JPH11351768A - Cooler and cooling system employing it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform cooling without generating noise while reducing the size and weight by stacking a heat pipe and a Peltier element. SOLUTION: Two Peltier elements 2 and two heat pipes 1 are stacked to constitute the cooler body and a heat transfer plate of aluminum, or the like, is laid on the lower surface of a Peltier element 2 located at the lowermost stage thus constituting a cooler A. Since a fan generating wind cut noise is not used, a heat source object can be cooled effectively. More specifically, heat carrier in the heat pipe 1 absorbs heat of the object to be cooled to cause gas-liquid phase conversion and heat is transmitted to the heat pipe 1 being cooled by the Peltier element 2. Consequently, heat is moved effectively from the object to be cooled using a small and lightweight cooler and cooling efficiency of the object to be cooled can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device and a cooling system using the same.

[0002]

2. Description of the Related Art Conventionally, a radiator of an automobile is provided for cooling water whose temperature has increased through a water jacket, and the water flowing from an upper tank is cooled by a core and discharged from a lower tank.

The core is composed of a number of water pipes for flowing water from the upper tank to the lower tank and cooling fins, and is usually provided with a cooling fan for forced cooling.

In a refrigerating cycle as shown in FIG. 9, saturated steam generated in an evaporator 100 is compressed by a compressor 200 to become high-pressure high-temperature steam, which is cooled by a condenser 300 to become a saturated liquid. The saturated liquid is throttled by the expansion valve 400 to become a low-temperature liquid and enters the evaporator 100, where it takes away the heat of evaporation from a target heat source and evaporates to become saturated vapor.

In this case, too, a cooling fan 500 is often used in order to efficiently cool the high-pressure high-temperature steam in the condenser 300.

[0006] In addition, other devices are provided with one similar to the cooling fan 500 and some heat radiation means.

[0007]

However, in the case of using the cooling fan 500 or other heat radiating means in the above-described radiator, condenser 300, and heat-generating equipment, the equipment is provided by disposing them. The overall layout is limited.

In particular, when the cooling fan 500 is used, there is a problem that the wind noise becomes noise, and the energy cost for driving the cooling fan 500 is increased.

An object of the present invention is to provide a cooling device that can solve the above-mentioned problems, and a cooling system using the same.

[0010]

Therefore, in order to solve the above-mentioned problem, in the present invention according to claim 1, a heat pipe and a Peltier element are stacked. Cooling can be performed effectively without generating noise and the like, and the size and weight can be reduced, so that the degree of freedom in layout is increased.

In the present invention, the heat pipe and the Peltier device are alternately stacked. Therefore, the cooling performance can be further improved.

According to the third aspect of the present invention, a cooling device in which another heat pipe and a Peltier element are stacked is mounted on the first heat pipe in which the conduit for the liquid to be cooled is inserted. Therefore, by using this for a radiator or a condenser, cooling can be performed effectively without generating noise and the like, and furthermore, the size and weight can be reduced, so that the degree of freedom of the layout of the entire system can be improved. Increase.

Further, according to the present invention, the other heat pipe and the Peltier element are alternately stacked. Therefore, the cooling performance can be further improved.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cooling device according to the present invention is configured by stacking a heat pipe and a Peltier element.

The heat pipe is made of a highly heat-conductive material such as copper or aluminum having a vacuum inside, and an easily vaporizable alcohol such as methanol or ethanol.
Alternatively, it is a fluid containing silica gel mixed therein as a working fluid, that is, sealed as a heat medium, and exhibits extremely large thermal conductivity due to convection accompanied by gas-liquid phase change.

The Peltier device may be a well-known device using a p-type or n-type semiconductor.

By constructing the cooling device by stacking the heat pipe and the Peltier element in contact with each other, an object which is a heat source can be effectively removed without using a fan or the like that generates wind noise. Can be cooled.

