TW571379B - Wafer detecting means and method used for single-wafer machine - Google Patents

Abstract

The present invention relates to a wafer detecting means and method used for single-wafer machine of semiconductor equipment. We can know whether the wafer is shift, broken or any errors happened by using the lift pins with the piezoelectric or dielectric means in process chamber to detect the weight difference of the wafer before the process and after the process. It includes a stage with the lift pins that lift the wafer; a weight detecting means installed in or on lift pins to detect the weight of the wafer; a signal transfer means couple to the weight detecting means for transferring the weight signal of the wafer; and a system control means couple to the signal transfer means to deal with the weight signal and detect whether any errors are happened.

Description

571379 V. Description of the invention (1) 5-1 FIELD OF THE INVENTION The present invention relates to a wafer detection device for a single-chip machine in a semiconductor device, and particularly to a lifting pin (1 ift) capable of lifting and lowering a wafer in a process reaction chamber. Pi η) A piezoelectric or capacitive conversion device J is installed to measure the weight change of the wafer before and after the process is performed. 5 A wafer detection device that judges whether the wafer is displaced, broken, or whether the process is abnormal. -2 The background of the invention is to respond to a variety of different process methods > There are quite many types of semiconductor equipment, and the hardware-i-TL δ is also old and ancient, and can be roughly divided into furnace tube equipment > ion distribution equipment, yellow light Exposure equipment Yellow light developing equipment Λ Wet-etching ri-TL · Hanbei Dry-remaining equipment Metal sputtering equipment Thin film deposition equipment Chemistry Grinding equipment and various measurement equipment. Among them, dry etching equipment, metal sputtering, and some thin film deposition equipment are mostly single-wafer process machines. The characteristics of the single-wafer machine process are that the process reaction is performed in each process reaction chamber. When there is only one wafer in a single-process reaction chamber, as shown in the first figure, the current single-chip machine—1 generally contains multiple process-reaction chambers 11. When the robot arm 12 Grab a wafer in the boat and transfer it to the transfer chamber (t rans fer chambe r) 1 3 hours 5 Laser detector located above the machine 14

571379 5. Description of the invention (2) It will detect whether the wafer is successfully grasped. In the transfer chamber 13, a laser detector 14 is installed above the reaction chamber Π and the wafer placement chamber 15 in each process to detect whether the chip is in the designated position. We can learn from the first picture that 'this single-chip machine has two process reaction chambers and two wafer boat placement chambers 1 5' Therefore, a total of four laser detectors are installed above the transfer chamber. 1 4. The simple detection diagram of the laser picker is shown in the second figure. The laser detector 14 emits a laser light source 21, and when this laser light source 2 1 hits the chip 2 2 'a reflective light source 2 3 will be generated and received by the laser detector. The detection device 'machine can know whether the chip is already at the designated position. Because the current single-chip machine has a wafer detection device located only in the transfer chamber 1 and the process reaction chamber 11 is often in a high temperature, low voltage, high voltage, and chemical-rich environment, the process reaction chamber is often 2 ί ΐ Install f laser detector. Please refer to the third figure. Due to the relationship between the diplexer = temperature and high voltage during the process reaction, the wafer edge is occasionally attached to the machine bearing platform (pedes ^ ai) 3i after the process is completed. At this time, three lifting pins 3 2 ^ wafer 2 2 The wafer 22 will be in a skewed state when it is lifted up. When the robot arm 1 2 is stretched out = the process reaction chamber 1 1 while the wafer 22 is being grasped, the wafer 2 2 will be contaminated with particles from the process reaction chamber 11 by the hitting stone. The need for downtime maintenance ~ 'causes a huge loss of capacity. Or due to the process deposition or thin sputtering, and the internal stress of the war is too large, the chip will break during the process or after the process is performed. However, because the machine does not know that the chip is damaged, the machine and hand will still The broken wafer is placed in the wafer boat, which will cause the machine and

