SG87109A1 - System and method for cleaning silicon-coated surfaces in an ion implanter - Google Patents

System and method for cleaning silicon-coated surfaces in an ion implanter

Info

Publication number
SG87109A1
SG87109A1 SG200002361A SG200002361A SG87109A1 SG 87109 A1 SG87109 A1 SG 87109A1 SG 200002361 A SG200002361 A SG 200002361A SG 200002361 A SG200002361 A SG 200002361A SG 87109 A1 SG87109 A1 SG 87109A1
Authority
SG
Singapore
Prior art keywords
ion implanter
coated surfaces
cleaning silicon
silicon
cleaning
Prior art date
Application number
SG200002361A
Other languages
English (en)
Inventor
Joseph Eddy Ronald
Miltiadis Kopalidis Peter
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eaton Corp filed Critical Eaton Corp
Publication of SG87109A1 publication Critical patent/SG87109A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
SG200002361A 1999-05-10 2000-04-27 System and method for cleaning silicon-coated surfaces in an ion implanter SG87109A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/309,466 US6259105B1 (en) 1999-05-10 1999-05-10 System and method for cleaning silicon-coated surfaces in an ion implanter

Publications (1)

Publication Number Publication Date
SG87109A1 true SG87109A1 (en) 2002-03-19

Family

ID=23198359

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200002361A SG87109A1 (en) 1999-05-10 2000-04-27 System and method for cleaning silicon-coated surfaces in an ion implanter

Country Status (6)

Country Link
US (1) US6259105B1 (ja)
EP (1) EP1054438A3 (ja)
JP (1) JP2001007041A (ja)
KR (1) KR100587630B1 (ja)
SG (1) SG87109A1 (ja)
TW (1) TW455917B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6415198B1 (en) 1999-06-25 2002-07-02 Applied Materials, Inc. Plasma etching of silicon using a chlorine chemistry augmented with sulfur dioxide
DE10029523A1 (de) * 2000-06-21 2002-01-10 Messer Griesheim Gmbh Verfahren und Vorrichtung zum Reinigen eines PVD- oder CVD-Reaktors sowie von Abgasleitungen desselben
JP3387488B2 (ja) * 2000-12-01 2003-03-17 日新電機株式会社 イオンビーム照射装置
US20030062064A1 (en) * 2001-09-28 2003-04-03 Infineon Technologies North America Corp. Method of removing PECVD residues of fluorinated plasma using in-situ H2 plasma
US7820981B2 (en) * 2003-12-12 2010-10-26 Semequip, Inc. Method and apparatus for extending equipment uptime in ion implantation
US20080073559A1 (en) * 2003-12-12 2008-03-27 Horsky Thomas N Controlling the flow of vapors sublimated from solids
US7819981B2 (en) * 2004-10-26 2010-10-26 Advanced Technology Materials, Inc. Methods for cleaning ion implanter components
CN101495190B (zh) * 2005-03-16 2013-05-01 高级技术材料公司 用于从固体源递送试剂的系统
US7511287B2 (en) 2005-09-21 2009-03-31 Axcelis Technologies, Inc. Systems and methods that mitigate contamination and modify surface characteristics during ion implantation processes through the introduction of gases
JP4875886B2 (ja) * 2005-11-22 2012-02-15 株式会社日立ハイテクノロジーズ 荷電粒子線装置
TWI473149B (zh) * 2006-04-26 2015-02-11 Advanced Tech Materials 半導體製程系統之清潔
US20080142039A1 (en) * 2006-12-13 2008-06-19 Advanced Technology Materials, Inc. Removal of nitride deposits
KR100855540B1 (ko) 2007-07-10 2008-09-01 주식회사 코미코 이온 주입 장치, 이온 주입 장치의 내부 구조물 및 상기이온 주입 장치의 코팅층 형성 방법
WO2009039382A1 (en) 2007-09-21 2009-03-26 Semequip. Inc. Method for extending equipment uptime in ion implantation
TWI573179B (zh) 2008-02-11 2017-03-01 先進科技材料公司 在半導體處理系統中離子源之清洗
CN201648509U (zh) * 2010-04-21 2010-11-24 北京京东方光电科技有限公司 磁控溅射设备
US9558914B2 (en) * 2015-02-25 2017-01-31 Axcelis Technologies, Inc. Bipolar wafer charge monitor system and ion implantation system comprising same

