TH2818C3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH2818C3 TH2818C3 TH603000334U TH0603000334U TH2818C3 TH 2818 C3 TH2818 C3 TH 2818C3 TH 603000334 U TH603000334 U TH 603000334U TH 0603000334 U TH0603000334 U TH 0603000334U TH 2818 C3 TH2818 C3 TH 2818C3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- weight
- free high
- temperature solder
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052803 cobalt Inorganic materials 0.000 claims abstract 2
- 239000010941 cobalt Substances 0.000 claims abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 239000004332 silver Substances 0.000 claims abstract 2
- 229910052718 tin Inorganic materials 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่าง ๆ อยู่ในเนื้อของโลหะบัดกรีและที่ใช้เป็นส่วน ประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย เงิน มากกว่า 0.02-0.4 % โดยน้ำหนัก ทองแดง มากกว่า 0.002-0.75 % โดยน้ำหนัก โคบอลท์ มากกว่า 0.001-0.4 แ% โดยน้ำหนัก และค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metal components in the texture of solder and used as part Assembled in the process of fabrication, the product contains silver more than 0.02-0.4% by weight of copper greater than 0.002-0.75% by weight of cobalt greater than 0.001-0.4% by weight and balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH2818A3 TH2818A3 (en) | 2006-09-07 |
| TH2818C3 true TH2818C3 (en) | 2006-09-07 |
Family
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