JP2005210134A - Method of forming patterns - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent resist breakdown to obtain anisotropic patterns, without fail on etching-target films and to control the sizes of the patterns, in etching processes in which resist patterns formed of resist material for exposing to an ArF excimer laser are used. <P>SOLUTION: A wafer 11, on which a resist pattern 16 is formed, is placed into a dry-etching device, and then dry etching is implemented on an antireflection film 15 and a silicon nitride film 14, using the resist pattern 16 as an etching mask. Hereby, both a first sediment 107A and a second sediment 17B, deposited inside and outside each of the resist pattern 16 segments, respectively, are attached thick, relative to the center of the wafer 11. A mixed gas of SF<SB>6</SB>, CHF<SB>3</SB>and Ar is employed for the etchant gas here. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a pattern formation method for patterning a film to be etched using a resist pattern as a mask, and in particular, a pattern for performing dry etching using a resist pattern made of a resist material that is sensitive to exposure light having a wavelength shorter than that of an ArF excimer laser beam as a mask. It relates to a forming method.

  As a microfabrication method in a semiconductor integrated circuit element, a method of forming a desired circuit element pattern on a film to be etched by forming a mask pattern with a resist material and performing etching using the resist pattern as a mask is generally used.

  The circuit element pattern formed at this time is etched almost perpendicularly to the main surface of the film to be etched so that the pattern dimension is substantially the same as the dimension of the mask pattern (anisotropic etching). ).

Hereinafter, a conventional pattern forming method using an insulating film as an etching target will be described with reference to FIGS. 11A to 11E (for example,
See).

  First, as shown in FIG. 11A, a silicon oxide film 102 having a thickness of about 20 nm is formed on a wafer 101 made of silicon by, eg, thermal oxidation or vapor deposition, and then silicon A polysilicon film 103 having a thickness of about 20 nm and a silicon nitride film 104 having a thickness of about 120 nm are sequentially formed on the oxide film 102 by, for example, chemical vapor deposition (CVD).

  Next, as shown in FIG. 11B, an antireflection film 105 for preventing reflection due to exposure is formed on the silicon nitride film 104. The antireflection film 105 is made of, for example, a silicon oxynitride film formed by a plasma CVD method, and a film thickness of about 40 nm is appropriate. Further, an organic film can be used as the antireflection film 105. In that case, the film thickness is appropriately about 80 nm and can be formed by a coating method.

  Subsequently, a resist film 106A for KrF excimer laser exposure is applied on the antireflection film 105 to a thickness of about 550 nm, and a photomask in which a circuit pattern of a semiconductor device is formed above the resist film 106A (FIG. After alignment, the resist film 106A is exposed with exposure light that has passed through the photomask.

  Next, as shown in FIG. 11C, the exposed resist film 106 </ b> A is developed to form a resist pattern 106.

Next, as shown in FIG. 11D, dry etching using a predetermined etching gas is performed on the antireflection film 105 and the silicon nitride film 104 using the formed resist pattern 106 as an etching mask. As the etching gas, a mixed gas containing mainly a gas having an etching action and a gas that generates a deposit made of a reaction product at the time of etching is used, so that a film to be etched (antireflection film 105 and silicon during etching) is used. Deposit 107 is deposited on each side surface of nitride film 104) that is being patterned. At this time, when the deposition amount of the deposit 107 and the etching rate by the etching gas are balanced, a silicon nitride film 104 having a pattern shape substantially perpendicular to the substrate surface as shown in FIG. 11E can be obtained. it can.
“Semiconductor Dry Etching Technology” by Tokuyama Kei, Sangyo Tosho Co., Ltd., October 1992, p. 81-89

  In recent years, semiconductor elements in semiconductor integrated circuits have been increasingly miniaturized, and accordingly, the wavelength of exposure light for exposing a resist pattern has been shortened. Conventionally, in accordance with the dimensions required for the circuit pattern, for example, a gr line (wavelength 436 nm) that is an emission line of a mercury lamp, an i line (wavelength 365 nm), and a KrF excimer laser beam (instead of the emission line of a mercury lamp) A wavelength of 248 nm) has been used.

  However, KrF excimer laser light having a wavelength of 248 nm cannot be used to expose a circuit pattern having a line width smaller than 130 nm. Therefore, an ArF excimer laser beam having a wavelength of 194 nm is being used as a light source for exposing a finer circuit pattern.

  For resists sensitive to g-line or i-line, a benzene ring-based resin material such as novolak is used as a material having etching resistance. When the resin material is used for ArF excimer laser light, the resin material is in this wavelength band. Has strong absorption. For this reason, an acrylic resin material is often used for the resist material for ArF excimer laser exposure.

  However, the acrylic resin material is not as strong as the benzene ring resin material, so even if a good pattern shape is obtained immediately after development, the resist pattern collapses during etching, so-called resist collapse. There is a problem that occurs.

  Further, regarding the aspect ratio of the resist pattern, the KrF excimer laser photosensitive resist material has an aspect ratio of about 3, whereas the ArF excimer laser photosensitive resist material has an aspect ratio of about 4. In this respect, resist collapse more easily occurs than the resist material for KrF excimer laser exposure.

  In the etching process using a resist pattern made of a resist material for ArF excimer laser exposure in view of the above-described conventional problems, the resist is prevented from falling and an anisotropic shape is reliably obtained in the film to be etched. The purpose is to be able to control the dimensions.

