TW200307814A - Probe unit and its manufacture - Google Patents

Abstract

A probe unit to be fixed to a probe device for testing functions of a test body. The probe unit includes: a substrate; probe pins formed on the substrate by lithography, the probe pins having distal ends protruded from the substrate and being made in contact with electrodes of the test body; and a positioning member formed on the substrate by lithography at a predetermined position relative to the probe pins, the positioning means abutting upon a member for positioning the substrate relative to the probe device.

Description

200307814 Description of invention: TECHNICAL FIELD This application is based on Japanese Patent Application No. 2001-287088 filed on September 20, 2001, and No. 2002-1 64244 filed on June 5, 2002, And No. 2002-205285 filed on July 15, 2002, the entire contents of which are hereby incorporated by reference. The present invention relates to a probe unit and a method for manufacturing the same. The probe unit is used for conducting tests of electrodes, terminals, and the like of an electronic device (test body), such as a semiconductor integrated circuit and a liquid crystal display panel. Prior art panel and printed circuit board products are used to check whether the operation of these products can meet the specifications. During this conductivity test, the pins formed at or near the tip of the probe unit: the pin pins abut on a side-by-side electrode of a semiconductor integrated circuit, a liquid crystal display panel, ... a printed circuit board, or the like. The red probe unit to be used for conductive measurement consists of an "independent wiring" m-type and a "piston" surface type. The probe pins of the "independent wiring" type probe unit make contact with the electrical & independent conduction of a test body with:-correlation. _ ",: 丄 Pri ..." The probe pins of the known probe unit are in contact with each other—the electrodes of the test body. The electrode layer currently forms a liquid crystal display panel. The last fine pitch is juxtaposed. $ 墓 、. 豕 Perform a +, head 丨 ', ... for j is i14 kinds of liquid crystal display panel ... m' kid conductive test device needs to have a probe unit, 84367 200307814 The probe pin system is compatible with this Fine pitch of electrode layers. The pitch of the electrode layers is 0.1 mm or less. It is very difficult to form a probe unit compatible with this pitch through mechanical punching. Therefore, the probe unit is manufactured by a touch or an electric clock. For example, Japanese Patent Laid-Open Publication No. 25 52084 discloses a method for manufacturing the unique needle unit of the spring type. This open document proposes that the work pieces are bonded together by a strap, and the strap is cut after being bonded. A method of manufacturing a probe unit of this independent wiring type is also disclosed in JP-B-7-5649j. This publication proposes to etch a conductive contact terminal to a predetermined shape and configuration, bond the conductive contact terminal to an insulating member, and then cut off both ends of the conductive contact terminal.

The "piston system is disclosed in JP-A-8-U 0362 and Cheng> Guji" type probes per day JP-A-11-64425 〇 The narrow distance between the electrodes of the test body and the probe pins makes it It is difficult to achieve position alignment between such electrodes and probe pins of 84367 200307814. JP-A-1 0-339740 reveals ~ 6, A, A4, _ a variety of foot position and fixed foot with probe pin formation method: on the (Tao Membrane)-probe unit (contact probe) to -The probe device, however, utilizes the method described in Japanese Patent Jr 52084, which is difficult to place in higher order. In addition, mV accuracy is used to bond the wires to an insulating base. When the field bundle is cut, the wires will be damaged. Utilizing JP-B-7-56493 in the middle, upper AA, aligning 浐 ... "Wan Fa of the field will have difficulty in bonding the conductive contact terminal to the insulating part with a high degree and degree. Used in JP-A_n The layer described in -337575 has a small contact area that contains Xuannan, a f α, a copper seed plate / house, and a plated spoon, so you thank you for a layer of this type, and it will take a long time to ',' Difficult to dissolve the 0 means difficult to use the wrong 4 m phase temple probe pins. It is also possible to place the probe pins with high accuracy at a position relative to the "hole" by laser. The plate U puts through the hole disclosed in P.A_1G_3397 and fixes a hole per -d 2 疋 k. The hole used for positioning the bismuth needle to a probe device is formed by the lithography method. _ Substrate: the formation of the probe pin, the probe pin and the positioning hole, 'it is difficult to come to Huailao at the position asked by Ping, between the probe device and the probe pin To 2 to 卞 precision. Therefore, the gate of the electrode of the test body held by the needle pin is equipped with a probe device and detection accuracy. The object of the present invention is to provide a high-precision placement on a substrate, and a high-opening / two-probe unit is used. Holes are used to mount the probe unit to the Zhuangban manufacturing method. ... and provide a probe sheet. According to one aspect of the present invention, it provides a probe unit body to test the function of a test body, which includes: "a probe pin fixed on a substrate, These probe pins ^ 'end points formed by lithography and brought into contact with the electrodes of the test body · the substrate is crying out into a positioning member on the substrate, its position' and fine lithography ^ ^ ^ Pair; cough and other probe pins-X, 疋 position JL, the 构件 position members abut against a probe device to position the substrate ... and close to the positioning component A component is opposed to the substrate, so the substrate is positioned and fixed to the probe device by using the positioning & 1 position. The positioning component C: is positioned on the substrate relative to the probe pin. Therefore, the M ^ is used to position the probe device with high precision relative to the probe device. 4 = pin pin can be-, A port improves the probe pin of the probe relative to the electrode of the test body. Position accuracy. The light source or radiation source for warm light and shadow is not limited. The lithography can be a flat plate: , UV lithography, ion beam lithography, or the like. The Θ position component may have the thinner ring-shaped ring shape * to extend around and form a through-hole through the substrate. Relative to the probe by pressure firmware The needle device positions the substrate to a fixed position with a thin clamping ring. The position accuracy of the probe pins relative to the probe device can be further improved due to the centering function of the positioning component. The needle riding unit can Further steps include a reinforcing film fixed to the substrate, and covering the probe pins on the substrate and / or at least the area of the positioning member 84367 200307814 f :: the reinforcing film can prevent the probe pins and / Or positioning Shao to come with the base = 'In this description, "probe pins on the substrate and / or at least the positioning section two ..." means "the rest pins on the substrate Pin "and" at least the area of the positioning component ". It is good that the probe pins and the positioning member are made of the same material and have the same film thickness. According to another aspect of the present invention, it provides a probe unit to be fixed to the test body to test the function of the test body, which includes: the probe pin includes a bottom: a film, and is formed on the bottom film. -A probe pin pattern; and a probe pinched as '叾 formed on an upper surface defined by the ends of the probe pins' and having a plurality of small holes. Since a plurality of small holes are formed through the probe holder, 1 can enlarge the contact area for removing the insecticide of the target layer. It is preferably that the probe holder is made of an electroplated layer formed in a frame defined by an impedance film. Preferably, an insulating film is formed on the surface of the probe holder, and the probe pins are formed on the surface of the insulating film. The needle is preferably a '-protective film covering the probe holder and the probes are plugged in. Preferably, the needle holder is made of a photo album as the probe sowing system of the probe holder. It is formed on the surface of a probe stopper made of a plating layer. It is preferable that the probe pin made of a plating layer is in a probe holder made of resin. According to another aspect of the present invention, there is provided a method for manufacturing a probe unit fixed to a probe device -10-200307814 to test-test body performance. The stomach method includes, a lower / rail, and a protrusion formed by a substrate. Point the probe pin at the end of the probe, and contact the probe with the electrode of the test body, and a positioning part to abut the positioning of the substrate with the β-probe device using the phase probe, and simultaneously set at On the substrate. Second, because the children's probe pins and positioning components are formed by lithography at the same time, the relative position accuracy of the probe pins and the positioning components can be improved. Because the 2 substrates are positioned by using the positioning member as a position reference, and the probe pins of the probe device, such as the stomach, can be positioned on the j-needle clothing I with high accuracy. According to the manufacturing method of the probe unit, the position accuracy of the bismuth pin pins relative to the electrodes of the test body can be improved. Λ According to another aspect of the present invention, it provides a method of manufacturing a probe unit for testing the function of a test body, the method comprising: two steps of t-aligning a mark on a substrate ... The probe pin that points at the basal end and makes it contact the test body: Step: It uses the alignment mark as a position reference to make a micrometer: on the substrate; and-form -The step of positioning the component against the component of the substrate with respect to I π and the position of the substrate, which is formed on the substrate by lithography by using the pair == as a position reference. = These probe pins and positioning components are formed from the lithography using the common alignment mark as the position JL + test, which can improve the position accuracy of the probe pins and the fixed position. Because the substrate is positioned and fixed to the probe device by using the # generation as a reference and position, the pins can be positioned on the probe device with 咼 precision. According to the probe 84367 200307814 manufacturing method of the needle unit, it can be changed to Xixian approval. ^ The accuracy of the position of the temple pin with respect to the electrode of the test body. After forming the pair of rhenium, ruthenium, and ruthenium, the method of forming the probe pins, or the method of forming the child's position part by R &S; According to another aspect of the present invention, a method of manufacturing a probe unit fixed to a test body to test the function of the test body is described. The method includes a method of forming a probe having a terminal point protruding from the substrate. The needle is inserted and brought into contact with the foot electrode of the test subject, and the steps of forming a substrate on the substrate at the same time as the mechanical shirt, and forming a kidney device for positioning the probe device _ Π VY, the positional component of the substrate i αM cattle, is formed by lithography on the substrate by using the alignment mark as ... Because the alignment mark of 6 Hai-g-17 AL. Is used as "." ^ Forming the probe pins at the same time forming the pins and positioning parts ^ reference formation, which can improve the use of these probes The positioning accuracy of the positioning part and the sub-l1. Because the substrate is a device, the probes are used as a position reference to locate and fix the probe. According to the single pin of the probe, the probe can be positioned on the probe device with high precision. The knowledge of this test body can improve the accuracy of the position of the probe pins relative to. According to the present invention, to test a test cell and a surface, a method for manufacturing a probe unit fixed to a test body and forming a close contact force is provided. The method includes:-Components for cypress and substrate The positioning of the remote probe device and an alignment mark on a substrate; the step of component B, which is formed by lithography at the same time in contact with the touch, and / or crying out of the substrate. The end point, and the steps of making the ai, the ritual heart align mark, and the probe pin of I 2 are formed by using the lithography on the substrate by using k as a reference. 84367 200307814 Because the connection #,, and pins are formed by the alignment # 2 μ, 717 圮 formed at the same time as the probes are formed, it can improve the detection Needle insertion and positioning, Q pieces < relative position accuracy. Because the substrate is positioned and fixed to the probe by using the fixed and fixed parts as a position reference, the probe pins can be positioned on the probe device with high accuracy. According to the manufacturing method of "slope detection" σσ as early as 7 ^, the position accuracy of the probe pins with respect to the test body by two dozen ^%% can be improved. According to the present invention, a method for manufacturing a probe unit is provided, which includes the steps of forming a sacrificial film on the surface of a force-amplifier plate, and forming a sacrificial film on the surface of the sacrificial film. A step of a bottom film;-at the bottom film I 1¾ i 4 · ', _ ^ ^ has a film corresponding to the opening of a probe unit pattern and includes at least one hole <step; a borrow The step of forming a salty probe unit pattern in the impedance film by electroplating, the probe unit pattern includes a vegetable pin and a probe holder; the removal of the impedance film and the impedance, , And a step of removing the sacrificial film to obtain a probe early element. According to another aspect of the present invention, a method of manufacturing a probe unit includes: a step of forming a sacrificial substrate, a substrate surface; a wind, a resistive film on the sacrificial film; Female, the step on the surface of the MM, the first-resistance moon has an opening corresponding to a probe holding a 4r ^ figure; one is formed in the opening of the four-resistance film by electroplating, forming an edge The step of chanting the pin holder pattern; the step of forming an insulating film on the surface of the probe holder # pattern, and removing the impedance film to obtain a plated film. A holder step; a step of forming a metal layer on the sacrificial film surface by electric ramping, wherein the probe holder is not formed 84367 -13-200307814; a bottom film is formed on the insulating film And < on the surface of the metal layer; a step of forming a second impedance film on the surface of the bottom film, the second impedance film having an opening corresponding to a probe pin pattern; Plating the probe pin pattern in the opening of the second impedance film Step; step of removing a second impedance of the pattern; and a removal of the sacrificial film under the second resistance film to obtain a probe unit of the step. According to another aspect of the present invention, there is provided a method of manufacturing a probe unit, comprising: a step of forming a sacrificial film on a surface of a substrate; and forming a first bottom film on the surface of the sacrificial film. Step; forming a first impedance film having an opening corresponding to a probe pin pattern on the surface of the first bottom film ... U-shaped pin patterns are formed in the opening of the first impedance film by electroplating Steps; a step of removing the first impedance film to obtain the probe pin pattern · Back ,,,-using a plating layer to cover the probe pin pattern, its research Lu Jin · Two Yushi Ashi, a surface of the G d ^ plating layer to make a coating surface of the plating layer flush with the probe insert τ, Shitomu clothing back, and then insert in the plating layer and the child pin. Needle pattern type ... ^. An insulating film is formed on the;

