SG87175A1 - Contact structure having silicon finger contactors and total stack-up structure using same - Google Patents

Contact structure having silicon finger contactors and total stack-up structure using same

Info

Publication number
SG87175A1
SG87175A1 SG200005611A SG200005611A SG87175A1 SG 87175 A1 SG87175 A1 SG 87175A1 SG 200005611 A SG200005611 A SG 200005611A SG 200005611 A SG200005611 A SG 200005611A SG 87175 A1 SG87175 A1 SG 87175A1
Authority
SG
Singapore
Prior art keywords
same
total stack
silicon finger
finger contactors
contact structure
Prior art date
Application number
SG200005611A
Other languages
English (en)
Inventor
Theodore A Khoury
James W Frame
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of SG87175A1 publication Critical patent/SG87175A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG200005611A 1999-10-12 2000-09-29 Contact structure having silicon finger contactors and total stack-up structure using same SG87175A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/415,913 US6232669B1 (en) 1999-10-12 1999-10-12 Contact structure having silicon finger contactors and total stack-up structure using same

Publications (1)

Publication Number Publication Date
SG87175A1 true SG87175A1 (en) 2002-03-19

Family

ID=23647745

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200005611A SG87175A1 (en) 1999-10-12 2000-09-29 Contact structure having silicon finger contactors and total stack-up structure using same

Country Status (6)

Country Link
US (1) US6232669B1 (zh)
JP (1) JP3343549B2 (zh)
KR (1) KR100454546B1 (zh)
DE (1) DE10050077A1 (zh)
SG (1) SG87175A1 (zh)
TW (1) TW480692B (zh)

