TH972B - Lead-free solder - Google Patents
Lead-free solderInfo
- Publication number
- TH972B TH972B TH203001125U TH0203001125U TH972B TH 972 B TH972 B TH 972B TH 203001125 U TH203001125 U TH 203001125U TH 0203001125 U TH0203001125 U TH 0203001125U TH 972 B TH972 B TH 972B
- Authority
- TH
- Thailand
- Prior art keywords
- weight
- free solder
- lead
- solder
- bismuth
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052797 bismuth Inorganic materials 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 239000004332 silver Substances 0.000 claims abstract 2
- 229910052718 tin Inorganic materials 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
Abstract
โลหะบัดกรีชนิดพิเศษไร้สารตะกั่วผสม ซึ่งจะมีส่วนประกอบของโลหะต่าง ๆ อยู่ในเนื้อของโลหะบัดกรี และที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย เงิน 2.5-3 % โดยน้ำหนัก, บิสมัท 0.7-1.2 % โดยน้ำหนัก, ทองแดง0.4~0.7%โดยน้ำหนัก และค่าสมดุลจะเป็นดีบุก Special solder-free solder. Which will contain various metal components in the texture of the solder. And used as a component in the fabrication process, the product contains silver 2.5-3% by weight, bismuth 0.7-1.2% by weight, copper 0.4 ~ 0.7% by weight. And the balance will be tin
Claims (1)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TH972B true TH972B (en) | 2003-04-01 |
Family
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