TH12653B - Tools and methods for agile plasma action. - Google Patents

Abstract

Plasma-activated devices are useful for depositing substrates onto thin, oxygen-blocking films at relatively rapid deposition rates. These devices consist of an air-deprived reaction chamber, an electrically charged electrode positioned against the plasma-facing surface inside the chamber, and a shield with transverse spacing between the plasma-facing surface and the shield. During plasma action, the plasma is kept at a safe distance while the substrate is continuously fed into the confined plasma.

Claims (19)

1. Plasma processing equipment consisting of: a ventilated reaction chamber; a plasma generation device within the reaction chamber, which comprises an electrically operated electrode that defines the surface adjacent to the plasma inside the reaction chamber; a device for electrically connecting the electrode to a specific substrate once the substrate is inside the reaction chamber by placing the surface adjacent to the plasma in a rolling mechanism in contact with the substrate, and for exposing the continuously changing portion of the substrate to the plasma during plasma processing; and a device for limiting the plasma to the continuously changing portion of the substrate, which is a boundary device consisting of a grounded shield. 2. The instrument under claim 1 where the electrically operated electrode is negatively biased relative to the limiting device. 3. The instrument under Patent 1, whereby the device limits the plasma flow to a variable portion of the substrate and within a range of approximately 0.5 inches to approximately 12 inches outward. 4. The instrument under Claim 3 shall cool the grounded shielding at a minimum distance from the variable portion of the substrate and confine the majority of the plasma between the variable portion of the substrate and the shielding. 5. The instrument under claim 4 where the surface adjacent to the plasma is curved and longitudinally along the axis, and the shield shares an axis with the surface. 6. The instrument under claim 4, whereby the boundary device consists of a magnetic device for generating a magnetic field that extends into the plasma and intersects with the surface adjacent to the plasma. 7. The device under claim 6, where the magnetic device consists of at least one pair of magnetic poles placed in close proximity to the shield. 8. Equipment pursuant to claim 4, which adjusts the reaction chamber to maintain a pressure of less than approximately 0.1 ter during plasma substrate action. 9. The instrument under claim number 8, whereby the plasma generating device consists of a film-forming gas generator, which can create a tightly packed substrate coating during plasma substrate application. 10. The instrument under claim 9, whereby the plasma generating device consists of a shielded, grounded inlet for the delivery of a film-generating gas stream from the gas source over a distance. 11. Instrument according to Patent 1 where the surface adjacent to the plasma is a cylinder. 12. Instruments under claim 11 where the substrate is predominantly non-conductive and flexible. 13. An instrument under Patent 1 where the substrate is predominantly electrically conductive and creates a surface in close contact with the plasma. 14. A thin-film coating instrument consisting of: a reaction chamber ventilated to less than approximately 0.1 Torr; a plasma generator within the reaction chamber from a film-forming gas stream that can deposit closely packed coating material onto the substrate; a plasma generator that maintains a variable portion of the substrate, fed through the reaction chamber during coating and kept at an external distance; a boundary device consisting of a grounded shield; and a device for negatively biasing the coated portion of the substrate relative to the reaction chamber and the grounded shield. 15. Coating instrument as per claim 14, where the distance is between approximately two inches and approximately four inches. 16. The coating equipment as per claim 14 shall be cooled by grounding the power equipment and be spaced at least a certain distance from the variable substrate section. 17. Coating device according to claim 16 where the surface adjacent to the plasma is curved and longitudinally along the axis, and the shield shares an axis with the surface. 18. A coating device pursuant to claim 17, whereby the magnetic device consists of at least one pair of magnetic poles placed adjacent to the shield. 19. The coating instrument pursuant to claim 14, whereby the negative bias device consists of a surface-defined electrode adjacent to the plasma within the reaction chamber, and a variable substrate portion is in contact with the electrode while rotating during coating.