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US6856150B2 (en) * 2001-04-10 2005-02-15 Formfactor, Inc. Probe card with coplanar daughter card
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US6651325B2 (en) * 2002-02-19 2003-11-25 Industrial Technologies Research Institute Method for forming cantilever beam probe card and probe card formed
KR100954081B1 (ko) * 2002-12-20 2010-04-23 삼성전자주식회사 연성회로기판 및 이를 이용한 베어 칩의 회로 불량 검사방법
US20040119485A1 (en) * 2002-12-20 2004-06-24 Koch Daniel J. Probe finger structure and method for making a probe finger structure
TWI238513B (en) 2003-03-04 2005-08-21 Rohm & Haas Elect Mat Coaxial waveguide microstructures and methods of formation thereof
US20050174136A1 (en) * 2004-02-09 2005-08-11 Jiachun Zhou Test pin back surface in probe apparatus for low wear multiple contacting with conductive elastomer
US7230437B2 (en) * 2004-06-15 2007-06-12 Formfactor, Inc. Mechanically reconfigurable vertical tester interface for IC probing
WO2007000799A1 (ja) * 2005-06-27 2007-01-04 Advantest Corporation コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置
US7362119B2 (en) * 2005-08-01 2008-04-22 Touchdown Technologies, Inc Torsion spring probe contactor design
US7245135B2 (en) * 2005-08-01 2007-07-17 Touchdown Technologies, Inc. Post and tip design for a probe contact
US20070057685A1 (en) * 2005-09-14 2007-03-15 Touchdown Technologies, Inc. Lateral interposer contact design and probe card assembly
US7821283B2 (en) * 2005-12-22 2010-10-26 Jsr Corporation Circuit board apparatus for wafer inspection, probe card, and wafer inspection apparatus
KR100780094B1 (ko) * 2006-03-22 2007-11-29 (주)테이크시스템즈 글래스 테스트용 콘택트 패드 프로브의 제조방법
KR101396604B1 (ko) * 2006-11-27 2014-05-16 엘지디스플레이 주식회사 액정표시장치용 검사장치
KR101476438B1 (ko) 2006-12-30 2014-12-24 누보트로닉스, 엘.엘.씨 3차원 미세구조 및 그 형성방법
US7755174B2 (en) 2007-03-20 2010-07-13 Nuvotonics, LLC Integrated electronic components and methods of formation thereof
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KR101092389B1 (ko) 2007-04-03 2011-12-09 가부시키가이샤 아드반테스트 콘택터의 제조방법
US8507908B2 (en) 2007-07-03 2013-08-13 Advantest Corporation Probe and probe card
US7761966B2 (en) * 2007-07-16 2010-07-27 Touchdown Technologies, Inc. Method for repairing a microelectromechanical system
CN101688886A (zh) 2007-07-24 2010-03-31 株式会社爱德万测试 接触器、探针卡及接触器的安装方法
KR200454501Y1 (ko) 2008-03-03 2011-07-08 주식회사 오킨스전자 번-인 소켓 및 커넥터의 조립체
JP5424675B2 (ja) * 2008-03-18 2014-02-26 キヤノン株式会社 半導体装置の製造方法及び半導体装置
KR100977165B1 (ko) 2008-08-29 2010-08-20 주식회사 코리아 인스트루먼트 프로브 기판 및 이를 구비하는 프로브 카드
US8277757B2 (en) * 2009-09-29 2012-10-02 Integra Biosciences Corp. Pipette tip mounting shaft
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
WO2013010108A1 (en) 2011-07-13 2013-01-17 Nuvotronics, Llc Methods of fabricating electronic and mechanical structures
CN102880563A (zh) * 2011-07-13 2013-01-16 深圳市先施科技股份有限公司 具有可拆装多功能扩展接口模块的便携式数据采集设备
TWI503553B (zh) * 2011-10-19 2015-10-11 Johnstech Int Corp 用於微電路測試器的導電開爾文接觸件
US9194887B2 (en) 2012-11-15 2015-11-24 Advantest America, Inc. Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
DE102013008324A1 (de) 2013-05-08 2014-11-13 Feinmetall Gmbh Elektrische Kontaktiervorrichtung
KR20160133422A (ko) * 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
SG11201608288UA (en) 2014-04-04 2016-11-29 Feinmetall Gmbh Contact-distance transformer, electrical testing device, and method for producing a contact-distance transformer
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
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DE102015004150A1 (de) * 2015-03-31 2016-10-06 Feinmetall Gmbh Verfahren zur Herstellung eines Kontaktabstandswandlers sowie Kontaktabstandswandler
DE112016001535T5 (de) * 2015-03-31 2018-03-08 Technoprobe S.P.A Sondenkarte für ein Testgerät von elektronischen Vorrichtungen mit verbesserten Filtereigenschaften
DE102017126716B4 (de) * 2017-11-14 2021-07-22 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul mit einer Schalteinrichtung
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
KR101978731B1 (ko) * 2018-03-27 2019-05-15 송인식 반도체 패키지용 테스트 소켓
TWI718938B (zh) * 2020-04-20 2021-02-11 中華精測科技股份有限公司 分隔式薄膜探針卡及其彈性模組
TWI719895B (zh) * 2020-05-11 2021-02-21 中華精測科技股份有限公司 陣列式薄膜探針卡及其測試模組
CN116315772A (zh) * 2021-12-08 2023-06-23 泰可广科技股份有限公司 测试连接器的电连接组件

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US4177425A (en) * 1977-09-06 1979-12-04 Seymour Lenz Multiple contact electrical test probe assembly
US4520314A (en) * 1981-10-30 1985-05-28 International Business Machines Corporation Probe head arrangement for conductor line testing with at least one probe head comprising a plurality of resilient contacts
US4522893A (en) * 1981-10-30 1985-06-11 International Business Machines Corporation Contact device for releasably connecting electrical components

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US4177425A (en) * 1977-09-06 1979-12-04 Seymour Lenz Multiple contact electrical test probe assembly
US4520314A (en) * 1981-10-30 1985-05-28 International Business Machines Corporation Probe head arrangement for conductor line testing with at least one probe head comprising a plurality of resilient contacts
US4522893A (en) * 1981-10-30 1985-06-11 International Business Machines Corporation Contact device for releasably connecting electrical components

Also Published As

Publication number Publication date
KR20010070133A (ko) 2001-07-25
KR100454546B1 (ko) 2004-11-03
JP3343549B2 (ja) 2002-11-11
TW480692B (en) 2002-03-21
DE10050077A1 (de) 2001-05-23
JP2001159642A (ja) 2001-06-12
US6232669B1 (en) 2001-05-15

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