TH37948B - Pyrogenetic silicon dioxide powder And the silicone sealing compound containing this powder - Google Patents

Abstract

DC60 (29/03/56) pyrogenetic silicon dioxide powder as a base particle clump with a BET surface of 150 plus or minus 15 square meters / g, where And the clusters show the mean surface area of 12000 to 20000 sq nm, the mean equivalent circle diameter (EDC) of 90 to 120 nm and the mean circumference of 1150 to 1700 nm. Which silicon tetrachloride and silicon components that Two of them contain H3SiCl, H2SiCl2, HSiCl3, CH3SiCl3, (CH3) 2SiCl2, (CH3) 3SiCl, and / or (n-C3H7) SiCl3. Was mixed with primary air And combustion gas And is burned into the reaction chamber, where secondary air is also brought into the reaction chamber, and where the feedstock is selected in such a way that That the adiabatic flame temperature is 1670 to 1730 degrees Celsius. Containing silicon powder Pyrogenic Dioxide Pyrogenetic silicon dioxide powder as a base particle clump with a BET surface of 150 + -15 m2 / g, at Which and the clusters show an average surface area of 12000 to 20000 square nanometers, the equivalent circle diameter (EDC) of 90 to 120 nm, and the average circumference of 1150 to 1700 nm were produced by the pyramid method. Chemical, where silicon tetrachloride and silicon components are Two of them contain H3SiCl, H2SiCl3, HSiCl3, CH3SiCl3, (CH3) 2SiCl2, (CH3) 3SiCl and / or (n-C3H7) SiCl3. Was mixed with air number one And combustion gas And burned into the reaction chamber, second air is also brought into the reaction chamber, and the feed material is selected to To achieve a flame temperature that has no or no heat, equal to 1670 to 1730 degrees Celsius silicone sealing compound. Containing silicon powder Pyrogenetic Dioxide

Claims (8)

Disclaimers (all) that will not appear on the advertisement page: 1. Mixture containing silicon powder. Dioxide which is produced as pyrogenetic in Primary particle cluster Where the mixture has a BET surface area of 150 + 15 square meters / g And the group showing Average surface area 12000 to 20000 square nanometers Average Equivalent Circle Diameter (ECD) 90 to 120 nm and average circumference length 1150 to 17000 nm. 2. Mixture according to claim 1, where the bulk is shown Average surface area 12500 to 14500 square nanometers The average equivalent circle diameter is 95 to 110 nm and the average circumference length is 1250 to 1450 nm. 3. Mixture according to claim 1 where the maximum diameter of the clot is between 170 and 240 nm and the minimum diameter of the clot is between 100 and 160 nm. 4. Mixture according to claim 1, where the mixture contains less than 250 ppm chloride. 5. Mixture according to claim 1, where the said mixture contains less than 100 ppm of carbon. 6.Process for silicon powder production Dioxide according to claim 1, where the mixture of silicon compounds is evaporated. Either separately or together, vapors are transported by means of a carrier to a mixing chamber where SiC14 is the first component, 60 to 95% by weight compared to the mix and the second component. The group consisted of H3 SiCl, H2SiCl2, HSiCl3 CH3SiCl3, (CH3) 2 SiCl2, (CH3), SiCl (n-C3 H7) SiCl3 and mixtures of this substance in the proportion of 5 to 40% by weight compared to the mixture. And burning gas And primary air Which can be freely chosen, can add oxygen and / or heat first Were transported separately to the mixing chamber Mixture of silicon chloride vapors, combustion gases and primary air. Being ignited in the burning head And the flames burned into the reaction chamber Secondary air Which surrounds the flame Was introduced into the reaction chamber Air ratio The secondary to primary climate ranged from 0.05 to 3. Then, the iron was removed from a gas-like or gas-like substance. And then the stuff was treated with steam at 250 ° C to 750 ° C where the total amount of oxygen was at least sufficient for the complete combustion of the combustible gas and silicon compounds and the amount of oxygen. The feedstock containing silicon gaseous compounds, primary air and secondary air is selected in such a way that the adiabatic temperature T is 1670 to 1730 ° C where T = input temperature + sum of reactive enthalpy of digestion / valence The heat of the substance leaving the reaction chamber Combined with silicon dioxide, water, hydrogen chloride, carbon dioxide, oxygen, nitrogen, etc. can be selected with the carrier if it is not air or nitrogen, using the specific heat capacity of these substances at 1000 ° C as a basis. 7. Process according to claim 6, where the temperature of the feed material is 90 degrees Celsius +40 degrees Celsius. 8. Process according to claim 6, where the speed of discharge of the reaction mixture from the mixing chamber to The reaction chamber is 1 to 80 m / s.