TW200408027A - Wafer detecting means and method used for single-wafer machine - Google Patents

Abstract

The present invention relates to a wafer detecting means and method used for single-wafer machine of semiconductor equipment. We can know whether the wafer is shift, broken or any errors happened by using the lift pins with the piezoelectric or dielectric means in process chamber to detect the weight difference of the wafer before the process and after the process. It includes a stage with the lift pins that lift the wafer; a weight detecting means installed in or on lift pins to detect the weight of the wafer; a signal transfer means couple to the weight detecting means for transferring the weight signal of the wafer; and a system control means couple to the signal transfer means to deal with the weight signal and determine whether any errors are happened.

Description

200408027 V. Description of the invention (1) 5- 1 Field of the invention: The present invention relates to a wafer detection device for a single-chip machine in a semiconductor device, in particular to a lifting and ejecting pin (1) capable of lifting and lowering a wafer in a process reaction chamber. iftpi η) is a wafer detection device that is equipped with a piezoelectric or capacitive conversion device to measure the weight change of the wafer before and after the process, and to determine whether the wafer has a displacement, a chip, or an abnormality in the reaction process. 5-2 Background of the Invention: In order to respond to various different process methods, there are quite a variety of semiconductor equipment. In terms of hardware equipment, it can be roughly divided into furnace tube equipment, ion cloth value equipment, yellow light exposure equipment, and yellow light development. Equipment, wet etching equipment, dry etching equipment, metal sputtering equipment, thin film deposition equipment, chemical machine grinding equipment and various measuring equipment. Among them, the dry and residual etching equipment, metal deposits and mineral deposit equipment and some thin film deposition equipment are mostly single-wafer process machines. The characteristic of the single-chip machine process is that when a process reaction is performed in each process reaction chamber, there is only one wafer in the single-process reaction chamber. As shown in the first figure, the current single-chip machine generally includes a plurality of process reaction chambers 11. When the robotic arm 12 grabs a wafer from the wafer boat and transfers it to the transfer chamber 13 each time, it is located at Laser finder above the machine 1 4

2,00408027 5. Description of the invention (2) It will detect whether the wafer is successfully grasped. A laser detector 14 is installed on the top of the transfer chamber 13 in front of the Youying chamber 11 and the boat placement chamber 15 for each process to detect whether the chip is in the designated position. As we can see from the first picture, this single-chip machine has two process reaction chambers 11 and two wafer boat placement chambers 15, so a total of four laser detectors are installed above the transfer chamber 13 1 4. The simple detection diagram of the laser detector is shown in the second figure. The laser detector 7 emits a laser light source 2 when the laser light source 2 1 hits the wafer 2 2 'a reflective light source 2 3 will be generated and received by the laser detector, so the price Testing device, the machine can know whether the chip is already in the designated position. Because the current single-chip machine has a wafer detection device located only in the transmission chamber, and in the process reaction chamber 11, because the process reaction is often in an environment of high temperature, air pressure, high voltage, and full of chemicals, the process reaction chamber, 4 Unable to shake the laser detector. Please refer to the third figure, because 1 is the relationship between the south temperature and the voltage during the process reaction. After the process is completed, the edge of the wafer is occasionally attached to the machine bearing platform (pedesta 1) 3 1. At this time, three lifts T When the pin 32 is lifted, the wafer 22 will be in a skewed state. When the robotic arm breaks 2 and stretches 2 the reaction chamber 11 grabs the wafer 22 on the same day, the crystal 22 will be hit and become a process reaction chamber. At this time, the machine * + ~ 2 days, causing a huge loss of capacity. Or the internal stress caused by the τ machine maintenance film due to the process sinking is too large, which causes the chip to break during the process, or after the machine plating is finished However, because the machine does not know the wafer p or the process arm, the broken wafer is still placed in the wafer boat. If it is broken, the machine and the wafer are 200408027. 5. The description of the invention (3) is known, so it will greatly affect the process. The contamination of other wafer particles in the good boat is not contaminated, resulting in a huge loss for the company. 5-3 Purpose and Summary of the Invention: In the context of the above-mentioned invention, the conventional single-chip machine cannot know that the wafer in the process reaction chamber has shifted, causing machine When the arm reaches the process reaction chamber and breaks the wafer, the process reaction chamber particles are contaminated, or the wafer has broken. The robotic arm still puts the broken wafer into the wafer boat, causing a lot of contamination of the wafer and other wafer particles in the wafer boat. Disadvantages, the present invention provides a wafer detection device and method to avoid the above-mentioned situation. An object of the present invention is to provide a wafer positioning detection device and method, which can detect whether the wafer is displaced or broken by detecting the weight of the wafer. Another object of the present invention is to provide a process detection device and method, which determine whether the readout reaction process is abnormal by detecting the weight change of the wafer before and after the process. Another object of the present invention is to provide an applicable Wafer detection device in the reaction chamber of a single-chip machine.

