SG91867A1 - Improved apparatus and method for dispensing solder - Google Patents

Improved apparatus and method for dispensing solder

Info

Publication number
SG91867A1
SG91867A1 SG200002839A SG200002839A SG91867A1 SG 91867 A1 SG91867 A1 SG 91867A1 SG 200002839 A SG200002839 A SG 200002839A SG 200002839 A SG200002839 A SG 200002839A SG 91867 A1 SG91867 A1 SG 91867A1
Authority
SG
Singapore
Prior art keywords
improved apparatus
dispensing solder
solder
dispensing
improved
Prior art date
Application number
SG200002839A
Other languages
English (en)
Inventor
Elisabeth Anna Radec Stephanie
Original Assignee
Casem Asia Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casem Asia Pte Ltd filed Critical Casem Asia Pte Ltd
Priority to SG200002839A priority Critical patent/SG91867A1/en
Priority to TW089110711A priority patent/TW453929B/zh
Priority to MYPI20012384A priority patent/MY128995A/en
Priority to EP01934800A priority patent/EP1294520A1/en
Priority to PCT/SG2001/000100 priority patent/WO2001089753A1/en
Priority to JP2001585982A priority patent/JP2003534648A/ja
Priority to AU2001260950A priority patent/AU2001260950A1/en
Priority to US10/276,851 priority patent/US20040035907A1/en
Priority to CNB01809905XA priority patent/CN1224487C/zh
Publication of SG91867A1 publication Critical patent/SG91867A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG200002839A 2000-05-24 2000-05-24 Improved apparatus and method for dispensing solder SG91867A1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SG200002839A SG91867A1 (en) 2000-05-24 2000-05-24 Improved apparatus and method for dispensing solder
TW089110711A TW453929B (en) 2000-05-24 2000-06-01 Improved apparatus and method for dispensing solder
MYPI20012384A MY128995A (en) 2000-05-24 2001-05-21 Improved apparatus and method for dispensing solder
EP01934800A EP1294520A1 (en) 2000-05-24 2001-05-23 Improved apparatus and method for dispensing solder
PCT/SG2001/000100 WO2001089753A1 (en) 2000-05-24 2001-05-23 Improved apparatus and method for dispensing solder
JP2001585982A JP2003534648A (ja) 2000-05-24 2001-05-23 はんだ供給のための改良された装置および方法
AU2001260950A AU2001260950A1 (en) 2000-05-24 2001-05-23 Improved apparatus and method for dispensing solder
US10/276,851 US20040035907A1 (en) 2000-05-24 2001-05-23 Apparatus and method for dispensing solder
CNB01809905XA CN1224487C (zh) 2000-05-24 2001-05-23 经过改进的用于分配焊料的装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200002839A SG91867A1 (en) 2000-05-24 2000-05-24 Improved apparatus and method for dispensing solder

Publications (1)

Publication Number Publication Date
SG91867A1 true SG91867A1 (en) 2002-10-15

Family

ID=20430592

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002839A SG91867A1 (en) 2000-05-24 2000-05-24 Improved apparatus and method for dispensing solder

Country Status (9)