A second frame is formed on the back of the garment, but a frame is formed on the J surface—: κ 步 骡;-a stepped shovel of the impedance film on the surface of the second bottom film, which has at least one 丨 $ ίΛ The second impedance film of the younger brother has a probe corresponding to, a small hole, and a crying jacket, and a drawing coat (opening); a pattern of the probe holder is formed by electroplating and a hole. The steps are: a step of obtaining a film, an insulating film, and a probe unit by using a resistive film, a coating, a plating layer, and the sacrificial film. On the device, for example, test body = pair: the accuracy is to be installed in each-different ^ — liquid crystal display panel or similar conductive 84367 '14-200307814: to be used with high accuracy. Because it is used to determine the installation position and the pattern of the 1-pin probe, the positioning holes can be formed with high precision. The accuracy of the relative position of the probe pin to the test body can be improved. : According to s. Needle early (manufacturing method,-the probe unit can be manufactured with two pins,-probe holder and positioning holes for mounting the probe unit-on the top of the knife can be used with high position accuracy The implementation method is described in reference to the preferred embodiment of the present invention. The probe unit according to the specific embodiment of the present invention will be described. First, the details shown in Figs. The first to fifth structure needle units 10 of a probe unit 10 have a -wire pattern U and a lead 16 formed on a substrate ". Sentences a. Μ and ‘early 10’ are fixed on a base of a test body (sample base cliff), oblique and strong, narrow, π 〇σ, and 2. In the example punches shown in Figs. 1 to 5B, although ^ 1 0 is fixed to the probe device 2, it is necessary to fix to the probe. The number of the two needles is determined according to the structure of a test body. For example, the four probe covers of s' are opened ten 卞 卞 Early Fan can be-probe device spaced 90. Radial to fix. The earth sling is made of a long cardan plate. The material of the substrate I 2 may be an insulating material such as glass tear, quartz, oxidized junction, glass, oxyresin, or a conductive material such as iron-nickel alloy, stainless steel, silicon, silicon carbide, and AITlC.