200408027 5. Description of the invention (4) According to the above-mentioned object, the present invention provides a wafer positioning detection device for a semiconductor device, including: a platform; a movable support device installed in the platform to support the wafer ; Weight detection device, which is installed on the _movable support device to detect the weight of the chip; signal transmission device, electrically connected to the weight detection device, to send out the weight signal of the chip; the system "control unit, electrical It is connected to the signal transmission device for processing the weight signal of the chip to judge whether the chip is shifted or broken. According to the above concept, the movable support device includes a plurality of lifting and ejecting pins. According to the above concept, the plurality of lifting and ejecting pins are located inside the platform. Or the edge. ^ According to the above concept, the top of the lifting and ejecting pin includes a pressured tip, and the chip is placed on the pressured tip, and the lower part is connected to the weight detection device. According to the above concept, the weight detection device is located in a plurality of Lift the top or bottom of the thimble. According to the above concept, the weight detection device includes Electrical transducer or a piezoelectric transducer. The above-described object, the present invention provides a semiconductor device

200408027 Fifth, the process detection device of the invention description (5) includes: a platform; a mobile support device installed in the platform to support the chip; a weight detection device installed on the mobile support device. To detect the weight of the chip; the signal transmission device is electrically connected to the weight detection device to send the first chip weight signal before the process and the second chip weight signal after the process; the system control unit, electrical Connected to the signal transmission device, it is used to process the first and second chip weight signals to determine whether the chip has an abnormality in the manufacturing process. According to the above-mentioned concept, wherein the movable supporting device comprises a plurality of lifting and ejecting pins, according to the above-mentioned concept, wherein the plurality of lifting and ejecting pins are located inside or at the edge of the platform. According to the above-mentioned concept, the tip of the lifting and ejecting pin includes a pressured tip, the chip is placed on the pressured tip, and the lower part is connected to the weight detection device. According to the above concept, the weight detecting device is located on the top or bottom of the plurality of lifting and ejecting pins. According to the above-mentioned concept, the weight detection device includes a capacitance converter or a piezoelectric converter. According to the above-mentioned object, the present invention provides a semiconductor device

200408027 5. The wafer positioning detection method of the invention description (6) includes the following steps: placing the wafer on the movable frost supporting device; detecting the weight of the wafer, and installing the movable supporting device by the weight detecting device; The chip weight signal is sent, and it is electrically connected to the weight detection device through the signal transmission device; the chip weight signal is processed, and it is electrically connected to the signal transmission device through the system control unit; and it is judged whether the chip W is shifted or broken. According to the above concept, the movable supporting device includes a plurality of lifting and lowering pins. According to the above concept, the top of the lifting and ejecting pin includes a pressured tip, the chip is placed on the pressured tip, and the lower part is connected to the weight detection device. ^ According to the above concept, the weight detecting device is located on the top or bottom of a plurality of lifting and ejecting pins. According to the above-mentioned concept, the weight detection device includes a capacitance converter or a piezoelectric converter. According to the above-mentioned object, the present invention provides a method for detecting a wafer process of a semiconductor device, which includes the following steps: placing a wafer on a movable supporting device; detecting the weight of the wafer; On the mobile support device; sending the first chip weight signal, which is electrically connected to the weight detection device through the signal transmission device; performing a preset process; detecting

Page 10, 200,408,027 5. Description of the invention (7) The weight of the chip is measured by the weight detection device; the second chip weight signal is sent by the signal transmission device; the first and second chip weight signals are processed by the system control Unit, which is electrically connected to the signal transmission device; determines whether an abnormality occurs in the chip during the manufacturing process. According to the above concept, the movable supporting device includes a plurality of lifting and lowering pins. According to the above-mentioned concept, the tip of the lifting and ejecting pin includes a pressured tip, the chip is placed on the pressured tip, and the lower part is connected to the weight detection device. According to the above concept, the weight detecting device is located on the top or bottom of the plurality of lifting and ejecting pins. According to the above-mentioned concept, the weight detection device includes a capacitance converter or a piezoelectric converter. In order to make the above description and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments are described in detail below in conjunction with the accompanying drawings. 5-4 Invention Details:

200408027 V. Description of the invention (8) This: Month Revealing the Road-A type of reaction chamber using a detection single-k chip before the process is carried out, a shovel, Jia-α soil mouth. ^ ^ Rules and I The weight changes, and it is judged whether there is any displacement, fragmentation, or process. J. Japanese and Japanese film & 6 "hanging Japanese and Japanese film detection device. ::: 日 = Embodiment of the present invention 'Please refer to the fourth A Figures ~ D: Top view of the fourth process reaction chamber U with reference to the fourth A chart and the fifth process chart. The fourth picture A is the second dagger, white is the single bearing, the inner platform of the bearing platform 3 1 is eight thimbles 3 2 are located on the side of the machine bearing platform 31 &

i:; Guide: ί'ί: These two designs of lifting and ejecting pins with 32 positions are currently used by manufacturers of V-body early wafer equipment in Malaysia, and A illustrates the implementation process of the present invention.乂 For the fourth A ~ D pictures, please refer to the placement of the human crystal boat. Please keep t 〇rr '. At this time, the upper part of the robotic wafer will be detected before the crystal is transferred. Previously, this laser was annoying | J At the confirmation machine; the first picture and the 15th chamber, the crystal was pumped to the crystal boat transmission room 1 3 and the arm 12 extended into the crystal transmission room 1 3 at the same time. After the capture room 1 3, when the aircraft is located on the wheel transfer device 14 will detect the arm 12 there are: A ~ D pictures, when the wafer boat with the wafer is placed: the door of the storage room 15 is closed and The vacuum degree at the beginning of the pumping chamber 15 reaches about 10-5 to 10-6 and the door at the junction of the boat placement chamber 15 will be opened, and the wafer in the boat placement chamber 15 will be grasped. The laser detector 14 is placed near the wafer placement room in the transmission room 1 3, and the laser detector 14 will enter the transmission room 1 3. After confirming that the wafer has been moved by the robotic arm 12 and then moving the wafer to the process reaction chamber 13 near the process reaction chamber, check whether there is a wafer on the robotic arm 12.曰 后 片 后 ’process reaction chamber 1 ； [的 门 就 打打

200408027 V. Description of the invention (9) On 'is located in the machine shaft and rises 3 1. Then the robot lifts the center position of the ejector pin 32. When the pressured tip on 3 2 is below the pressured tip 4 2 The pressured tip 4 2 is pressed down The piezoelectric transducer or top or bottom. The signal on this transmission line is 4-5. When the system control pressure or the weight of the wafer is lowered, the center pin of the pin 3 is displaced or the fragment is not displaced. The crystals will be put on the tablet, and the capacity will be transferred according to the amount of pressure on the surface. When the connection is turned on, the 4 will transfer the capacity of the computer, and then the position. Epistar is converted into a new one. After 5 minutes, it is learned to judge the platform to send the position of the rear or side into the center of gravity. The weight of the lifting plate should be changed to the pressure of the device or set. 4 3 It can be converted by electric power or electric power. The calculation is that the broken wafer of the wafer will issue three lifts for the continuous operation edge. It will be south of the robotic vehicle by the reaction chamber 1 1. When it is on the second report of the ejector pin 32, it will be pressed down or capacitively converted | capacitance value ' It should be noted that the installation of the lifting device or the transfer of capacitance value to the system, from the two lifts, you can get the warning message of whether the center of gravity of each lift is shifted or broken, and stop Dingbei 3 2 will accept the platform rose in three lifts Collar 3 2 Elevating Pin At the time position 4 3 it will be noticed that the replacement of the ejector pin 3 2 controls the electrical system of the ejector pin 3 2 and the ejection of the wafer by the ejector pin 3 2. If the crystal stops moving, it will be flattened until its top position is lower than the machine shaft. After the process is completed, the three pieces should be removed from the machine bearing platform 31. Here, π ± 2 rises again, and the top 42 of the chip, the piezoelectric conversion fruit is set to the day, and the pressure tips on the three lifting and ejecting pins are rotated as described above: device 43 and the message; the transmission line " This is called an action, and finally the pressure or capacitance value is transmitted to

