TH1184C3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH1184C3 TH1184C3 TH303000751U TH0303000751U TH1184C3 TH 1184 C3 TH1184 C3 TH 1184C3 TH 303000751 U TH303000751 U TH 303000751U TH 0303000751 U TH0303000751 U TH 0303000751U TH 1184 C3 TH1184 C3 TH 1184C3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- temperature solder
- free high
- weight
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 239000004332 silver Substances 0.000 claims abstract 2
- 229910052718 tin Inorganic materials 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่างๆ อยู่ในเนื้อของโลหะบัดกรีและ ที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย เงิน 0.005 ~ น้อยกว่า 3.0 % โดยน้ำหนัก ทองแดง 0.003 ~ น้อยกว่า 0.7 % โดยน้ำหนักและค่าสมดุลจะเป็นดีบุก Lead-free temperature solder Which contains various metals In the texture of solder and Used as a component in the fabrication process, the product contains silver 0.005 ~ less than 3.0% by weight, copper 0.003 ~ less than 0.7% by weight and the balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH1184C3 true TH1184C3 (en) | 2003-12-22 |
| TH1184A3 TH1184A3 (en) | 2003-12-22 |
Family
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