That is, it is assumed that the cooling device is heavily charged while the cooling side of the Peltier element is in contact with the upper portion of the heat pipe, and when the cooling device is placed on the cooling object, the heat of the cooling object is transferred to the heat pipe. The heat medium absorbs heat and causes gas-liquid phase transition as described above, and heat is efficiently transmitted to the heat pipe, and the heat pipe is cooled by the Peltier device. Therefore, even though the cooling device is small and lightweight, heat can be more effectively transferred from the object to be cooled, and the cooling efficiency of the object to be cooled can be increased.

The relative positional relationship between the heat pipe and the Peltier device may be opposite to the above. That is, the cooling side of the Peltier device may be brought into contact with the object to be cooled, and the heat pipe may be heavily responsible for the heat generation side.

In any case, an insulating sheet is interposed between the heat pipe and the Peltier element.

In order to further improve the cooling performance, a plurality of heat pipes and Peltier elements can be alternately stacked. The number can be set as appropriate.

Further, the present invention relates to a cooling system in which a cooling device in which another heat pipe and a Peltier element are stacked is mounted on a first heat pipe in which a conduit for a liquid to be cooled is penetrated. is there.

That is, the object to be cooled is a liquid, and a conduit for the liquid to be cooled is arranged in a meandering manner in the first heat pipe, and the lowermost end of the conduit is immersed in the medium liquid sealed in the heat pipe. To do it.

If this cooling system is used in place of, for example, a radiator of an automobile, the cooling water which has cooled the engine and the like and has become high temperature can be efficiently exchanged for cooling, thereby eliminating the need for a cooling fan Can be. Therefore, noise such as wind noise can be prevented, and the size and weight can be reduced. Further, since a cooling fan is not required, the degree of freedom in layout within the hood is increased, and the design of the entire vehicle is also improved. Constraints are relaxed.

Also in this case, the relative positions of the other heat pipes and the Peltier device may be reversed.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings.

FIGS. 1 and 2 show a cooling device according to the present invention and a heat pipe used in a cooling system using the cooling device.

As the heat pipe 1 (1 '), a die-shaped box-shaped one as shown in FIG. 1 or a cylindrical one as shown in FIG. 2 can be used. ,
It is appropriately determined depending on the use state and the installation location.

In the figure, reference numeral 10 denotes a heat pipe main body, which is formed of a material having excellent heat conductivity.

For example, a metal such as copper is preferably used, but a synthetic resin may be used. Also, the heat pipe body
Inside 10, an easily vaporizable alcohol such as methanol or ethanol, or a mixture of silica gel and silica gel is sealed as a working fluid, that is, a heat medium 12 (see FIG. 6).

Numerals 11 are fins formed on the surface of the heat pipe main body 10, and the fins 11 form the heat pipe main body.
10 has improved heat dissipation.

(First Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

In FIG. 3, reference numeral 2 denotes a Peltier element;
In the present embodiment, the Peltier elements 2 are arranged in a suitable number and arranged in a plate shape. The Peltier element 2 and the heat pipe 1 are stacked two by two to form an apparatus main body a, and the Peltier element 2 located at the lowest stage of the apparatus main body a
A heat transfer plate 3 made of aluminum or the like is connected to the lower surface of the cooling device A to form a cooling device A. Note that an insulator is interposed between the heat pipe 1 and the Peltier element 2.

The size of the heat transfer plate 3 according to the present embodiment can be determined in accordance with the object to be cooled, and the planar size of the heat pipe 1 and the Peltier element 2 is made smaller than that of the heat transfer plate 3. By reducing the size, the apparatus main body a can be reduced in size with respect to the cooling object.

As shown in FIG. 4, the apparatus main body a is
The relative positional relationship between the heat pipe 1 and the Peltier device 2 may be reversed. That is, the apparatus body shown in FIG.
In a ′, the heat pipe 1 is located at the bottom.

The heat transfer plate 3 is not always necessary as the cooling device A, and the cooling device A may be constituted by only the device main bodies a and a 'excluding the heat transfer plate 3.

