CN108288600A - Wafer susceptor and ion implantation device - Google Patents
Wafer susceptor and ion implantation device Download PDFInfo
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- CN108288600A CN108288600A CN201810076040.2A CN201810076040A CN108288600A CN 108288600 A CN108288600 A CN 108288600A CN 201810076040 A CN201810076040 A CN 201810076040A CN 108288600 A CN108288600 A CN 108288600A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of wafer susceptor and ion implantation device, the wafer susceptor include：Wafer carrier, the wafer carrier have multiple mounting holes；Multiple detection needles, it is respectively arranged in each mounting hole and can be moved up and down perpendicular to the direction on the wafer carrier surface, under no wafer state, the first end of the detection needle is higher than the surface of the wafer carrier, in the case where there is wafer state, the detection needle is moved down by wafer compressing；Displacement sensor couples with the multiple detection needle, and distance is moved down suitable for detecting the multiple detection needle in the case where there is wafer state, when at least one detection needle is when moving down distance and being less than predetermined threshold value, determines that the wafer position is abnormal.The present invention program can improve the accuracy of the semiconductor equipment where wafer susceptor and the quality of product.
Description
Technical field
The present invention relates to field of semiconductor devices, more particularly, to a kind of wafer susceptor and ion implantation device.
Background technology
In existing a variety of semiconductor equipments, it is required to that pending wafer is fixed by wafer susceptor, in turn
Process is carried out to the wafer.Such as in ion implanting (Implant, IMP) equipment or physical vapor deposition
In (Physical Vapor Deposition, PVD) equipment.
Specifically, in the injection technology of existing IMP, ion beam is mapped to after the surface of wafer, by solid material
The resistance of material and speed slowly lowers, and eventually settle in wafer, to complete ion implanting.
In the sputtering technology of existing PVD, usually under vacuum, using low-voltage, the arc discharge of high current
Technology makes energetic particle hits have the target solid plate of high-purity, original is knocked out according to physical process using gas discharge
Son, and make the atomic deposition being knocked out on wafer.
However, there are particulate matters between wafer susceptor and wafer, so that one end of wafer is tilted causes the wafer to occur
When inclination, IMP equipment or PVD equipment are then difficult to detect, and cause to influence the implant angle of IMP and the sputtering angle of PVD,
Influence especially to 0 ° of injection of IMP is particularly evident, and yield abnormal even wafer loss is caused when serious.
There is an urgent need for a kind of detection jigs of the wafer position of wafer susceptor exception, and being tilted to one end of wafer causes the wafer to be sent out
Raw the case where tilting, is effectively detected.
Invention content
The technical problem to be solved by the present invention is to provide a kind of wafer susceptor and ion implantation devices, can improve wafer susceptor
The accuracy of the semiconductor equipment at place and the quality of product.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of wafer susceptor, including：Wafer carrier, the crystalline substance
Circle microscope carrier has multiple mounting holes；Multiple detection needles, are respectively arranged in each mounting hole and can be perpendicular to the wafer
The direction on platform surface moves up and down, and under no wafer state, the first end of the detection needle is higher than the surface of the wafer carrier,
In the case where there is wafer state, the detection needle is moved down by wafer compressing；Displacement sensor couples with the multiple detection needle, is suitable for
That the multiple detection needle is detected in the case where there is wafer state moves down distance, and distance is moved down less than default when at least one detection needle
When threshold value, determine that the wafer position is abnormal.
Optionally, institute's displacement sensors include：Multiple detection components, each detection components include the first conduct piece and the
Two conduct pieces, wherein in each detection components, first conduct piece, which is coupled to, is fixed on the second of corresponding detection needle
End, second conduct piece and the first conduct piece are at a distance of the predetermined threshold value, in the case where there is wafer state, first conduct piece with
The detection needle is moved to second conduct piece；Input terminal and output end, the input terminal, multiple detection components and institute
It states output end and forms series loop, in the multiple detection components, the first conduct piece and the input of first detection components
End electrical connection, the first conduct piece of latter detection components are electrically connected with the second conduct piece of previous detection components, the last one inspection
The second conduct piece for surveying component is electrically connected with the output end；Device is detected, suitable in the case where there is wafer state, detecting the series connection
Whether circuit is connected, and when the series loop is to disconnect, determines that the wafer position is abnormal.
Optionally, the predetermined threshold value be the surface of the wafer carrier without particulate matter when, the detection needle is from no wafer
State is to the displacement distance for having wafer state.
