200302298 玫、發明說明 【發明所屬之技術領域】 本發明係有關於一種施以脈衝電流之電化學處理材料 的裝置與方法，此裝置與方法適合用在生產線、浸入型機 器與捲軸至捲軸間之傳送帶機器，較適合處理之產品為電 路板、電路箔與晶圓。本發明適合用在產品表面的一個完 整平面之處理以及電絕緣結構之處理，像是導帶（c〇nducting strips )電路板襯墊的處理，脈衝電流可以是單極型或雙 極型。 【先前技術】 已知在電錢時施以脈衝電流相較於施以直接電流，於 結晶成長的影響為較有利。不平坦或形成某種形狀表面的 程度也會對電化學處理造成影響，尤其是對於孔洞與通道 的處理。研究結果指出，使用暫時且非常短暫的脈衝電流 是非常有利的。而此極短之脈衝電流被定義為一個約為1 毫秒（m1Crosec〇nd )的發展時間。到目前為止，這樣短的 脈衝/、有在非常小之產品的電化學處理，且在技術需求約 為100安培的高電流時，為可實行的。 在德國之專利文件DE 27 39 427 C2中，揭露在電鍍 時施以脈衝的—種方法。在此文件中揭露，降低脈衝時間 可以明顯改善電鍍深洞的情形。最佳結果在10毫秒至1 毫矜之間的脈衝時間可以達到，而相應之脈衝頻率範圍則 為0·1百萬赫茲（MHz )至1 MHz。 200302298 對由脈衝電流源至電解槽並具有電導之高頻 高電流脈衝來說，其傳送必定非常小。 以下計算範例說明了如果應用已知方法，典 生產線或浸入機無法以高頻脈衝電流處理。 一圓形高電流導體之誘導率約為0.5 β H/tn 置於電解槽外之脈衝電流源與陽極、陰極電路板 前進導體與返回導體所需之總平均長約需要2m， 電流源直接置於電解槽内。 導體整個的誘導率約為1//H。整體之有效 有整個電子迴路之歐姆電阻❶因此，其包含導體 電性接觸的全部電阻與電解槽電阻，總共約有1 〇 (milliohms ) 〇 根據方程式tau = L/R，其中l為誘導率，R 阻’可計算針對脈衝電流上升之獨立電流時間常數 上述中所提到之tau計算如下： tau= 1*i〇-6H /l〇*l〇-3〇hm = 〇.l*1〇-3seconds 對一完全發展的脈衝約需要 5*tau， 5*〇.lms = 0.5ms 。這相對應於可實行的脈衝頻率约 赫茲（kHz )。 因此習知在工業應用上之電化學設備，僅使 展期間的脈衝與介於1〇〇赫茲（Hz)至lkHz之間 在上述德國專利中所提到脈衝時間介於1 〇 s )到1 M s間的較佳範圍，並不能以習知技術來實 在德國專利文件DE 197 265 1 〇 C2中，曾 誘導率的 型電路板 。為了以 相連接， 即使脈衝 電阻包含 的電阻、 百萬歐姆 為歐姆電 .J tau ， 例如， I為1千 用電流發 的頻率。 微秒（从 行。 揭露在電 200302298 路板之電化學金屬電鍍技術中，使用脈衝電流的方法與裝 置。此發明被應用於浸入機與連續式水平板或垂直板傳送 的生產線中。為了改善使用情形，減少了其所建議的電流 發展時間（由脈衝電流源至陽極或陰極之傳送）。載體，也 就疋一般電解浸入機之陰極載體與陽極載體，其長度約有 1米（m )到8m。如果在陰極載體或陽極載體上傳送脈衝 電〉瓜源，上述之j? 'n e λ· 電子迴路長度，較之於直接位在電解槽之 脈衝電流源’ ϋ無改變。電子迴路終止，總是由電流源開 始至：極載體、鑲嵌於其上的陽極、ϋ過電解液至被處理 =產直到至陰極載體而再回到電流源。其與電流源 安置於電子迴路何處並無關聯。i少在兩載體其中之一設 置電流源’電子迴路 | & 略之長度並無減少。因此，整個電子 路之有效誘導率不合# ,丨、 m 不會減乂 。因而，應用此發明之脈衝 在僅幾百個赫茲為可行的。 【發明内容】 本發明之目的為提 安培之脈衝電流與高達 用0 供一種裝置與方法，能夠使用1〇〇〇 頻率於大規模工業電解應 -直别、 範圍第1項所述之裝置盥如 睛專利乾圍第〗9 TS « _ * i兴如 一新技術获 、斤述之方法來達成。此裝置與方法使 :、置於其中，其具有接觸電極的特徵。 _二電:：其基礎之應用在德國專利申請… ” DE 100 43 816。中有描述，但皆尚未 200302298 開。大體上’攻些接觸電極包含有數種帶（s⑴p )型 排列接觸·點，係位於產品電解處理表面上。在接 ； 帶狀之反相電極安置於產品表面的後方，1與接觸帶電1 絕緣。產品表面與反相電極形成電解小槽。這些小槽 流源提供電流，而安置於處理槽外的電流源、，並藉： 曲之電導與接觸帶及反相電極相聯結。接觸帶與反相電極 被固定於必須藉由移動單元才能移動的主要單元上，如此 產品可以為接觸狀態，且產品可以在非接觸之狀態下被傳 送，而產品之電解處理則發生於接觸狀態下。 接觸電極允許產品表面之絕緣結構發生電解液處理。 如果當非常薄之電導層要藉由電解而增厚時，例如··濺鍍 層，這也是有利之可用方法。 接觸電極之應用也適用於脈衝電流與頻率高至幾百個 赫茲之應用。然而並不適用於約1MHz的高頻脈衝電流以 及約1 000安培或更高振幅之脈衝電流。 上述與其他的目的、特徵以及本發明之優點將在下列 之細節描述與隨附之關聯圖形中作更詳細的描述。 【實施方式】 在此以所附之圖式來具體化說明本發明之較佳實施 例。以下之描述與圖形，相同之參照數字被用來命名相同 或相似之元件’因此相同或相似元件之敘述將不再重複。 如弟1圖之接觸電極包含已•有絕緣處理的主要單元 6，以及與進行電解處理之電導層2接觸的帶狀電觸點4 。 200302298 接觸帶3由觸點4與觸點絕緣5所形成。鄰接接觸帶3為 反相電極7，其與接觸帶3絕緣，同時也被安排成帶狀。 反相電極7與產品丨的的電導層2共同形成了電解電池。 在下文中，電解電池將被稱作為電解小槽在兩個接觸 帶3當中的距離，也就是反相電極7被安置的地方，可以 有很大的改變範圍。最小的電解處理結構可以小到例如〇1 公釐（mm)，最大則可以大到好幾公分（cm)，例如5cm。 在電解小槽9當中，陽極與陰極的距離在最小的處理結構 當中也是可行的’然而在大到好幾公分時，例如1()咖時， 也應是可行的。 在電鍍時，觸點4以及被處理的電導層2為極化陰極， 反相電極7則為陽極，其較佳為不溶於電解液的形式。在 電鍍時施以雙極脈衝電流，反相電極7被顯著地極化為陽 ★產口則被顯著地極化為陰極。彼此十分靠近的陽極與 陰極被固定在主要置分& u 要早70 6上。场極、陰極與主要單元6 一 起形成一模組單元，經或拉細 ^ 稱為接觸電極30。電流源12的一端 精由電導 8與接雜适 接觸電極30上之接觸帶3相連結，而另一 端則與接觸電極30上之反相電極7相連結。 第2圖所綠示為根據本發日月，置於接觸電極3〇上並 作為電流源的脈衝雷法；，， ^ 電机源13 。脈衝電流源1 3的一端與觸 點4有電性連接，而里 ^ t ^ 另一 則與反相電極7有電性連接。 整個電子迴路在接 、 觸電極上終止，換言之也就是在脈衝 電流源13之上。垃飽 接觸電極與脈衝電流源形成一個緊實的模 組單元。此外，雷道。 V 8的長度減少到只有幾公分，而這與 200302298200302298 Description of invention [Technical field to which the invention belongs] The present invention relates to a device and method for applying an electrochemical treatment material to a pulsed current. The device and method are suitable for use in production lines, immersion machines, and between reels and reels. Conveyor machines are more suitable for handling circuit boards, circuit foils and wafers. The invention is suitable for the treatment of a complete flat surface of the product and the treatment of electrically insulating structures, such as the treatment of conductive strips for circuit board pads, and the pulse current can be unipolar or bipolar. [Prior art] It is known that applying a pulsed current to electricity has a more favorable effect on crystal growth than a direct current. The degree of unevenness or the formation of a shaped surface can also affect electrochemical processing, especially for holes and channels. The results of the study indicate that the use of temporary and very short pulse currents is very advantageous. And this extremely short pulse current is defined as a development time of about 1 millisecond (m1Crosecnd). So far, such short pulses have been electrochemically treated in very small products, and have been