The above-mentioned cooling device A is used for any cooling object 4.
Can be used for For example, a device consisting of a power generating device or a precision machine that generates heat can be considered. If the cooling device such as a forced cooling fan is conventionally provided and used, as shown in FIG. By directly placing the cooling device A on the object 4, the heat radiating means can be dispensed with.

That is, the heat of the cooling object 4 is absorbed by the heat medium 12 of the heat pipe 1 and the heat medium 12 is vaporized, and the vaporized vapor comes into contact with the heat pipe body 10 to lose heat and liquefy. The liquid phase change is repeated. By this action, the heat of the object to be cooled 4 is efficiently conducted to the heat pipe 1,
Moreover, since the heat pipe 1 is cooled by the Peltier element 2, the heat transfer from the object to be cooled 4 to the heat pipe 1 is performed more efficiently while the apparatus A is small and lightweight.

(Second Embodiment) FIG. 6 shows a second embodiment of the present invention.

The cooling device A according to the present embodiment is used for cooling the condenser 5, and in the figure, reference numeral 4a denotes a cooling tank for storing the condenser 5 in a cooling oil 4 '. Note that cooling water may be used instead of the cooling oil 4 '.

The condenser 5 is housed in a cooling tank 4a. When high-pressure high-temperature steam sent from a compressor (not shown) flows into the condenser 5 from the inflow pipe 51, it is cooled by the cooling oil 4 '. Then, it is configured to be saturated vapor and flow out from the outflow pipe 52 to the expansion valve side (not shown).

By forcibly cooling the cooling oil 4 'in the cooling tank 4a, the condenser 5 can be effectively cooled. In this embodiment, a cooling device is mounted on the cooling tank 4a. A hole 4b is provided, and the cooling tank 4a is inserted through the mounting hole 4b.
A cooling device A is configured by facing a heat transfer member 3 ′ made of, for example, an aluminum ingot and disposing the device main body a described in the first embodiment through the heat transfer member 3 ′. I have.

Also in this embodiment, the relative positions of the heat pipe 1 and the Peltier element 2 in the apparatus main body a may be reversed.

(Third Embodiment) FIG. 7 shows a third embodiment of the present invention.

This embodiment relates to a cooling system B. When the object 4 to be cooled is a liquid, the liquid
(Indicated by an arrow) through a first heat pipe
The cooling device A, that is, a device main body a in which another heat pipe 1 and a Peltier element 2 are stacked, is mounted on the first heat pipe 1a. . The apparatus main body a in the present embodiment has a Peltier element 2 disposed at the lowermost stage, and another heat pipe 1 and a Peltier element 2 are alternately stacked thereon. A pipe 1 is provided.

The first heat pipe 1a has substantially the same structure as the above-described heat pipe 1; an inlet pipe 60 is connected to the upper part of the first heat pipe 1a, and a drain pipe 61 is connected to the lower part. It is connected continuously. Then, both pipes 60 and 61 are connected
The conduit 6 is connected and connected at 62. The meandering connecting pipe 62 is housed in a heat dissipation can 63 housed in the first heat pipe 1a. Such a heat dissipation can 63
Has substantially the same function as the heat transfer plate 3 described above. Note that 21
Are fins provided on the Peltier element 2 stacked on the first heat pipe 1a.

According to the cooling system B having the steam configuration, when the liquid 40 to be cooled is cooling water, the cooling water which has become high in temperature due to heat exchange with some cooling object 4 is supplied to the first heat pipe 1a. By repeating the gas-liquid phase change described in the first embodiment, the heat of the cooling water is efficiently taken by the first heat pipe 1a and cooled.

Further, the fins 11 are provided on the side surfaces of the heat pipe main body 10 of the first heat pipe 1a which has taken heat and raised in temperature.
The heat pipe body
Since the cooling side of the Peltier element 2 is in contact with the upper surface of the 10, the heat from the cooling water can be taken one after another without the heat quantity being saturated.