  In order to achieve the above object, the present invention provides a pattern forming method using a resist pattern made of a resist material that is sensitive to exposure light having a wavelength shorter than that of an ArF excimer laser beam, at least with respect to the radial direction of the wafer in the resist pattern. Etching is performed while depositing a relatively thick deposit on both side surfaces of a portion having a vertical side surface, or etching is performed so that no deposit is deposited on both side surfaces.

  The inventor of the present application has studied the resist pattern made of a resist material that is sensitive to exposure light having a wavelength shorter than that of the ArF excimer laser light, and as a result of various investigations regarding the resist collapse during etching, as a result, ascertained the following cause and obtained knowledge. ing.

  FIG. 1 shows a case where a resist pattern for ArF excimer laser exposure is used, and the results of plotting the respective dimensional conversion differences while changing the initial value of the resist pattern dimension for each of the five etching conditions (A to E). Show. Here, the resist pattern dimension refers to the line width of a pattern having a line shape, and the values of dimensional conversion differences relating to the same etching conditions are connected by straight lines.

  As shown in FIG. 1, in the case of etching conditions A and C with a dimensional conversion difference of about 4 nm to 10 nm, it can be seen that when the initial value of the resist pattern is smaller than 130 nm, resist collapse occurs in all patterns. . On the other hand, in the case of the etching condition D in which the dimensional conversion difference is 20 nm or more or the etching condition E in which it is about −15 nm, it can be seen that resist collapse does not occur.

  Here, for comparison, a case where a resist pattern for KrF excimer laser exposure is used will be described.

  FIG. 2 shows a case in which a resist pattern for KrF excimer laser exposure is used, and the results of plotting the respective dimensional conversion differences while changing the initial value of the resist pattern dimension for each of the five etching conditions (1 to 5). Show. Also here, the values of the dimensional conversion differences according to the same etching conditions are connected by straight lines.

  As shown in FIG. 2, when resist patterns for KrF excimer laser exposure are used, resist collapse does not occur in all resist patterns, so that a dimensional conversion difference within ± 10 nm with respect to the resist pattern dimensions. In addition, it is possible to finish the dimensions of the resist pattern.

  The value of the dimensional conversion difference is proportional to the amount of deposits that adhere to the sidewall during etching. Therefore, the condition with a large dimensional conversion difference is equivalent to an etching condition in which the amount of deposit (sidewall deposit) deposited on the sidewall of the resist pattern is relatively large. That is, as can be seen from FIG. 1, in the case of an ArF excimer laser photosensitive resist, the amount of sidewall deposit generated during etching is made larger than the etching amount, or the amount of sidewall deposit deposited is made smaller than the etching amount. If this happens, resist collapse will not occur.

  In the first place, resist collapse occurs when the stresses on both sides of the resist pattern are different in magnitude and more than the strength of the resist is applied. The source of stress applied to the resist pattern is considered to be mainly due to self-shrinkage of the resist pattern due to heat. It is well known that the resist pattern is heated and contracted by being exposed to ions during etching.

  As shown in FIG. 3A, generally, the linear pattern (line pattern) is parallel to the first line pattern 104A arranged perpendicular to the radial direction of the wafer 101 and parallel to the radial direction. In the case of the first line pattern 104A arranged perpendicular to the radial direction, there is an amount of deposit adhering on the side surface facing the inside of the wafer 101. Many deposits are less on the side facing outward. In addition, the difference in the adhesion amount is particularly noticeable at the peripheral edge of the wafer 101. That is, as shown in FIG. 3A, for example, when the center line including the notch 101a used for discriminating the crystal direction of the wafer 101 is defined as the X axis, the second side surfaces intersecting with the Y axis perpendicular to the X axis. Of one line pattern 104 </ b> A, more deposits adhere to the inner side surface of the pattern formed on the peripheral portion of the wafer 101. Similarly, in the case shown in FIG. 3B, of the first line pattern 104A and the second line pattern 104B, of the first line pattern 104A having the side surface intersecting with the X axis, More deposits adhere to the inner side of the pattern formed at the periphery.

  In the following, the manner in which resist collapse occurs together with the phenomenon of resist shrinkage will be described in detail with reference to the cross-sectional views of FIGS. 4 (a) to 4 (d).

  First, as shown in FIG. 4A, an ArF excimer laser photosensitive resist pattern 108 with an antireflection film 105 interposed is formed on a silicon nitride film 104 on a wafer 101.

  In FIG. 4B, assuming that the left direction of the drawing is the center direction (inner side) of the wafer 101 and the resist pattern 108 is used as a mask, dry etching is started on the antireflection film 105 and the silicon nitride film 105. The first deposit 107A deposited inside 108 adheres thicker than the second deposit 107B deposited outside. In addition, in the case of a pattern in which the intervals (spaces) between adjacent lines are arranged in an unbalanced manner, the amount of deposit attached inevitably becomes unbalanced.

  Next, as shown in FIG. 4C, when the resist pattern 108 to which the first and second deposits 107A and 107B having different thicknesses adhere is contracted due to the temperature rise, the second deposition with a small deposition amount is performed. When the stress resistance strength of the resist 107B against the resist and the stress resistance strength of the resist itself are smaller than the stress due to shrinkage, resist collapse occurs. If etching is continued in this state, the state shown in FIG.

  Based on this phenomenon, the first knowledge for preventing resist collapse will be described with reference to FIGS. 5 (a) to 5 (d).

  First, as shown in FIG. 5A, an ArF excimer laser photosensitive resist pattern 108 with an antireflection film 105 interposed is formed on a silicon nitride film 104 on a wafer 101.