implemented when the technical requirements are high currents of about 100 amps. In German patent document DE 27 39 427 C2, a method is disclosed in which pulses are applied during electroplating. It is disclosed in this document that reducing the pulse time can significantly improve the situation of plating deep holes. The best results can be achieved with pulse times between 10 milliseconds and 1 milli-Torr, and the corresponding pulse frequency range is from 0.1 million hertz (MHz) to 1 MHz. 200302298 For a high-frequency, high-current pulse with a conductance from a pulsed current source to the electrolytic cell, its transmission must be very small. The following calculation example illustrates that if a known method is applied, a typical production line or immersion machine cannot be processed with high-frequency pulsed current. The induction rate of a circular high current conductor is about 0.5 β H / tn. The total average length of the pulse current source and anode and cathode circuit board forward conductor and return conductor placed outside the electrolytic cell needs about 2m. The current source is directly placed. In the electrolytic cell. The overall induction rate of the conductor is about 1 // H. The overall effectiveness is the ohmic resistance of the entire electronic circuit. Therefore, it includes all the electrical resistances of the conductors and the resistance of the electrolytic cell, a total of about 1 (milliohms). According to the equation tau = L / R, where l is the induction rate, R resistance can be calculated for the independent current time constant for the rise of the pulse current. The tau mentioned above is calculated as follows: tau = 1 * i〇-6H / l〇 * l〇-3〇hm = 〇.l * 1〇- 3seconds requires approximately 5 * tau for a fully developed pulse, 5 * 〇.lms = 0.5ms. This corresponds to a practical pulse frequency of approximately hertz (kHz). Therefore, the conventional electrochemical devices used in industrial applications only make the pulses during the exhibition and between 100 Hz and 1 kHz. The pulse time mentioned in the above German patent is between 10 s and 1 The preferred range between M s cannot be realized by the conventional technology in the German patent document DE 197 265 100 C2, a type of circuit board that has an induction rate. In order to connect with each other, even if the impulse resistance includes the resistance, millions of ohms are ohms of electricity. J tau, for example, I is a frequency of 1 thousand currents. Microseconds (from the line. Disclosed in the electrochemical metal plating technology of electric 200302298 circuit board, using the method and device of pulse current. This invention is applied to the production line of immersion machine and continuous horizontal or vertical board transfer. In order to improve The use case reduces the recommended current development time (transmission from the pulse current source to the anode or cathode). The carrier, that is, the cathode carrier and anode carrier of the general electrolytic immersion machine, has a length of about 1 meter (m) To 8m. If the pulsed electricity is transmitted on the cathode carrier or anode carrier> the source, the above j? 'Ne λ · electronic circuit length is not changed compared to the pulse current source directly located in the electrolytic cell'. The electronic circuit is terminated. , Always start from the current source to: the electrode carrier, the anode embedded on it, the electrolyte solution to be processed = produced until the cathode carrier and then return to the current source. Where and the current source are placed in the electronic circuit and No correlation. The current source's electronic circuit is not set in one of the two carriers, and the length is not reduced. Therefore, the effective induction rate of the entire electronic circuit is not the same #, 丨, m will not decrease. Therefore, the application of the pulse of this invention is only feasible at a few hundred hertz. [Summary of the invention] The purpose of the present invention is to improve the pulse current of amps and provide a device and method using 0, which can use 1 〇〇〇 Frequency in the large-scale industrial electrolysis should be-straight, the scope described in