Optionally, detection voltage is applied between the input terminal and output end, the detection device includes voltage detecting
Device, the voltage detection device are adapted to detect for the electricity of the tie point between each adjacent two detection components in the series loop
Pressure；When any testing result of the voltage detection device is zero, the voltage detection device determines the wafer position hair
It is raw abnormal.
Optionally, detection voltage is applied between the input terminal and output end, the detection device includes current detecting
Device；When it is zero that the testing result of the current sensing device, which is electric current in the series loop, the current detector
Part determines that the wafer position is abnormal.
Optionally, the detection components further include：Elastomeric element, the elastomeric element are set to the first conduct piece and second
Between conduct piece.
Optionally, first conduct piece has the conductive protrusion stretched out towards the second conduct piece and/or the second conduction
Part has the conductive protrusion stretched out towards the first conduct piece.
Optionally, the multiple mounting hole is distributed in the different location of the wafer carrier.
Optionally, the wafer carrier is electrostatic chuck formula microscope carrier.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of ion implantation device, including above-mentioned wafer base
Seat.
Compared with prior art, the technical solution of the embodiment of the present invention has the advantages that：
In embodiments of the present invention, the wafer susceptor includes：Wafer carrier, the wafer carrier have multiple installations
Hole；Multiple detection needles are respectively arranged in each mounting hole and can be moved down on the direction perpendicular to the wafer carrier surface
Dynamic, under no wafer state, the first end of the detection needle is higher than the surface of the wafer carrier, in the case where there is wafer state, institute
Detection needle is stated to be moved down by wafer compressing；Displacement sensor is coupled with the multiple detection needle, suitable for being detected in the case where there is wafer state
The multiple detection needle moves down distance, detects when moving down distance less than predetermined threshold value of needle when at least one, determines the crystalline substance
Circle position is abnormal.Using the above scheme, the detection needle moved down can be oppressed by wafer by being arranged in the case where there is wafer state, and
The distance that moves down for detecting needle is detected using displacement sensor, when the distance that moves down of at least one detection needle is less than default threshold
When value, it may be determined that the wafer of the corresponding position of detection needle tilts, to effectively to wafer tilt the case where carry out
Detection, helps to improve the accuracy of the semiconductor equipment where wafer susceptor and the quality of product.
Further, include the series loop that detection components, input terminal and output end are formed by the way that displacement sensor is arranged,
And in the case where there is wafer state, the first conduct piece of the detection components is moved with detection needle to the second conduct piece, can be in crystalline substance
When the non-run-off the straight of circle, the first conduct piece of each detection components is contacted with the second conduct piece, realizes the conducting of series loop；
When wafer run-off the straight, the first conduct piece that wafer tilts the detection components of side is not contacted with the second conduct piece, realizes series connection
The disconnection in circuit, and then according to detecting whether the series loop is connected, determine whether the wafer position is abnormal.Using
The scheme of the embodiment of the present invention, can further to wafer tilt the case where effectively detected, to improve wafer susceptor institute
Semiconductor equipment accuracy and product quality.
Further, there is elastomeric element between the first conduct piece and the second conduct piece of the detection components.In the present invention
It, can be from when having wafer state to no wafer state, effectively by using the detection components with elastomeric element in embodiment
The returning quickly for realizing the first conduct piece and the second conduct piece further increases the accurate of the semiconductor equipment where wafer susceptor
The quality of property and product.
Further, first conduct piece has the conductive protrusion stretched out towards the second conduct piece and/or the second conduction
Part has the conductive protrusion stretched out towards the first conduct piece.It in embodiments of the present invention, can be effective by conductive protrusion
The connection of the first conduct piece and the second conduct piece is realized on ground, further increases the accuracy of the semiconductor equipment where wafer susceptor
And the quality of product.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of wafer susceptor in the prior art；
Fig. 2 is a kind of structural schematic diagram of wafer susceptor in the embodiment of the present invention；
Fig. 3 is structural schematic diagram of another wafer susceptor under no wafer state in the embodiment of the present invention；
Fig. 4 is structure of another wafer susceptor when under having wafer state and surface is without particulate matter in the embodiment of the present invention
Schematic diagram；
Fig. 5 be in the embodiment of the present invention another wafer susceptor in the structure under having wafer state and when there is particulate matter on surface
Schematic diagram；
Fig. 6 is a kind of structural schematic diagram of detection components in the embodiment of the present invention.