  Next, as shown in FIG. 5 (b), for example, as shown in the etching condition D shown in FIG. . In this way, the amount of the second deposit 107B deposited outside the resist pattern 108 is also increased.

  As a result, even when the resist pattern 108 contracts as shown in FIG. 5C, the stress resistance strength of the second deposit 107B is sufficiently increased, so that the resist pattern 108 can withstand the contracting stress. obtain. As a result, when the etching is further advanced using the resist pattern 108 contracted without falling as a mask, a circuit pattern can be formed without causing the resist falling as shown in FIG. However, in this case, a dimensional conversion difference corresponding to the deposition amount of the deposits 107A and 107B having a thickness that can withstand the stress occurs.

  Next, the second knowledge for preventing resist collapse will be described with reference to FIGS. 6 (a) to 6 (d).

  First, as shown in FIG. 6A, a resist pattern 108 for ArF excimer laser exposure with an antireflection film 105 interposed is formed on a silicon nitride film 104 on a wafer 101.

  Next, as shown in FIG. 6B, for example, as shown in the etching conditions B and E shown in FIG. 1, the dry deposition is such that the sidewall deposit hardly adheres to the antireflection film 105 and the silicon nitride film 105. Etching is performed. Therefore, in this case, the deposit does not adhere to the both side walls of the resist pattern 108 in an unbalanced manner.

  Next, as shown in FIG. 6C, even if the resist pattern 108 contracts during etching, there is no difference in the stress resistance due to the difference in the amount of deposited sidewall deposits. There is no stress to cause the fall. However, it is premised that the cross-sectional shape of the resist pattern 108 does not have a shape that easily falls down like a reverse taper.

  Next, as shown in FIG. 6D, when the etching further proceeds using the resist pattern 108 contracted without falling as a mask, a circuit pattern can be formed without causing the resist falling.

  Note that side wall deposits deposited on both side surfaces of a portion having side surfaces parallel to the radial direction of the wafer 101 in the resist pattern 101 do not cause a problem because they are not originally unbalanced.

  The pattern forming method according to the present invention is made based on these findings, and the resist pattern side wall deposit is thickened to the extent that it can withstand stress during dry etching, or under etching conditions in which the side wall deposit is hardly deposited. Perform dry etching.

  Specifically, the first pattern forming method according to the present invention includes a first step of forming an etching target film on the wafer, and an ArF excimer laser beam or a shorter wavelength on the etching target film. A second step of forming a resist pattern made of a resist material that is sensitive to exposure light, and a third step of etching the film to be etched using the resist pattern as a mask. The etching film is etched while depositing a relatively thick deposit on both side surfaces of a portion having a side surface perpendicular to the radial direction of the wafer in the resist pattern.

  According to the first pattern forming method, etching is performed while depositing a relatively thick deposit on both sides of a portion having a side surface perpendicular to the radial direction of the wafer in the resist pattern with respect to the etching target film. To do. For this reason, even if the resist pattern undergoes thermal shrinkage, the stress resistance strength of the relatively thick deposits increases on both sides of the resist pattern and is almost balanced, so that resist collapse can be prevented. Thus, an anisotropic shape can be obtained in the film to be etched.

  In the first pattern forming method, the third step is preferably performed so that the pattern size after etching in the etching target film is larger than a predetermined size.

  In the first pattern forming method, the dimensional conversion difference of the pattern dimension in the film to be etched is preferably + 20% to + 80%.

  The second pattern forming method according to the present invention is sensitive to a first step of forming a film to be etched on a wafer and ArF excimer laser light or exposure light having a shorter wavelength on the film to be etched. A second step of forming a resist pattern made of a resist material to be etched, and a third step of etching the film to be etched using the resist pattern as a mask. The third step is performed on the film to be etched. Then, the resist pattern is etched so that deposits are not deposited on both side surfaces of at least a portion having side surfaces perpendicular to the radial direction of the wafer.

  According to the second pattern forming method, the etching target film is etched so as not to deposit deposits on both side surfaces of a portion having a side surface perpendicular to the radial direction of the wafer in the resist pattern. For this reason, even if the resist pattern undergoes thermal shrinkage, deposits do not accumulate on both sides of the resist pattern, and the stress applied to the resist pattern does not become unbalanced, so resist collapse can be prevented. As a result, an anisotropic shape can be obtained in the film to be etched.

  In the second pattern forming method, the third step is preferably performed such that the pattern dimension after etching in the film to be etched is smaller than a predetermined dimension.

  In this case, the dimensional conversion difference of the pattern dimension in the film to be etched is preferably ± 0% to −30%.

  The third pattern forming method according to the present invention includes a first step of forming a film to be etched, and a resist material that is sensitive to ArF excimer laser light or exposure light having a shorter wavelength on the film to be etched. And a third step for etching the film to be etched using the resist pattern as a mask. The third step is a step of resisting the film to be etched. Etching while depositing relatively thick deposits on both side surfaces of the pattern, and etching the film to be etched so that the deposits do not deposit on both side surfaces of the resist pattern Step (b).

  According to the third pattern forming method, the step (a) of etching the film to be etched while depositing relatively thick deposits on both side surfaces of the resist pattern; And a step (b) of performing etching so that deposits are not deposited on both side surfaces of the resist pattern. For this reason, even if the value of the dimension conversion difference becomes large due to the relatively thick deposit in step (a), the value of the dimension conversion difference becomes negative in the next step (b). Can be obtained.

