SG91867A1 - Improved apparatus and method for dispensing solder - Google Patents
Improved apparatus and method for dispensing solderInfo
- Publication number
- SG91867A1 SG91867A1 SG200002839A SG200002839A SG91867A1 SG 91867 A1 SG91867 A1 SG 91867A1 SG 200002839 A SG200002839 A SG 200002839A SG 200002839 A SG200002839 A SG 200002839A SG 91867 A1 SG91867 A1 SG 91867A1
- Authority
- SG
- Singapore
- Prior art keywords
- improved apparatus
- dispensing solder
- solder
- dispensing
- improved
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200002839A SG91867A1 (en) | 2000-05-24 | 2000-05-24 | Improved apparatus and method for dispensing solder |
TW089110711A TW453929B (en) | 2000-05-24 | 2000-06-01 | Improved apparatus and method for dispensing solder |
MYPI20012384A MY128995A (en) | 2000-05-24 | 2001-05-21 | Improved apparatus and method for dispensing solder |
PCT/SG2001/000100 WO2001089753A1 (en) | 2000-05-24 | 2001-05-23 | Improved apparatus and method for dispensing solder |
JP2001585982A JP2003534648A (ja) | 2000-05-24 | 2001-05-23 | はんだ供給のための改良された装置および方法 |
EP01934800A EP1294520A1 (en) | 2000-05-24 | 2001-05-23 | Improved apparatus and method for dispensing solder |
US10/276,851 US20040035907A1 (en) | 2000-05-24 | 2001-05-23 | Apparatus and method for dispensing solder |
AU2001260950A AU2001260950A1 (en) | 2000-05-24 | 2001-05-23 | Improved apparatus and method for dispensing solder |
CNB01809905XA CN1224487C (zh) | 2000-05-24 | 2001-05-23 | 经过改进的用于分配焊料的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200002839A SG91867A1 (en) | 2000-05-24 | 2000-05-24 | Improved apparatus and method for dispensing solder |
Publications (1)
Publication Number | Publication Date |
---|---|
SG91867A1 true SG91867A1 (en) | 2002-10-15 |
Family
ID=20430592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200002839A SG91867A1 (en) | 2000-05-24 | 2000-05-24 | Improved apparatus and method for dispensing solder |
Country Status (9)
Country | Link |
---|---|
US (1) | US20040035907A1 (ja) |
EP (1) | EP1294520A1 (ja) |
JP (1) | JP2003534648A (ja) |
CN (1) | CN1224487C (ja) |
AU (1) | AU2001260950A1 (ja) |
MY (1) | MY128995A (ja) |
SG (1) | SG91867A1 (ja) |
TW (1) | TW453929B (ja) |
WO (1) | WO2001089753A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG117410A1 (en) * | 2002-05-03 | 2005-12-29 | Casem Asia Pte Ltd | Method and apparatus for dispensing solder |
EP1637268A1 (en) * | 2003-06-26 | 2006-03-22 | Pentel Kabushiki Kaisha | Wire material payout device and wire solder |
WO2007012910A1 (en) * | 2005-07-28 | 2007-02-01 | Infineon Technologies Ag | Method for reliably positioning solder on a die pad for attaching a semiconductor chip to the die pad and molding die for solder dispensing apparatus |
US7735715B2 (en) * | 2007-12-07 | 2010-06-15 | Asm Assembly Automation Ltd | Dispensing solder for mounting semiconductor chips |
US20110272452A1 (en) * | 2010-05-04 | 2011-11-10 | Kui Kam Lam | System for dispensing soft solder for mounting semiconductor chips using multiple solder wires |
JP6075654B2 (ja) | 2011-06-30 | 2017-02-08 | ドナルドソン カンパニー,インコーポレイティド | 空気/油分離装置アセンブリ、部品及び方法 |
JP5800778B2 (ja) * | 2011-11-25 | 2015-10-28 | 三菱電機株式会社 | 接合方法および半導体装置の製造方法 |
US8701966B2 (en) * | 2012-01-24 | 2014-04-22 | Apple Inc. | Induction bonding |
CN102601483B (zh) * | 2012-04-06 | 2016-03-02 | 深圳市深立精机科技有限公司 | 一种自动送锡系统 |
CH706712A1 (de) * | 2012-07-05 | 2014-01-15 | Besi Switzerland Ag | Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. |
CN102810489B (zh) * | 2012-08-17 | 2015-01-21 | 杭州士兰集成电路有限公司 | 芯片封装系统、方法、注入装置及冲压与注入联动装置 |