The lead pattern 4 is composed of a lead line 20 formed on the substrate 2.所述 线 2。 These wires 2. It may be mutually conductive or non-mutually conductive. The lithography is formed on the base Z 84367 -15-200307814 12 in a position aligned with each other. A flexible printed wiring plane cable 3 is electrically connected to the proximal side of the wire 20. The tip side of these wires 20 forms a probe pin 22. These probe pins 22 are placed at a uniform interval and extend linearly in parallel. The material of the wire 20 may be metal, such as nickel alloy and nickel. The positioning member 16 is formed on the surface of the substrate 2 by lithography under a positional alignment with the probe pins 22 of the wire pattern 4]. The positioning members 16 abut on the fixing jig 4 of the probe device 2. Similar to the wire 22, the positioning member 16 is made of metal, such as nickel alloy and nickel. Compared to synthetic resins, such as polyamides, metals can have a good shape stability 'and are less likely to be deformed by temperature or humidity. The positioning members 16 abut on the fixing jig 4 determine the position of the substrate 12 relative to the probe device 2. The fixing jig 4 constitutes "a member for positioning the substrate with respect to the probe device". Hereinafter, the first to fifth structures of the probe unit 10 will be explained in detail. (First structure) In the first structure shown in FIG. 1, the probe pin 22 on the end side of each lead is protruded from one side 1a of the substrate 12. The positioning member 6 has an L shape, which extends along a side edge 1 2 b perpendicular to the side i2a protruding from the probe pins 22 and along a side edge 1 2 a opposite to the side edge 1 2 a. 1 2 c, and protrude from these sides 1 2b and 1 2c. The other positioning members 6 also have a shape that extends along the other side 12d perpendicular to the side 12a protruding from the probe pins 22 and along the side 12 ( : And protrude from these side edges 12d and 12c. On the base plate! 2 Each positioning member on the outer side of the case 6 The side edge 17 of the 6 is abutted against the pins of a U-shaped fixing fixture 4 5. Therefore, the 84367 200307814 base plate 12 is fixed relative to the extension direction of the probe pins and perpendicular to the extended universal foot direction. As shown in FIG. 6, a plurality of columns (the cylinders in FIG. 6) ) The footholding jig 4 may be formed to abut the outer wall of the fixing jigs 4 on the positioning member 16 at a plurality of positions. (Younger Structure) In the second structure shown in FIG. A structure can be formed to cover a part of the surface of the positioning member 16 and be fixed to the reinforcing film 24 'of the base plate 12 and the reinforcing film 24 covering the base position of the probe pins 22. The reinforcements 24 and 24 The material of 25 is an artificial resin or the like. The reinforcing film 24 prevents the foot member 16 from being applied to the positioning. The external force on the outside of the piece 16 is separated from the substrate 12. The reinforcing film 25 can prevent the probe pins 22 from being separated from the substrate 12 by an external force. It is not necessary to use these films and One of the reinforcing film 24 covering the positioning member; 6 and one of the reinforcing film 25 covering the base position of the probe pins 22. It can be formed to cover the positioning pins of the probe pins 22 feet 6 And the reinforcing film of the base part. As shown in FIG. 7, a plurality of holes can be formed through the positioning member 16 and filled with the same material as the reinforcing film to further strengthen the reinforcing film 24. (No. (3 structures) FIG. 3A shows a plan view of the third structure of the probe unit 10, and FIG. 3A is a cross-sectional view of the probe unit taken along the BrB3 line shown in FIG. 3A. In the third structure, the positioning member 16 and the fixing jig 4 abutting on the positioning member 6 are different from the first structure. The ring-shaped positioning member 16 is formed on the wire pattern 1 4 On both sides, and covered with Mi ... Pass through holes 2 6 of the base plate 12. The positioning parts 16 are made of the same material Cheng 84367 -17-200307814 'Asia has the same thickness as the child wire pattern 14. The hole of the positioning member 丨 6 "diameter of the through hole 26. The inner wall of the hole of the positioning member 16 8 Sit on the opening of the Xianyu hole 26. A cylindrical fixing jig 4 is assembled into the hole of the positioning member 16, so the base plate 12 is fixed in all directions. A plan view of the fourth structure of the probe unit 10, and FIG. 4b is not a & sectional view of the probe unit 10 taken out along the line B4-B4 shown in FIG. 4A. The shape of the positioning member 6 is different from the second structure. The positioning members 6 have the shape of an internal clip washer, as shown by the protrusions extending from the inner peripheral side to the radial inner side, and are placed in a peripheral manner. It is preferable that the protrusions 9 are placed circumferentially at an equal interval. As shown in FIG. 4B, since the surrounding fixing jig 4 is assembled in the hole of the foot part 16, each protrusion can be elastically deformed to the assembly direction. This deformation can absorb the tolerance of the hole diameter of the positioning member and the outer diameter of the fixing jig 4 '. Therefore, the positioning member 6 is positioned at the center of the fixing jig 4 with high accuracy. (Fifth Structure) FIG. 5A is a plan view of a fifth structure of the probe unit 10, and FIG. 5B is not a probe unit 10 taken out along the 35-35 line shown in FIG. 5A Inspection section. In the fifth structure, two axisymmetric wire patterns 4 are formed on the substrate 12. The probe pins 22 of the wires 20 constituting each of the wire patterns 14 have a bar shape protruding vertically from the surface of the remote base plate 12. The rectangular positioning members 16 are formed along the sides on the opposite sides of the pillars of the probe pins 22 of the wire patterns 14. The positioning parts 丨 6 are protruded by the corresponding sides 84b -18-200307814 12b and 12d. The side edges 17 of the positioning members 16 are parallel to the side edges 1 2 b and 1 2 d. The side 17 of each positioning member 16 abuts on the outer periphery of the plurality of fixing jigs 4 having the shape of a cylinder (a cylinder in Figs. 5A and 5B). Therefore, the substrate 12 is fixed to the probe device 2. The foot 12 reinforced film 28 fixed on the base plate covers the base portion of the probe pins 22 and a part of the surface of the positioning members 16. The material of the reinforcing film 28 is an artificial resin or the like. The reinforcing member 28 can prevent the probe pins 22 and the positioning members 16 from being separated from the substrate 12 by external forces applied to the probe pins and the sides 17 of the positioning members 6 . In this fifth structure, although the height (thin film thickness) of the positioning member 16 is set sufficiently lower than the height of the child probe pin 22, as shown in FIG. 5B, the positioning member 16 can be set to the south of the foot. Higher than this probe pin 22. In this example, the side 17 of the positioning member 16 can be prevented from being damaged by an external force. (Sixth Structure) FIG. 8A is a plan view of a sixth structure of the probe unit 10. In this structure, the comb-shaped probe pins 22 which are highly parallel to a certain number of wires 20 are formed at a narrow pitch, and the probe pins 22 (a " A probe holder 1 10. The probe pins 22 and the probe holder 110 are flush with each other on the same plane. The probe pins 22 and the probe holder 1 1 0 ir, from The same material is made of, for example, a nickel alloy formed by electroplating. The seventh, the structure of the probe pin 22 and the probe holder 1 1 0 of the probe unit are made of the same material. The wires 20 are mutually conductive. The first and the structure 1 probe units can be applied to a piston type probe unit, which performs the conductivity measurement of a plurality of electrodes of the same device at the same time, such as a liquid crystal 84367 -19 -200307814 Display panel. Positioning holes 丨 π can be formed through the probe holder 110 to position the probe unit 10 on each device in a positionally aligned manner. The size and shape of the positioning holes 丨 丨The position and position are determined by each device in which the probe unit 10 is installed. For example, Therefore, in addition to several polygonal holes, as shown in Figure 8A, a single polygonal hole can prevent rotation, or can form a plurality of round holes (refer to Figure 8B), or can form oval holes' It can adjust an installation position (reference (Figure 8C) 〇 The position of each positioning hole 1 1 1 is highly accurately determined by using a photoresist, so the probe unit 10 can be mounted on each device with high-precision position alignment. Therefore, it may come Highly accurate conductivity testing of liquid crystal display panels and the like. Some small holes 112 may be formed through the remote probe holder 11. As described below, in the method of manufacturing the probe unit of the sixth structure In a sacrificial film, an etchant is dissolved to separate a portion of a metal film from a base film from a fundamental oscillator. The small holes 1 1 2 are used to increase the space between the sacrificial film and the etchant. Contact area. Although the position, size, and number of the small holes 1 12 are not specifically limited, it is preferable that the small holes 1 1 2 are formed in such a manner that the nicking agent uniformly contacts the bottom film. The entire surface of the sacrificial film. When the sacrificial film is dissolved (Seventh structure) FIG. 9A shows a plan view of the seventh structure of the probe unit 10, and FIG. 9b shows the same taken out along the line BγB9 shown in FIG. 9A. A cross-sectional view of the probe unit 丨 〇 84367 -20-200307814 This probe unit U) has a probe 窀 π π, which also holds 1 10, and forms a sub-column with a high accuracy at a narrow pitch. A comb probe pin 22 on the end side of 4 + 7? S ^. 1 inch,. The edge temple probe pin 2a 'is suitable for integration with the child probe holder 11o. For this probe unit, the combination of the unidirectional printed wiring flat cable 3 has a number of electrodes, which are also arranged at a pitch. The probe unit 10 and the flexible printed wiring are twisted and twisted eleven, see, and table J are combined with the lead 20 and the electrode 113 which are electrically connected to the female pair. The nipple holes 1 1 1 can be formed through the probe holder 1 1 10 to mount the probe unit on each device in a positionally aligned manner. The size, shape, and position of the positioning hole 根据 are determined according to each device in which the probe unit 10 is installed. Female hole} The position of i 1 is determined with high accuracy by using photoresistance. So 5 | 0 can be mounted on each unit with high-precision position alignment. When the probe pins 22 are formed, the probe pins are formed with the probe pins. Positioning members 16 made of the same material may be formed on the outer peripheral surface of the positioning holes ηm. This positioning element further improves the positioning accuracy. A protective film 32 shown in Figs. 9A and 9B will be described later. (Eighth Structure) FIG. 10 is a plan view showing an eighth structure of a probe unit. In the probe unit that violates the eighth structure, one or a plurality of small holes 1 1 2 can form buds through the probe holder!丨 〇. As described below, in the method of manufacturing the probe unit of the eighth structure, an etchant is used to dissolve a sacrificial film and an electrical bell steel layer to separate the integration of the probe pin and the probe holder from a substrate The part. The small holes Π 2 are used to increase the connection between the sacrificial film and the remaining agent. 84367 -21- 200307814 ~. It is expected that the positions, sizes, and numbers of the small holes are not specifically defined: 'It is preferable to form the small holes 1 η in such a way that the etchant uniformly contacts the probes, and ; < the entire surface of the sacrificial film. The dissolution time of the sacrificial film can be considerably shortened. (Ninth Structure) FIG. 7A is a plan view of the ninth structure of the probe unit W, and FIG. 7 is a cross-sectional view of the ninth structure of the needle grasping unit 10. This probe unit 1G has a probe holder 110 and a comb-shaped probe pin 22 on the end side of a number of wires 20 arranged side by side with a high degree of precision. The probe pins 22 are stacked on the probe holder 11Q and are combined with /, positive sigma. For this probe unit 10, a flexible printed wiring flat cable 3 has some electrodes Π3 in parallel with A narrow pitch configuration. The probe unit 10 and the flexible printed wiring flat cable 3 are combined with each pair of electrically connected wires 20 and electrodes 1 1 3. A positioning hole 111 may be formed to pass through the probe holder 1 to mount the probe unit 10 on each device in a positionally aligned manner. The size, shape and position of the positioning hole 1U are determined according to each device in which the probe unit 1 is installed. As explained below, the position of each positioning hole 丨 丨 丨 is accurately determined by using photoresistors, so the probe unit 10 can be mounted on each device with high-precision position alignment. While forming the probe pins 22, positioning members 16 made of the same material as the probe pins 22 may be formed on the outer peripheral surface of the positioning holes π1. The pattern used to determine a mounting position and the probe pins are formed at the same time 84367 -22-200307814. Therefore, the coincidence hole can be formed with high accuracy. Therefore, the position between the pin pin and a test body Accuracy can be improved. (Tenth Structure) FIG. 12 is a plan view of the tenth structure of the TF probe unit. In the tenth structure of the probe unit, a plurality of small holes 12 may be formed to pass through the needle holder 110. As described below, in the method for manufacturing the tenth-structured probe tip, an etchant is used to dissolve a sacrificial film to divide a substrate from a substrate by grasping the integrated part of the probe pin and the probe holder. The small holes] 12 are used to increase the contact area between the film and the etchant. Although the position, size, and number of the small holes are not specifically limited, it is preferable that the pattern of forming and equalizing the small holes 1 12 is that the etchant uniformly contacts the underside of the probe holder 110. Sacrifice the entire surface of the film. The dissolution time of the sacrificial film can be shortened considerably. (Eleventh Structure) FIG. W shows a plan view of the eleventh structure of the probe unit 10, and FIG. 13B shows a cross-sectional view of 10 taken out along the line Bl3_Bi3 shown in FIG. 13A. The probe unit of the eleventh structure has a part of the private needle holder 110 made of the layer 110a. In this probe unit, in order to electrically isolate the probes—n pairs of early Fan 2 2 trays each 1 1 0, the needle holders 1 1 0 forming the probe pins 22 Ju 4 1 ¾ is made of photosensitive polyamidine or similar tree branches and 10 jins. Because ,, ~ has a large expansion coefficient for the fat layer 1 1 0 a, and because the θ "degree is changed, it will reduce the position accuracy of these probe pins. Because" It is better The ground is made of 84367 -23-200307814. The resin drawer of the probe holder 110 ^,,... ^ 110a occupies a small area. This is like a needle installed in a conductive test device. The pu frame 1 14 is installed in the guide ^ ^ jj 6. J ^ K holder] 1 5 mounting parts (twelfth structure) A flat plan view of the structure and the probe unit taken out of the drawing Fig. 14A shows a cross-sectional view of the probe unit 10, 14B, along the b " _b 10 shown in Fig. I4A. The positioning holes of the probe sheet 1 14 of the frame 11 1 14a. The element has to pass through the positioning frames such as the following foot Chengming. The positioning frame 1 14 and the positioning hole 1 14a are formed at the same time. The position accuracy of the 4-position frame 114 and the positioning hole 114a can be the same. The position accuracy between the probe pin 22 and a test body can be improved. &Amp; This Shenmu pin is installed in each conductive test device Ji, and these conductive test devices The positioning pins 116 of the holder Π5 are fitted into the positioning holes 1 14a. Because the resin layer H 〇a of the probe holder 1 丨 of the cypress needle unit is small, It is possible to prevent the position accuracy of the probe pins from being lowered due to temperature changes. Because no resin is used in the area close to the positioning holes, it may prevent the probe pins from being caused by temperature changes. (Thirteenth structure) FIG. 15A shows a plan view of the thirteenth structure of the yttrium probe unit 10, and FIG. 15B does not show the Bu- A cross-sectional view of the probe unit 84367 -24-200307814 1 〇 taken out by the Bb line. The probe unit of the 13th structure has a probe holder]] 〇, which is formed in parallel at a height of mi -The 'shaped probe pins 22' on the end side of some wires 2㈣ and the positioning frame. The probe pins 22 and the positioning frame 114 are stacked on the probe holder 110 and integrated therewith. The: The foot frame 114 is placed on the probe holder I1G in parallel with the wires 20 On both sides. The positioning frame 114 is made of the same material as the probe pins. The size, shape, and position of the positioning frame 114 are based on each conductive device on which the probe unit 10 is installed. The decision is as follows; 5 Ming, the positioning frame 114 used to determine the installation position and the probe pins 22 are formed at the same time. Therefore, the positioning accuracy of the positioning frame n4 is very high. The probes can be improved Position accuracy between pin 22 and-test body. When this probe unit is mounted on each conductive test device, the positioning frames 1 1 4 are assembled in the mounting parts i! 6 of the holders of the conductive devices. The structure of the probe unit 10 has been described above. Next, a method of manufacturing the probe unit 10 will be described. First, the first to seventh manufacturing methods will be explained. The first to seventh manufacturing methods can be applied to any of the first to fifth structures of the probe unit 10. The first to sixth methods will be described by taking the manufacturing of a probe unit having the first structure as an example. The seventh method will be described by taking the manufacturing of a probe unit having the fifth structure as an example. (First Manufacturing Method) Figs. 16A to 16H are cross-sectional views showing the architecture of the first method of manufacturing the probe unit. B4367 -25-200307814. By applying this manufacturing method, the probe unit 10 having, for example, the first structure shown in FIG. 1 can be manufactured. First, as shown in FIG. 16A, a recess 50, such as glass ceramic, quartz, and oxidized junction, is formed in a surface layer made of an insulating material-substrate 丨 2. The inner walls of the recesses 50 become the sides 12a, 12b, and 12d of the substrate 12 after the subsequent method. As shown in FIG. 16B, a sacrificial film 52 is formed on the surface of the substrate 12. The material of the sacrificial film 52 may be metal, artificial resin such as epoxy resin and urea resin, or inorganic salt 'such as calcium carbonate. If a metal is to be used, a metal other than the metal of the wire pattern 14 is used, such as copper. If copper is used, a bottom layer 52a is formed, and then a copper film 52b is formed on the surface of the bottom layer 52a by electroplating, sputtering, or the like. For example, the bottom layer 52a is a composite layer of a chromium layer having a thickness of 30 nm and a copper layer having a thickness of 300 nm. The copper film 52b is formed and filled in the recesses 50. As shown in Fig. 16C, the plate "the sacrificial film 52 is polished to expose and planarize the surface of the substrate 12" and leave the sacrificial film 52 only in the recesses 50. As shown in FIG. 16D, a lead pattern 14 and a photomask on the bottom film 56 are placed on the ground surface 55 to form the bottom film 56 of the positioning member 16 with a uniform thickness. On the surface, coated with photoresist. On a surface of a photoresist having a predetermined pattern. The unnecessary green system is removed by a developing method to form a resistive film 58. The impedance film 58 has an opening 59a in which the wiring pattern is formed, and an opening 59b for exposing a region where the piece 16 is formed. Two of the openings 59b are formed over a recess filled with the sacrificial film 52. 84367 -26-200307814 As shown in FIG. 16E, a cover film 57 is formed on the surface of the bottom film 56, and the openings 59a and 59b are exposed by electroplating using a known iron-nickel plating solution. , Which contains sulfuric acid as the main component. The cover film 5 7 is used as the lead pattern 4 and the positioning member 16. The wire pattern 14 and the positioning member 16 made of the same material are thus formed on the bottoms of the openings 59a and 59b. As shown in FIG. 16F, the impedance film 58 is removed by ultrasonically cleaning the surface of the impedance film 58 with a liquid such as N-methyl-2-pyrrolidone. Next, the bottom film 56 not covered with the cover film 57 is removed by a frame cutting method such as ion milling, or an etching method such as ion beam etching. 