  In the third pattern forming method, the film to be etched is formed on the wafer, and both side surfaces of the resist pattern are both side surfaces of a portion having a side surface perpendicular to the radial direction of the wafer in the resist pattern. It is preferable.

  In step (a) in the third step in this case, etching is performed so that the pattern dimension after etching in the etched film is larger than a predetermined dimension, and in step (b) in the third process, etching is performed on the film to be etched. It is preferable that the etching condition is set so that the deposit is etched, and etching is performed so that the pattern dimension after etching in the film to be etched is smaller than a predetermined dimension.

  In this case, the dimensional conversion difference of the pattern dimension in the film to be etched is preferably ± 0% to + 20%.

In the first or third pattern formation method, the film to be etched is made of silicon, a silicon compound, carbon, or a carbon compound, and etching performed while depositing a relatively thick deposit in the third step proceeds with etching. SF ₆ is used as the first etching gas, and at least one of CF ₄ , CHF ₃ , CH ₂ F _2, and CH ₄ is used as the second etching gas that generates deposits on the side surfaces of the resist pattern. It is preferable to use Ar, He, Ne, or Xe as the dilution gas for diluting the first etching gas and the second etching gas.

In the second or third pattern forming method, the film to be etched is made of silicon, a silicon compound, carbon, or a carbon compound, and the etching performed so as not to deposit the deposit in the third step is a first process that advances the etching. SF ₆ that is an etching gas, CF ₄ or CHF ₃ that is a second etching gas that causes the etching to progress and also a deposit, and CH ₂ F ₂ that is a third etching gas that causes a deposit And at least one of CH ₄ and at least one of SF ₆ , O ₂ , O ₃ , CO and CO ₂ , which are the fourth etching gases for etching the deposit, A first combination of a second etching gas, a third etching gas, and a fourth etching gas. The first mixed gas and the second mixed gas are diluted by using a mixed gas or a second mixed gas in which the first etching gas or the second etching gas and the fourth etching gas are combined. Ar, He, Ne or Xe is preferably used as the dilution gas.

  According to the first pattern forming method of the present invention, even if the resist pattern undergoes thermal shrinkage, the stress resistance strength of the relatively thick deposit increases on both sides of the resist pattern and is almost balanced. Since resist collapse can be prevented, an anisotropic shape can be obtained in the film to be etched.

  According to the second pattern forming method of the present invention, even if the resist pattern undergoes thermal shrinkage, deposits are not deposited on both sides of the resist pattern, and stress applied to the resist pattern does not become unbalanced. Since resist collapse can be prevented, an anisotropic shape can be obtained in the film to be etched.

  According to the third pattern forming method of the present invention, even if the value of the dimension conversion difference is increased due to the relatively thick deposit in the step (a), the value of the dimension conversion difference in the next step (b). Therefore, a desired processing dimension can be obtained.

(First embodiment)
First, an outline of a dry etching apparatus used in the pattern forming method according to the first embodiment of the present invention will be described.

  The dry etching apparatus shown in FIG. 7 is a dry etching apparatus adopting a UHF (Ultra High Frequency) -ECR (Electron Cyclotron Resonance) plasma system, and as shown in FIG. 52, the upper electrode 53 having a plurality of holes 53a penetrating in the front and back direction, and the lower electrode 55 which is held on the holding table 54 and holds the wafer 11 on the upper surface thereof. Are spaced apart from each other and are provided opposite to each other.

  The upper electrode 53 is electrically connected to the first high frequency power source 56, and the lower electrode 55 is electrically connected to the second high frequency power source 57.

  A lid member 58 that covers the upper electrode holding member 52 and the upper electrode 53 is airtightly provided above the reaction chamber 51. A gas introduction hole 58 a is provided inside the lid member 58, and an outlet thereof opens above the upper electrode 53.

  A waveguide 59 for propagating electromagnetic waves is provided on the lid member 58 and above the central portion of the upper electrode 53, and a UHF wave is provided at the end of the waveguide 59 opposite to the lid member 58. An electromagnetic wave oscillator 60 that oscillates is connected.

  An exhaust port 61 for exhausting the gas in the reaction chamber 51 is provided at the lower part of the side surface of the reaction chamber 51, and the reaction chamber 51 is brought into a predetermined vacuum state by an exhaust pump 62 provided in the exhaust port 61. To be kept.

  The lower part of the holding table 54 for holding the lower electrode 55 is supported by a support member 63, and the position of the wafer 11 is the optimum position for the plasma density generated in the reaction chamber 51. Thus, a mechanism for moving the holding base 54 up and down is provided.

  Hereinafter, an example of obtaining a circuit pattern having a dimensional conversion difference of about 30 nm from a resist pattern having a line width of 100 nm from a film to be etched using the dry etching apparatus having the above-described configuration will be described in detail with reference to the drawings. To do.

  FIG. 8A to FIG. 8D show partial sectional configurations of wafers in the order of processes in the pattern forming method according to the first embodiment of the present invention.