the scope of the first item of patents and patents [9] TS «_ * i Xingru as a new technology to obtain, the method described. This is achieved. The device and method are: placed in it, which has the characteristics of a contact electrode. _ Erdian :: The basic application is described in the German patent application ... "DE 100 43 816. However, none of them have yet been published in 200302298. Generally ' The contact electrodes include several types of stripe-type array contacts and points, which are located on the surface of the product's electrolytic treatment. On the connection; a strip-shaped reverse electrode is placed behind the product surface, 1 is insulated from the contact charge 1. The surface of the product An electrolytic cell is formed with the inverting electrode. These small tank current sources provide current, and the current source placed outside the processing tank is connected to the contact strip and the inverting electrode by: It is fixed on the main unit that must be moved by the mobile unit, so that the product can be in a contact state, and the product can be transferred in a non-contact state, while the electrolytic treatment of the product occurs in a contact state. The contact electrode allows the product The surface of the insulating structure undergoes electrolyte treatment. This is also an advantageous method if very thin conductive layers are to be thickened by electrolysis, such as sputtering. The application of contact electrodes is also suitable for pulsed currents and high frequencies. Applications up to several hundred hertz. However, it is not suitable for high-frequency pulse currents of about 1 MHz and pulse currents of about 1,000 amperes or higher. The above and other objects, features, and advantages of the present invention will be described in detail below. A more detailed description is provided in the description and accompanying graphics. [Embodiment] A preferred embodiment of the present invention will be specifically described with the attached drawings. The following descriptions and figures, the same reference numerals are used to name the same or similar components', so the description of the same or similar components will not be repeated. The contact electrode shown in Fig. 1 includes a main unit 6 that has been insulated and a strip-shaped electrical contact 4 that is in contact with the conductive layer 2 that is subjected to electrolytic treatment. 200302298 Contact strip 3 is formed by contact 4 and contact insulation 5. Adjacent contact strips 3 are reverse electrodes 7 which are insulated from the contact strips 3 and are also arranged in a strip shape. The counter electrode 7 and the conductive layer 2 of the product together form an electrolytic cell. In the following, the distance of the electrolytic cell between the two contact strips 3, which is referred to as the electrolytic cell, that is, where the reverse electrode 7 is placed, can have a wide range of variation. The smallest electrolytic structure can be as small as 0.1 mm (mm), and the largest can be as large as several centimeters (cm), such as 5 cm. In the electrolytic cell 9, the distance between the anode and the cathode is also feasible in the smallest processing structure '. However, it should also be feasible when it is as large as several centimeters, such as 1 (). During electroplating, the contacts 4 and the treated conductive layer 2 are polarized cathodes, and the reverse electrode 7 is an anode, which is preferably in an insoluble form in the electrolyte. When a bipolar pulse current is applied during electroplating, the inverting electrode 7 is significantly polarized to be a positive electrode. ★ The port is significantly polarized to be a cathode. The anode and the cathode, which are very close to each other, are fixed to the main component & u as early as 70 6. The field electrode, the cathode, and the main unit 6 together form a module unit, which is referred to as a contact electrode 30 after being drawn or thinned. One end of the current source 12 is connected to the contact strip 3 on the contact electrode 30 by the conductance 8 and the other end is connected to the reverse electrode 7 on the contact electrode 30. The green color shown in FIG. 2 is a pulsed lightning method placed on the contact electrode 30 and used as a current source according to the current sun and moon; ^ Motor source 13. One end of the pulse current source 13 is electrically connected to the contact 4, and the other ^ t ^ is electrically connected to the reverse electrode 7. The entire electronic circuit is terminated at the contact and contact electrodes, in other words above the pulsed current source 13. The contact electrode and the pulsed current source form a compact module unit. Also, Thunder Road. The length of V 8 is reduced to only a few centimeters, which is in contrast to 200302298
習知技術比較來說要短了許多。ιL τ夕如果接觸電極上的這些導 體要完整配電設計，則導體的長声腺合、、由生 m ± j 1^度將會消失。因此，整體 電路有效之誘導率也會消失〇这祐π邮你带+ k使付脈衝電流可以應用至 高振幅以及高至1MHz之頻率。 高頻高電流電路的非常緊會社德目士 i ^ 中I貫結構具有進一步優勢為， 實質上不產生電磁波之輻射。理. L χ 理由是，與上述習知技術對 照之下，此電路並不存在電流迪故, f t 也机W路（current 1〇〇p)與整個模 組單元電磁屏蔽之可能性。 ' 接觸電極30被整合至產品i的逐步電解處理裝置中’ 16運送，此The conventional technique is much shorter. If these conductors on the contact electrodes are to be designed for complete power distribution, the long acoustic glands of the conductors and the natural m ± j 1 ^ degrees will disappear. Therefore, the effective induction rate of the overall circuit will also disappear. This will allow you to apply + k to enable the pulse current to be applied to high amplitudes and frequencies up to 1 MHz. The very tight structure of the high-frequency and high-current circuit in the company's I ^ structure has the further advantage that substantially no electromagnetic radiation is generated. The reason for L χ is that, in contrast to the above-mentioned conventional technology, there is no possibility of current leakage in this circuit, and f t is also a possibility of electromagnetic shielding between the current path W (current 100p) and the entire module unit. 'The contact electrode 30 is integrated into the stepwise electrolytic treatment device of product i' 16 and this
如第2圖中所示。接觸電極30藉由移動裝置 移動裝置1 6可以抬高接觸電極3 〇離開產品丨，也可以再 度靠近及緊迫（press)產品Ϊ。電解處理在此緊迫狀態得 以完成（接觸電極30壓迫於產品〇。當接觸電極3〇處於 昇高狀態’移動裝置16可以同時完成與進料方向I?(表 示產品之移動方向）同向或反向之傳輸動作。如果接觸電As shown in Figure 2. By moving the contact electrode 30, the moving device 16 can raise the contact electrode 30 to leave the product, and can also approach and press the product again. The electrolytic treatment is completed in this pressing state (the contact electrode 30 is pressed against the product 0. When the contact electrode 30 is raised, the moving device 16 can simultaneously complete the same direction or opposite to the feeding direction I? (Indicating the product moving direction) Transfer action to it. If contact with electricity
極30處於緊迫狀態，接觸電極30與處理槽2〇内之產品} 可完成一致之傳輸步驟。如果接觸電極3 〇處於昇高狀態， 則接觸電極30返回一步驟而與傳輪方向相反。只有當產品 與接觸電極3 0處於昇高狀時’傳輸裝置1 9也可逐步傳 送。當接觸電極30與產品1之電導層2處於緊迫狀態，在 接觸電極3 0與產品1之表面沒有因傳送引起之相對移動。 藉由接觸電極3 0線性或迴轉的移動，將其從產品1 的表面抬起及靠近產品1。利用迴轉增加了電解液在小槽9 内的交換。接觸電極30緊迫在產品1上，而後者則倚靠著 9 200302298 一個固定的安排主體（為平滑產品而做的平滑設計），用以 吸收反作用力。這個主體稱為力重（force mass)18。如果產 品兩面同時進行處理，另外會再有一個接觸電極so將取代 力重18。產品i由含有以滾筒、圓筒、夾板或掛勾構成之 傳輸裝置19逐步傳送，以防接觸電極未處於緊迫狀態。在 處理槽20外侧可安置一或多個的運輸設備2丨，使供應至 處理槽20之產品i與從處理槽2〇拿走之產品i運輸無虞。 在主要單元6上之震動器22,用以產生電解液的壓力衝擊 與產品震盪。因此，在產品處理時因電解液交換所產生的 小洞問題得到改善。觸點4與反相電極7連結至脈衝電流 源13，形成電解小槽9之電源供給。整個裝置所有的移動 私序由控制單元23來協調與控制，如虛線所表示。控制單 元23也負責控制脈衝電流源1 3。 脈衝電流源1 3可以電流或電壓控制，也可以是固定 開啟的狀態。較佳者為，脈衝電流源只有在處理步驟時（電 鍛步驟）是固定開啟的狀態，且將具有顯著之臨時極性。 在移動步驟中，脈衝電流源也會是開啟的狀態，並具有另 一顯著之臨時極性。在此脈衝電流源也可產生一直接電流 用來對最後形成的沉積物去金屬化。必要之調整與開關程 序由控制單元23來及時啟動。在處理步驟與移動步驟中， 脈衝電流源1 3顯著之臨時極性可能有所不同。 處理步驟之時間間隔為0 · 〇 1秒至1小時，較佳者為 1秒至1分鐘。如果臨時發生非常短的處理步驟（起因於 在移動步驟中的關閉），直接電流源則提供了相應於單極型 10 200302298 優點為在接觸電極上也安置了直 脈衝電流之電流。在此^ 接電流源。 3m，較佳者為 物料處理之設 移動步驟中的^ 1 0mm 到 1 00mm 為宜。 備有關。 料步距為0.1mm至 較大之進料則與帶狀 電解液在經由處理搞、 槽20在迴路24中傳送，此迴路為： 例如幫浦2 5的一電解液億於 ·、、、 醉履傳輸裝置，以及用以調節處 液的過濾器26與計量單 电胖 早兀27。處理槽20中之電解液28 的水平面較接觸電極3 〇 Λ * 馮同，甚至比脈衝電流源i 3的最 上層表面還要高。電解液蕻篓暂 狀糟者幫浦經由電解液入口 1 〇 充滿電解小槽9，相同地經 、主由電解液出口 Π流出。第i圖 有圖例說明。在此，處理摊 蛟理槽20只用作為電解液之收集槽。 在圖中並未繪示，處理槽2〇 " 座口口 1之輸入與輸出而開 啟。輸入與輸出可由一手動驻罢lit ▲ ^ 于動裝置經過槽板來完成·，而在連 續式傳送帶上，也可藉由描辟1 ^ 稭由槽壁上之狹縫來傳送。狹縫可用 熟悉此技藝者所知之密封滾铕充 , 了展商或擒封口來加以密封。在脈 衝電流源1 3之概略圖示中，命诚士政 根據本發明，所有開關裝置與 電極可逆裝置都應被包含在内。 脈衝電流源13至少有部分被被置於接觸電極3〇上， 接觸電極與主要單元6、接觸帶3與反相電極了形成一棋 組單元。接觸帶…同方式互相電性連接，且與脈衝電 流源U -端相連接。脈衝電流源13另一端則與反相電極 7相連接’同時反相電7也以不同方式互相電性連接。 因為脈衝電流源、13、陽極與陰極被安置於很小的空間裡， 200302298 所以電$ 8 #常的短。