SK6632000A3 - Laser beam cutting method for cutting laminates for applying to the skin - Google Patents

Laser beam cutting method for cutting laminates for applying to the skin Download PDF

Info

Publication number
SK6632000A3
SK6632000A3 SK663-2000A SK6632000A SK6632000A3 SK 6632000 A3 SK6632000 A3 SK 6632000A3 SK 6632000 A SK6632000 A SK 6632000A SK 6632000 A3 SK6632000 A3 SK 6632000A3
Authority
SK
Slovakia
Prior art keywords
laminate
cutting
laser beam
skin
cut
Prior art date
Application number
SK663-2000A
Other languages
English (en)
Slovak (sk)
Inventor
Falkenhausen Christian Von
Original Assignee
Lohmann Therapie Syst Lts
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohmann Therapie Syst Lts filed Critical Lohmann Therapie Syst Lts
Publication of SK6632000A3 publication Critical patent/SK6632000A3/sk

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61KPREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K9/00Medicinal preparations characterised by special physical form
    • A61K9/70Web, sheet or filament bases ; Films; Fibres of the matrix type containing drug
    • A61K9/7023Transdermal patches and similar drug-containing composite devices, e.g. cataplasms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00Cutting
    • Y10T83/546Interrelated tool actuating and work guide moving means

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Veterinary Medicine (AREA)
  • Medicinal Chemistry (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Dermatology (AREA)
  • Public Health (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Medicinal Preparation (AREA)
SK663-2000A 1997-11-08 1998-10-29 Laser beam cutting method for cutting laminates for applying to the skin SK6632000A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1997149525 DE19749525C1 (de) 1997-11-08 1997-11-08 Laserstrahl-Schneideverfahren zum Schneiden von Laminat zur Applikation auf die Haut und Fixiervorrichtung
PCT/EP1998/006861 WO1999024213A1 (fr) 1997-11-08 1998-10-29 Procede pour decouper au faisceau laser des stratifies s'appliquant sur la peau

Publications (1)

Publication Number Publication Date
SK6632000A3 true SK6632000A3 (en) 2000-11-07

Family

ID=7848109

Family Applications (1)

Application Number Title Priority Date Filing Date
SK663-2000A SK6632000A3 (en) 1997-11-08 1998-10-29 Laser beam cutting method for cutting laminates for applying to the skin

Country Status (21)

Country Link
US (1) US6414264B1 (fr)
EP (1) EP1042100B1 (fr)
JP (1) JP3735252B2 (fr)
KR (1) KR100515006B1 (fr)
AT (1) ATE216302T1 (fr)
AU (1) AU2151699A (fr)
CA (1) CA2308598C (fr)
DE (2) DE19749525C1 (fr)
DK (1) DK1042100T3 (fr)
ES (1) ES2175848T3 (fr)
HU (1) HUP0004387A3 (fr)
ID (1) ID24629A (fr)
IL (1) IL135919A (fr)
NO (1) NO20002392D0 (fr)
PL (1) PL340402A1 (fr)
PT (1) PT1042100E (fr)
SK (1) SK6632000A3 (fr)
TR (1) TR200001212T2 (fr)
TW (1) TW414741B (fr)
WO (1) WO1999024213A1 (fr)
ZA (1) ZA9810154B (fr)

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US8765031B2 (en) 2009-08-13 2014-07-01 Align Technology, Inc. Method of forming a dental appliance
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US9211166B2 (en) 2010-04-30 2015-12-15 Align Technology, Inc. Individualized orthodontic treatment index
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US10449016B2 (en) 2014-09-19 2019-10-22 Align Technology, Inc. Arch adjustment appliance
US9610141B2 (en) 2014-09-19 2017-04-04 Align Technology, Inc. Arch expanding appliance
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KR102363513B1 (ko) * 2016-11-22 2022-02-17 메스텍 머시너리 인코포레이티드 금속 작업부재를 조작하기 위한 방법 및 장비
CN113440273A (zh) 2016-12-02 2021-09-28 阿莱恩技术有限公司 一系列腭扩张器及其形成方法和形成设备
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US11376101B2 (en) 2016-12-02 2022-07-05 Align Technology, Inc. Force control, stop mechanism, regulating structure of removable arch adjustment appliance
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CN110996836B (zh) 2017-07-27 2023-04-11 阿莱恩技术有限公司 用于通过光学相干断层扫描术来处理正畸矫正器的系统和方法
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CN109465555B (zh) * 2018-12-12 2024-03-26 济南和创医疗器械有限公司 膏药贴激光切割柔性生产线
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Also Published As

Publication number Publication date
NO20002392L (no) 2000-05-08
JP2001522724A (ja) 2001-11-20
ID24629A (id) 2000-07-27
DE19749525C1 (de) 1999-06-10
EP1042100A1 (fr) 2000-10-11
PT1042100E (pt) 2002-09-30
TW414741B (en) 2000-12-11
EP1042100B1 (fr) 2002-04-17
TR200001212T2 (tr) 2000-09-21
US6414264B1 (en) 2002-07-02
DE59803883D1 (de) 2002-05-23
ZA9810154B (en) 1999-05-07
KR20010031891A (ko) 2001-04-16
CA2308598C (fr) 2006-02-14
IL135919A (en) 2004-03-28
IL135919A0 (en) 2001-05-20
WO1999024213A1 (fr) 1999-05-20
JP3735252B2 (ja) 2006-01-18
HUP0004387A3 (en) 2002-06-28
KR100515006B1 (ko) 2005-09-14
HUP0004387A2 (hu) 2001-04-28
PL340402A1 (en) 2001-01-29
ES2175848T3 (es) 2002-11-16
NO20002392D0 (no) 2000-05-08
ATE216302T1 (de) 2002-05-15
CA2308598A1 (fr) 1999-05-20
DK1042100T3 (da) 2002-08-12
AU2151699A (en) 1999-05-31

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