  First, as shown in FIG. 8A, a silicon oxide film 12 having a thickness of about 20 nm is formed on a silicon wafer 11 by, eg, thermal oxidation or vapor deposition, and then silicon. A polysilicon film 13 having a thickness of about 20 nm and a silicon nitride film 14 having a thickness of about 120 nm are sequentially formed on the oxide film 12 by, for example, chemical vapor deposition (CVD). Thereafter, an antireflection film 15 for preventing exposure light from reflecting is formed on the silicon nitride film 14. The antireflection film 15 is made of, for example, a silicon oxynitride film formed by a plasma CVD method, and a film thickness of about 40 nm is appropriate. The antireflection film 15 may be an organic film formed by a coating method. In this case, an appropriate film thickness is about 80 nm. Subsequently, a resist film 16A for ArF excimer laser exposure is applied on the antireflection film 15 to a thickness of about 400 nm, and a photomask in which a circuit pattern of a semiconductor device is formed above the resist film 16A (FIG. After alignment, the resist film 16A is exposed with exposure light that has passed through the photomask.

  Next, as illustrated in FIG. 8B, the exposed resist film 16 </ b> A is developed to form a resist pattern 16. Here, the resist pattern 16 </ b> A shows a cross section of a portion extending in a direction perpendicular to the radial direction of the wafer 11.

Next, as shown in FIG. 8C, the wafer 11 on which the resist pattern 16 is formed is put into a dry etching apparatus, and the resist pattern 16 is used as an etching mask to the antireflection film 15 and the silicon nitride film 14. Perform dry etching. As the etching gas at this time, for example, a mixed gas of sulfur hexafluoride (SF ₆ ), trifluoromethane (CHF ₃ ), and argon (Ar) is used.

The ratio of the reactive gas to the non-reactive gas that dilutes it, that is, the value of (SF ₆ + CHF ₃ ) / Ar is controlled in the range of 0.04 to 0.1, and the ratio between sulfur hexafluoride and trifluoromethane is The value of the ratio (SF ₆ / CHF ₃ ) is controlled in the range of 1 to 2.5.

  The pressure in the reaction chamber 51 is controlled in the range of 0.5 Pa to 4 Pa, the power of the UHF wave oscillated by the electromagnetic wave oscillator 60 is controlled in the range of 200 W to 1000 W, and the RF power applied to the upper electrode 53 is 100 W to 800 W. The RF power applied to the lower electrode 55 is controlled in the range of 50W to 800W.

  The temperature of the lower electrode 55 is controlled in the range of −20 ° C. to 40 ° C., the temperature of the wall surface of the reaction chamber 51 is controlled in the range of 0 ° C. to 60 ° C., and the distance between the upper electrode 53 and the lower electrode 55 is 10 mm to Control within a range of 120 mm.

  In the first embodiment, the etching conditions are set so that the dimensional conversion difference is about 30 nm.

The detailed examples are listed below.
・ Reactive gas (SF ₆ ) flow rate: 40 ml / min
-Reactive gas (CHF ₃ ) flow rate: 20 ml / min
-Flow rate of dilution gas (Ar): 1000 ml / min
・ Reaction chamber pressure: 2 Pa
・ UHF wave power: 600W
-RF power for upper electrode: 400W
・ RF power for the lower electrode: 150 W
-Lower electrode temperature: 20 ° C
・ Reaction chamber wall temperature: 30 ℃
・ Distance between electrodes: 30mm
Under this etching condition, as shown in FIG. 8C, both the first deposit 17A deposited inside the resist pattern 16 and the second deposit 17B deposited outside thereof are relatively thick. Adhere to.

  As a result, as shown in FIG. 8D, even if the resist pattern 16 contracts due to exposure to ions during etching, the first deposit is deposited oppositely on both side surfaces of the resist pattern 16. Since the thicknesses of 17A and second deposit 17B are substantially balanced, the stress resistance strength of both deposits 17A and 17B is also balanced, so that resist collapse does not occur.

  Further, even when the value of the dimensional conversion difference is made larger than 30 nm, the resist collapse can be similarly prevented by changing the parameter value in the above etching condition within a predetermined control range. Can be realized.

(Second Embodiment)
Hereinafter, in the second embodiment of the present invention, using the dry etching apparatus shown in FIG. 7, a circuit pattern having a dimensional conversion difference value of about −10 nm from a film to be etched by a resist pattern having a line width of 100 nm. A pattern forming method for obtaining the above will be described with reference to the drawings.

  FIG. 9A to FIG. 9D show partial sectional configurations of wafers in the order of processes in the pattern forming method according to the second embodiment of the present invention.

  First, as shown in FIG. 9A, a silicon oxide film 12 having a thickness of about 20 nm is formed on a silicon wafer 11 by, for example, a thermal oxidation method or a vapor phase growth method. A polysilicon film 13 having a thickness of about 20 nm and a silicon nitride film 14 having a thickness of about 120 nm are sequentially formed on the oxide film 12 by, eg, CVD. Thereafter, an antireflection film 15 for preventing exposure light from reflecting is formed on the silicon nitride film 14. The antireflection film 15 is made of, for example, a silicon oxynitride film formed by a plasma CVD method, and a film thickness of about 40 nm is appropriate. The antireflection film 15 may be an organic film formed by a coating method. In this case, an appropriate film thickness is about 80 nm. Subsequently, a resist film 16A for ArF excimer laser exposure is applied on the antireflection film 15 to a thickness of about 400 nm, and a photomask in which a circuit pattern of a semiconductor device is formed above the resist film 16A (FIG. After alignment, the resist film 16A is exposed with exposure light that has passed through the photomask.

  Next, as illustrated in FIG. 9B, the exposed resist film 16 </ b> A is developed to form a resist pattern 16. Again, the resist pattern 16A shows a cross section of a portion extending in a direction perpendicular to the radial direction of the wafer 11.