這使得高頻脈衝應用㈤涉員率可尚達 1MHz 〇 第3圖為本發明之剖面圖與俯視圖。接觸帶與反相電 :則以主要單& 6下方之虛線來表示。纟冑3圖中，接觸 π —反相電極由左至右延伸，每一個在其表面都有電性連 接。所有接觸電極3〇上的接觸帶3藉由接觸條與每一 個接觸帶互相聯結，且所有接觸電極3〇上的反相電極7藉 由電極條3 2與每一個反相電極互相聯結。接觸條31與接 觸電極3 0上之脈衝電流源丨3的一端有電性連接，而電極 條32則與接觸電極3 0上之脈衝電流源1 3的另一端有電性 連接。 脈衝電流源1 3、陰極與陽極被安置於處理槽20内之 模組單元上。脈衝電流源13必須由位於處理槽20外供應 電源動力與控制信號。而這分別由電流供應主體1 4與經由 雙向作用行程線15來完成。脈衝電流源丨3的級數可由控 制單元經由行程線15來調整。對脈衝頻率、異常激烈、脈 衝振幅、操作時間與循環時間的級數來說，如果以雙極型 脈衝電流源1 3，這些級數在兩種極性下皆為可調整的。在 接觸電極上有多個脈衝電流源時，如果在相同頻率下操作’ 則彼此之間的相位為可調整的。 在上述之德國專利文件DE 27 39 427 C2中曾揭露數 個脈衝電流源，分別包含幾個不同位置之元件，而整個電 解設備的操作與觀察則由中央控制系統來掌握。通常對電 流供應來說，這樣是有效的，例如脈衝電流源13。脈衝電 12 200302298 流源13的控制單元可以被安置於中心、表面或直接置於接 觸電極30上。由於空間與重量因素，只安排技術所需的元 件於接觸電極30是比較有利的。既然電導8之誘導率必須 維持低則至少脈衝電流源1 3的動力元件以及這部分之控 制必須安置於接觸電極3〇上。在第2圖至第5圖中為一般 的脈衝電流源13。在長距離中，藉由連接到接觸電極3〇 的簡單行程線或同軸電纜，可以輕易地傳送高頻控制訊號 且花費低廉。這種脈衝技術，包含電子電源，都是屬於習 知技術。 本發明則是實現，由脈衝電流源1 3輸出至工業大規 模應用電解槽之陰極、陽極的極短且低誘導率的電導8之 可能性。沒有佔空間的大型電流迴路被發展。即使在有非 常激烈與高頻率脈衝的高電流振幅下，電磁干擾輻射的放 射幾乎可以完全被避免掉。金屬遮蓋2 9用以防止剩餘的干 擾輻射’尤其是當產品被施以雙極型脈衝之電化學處理。 同時，金屬遮蓋29也保護了脈衝電流源13使其不受到電 解液以及其蒸氣的損害。整個模組也可以樹脂模組化。舉 例來說，脈衝電流源1 3可產生下列的電流振幅：一接觸電 極其工作區域約為20dm2，而平均電流密度為25A/dm2， 電流高點約至500A。 與第3圖相較，第4圖所繪示為接觸電極3 〇使得至 接觸帶3及反相電極7的脈衝電流源13之電導8縮短。 在接觸電極30的其中一邊，接觸帶3與金屬之接觸板33 有電性連接，而在接觸電極3 0之另一邊，反相電極則與導 13 200302298 電之電極板34有電性連接。與第3圖相比，這些相連之表 面降低了由脈衝電流源至電解小槽間之電性連接的誘導 率。於是，高頻脈衝為可應用的。 為了連接接觸帶3與接觸板33 ，這些接觸帶凸出在 主要單元6上之接觸電極30的其中一邊。為了連接反相電 極7 ，這些反相電極凸出在主要單元ό上之接觸電極30 的另一邊，與電極板34同方向。為了不受電解液的損害， 模組單元可以被遮蓋或是以樹脂模組化。 在第5圖中係緣示，接觸電極為由脈衝電流源13至 電解小槽9之聯結，幾乎沒有誘導率。電性連接由兩接觸 區35,36所提供，彼此之間有電性絕緣。這些區域的面積 幾乎與接觸電極30之處理區域的面積相同。所有的接觸帶 3在分布於金屬區的許多位置上與最上方之接觸區35有電 性連接。這些連接則以絕緣通過接觸區3 6。反相電極7在 分布於金屬區的許多位置與接觸區36有電性連接。 在接觸區3 5中央有一開口。經由此開口，脈衝電流 源13得以最短距離與電極表面36之一端相連接；而脈衝 電流源的另一端則與接觸區35相連接.。當電化學處理程序 之必需電流被避免時的電流迴路，藉由位於中央之脈衝電 流源的連接及其連接至接觸區3 5與接觸區3 6間，也稱之 為集中連結器幾乎不存在的誘導率，彳免去電化學製程處 理中的電流迴圈。這樣的連接同時也避免了電磁干擾輻射 的放射，尤其是在使用了高頻脈衝時。 為了降低剩餘誘導率，接觸區35、接觸區域36,或 14 200302298 接觸板33、接觸板34，或接觸條3i、接觸條32會以平行 方式與脈衝電流源1 3 電性連接。在第5圖的俯視圖中， 僅繪示脈衝電流源1 3之輪廓。 根據第5圖之接觸電極3 〇實施例，可允許高頻脈衝 的應用。由頻率1 MHz與高振幅所產生之電流脈衝，將會 有新方法出現於工業上的大規模應用。但到目前為止，僅 在實驗室環境中為可實行的。 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範圍； 凡其它未脫離本發明所揭示之精神下所完成之等效改變或 修飾，均應包含在下述之申請專利範圍内。 【圖式簡單說明】 所有圖示皆為概要之表示 第1圖所繪示為接觸電極 不且非按原比例。The electrode 30 is in an urgent state, and the contacting electrode 30 and the product in the treatment tank 20 can complete a consistent transfer step. If the contact electrode 30 is in a raised state, the contact electrode 30 returns to a step opposite to the direction of the transfer wheel. Only when the product and the contact electrode 30 are in a raised state, the 'transmission device 19 can also be gradually transferred. When the contact electrode 30 and the conductive layer 2 of the product 1 are in a state of urgency, there is no relative movement on the surfaces of the contact electrode 30 and the product 1 due to transmission. By moving the contact electrode 30 linearly or revolvingly, it is lifted from the surface of the product 1 and approaches the product 1. The rotation increases the exchange of electrolyte in the small tank 9. The contact electrode 30 is pressed on the product 1 and the latter leans on a fixed arrangement body (smooth design for smoothing the product) 9 200302298 to absorb the reaction force. This body is called force mass 18. If both sides of the product are processed at the same time, another contact electrode so will replace the force weight 18. The product i is gradually transferred by including a transfer device 19 constituted by a roller, a cylinder, a splint or a hook, in order to prevent the contact electrode from being in a pressing state. One or more transport devices 2 丨 may be arranged outside the processing tank 20 so that the product i supplied to the processing tank 20 and the product i removed from the processing tank 20 can be transported without any problem. The vibrator 22 on the main unit 6 is used to generate pressure shock of the electrolyte and product shock. Therefore, the problem of small holes due to electrolyte exchange during product processing is improved. The contact 4 and the reverse electrode 7 are connected to a pulse current source 13 to form a power supply for the electrolytic cell 9. All mobile private sequences of the entire device are coordinated and controlled by the control unit 23, as indicated by the dotted lines. The control unit 23 is also responsible for controlling the pulsed current source 13. The pulse current source 1 3 can be controlled by current or voltage, or it can be fixed on. Preferably, the pulsed current source is fixedly turned on only during the processing step (electric forging step) and will have significant temporary polarity. During the moving step, the pulsed current source is also on and has another significant temporary polarity. The pulsed current source can also generate a direct current to demetalize the final deposit. The necessary adjustment and switching procedures are started by the control unit 23 in time. The significant temporary polarity of the pulsed current source 13 may differ between the processing step and the moving step. The time interval of the processing steps is from 0 to 0 seconds to 1 hour, preferably from 1 second to 1 minute. If very short processing steps occur temporarily (due to the closing in the moving step), the direct current source provides a current corresponding to the unipolar type 10 200302298. The advantage is that a direct pulse current is also placed on the contact electrode. ^ Connect the current source here. 3m, preferably material handling equipment ^ 1 0mm to 100mm in the moving step is appropriate. Prep related. The feed with a step size of 0.1mm to a larger one is conveyed with a strip-shaped electrolyte through a process, and the tank 20 is conveyed in a circuit 24. This circuit is, for example, an electrolyte of pump 25 billion, ... The drunk shoe transmission device, and the filter 26 and the metering unit 27 for adjusting the liquid. The level of the electrolyte 28 in the treatment tank 20 is higher than the contact electrode 3 0 Λ * Feng Tong, and even higher than the uppermost surface of the pulse current source i 3. The electrolyte tank is temporarily filled with electrolyte through the electrolyte inlet 10 and fills the small electrolytic tank 9, and flows out through the electrolyte outlet Π. Figure i has a legend. Here, the treatment tank 20 is used only as a collection tank for the electrolytic solution. Not shown in the figure, the processing tank 20 " input and output of the seat port 1 is opened. Input and output can be completed by a manual stop lit ▲ ^ moving device through the slot plate, and on a continuous conveyor, it can also be conveyed through a slit on the wall of the slot. The slit can be filled with a sealing roll known to those skilled in the art, sealed by an exhibitor or a seal. In the schematic illustration of the pulsed current source 13, all switching devices and electrode reversible devices according to the present invention should be included. The pulse current source 13 is at least partially placed on the contact electrode 30. The contact electrode and the main unit 6, the contact band 3 and the reverse electrode form a chess unit. Contact strips ... are electrically connected to each other in the same way and are connected to the U-terminal of the pulsed current source. The other end of the pulse current source 13 is connected to the inverting electrode 7 'and the inverting currents 7 are also electrically connected to each other in different ways. Because the pulsed current source, 13, anode and cathode are placed in a small space, 200302298, so the electricity $ 8 # is often short. This makes the high-frequency pulse application involving a rate of up to 1MHz. Figure 3 is a cross-sectional view and a top view of the present invention. Contact band and reverse phase: it is indicated by the dotted line below the main single & 6. In Fig. 3, the contact π-inverting electrodes extend from left to right, and each one is electrically connected on its surface. The contact strips 3 on all the contact electrodes 30 are connected to each other by a contact bar, and the inverting electrodes 7 on all the contact electrodes 30 are connected to each of the inverting electrodes via the electrode strips 32. The contact strip 31 is electrically connected to one end of the pulse current source 丨 3 on the contact electrode 30, and the electrode strip 32 is electrically connected to the other end of the pulse current source 13 on the contact electrode 30. Pulse current source 1 3. The