AU 2003277566A AU 2003277566 A AU2003277566 A AU 2003277566A AU 2003277566 A1 AU2003277566 A1 AU 2003277566A1
- Authority
- AU
- Australia
- Prior art keywords
- producing
- same
- wiring board
- printed wiring
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-324098 | 2002-11-07 | ||
JP2002324098A JP2004158703A (en) | 2002-11-07 | 2002-11-07 | Printed wiring board and method for manufacturing the same |
PCT/JP2003/014126 WO2004043121A1 (en) | 2002-11-07 | 2003-11-05 | Printed wiring board and process for producing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003277566A1 true AU2003277566A1 (en) | 2004-06-07 |
Family
ID=32310434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003277566A Abandoned AU2003277566A1 (en) | 2002-11-07 | 2003-11-05 | Printed wiring board and process for producing the same |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP2004158703A (en) |
KR (1) | KR20050059246A (en) |
CN (1) | CN1706230A (en) |
AU (1) | AU2003277566A1 (en) |
DE (1) | DE10393589T5 (en) |
TW (1) | TWI228022B (en) |
WO (1) | WO2004043121A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006101134A1 (en) * | 2005-03-24 | 2006-09-28 | Ibiden Co., Ltd. | Multi-layer printed circuit board |
WO2012172792A1 (en) * | 2011-06-17 | 2012-12-20 | 住友ベークライト株式会社 | Printed wiring board and method for manufacturing same |
JP2016051756A (en) * | 2014-08-29 | 2016-04-11 | 日本ゼオン株式会社 | Multilayer printed wiring board and method of manufacturing the same |
KR102450597B1 (en) * | 2017-09-29 | 2022-10-07 | 삼성전기주식회사 | Coil component and method for manufacturing the same |
WO2024071007A1 (en) * | 2022-09-30 | 2024-04-04 | 京セラ株式会社 | Wiring board and circuit structure obtained using same |
WO2024090336A1 (en) * | 2022-10-28 | 2024-05-02 | 京セラ株式会社 | Wiring board and package structure using same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5826330A (en) * | 1995-12-28 | 1998-10-27 | Hitachi Aic Inc. | Method of manufacturing multilayer printed wiring board |
JPH09283933A (en) * | 1996-04-10 | 1997-10-31 | Cmk Corp | Printed wiring board |
JP2000244127A (en) * | 1998-12-24 | 2000-09-08 | Ngk Spark Plug Co Ltd | Wiring board and its manufacture |
-
2002
- 2002-11-07 JP JP2002324098A patent/JP2004158703A/en active Pending
-
2003
- 2003-10-30 TW TW092130223A patent/TWI228022B/en not_active IP Right Cessation
- 2003-11-05 CN CNA2003801016967A patent/CN1706230A/en active Pending
- 2003-11-05 AU AU2003277566A patent/AU2003277566A1/en not_active Abandoned
- 2003-11-05 DE DE10393589T patent/DE10393589T5/en not_active Withdrawn
- 2003-11-05 WO PCT/JP2003/014126 patent/WO2004043121A1/en active Application Filing
- 2003-11-05 KR KR1020057005970A patent/KR20050059246A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20050059246A (en) | 2005-06-17 |
DE10393589T5 (en) | 2005-12-22 |
CN1706230A (en) | 2005-12-07 |
TW200420206A (en) | 2004-10-01 |
WO2004043121A1 (en) | 2004-05-21 |
JP2004158703A (en) | 2004-06-03 |
TWI228022B (en) | 2005-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2003260274A1 (en) | Printed circuit board and method for producing the same | |
AU2003235219A1 (en) | Flexible printed circuit board and process for producing the same | |
EP1699279B8 (en) | Multilayer printed wiring board and method for producing the same | |
EP1109430A3 (en) | Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board | |
AU4316700A (en) | Sheet for printed wiring board, method of forming via, resin sheet having filledvia, printed wiring board and method of manufacturing the same | |
GB2401485B (en) | Multilayer wiring board and manufacture method thereof | |
AU2003234852A1 (en) | Conductive paste, multilayer board including the conductive paste and process for producing the same | |
AU2003211704A1 (en) | Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof | |
EP1542518A4 (en) | Board for printed wiring, printed wiring board, and method for manufacturing them | |
AU2003220241A1 (en) | Process and apparatus for manufacturing printed circuit boards | |
AU6731400A (en) | Wiring-connecting material and process for producing circuit board with the same | |
AU2003284573A1 (en) | Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board | |
AU2002215211A1 (en) | Liquid thermosetting resin composition, printed wiring boards and process for their production | |
AU2003252303A1 (en) | Electronic apparatus | |
AU2003236216A1 (en) | Fast production method for printed board | |
AU2003242008A1 (en) | Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device | |
AUPS289402A0 (en) | Composite board and process for making the board | |
EP1168899A4 (en) | Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same | |
AU2003272831A1 (en) | Circuit board threadplate | |
EP1739739A4 (en) | Through wiring board and method for producing the same | |
AU2003254848A1 (en) | Multilayer printed wiring board and production method therefor | |
AU2002353536A1 (en) | Photosensitive composition and production processes for photosensitive film and printed wiring board | |
AU2003221057A1 (en) | Material for electronic device and process for producing the same | |
AU2003235965A1 (en) | Electronic apparatus | |
AU2003270225A1 (en) | Method for the production of rigid/flexible circuit boards and circuit board with at least one rigid region and at least one flexible region |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |