WO2023125502A1

WO2023125502A1 - Base grounding detection apparatus and method

Info

Publication number: WO2023125502A1
Application number: PCT/CN2022/142229
Authority: WO
Inventors: 吴启东
Original assignee: 北京北方华创微电子装备有限公司
Priority date: 2021-12-29
Filing date: 2022-12-27
Publication date: 2023-07-06
Also published as: TWI847454B; CN114355244A; TW202326889A

Abstract

A base (9) grounding detection apparatus and method. A voltage signal acquisition unit (302) acquires a voltage signal of a base (9). A voltage detection unit (304) determines, according to the voltage signal and a preset voltage signal, whether the base (9) is grounded, and when the base (9) is grounded, uses a first signal indicating that the base (9) is grounded as an output signal. During execution of a process, a control unit (306), once receiving the first signal, immediately instructs a semiconductor device to stop executing the process and sends an alarm signal, so that a grounding situation caused by a short circuit between the base (9) and a chamber wall or a lining can be detected in time, thereby avoiding an accident that a current breaks down a wafer and further seriously impacts the electrical performance of the wafer and product quality.

Description

Base ground detection device and method

technical field

The present application relates to the field of semiconductor manufacturing, in particular to a base grounding detection device and method.

Background technique

The magnetron sputtering process is a technology widely used in the field of semiconductor manufacturing. A typical magnetron sputtering process is completed in a high vacuum chamber as shown in Figure 1. The main structure of the chamber includes: a chamber wall 9 , a target 1 , a lining 2 , a pressure ring 3 , and a base 4 . These structures mainly constitute the closed environment required for the magnetron sputtering process. Before performing the magnetron sputtering process, the wafer 7 is first placed on the base 4, and then the chamber is evacuated to a vacuum state by the vacuum pump 5. When the chamber reaches a specified vacuum degree, the base 4 rises and lifts the pressure ring 3 to separate the pressure ring 3 from the lining 2, and the base 4 and the pressure ring 3 are suspended (ie, not grounded).

When the susceptor 4 reaches the process position, the control system feeds a specified amount of argon gas into the chamber through the air inlet 10 as the process gas, and the magnetron sputtering process can be started at this time. Referring to Figure 2, the sputtering power supply 8 applies a specified voltage between the chamber wall 9 and the target 1 to ionize the argon gas in the chamber, and at the same time, under the binding effect of the rotating magnetron 6 on the electrons, it is ionized The argon ions move towards the target 1 (cathode) under the action of the electric field force, and the lower surface of the target 1 will form a stable plasma. Under the action of the electric field and magnetic field, the ionized argon ions continuously bombard the surface of the target 1, so that the target atoms are sputtered out and fall on the surface of the wafer 7 placed on the base 4, thereby achieving Surface coating process.

At the same time, during the above magnetron sputtering process, the free electrons move toward the inner lining 2 (anode), and some of the free electrons will fall on the potential-floating base 4 . A certain amount of free electrons will accumulate on the potential floating base 4, so that a potential difference is formed between the base 4 and the ground. The greater the power in the process, the more free electrons accumulate on the susceptor 4 .

In the process of performing the process, if the base 4 is short-circuited with the chamber wall 9 or the inner liner 2, for example, foreign objects appear in the chamber to short-circuit the base 4 with the chamber wall 9 or the inner liner 2, or the base 4 and the inner liner 2 are short-circuited. When the pressure ring 3 is not completely separated from the inner liner 2, it is misjudged that the base 4 has reached the process position and the magnetron sputtering process is started. At this time, the base 4 is short-circuited with the chamber wall 9 and the inner liner 2. The accumulated free electrons will be quickly absorbed by the ground, making the base 4 and the ground equipotential, and the chamber wall 9 is connected to the ground, which is equivalent to the base 4 becoming an anode, causing the base 4 and the target 1 (cathode) ) form a current loop, and the current flows through the wafer 7 placed on the base 4, which will cause the components on the wafer 7 to be broken down by the current, seriously affecting the electrical performance of the wafer and affecting product quality. In the prior art, it is difficult to detect the short circuit between the susceptor 4 and the chamber wall 9 or the inner liner 2 in time during the execution process, so it is impossible to detect the abnormal grounding of the susceptor in time and stop the execution process in time, which affects the quality of the wafer.

Contents of the invention

The purpose of the present application is to provide a method and device capable of conveniently and accurately performing base grounding detection.

In one aspect of the present application, a base grounding detection device is provided for use in semiconductor equipment, the base is arranged in a process chamber for performing semiconductor processes in the semiconductor equipment, and the base is used to carry For the wafer to be processed, the base ground detection device includes a voltage signal acquisition unit, a voltage detection unit and a control unit; wherein:

The voltage signal acquisition unit is used to acquire the voltage signal of the base;

The voltage detection unit is configured to receive the voltage signal from the voltage signal acquisition unit, and determine whether the base is grounded according to the voltage signal and a preset voltage signal, and when the base is grounded, sending a first signal to the control unit as an output signal, the first signal indicating that the base is grounded;

The control unit is configured to instruct the semiconductor equipment to stop performing the process and send an alarm signal when receiving the first signal during the process of the semiconductor equipment performing the process.

Optionally, the voltage detection unit is specifically used for:

receiving the voltage signal, and comparing the voltage signal with the preset voltage signal, and if the absolute value of the voltage signal is smaller than the preset voltage signal, it is determined that the base is grounded, and the The first signal is used as the output signal.

Optionally, the voltage detection unit is also used for:

If the absolute value of the voltage signal is greater than the preset voltage signal, it is determined that the base is not grounded, and a second signal is used as the output signal, the second signal indicating that the base is not grounded.

Optionally, the base ground detection device further includes a pressurizing unit, the pressurizing unit is configured to provide a reference voltage signal to the voltage detection unit when there is no voltage signal on the base, the The voltage detection unit is used to compare the reference voltage signal with the preset voltage signal, and when the absolute value of the reference voltage signal is greater than the preset voltage signal, determine that the base is not grounded, and A second signal is used as the output signal, the second signal indicating that the base is not grounded.

Optionally, the control unit is further configured to, when receiving that the output signal changes from the second signal to the first signal and then changes from the first signal to the second signal, to the record the positions of the base as a first position and a second position respectively, and compare the first position and the second position, and determine that the first position is lower than the second position when the first position is lower than the second position The second position is the lowest craft position.

In another aspect of the present application, a base grounding detection method is also provided, which is used in semiconductor equipment, and the method includes:

S1, collecting the voltage signal of the base;

S2. Determine whether the base is grounded according to the voltage signal and a preset voltage signal, and use a first signal as an output signal when the base is grounded, and the first signal indicates that the base is grounded;

S3. During the execution of the process, if the output signal is the first signal, stop the execution of the process and send an alarm signal.

Optionally, step S2 specifically includes:

Comparing the voltage signal with the preset voltage signal, if the absolute value of the voltage signal is smaller than the preset voltage signal, it is determined that the base is grounded, and the first signal is used as the output Signal.

Optionally, step S2 also includes:

Optionally, the method also includes:

In the case of no voltage signal on the base, provide a reference voltage signal, and compare the reference voltage signal with the preset voltage signal, and when the absolute value of the reference voltage signal is greater than the preset voltage signal, determine that the base is not grounded, and use a second signal as the output signal, the second signal indicating that the base is not grounded.

Optionally, the method also includes:

When the output signal is received from the second signal to the first signal and then from the first signal to the second signal, the position of the base is respectively recorded as the first position and a second position, and comparing the first position and the second position, and determining that the second position is the lowest process position when the first position is lower than the second position.

In the technical solution of the present application, the voltage signal of the base is collected by the voltage signal acquisition unit, and the voltage detection unit determines whether the base is grounded according to the voltage signal and the preset voltage signal, and when the base is grounded, it will indicate whether the base is grounded. The first signal is used as an output signal. When the process is being executed, once the control unit receives the first signal, it will immediately instruct the semiconductor equipment to stop the process and send out an alarm signal, so that the short circuit between the susceptor and the chamber wall or lining can be found in time. The resulting grounding situation avoids accidents in which the wafer to be processed is broken down by the current, which seriously affects the electrical performance of the wafer and affects product quality.

Description of drawings

The above and other objects, features and advantages of the present application will become more apparent by describing the exemplary embodiments of the present application in more detail with reference to the accompanying drawings, wherein, in the exemplary embodiments of the present application, the same reference numerals are generally represent the same part.

Figure 1 shows a schematic diagram of a typical high vacuum chamber for performing a magnetron sputtering process.

Figure 2 shows a schematic diagram of a magnetron sputtering process performed in a chamber.

Fig. 3 shows a structural block diagram of a base grounding detection device according to an embodiment of the present application.

Fig. 4 shows a block diagram of a base ground detection device according to an exemplary embodiment of the present application.

5( a ), ( b ) and ( c ) show schematic diagrams of outputs corresponding to different states of the base grounding detection device according to an exemplary embodiment of the present application.

6( a ) and ( b ) show schematic diagrams of analysis for determining the lowest process position according to an exemplary embodiment of the present application.

FIG. 7 shows a flow chart of a base ground detection method according to an embodiment of the present application.

Detailed ways

The voltage signal acquisition unit 302 is used to acquire the voltage signal of the base. Optionally, the voltage signal acquisition unit 302 can collect the voltage signal of the base by being electrically connected to the part of the base 9 exposed outside the chamber. Before officially starting to execute the magnetron sputtering process, the base 9 will gradually rise from the initial position until reaching the process position. The above-mentioned "part of the base exposed outside the chamber" refers to the part of the base 9 that is always exposed outside the chamber during operation and will not rise into the chamber. The voltage signal acquisition unit 302 may be a voltage signal acquisition wire, which may be connected to the base by means of screws or the like.

The voltage detection unit 304 is used to receive the voltage signal from the voltage signal acquisition unit 302, and according to the voltage signal and the preset voltage signal, determine whether the base is grounded, and when the base is grounded, send the first signal as an output signal to the control unit, the first signal indicates that the base is grounded. In some examples, the voltage signal can be further processed. For example, in order to meet the requirements of the control system for the electrical signal range, etc., the voltage signal can be divided by a voltage divider circuit, and/or its amplitude can be scaled as required, And/or perform inversion processing on it, etc., then determine whether the base is grounded according to the processing result and the above-mentioned preset voltage signal, and when the base is grounded, send the first signal as an output signal to the control unit, which will not be made here limited.

In some possible implementations, the voltage detection unit 306 is specifically configured to receive the voltage signal, and compare the voltage signal with a preset voltage signal, and if the absolute value of the voltage signal is less than the preset voltage signal, determine that the base is grounded, and The first signal is used as an output signal.

In some possible implementations, the voltage detection unit 306 is also configured to determine that the base is not grounded if the absolute value of the voltage signal is greater than the preset voltage signal, and use the second signal as an output signal, the second signal indicating that the base Not grounded.

The control unit 306 is configured to instruct the semiconductor device to stop performing the process and send an alarm signal when receiving the first signal during the process of the semiconductor device executing the process.

Those skilled in the art can select an appropriate preset voltage signal according to actual needs, simulation experiments, and the like.

In the above-mentioned embodiment, the voltage signal of the base is collected by the voltage signal acquisition unit, and the voltage detection unit determines whether the base is grounded according to the voltage signal and the preset voltage signal, and when the base is grounded, it will indicate the first grounding of the base. One signal is used as an output signal. When the process is being executed, once the control unit receives the first signal, it will immediately instruct the semiconductor equipment to stop performing the process and send an alarm signal, so that it can be found in time that the susceptor is short-circuited with the chamber wall or the lining. To avoid accidents where the wafer is broken down by the current, which seriously affects the electrical performance of the wafer and affects the product quality.

The above terms "first signal" and "second signal" are used to distinguish signals representing different information. In one example, the first signal refers to an electrical signal whose amplitude is a first level, and the second signal refers to an electrical signal whose amplitude is a second level. For example, the first level can be set as a high level, and the second The level is low level, or vice versa, the first level is low level, and the second level is high level, which can conveniently and concisely indicate whether the base is grounded, and is convenient for subsequent use.