cathode and anode are placed on the module unit in the processing tank 20. The pulse current source 13 must be supplied with power and control signals from outside the processing tank 20. This is done by the current supply main body 14 and via the double acting stroke line 15 respectively. The number of stages of the pulse current source 3 can be adjusted by the control unit via the stroke line 15. For the series of pulse frequency, abnormal intensity, pulse amplitude, operating time and cycle time, if a bipolar pulse current source 13 is used, these series can be adjusted in both polarities. When there are multiple pulsed current sources on the contact electrode, the phases between each other can be adjusted if they are operated at the same frequency. In the above-mentioned German patent document DE 27 39 427 C2, several pulsed current sources have been disclosed, each containing several components at different positions, and the operation and observation of the entire electrolytic equipment is controlled by a central control system. This is usually effective for a current supply, such as a pulsed current source 13. Pulse current 12 200302298 The control unit of the current source 13 can be placed on the center, surface or directly on the contact electrode 30. Due to space and weight considerations, it is advantageous to arrange only the components required for the technology on the contact electrode 30. Since the induction rate of conductance 8 must be kept low, at least the power element of pulse current source 13 and the control of this part must be placed on contact electrode 30. In FIGS. 2 to 5, a general pulse current source 13 is shown. Over long distances, high-frequency control signals can be easily transmitted at a low cost with a simple stroke line or coaxial cable connected to the contact electrode 30. This pulse technology, including electronic power, is a conventional technology. The present invention realizes the possibility of outputting a pulse current source 13 to a large-scale industrial application of the cathode and anode of the electrolytic cell with a very short and low induction rate conductivity 8. No large current loops were developed that took up space. Even at high current amplitudes with very intense and high-frequency pulses, the emission of electromagnetic interference radiation can be almost completely avoided. The metal cover 29 is used to prevent residual interference radiation ', especially when the product is electrochemically treated with a bipolar pulse. At the same time, the metal cover 29 also protects the pulsed current source 13 from the electrolyte and its vapor. The entire module can also be modularized with resin. For example, the pulse current source 13 can generate the following current amplitudes: a contact current is about 20dm2 in the working area, the average current density is 25A / dm2, and the current high point is about 500A. Compared with FIG. 3, FIG. 4 illustrates the contact electrode 30, which shortens the conductance 8 of the pulse current source 13 to the contact strip 3 and the reverse electrode 7. On one side of the contact electrode 30, the contact strip 3 is electrically connected to the metal contact plate 33, and on the other side of the contact electrode 30, the inverting electrode is electrically connected to the electrode plate 34 of the conductor 13 200302298. Compared to Figure 3, these connected surfaces reduce the induction rate of the electrical connection from the pulsed current source to the electrolytic cell. Thus, high-frequency pulses are applicable. In order to connect the contact strips 3 and the contact plates 33, these contact strips protrude on one side of the contact electrodes 30 on the main unit 6. In order to connect the inverting electrodes 7, these inverting electrodes protrude on the other side of the contact electrode 30 on the main unit, in the same direction as the electrode plate 34. In order not to be damaged by the electrolyte, the module unit may be covered or modularized with resin. Fig. 5 shows that the contact electrode is connected from the pulse current source 13 to the electrolytic cell 9 and has almost no induction rate. The electrical connection is provided by two contact