Specific implementation mode
In existing a variety of semiconductor equipments, it is required to that pending wafer is fixed by wafer susceptor, in turn
Process is carried out to the wafer.
Referring to Fig.1, Fig. 1 is that a kind of structural schematic diagram of wafer susceptor, the wafer susceptor 10 include using in the prior art
In the wafer carrier 100 of carrying wafer 110.
In part semiconductor equipment, the wafer carrier 100 is that electrostatic chuck formula microscope carrier namely wafer susceptor 10 may be used also
To include electrostatic chuck 101, to which according to electrostatic absorption principle, wafer 110 is adsorbed on crystalline substance by the suction generated using electrostatic charge
The surface of circle microscope carrier 100.Wherein, the electrostatic chuck 101 may include for the power supply of power supply and for conductive electrode.
It was found by the inventors of the present invention that in the prior art, when there are particles between wafer carrier 100 and wafer 110
Object 112, when so that one end of wafer 110 is tilted leads to 110 run-off the straight of wafer, existing semiconductor equipment, which then lacks, to detect
The means that the wafer position is abnormal, and then manufacturing process is had an impact, yield abnormal even wafer report is caused when serious
It is useless.
In embodiments of the present invention, the wafer susceptor includes：Wafer carrier, the wafer carrier have multiple installations
Hole；Multiple detection needles are respectively arranged in each mounting hole and can be moved down on the direction perpendicular to the wafer carrier surface
Dynamic, under no wafer state, the first end of the detection needle is higher than the surface of the wafer carrier, in the case where there is wafer state, institute
Detection needle is stated to be moved down by wafer compressing；Displacement sensor is coupled with the multiple detection needle, suitable for being detected in the case where there is wafer state
The multiple detection needle moves down distance, detects when moving down distance less than predetermined threshold value of needle when at least one, determines the crystalline substance
Circle position is abnormal.Using the above scheme, the detection needle moved down can be oppressed by wafer by being arranged in the case where there is wafer state, and
The distance that moves down for detecting needle is detected using displacement sensor, when the distance that moves down of at least one detection needle is less than default threshold
When value, it may be determined that the wafer of the corresponding position of detection needle tilts, to effectively to wafer tilt the case where carry out
Detection, helps to improve the accuracy of the semiconductor equipment where wafer susceptor and the quality of product.
It is understandable to enable above-mentioned purpose, feature and the advantageous effect of the present invention to become apparent, below in conjunction with the accompanying drawings to this
The specific embodiment of invention is described in detail.
With reference to Fig. 2, Fig. 2 is a kind of structural schematic diagram of wafer susceptor in the embodiment of the present invention.The wafer susceptor can be with
Including wafer carrier 200, multiple detection needles 220 and displacement sensor 230.
Wherein, the wafer carrier 200 can have multiple mounting holes 202.
The multiple detection needle 220 can be respectively arranged in each mounting hole 202 and can be perpendicular to the wafer
The direction on 200 surface of platform moves up and down.Specifically, the internal diameter of mounting hole 202 needs the diameter of section for being more than detection needle 220, from
And improve detection needle 220 mounting hole 202 it is mobile when flexibility, resistance when reducing mobile.
Specifically, under no wafer state, the first end of the detection needle 220 is higher than the surface of the wafer carrier 200,
In the case where there is wafer state, the detection needle 220 is moved down by the compressing of wafer 210.It is understood that when the table of the wafer carrier
When face is without particulate matter, for each needle 220 that detects from no wafer state to when having wafer state, the displacement distance moved down is consistent.
Displacement sensor 230 is coupled with the multiple detection needle 220, the multiple suitable for being detected in the case where there is wafer state
Detection needle 220 moves down distance, detects when moving down distance less than predetermined threshold value of needle 220 when at least one, determines the wafer
210 positions are abnormal.
Wherein, the predetermined threshold value can be the wafer carrier 200 surface without particulate matter when, the detection needle 220
From no wafer state to the displacement distance for having wafer state.In specific implementation, the wafer of size, similar weight may be used
The wafer of same technique platform (be, for example) in advance tests the displacement distance for detecting needle, to obtain predetermined threshold value, and
It is further modified in subsequent implementation, to improve the accuracy of setting predetermined threshold value.