Fig. 4 shows a block diagram of a base ground detection device according to an exemplary embodiment of the present application. As shown in Figure 4, the device also includes a pressurization unit 308, the pressurization unit 308 is used to provide a reference voltage signal to the voltage detection unit 304 when there is no voltage signal on the base, and the voltage detection unit 304 is also used to set the The reference voltage signal is compared with the preset voltage signal, and when the absolute value of the reference voltage signal is greater than the preset voltage signal, it is determined that the base is not grounded, and the second signal is used as an output signal, and the second signal indicates that the base is not grounded.

In the case that the base has no voltage signal, the reference voltage signal will be compared as a substitute voltage signal in subsequent steps, so that the voltage detection unit 304 can also output the first The second signal, which is clearly distinguished from the first signal indicating that the base is grounded, ensures that the subsequent control unit 306 can issue a correct alarm signal.

The voltage detection unit 304 and the pressurization unit 308 can be implemented by a circuit, which can be integrated on the same circuit board, and those skilled in the art can also realize the above-mentioned units by other hardware and/or software methods that are considered suitable. No limit.

When the process is performed in the process chamber of the semiconductor equipment, the base needs to be raised and lowered to a suitable process position. The height of this position should meet: the base lifts the pressure ring to separate the pressure ring from the inner lining. In this way, it is necessary to determine the lowest position of the base when performing a process, that is, the lowest process position of the base. How to determine the appropriate minimum process position is also a technical problem in this field. The lowest process position refers to the lowest position of the base allowed by the execution process conditions. We usually use the position of the base 4 when the pressure ring 3 and the inner liner 2 are just separated, and the base 4 and the pressure ring 3 are just in a suspended state as the execution magnetic control position. The lowest process position of the chamber for the sputtering process. If the minimum process position is set too low, the process cannot be performed normally; if the minimum process position is too high, the adjustable space left for the base 4 when performing different processes is significantly smaller, and the larger the adjustable space, the subsequent realization. The more processes there are, correspondingly, the small adjustable space will significantly limit the execution of subsequent processes. In the prior art, it is necessary to open the chamber, connect one end of the test lead of the multimeter to the base 4, and the other end to the chamber wall 9, and manually monitor the guide between the base and the chamber wall by manually lifting the base 4. According to the general situation, to determine the lowest process position. This method is cumbersome to implement and will cause some disturbance to the chamber.

According to some embodiments of the present application, the control unit is further configured to record the position of the base as the first signal when receiving the output signal from the second signal to the first signal and then from the first signal to the second signal position and the second position, and compare the first position and the second position, and determine that the second position is the lowest process position when the first position is lower than the second position.

In an example, the distance between the base and the initial position may be used to characterize the position of the base.

In an example, the position of the base can be obtained through the operation information of the drive motor of the base, for example, the rising distance of the base can be obtained through the operation information of the drive motor.

According to the above exemplary embodiments of the present application, the lowest process position can be determined quickly and accurately without disturbing the chamber.

The output of the base grounding detection device according to the exemplary embodiment of the present application in different states is analyzed below with reference to FIG. 5(a), FIG. 5(b) and FIG. 5(c).

The inventor conducted an in-depth and detailed analysis of the entire process of the base rising from the initial position to the process position before the process was executed, the process execution process, and the process of the base descending from the process position to the initial position after the process was completed, and considered the base during process execution. Abnormal conditions of shorts to the chamber wall or lining, which are categorized according to the voltage state of the base:

(1) The base is in a suspended state, and there is no accumulated charge on the base;

(2) The base is in a suspended state, and there is accumulated negative charge on the base;

(3) The base is grounded.

In the rising stage of the base, before contacting the pressure ring and after lifting the pressure ring and separating the pressure ring from the inner lining, all belong to the above situation (1); in the descending stage of the base, the pressure ring is placed on the inner lining and connected After separation, it also belongs to the above-mentioned situation (1).

