SU1746436A1 - Heat-sink of semiconductor instrument - Google Patents
Heat-sink of semiconductor instrument Download PDFInfo
- Publication number
- SU1746436A1 SU1746436A1 SU904820378A SU4820378A SU1746436A1 SU 1746436 A1 SU1746436 A1 SU 1746436A1 SU 904820378 A SU904820378 A SU 904820378A SU 4820378 A SU4820378 A SU 4820378A SU 1746436 A1 SU1746436 A1 SU 1746436A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- heat
- heat pipes
- coolant
- pipes
- filled
- Prior art date
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Использование: дл охладителей с испарительной системой теплоотвода от полупроводниковых приборов, эксплуатируемых при положительных и отрицательных температурах охлаждающего воздуха. Сущность изобретени : охладитель содержит рабочие тепловые трубы 1, заполненные замерзающим теплоносителем, например водой 2. Дополнительна труба 3-заполнена незамерзающим теплоносителем 4, например гептаном. Оба вида тепловых труб размещены на основании 5 с обеспечением теплового контакта с ним и между собой. Така конструкци за счет разогрева рабочих труб дополнительными исключает возможность образовани льда на конденсаторной части, осушение испарител без снижени тепло- отдающей способности охладителей. 1 з.п. ф-лы, 3 ил.Use: for coolers with evaporative heat sink system from semiconductor devices operated at positive and negative cooling air temperatures. The essence of the invention: the cooler contains working heat pipes 1 filled with a freezing coolant, for example water 2. The additional pipe 3 is filled with antifreeze coolant 4, for example heptane. Both types of heat pipes are placed on the base 5 with ensuring thermal contact with it and between themselves. Such a design, by heating the working pipes with additional ones, eliminates the possibility of ice formation on the condenser part, draining the evaporator without reducing the heat transfer ability of the coolers. 1 hp f-ly, 3 ill.
Description
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Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU904820378A SU1746436A1 (en) | 1990-04-27 | 1990-04-27 | Heat-sink of semiconductor instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU904820378A SU1746436A1 (en) | 1990-04-27 | 1990-04-27 | Heat-sink of semiconductor instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1746436A1 true SU1746436A1 (en) | 1992-07-07 |
Family
ID=21511574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU904820378A SU1746436A1 (en) | 1990-04-27 | 1990-04-27 | Heat-sink of semiconductor instrument |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU1746436A1 (en) |
-
1990
- 1990-04-27 SU SU904820378A patent/SU1746436A1/en active
Non-Patent Citations (1)
| Title |
|---|
| Охладители с тепловыми трубами. Пау- еркиккер Фурукава Дэнко Дзмхо № 75,1985, К. Мурасэ, Япони . * |
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