16D to 16F, the lead pattern 14 and the positioning member 16 made of the bottom film 56 and the cover film 57 are simultaneously formed by lithography. Therefore, the probe pins 22 of the wire pattern 14 and the foot position member 16 can be formed with relative positions with high accuracy. As shown in FIG. 16G, the sacrificial film 52 remaining in the recess 50 is removed. For example, the sacrificial film 5 2 is made of copper, and the sacrificial film 5 2 is dissolved by using an etchant, which can dissolve copper with priority over other materials. As shown at tf in FIG. 16H, the substrate 12 is cut along a cutting line reaching the bottom of the substrate. From the sides 12a, i2b, and 12d of the substrate 12 along the cutting line, the probe pins 22 (not shown in FIG. 16H) of the wire pattern 14 and the positioning member 16 cry out. (Second Manufacturing Method) FIGS. 7A to 17C are architectural cross-sectional views showing a second method of manufacturing the probe unit. By applying this manufacturing method, for example, the probe unit 10 having a first structure of 84367-27 to 200307814 shown in FIG. 1 can be manufactured. As shown in FIG. 17A, the 'alignment mark 30' is formed at a pre-foot position on the surface of the substrate 12. The registration mark 30 can be formed by lithography, printing, or machining. The shape of the alignment mark has a cross shape as shown in Fig. 7A. A polygon or a circular center can accurately represent a specific position. As shown in FIG. 17B, only the wire pattern 4 is formed on the surface of the substrate 12 by a method similar to the first manufacturing method. In this example, in the method corresponding to FIG. 16D, the opening 59a is formed through the impedance film 58 at a predetermined position determined by using the alignment mark 30 as a reference point. Corresponds to the figure! In the methods 6D to 16F, the probe pins 22 of the wire pattern 14 can therefore be formed by lithography with high positional accuracy relative to the alignment mark. As shown in FIG. 17C, the positioning members 16 are formed on the surface of the substrate 12. In this example, 'in the method corresponding to FIG. 16D, the openings 59b are formed through a 1¾ resistive film 5 8 which is located at a predetermined position determined by using the alignment marks as reference points. . In the method corresponding to FIGS. 16D to 16F, the positioning members 16 can therefore be formed by lithography with high positional accuracy relative to the alignment marks 30. The probe pins 22 and the positioning members 16 which are formed at positions determined by the common alignment mark 30 with high accuracy can therefore be formed with high relative position accuracy. The tf method shown in Figure 17B and the method shown in Figure 7c can reverse the order to achieve similar expected results. (Third Manufacturing Method) FIGS. 18A and 18B are architectural 84367 -28-200307814 plan views showing a third method of manufacturing the probe unit. By applying this manufacturing method, for example, the probe unit having a first structure shown in FIG. In the second manufacturing method, a part of the second manufacturing method is corrected. That is, the method shown in FIG. 17A is omitted, and the method shown in FIG. 7B is replaced with the method shown in FIG. 18A. In the method shown in FIG. 8a, when the wire pattern 14 is formed by a method similar to the first manufacturing method, the alignment mark 3 is formed. In a method corresponding to the method shown in FIG. 16D, an opening 59a for forming the wire pattern 14 and an opening for exposing a region in which the alignment marks 30 are formed are formed through the impedance film 5 8 'without forming such openings 59b. The lead pattern 14 and the alignment mark 30 are formed by lithography simultaneously using a method corresponding to that shown in Figs. 16D to 16F. After the method shown in FIG. 18A, in the method shown in FIG. 8] B, the positioning member 16 is formed by a method similar to the second manufacturing method shown in FIG. 7c. Because the positioning members 16 are formed with high precision at positions determined by the alignment marks 30 formed at the same time as the wire pattern 14 is formed, they can be formed with high precision in the probe with the wire pattern 14. The relative positions of the needle pins 22. (Fourth Manufacturing Method) Figs. 19A and 19B are schematic plan views showing a fourth method of manufacturing the probe unit. By applying this manufacturing method, the probe unit 10 having the first structure shown in FIG. 1 can be manufactured, for example. In the fourth manufacturing method, a part of the second manufacturing method is corrected. That is, the method shown in FIG. 17A is omitted, and the method shown in FIG. 19A is performed by the method shown in FIG. 17B. In the method shown in FIG. 19A, the alignment mark 30 is formed when 84367-29-200307814 equal positioning member 16 is formed by a method similar to the first manufacturing method '. In the method corresponding to the method shown in FIG. 16D, 'the opening 5 9b for forming the positioning member 16 and the opening for exposing the area in which the alignment marks 30 are formed are formed' and Such openings 59a are not formed. By using methods corresponding to those shown in FIGS. 16D to 16F, the positioning member 16 and the alignment member 5 are simultaneously formed by lithography. After the method shown in FIG. 9A, in the method shown in FIG. 9B, the wiring pattern 14 is formed by a method similar to the second manufacturing method shown in FIG. 17C. Because the probe pin 22 of the child wire pattern 4 is formed at a position and location determined by the alignment marks 30 formed at the same time as the positioning member 16 is formed with high accuracy The relative position of the positioning member 6. 々 仏 丁, Zhuo Si alignment mark 30 material, film thickness (height), the guide round circle 4 a,, _, Cetum 14 and Zhuo Si foot part 16 A 疋 is different. In this example, for example, only the mechanical strength of the positioning members 1 may be high, or the alignment marks 30 may be made thin. "Purpose 'constitutes $ Hai, etc., and aligns with Shishi 3. > Erji 0 foot exhibition film 56 and cover film W, guide scale pattern 14 and positioning member 16 are made of different materials, and the conditions can be set to different The female fruit has only the mechanical one of the foot parts 16, and the n ^ degree can be high, and the mask mark i and the alignment mark 30 and the wire pattern 丨 4, and a ^ ^ ^ are executed in one step. Electroplating is used to deposit the Ί plated film on the surface of the 部件 members 16 (fifth manufacturing method). Figures 20A to 20J show the framework of the fifth method for manufacturing the probe gate, 卞 early 疋. A cross-sectional view. Using this manufacturing method, the car can be used to manufacture the probe unit 1 having a first structure of 84,367-30, 2003,078,14, as shown in FIG. 1. As shown in FIG. 20A, a first sacrificial film 62 is formed on a surface of a substrate 60. The material of the substrate 60 may be glass, ceramic, silicon, metal, or the like. For example, the first sacrificial film 62 is formed by sputtering to a thickness of 0.3 μm. Grid film and copper film with a thickness of 0.3 μm. As shown in FIG. 20B, a first bottom film 64 is uniform. Degree is formed on the first sacrificial film 62. The first bottom film 64 becomes the wire pattern 14 and the positioning member 16 after subsequent processing. For example, the first bottom film M has a thickness of 0.02 μ m film and a composite film of iron-recording alloy film with a thickness of 0.15 μm. Next, an impedance film 66 is formed on the first bottom film 64. An opening 67 is formed to pass through the impedance. The film 66 exposes the area where the wire pattern 14 and the positioning member 16 are formed. As shown in FIG. 20C, a cover film 68 is formed on the surface of the first bottom film 64 exposed in the openings 67. The cover film 6 8 becomes the wire pattern 14 and the positioning member 16 after the subsequent processing. For example, the cover film 68 is formed of an electric clock recording alloy containing a known iron-nickel plating solution containing sulfuric acid as a main component. The lead pattern 14 and the positioning member 6 are made of the same material and have the same thickness. As shown in FIG. 20D, the resist mask 66 is removed using, for example, an organic solvent. Next, the cover film is not covered. The first bottom film of 6 8 6 4 is sharpened by ions or similar 20B to 20D, the lead pattern 14 and the positioning member 16 constituting the first bottom film 64 and the cover film 68 are formed by lithography at the same time, and the detection of the lead pattern 14 The pin pins 22 and the positioning members 16 are formed with high pin positioning accuracy of 84367 -31-200307814. In addition to the electroplating using impedance, the cover film 6 8 can be formed by a conductive coating formed by galvanization A film or a printed conductive paste is formed. By using lithography, a high-precision wire pattern M and a positioning member 16 can be obtained. As shown in FIG. 20E, a second sacrificial film 70 is formed on the surfaces of the first sacrificial film ^ and the cover film 68. For example, the second sacrificial film 70 is formed on the surface of the first sacrificial film 62 by electroplated copper or the like, and overflows the electroplated copper on the surface of the cover film 68. Next, the surface of the second sacrificial film 70 is ground and planarized to expose the surface of the cover film 68. As shown in FIG. 20F, an insulating film 72 is formed on the surface and the cover film 68 of the second sacrificial film. The insulating film 72 together with a second bottom film and a support film 7 8 mentioned below constitute a substrate 12. The material of the insulating film may be silicon monoxide, aluminum oxide, or the like. Next, similar to the first bottom film 64, a second bottom film 74 is formed on the insulating film 72. As shown in FIG. 20G, a photoresist is applied on the surface of the second bottom film 74. A photomask having a predetermined pattern is placed on the surface of the photoresist. The unnecessary photoresist is removed by a shadowing method to form a resistive film%. The resistive film 7 6 has an opening 7 7 to expose a region where the substrate 12 is formed. The opening 77 has a shape corresponding to the wiring pattern 14 and the positioning member 16 constituting the first bottom film 64 and the cover film 68. As shown in FIG. 20H, a support film 78 is formed on the surface of the first bottom film 74 exposed on the bottom of the opening 77. As shown in FIG. For example, the support film 7 8 is formed by a plated metal on the bottom of the opening 7 7. The resistance is shown in FIG. 2I. 'Similar to the impedance film 66 and the first bottom film 6 4, 84367 -32-200307814 the anti-boat 76 and the second bottom film 74 not covered with the support film 78 are Removed. Next, the insulating film 72, which is not covered with the second bottom film 74, is removed, for example, by an ion $ worm. As shown in FIG. 20J, the first and second sacrificial films 62 and 70 are removed. Therefore, a substrate 12 having the integrated conductive wire pattern 4 and the positioning member 6 can be formed. When the first sacrificial film 62 is removed, the substrate 60 is separated from the wire pattern 14 and the foot part 16. If the sacrificial films 62 and 70 are made of copper, the sacrificial films 62 and 70 are dissolved by using an etchant, which can dissolve copper with a higher priority than other materials. Before the sacrificial films 62 and 70 are removed by etching, a hole system is formed through the supporting film 78, the second bottom film 74, and the insulating film 72, so the sacrificial films 62 and 70 can be separated at a higher rate. . (Sixth manufacturing method) FIGS. 2A to 21F are architectural cross-sectional views showing a sixth method of manufacturing the probe unit. By applying this manufacturing method, the probe unit 10 having the first structure shown in FIG. 1 can be manufactured, for example. As shown in FIG. 21A, a sacrificial film 82 is formed on a surface of a substrate 80. The material of the substrate 80 may be stainless steel. The sacrificial film 82 is formed by plating metal or sputtering. As shown in FIGS. 21B to 21D, the wire pattern 14 and the positioning member 16 are formed by a method similar to the fifth manufacturing method shown in FIGS. 20B to 20D. That is, as shown in FIG. 21B, a resistive film 85 is formed, which has an opening 8 4 that exposes a region where the wire pattern 4 is formed and a positioning member 16 is positioned. Next, as shown in FIG. 2C, the lead 20 of the lead pattern 14 and the positioning members 16 are formed on the surface of the sacrificial film 8 2 exposed on the bottom of the openings 8 4 ^ 4367- 33-200307814. Then, as shown in FIG. 2D, the resistance film 85 is removed. Because the wire pattern 14 and the foot piece 16 are formed by lithography at the same time, the probe pin 22 of the wire pattern 14 and the foot pieces 16 can be used with higher relative position accuracy. form. As shown in FIG. 2E, a film 88 is attached to the surface of the wire pattern 14 and the foot member 16 with an adhesive 89. The thin film 88 is used as a substrate 2. For example, as shown in FIG. 21E, the film 88 is a composite film of a metal layer 88a and an artificial resin layer 88b, which can increase the mechanical strength of the film 88 relative to expansion and contraction. The material of the metal layer 8 8 a of the composite film is nickel alloy, copper or the like, and the material of the artificial resin layer 8 8 b is polyamine or the like. As shown in FIG. 21F, the sacrificial film 82 is separated from the substrate 80. Then, the sacrificial film 82 is removed by etching or the like. Then, if needed, the outer surface of the home wire Tu Lai 1 4-foot wire 20 can be covered with plated gold $ 9. As shown in FIG. 21F, the electroplated gold 89 may be formed on the outer surfaces of the positioning members 16, or may be formed to increase the positional alignment accuracy of the abutment between the positioning member 6 and the fixing jig 14. (Seventh manufacturing method) FIGS. 22A to 22H are architectural cross-sectional views showing a seventh method of manufacturing the probe unit. By applying this manufacturing method, the probe unit having a fifth structure shown in FIGS. 5A and 5B can be manufactured, for example. As shown in FIG. 2A, a substrate 90, which is made of a single stone crystal and metal deposition films 91 and 92, is formed by lithography on the surface. The metal deposition film 9 has a pattern corresponding to the wiring of the probe pin 22, and the metal deposition film "has a pattern corresponding to the wiring of the positioning members 16. The metal deposition 84367 200307814 film 9 1 The material of 92 and 92 may be gold. As shown in FIG. 22B, the substrate 90 covered with the metal deposition films 91 and 92 is grown by, for example, a VLS (gas-liquid solid) growth method to about 1 to 5000. As shown in Fig. 22C, the metal deposition film 92 covered with the growth region 94 constituting the positioning members 16 may be removed. For example, the metal deposition film 92 may be selectively covered by the metal deposition film 9 1-an impedance To remove the film, perform ion milling or engraving, and then remove the impedance film. As shown in FIG. 22D, only the growth area% covered with the metal deposition film 91 can be further grown by the VLS method. The growth area 93 of the pin 22 is grown into a rod shape, and its length is about 2000 to 5000, which is based on the length of the probe pin 22. As shown in FIG. 22E, the artificial resin 95 is Deposition to cover the growth area% and harden. The growth areas 93 The upper surface is ground to make it flush. In this example, the metal deposition film M covering the upper surface of the growth areas 93 is removed as shown in FIG. 22.E, or a part of the metal deposition film may be left. M. As shown in the figure, after the artificial resin 95 is removed, the surface of the substrate 90 and the growth regions 93 and 94 are covered with _ conductive film%. For example, the: electric film 96 is electroplated like gold In order to maintain the electrical insulation between the probe pins 22, the growth region 93 may be covered with artificial trees, such as polyamide, in addition to the upper surface. 22A to 22F, using the ancient, ancient, and Japanese 1 million people, the probe pin u 'of the wire pattern 14 composed of the growth area 93 and the lightning conductor 96, and the conductive film 96 The £ 94 and h-iM cattle 16 series are provided by lithography at the same time. Therefore, the probe pins 22 and positioning, y into #piece 16 can be formed with a high relative position 84367 200307814. As shown in Figure 2 G The base portion of the probe pins 22 and the surface of the positioning members are covered with artificial resin to form a reinforcing film 28. 2 2 Η'The probe pins 2 2, the positioning member 16 and the reinforcing film 2 8 are separated from the substrate 90. Next, the separated structure is adhered to the wire pattern 1 4 The pattern 9 9 is on the substrate 12 without the probe pin 2 2. The surface wire pattern 1 4 is completed by correctly adhering the probe pin 22 and the pattern 9 9. In the seventh manufacturing method, 'cover The metal deposition film 91 constituting the growth region 93 of the probe pin 22 can be selectively removed by leaving the metal deposition film 92 covering the growth region 94 constituting the positioning members 6. By setting the height (thickness) of the positioning members 16 higher than the height of the probe pins 22, the mechanical strength of the foot positioning members 16 can be increased. (Eighth Manufacturing Method) FIGS. 20A to 23F are architectural diagrams and cross-sectional views showing the eighth method of manufacturing the probe unit. By applying this manufacturing method, for example, the manufacturing method having This probe unit 10 of the sixth structure. In this method for moving the needle collection unit, as shown in FIG. 2A, a sacrificial film 1 3 1 is sprayed, vacuum-deposited, ion-plated, or the like on a surface. The formed 'preferably' is made from tun. On the surface of the sacrificial film 131, a bottom film 132 of the probe unit is formed. The material of the substrate 130 is a glass plate, an artificial resin plate, a hazard plate, a watt plate, a metal plate or the like having a thickness of several mm. The material of the% film 131 is preferably a copper thin film, a copper (Cu) / chrome 84367 -36-200307814 (Cr) thin film, or the like having a thickness of 0.01 to 50 μΓη. If the copper / chromium film is to be the sacrificial film 1 3 1, chromium is first sprayed to form a close contact layer, and copper is sprayed on the close contact layer. In this example, for example, the thickness of the chromium thin film is 0.03 μπι, and the thickness of the copper thin film is about 0.3 μιτι. The bottom film 132 is preferably a titanium (τη) / nickel (Nm) iron (Fe) film, or the like having a thickness of about 0.5 to 0.5 μΐΉ. If the Chin / Ni-Fe thin film is to be formed into the bottom film 1 3 2, a titanium thin film is first formed into a close contact layer by sputtering, and a nickel-iron thin film is formed on the titanium thin film by sputtering. In this example, for example, the thickness of the titanium thin film is 0. 2 μΐΏ, and the thickness of the nickel-iron thin film is about 0.1 5 μm. The use of the bottom film 1 32 is because a photoresistance resistance film to be described later is formed directly on the sacrificial film 1 31, which cannot obtain a resistance film having a high resolution :. Depending on the type of element resistance, the bottom film 1 3 9 can be omitted. Since the bottom film 1 3 2 and the photoresist to be described later have good moisture permeability, a resistance film having a South resolution and a desired shape can be formed on the sacrificial film 1 3 1. As shown in FIG. 2B, the photoresist is coated on the surface of the far-bottom film 1 32 to an arbitrary thickness. -A photomask having a predetermined pattern is placed on the surface of the photoresist. It performs exposure and development processes to remove unnecessary photoresist to form a resistance film ^ 3 having an opening corresponding to a predetermined probe unit pattern. The thickness of the impedance film 133 is preferably in a range from 10 to 200 μΐΏ. The probe unit pattern of the opening of the impedance film 33 includes a pattern for forming the probe units and a probe holder constituting the probe unit, and a pattern for forming the positioning member, for example, a Or a plurality of positioning holes and -37-S4367 200307814 positioning frame 'and a pattern for forming small holes, as described with reference to FIGS. 8A to 8C. Since the resist film U3 of the photoresist is to be used, the pattern of the wires constituting the probe pins can be formed in parallel at a narrow pitch, such as a narrow and uniform pitch. Therefore, the probe pins formed by using the impedance film 133 can be formed in a narrow pitch in parallel. Similarly, the probe pins and probe holders of the probe unit formed by using the impedance film 133 can be formed with high relative position accuracy. The positioning holes and small holes can also be formed at a high positional alignment accuracy. As shown in FIG. 23C, a nickel alloy metal foil is formed on the surface of the bottom film 1 324 not covered with the resistance film 1 B. It is plated by using a known iron-nickel plating solution. Sulfuric acid is used as the main ingredient. The thickness of the metal foil 1 3 4 can be set as required. As shown in FIG. 23D, the impedance film 133 is removed by ultrasonically cleaning the interface between the impedance film 1 33 and the bottom film 132 using a liquid such as N, ethyn pyrroHdone. In this example, the impedance film 133 can be efficiently moved by immersing the structure of the substrate 130, the impedance film 133 and the like at N-methynpyrrolidone *, and performing ultrasonic cleaning at 85QC. except. As shown in FIG. 23E, the exposed bottom film 132 is removed by ion milling, so the bottom film 132 and the metal foil} 34 have the same external dimensions. As shown in FIG. 2 F, the metal foil} 3 4 and the bottom film] 3 2 may be separated from the substrate 30. A probe unit 10 having the metal foil and the bottom film 132 is obtained. Using a method for manufacturing a probe unit having the sixth structure 84367 -38-200307814 'The probe pins and probe holders can be integrally formed without the need to mechanically or use solder or an adhesive to bond the Wait for the probe pins and probe holder. Therefore, it is possible to prevent the probe pins from being damaged. It is possible to form such probe pins and probe holders with relative position accuracy. Since it is not necessary to physically remove the probe holder, the external scale can be determined with high accuracy, and the probe pins prevent breakage during a removal procedure. (Ninth Manufacturing Method) Figs. 24 to 24LY show the structural wearing surfaces of the ninth method of manufacturing the probe unit. By applying this manufacturing method, the probe unit 10 has the seventh structure shown in FIGS. 9A and 9B, for example, or the structure shown in FIG. 10 can be manufactured. Figure-4AX, 24BX, ..., 24LX are cross-sectional views taken along the universal direction parallel to the probe unit, and Figures 24Aγ, 24Βγ,, 2 Li Ya: No: in child detection The procedure for forming the positioning hole in the probe holder of the needle unit is shown in Fig. 24 and Fig. 8 in the method of manufacturing the probe unit. First, as shown in Fig. 24 and Fig. 8, on the surface of the substrate 140, The film 41 is formed by a vacuum coating, vacuum deposition, ion implantation, etc., preferably by spraying. On the surface of this film 1 4 1, the cloth is blocked to a first. Arbitrary thickness.—A mask with " t, 疋 pattern 罾 "^ ^ ^ ^ H 涿 on the surface of the photoresist. Perform exposure and display to remove unnecessary, ..., units-俨 仏+ To form a first-resistance_ with an opening corresponding to the pattern of the prober. The thickness of the second-2 is preferably in the range from _2.〇_. Next, — 84367 -39-200307814 Anchor 1 4J is formed on the sacrificial film 1 4 1 of the sacrificial film 1 4 1 which is not covered with the first impedance film 1 42. The clothing surface is plated with a known iron-nickel plating solution. 1 I as a main component. The thickness of the first metal foil may vary depending on i 43 needs to be set. Lamb names are not particularly limited, and the material of the substrate 140 is a glass plate, a synthetic