Next, as shown in FIG. 9C, the wafer 11 on which the resist pattern 16 is formed is put into a dry etching apparatus, and the resist pattern 16 is used as an etching mask to the antireflection film 15 and the silicon nitride film 14. Perform dry etching. As the etching gas at this time, for example, a mixed gas of oxygen (O ₂ ), trifluoromethane (CHF ₃ ), and argon (Ar) is used.

The ratio of the reactive gas to the non-reactive gas that dilutes it, that is, the value of (O ₂ + CHF ₃ ) / Ar is controlled in the range of 0.02 to 0.1, and the ratio of oxygen to trifluoromethane (O The value of ₂ / CHF ₃ ) is controlled within the range of 0.1-1.

  The pressure in the reaction chamber 51 is controlled in the range of 0.5 Pa to 4 Pa, the power of the UHF wave oscillated by the electromagnetic wave oscillator 60 is controlled in the range of 200 W to 1000 W, and the RF power applied to the upper electrode 53 is 100 W to 800 W. The RF power applied to the lower electrode 55 is controlled in the range of 50W to 800W.

  The temperature of the lower electrode 55 is controlled in the range of −20 ° C. to 40 ° C., the temperature of the wall surface of the reaction chamber 51 is controlled in the range of 0 ° C. to 60 ° C., and the distance between the upper electrode 53 and the lower electrode 55 is 10 mm to Control within a range of 120 mm.

  In the second embodiment, the etching conditions are set so that the dimensional conversion difference is about −10 nm.

The detailed examples are listed below.
-Reactive gas (CHF ₃ ) flow rate: 60 ml / min
-Reactive gas (O ₂ ) flow rate: 20 ml / min
-Flow rate of dilution gas (Ar): 1000 ml / min
・ Reaction chamber pressure: 2 Pa
・ UHF wave power: 600W
-RF power for upper electrode: 400W
-RF power for the lower electrode: 200W
-Lower electrode temperature: 20 ° C
・ Reaction chamber wall temperature: 30 ℃
・ Distance between electrodes: 90mm
By using this etching condition, deposits hardly adhere to both side walls of the resist pattern 16 as shown in FIG.

  As a result, as shown in FIG. 9 (d), even if the resist pattern 16 contracts due to exposure to ions during etching, the contraction stress applied to the resist pattern 16 is balanced on both sides. There is no fall.

  Further, even when the value of the dimensional conversion difference is increased to an absolute value larger than −10 nm, the resist collapse can be prevented by changing the parameter value in the above etching condition within a predetermined control range. Therefore, a desired processing dimension can be realized.

(Third embodiment)
Hereinafter, in the third embodiment of the present invention, using the dry etching apparatus shown in FIG. 7, a circuit pattern having a dimensional conversion difference value of approximately 0 nm from a film to be etched by a resist pattern having a line width of 100 nm. A pattern forming method for obtaining the above will be described with reference to the drawings.

  FIG. 10A to FIG. 10D show partial sectional configurations of wafers in the order of processes in the pattern forming method according to the third embodiment of the present invention.

  First, as shown in FIG. 10A, a silicon oxide film 12 having a thickness of about 20 nm is formed on a wafer 11 made of silicon by, eg, thermal oxidation or vapor phase growth, and then silicon. A polysilicon film 13 having a thickness of about 20 nm and a silicon nitride film 14 having a thickness of about 100 nm are sequentially formed on the oxide film 12 by, eg, CVD. Thereafter, an antireflection film 15 for preventing exposure light from reflecting is formed on the silicon nitride film 14. The antireflection film 15 is made of, for example, a silicon oxynitride film formed by a plasma CVD method, and a film thickness of about 35 nm is appropriate. The antireflection film 15 may be an organic film formed by a coating method. In this case, an appropriate film thickness is about 80 nm. Subsequently, a resist film 16A for ArF excimer laser exposure is applied on the antireflection film 15 to a thickness of about 400 nm, and a photomask in which a circuit pattern of a semiconductor device is formed above the resist film 16A (FIG. After alignment, the resist film 16A is exposed with exposure light that has passed through the photomask.

  Next, as illustrated in FIG. 10B, the exposed resist film 16 </ b> A is developed to form a resist pattern 16. Also here, the resist pattern 16 </ b> A shows a cross section of a portion extending in a direction perpendicular to the radial direction of the wafer 11.

Next, as shown in FIG. 10C, the wafer 11 on which the resist pattern 16 is formed is put into a dry etching apparatus, and the resist pattern 16 is used as an etching mask to the antireflection film 15 and the silicon nitride film 14. Perform dry etching. In the third embodiment, when the etching of the silicon nitride film 14 proceeds about 70 nm, the etching of the silicon nitride film 14 is temporarily stopped. As the etching gas at this time, similarly to the first embodiment, for example, a mixed gas of sulfur hexafluoride (SF ₆ ), trifluoromethane (CHF ₃ ), and argon (Ar) is used.

The ratio of the reactive gas to the non-reactive gas that dilutes it, that is, the value of (SF ₆ + CHF ₃ ) / Ar is controlled in the range of 0.04 to 0.1, and the ratio between sulfur hexafluoride and trifluoromethane is The value of the ratio (SF ₆ / CHF ₃ ) is controlled in the range of 1 to 2.5.

  The pressure in the reaction chamber 51 is controlled in the range of 0.5 Pa to 4 Pa, the power of the UHF wave oscillated by the electromagnetic wave oscillator 60 is controlled in the range of 200 W to 1000 W, and the RF power applied to the upper electrode 53 is 100 W to 800 W. The RF power applied to the lower electrode 55 is controlled in the range of 50W to 800W.

