TH1302C3 - High temperature solder Lead-free - Google Patents
High temperature solder Lead-freeInfo
- Publication number
- TH1302C3 TH1302C3 TH303001236U TH0303001236U TH1302C3 TH 1302 C3 TH1302 C3 TH 1302C3 TH 303001236 U TH303001236 U TH 303001236U TH 0303001236 U TH0303001236 U TH 0303001236U TH 1302 C3 TH1302 C3 TH 1302C3
- Authority
- TH
- Thailand
- Prior art keywords
- high temperature
- temperature solder
- free
- weight
- solder lead
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 2
- 239000011574 phosphorus Substances 0.000 claims abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 239000004332 silver Substances 0.000 claims abstract 2
- 229910052718 tin Inorganic materials 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่างๆอยู่ในเนื้อ ของโลหะบัดกรีและที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ผลิตภัณฑ์ ประกอบด้วย ฟอสฟอรัส 0.001 - 0.5% โดยน้ำหนัก ,เงิน 0.05 - 9.0 % โดยน้ำหนัก,ทองแดง 0.1- 15.0%โดยน้ำหนัก และค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metal components in the body Of solder and used as a component in the fabrication process, the product contains phosphorus 0.001 - 0.5% by weight, silver 0.05 - 9.0% by weight, copper 0.1 - 15.0% by weight. And the balance will be tin
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH1302A3 TH1302A3 (en) | 2004-03-26 |
| TH1302C3 true TH1302C3 (en) | 2004-03-26 |
Family
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