Resin board, a pottery such as human urine, L tile board, a metal plate or similar have a thickness of several minutes. The material of the sacrificial film 141 is preferably a copper film, a copper (Cu) / chromium (co film or similar having a thickness of ojas.o) ^] 11. If the copper / chrome thin film is to be used as the sacrificial film 141, firstly, chromium is sputtered to form a close contact layer, and copper is sprayed on the close contact layer. In this example, for example, the thickness of the chrome thin boat is 0.03, and the thickness of the copper thin film is about 0.3 μΐΉ. When the first impedance film 42 is formed, not only the opening corresponding to the rest needle holder, but also one or more positioning holes or small holes can be formed at the same time. As shown in FIGS. 24BX and 24BY, an insulating film 144 is formed on the surfaces of the first impedance film 1 4 2 and the first metal foil 1 4 3. The insulating film 1 4 4 may be a silicon dioxide film, an aluminum film, or the like formed by sputtering, CVD, or the like with a thickness of about 0.1 to 20 μm. The insulating film 1 44 is formed so as to electrically insulate the first metal foil 1 4 3 and the probe pins to be formed on the first metal foil 1 4 3 as described below. As shown in FIGS. 24CX and 24CY, the first impedance film 142 is removed, leaving the probe holder Π 0 on the surface of the sacrificial film 1 4 1. The probe holding device 0 is The first metal foil 1 4 3 and the insulating film 1 4 4 are configured. In order to remove the first impedance film 1 42, the interface between the first impedance film 1 42 and the sacrificial film 1 41 is cleaned by N-methyl-2-pyrrolidone. In this example, by immersing the structure of the 84367 -40-200307814 substrate 140, the first impedance film ι42 and the like are in N-π ^ 1ιγ1-2-pyrohdone, and ultrasonic cleaning is performed at 85 ° C. The first resistance film 142 can be removed efficiently. As shown in FIGS. 24DX and 24DY, the entire surface of the sacrificial film 141 removes the first impedance film 142, that is, the entire surface of the sacrificial film 141 does not form the first metal foil 143, and is made of copper. Electroplating to form a plated copper layer 145. The thickness of the m-plated copper layer 145 is set to be thicker than the probe holder 110. As shown in Figures 24EX and 24EY, the plated copper layer 145 is ground to be flush with the probe holder 110. As shown in FIGS. 24FX and 24F Y, the bottom film of the probe unit] 46 is formed on the surfaces of the probe holder 110 and the plated copper layer 145 by sputtering. The bottom film 146 is preferably a titanium (butyl ... nickel (Nl) iron (Fe) film, or similar having a thickness of about 0.5 to 0.5 μm. If the thin film is to be formed For the bottom film 1 46, first, a titanium thin film is formed by sputtering to form a close contact layer, and a nickel-iron film is formed on the titanium thin film by sputtering. In this example, for example, the thickness of the titanium thin film It is 0.02 μΐΏ, and the thickness of the nickel-iron film is about 0.1 5 μm. As shown in FIGS. 24GX and 24GY, a photoresist is applied to the surface of the bottom film 146 to an arbitrary thickness. The patterned photomask is placed on the surface of the photoresist. It performs exposure and development processes to remove unnecessary photoresist to form a second resistive film 147 having openings corresponding to the probe pin patterns. The second impedance film! The thickness of 47 is preferably in the range from 0 to 200 μm. Except for the openings corresponding to the patterns of the probe pins, the thicknesses corresponding to the patterns of the positioning members are Waiting for the opening to determine the installation position can be formed at the same time as 84367 -41-200307814. See Figure 24 As shown in HX and 24HY, a second nickel alloy metal pattern (pattern) i48 is formed on the surface of the bottom film 146 which is not covered with the resistance film 147, and is plated by using a known iron-nickel plating solution. It contains sulfuric acid as a main component. The thickness of the second metal foil (pattern) 148 can be determined as required, as shown in FIGS. 24 IX and 241Y, and the second impedance film 147 is removed. In order to remove the second The resistive film 147, the interface between the second resistive film 147 and the bottom film 146 is cleaned with N-methyl-2-pyrrolldone. In this example, the second resistive film 147 and Similarly, in N-methyl-2-pyrrolidone, and performing ultrasonic cleaning at 85 ° C, the second impedance film 1 4 7 can be removed efficiently. As shown in Figure 2 4 JX and 2 4 JY, The exposed bottom film 1 4 6 is removed by ion sharpening, so the bottom film 146 and the second metal foil (pattern) 148 have the same outer dimensions, and the bottom film 146 and the second metal foil 248 are formed. The probe pin 22 is left on the probe holder n 0. As shown in FIGS. 24KX and 24KY, in order to improve the probe holder The probe 110 and the probe pin 22 are in close contact and protect the wiring of the probe unit. The area where the probe pin is in close contact with the probe holder n 0 is covered with a protective film 32. Here In the example, photosensitive polyamide, ultraviolet curing adhesive, card type, insulating material, photoresist, or the like is coated on the area, and the probe pins are in close contact with the probe holder 1 1 0, and is hardened or attached with a dry film to form the protective film 3 2. As shown in FIGS. 24LX and 24LY, the sacrificial film 141 and the electroplated copper layer 145 can be dissolved with a etchant, which will be more soluble than Other materials should preferentially dissolve copper 84367 -42-200307814 Q This integrated part of probe pins 2 2 and probe holder 1 1 〇 is separated from the substrate 140 and can be formed with such probes Pin 22 and probe unit 10 of probe holder U0. With the ninth method of manufacturing the probe unit, the probe pins 22 and the probe holder 1 10 are integrally formed by stacking a plurality of films, instead of mechanically or using solder or an adhesive. Combine these probe pins and probe clamps. Therefore, it is possible to prevent the probe pins from being damaged. It is possible to form the probe pins 22 and the probe holder 1 10 with high relative position accuracy because it does not need to actually cut off the probe holder 1 1 0. The external ruler may Determined with high accuracy, and the probe pins 22 prevent breakage during a resection procedure. 1¾ equal-foot holes are formed through the probe holder 110 with high positional alignment accuracy by using a photoresist. Therefore, the probe unit 10 can be mounted on each device with high positional alignment accuracy. Therefore, it is possible to perform the conductivity test of the liquid crystal display panel and the like with high accuracy. Because the patterns used to determine the mounting positions and the positioning pins of the probe pins 22 can be formed at the same time, the positioning holes can be formed with high accuracy, so that the relativeity of the probe pins 22 and the like to a test body can be improved Position accuracy. In this embodiment, although the protective film 32 is formed, the probe unit 10 without the protective film 32 can be formed. In addition, after the probe unit 10 is separated from the substrate 1 40, the protective film 32 may be formed. In order to shorten the time required to separate the probe unit 10 and the substrate 140, the substrate 140 can be made of copper without forming the sacrificial film 1 41. In this example, 84367 -43-200307814, if the copper substrate 140 has insufficient mechanical strength, a solid and stable substrate made of glass, ceramic or the like may be aligned with the substrate 140. Meanwhile, in this specific embodiment, after the probe holder 11 is formed, the probe pins 22 are stacked on the probe holder 11. Conversely, after the probe pins 22 and the like are formed, the probe holder 10 can be stacked on the probe pins. (Tenth manufacturing method) Figs. 25A to 2: > F is a schematic cross-sectional view showing a tenth method of manufacturing the probe unit. By applying this manufacturing method ', a probe unit 10 having, for example, one of the ninth to twelfth structures can be manufactured. In this tenth method of manufacturing the probe unit, as shown in FIG. 25A, on a surface of a substrate 150, a sacrificial film 151 is preferably formed by sputtering, vacuum deposition, ion plating, or the like. The ground is splashed. On the garment surface of the sacrificial film 1, a bottom film 15 2 of the probe unit is formed by sputtering. On the surface of the film 152, a photoresist is applied to an arbitrary thickness. A photomask with a fixed pattern is placed on the surface of the photoresist. It performs exposure and display processing to remove unnecessary photoresist to form a resistive film 153 having an opening corresponding to the probe pin patterns. Because the patterns used to determine the mounting positions and the positioning parts of the probe pins are formed at the same time, the positioning holes can be shaped with high precision, and the probe pins and a test body can be improved. Relative position accuracy. Although the table is not particularly limited, the material of the substrate 150 is a glass plate, an artificial tree plate, a ceramic plate, a metal plate or the like having a thickness of several mm. The material of bismuth at 151 is preferably a copper thin film, a copper (Cu) / chrome 84367 -44-200307814 (C r) thin film or the like having a thickness of 0.1 to 5.0 μm. If the copper / cold film is to be used as the sacrificial film 1 5 1 ′, chromium is first sprayed to form a close contact layer, and copper is sprayed on the close contact layer. In this example, for example, the thickness of the chromium thin film is 0.0 3 μm, and the thickness of the copper thin film is about 0 3 μm. The bottom film 152 is preferably a (Ti) / nickel (Ni) iron (Fe) film, or the like having a thickness of about 0.05 to 0.5 μm. If the "nickel-iron film" is to be formed into the bottom film 152, first a "film" is formed by spraying; a close contact layer is formed; and a nickel-iron film is formed by spraying on the titanium film. In this example, for example, the thickness of the titanium thin film is 0. 02 μm, and the thickness of the nickel-iron thin film is about 0.1 5 μm. The use of the bottom film 152 is because a photoresistance resistance film to be described later is formed directly on the sacrificial film 151, which cannot obtain a resistance film having a high resolution. Because the bottom film 152 has good moisture permeability with photoresistance, a resistance film having a high resolution and a desired shape can be formed on the sacrificial film 151. According to the type of the photoresist, the bottom film 5 2 can be omitted. The resistance film 153 preferably has a thickness of 10 to 200 μm. Because the photoresistive resistance film 153 is to be used, the pattern of the wires constituting the probe pins can be formed in parallel at a narrow pitch. Similarly, the probe pins and probe holders can be formed with high relative position accuracy. The positioning holes can also be formed with a high positioning accuracy. As shown in FIG. 25B, a nickel alloy metal foil (pattern) 154 of a probe pin is formed on the surface of the bottom film 152 which is not covered with the impedance film 153, by using a known iron-nickel plating solution. Electroplating is performed, which contains sulfuric acid as a main component. The thickness of the metal foil (pattern) 1 5 4 can be set as required. 84367 -45-200307814 As shown in Figure 2 5 C, remove the impedance film 1 5 3. In order to remove the first impedance film 153, the interface between the first impedance film 153 and the bottom film 152 is cleaned with N-methyl-2-pyrrolidone. In this example, by immersing the structure of the substrate 150, the impedance film 153 and the like in N-methyl-2-pyrrolidone, and performing ultrasonic cleaning at 85 ° C, the first impedance film I "It can be removed efficiently. As shown in Fig. 25D, the exposed bottom film 52 is removed by ion milling, so the bottom film 152 and the metal foil (pattern) 154 have the same external dimensions to form the bottom film." The probe pins 22 of 152 and the metal foil 154 remain on the surface of the probe holder ^ § · 151. As shown in FIG. 25E, a probe holder U0 is formed on the bottom film 152 and the metal flute. In areas where 154 is in close contact with each other, it is coated with photosensitive polyamide,