  The temperature of the lower electrode 55 is controlled in the range of −20 ° C. to 40 ° C., the temperature of the wall surface of the reaction chamber 51 is controlled in the range of 0 ° C. to 60 ° C., and the distance between the upper electrode 53 and the lower electrode 55 is 10 mm to Control within a range of 120 mm.

  In the first-stage etching process in which the lower part of the silicon nitride film 14 is left, as in the first embodiment, etching conditions are used such that the dimensional conversion difference is 30 nm or more.

For example, when the dimensional conversion difference is 30 nm,
・ Reactive gas (SF ₆ ) flow rate: 40 ml / min
-Reactive gas (CHF ₃ ) flow rate: 20 ml / min
-Flow rate of dilution gas (Ar): 1000 ml / min
・ Reaction chamber pressure: 2 Pa
・ UHF wave power: 600W
-RF power for upper electrode: 400W
・ RF power for the lower electrode: 150 W
-Lower electrode temperature: 20 ° C
・ Reaction chamber wall temperature: 30 ℃
・ Distance between electrodes: 30mm
Under this etching condition, as shown in FIG. 10C, both the first deposit 107A deposited inside the resist pattern 16 and the second deposit 17B deposited outside the resist pattern 16 are relatively thick. Adhere to.

Next, as shown in FIG. 10 (d), the condition in which the first deposit 17A and the second deposit 17B do not adhere, that is, the condition in which these deposits 17A and 17B are etched, in other words, the dimension. Etching for the remaining silicon nitride film 14 is resumed under an etching condition in which the conversion difference becomes negative, and a desired circuit pattern is formed from the silicon nitride film 14. As the etching gas at this time, for example, a mixed gas of oxygen (O ₂ ), trifluoromethane (CHF ₃ ), and argon (Ar) is used as in the second embodiment.

The ratio of the reactive gas to the non-reactive gas that dilutes it, that is, the value of (O ₂ + CHF ₃ ) / Ar is controlled in the range of 0.02 to 0.1, and the ratio of oxygen to trifluoromethane (O The value of ₂ / CHF ₃ ) is controlled within the range of 0.1-1.

  In the third embodiment, each etching parameter value is changed so that the final value of the dimensional conversion difference is approximately 0 nm. For example, in this second stage etching process, each etching parameter value is set so that the dimensional conversion difference is -30 nm or less.

The detailed examples are listed below.
・ Reactive gas (O ₂ ) flow rate: 30 ml / min
-Reactive gas (CHF ₃ ) flow rate: 60 ml / min
-Flow rate of dilution gas (Ar): 1000 ml / min
・ Reaction chamber pressure: 2 Pa
・ UHF wave power: 400W
-RF power for upper electrode: 400W
-RF power for the lower electrode: 300W
-Lower electrode temperature: 20 ° C
・ Reaction chamber wall temperature: 30 ℃
・ Distance between electrodes: 30mm
Thus, in the third embodiment in which the value of the dimensional conversion difference is approximately 0 nm, the dimensional conversion difference is once increased to a positive value with respect to the silicon nitride film 14 as shown in FIG. By performing the first-stage etching, and then performing the second-stage etching in which the dimensional conversion difference is negative, resist collapse can be prevented, so that a circuit pattern in which the dimensional conversion difference is almost zero is obtained. be able to.

  Similarly, when the desired dimension conversion difference value is 0 nm to 30 nm, the sum of the positive dimension conversion difference value in the first stage and the negative dimension conversion difference in the second stage is the desired dimension conversion difference. It is preferable to change the parameter value of each etching step so that the value becomes.

  Contrary to the third embodiment, in the first stage etching process, etching in which the dimensional conversion difference once becomes a negative value, that is, etching in which deposits are not deposited on both side surfaces of the resist pattern 16 is performed. Then, in the second stage etching process, the dimensional conversion difference becomes a positive value, that is, etching is performed so as to deposit relatively thick deposits 17A and 17B on both side surfaces of the resist pattern 16, and The resist collapse can be prevented by selecting an etching condition such that the sum of the dimensional conversion difference at the first stage and the dimensional conversion difference at the second stage becomes a desired value. As a result, a circuit pattern having a desired dimension can be reliably formed.

In each of the first and third embodiments, as the etching gas for increasing the width dimension of the resist pattern 16 by the deposit, that is, for increasing the thickness, sulfur hexafluoride (SF ₆ ), trifluoromethane (CHF ₃ ), and Although a mixed gas containing argon (Ar) was used, it is not limited to trifluoromethane (CHF ₃ ), but also methane (CH ₄ ), tetrafluorocarbon (CF ₄ ), C ₄ F ₈ , C ₂ F ₆ , C Fluorocarbons such as ₄ F ₆ and C ₅ F ₈ (C _x F _y ) and hydrofluorocarbons such as difluoromethane (CH ₂ F ₂ ) (CH _x F _y , provided that 0 ≦ x, y ≦ 4, x + y = 4 The same effect can be obtained by using (). Note that CH _x F _y has a stronger etching effect on the silicon nitride film 14 as the hydrogen composition x is smaller, and the larger the composition x, the greater the amount of deposits deposited. Here, SF ₆ is an etchant that etches silicon nitride and sidewall deposits. Further, an inert gas such as helium (He), neon (Ne), or xenon (Xe) may be used as the dilution gas instead of argon (Ar).