200408027 V. Description of the invention (10) The system control computer 45 and the system control computer 4 5 respectively receive the pressure or capacitance value j transmitted from the white lifting needle 32 2 through calculation. The weight of the wafer being carried further determines whether the center of gravity of the wafer is still at the center position j of the two wafer lifting and ejecting pins 32 to determine whether the wafer is displaced or broken during the reaction process. If the wafer is moved or broken, the machine will send out a warning message. The robot arm 12 also stops entering the process reaction chamber 11 to grab the wafer. This can prevent the wafer from being broken or the robot arm 1 2 will still put the broken wafer. Problems in entering the boat. On the other hand, the system control computer 4 5 can also judge whether the wafer increases or decreases the preset weight after the process according to the data before and after the process. It can be used to determine whether the process is abnormal. (1) If the weight difference exceeds the allowable range, 5 machines can also send a notification message) Inform 1 that the engraving or deposition process is abnormal Decided that, for example, when a 1 engraving process is performed, the wafer weight will be reduced by 5 after the process is completed, but if thin film sputtering is performed Deposition process> The wafer weight will increase after the completion of the process. In summary, the wafer detection device disclosed by the present invention can detect whether the wafer is displaced or broken, and whether the reaction process is abnormal. For single-chip machines In other words, this detection device can be installed in the process reaction chamber to detect whether the chip is displaced or broken in real time, or to determine whether the process of the wafer in the process reaction chamber is abnormal based on the variation of the measured data.

Page 14 200408027 5. Description of the invention (11) Even though the present invention is described by citing several preferred embodiments, the present invention is not limited to the listed embodiments. Although specific examples have been cited and described previously, it is obvious that other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the scope of patent application of the present invention. In addition, all other similar and approximate changes or modifications made without departing from the spirit disclosed by the present invention are also included in the scope of patent application of the present invention. At the same time, the scope of the present invention should be construed in the broadest definition so as to encompass all modifications and similar structures.

Page 15 200408027 Brief description of the diagram Brief description of the diagram: The first diagram shows the top view of the single-chip machine; the second picture does not show the intention of detecting the laser debt, the third picture shows It shows the unintentionalness of the lifting pin when the one end of the wafer is stuck to the bearing platform of the machine. Figure 4A shows the top view of the process reaction chamber; Figure 4B shows the lifting pin and its connecting rod. The fourth diagram C shows a device structure diagram of a preferred embodiment of the present invention; the fourth diagram D shows a device structure diagram of another preferred embodiment of the present invention; and the fifth The figure shows a top view of a reaction chamber in another process. Explanation of symbols: 1 1: process reaction chamber 1 2: robot arm 1 3: transmission chamber 1 4: laser detector 1 5: boat placement chamber 2 P · laser light source 2 2 · chip 2 3: Reflected light source 3 1: Machine bearing platform 3 2: Lifting thimble

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Claims (1)