CH708278A1 (de) * | 2013-07-08 | 2015-01-15 | Besi Switzerland Ag | Vorrichtung zum Auftragen und Verteilen von Lot auf einem Substrat. |
CN107159996A (zh) * | 2017-06-01 | 2017-09-15 | 安徽吉乃尔电器科技有限公司 | 一种锡球焊接装置 |
CN109047994A (zh) * | 2018-09-06 | 2018-12-21 | 南通市华冠电器有限公司 | 自动焊接机焊丝自动输送装置 |
JP7207152B2 (ja) * | 2019-05-16 | 2023-01-18 | 株式会社デンソー | スリーブはんだ付け装置および電子装置の製造方法 |
EP4101572A4 (en) * | 2020-04-03 | 2023-03-29 | Hirata Corporation | BRAZING MATERIAL SUPPLY UNIT, BRAZED WORKPIECE MANUFACTURING DEVICE, COMPONENT MOUNTING DEVICE AND PRODUCTION SYSTEM |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5038995A (en) * | 1989-01-10 | 1991-08-13 | Eishu Nagata | Soldering method and soldering apparatus |
US5878939A (en) * | 1995-07-01 | 1999-03-09 | Esec S.A. | Method and apparatus for dispensing liquid solder |
JP2000216174A (ja) * | 1999-01-25 | 2000-08-04 | Nec Kansai Ltd | ダイボンダ |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3894671A (en) * | 1971-01-06 | 1975-07-15 | Kulicke & Soffa Ind Inc | Semiconductor wire bonder |
US4272007A (en) * | 1979-02-02 | 1981-06-09 | Steranko James J | Wire bonding system and method |
US4691854A (en) * | 1984-12-21 | 1987-09-08 | Texas Instruments Incorporated | Coatings for ceramic bonding capillaries |
US5065932A (en) * | 1990-09-24 | 1991-11-19 | International Business Machines Corporation | Solder placement nozzle with inert cover gas and inert gas bleed |
KR940001270Y1 (ko) * | 1991-07-15 | 1994-03-09 | 금성일렉트론 주식회사 | 와이어 본드의 히터블록 |
JP3218380B2 (ja) * | 1995-03-22 | 2001-10-15 | 株式会社新川 | テープボンディング装置 |
JPH08316617A (ja) * | 1995-05-12 | 1996-11-29 | Akai Electric Co Ltd | リード線のはんだ付け方法および装置 |
JP2981973B2 (ja) * | 1995-05-30 | 1999-11-22 | 株式会社新川 | ワイヤボンディング装置 |
US6068174A (en) * | 1996-12-13 | 2000-05-30 | Micro)N Technology, Inc. | Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
US6158647A (en) * | 1998-09-29 | 2000-12-12 | Micron Technology, Inc. | Concave face wire bond capillary |
US6202293B1 (en) * | 2000-01-28 | 2001-03-20 | Visteon Global Technologies, Inc. | Work holder assembly |
-
2000
- 2000-05-24 SG SG200002839A patent/SG91867A1/en unknown
- 2000-06-01 TW TW089110711A patent/TW453929B/zh not_active IP Right Cessation
-
2001
- 2001-05-21 MY MYPI20012384A patent/MY128995A/en unknown
- 2001-05-23 JP JP2001585982A patent/JP2003534648A/ja active Pending
- 2001-05-23 WO PCT/SG2001/000100 patent/WO2001089753A1/en not_active Application Discontinuation
- 2001-05-23 AU AU2001260950A patent/AU2001260950A1/en not_active Abandoned
- 2001-05-23 CN CNB01809905XA patent/CN1224487C/zh not_active Expired - Fee Related
- 2001-05-23 US US10/276,851 patent/US20040035907A1/en not_active Abandoned
- 2001-05-23 EP EP01934800A patent/EP1294520A1/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5038995A (en) * | 1989-01-10 | 1991-08-13 | Eishu Nagata | Soldering method and soldering apparatus |
US5878939A (en) * | 1995-07-01 | 1999-03-09 | Esec S.A. | Method and apparatus for dispensing liquid solder |
JP2000216174A (ja) * | 1999-01-25 | 2000-08-04 | Nec Kansai Ltd | ダイボンダ |
Also Published As
Publication number | Publication date |
---|---|
MY128995A (en) | 2007-03-30 |
JP2003534648A (ja) | 2003-11-18 |
TW453929B (en) | 2001-09-11 |
US20040035907A1 (en) | 2004-02-26 |
WO2001089753A1 (en) | 2001-11-29 |
AU2001260950A1 (en) | 2001-12-03 |
EP1294520A1 (en) | 2003-03-26 |
CN1224487C (zh) | 2005-10-26 |
CN1430542A (zh) | 2003-07-16 |
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