Protective film for indented probe pins. ’Photoresist covering

The bit hole or small hole passes through the probe holder. As shown in FIG. 2F, the sacrificial face 1α is formed by using a photoresist to form the probe holder. The sacrificial film 151 is dissolved by using an etchant, and its 84367 '46-200307814 is inserted. Needle 22: its higher priority to dissolve copper. Therefore, the probes can be separated from the substrate 150 by the integrated part of the two probe holders U0. The tenth method of the probe single pin with the probe pin 22 and the probe holder 丨 10 of this unit 'Xiao and other probe pins 22 and probe _ A 1Q series, by using a stack of many films to -It is formed in the body, without using a dot or using a material or an adhesive to combine the probe pins and probes. Therefore, it is possible to prevent the probe pins 22 from being damaged. ~ It has It is possible to form the probe pins M and the probe holder 11 with high relative position accuracy. Since the probe holder 110 is formed by using a photoresist, the positioning holes are available at a high position It is formed by the alignment accuracy. Therefore, the probe unit 10 can be mounted on each device with the positional alignment accuracy. Therefore, it can perform the conductivity test of the liquid crystal display panel and the like with high accuracy. Because it is used for Depending on the installation positions and the patterns of the positioning parts of the probe pins 22, both the positioning holes can be formed with high precision, so the probe pins 22 and a test body can be improved. Accuracy of the relative position. In order to shorten the separation between the probe unit 10 and the substrate 150. In the required time, the substrate 150 can be made of copper without forming the sacrificial film 51. In this example, 'if the mechanical strength of the far copper substrate 150 is insufficient, the glass, ceramics or the like is used. A solid and stable substrate can be aligned with the substrate 150. If the probe holder 110 is made of resin, the probe holder 1 1 0 can be expanded by a temperature change Or shrink, so you can not get a high dimensional accuracy. In this timeless state; brother 'as shown in Figure 26, a material that is difficult to bulge or shrink by changing the temperature 84367 -47-200307814 degrees A holder plate 155 made of, for example, ceramic, quartz, and _1 can be used to break the fixed position probe holding clamp 110. ° ° (Eleventh manufacturing method) The structure of the first method of the ' 27A to 27Q can be manufactured, for example, as shown in FIG. 27A to 27Q. A single cross section view of manufacturing the probe is shown. By applying one of the three structures of this manufacturing method, the probe unit 10 is manufactured. In the thirteen methods, first, as shown in FIG. 27 and FIG. 8, on a surface of a substrate 160, a sacrificial film 161 Formed by air deposition, ion plating or the like, preferably by sputtering. Although not particularly limited, the material of the substrate 160 is a glass plate, an artificial resin plate, a ceramic plate, a metal plate or the like A thickness of several mm. The material of the sacrificial film 161 is preferably a copper film, a copper (〇11) / chrome (cO film or the like having a thickness of 〇 丨 to 50 μπ1. If the copper / chrome The thin film is to be the sacrificial film 1 51, and chromium is first sprayed to form a close contact layer, and steel is sprayed on the close contact layer. In this example, for example, the thickness of the chromium thin film is 0. 〇3 μηι, and the thickness of the copper film is about 0.3 μπι. As shown in FIG. 27B, on the surface of the sacrificial film 161, the probe pins and the first bottom film 162 are formed by sputtering. The first bottom film 162 is preferably a titanium (Tm) / nickel (Nm) iron (Fe) film, or the like having a thickness of about 0.05 to 0.5 μΓα. If the titanium / nickel-iron thin film is to be formed as the bottom film 162, first, a titanium thin film is formed by sputtering to form a close contact layer, and a nickel-iron thin film is formed on the titanium film by sputtering. In this example, for example, the thickness of the titanium film is 0.02 Å, and the thickness of the nickel-iron film Η4367 -48-200307814 is about 0.1 5 μm. The use of the first bottom film 16 2 is because a photoresistance resist film to be described later is formed directly on the sacrificial film 16 1, which cannot obtain a high-resolution impedance film. Depending on the type of the photoresist, the first bottom film 162 may be omitted. As shown in Fig. 27C, on the surface of the first bottom film} 62, a photoresist is applied to an arbitrary thickness. A photomask having a predetermined pattern is placed on the surface of the photoresist. It performs exposure and development processes to remove unnecessary photoresist to form a first resistive film 1 63 having openings corresponding to the probe patterns. The first resistive film 163 preferably has a thickness of about ˜200 μπ}. When the first impedance film 163 is formed, in addition to the patterns corresponding to the probe pins, the graphics corresponding to one or more frame beams used to determine the position of the probe unit may be simultaneously Form one or more positioning holes and small holes. As shown in FIG. 27D, the first nickel alloy pig (pattern) 164, which is to be used as a probe pin and a positioning member, is formed on the surface of the back surface of the first impedance film 163, which is not covered with 162. Electroplating is performed by using a known iron-nickel plating solution, which contains sulfuric acid as a main component. The thickness of the first metal pattern (pattern) 164 can be set as required. As shown in FIG. 27E, the first impedance film 163 is removed. To remove the first resistance film 163, the interface between the first resistance film 163 and the first bottom film 162 is cleaned with N-methyK2-pyrrolldone. In this example, by immersing the structure of the substrate 160, the ytterbium film 163 and the like in ... methyl_2_pyrro_Udone and performing ultrasonic cleaning at 85γ, the first impedance film 1 6 3 may Remove efficiently. -49-84367 200307814 As shown in FIG. 27F, the exposed bottom film 1 62 is removed by ion milling, so the first bottom film 1 62 and the first metal foil 1 64 have the same external dimensions to constitute the first The probe pins 22 of the bottom film 162 and the first metal foil 164 remain on the surface of the sacrificial film 161. As shown in FIG. 27G, the surfaces of the sacrificial film 16 and the probe pins 22 are covered with an electroplated copper layer 1 65. In this example, the plated copper layer! 6 5 is formed excessively, so the surfaces of the sacrificial film 16 1 and the probe pin 22 can be completely covered. As shown in FIG. 2 7, the electroplated copper layer 1 6 5 is grinded with diamond. To grind so that the upper surface of the plated copper layer 1 65 is flush with the probe pins 22. As shown in FIG. 2I, an insulating film 16 is formed on the surfaces of the probe pins 22 and the plated copper layer 165. The insulating film 166 may be a broken film, a film, or the like formed by spraying money, CVD or the like, and having a thickness of about 0 1 to 20 μm. The insulating film 166 is formed to electrically insulate the probe pins 22 and a probe holder to be formed on the probe pins 22, as described below. As shown in FIG. 27J, on the surface of the sacrificial film 166, a first bottom film 1 7 of the probe holder is formed by sputtering. The second bottom film 1 $ 7 is made of a material similar to the first bottom film 16 2. As shown in Fig. 27K, on the surface of the second bottom film 167, the photoresist is coated to an arbitrary thickness. A photomask having a predetermined pattern is placed on the surface of the photoresist. It performs exposure and development processes to remove unnecessary photoresist to form a second resistive film having an opening corresponding to the probe holder pattern] 6 8. The thickness of the second impedance film 1 68 is preferably in the range from 10 to 2 84367 -50-200307814. Except for the openings that should correspond to the pattern of the probe holder, the thickness of the second resistance film 1 68 corresponds to that used for determining the riding position. The openings of the needles (set or set) or a plurality of frame patterns can form one or more positioning holes and small holes at the same time.