Further, the multiple mounting hole 202 can be distributed in the different location of the wafer carrier 200.Specifically,
The case where in order to preferably determine whether there is wafer tilt, multiple mounting holes 202 can be to avoid being arranged at wafer carrier 200
Central area the case where, such as intermediate region or the fringe region of the wafer carrier 200 can be distributed in, so that multiple set
Be placed in detection needle 220 in mounting hole 202 can when supporting wafer 210 uniform stressed, from regardless of wafer 210 to which side
To tilting, all there is mounting hole 202 and detection needle 220 tilting position, help to improve whether determining wafer position occurs
Abnormal accuracy.
Further, the wafer carrier 200 can be electrostatic chuck formula microscope carrier, to according to electrostatic absorption principle, profit
Wafer 210 is adsorbed on the surface of wafer carrier 200 by the suction generated with electrostatic charge, is improved advanced.
In embodiments of the present invention, the detection needle 220 moved down can be oppressed by wafer by being arranged in the case where there is wafer state, and
The distance that moves down for detecting needle 220 is detected using displacement sensor 230, distance is moved down when at least one detection needle 220
When less than predetermined threshold value, it may be determined that the wafer 210 of the 220 corresponding position of detection needle tilts, to effectively to crystalline substance
The case where circle 210 tilts is detected, and the accuracy and product of the semiconductor equipment where wafer susceptor are helped to improve
Quality.
Structural schematic diagram of another wafer susceptor under no wafer state in the embodiment of the present invention with reference to shown in Fig. 3.
Displacement sensor 230 in the wafer susceptor may include multiple detection components 231, input terminal 233, output end
234 and detection device 235.
Wherein, in multiple detection components 231, each detection components 231 include that the first conduct piece 2311 and second is conductive
Part 2312, wherein in each detection components 231, first conduct piece 2311, which is coupled to, is fixed on corresponding detection needle 220
Second end, second conduct piece, 2312 and first conduct piece 2311 is at a distance of the predetermined threshold value, in the case where there is wafer state, institute
The first conduct piece 2311 is stated to move to second conduct piece 2312 with the detection needle 220.
For convenience of explanation, include 3 with displacement sensor 230 below and detect needles 220, and correspond respectively to detection needle
It is illustrated for 220 3 detection components 231, detection components 236 and detection components 237, it should be pointed out that in this hair
In bright embodiment, the number of detection needle 220 and detection components 231 is not limited.
The input terminal 233, multiple detection components 231, detection components 236 and detection components 237 and the output end
234 form series loop.In the series loop shown in Fig. 3, the first conduct piece 2311 of first detection components 231 with it is described
Input terminal 233 is electrically connected, the second conduct piece of the first conduct piece 2361 and previous detection components 231 of latter detection components 236
2312 electrical connections, the second conduct piece 2372 of the last one detection components 237 are electrically connected with the output end 234.Wherein, described
First conduct piece 2371 of the last one detection components 237 is electrically connected with the second conduct piece 2362 of previous detection components 236.
It detects device 235 to be suitable in the case where there is wafer state, detects whether the series loop is connected, when the series loop
When to disconnect, determine that the wafer position is abnormal.
Further, the detection device 235 may include voltage detection device or current sensing device, with basis respectively
Voltage in series loop or electric current, determine testing result.
In a kind of concrete application of the embodiment of the present invention, it can apply between the input terminal 233 and output end 234
There is detection voltage, the detection device 235 may include voltage detection device, and the voltage detection device is adapted to detect for the string
The voltage for joining the tie point in circuit between each adjacent two detection components, when any testing result of the voltage detection device
When being zero, the voltage detection device determines that 210 position of the wafer is abnormal.
It is that wafer susceptor is in the case where there is wafer state and surface is without particulate matter for another kind in the embodiment of the present invention with reference to Fig. 4, Fig. 4
When structural schematic diagram.
In the state of having wafer 210, the first conduct piece 2311, the first conduct piece 2361 and the first conduct piece 2371 can
It is moved to second conduct piece 2312, the second conduct piece 2362 and the second conduct piece 2372 with the detection needle 220, first leads
The displacement distance of electric part 2311, the first conduct piece 2361 and the first conduct piece 2371 is predetermined threshold value, since surface is without particulate matter,
Therefore the first conduct piece in the multiple detection components and the second conduct piece can contact respectively, to make series loop be connected.