During the execution of the process, it belongs to the above-mentioned situation (2); when the base is lowered, and before the pressure ring is in contact with the lining, it also belongs to the above-mentioned situation (2).

In the rising stage of the base, the process is in contact with the pressure ring until the pressure ring is separated from the inner lining, which belongs to the case (3); in the descending stage of the base, the pressure ring is in contact with the inner lining until the base is separated from the pressure ring, and this process belongs to the situation ( 3); During the execution of the process, the presence of foreign matter causes the base to be short-circuited with the chamber wall or lining, which also belongs to the case (3).

Case (1) is analyzed here first. Figure 5(a) takes the state diagram of the base rising stage and before contacting the pressure ring as an example to analyze the situation (1), and other states that meet the situation (1) are similar. When the magnetron sputtering process is not performed in the magnetron sputtering chamber, except for the moment when the base lifts up the pressure ring during the rising process of the base, the base is in a suspended state in other cases, and there is no accumulated negative charge on the base . In this state, since there is no voltage signal at the acquisition voltage input terminal of the voltage signal acquisition unit, and the voltage detection unit judges whether the base is grounded through the voltage signal collected by the voltage signal acquisition unit, then the voltage of the base is not collected. signal, the voltage detection unit cannot compare with the set preset voltage signal, therefore, the pressure unit 308 provides a reference voltage signal. The voltage detecting unit 304 performs detection based on the reference voltage signal provided by the voltage applying unit 308, and compares the reference voltage signal with a preset voltage signal. The setting principle of the reference voltage signal is that its absolute value is greater than the preset voltage signal. Therefore, the voltage detection unit 304 sends a second signal to the control unit 306 as an output signal, the second signal indicating that the base is not grounded. In this way, when there is no voltage signal on the base, it can be compared and judged normally with the set comparison voltage. In one example, the preset voltage signal can be set to be 0.5V (volt), and the reference voltage signal can be set to be 15V.

Analyze the situation (2). Figure 5(b) takes the process execution as an example to analyze the situation (2), and other states that meet the situation (2) are similar. At this time, the magnetron sputtering process is performed in the chamber. As mentioned above, negative charges are accumulated on the suspended base, and the suspended base is in a negative voltage state, and the voltage signal acquisition unit 302 acquires the negative voltage signal. In the actual magnetron sputtering process, this is a negative voltage with a large amplitude, and the voltage detection unit 304 compares the voltage signal with the preset voltage signal, and the absolute value of the voltage signal is greater than the preset voltage signal. At this time, the voltage detection unit 304 sends a second signal to the control unit 306 to indicate that the base is not grounded.

Analyze the case (3). Figure 5(c) analyzes the case (3) by taking the state where the base is rising, the base is in contact with the pressure ring and the pressure ring is not separated from the lining as an example, and other states that meet the case (3) are similar. When the magnetron sputtering process is not carried out in the magnetron sputtering chamber, and the pedestal is in the process of rising, the pedestal rises to contact with the pressure ring and lifts the pressure ring from the moment when the inner lining is separated. At this time, The base is connected to the ground through the contact between the pressure ring and the lining; similarly, when the process is completed, the base should be lowered from the process position and the pressure ring should be restored to its original position. The moment the ring is detached and the pressure ring is placed on the lining, the base is connected to the ground through the contact between the pressure ring and the lining; or, when the base should be in a suspended state, but due to other abnormal conditions, it is connected to the ground When, for example, there is an abnormal situation in the magnetron sputtering process (such as: when there is a foreign object between the base and the chamber wall, the foreign object short-circuits the base and the chamber wall; or when the base is at a relatively low In the process position, the distance between the base and the lining is relatively close, if there is foreign matter falling between the lining and the base, there will be a short circuit between the base and the lining), in these cases the accumulation on the base The negative charge will be released, the potential of the base is equal to the ground, the voltage signal acquisition unit 302 collects the voltage signal of the base is 0, the voltage detection unit 304 compares the voltage signal with the preset voltage signal (0.5V), and the The absolute value is smaller than the preset voltage signal, so a first signal is output as an output signal and sent to the control unit 306, and the first signal indicates that the base is grounded.