areas 35, 36, which are electrically insulated from each other. The area of these areas is almost the same as that of the processing area of the contact electrode 30. All the contact strips 3 are electrically connected to the uppermost contact region 35 at a plurality of positions distributed in the metal region. These connections then pass through the contact area 36 with insulation. The counter electrode 7 is electrically connected to the contact region 36 at a plurality of locations distributed in the metal region. There is an opening in the center of the contact area 35. Through this opening, the pulse current source 13 is connected to one end of the electrode surface 36 at the shortest distance, and the other end of the pulse current source is connected to the contact region 35. When the necessary current of the electrochemical process is avoided, the current loop is connected by a centrally located pulsed current source and connected to the contact area 35 and the contact area 36, also known as a concentrated connector. The induction rate can avoid the current loop in the electrochemical process. This connection also avoids the emission of electromagnetic interference radiation, especially when high-frequency pulses are used. In order to reduce the residual induction rate, the contact area 35, the contact area 36, or the 14 200302298 contact plate 33, the contact plate 34, or the contact bar 3i, the contact bar 32 will be electrically connected to the pulse current source 13 in a parallel manner. In the top view of FIG. 5, only the outline of the pulse current source 13 is shown. According to the embodiment of the contact electrode 30 in Fig. 5, the application of high-frequency pulses is allowed. The current pulse generated by the frequency of 1 MHz and high amplitude will bring new methods to large-scale applications in industry. But so far, it has been feasible only in a laboratory environment. As will be understood by those familiar with this technology, the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the scope of patent application for the present invention; all others completed without departing from the spirit of the present invention Effective changes or modifications should be included in the scope of patent application described below. [Brief description of the drawings] All the diagrams are schematic representations. The contact electrodes shown in Figure 1 are not to scale.
面圖，包含了電解 第3 中接觸帶與 w固尸汁不之接觸電極 發明之各項裝置；The top view includes various devices of the invention of the contact electrode and the contact electrode that is not in contact with the solid body juice in the third electrolytic solution;
的面上； 反相電極的接觸電極，其 第4圖所繪示 其中接觸帶與反向 上；以及 第5 與反相電極的接觸電極 主接觸電極各自一半的 電極， 圖所繪示為一接觸電極， 其中接觸帶與反相 200302298 分別整合在接觸電極上的整個正面。 【元件代表符號簡單說 1產品 3接觸帶 5觸點絕緣 7反相電極 9電解小槽 11電解液出口 1 3脈衝電流源 15行程線 1 7進料方向 1 9傳輸裝置 21運輸設備 23控制單元 25電解液傳輸裝置/幫 27計量單元 29遮蓋 3 1接觸條 3 3接觸板 3 5接觸區 明】 2電導層 4觸點 6主要單元 8電導 10電解液入口 12電流源 1 4電流提供主體 16移動裝置 18力重 2 0處理槽 22震動器 24電解液循環 浦 26電解液過濾器 28電解液 3 0接觸電極 3 2電極條 3 4電極板 3 6電極區The contact electrode of the inverting electrode is shown in FIG. 4 in which the contact band and the inversion are shown in FIG. 4; and the contact electrode of the fifth and inverting electrodes is each half of the main contact electrode. The drawing is shown as a contact The electrode, wherein the contact strip and the reverse phase 200302298 are integrated on the entire front surface of the contact electrode, respectively. [Element representative symbols simply say 1 product 3 contact belt 5 contact insulation 7 reverse electrode 9 electrolytic cell 11 electrolyte outlet 1 3 pulse current source 15 stroke line 1 7 feeding direction 1 9 transmission device 21 transportation equipment 23 control unit 25 Electrolyte transfer device / gang 27 Metering unit 29 Cover 3 1 Contact strip 3 3 Contact plate 3 5 Contact area] 2 Conductive layer 4 Contact 6 Main unit 8 Conductance 10 Electrolyte inlet 12 Current source 1 4 Current supply body 16 Mobile device 18 force 2 0 treatment tank 22 shaker 24 electrolyte circulation pump 26 electrolyte filter 28 electrolyte filter 3 0 contact electrode 3 2 electrode strip 3 4 electrode plate 3 6 electrode area
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