When being applied with detection voltage between the input terminal 233 and output end 234, the voltage detection device is suitable for inspection
The voltage for surveying the tie point in the series loop between each adjacent two detection components, due to input terminal 233 and output end 234
Between usually there is voltage difference, therefore when series loop is connected, the tie point between each adjacent two detection components exists
Voltage value may thereby determine that 210 position of the wafer is normal.
It is that wafer susceptor is in the case where there is wafer state and there is particulate matter on surface for another kind in the embodiment of the present invention with reference to Fig. 5, Fig. 5
When structural schematic diagram.
In the state of having wafer 210, the first conduct piece 2311, the first conduct piece 2361 and the first conduct piece 2371 can
It is moved to second conduct piece 2312, the second conduct piece 2362 and the second conduct piece 2372 with the detection needle 220, first leads
The displacement distance of electric part 2311, the first conduct piece 2361 and the first conduct piece 2371 is predetermined threshold value, due to wafer carrier 200
There is particulate matter 210 on surface, therefore the side of wafer 210 can tilt, and wafer 210 is caused to tilt.And then in multiple detection components
The case where failing contact there are the first conduct piece and the second conduct piece, such as the first conduct piece 2311 and the second conduct piece 3212
Fail to contact, the first conduct piece 2361 also fails to contact with the second conduct piece 3262, to make series loop disconnect.
When being applied with detection voltage between the input terminal 233 and output end 234, the voltage detection device is suitable for inspection
The voltage for surveying the tie point in the series loop between each adjacent two detection components, due to input terminal 233 and output end 234
Between usually there is voltage difference, therefore when series loop disconnects, there are detecting the case where voltage value is zero, such as detect
Between component 231 and detection components 236 and between detection components 236 and detection components 237, it can detect that voltage value is
Zero, it may thereby determine that 210 position of the wafer is abnormal.
It, can be in the input terminal 233 and defeated in another concrete application of the embodiment of the present invention with continued reference to Fig. 3
Detection voltage is applied between outlet 234, the detection device 235 includes current sensing device；When the current sensing device
Testing result when be electric current in the series loop being zero, the current sensing device determines that 210 position of the wafer is sent out
It is raw abnormal.
Structural representation of another wafer susceptor when under having wafer state and surface is without particulate matter with reference to shown in Fig. 4
Figure.
In the state of having wafer 210, the first conduct piece 2311, the first conduct piece 2361 and the first conduct piece 2371 can
It is moved to second conduct piece 2312, the second conduct piece 2362 and the second conduct piece 2372 with the detection needle 220, first leads
The displacement distance of electric part 2311, the first conduct piece 2361 and the first conduct piece 2371 is predetermined threshold value, since surface is without particulate matter,
Therefore the first conduct piece in the multiple detection components and the second conduct piece can contact respectively, to make series loop be connected.
When being applied with detection voltage between the input terminal 233 and output end 234, the current sensing device is suitable for inspection
The electric current in the series loop is surveyed, due to usually having voltage difference between input terminal 233 and output end 234, is being connected
When circuit is connected, current sensing device can detect that the electric current in current value namely the series loop is not zero, so as to
It is normal with determination 210 position of wafer.
It is that wafer susceptor is in the case where there is wafer state and there is particulate matter on surface for another kind in the embodiment of the present invention with reference to Fig. 5, Fig. 5
When structural schematic diagram.
In the state of having wafer 210, the first conduct piece 2311, the first conduct piece 2361 and the first conduct piece 2371 can
It is moved to second conduct piece 2312, the second conduct piece 2362 and the second conduct piece 2372 with the detection needle 220, first leads
The displacement distance of electric part 2311, the first conduct piece 2361 and the first conduct piece 2371 is predetermined threshold value, due to wafer carrier 200
There is particulate matter 210 on surface, therefore the side of wafer 210 can tilt, and wafer 210 is caused to tilt.And then in multiple detection components
The case where failing contact there are the first conduct piece and the second conduct piece, such as the first conduct piece 2311 and the second conduct piece 3212
Fail to contact, the first conduct piece 2361 also fails to contact with the second conduct piece 3262, to make series loop disconnect.
When being applied with detection voltage between the input terminal 233 and output end 234, the current sensing device is suitable for inspection
The electric current in the series loop is surveyed, due to usually having voltage difference between input terminal 233 and output end 234, is being connected
When circuit disconnects, the current value that current sensing device detects is zero, and it is different to may thereby determine that 210 position of the wafer occurs
Often.
