SG93928A1 - Electroconductive resin composition - Google Patents

Electroconductive resin composition

Info

Publication number
SG93928A1
SG93928A1 SG200201092A SG200201092A SG93928A1 SG 93928 A1 SG93928 A1 SG 93928A1 SG 200201092 A SG200201092 A SG 200201092A SG 200201092 A SG200201092 A SG 200201092A SG 93928 A1 SG93928 A1 SG 93928A1
Authority
SG
Singapore
Prior art keywords
resin composition
electroconductive resin
electroconductive
composition
resin
Prior art date
Application number
SG200201092A
Other languages
English (en)
Inventor
Harada Munehiro
Original Assignee
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chem filed Critical Daicel Chem
Publication of SG93928A1 publication Critical patent/SG93928A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C08L23/0884—Epoxide containing esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/22—Thermoplastic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/04—Thermoplastic elastomer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Conductive Materials (AREA)
SG200201092A 2001-02-28 2002-02-20 Electroconductive resin composition SG93928A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001054760A JP2002256125A (ja) 2001-02-28 2001-02-28 導電性樹脂組成物

Publications (1)

Publication Number Publication Date
SG93928A1 true SG93928A1 (en) 2003-01-21

Family

ID=18915045

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200201092A SG93928A1 (en) 2001-02-28 2002-02-20 Electroconductive resin composition

Country Status (5)

Country Link
JP (1) JP2002256125A (zh)
KR (1) KR20020070825A (zh)
CN (1) CN1373153A (zh)
HK (1) HK1049348A1 (zh)
SG (1) SG93928A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1461386B1 (en) * 2002-01-07 2006-11-29 Denki Kagaku Kogyo Kabushiki Kaisha Electroconductive resin composition
EP1787804B1 (en) * 2004-09-07 2011-04-20 Denki Kagaku Kogyo Kabushiki Kaisha Conductive composite sheeting
WO2006030871A1 (ja) * 2004-09-16 2006-03-23 Denki Kagaku Kogyo Kabushiki Kaisha 複合シート
JP5259131B2 (ja) * 2007-07-02 2013-08-07 電気化学工業株式会社 樹脂組成物、及びシート
FR2924434B1 (fr) * 2007-12-04 2010-12-17 Rhodia Operations Composition polyamide stabilisee vis-a-vis de la chaleur et de la lumiere
KR100975331B1 (ko) * 2008-12-26 2010-08-12 권오건 초음파 탐촉자 조립체
JP5419078B2 (ja) * 2009-06-26 2014-02-19 太平化学製品株式会社 導電性樹脂組成物、導電性シートおよび静電気障害対策用成形品
KR101102312B1 (ko) * 2010-02-26 2012-01-03 주식회사 에네스코 발전용 터빈 블레이드 핀 자동초음파탐상용 물기둥 웨지유닛
JP2014009337A (ja) * 2012-07-02 2014-01-20 Sumitomo Bakelite Co Ltd 電子部品包装用基材シート、電子部品包装用多層シート、電子部品包装用キャリアテープ、および、電子部品搬送体
CN104031350B (zh) * 2014-06-17 2017-08-25 东莞市德诚塑化科技有限公司 一种电容笔手写笔用料、制备方法及其用途
CN104861405A (zh) * 2015-05-11 2015-08-26 昆山恒光塑料制品有限公司 复合导电母粒及其生产工艺
US9741677B1 (en) * 2016-03-01 2017-08-22 Infineon Technologies Ag Semiconductor device including antistatic die attach material
CN106947202A (zh) * 2017-05-05 2017-07-14 安徽彩晶光电有限公司 液晶电视机用高强耐污塑料机架

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5707699A (en) * 1995-01-26 1998-01-13 Denki Kagaku Kogyo Kabushiki Kaisha Electroconductive resin composition, sheet, molded product and container
US5747164A (en) * 1995-09-19 1998-05-05 Denki Kagaku Kogyo Kabushiki Kaisha Conductive composite plastic sheet and container
WO2001009241A1 (en) * 1999-07-29 2001-02-08 Shanghai Genius Advanced Material Co. Ltd. High fluidible, impact resistant conductive acrylonitrile-butadiene-styrene terpolymer material and preparing method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3202553B2 (ja) * 1995-09-19 2001-08-27 電気化学工業株式会社 導電性複合プラスチックシート及び容器
JPH101603A (ja) * 1996-06-17 1998-01-06 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物及びｉｃトレー
JP3456416B2 (ja) * 1998-06-03 2003-10-14 住友化学工業株式会社 樹脂組成物
JP2000141554A (ja) * 1998-08-31 2000-05-23 Dainippon Ink & Chem Inc 導電性シ―ト、その製法及び成型品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5707699A (en) * 1995-01-26 1998-01-13 Denki Kagaku Kogyo Kabushiki Kaisha Electroconductive resin composition, sheet, molded product and container
US5747164A (en) * 1995-09-19 1998-05-05 Denki Kagaku Kogyo Kabushiki Kaisha Conductive composite plastic sheet and container
WO2001009241A1 (en) * 1999-07-29 2001-02-08 Shanghai Genius Advanced Material Co. Ltd. High fluidible, impact resistant conductive acrylonitrile-butadiene-styrene terpolymer material and preparing method thereof

Also Published As

Publication number Publication date
KR20020070825A (ko) 2002-09-11
CN1373153A (zh) 2002-10-09
HK1049348A1 (zh) 2003-05-09
JP2002256125A (ja) 2002-09-11

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