The photoresistor used as the second impedance film 168 may be similar to the photoresistor Q used as the first impedance film 163 / as shown in FIG. 27L. The second nickel alloy metal Luo 169 of the probe holder It is formed on the surface of the second bottom layer 7 that is covered with the second impedance film 168. It is plated by using a known iron-nickel plating solution, which contains bowl acid as a main component. The second metal foil! The thickness of 69 can be set as required. As shown in FIG. 27M, the second resistance film 168 is removed. To remove the second resistive film 168, the interface between the second resistive film 168 and the second bottom film 167 is cleaned with N-methyl-2-pyrroUdone. In this example, by immersing the structure of the substrate 160, a resistive film 16 8 and the like are in N-methyl-2-pyirolidone, and at 85. (: The next execution of the ultrasound, please wash away the second impedance film 1 6 8 can be removed efficiently. As shown in Figure 27N, the exposed second bottom film 1 67 is removed by ion milling 'so the second bottom The film 167 and the second metal foil 169 have the same external dimensions. As shown in Fig. 2 7P, "the exposed insulating film 1 6 6 is removed by ion | insect etch" so the insulating film 1 6 6 and the second The metal foils 1 6 9 have the same external dimensions, and a probe holder Π 〇 composed of the insulating film 1 66 and the second metal foil 1 69 can be obtained. As shown in FIG. 27Q, the sacrificial film 161 and The electroplated copper layer 165 can be dissolved with a solvent, which will give priority to dissolving copper over other materials. Because of & $ -51-H4367 200307814 and other alder needle pins 22 and probe holders 1 10 The integrated part and the substrate 160 can be used to form a probe unit 10 having the probe pins 22 and a probe holder n0. Using the eleventh method of the probe unit, These probe pins 22 and = ten clamps 1 1 〇 are integrally formed by using a stack of many films, without using mechanical or solder or adhesive Bonding agent to combine the probe pins and probe ten: hold state. Therefore, it is possible to prevent the probe pins 22 from being damaged. It is possible to form the probe pins 22 with high relative position accuracy. And probe holder 1 1 0. The probe pins 2 2 and probe holder i 1 〇 use photoresist to form the frame, positioning holes and small holes. Available-high position alignment precision ::: Cheng. Therefore, the needle unit 10 can be mounted with high position alignment accuracy. Therefore, it is possible to perform the conductivity of the liquid crystal display panel and the like with high accuracy. Test. Because it is possible to form the frame, the positioning of the probe pin 22 and the relative position of the body and the body at the same time: '; You can improve these probe pins 22 Say I: Grab the needle early And its manufacturing method has been matched with the preferred embodiment, if a plurality of small holes are formed through the element, the needle can be clamped, and the probe can be etched to efficiently perform the task. The needle unit is shaped by electroplating. The thickness of the probe holding the crying pA in the frame which is not disturbed by any obstruction is Evenly, two, ^ 'The positioning holes, open v ~ bu, and follow the temple position to form a frame and the frame of the foot on the hexagram r, zhangzhiyi 84367 -52-200307814 and so on Small holes can be placed with precise alignment accuracy. The edge film is formed on the probe holder by electroplating, and the surface of the insulating film you pass through is formed by using a photoresist To form a probe pin pattern with a single resolution, it can be formed 'so these probe pins can be formed with a high degree of accuracy. / If the wooden pin holder and probe pin are covered with -protection The film can be changed ... . The close contact between the feed pin and the pin can protect the wiring of the wood grabbing pin as early as 7C. Cry $: etc. The needle pins are formed in the probe holder formed by electroplating. By using the same or generalized material as the child's needle holder, 2 the use of rhenium alloy can be improved in the probe holder The holder and the probe are inserted in the pottery, and the children's probe pins and the probe holder can be placed with high relative placement accuracy. If the probe pins formed by electroplating are embedded in a needle holder made of resin, it will not damage the waiting probe pins and probe holders: Wait for the probe pins. In addition, these probe pins and probes can be formed and combined with high relative position accuracy. . . Fig. 28 shows a front view of how to use the probe manufactured by the method of this embodiment. In Fig. 28, a probe unit with a seventh structure shown in Fig. 9A and a clasp is shown. The probe holder i 10 of the probe unit 10 is bonded to a joint surface 100 a of a holder 100 of a conductive test device, not shown. The probe unit 10 is electrically connected to the circuit of the conductive test device through an electrode (not shown) of the flexible wiring plane cable 3.

53 200307814 In order to bond the probe unit 丨 0 to the holder 丨 〇〇, install it vertically on the joint surface of the holder 1 0 0, and read the buddha ’s position in S temple pin 10 and above A part of the positioning pin 形成 formed with a thread is inserted into the 孔 k hole 111 formed through the probe holder 110 and the fixing jig 1Q2 ′, for example, a nut is engraved with the thread by the pin. A conductive test system is pushed in by Pu Puzhong $ 采 针 早 伍 1 0 < Probe pin 2 2 Tip

To a test body (to be measured) 1 1 QUUU ^ pole to perform, for example, placed on a test and made of insulating material, Λ 十, it 1 type sister base (sample base) 103 Of an LCD panel. The present invention has been described in conjunction with the perch du θ M ~, 乂, 乂 /, and Qiguan. The present invention is not limited to the above specific implementations. J is so drunk that the technical professionals can perform different corrections, modifications, combinations, and the like. Brief Description of the Drawings Figure 1 shows a plan view of the dry unitary structure of a probe unit. Fig. 2 is a plan view of a probe unit J 罘 structure. 3A and 3B show a plan view and a cross-sectional view of the third structure of the early leg, such as —, > τ " Figures 4A and 4B show a plan view and a cross-sectional view of the fourth structure of an oblique σσ. Figures 5A and 5B show a distance-seeing, and a block diagram. The plan view and cross section of the fifth structure are shown in Fig. 6, which is not a modification of Fig. 1. One, ten Zhuowu floor plan. FIG. 7 shows a plan view of a modified wooden leaf unit in FIG. 2; Figures 8A to 8C show a look-ahead. Early Yuan's sixth structure plan view. 84367 '54-200307814 Figures 9A and 9B show a plan view and a cross-sectional view of a seventh structure of a probe unit. FIG. 10 is a plan view showing an eighth structure of a probe unit. 11A and 1B show a plan view and a cross-sectional view of a ninth structure of a probe unit. FIG. 12 is a plan view showing a tenth structure of a probe unit. 13A and 13B are a plan view and a cross-sectional view showing an eleventh structure of a probe unit. 14A and 14B show a plan view and a cross-sectional view of a twelfth structure of a probe unit. 15A and 15B are a plan view and a cross-sectional view showing a thirteenth structure of a probe unit. Figs. 16A to 16A show cross-sectional views of the first method of manufacturing a probe unit. 17A to 17C are schematic plan views showing a second method of manufacturing a probe unit. Figures 18A to 18B are architectural plan views of a third method of manufacturing a probe unit. Figures 19A and 19B are architectural plan views of a fourth method of manufacturing a probe unit. Figures 20 A to 20 J show a cross-sectional view of a fifth method of manufacturing a probe unit. Figures 2 A to 2 1 F are architectural cross-sectional views of a sixth method of manufacturing a probe unit. 84367 -55-200307814 Figures 22A to 22H are architectural cross-sectional views of the seventh method of manufacturing a probe unit. 23A to 23F are architectural cross-sectional views showing an eighth method of manufacturing a probe unit. 24AX and 24AY to 24LX and 24LY are architectural cross-sectional views showing a ninth method of manufacturing a probe unit. 25A to 25F are architectural cross-sectional views showing a tenth method of manufacturing a probe unit. Figure 26 shows an architectural cross-sectional view of a modification of the tenth method of manufacturing a probe unit. Figures 27 A to 2 7 Q are architectural cross-sectional views of the eleventh method of manufacturing a probe unit. Fig. 28 is a front view showing how to use the probe unit manufactured by the method of this embodiment. Description of symbolic symbols 2 Probe device 3 Flexible printed wiring plane cable 4 Fixing fixture 10 Probe unit 12 Substrate 14 Wire pattern 16 Positioning part 1 8 Inner wall 19 protruding! 84367 -56-200307814 20 Wire 22 Probe pin 24, 25, 28 Reinforced film 26 Through hole 30 Alignment mark 32 Protective film 50 Recessed 52 Sacrifice film 52a Bottom layer 52b Copper film 5 7 Cover film 58 Resistance film 60 Substrate 66 Resistance mask 67 Opening 72 Insulation film 76 Resistance film 78 Supporting film 88a Metal layer 88b Artificial resin layer 89 Adhesive 89 Electroplated gold 92 Metal deposition film 94 Growth area-57 84367 200307814 96 Conductive film 103 Test body base 1 10 Probe holder 1 10 Test body 111 Positioning hole 1 12 孑 L 1 13 Electrode 1 14 Positioning frame 1 15 Holder 1 16 Mounting parts 134 Metal foil 145 Electroplated copper layer 84367 〇8