In embodiments of the present invention, by the way that series loop is arranged, and series loop includes detection components 231, input terminal 233
And output end 234, and in the case where there is wafer state, the first conduct piece 2311 of the detection components 231 with detection needle 220 to
Second conduct piece 2312 moves, can be in 210 non-run-off the straight of wafer, the first conduct piece 2311 of each detection components 231
It is contacted with the second conduct piece 2312, realizes the conducting of series loop；In 210 run-off the straight of wafer, wafer 210 tilts side
First conduct piece 2311 of detection components 231 is not contacted with the second conduct piece 2312, realizes the disconnection of series loop, and then basis
It detects whether the series loop is connected, determines whether 210 position of wafer is abnormal.Using the side of the embodiment of the present invention
Case, the case where can further being tilted to wafer 210, are effectively detected, to improve the semiconductor equipment where wafer susceptor
Accuracy and product quality.
With reference to Fig. 6, Fig. 6 is a kind of structural schematic diagram of detection components in the embodiment of the present invention.The detection components 231 can
Can also include elastomeric element 232 to include the first conduct piece 2311 and the second conduct piece 2312.
Wherein, the elastomeric element 232 can be set between the first conduct piece 2311 and the second conduct piece 2312.
It in embodiments of the present invention, can be from there is wafer-shaped by using the detection components 231 with elastomeric element 232
When state to no wafer state, the returning quickly of the first conduct piece 2311 and the second conduct piece 2312 is effectively realized, is further carried
The accuracy of semiconductor equipment where high wafer susceptor and the quality of product.
Further, first conduct piece 2311 has the conductive protrusion stretched out towards the second conduct piece 2312
23111 and/or second conduct piece 2312 have towards the first conduct piece 2311 stretch out conductive protrusion (not shown).
In embodiments of the present invention, by conductive protrusion 23111, the first conduct piece 2311 and can be effectively realized
The connection of two conduct pieces 2312 further increases the accuracy of the semiconductor equipment where wafer susceptor and the quality of product.
Further, the detection components 231 can also have shell (not shown), with to the first conduct piece 2311,
Second conduct piece 2312, elastomeric element 232 are protected.It is understood that first conduct piece 2311 inside the shell can
It is enough flexibly mobile, and do not influence to detect needle from no wafer state to the displacement distance for having wafer state.
Further, the wafer susceptor can also include warning device, suitable for determining that it is different that the wafer position occurs
Chang Shi sends out abnormal information warning.
Specifically, it may include sending out alarm sound or display alarm information to send out abnormal information warning.More specifically
Ground, alarm sound can be sent out by the electroacoustic device on the machine where external or multiplexing wafer susceptor, can also be adopted
It is sent out with additional electroacoustic device.Warning message can be filled by the display on the machine where external or multiplexing wafer susceptor
It sets and is shown, or be transmitted in other display equipment of user and show, the present invention is without limitation.
The wafer susceptor can also include memory device, suitable for when determining that the wafer position is abnormal, storing
Exception record.
Specifically, storing the exception record of the wafer position helps chronically to carry out data tracking.More specifically, can
To be stored or be transmitted to the other of user by the memory module on the machine where external either multiplexing wafer susceptor
It is stored in storage device, the present invention is without limitation.
In embodiments of the present invention, when monitoring that the wafer position is abnormal, the wafer position can be stored
Exception record and/or information warning is sent out, to effectively remind operator's timely processing, reduction that same problem occurs again
Possibility is effectively reduced loss caused by same type problem.
The embodiment of the present invention also provides a kind of ion implantation device, and the ion implantation device may include such as Fig. 2 to Fig. 6
The wafer susceptor shown.
Further, in existing ion implantation device, usually there is grounding pin, to eliminate the wafer in wafer carrier
Electrostatic, then the detection needle mentioned in the embodiment of the present invention can be multiplexed the grounding pin.
In existing part ion injection device, the second end (that end for not exposing wafer carrier) of the grounding pin
With electric discharge contact chip, to carry out water conservancy diversion to the electrostatic of wafer.Can then have institute between grounding pin and first conduct piece
State electric discharge contact chip.Wherein, the electric discharge contact chip can be shrapnel.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (10)
1. a kind of wafer susceptor, which is characterized in that including：
Wafer carrier, the wafer carrier have multiple mounting holes；
Multiple detection needles are respectively arranged in each mounting hole and can be moved down on the direction perpendicular to the wafer carrier surface
Dynamic, under no wafer state, the first end of the detection needle is higher than the surface of the wafer carrier, in the case where there is wafer state, institute
Detection needle is stated to be moved down by wafer compressing；
Displacement sensor is coupled with the multiple detection needle, suitable in the case where detecting the multiple detection needle under having wafer state
Distance is moved, when moving down distance less than predetermined threshold value of needle is detected when at least one, determines that the wafer position is abnormal.
