TH1280C3 - High temperature solder Lead-free - Google Patents
High temperature solder Lead-freeInfo
- Publication number
- TH1280C3 TH1280C3 TH303001238U TH0303001238U TH1280C3 TH 1280 C3 TH1280 C3 TH 1280C3 TH 303001238 U TH303001238 U TH 303001238U TH 0303001238 U TH0303001238 U TH 0303001238U TH 1280 C3 TH1280 C3 TH 1280C3
- Authority
- TH
- Thailand
- Prior art keywords
- high temperature
- temperature solder
- free
- solder lead
- weight
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 2
- 239000011574 phosphorus Substances 0.000 claims abstract 2
- 229910052725 zinc Inorganic materials 0.000 claims abstract 2
- 239000011701 zinc Substances 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่างๆ อยู่ในเนื้อ ของโลหะบัดกรีและที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย ฟอสฟอรัส 0.001 - 5.0 % โดยน้ำหนัก สังกะสี 0.05 - 30.0 % โดยน้ำหนัก และค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metals in the body of solder and used as a component in the fabrication process. Products contain phosphorus 0.001 - 5.0% by weight, zinc 0.05 - 30.0% by weight and the balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH1280C3 true TH1280C3 (en) | 2004-03-10 |
| TH1280A3 TH1280A3 (en) | 2004-03-10 |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2003064102A8 (en) | Solder metal, soldering flux and solder paste | |
| WO2005071750A3 (en) | Conductive material compositions, apparatus, systems, and methods | |
| TH1280A3 (en) | High temperature solder Lead-free | |
| TH1280C3 (en) | High temperature solder Lead-free | |
| WO2006045995A8 (en) | Improvements in or relating to solders | |
| TH1279A3 (en) | Lead-free high temperature solder | |
| TH1279C3 (en) | Lead-free high temperature solder | |
| TH1281A3 (en) | Lead-free high temperature solder | |
| TW200708624A (en) | Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder | |
| TH1281C3 (en) | Lead-free high temperature solder paste | |
| MY189490A (en) | Solder alloy, solder paste, solder ball, solder preform, and solder joint | |
| TH1302C3 (en) | High temperature solder Lead-free | |
| TH1302A3 (en) | High temperature solder Lead-free | |
| TH1303A3 (en) | Lead-free high temperature solder | |
| TH1303C3 (en) | Lead-free high temperature solder | |
| WO2006089032B1 (en) | Metal containers for solder paste | |
| TH1304C3 (en) | Lead-free high temperature solder | |
| TH1304A3 (en) | Lead-free high temperature solder | |
| TH1184C3 (en) | Lead-free high temperature solder | |
| TH1184A3 (en) | Lead-free high temperature solder | |
| TH1185A3 (en) | Lead-free high temperature solder | |
| TH1185C3 (en) | Lead-free high temperature solder | |
| UA89208C2 (en) | Compositions for mercury dispensing and devices based thereon | |
| TH2813A3 (en) | Lead-free high temperature solder | |
| TH2813C3 (en) | Lead-free high temperature solder |