Claims (1)

200307814 Scope of patent application ... 1. A probe unit, Jt —, human /, mouth I — a needle device to test the function of a test body, which includes: a substrate; '^ probe pin' The lithography is formed on the substrate, and the probes are inserted with end points that are larger than the β substrate, and are brought into contact with the test body. The lithography is formed on the substrate with respect to the probe pins. At a predetermined position, the mosquito biting member abuts on the component to position the substrate relative to the child probe device. twenty four. For example, the probe unit of the patent application item # 1, the positioning member of the towel has an inner #clip loop shape, wherein the elastic protrusion extends around the periphery of the through hole formed through the substrate. ^ Number of patent applications! The probe unit of this item further includes a reinforced frame, which is fixed to the child base, and covers the area of the probe pins on the substrate, and / or at least one area of the positioning component. For example, in the scope of application for the first item in the scope of patent application-* | 一, τ 间 不 i (the needle is early, in which the probe pins of the child and the positioning component must be made of the same material and have a film thickness of ㈣. A kind of probe unit, which is fixed to a probe device to test and test bone functions, including: a probe pin including a bottom film, and a probe pin pattern formed on the bottom film; and —Probes formed on the upper surface defined by the ends of these probe pins, and having a plurality of small holes are crying. 84367 200307814 6 9 10 As shown in item 5 of the scope of the patent application, the shape of the probe is 4 , ， 10 early, where the probe holder is from the top, the bar, and the diaphragm on the coat room. 探针 Probe single wood 5-8 probe 4 of the patent scope 5 wooden needle early 疋Contains coverage of the text holding benefits and the probe insert f < security film. Forma patent range 6 Fuzhi photo 4+ σσ-except 7 ~ solid κ grasping needle early, where the probe holder 1. In addition to this, the material outside the limbal membrane is made of the same material as that of the Mm < Temple probe pin. Π wu If the probe in the scope of patent application No. 5 covers the probe pins. ^ Wooden needle holder ': a method for manufacturing a probe unit, which is fixed to 1 ## Testing the function of a test body includes: ^ (a)-a step of preparing a substrate; ⑻-the step of forming a recess in a surface layer of the substrate-⑷-forming a sacrificial in the recess of the substrate Film step; '(d) — step between the substrate and the sacrificial film; formation of a film on the field-forming an opening step on the surface of the bottom film by forming on the surface of the sacrificial film The above-mentioned "at least-part of the film of Wu Zhibu is exposed at the bottom of the openings :, the bottom (f)-at the bottom exposed at the openings ^ Steps of the cover film; (g) on Table®-a step of removing the impedance film; (h) and a bottom film that is not covered with the cover film. (I) a step of removing the sacrificial film; and 200307814 (J) A step of cutting the substrate along a cutting line passing through the recess, wherein the steps (a) to (J) are simultaneous Formed on the substrate are: " probe pins protruding from the substrate " terminal points, and brought into contact with the electrode of the test body, and a positioning member, which is abutted against a member opposite to the probe device基板 jj / A method of manufacturing a probe unit, which is fixed to a probe device to test the function of a test body, including: (a)-a step of preparing a substrate; (b) -A step of forming an alignment mark on the surface of the substrate; (c) a step of forming a recess in a surface layer of the substrate; (d)-forming a sacrificial film in the recess of the substrate Steps, steps; (e)-forming a bottom film on the surface of the substrate and the sacrificial film + step; (f) a step of forming an impedance film with a gate on the surface of the bottom film, in the form of At least a part of the bottom film formed on the surface of the sacrificial film is exposed at the bottom of the openings; a (g)-forming a cover film on the surface of the bottom film exposed at the bottom of the openings Steps; (h)-steps for removing the impedance film; (I) Removing the bottom film not covered with the cover film; (J) a step of removing the sacrificial film; and (k) a step of cutting the substrate along a cutting line passing through the recess wherein: in the After steps (a) and (b), these steps to () <) form a probe 84367 200307814 pin to make it contact the buckle, child pole of the test body, and the substrate dog on the substrate. Out, by using the alignment mark as a position reference; and forming a positioning member to abut a two thousand thousand to use the alignment fear as a position reference relative to a The probes on the substrate are placed on the substrate. 12 Two methods for manufacturing a probe unit 'The probe unit is fixed to a probe device to test the function of a test body, and includes: (a)-a step of preparing a substrate; (b)-on the substrate A step of forming a recess in a surface layer; (c) a step of forming a sacrificial film in the recess of the substrate; (d) a step of forming a bottom film on the surface of the substrate and the sacrificial film; A step of forming a resistive film with openings on the surface of the bottom film by forming at least a portion of the bottom 4 film formed on the surface of the sacrificial film to be exposed to the bottom of the openings; 0—the step of forming a cover film on the surface of the bottom film exposed at the bottom of the openings; U) —the step of removing the impedance film; 〇1) removing the bottom film that is not covered with the cover film (0 — a step of removing the sacrificial film; and (J) a step of cutting the substrate along a cutting line passing through the recess, wherein: the previous steps (a) to ⑴ are respectively formed on the substrate The probe pins are used to contact the electrodes of the test body, and The substrate protrudes, and a pair of ^ 4367 200307814 quasi-marks; and then these steps (b) to (j) form a positioning part to abut on the part to use the alignment mark as a position reference to The substrate is positioned relative to the probe unit on the substrate. 3 · A method of manufacturing a probe unit, the probe unit being fixed to a probe device to test the function of a test body, including: (a ) — A step of preparing a substrate; (b) — a step of forming a recess in the surface layer of the substrate; (c) a step of forming a sacrificial film in the recess of the substrate; (d) — A step of forming a bottom film on the surface of the substrate and the sacrificial film; (e)-a step of forming a resistive film with an opening on the surface of the bottom film in a manner formed on the surface of the sacrificial film At least a part of the formed bottom film is exposed at the bottom of the openings; (f) a step of forming a cover film on the surface of the bottom film exposed at the bottom of the openings; (g) a shift The step of removing the impedance film; (h) removing the uncovered film The bottom film of the film; (I) a step of removing the sacrificial film; and (J) a step of cutting the substrate along a cutting line passing through the recess, wherein: the previous steps (a) to G ) Forming a positioning component on the substrate to abut against a component to position the substrate relative to the probe unit, and an alignment mark; and 84367 200307814 Then these steps (b) to (") A probe pin is formed to contact the electrode of the dream test subject, and it is protruded from the substrate by using the alignment mark ^ and the position is not old. 14 15 A method of manufacturing a probe unit, comprising: a step of forming a sacrificial film on a surface of a substrate; a step of forming a bottom film on the surface of the sacrificial film; a surface of the bottom film A step of forming a resistive film having an opening corresponding to the -probe unit pattern;-a step of forming a unique pattern of the probe in the openings of the resistive film by electroplating 'the probe unit pattern includes a probe Pins and holders; a step of removing the resistive film and a film of the Chenchen film in the hole of the resistive film; and a step of removing the sacrificial film to obtain a probe unit A method for a needle unit, comprising: a step of forming a sacrificial film on a surface of a substrate; a step of forming a sacrificial film on the surface of the sacrificial film; Corresponding to the-opening of the probe holder pattern;-the step of forming the probe holder pattern in the Λ, + ^ Wu 0 ^ temple opening of the first impedance film by electroplating;-in the probe Table of gripper pattern; I round Forming an insulating film, removing the first impedance film, and obtaining a cypress needle holder; a step of forming a metal layer on the surface of the sacrificial film by electroplating; 84367 200307814 step; and The probe is not formed to hold a cry. A step of forming a bottom film on the surface of the insulating film and the metal; ^ ^ main y ^ 丄, the tenth arm; a formation on the surface of the bottom film- Step of the second impedance film 'The second impedance film has an opening corresponding to a probe holder pattern; a step of forming the probe pin pattern in the openings of the second impedance film by electroplating 骡A step of removing the second impedance pattern and a step of removing the sacrificial film under the second impedance film to obtain a probe unit. 16 · A method of manufacturing a probe unit, comprising: a step of forming a sacrificial film on a surface of a substrate; a step of forming a first bottom film on the surface of the sacrificial film. Step; A step of forming a first impedance film having an opening corresponding to a probe unit pattern on a surface of the first bottom film; and forming the probe pin pattern in the opening of the first impedance film by electroplating A step of removing the first impedance film to obtain the probe pin pattern; a covering layer of the probe pin pattern with a plating layer, grinding the surface of the electric clock layer to make the surface of the plating layer A step of flushing the surface of the probe pin pattern, and then forming an insulating film on the plating layer and the surface of the probe pin pattern; forming a second bottom film on the surface of the insulating film Buzan · One step of forming a second impedance film on the surface of the second bottom film 84367 200307814, the second impedance film has an opening corresponding to one of the probe holder patterns having at least one small hole; a By breaking the key in * Hidi A step of forming a cough probe fire holder pattern in the opening of the impedance film 1; and removing 4 the first impedance film, the second bottom film, the insulation film, the plating layer, and the sacrificial film to obtain a probe Unit steps. 17. A method of manufacturing a probe unit, comprising: a step of forming a sacrificial film on a surface of a substrate; a step of forming a bottom film on the surface of the sacrificial film; A step of forming an impedance film with an opening corresponding to a probe pin pattern on the surface; a step of forming the probe pin pattern in the openings of the impedance film by electroplating; a step of the bottom film Step of removing the far-impedance film and the step of the resistance film; the step of changing the clothes back into two holders' the probe holder is made of resin; and 1δ remove the sacrificial film to obtain a Steps of the probe unit. A method of manufacturing a probe unit, the probe unit being fixed to a probe gas to measure the function of a test body, which includes: It is in contact with the probe pin of the test body, and the probe is opposed to the probe part. The material of the gray and blue substrate is 3f) 7 -8 * 200307814 — a kind of manufacturing probe Unit method, the probe unit being fixed to a probe device to test the function of a test body, including: a step of forming an alignment mark on a substrate; and using the pair on the substrate by lithography The quasi-marker is used as a ~ position test to form a probe pin so that it contacts the electrode of the test body and protrudes from the substrate. A & forming a ^ position component to abut on the component, to A step of positioning the substrate with respect to the probe unit on the substrate using lithography by using the alignment mark as a position reference. 20. A method of manufacturing a probe unit, the probe unit being fixed Yu-probe device to 'test the function of the test body, which Including: by lithography simultaneously forming the foot probe pins with the last 4 points of the H substrate out of contact with the snow kappa pole of a test body on the substrate at the same time, and ~ alignment marks; = formation-positioning component Come close to the component to use the pair: loose: as a position reference to position the substrate relative to the probe unit on the substrate. 21-A method of manufacturing a probe unit, The probe unit is fixed to a probe device to test the function of a test body, and includes: by forming a positioning member on the substrate by lithography at the same time to abut the -Deng's component by using the alignment Marking is used as a position reference to position the substrate relative to the probe unit on the substrate, and a step of aligning the marks; 84367 200307814 reference to form a terminal point protruding from the substrate and making it contact the test body Steps of probing pins of electrodes. 22. A method of manufacturing a probe unit, the method includes the following steps: (a) preparing a first substrate made of copper; (b) on the surface of the first substrate A bottom film is formed thereon; (c) forming an impedance film having an opening corresponding to a probe cell pattern having one or more small holes on the surface of the bottom film; (d) electroplating a metal layer on the bottom film to form a substrate having a probe The probe unit pattern of the pin pin and the probe holder; (e) removing the impedance film and the bottom film; (f) dissolving copper to obtain a probe unit. The method for manufacturing a probe unit further includes the steps after step (a): (g) aligning the first substrate with a second substrate that is solid and stable. 84367 -10-