200408027 6. Scope of patent application Patent scope: I A wafer positioning detection device for semiconductor equipment, including: a platform; a movable support device installed in the platform to support a chip; a weight detection device It is installed on the movable support device to detect the weight of the chip; a signal transmission device is electrically connected to the weight detection device to send a chip weight signal; a system control unit, electrical Connected to the signal transmission device and used to process the chip weight signal to determine whether the chip is shifted and broken. 2. The wafer positioning detection device according to item 1 of the scope of patent application, wherein the movable supporting device includes a plurality of lifting and ejecting pins. 3. The wafer positioning detection device according to item 2 of the scope of patent application, wherein the plurality of lifting and ejecting pins are located inside the platform. 4. The wafer positioning detection device according to item 2 of the patent application scope, wherein the plurality of lifting and ejecting pins are located at the edge of the platform. 5. The wafer positioning detection device according to item 2 of the scope of patent application, wherein the tip of the lifting ejector pin includes a pressured tip, and the wafer is placed on the receiver Page 18 200408027 6. Scope of patent application The pressure tip is connected to the weight detection device below. 6 · The wafer positioning detection device according to item 2 of the patent application scope, wherein the weight detection device is located on top of the plurality of lifting and ejecting pins. 7 · The wafer positioning detection device according to item 2 of the patent application scope, wherein the weight detection device is located at the bottom of the plurality of lifting and ejecting pins. 8. The wafer positioning detection device according to item 1 of the scope of patent application, wherein the weight detection device includes a capacitor-capacitor converter. 9. The wafer positioning detection device according to item 1 of the patent application scope, wherein the weight detection device includes a piezoelectric converter. 10. The wafer positioning detection device according to item 1 of the scope of patent application, wherein the wafer positioning detection device is a single-chip machine for semiconductor equipment. 1 1. A process detection device for a semiconductor device, comprising: a platform; a movable support device installed in the platform to support a chip; a weight detection device installed in the movable support device Is used to detect the reset of the chip, a signal transmission device is electrically connected to the weight detection device for Page 19, 200,408,027 6. The scope of the patent application is for one system: send out a first-a system to deal with the first process. 1 2. If you apply for & dynamic support equipment, U · If you apply for multiple lifts l4 · If you apply for Plural root lifting% 15 · If applying for 'lower I needle' on the end, its 16 · If applying for ®Amount detecting device 17 · If applying for * Amount detecting device The weight signal is set to send a first chip and a second chip weight signal before the good; a control unit is electrically connected to the signal transmission wheel and the first chip weight signal to determine whether the chip is abnormal. The process described in item 11 of the patent scope includes a plurality of lifting and ejecting pins. ′ Wherein the process detection device described in item 12 of the patent scope, the ejector pin is located inside the platform. Among them, the process detection device described in item 12 of the patent scope. The thimble is located at the edge of the platform. ′ The process detection device described in item 12 of the patent scope includes a pressured tip at the top, and the chip is placed ′ where the lower part is connected to the weight detection device. Placed in the process detection described in item 12 of the pressured patent range | Placement is in item 1 of the plurality of lifting thimbles; where the process detection described in item 12 of the patent range is sufficient | placement system is in the plural The bottom of the lifting thimble ^ set '200408027 6. The scope of patent application 18. The process detection device 1 described in item 11 of the patent scope, wherein the weight detection device includes a capacitor-capacitor converter. 19. The process detection device described in item 11 of the patent scope, The measuring device Ϊ wherein the weight detecting device includes a piezoelectric converter. 20. The process detecting device described in item 11 of the patent / r / T Kuoweiwei 5 where the process detecting device is used for semiconductor equipment Single-chip machine 〇21. A semiconductor device wafer positioning detection method includes; placing-the wafer on a movable support device J to detect the weight of the wafer, by a weight detection device, which is installed in the activity A weight signal is sent from the supporting device, and a signal transmission device is electrically connected to the weight detecting device to process the crystal. Weight signal, through a system control unit 5 which is electrically connected to the signal transmission device > to determine whether the chip is shifted and broken 0 22. The method for chip positioning detection as described in item 21 of the patent scope) The movable support device includes a plurality of lifting thimbles. 0 23 · The chip positioning detection method described in item 22 of the patent scope 5 Page 21 200408027 6. In the scope of patent application, the top of the lifting and ejecting pin includes a pressured tip. The chip is placed on the pressure tip, and the lower part is connected to the weight detection device. 4 · The wafer positioning detection method as described in item 22 of the patent application range, wherein the weight detection device is located on top of the plurality of lifting and ejecting pins. 25. The wafer positioning detection method according to item 22 of the scope of patent application, wherein the weight detection device is located at the bottom of the plurality of lifting and ejecting pins. 26. The chip positioning detection method as described in item 21 of the scope of patent application, wherein the weight detection device includes a capacitance converter. 27. The wafer positioning detection method according to item 21 of the patent application scope, wherein the weight detection device includes a piezoelectric transducer. 2 8. —A process detection method for a semiconductor device, comprising: placing a chip on a movable supporting device; detecting the weight of the chip, and installing the chip on the movable supporting device by a weight detecting device; Send a first chip weight signal, which is electrically connected to the weight detection device through a signal transmission device; perform a preset process on the chip; detect the weight of the chip, and use the weight detection device; Sending a second chip weight signal through the one signal transmission device; Page 22 200408027 6. Scope of patent application The first and second chip weight signals are processed, and a system control unit is electrically connected to the signal transmission device; it is determined whether the chip has an abnormality in the process. 29. The method for detecting a process according to item 28 of the scope of patent application, wherein the movable supporting device includes a plurality of lifting and ejecting pins. 30. The process detection method as described in item 29 of the scope of the patent application, wherein the top of the lifting ejector pin includes a pressured tip, the chip is placed on the pressured tip, and the lower part is connected to the weight detection Device. 3 1. The process detection method according to item 29 of the scope of patent application, wherein the weight detection device is located on top of the plurality of lifting and ejecting pins. 32. The process detection method as described in item 29 of the scope of patent application, wherein the weight detection device is located at the bottom of the plurality of lifting and ejecting pins. 33. The method for detecting a process according to item 29 of the scope of patent application, wherein the weight detecting device includes a capacitor-capacitor converter. 34. The method for detecting a process according to item 29 of the scope of patent application, wherein the weight detecting device includes a piezoelectric transducer. Page 23