In each of the second and third embodiments, a mixed gas of oxygen (O ₂ ), trifluoromethane (CHF ₃ ), and argon (Ar) is used as an etching gas that does not deposit deposits on the side surfaces of the resist pattern 16. However, the same effect can be obtained by using a gas such as ozone (O ₃ ), carbon monoxide (CO) or carbon dioxide (CO ₂ ) instead of oxygen. Oxygen atoms are etchants that etch sidewall deposits. Further, fluorocarbons (CH _x F _y , C _x F _y ) may be used for trifluoromethane (CHF ₃ ).

Furthermore, in addition to the combination of oxygen (O ₂ ), trifluoromethane (CHF ₃ ) and argon (Ar), a combination of sulfur hexafluoride (SF ₆ ) and argon (Ar), or tetrafluorocarbon (CF ₄ ) And a combination of argon (Ar). Further, sulfur hexafluoride (SF ₆ ) may be added simultaneously with oxygen in order to etch both the film to be etched and the deposit.

  Further, although silicon nitride is used for the film to be etched, the same effect can be obtained even with silicon oxide. Furthermore, not only a silicon compound but also an appropriate selection of an etching gas can be applied to various semiconductor materials, conductive materials, and insulating materials that are compatible with the semiconductor manufacturing process.

  In each embodiment, etching is performed using the UHF-ECR plasma type dry etching apparatus shown in FIG. 7, but instead, for example, RIE (Reactive Ion Etching) or ICP (Inductively Coupled Plasma) is used. Needless to say, the same effect can be obtained by using a dry etching apparatus having a plasma source such as TCP (Transformer Coupled Plasma) or DPS (Decoupled Plasma Source).

  In each embodiment, the ArF excimer laser photosensitive resist is used as the material of the resist film 16A. However, the present invention is not limited to this. That is, an equivalent effect can be obtained as long as the resist material is sensitive to ArF excimer laser light or exposure light having a shorter wavelength. Specifically, it is a resist material that does not contain a benzene ring resin such as novolak, or a resist material for forming a pattern having a line width smaller than 130 nm, which is the same as a resist material for ArF excimer laser exposure. If the resist material has strength, the same effect can be obtained.

  The pattern forming method according to the present invention has an effect of preventing resist collapse and obtaining an anisotropic shape in a film to be etched. For example, exposure light having a wavelength less than that of an ArF excimer laser beam. It is useful for a pattern forming method or the like in which dry etching is performed using a resist pattern made of a resist material that is sensitive to light.

It is a graph which shows the relationship between the initial value of the resist pattern dimension for every etching condition at the time of using the resist for ArF excimer laser exposure, and a dimension conversion difference, and the relationship between a dimension conversion difference and a resist fall. It is a graph for comparison, and shows a relationship between an initial value of a resist pattern dimension and a dimensional conversion difference for each etching condition when a KrF excimer laser photosensitive resist is used. (A) And (b) is a typical top view which shows the arrangement direction of the line pattern on the main surface of a wafer. FIG. 6 is a structural cross-sectional view in the order of steps showing a state of occurrence of resist collapse in a pattern forming step when an ArF excimer laser photosensitive resist is used. FIG. 5 is a structural cross-sectional view in the order of steps showing a first method for preventing resist collapse in a pattern formation step when an ArF excimer laser photosensitive resist according to the present invention is used. It is a structure sectional view of the order of a process which shows the 2nd method of preventing the resist collapse in the pattern formation process at the time of using the resist for ArF excimer laser exposure concerning the present invention. It is a structure sectional view showing the dry etching apparatus used for the pattern formation method of the present invention. It is a partial composition sectional view of the order of a wafer showing a pattern formation method concerning a 1st embodiment of the present invention. It is a partial composition sectional view in order of a process of a wafer showing a pattern formation method concerning a 2nd embodiment of the present invention. It is a partial composition sectional view in order of a process of a wafer showing a pattern formation method concerning a 3rd embodiment of the present invention. It is composition sectional drawing of the order of a process which shows the conventional pattern formation method.

Explanation of symbols

11 Wafer 12 Silicon oxide film 13 Polysilicon film 14 Silicon nitride film (film to be etched)
15 antireflection film 16A resist film 16 resist pattern 17A first deposit 17B second deposit 51 reaction chamber 52 upper electrode holding member 53 upper electrode 53a hole portion 54 holding base 55 lower electrode 56 first high frequency power source 57 first 2 High frequency power source 58 Lid member 59 Waveguide 60 Electromagnetic wave oscillator 61 Exhaust port 62 Exhaust pump 63 Support member

Claims (5)

A first step of forming an etching target film made of an insulating film on the wafer;
A second step of forming a resist pattern made of a resist material sensitive to an ArF excimer laser beam or exposure light having a shorter wavelength on the film to be etched;
A third step of etching the film to be etched using the resist pattern as a mask,
In the third step, the etching target film is etched so that deposits are not deposited on both side surfaces of the resist pattern having at least a side surface perpendicular to the radial direction of the wafer. A pattern forming method characterized by the above.   The pattern forming method according to claim 1, wherein the etching target film includes a lower insulating film and an upper antireflection film.   The pattern forming method according to claim 1, wherein the film to be etched includes a silicon compound, carbon, or a carbon compound.   4. The pattern formation according to claim 1, wherein in the third step, etching is performed so that a dimensional conversion difference in pattern dimensions after etching in the film to be etched is −10 nm. 5. Method.   5. The pattern forming method according to claim 4, wherein a dimensional conversion difference in pattern dimensions in the film to be etched is ± 0% to −30%.

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