2. wafer susceptor according to claim 1, which is characterized in that institute's displacement sensors include：
Multiple detection components, each detection components include the first conduct piece and the second conduct piece, wherein in each detection components
In, first conduct piece is coupled to the second end for being fixed on corresponding detection needle, second conduct piece and the first conduct piece
At a distance of the predetermined threshold value, in the case where there is wafer state, first conduct piece is moved with the detection needle to second conduct piece
It is dynamic；
Input terminal and output end, the input terminal, multiple detection components and the output end form series loop, described more
In a detection components, the first conduct piece of first detection components is electrically connected with the input terminal, and the first of latter detection components
Conduct piece is electrically connected with the second conduct piece of previous detection components, the second conduct piece and the output of the last one detection components
End electrical connection；
Device is detected, suitable in the case where there is wafer state, detecting whether the series loop is connected, when the series loop is to disconnect
When, determine that the wafer position is abnormal.
3. wafer susceptor according to claim 1 or 2, which is characterized in that the predetermined threshold value is the wafer carrier
When surface is without particulate matter, the detection needle is from no wafer state to the displacement distance for having wafer state.
4. wafer susceptor according to claim 2, which is characterized in that be applied with detection between the input terminal and output end
Voltage, the detection device includes voltage detection device, and the voltage detection device is adapted to detect in the series loop per phase
The voltage of tie point between adjacent two detection components；
When any testing result of the voltage detection device is zero, the voltage detection device determines the wafer position hair
It is raw abnormal.
5. wafer susceptor according to claim 2, which is characterized in that be applied with detection between the input terminal and output end
Voltage, the detection device includes current sensing device；
When it is zero that the testing result of the current sensing device, which is electric current in the series loop, the current sensing device
Determine that the wafer position is abnormal.
6. wafer susceptor according to claim 2, which is characterized in that the detection components further include：
Elastomeric element, the elastomeric element are set between the first conduct piece and the second conduct piece.
7. wafer susceptor according to claim 2, which is characterized in that
There is first conduct piece conductive protrusion stretched out towards the second conduct piece and/or the second conduct piece to have direction
The conductive protrusion that first conduct piece stretches out.
8. wafer susceptor according to claim 1, which is characterized in that the multiple mounting hole is distributed in the wafer carrier
Different location.
9. wafer susceptor according to claim 1, which is characterized in that the wafer carrier is electrostatic chuck formula microscope carrier.
10. a kind of ion implantation device, which is characterized in that including wafer susceptor as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810076040.2A CN108288600A (en) | 2018-01-26 | 2018-01-26 | Wafer susceptor and ion implantation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810076040.2A CN108288600A (en) | 2018-01-26 | 2018-01-26 | Wafer susceptor and ion implantation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108288600A true CN108288600A (en) | 2018-07-17 |
Family
ID=62835626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810076040.2A Pending CN108288600A (en) | 2018-01-26 | 2018-01-26 | Wafer susceptor and ion implantation device |
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| Country | Link |
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| CN (1) | CN108288600A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW571379B (en) * | 2002-11-01 | 2004-01-11 | Winbond Electronics Corp | Wafer detecting means and method used for single-wafer machine |
| CN203826354U (en) * | 2014-05-07 | 2014-09-10 | 中芯国际集成电路制造(北京)有限公司 | Wafer tray |
| CN206271678U (en) * | 2016-12-26 | 2017-06-20 | 武汉新芯集成电路制造有限公司 | A kind of wafer state detection means and technique board |
-
2018
- 2018-01-26 CN CN201810076040.2A patent/CN108288600A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW571379B (en) * | 2002-11-01 | 2004-01-11 | Winbond Electronics Corp | Wafer detecting means and method used for single-wafer machine |
| CN203826354U (en) * | 2014-05-07 | 2014-09-10 | 中芯国际集成电路制造(北京)有限公司 | Wafer tray |
| CN206271678U (en) * | 2016-12-26 | 2017-06-20 | 武汉新芯集成电路制造有限公司 | A kind of wafer state detection means and technique board |
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