Country Link
US (1) US20040035907A1 (zh)
EP (1) EP1294520A1 (zh)
JP (1) JP2003534648A (zh)
CN (1) CN1224487C (zh)
AU (1) AU2001260950A1 (zh)
MY (1) MY128995A (zh)
SG (1) SG91867A1 (zh)
TW (1) TW453929B (zh)
WO (1) WO2001089753A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG117410A1 (en) * 2002-05-03 2005-12-29 Casem Asia Pte Ltd Method and apparatus for dispensing solder
KR101093302B1 (ko) * 2003-06-26 2011-12-14 센주긴조쿠고교 가부시키가이샤 선재 조출 장치 및 와이어 솔더
US20080308952A1 (en) * 2005-07-28 2008-12-18 Infineon Technologies Ag Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus
US7735715B2 (en) * 2007-12-07 2010-06-15 Asm Assembly Automation Ltd Dispensing solder for mounting semiconductor chips
US20110272452A1 (en) * 2010-05-04 2011-11-10 Kui Kam Lam System for dispensing soft solder for mounting semiconductor chips using multiple solder wires
EP2726171B1 (en) 2011-06-30 2017-05-17 Donaldson Company, Inc. Air/oil separator assemblies
JP5800778B2 (ja) 2011-11-25 2015-10-28 三菱電機株式会社 接合方法および半導体装置の製造方法
US8701966B2 (en) * 2012-01-24 2014-04-22 Apple Inc. Induction bonding
CN102601483B (zh) * 2012-04-06 2016-03-02 深圳市深立精机科技有限公司 一种自动送锡系统
CH706712A1 (de) * 2012-07-05 2014-01-15 Besi Switzerland Ag Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.
CN102810489B (zh) * 2012-08-17 2015-01-21 杭州士兰集成电路有限公司 芯片封装系统、方法、注入装置及冲压与注入联动装置
CH708278A1 (de) * 2013-07-08 2015-01-15 Besi Switzerland Ag Vorrichtung zum Auftragen und Verteilen von Lot auf einem Substrat.
CN107159996A (zh) * 2017-06-01 2017-09-15 安徽吉乃尔电器科技有限公司 一种锡球焊接装置
CN109047994A (zh) * 2018-09-06 2018-12-21 南通市华冠电器有限公司 自动焊接机焊丝自动输送装置
JP7207152B2 (ja) * 2019-05-16 2023-01-18 株式会社デンソー スリーブはんだ付け装置および電子装置の製造方法
JP7365493B2 (ja) * 2020-04-03 2023-10-19 平田機工株式会社 半田供給ユニット、半田片製造装置、部品実装装置および生産システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038995A (en) * 1989-01-10 1991-08-13 Eishu Nagata Soldering method and soldering apparatus
US5878939A (en) * 1995-07-01 1999-03-09 Esec S.A. Method and apparatus for dispensing liquid solder
JP2000216174A (ja) * 1999-01-25 2000-08-04 Nec Kansai Ltd ダイボンダ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3894671A (en) * 1971-01-06 1975-07-15 Kulicke & Soffa Ind Inc Semiconductor wire bonder
US4272007A (en) * 1979-02-02 1981-06-09 Steranko James J Wire bonding system and method
US4691854A (en) * 1984-12-21 1987-09-08 Texas Instruments Incorporated Coatings for ceramic bonding capillaries
US5065932A (en) * 1990-09-24 1991-11-19 International Business Machines Corporation Solder placement nozzle with inert cover gas and inert gas bleed
KR940001270Y1 (ko) * 1991-07-15 1994-03-09 금성일렉트론 주식회사 와이어 본드의 히터블록
JP3218380B2 (ja) * 1995-03-22 2001-10-15 株式会社新川 テープボンディング装置
JPH08316617A (ja) * 1995-05-12 1996-11-29 Akai Electric Co Ltd リード線のはんだ付け方法および装置
JP2981973B2 (ja) * 1995-05-30 1999-11-22 株式会社新川 ワイヤボンディング装置
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6158647A (en) * 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6202293B1 (en) * 2000-01-28 2001-03-20 Visteon Global Technologies, Inc. Work holder assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5038995A (en) * 1989-01-10 1991-08-13 Eishu Nagata Soldering method and soldering apparatus
US5878939A (en) * 1995-07-01 1999-03-09 Esec S.A. Method and apparatus for dispensing liquid solder
JP2000216174A (ja) * 1999-01-25 2000-08-04 Nec Kansai Ltd ダイボンダ

Also Published As

Publication number Publication date
JP2003534648A (ja) 2003-11-18
CN1430542A (zh) 2003-07-16
CN1224487C (zh) 2005-10-26
TW453929B (en) 2001-09-11
WO2001089753A1 (en) 2001-11-29
MY128995A (en) 2007-03-30
US20040035907A1 (en) 2004-02-26
EP1294520A1 (en) 2003-03-26
AU2001260950A1 (en) 2001-12-03

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