Fig. 6(a) and Fig. 6(b) show schematic diagrams of determining the lowest process position according to an exemplary embodiment of the present application. For ease of description, the first signal is assumed to be a low-level signal, and the second signal is a high-level signal. If there is no abnormal situation that causes the base to be in a conductive state with the ground, the base will be in a conductive state with the ground only at the position shown in Figure 5(c). Since the pressure ring is in contact with the lining, the lining is connected to the ground, and the base is grounded when the base contacts the pressure ring. When determining the lowest process position, it is necessary to ensure that the base moves from bottom to top, because what we need is the position where the base and the pressure ring are separated from the lining.

Fig. 6(a) shows a schematic diagram of the susceptor raising process before performing the process. As shown in Figure 6(a), the base starts to move from the initial position. When the base moves to t1 seconds, the base contacts the pressure ring. According to the above analysis, at this time, because the base is grounded, the voltage detection unit 304 The output signal changes from the second signal (high level) to the first signal (low level), and at this time the position of the base is the first position (the position where the base contacts the pressing ring). As the base lifts the pressure ring and continues to move upward, when the base moves to t2 seconds, the base lifts the pressure ring to completely separate from the inner liner, and the connection point between the pressure ring and the inner liner is disconnected. The base is not grounded, the output signal of the voltage detection unit 304 changes from the first signal (low level) to the second signal (high level), and the position of the base is the second position (the base and the pressure ring are separated from the lining s position). The inventor has conducted in-depth research on this process. In the above process, at time t2, when the output signal of the voltage detection unit 304 changes from the first signal (low level) to the second signal (high level), the base and the The pressure ring has been completely disengaged from the inner liner, and the base and the pressure ring have just been disengaged from the inner liner, therefore, the above-mentioned second position can be determined as the lowest process position.

Figure 6(b) shows a schematic diagram of the susceptor lowering process after the execution process is completed. The base moves from the process position to the initial position, that is, the base moves from top to bottom. This is the process in which the base puts the lifted pressure ring back to the inner liner and then returns to the initial position. When the base moves to t3 seconds, the base and the pressure ring touch the lining, and the output signal of the voltage detection unit 304 changes from the second signal (high level) to the first signal (low level). When the base moves to t4 seconds, the pressure ring falls completely on the lining, and the base is separated from the pressure ring, and the generated signal of the voltage detection unit 304 changes from the first signal (low level) to the second signal (high level). flat). The output signal of the voltage detection unit 304 in Fig. 6(b) seems to be similar to that in Fig. 6(a), but after careful analysis, it can be found that at the time t3 when the above-mentioned generated signal changes, the base and the pressure ring have been in contact with the lining, That is, the pedestal has just passed the theoretical minimum process position downwards, therefore, the position of the pedestal at time t3 is not suitable as the minimum process position.

FIG. 7 shows a flow chart of a base ground detection method according to an embodiment of the present application. As shown in Fig. 7, the method includes steps S1-S3.

S1, collecting the voltage signal of the base;

S2. Determine whether the base is grounded according to the voltage signal and the preset voltage signal, and use the first signal as an output signal when the base is grounded, and the first signal indicates that the base is grounded;

In some possible implementation manners, step S2 specifically further includes:

The voltage signal is compared with the preset voltage signal, and if the absolute value of the voltage signal is smaller than the preset voltage signal, it is determined that the base is grounded, and the first signal is used as an output signal.

In some possible implementation manners, step S2 also includes:

If the absolute value of the voltage signal is greater than the preset voltage signal, it is determined that the base is not grounded, and the second signal is used as an output signal, and the second signal indicates that the base is not grounded.

In some possible implementations, the method also includes:

In the case of no voltage signal on the base, provide a reference voltage signal, compare the reference voltage signal with the preset voltage signal, and determine that the base is not grounded when the absolute value of the reference voltage signal is greater than the preset voltage signal, And take the second signal as the output signal, the second signal indicates that the base is not grounded.