Further, since another heat pipe 1 is stacked on the heat generation side of the Peltier element 2, the cooling efficiency of the Peltier element 2 is improved. Furthermore, a second Peltier element 2 is placed on the heat pipe 1.
However, since the second other heat pipe 1 is sequentially stacked thereon, the cooling effect is significantly improved.

The cooling system B having such a configuration is, for example,
When used in place of a car radiator, no forced fan is required, which reduces noise and reduces overall weight and weight.
The size can be reduced, and the degree of freedom in vehicle design is improved.

(Fourth Embodiment) FIG. 8 shows a cooling system B according to a fourth embodiment. In this embodiment, the cooling system B shown in the third embodiment is applied to a condenser 5 in a refrigeration cycle. In the figure, 7 is a compressor, 8 is an expansion valve, and 9 is an evaporator.

Here, the other heat pipe 1 of the apparatus main body a is assumed to be smaller than the first heat pipe 1a.
A heat transfer plate 3 is interposed between the first heat pipe 1a and another heat pipe 1 located at the bottom of the apparatus main body a.
Further, a Peltier device 2 is disposed at the top of the apparatus main body a in the present embodiment.

As described above, the present invention has been described through the embodiments. However, the cooling apparatus A and the cooling system B according to the present invention are not limited to the above-described embodiments, and can be applied to all those requiring cooling. In addition to the large cooling effect, the system can be reduced in size and weight without generating noise unlike a conventional forced fan or the like, and the system can be made more compact.

[0054]

The present invention is embodied in the above embodiment and has the following effects.

According to the first aspect of the present invention, since the heat pipe and the Peltier device are stacked, the cooling can be performed effectively without generating noise and the like.
It is possible to reduce the size and weight.

According to the second aspect of the present invention, since the heat pipe and the Peltier element are alternately stacked, the cooling performance can be further improved.

According to the third aspect of the present invention, a cooling device in which another heat pipe and a Peltier element are stacked is mounted on the first heat pipe in which the conduit for the liquid to be cooled is inserted. By using this for radiators and condensers, cooling can be performed effectively without generating noise, etc. In addition, since it is possible to reduce the size and weight, the degree of freedom in the layout of the entire system increases. .

In the present invention, the cooling performance can be further improved by alternately stacking the other heat pipes and Peltier elements.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a cooling device according to the present invention and a heat pipe used in a cooling system using the cooling device.

FIG. 2 is a perspective view showing one embodiment of a cooling device according to the present invention and a heat pipe used in a cooling system using the cooling device.

FIG. 3 is an explanatory diagram of the cooling device according to the first embodiment.

FIG. 4 is an explanatory view showing another embodiment of the cooling device.

FIG. 5 is an explanatory diagram illustrating a use state of the cooling device according to the first embodiment.

FIG. 6 is an explanatory diagram illustrating a use state of a cooling device according to a second embodiment.

FIG. 7 is an explanatory diagram illustrating one embodiment of a cooling system.

FIG. 8 is an explanatory diagram showing a use state of the cooling system.

FIG. 9 is an explanatory diagram showing a conventional cooling system in a refrigeration cycle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS A Cooling apparatus B Cooling system 1 Heat pipe 1a 1st heat pipe 2 Peltier element 3 Heat transfer plate 4 Object to be cooled 40 Liquid to be cooled 5 Condenser 6 Conduit

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H05K 7/20 H05K 7/20 S

Claims (4)

[Claims] 1. A cooling device comprising a heat pipe and a Peltier element stacked. 2. A cooling device comprising a heat pipe and a Peltier element stacked alternately. 3. A cooling system comprising: a cooling device in which another heat pipe and a Peltier element are stacked on a first heat pipe in which a conduit for a liquid to be cooled is inserted. 4. The cooling system according to claim 3, wherein another heat pipe and a Peltier element are alternately stacked.