571379 V. Description of the invention (3) Other wafer particles in the boat are contaminated without knowing it, which will greatly affect the process yield and cause huge losses to the company. 5-3 Purpose and summary of the invention: In view of the above background of the invention, the conventional single-chip machine cannot know that the wafer in the process reaction chamber has been shifted, causing the robot arm to reach into the process reaction chamber and break the wafer, resulting in contamination of the process chamber with particles. Or, if the chip has been broken, the robotic arm still puts the broken chip into the wafer boat, causing many disadvantages of contamination of the wafer and other wafer particles in the wafer boat. The present invention provides a wafer detection device and method to avoid the above situation. produce. An object of the present invention is to provide a wafer positioning detection device and method, which determine whether a wafer is displaced or broken by detecting the weight of the wafer. Another object of the present invention is to provide a process detection device and method for determining whether an abnormality occurs in a readout process by detecting a change in the weight of a wafer before and after the process. Another object of the present invention is to provide a wafer detection device suitable for a single-wafer machine processing chamber.

571379 乂% W ^ ---- According to the above-mentioned purpose, the wafer positioning unit H, H 丨 company married 44 · τ for a variety of conductor equipment π 疋 position detection device, including a platform Installed in the flat shot, the μ · Ι mobile support device is used to support the wafer in the mouth; Panyu starts from W _ ~~ ^ --- ~ 5. Description of the invention (4) The measuring device includes: a platform; 4 muscle recognition and two are installed in the platform, using the "support chip; weight detection penetrating the" 5 sets "two mobile branches are placed ... to measure the weight of the chip with debt = value; install It is set to be electrically connected to the weight detection device I for sending out; the chip weight 1 transmission device 'control unit' is electrically connected to the signal transmission device second delivery 'system' two signals to determine whether the chip is shifted and the chip is placed for use. According to the above-mentioned concept, the movable support device includes a plurality of lifting pins or edges; according to the above-mentioned concept ... a plurality of lifting pins are located inside the platform according to the above-mentioned concept, wherein the top of the lifting pins includes a wafer system placed under pressure. At the tip, the lower 2 are attached to the weight Measuring means. Root = Conception 'where the weight debt is measured on the top or bottom of a plurality of lifting thimbles. = Summary of Conception ′, where the weight detector has just installed an electric converter or a piezoelectric converter. According to the above-mentioned object, the present invention provides a semiconductor device

Page 8 __— 571379 5. The process detection device of the invention description (5) includes: a platform; a movable support device installed in the platform to support the chip; a weight detection device installed in The mobile support device is used to detect the weight of the chip; the signal transmission device is electrically connected to the weight detection device to send the first chip weight signal before the process and the second chip weight signal after the process; The system control unit is electrically connected to the signal transmission device, and is used to process the first and second chip weight signals to determine whether the chip has an abnormality during the manufacturing process. According to the above concept, the movable supporting device includes a plurality of lifting and lowering pins. According to the above concept, a plurality of lifting and ejecting pins are located inside or at the edge of the platform. According to the above-mentioned concept, the tip of the lifting and ejecting pin includes a pressured tip, the chip is placed on the pressured tip, and the lower part is connected to the weight detection device. According to the above concept, the weight detecting device is located on the top or bottom of the plurality of lifting and ejecting pins. According to the above-mentioned concept, the weight detection device includes a capacitance converter or a piezoelectric converter. According to the above-mentioned object, the present invention provides a semiconductor device

571379 5. The wafer positioning detection method of invention description (6) includes the following steps: placing the wafer on the movable support device; detecting the weight of the wafer, and the weight detecting device is installed on the movable support device; The chip weight signal is electrically connected to the weight detection device through the signal transmission device; the chip weight signal is processed and electrically connected to the signal transmission device through the system control unit; and it is determined whether the chip is displaced or broken. According to the above concept, the movable supporting device includes a plurality of lifting and lowering pins. According to the above-mentioned concept, the tip of the lifting and ejecting pin includes a pressured tip, the chip is placed on the pressured tip, and the lower part is connected to the weight detection device. According to the above concept, the weight detecting device is located on the top or bottom of the plurality of lifting and ejecting pins. According to the above-mentioned concept, the weight detection device includes a capacitance converter or a piezoelectric converter. According to the above-mentioned object, the present invention provides a method for detecting a wafer process of a semiconductor device, which includes the following steps: placing a wafer on a movable supporting device; detecting the weight of the wafer; On the mobile support device; sending the first chip weight signal, which is electrically connected to the weight detection device through the signal transmission device; performing a preset process; detecting

Page 10 571379 V. Description of the invention (7) The weight of the chip is measured by the weight detection device; the second chip weight signal is sent by the signal transmission device; the first and second chip weight signals are processed by the system control Unit, which is electrically connected to the signal transmission device; determines whether an abnormality occurs in the chip during the manufacturing process. According to the above concept, the movable supporting device includes a plurality of lifting and lowering pins. According to the above-mentioned concept, the tip of the lifting and ejecting pin includes a pressured tip, the chip is placed on the pressured tip, and the lower part is connected to the weight detection device. According to the above concept, the weight detecting device is located on the top or bottom of the plurality of lifting and ejecting pins. According to the above-mentioned concept, the weight / quantity detecting device includes a capacitance converter or a piezoelectric converter. In order to make the above description and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments are described in detail below in conjunction with the accompanying drawings. 5-4 Invention Details:

571379 V. Description of the invention (8) The present invention discloses a method of using a monolithic wafer to determine whether a wafer has a displacement, a broken piece, or a process that differs from the weight of a wafer machine in a process reaction chamber before and after the process. Chip detection device. In order to explain the embodiment of the present invention, please refer to the fourth and fifth diagrams A to D and the fifth diagram. Baixian please refer to Figure 4A and ® Biyan Ling 谖 Manufacture < α㈤ μ Bottom Figure 5, both of which are simple top views of I-pass reaction chamber 11. The fourth Aisi # red i τ should be shown in the figure, the lifting thimble 32 is located inside the machine bearing platform 31, and the fifth drawing is A u = Bian Yishan A, the lifting thimble 32 connected to the machine is located on the machine shaft 7 D w Factory J only: The edge of the supporting platform 31. These two types of lifting jacks 舢 ^ ^ ^ Seven,., The design of the 32 pin position, is currently generally used by semiconductor single chip equipment manufacturers Now, the implementation process of the present invention will be described with the fourth A to D drawings. Please refer to the first figure and the fourth, when the wafer boat with the wafer is placed: the boat placement room 15 when the wafer boat is placed The door of 5 is then closed and pumping is started, and the pump is pumped until the vacuum degree of the boat placement chamber 15 reaches about 10-5 to 106 to 0H. At this time, the transmission chamber 13 and the boat are set. The n at the junction of the placing chamber 15 will be opened, and then the robot arm 12 extends into the wafer boat in the wafer placement chamber 15 to grab the wafers. The crystal ^ is caught in the transfer chamber 1 3 at the same time, it is located in the transfer chamber 丨 3 near the wafer boat. A laser detector 4 is installed above the placement chamber 15 刖, and the laser detector 14 will test whether the wafer has been caught in the transfer chamber 3 or not. Then, after grasping the transfer chamber 1 3, the robot arm 12 moves the wafer to the process reaction chamber L! Then, at this time, the thunder f detector 1 located in the transfer chamber 13 and close to the process reaction chamber 1 1 4 will detect whether there is a wafer on the robot arm 丨 2. After confirming that there is a wafer on the robot arm 1 2, the door of the process reaction chamber 丨 will be opened immediately.

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571379 V. Description of the invention (9) Opening is located in the machine direction, 3 1 ° then the center of the lifting pin 32 of the machine 3 2 is pressurized by the pressure point of the pressure point 42 I on the electrical conversion device or the bottom The signal is transmitted to the brain 45, when the pressure of the system to withstand the chip's ejector pin 3 2 is displaced or if the wafer has no positioner bearing platform, the ejector arm 12 will be lifted up, at this time the crystal. When the chip is inflamed, 4 2 will be transposed or capacitively switched by the amount of pressing under 4 2. At this time, connecting the transmission line 4 and 4 will control the computer or the capacitance value, weight, and then the center position, and the fragment. When the machine moves, the machine will follow the 3 1 inside or the edge 3 2 and the chip will send the image to the center of gravity. Depending on the weight of the wafer, the electric conversion device is changed to pressure or the device 4 3 can be converted in piezoelectric pressure or electricity 4 5 respectively. After receiving the calculation, the wafer will be known to determine that the wafer table will issue three successive rises in the subsequent operating edge. When the reaction chamber 11 on the machine side is pressed on the three thimbles 32, the capacitance value is switched downward or capacitively. The capacitance value should be transmitted to the three liters by the installation device or the capacitance value to get whether each center of gravity is in the Displacement or warning message and the ejector pin 3 2 will bearing the platform 'placed on the three ejector pins 32'. At this time, the device 43 will note that the conversion device of the ejector pin 4 3 system controls the electric ejector pin 32. The three wafers of the lifting pin are lifted and broken. If the crystal stops moving, Cheng Ping; "1 2 2 downwards until its top position is lower than the machine shaft process Ercheng De Yiying Chamber 1 1 starts the preset reaction process, when the ejector pin 32 will rise again, ㈣The wafer is lifted away from the machine bearing platform 3. 1. A bucket FI η The main Ding Rihna J Bei 踹 49 ^ Φ ^ ^ At the same time 'Pressure tip on the three lifting ejector pins η: Conversion device or capacitor conversion The accumulative action described above, and finally the pressure or capacitance value =

Page 13 571379 V. Description of the invention (10) The system control computer 45, the system control computer 45 respectively receives the pressure or capacitance value from the three lifting thimbles 32. After calculation, each lifting top ^ 10 can bear The weight of the wafer, and further know whether the center of gravity of the wafer is still two, and the center position of the wafer lifting and ejecting pin 32, to determine whether the wafer is moved or broken during the reaction process. If the wafer is displaced or broken, the machine will issue a warning message, and the robot arm 1 2 will also stop entering the process reaction chamber 1 丨 Grab the wafer = action, this can prevent the wafer from being broken or the robot arm i 2 will still be damaged. The problem that the wafer rose into the wafer boat. On the other hand, the system control computer 45 can also judge whether the weight of the wafer is increased / decreased after the process according to the data before and after the process, which can be used as a basis for judging whether the process is abnormal. If the difference is outside the allowable range, the machine can also issue a warning message to inform Eclipse that the manufacturing process is abnormal. It should be noted that the decrease in the weight of the wafer after the process is determined by the process. For example, when the Jiban # process is performed, the weight of the wafer will be reduced after the process is completed, but if a thin film sputtering or deposition process is performed , The wafer weight will increase after the process is completed.

In summary, based on whether the wafer disclosed in the present invention has any displacement or fragmentation, it can also be used in a single-chip machine. This detection device detects whether the wafer is displaced or fragmented in real time to determine the exposure of the wafer in the reaction chamber of the process. The chip detection device can detect whether the reaction process is abnormal. Opposition can be installed in the process reaction chamber, or it can be a basis for whether the process is abnormal by measuring the variation of the data.

Page 14 571379 V. Description of the invention (11) Even though the present invention has been described by citing several preferred embodiments, the present invention is not limited to the illustrated embodiments. Although specific examples have been cited and described previously, it is obvious that other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the scope of patent application of the present invention. In addition, all other similar and approximate changes or modifications made without departing from the spirit disclosed by the present invention are also included in the scope of patent application of the present invention. At the same time, the scope of the present invention should be construed in the broadest definition so as to encompass all modifications and similar structures.

Page 571379 Simple illustrations Simple illustrations: The first image shows the top view of the single-chip machine; the second image shows the detection schematic of the laser detector; the third image shows It is the intention of the lifting pin to lift the wafer when one end of the wafer is stuck to the bearing platform of the machine; Figure A shows the top view of the process reaction chamber; Figure B shows the lifting pin and its connecting rod. Structure diagram; The fourth diagram C shows a structure diagram of a device according to a preferred embodiment of the present invention; the fourth diagram D shows a structure diagram of a device according to another preferred embodiment of the present invention; and the fifth diagram Shown is a top view of another process reaction chamber. Explanation of symbols: 1 1: Process reaction chamber 1 2: Robot arm 1 3: Transmission chamber 1 4: Laser detector 1 5: Crystal boat placement chamber 2 1: Laser light source 2 2: Chip 2 3: Reflected light source 3 1: Machine bearing platform 3 2: Lifting thimble

Page 16 571379 Brief description of the drawings 42: Pressure tip 43: Piezoelectric conversion device or capacitor conversion device 44: Signal transmission line 45: System control computer

IlHlii Page 17

Claims (1)

571379 6. Scope of application for patents Application scope of patents: L A semiconductor device crystal # # # # 一 平台 ； Sun and moon position detection device, including a mobile support device, tablet; In this platform, a weight detection device is used to detect the weight of the chip; /, it is mounted on the movable support device ... a signal transmission device to electrically send a chip weight signal; on the support, use The weight detection device is connected to the processing unit for processing; the manufacturing unit is electrically connected to the signal transmission gear to process the weight signal, and to determine whether the chip is shifted and used as described in item 1 of the patent scope. The mobile positioning device includes a plurality of lifting and ejecting pins. ， 置 '3. The wafer positioning and detecting farm as described in item 2 of the scope of patent application, the plurality of lifting and ejecting pins are located inside the platform. In addition, according to the wafer positioning detection device described in item 2 of the scope of the patent application, the plurality of lifting and ejecting pins are located at the edge of the platform. 5. Among them, the chip positioning detection described in item 2 of the scope of patent application, and the top of the lifting thimble contains a flame-resistant end. The chip is placed in the 571379. 6. The scope of patent application pressure The tip is connected to the weight detection device below. 6. The wafer positioning detection device according to item 2 of the scope of patent application, wherein the weight detection device is located on top of the plurality of lifting and ejecting pins. 7. The wafer positioning detection device according to item 2 of the scope of patent application, wherein the weight detection device is located at the bottom of the plurality of lifting and ejecting pins. 8. The wafer positioning detection device according to item 1 of the scope of patent application, wherein the weight detection device includes a capacitor-capacitor converter. 9. The wafer positioning detection device according to item 1 of the patent application scope, wherein the weight detection device includes a piezoelectric converter. 10. The wafer positioning and detecting device according to item 1 of the scope of the patent application, wherein the wafer positioning and Y measuring device is an early wafer machine for semiconductor equipment. 11. A process detection device for a semiconductor device comprising: a platform; a movable support device installed in the platform to support a chip; a weight detection device installed on the movable support device To measure the weight of the chip, a signal transmission device, electrically connected to the weight detection device, Page 571 379 The scope of the patent is to send a first chip weight signal before a process, and send a second chip weight signal to the rod to order the §Hai process, to determine whether the system control unit is electrically connected to the signal transmission wheel. The first and second wafer weight signals are hardened to determine that an abnormality has occurred in the wafer process. .... The process detection device according to item 11 of the scope of patent application, wherein the tongue support device includes a plurality of lifting and ejecting pins. Hai 1 3 // The process detection device according to item 12 of the patent application scope, wherein a plurality of lifting and ejecting pins are located inside the platform. /, Α 1 4 · According to the process detection described in item 12 of the scope of patent application, Pei Zhi is located at the edge of the platform. Wherein 'the top of the pressurized 1 b • long process detection device as described in the scope of the patent application, the tip of the stylus needle includes a pressurized tip * end, the wafer is placed on the tip' Connected to the weight detection device below. 16. Once the process detection device is described in item 2 of the patent application scope, the s detection device is located on top of the plurality of lifting and ejecting pins. The process detection as described in item 1 and 2 of the scope of patent application of the present invention is located at the bottom of the plurality of lifting thimbles ^. , Where the 571379 6. Scope of patent application 18. The process detection device described in item 11 of the scope of patent application, wherein the weight detection device includes a capacitor-capacitor converter. 19. The process detection device according to item 11 of the scope of patent application, wherein the weight detection device includes a piezoelectric transducer. 20. The process detection device according to item 11 of the scope of patent application, wherein the process detection device is a single-chip machine for semiconductor equipment. 21. A wafer positioning detection method for a semiconductor device, comprising: placing a wafer on a movable support device; detecting the weight of the wafer, and installing the wafer on the movable support device through a weight detection device; A chip weight signal is electrically connected to the weight detection device through a signal transmission device; a chip control signal is processed to be electrically connected to the signal transmission device through a system control unit; and it is determined whether the chip is Displacement and fragmentation. 22. The wafer positioning detection method as described in item 21 of the patent application scope, wherein the movable supporting device includes a plurality of lifting and ejecting pins. 23. The wafer positioning detection method as described in item 22 of the patent application scope, which Page 21 571379 6. In the scope of the patent application, the top of the lifting ejector pin includes a pressured tip, the chip is placed on the pressured tip, and the weight is connected to the weight detection device below. 24. The wafer positioning detection method as described in item 22 of the scope of patent application, wherein the weight detection device is located on top of the plurality of lifting and ejecting pins. 25. The wafer positioning detection method according to item 22 of the scope of patent application, wherein the weight detection device is located at the bottom of the plurality of lifting and ejecting pins. 2 6. The wafer positioning detection method according to item 21 of the scope of patent application, wherein the weight detection device includes a capacitance converter. 27. The wafer positioning detection method as described in item 21 of the patent application scope, wherein the weight detection device includes a piezoelectric transducer. 28. A method for manufacturing process detection of a semiconductor device, comprising: placing a chip on a movable supporting device; detecting the weight of the chip, and mounting the wafer on the movable supporting device by a weight detecting device; The first chip weight signal is electrically connected to the weight detection device through a signal transmission device; a preset process is performed on the chip; the weight of the chip is detected by the weight detection device; A second chip weight signal through the one signal transmission device; Page 22 571379 VI. Scope of patent application The first and second chip weight signals are processed, and a system control unit is electrically connected to the signal transmission device; it is determined whether the chip has an abnormality in the manufacturing process. 29. The process detection method according to item 28 of the scope of patent application, wherein the movable supporting device includes a plurality of lifting and ejecting pins. 30. The process detection method as described in item 29 of the scope of patent application, wherein the top of the lifting and ejecting pin includes a pressured tip, the chip is placed on the pressured tip, and the weight is connected to the weight detection device below . 31. The process detection method as described in item 29 of the patent application scope, wherein the weight detection device is located on top of the plurality of lifting and ejecting pins. 32. The process detection method described in item 29 of the scope of patent application, wherein the weight detection device is located at the bottom of the plurality of lifting and ejecting pins. 33. The process detection method described in item 29 of the scope of patent application, wherein the weight detection device includes a capacitor-capacitor converter. 3 4. The process detection method according to item 29 of the scope of patent application, wherein the weight detection device includes a piezoelectric converter. Page 23