SG99901A1 - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG99901A1
SG99901A1 SG200103003A SG200103003A SG99901A1 SG 99901 A1 SG99901 A1 SG 99901A1 SG 200103003 A SG200103003 A SG 200103003A SG 200103003 A SG200103003 A SG 200103003A SG 99901 A1 SG99901 A1 SG 99901A1
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG200103003A
Other languages
English (en)
Inventor
R Jackson Robert
Togawa Tetsuji
Wakabayashi Satoshi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG99901A1 publication Critical patent/SG99901A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200103003A 2000-05-23 2001-05-18 Polishing apparatus SG99901A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/576,717 US6358126B1 (en) 2000-05-23 2000-05-23 Polishing apparatus

Publications (1)

Publication Number Publication Date
SG99901A1 true SG99901A1 (en) 2003-11-27

Family

ID=24305673

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200103003A SG99901A1 (en) 2000-05-23 2001-05-18 Polishing apparatus

Country Status (7)

Country Link
US (1) US6358126B1 (zh)
EP (1) EP1157782B1 (zh)
JP (1) JP4183398B2 (zh)
KR (1) KR100726013B1 (zh)
DE (1) DE60122236T2 (zh)
SG (1) SG99901A1 (zh)
TW (1) TW506879B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
TW472636U (en) * 2001-04-03 2002-01-11 Nanya Technology Corp Improvement for chemical mechanical polishing machine
JP3888620B2 (ja) * 2002-01-22 2007-03-07 東京エレクトロン株式会社 基板搬送装置における基板の受け渡し位置検知方法及びその教示装置
KR100470230B1 (ko) * 2002-02-08 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US6780083B2 (en) * 2002-04-19 2004-08-24 Peter Wolters Cmp-Systeme Gmbh & Co. Kg Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
DE10326472B4 (de) * 2003-06-12 2006-03-09 Hilti Ag Verbindungselement zum Verbinden eines Handgriffs mit einem Gehäuseteil und einem Getriebegehäuse eines Elektrohandgeräts
JP4583207B2 (ja) * 2004-03-31 2010-11-17 不二越機械工業株式会社 研磨装置
JP4642532B2 (ja) * 2005-04-01 2011-03-02 不二越機械工業株式会社 研磨装置
JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
JP2007201417A (ja) * 2005-12-28 2007-08-09 Tokyo Electron Ltd 熱処理用ボート及び縦型熱処理装置
US7536233B1 (en) * 2006-01-30 2009-05-19 Advanced Micro Devices, Inc. Method and apparatus for adjusting processing speeds based on work-in-process levels
JP4926528B2 (ja) * 2006-04-19 2012-05-09 昭和電工株式会社 湿式研磨装置
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
CN114473847B (zh) * 2021-12-29 2023-04-25 华海清科股份有限公司 一种旋转式晶圆交互系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944119A (en) * 1988-06-20 1990-07-31 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
US5549502A (en) * 1992-12-04 1996-08-27 Fujikoshi Machinery Corp. Polishing apparatus
US5649854A (en) * 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5804507A (en) 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
JP3231659B2 (ja) * 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
JPH11204468A (ja) 1998-01-09 1999-07-30 Speedfam Co Ltd 半導体ウエハの表面平坦化装置
JP4156039B2 (ja) * 1998-03-09 2008-09-24 株式会社荏原製作所 ポリッシング装置
SG97860A1 (en) * 1999-03-05 2003-08-20 Ebara Corp Polishing apparatus
JP3897507B2 (ja) * 1999-03-05 2007-03-28 株式会社荏原製作所 ポリッシング装置
EP1080840A3 (en) * 1999-08-30 2004-01-02 Mitsubishi Materials Corporation Polishing apparatus, polishing method and method of conditioning polishing pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944119A (en) * 1988-06-20 1990-07-31 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
US5549502A (en) * 1992-12-04 1996-08-27 Fujikoshi Machinery Corp. Polishing apparatus
US5649854A (en) * 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations

Also Published As

Publication number Publication date
US6358126B1 (en) 2002-03-19
DE60122236T2 (de) 2007-08-23
JP2002009021A (ja) 2002-01-11
TW506879B (en) 2002-10-21
DE60122236D1 (de) 2006-09-28
EP1157782A3 (en) 2004-01-14
EP1157782A2 (en) 2001-11-28
KR20010107672A (ko) 2001-12-07
KR100726013B1 (ko) 2007-06-08
JP4183398B2 (ja) 2008-11-19
EP1157782B1 (en) 2006-08-16

Similar Documents

Publication Publication Date Title
SG96621A1 (en) Polishing apparatus
EP1346798A4 (en) POLISHING DEVICE
GB0121865D0 (en) Apparatus
GB2381768B (en) Improved grinding apparatus
SG99901A1 (en) Polishing apparatus
GB0226397D0 (en) Grinding apparatus
SG97860A1 (en) Polishing apparatus
GB2361447B (en) Wafer polishing apparatus
GB0014348D0 (en) Apparatus
GB0003442D0 (en) Apparatus
GB2361446B (en) Polishing apparatus
SG96553A1 (en) Abrasive
GB0227538D0 (en) Orbital polishing apparatus
GB2361448B (en) Wafer polishing apparatus
GB2366755B (en) Wafer polishing apparatus
GB0225994D0 (en) Apparatus
EP1332835A4 (en) POLISHING DEVICE
GB0015486D0 (en) Chromatogtraphy apparatus
GB0006869D0 (en) Apparatus
GB0120617D0 (en) Skill-improvement apparatus
GB0011118D0 (en) Apparatus
GB0030538D0 (en) Apparatus
GB0000789D0 (en) Apparatus
AU5995201A (en) Grinding apparatus
GB0015642D0 (en) Apparatus