In some possible implementations, the method also includes:

When receiving the output signal from the second signal to the first signal and then from the first signal to the second signal, the positions of the base are respectively recorded as the first position and the second position, and the first position and the second position are compared. Two positions, and when the first position is lower than the second position, determine the second position as the lowest process position.

For other details and aspects of this embodiment, please refer to the above, and details will not be repeated here.

Having described various embodiments of the present application above, the foregoing description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and alterations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

Claims

A pedestal grounding detection device used in semiconductor equipment, the pedestal is set in the process chamber for semiconductor process in the semiconductor equipment, and the pedestal is used to carry the wafer to be processed, its It is characterized in that the base grounding detection device includes a voltage signal acquisition unit, a voltage detection unit and a control unit; wherein:

The voltage signal acquisition unit is used to acquire the voltage signal of the base;

The voltage detection unit is configured to receive the voltage signal from the voltage signal acquisition unit, and determine whether the base is grounded according to the voltage signal and a preset voltage signal, and when the base is grounded, sending a first signal to the control unit as an output signal, the first signal indicating that the base is grounded;

The control unit is configured to instruct the semiconductor equipment to stop performing the process and send an alarm signal when receiving the first signal during the process of the semiconductor equipment performing the process.
The base grounding detection device according to claim 1, wherein the voltage detection unit is specifically used for:

receiving the voltage signal, and comparing the voltage signal with the preset voltage signal, if the absolute value of the voltage signal is smaller than the preset voltage signal, it is determined that the base is grounded, and the The first signal is used as the output signal.
The base grounding detection device according to claim 2, wherein the voltage detection unit is also used for:

If the absolute value of the voltage signal is greater than the preset voltage signal, it is determined that the base is not grounded, and a second signal is used as the output signal, the second signal indicating that the base is not grounded.
The base ground detection device according to claim 1, characterized in that the device further comprises a pressurization unit, and the pressurization unit is used to provide the voltage detection The unit provides a reference voltage signal, and the voltage detection unit is used to compare the reference voltage signal with the preset voltage signal, and determine when the absolute value of the reference voltage signal is greater than the preset voltage signal The base is not grounded, and a second signal is used as the output signal, the second signal indicating that the base is not grounded.
The base grounding detection device according to claim 3 or 4, wherein the control unit is further configured to change from the second signal to the first signal and then from the When the first signal changes to the second signal, the positions of the base are respectively recorded as the first position and the second position, and the first position and the second position are compared, and the When a position is lower than the second position, it is determined that the second position is the lowest process position.
A base grounding detection method used in semiconductor equipment, characterized in that the method comprises:

S1, collecting the voltage signal of the base;

S2. Determine whether the base is grounded according to the voltage signal and a preset voltage signal, and use a first signal as an output signal when the base is grounded, and the first signal indicates that the base is grounded;

S3. During the execution of the process, if the output signal is the first signal, stop the execution of the process and send an alarm signal.
The base grounding detection method according to claim 6, wherein the step S2 specifically comprises:

Comparing the voltage signal with the preset voltage signal, if the absolute value of the voltage signal is smaller than the preset voltage signal, it is determined that the base is grounded, and the first signal is used as the output Signal.
The base grounding detection method according to claim 7, wherein step S2 further comprises:

If the absolute value of the voltage signal is greater than the preset voltage signal, it is determined that the base is not grounded, and a second signal is used as the output signal, the second signal indicating that the base is not grounded.
The base grounding detection method according to claim 6, further comprising:

In the case of no voltage signal on the base, provide a reference voltage signal, and compare the reference voltage signal with the preset voltage signal, and when the absolute value of the reference voltage signal is greater than the preset voltage signal, determine that the base is not grounded, and use a second signal as the output signal, the second signal indicating that the base is not grounded.
The base grounding detection method according to claim 8 or 9, wherein the method further comprises:

When the output signal is received from the second signal to the first signal and then from the first signal to the second signal, the position of the base is respectively recorded as the first position and a second position, and comparing the first position and the second position, and determining that the second position is the lowest process position when the first position is lower than the second position.