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703183A (en) * 1985-12-05 1987-10-27 Eaton Corporation Ion implantation chamber purification method and apparatus
JPH02155147A (ja) * 1988-12-06 1990-06-14 Tokyo Electron Ltd イオン注入装置のクリーニング方法
US5144147A (en) * 1990-08-31 1992-09-01 Kabushiki Kaisha Toshiba Ion implantation apparatus and method of cleaning the same
US5281302A (en) * 1992-01-27 1994-01-25 Siemens Aktiengesellschaft Method for cleaning reaction chambers by plasma etching
US5413670A (en) * 1993-07-08 1995-05-09 Air Products And Chemicals, Inc. Method for plasma etching or cleaning with diluted NF3
US5486235A (en) * 1993-08-09 1996-01-23 Applied Materials, Inc. Plasma dry cleaning of semiconductor processing chambers
US5611863A (en) * 1994-08-22 1997-03-18 Tokyo Electron Limited Semiconductor processing apparatus and cleaning method thereof
US5633506A (en) * 1995-07-17 1997-05-27 Eaton Corporation Method and apparatus for in situ removal of contaminants from ion beam neutralization and implantation apparatuses
US5824375A (en) * 1996-10-24 1998-10-20 Applied Materials, Inc. Decontamination of a plasma reactor using a plasma after a chamber clean

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4923828A (en) * 1989-07-07 1990-05-08 Eastman Kodak Company Gaseous cleaning method for silicon devices
JPH05325874A (ja) * 1992-05-21 1993-12-10 Sony Corp イオン注入装置
EP0648858A1 (en) * 1993-10-15 1995-04-19 Applied Materials, Inc. Methods of coating plasma etch chambers and apparatus for plasma etching workpieces
DE4339465C2 (de) * 1993-11-19 1997-05-28 Gold Star Electronics Verfahren zur Behandlung der Oberfläche eines einer Trockenätzung ausgesetzten Siliciumsubstrats
US5514246A (en) 1994-06-02 1996-05-07 Micron Technology, Inc. Plasma reactors and method of cleaning a plasma reactor
US5554854A (en) 1995-07-17 1996-09-10 Eaton Corporation In situ removal of contaminants from the interior surfaces of an ion beam implanter
US5656092A (en) * 1995-12-18 1997-08-12 Eaton Corporation Apparatus for capturing and removing contaminant particles from an interior region of an ion implanter
US5843239A (en) 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US6125859A (en) * 1997-03-05 2000-10-03 Applied Materials, Inc. Method for improved cleaning of substrate processing systems
KR100460800B1 (ko) * 1997-07-03 2005-05-19 삼성전자주식회사 플라즈마처리장치및이의잔류물제거플레이트제조방법

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703183A (en) * 1985-12-05 1987-10-27 Eaton Corporation Ion implantation chamber purification method and apparatus
JPH02155147A (ja) * 1988-12-06 1990-06-14 Tokyo Electron Ltd イオン注入装置のクリーニング方法
US5144147A (en) * 1990-08-31 1992-09-01 Kabushiki Kaisha Toshiba Ion implantation apparatus and method of cleaning the same
US5281302A (en) * 1992-01-27 1994-01-25 Siemens Aktiengesellschaft Method for cleaning reaction chambers by plasma etching
US5413670A (en) * 1993-07-08 1995-05-09 Air Products And Chemicals, Inc. Method for plasma etching or cleaning with diluted NF3
US5486235A (en) * 1993-08-09 1996-01-23 Applied Materials, Inc. Plasma dry cleaning of semiconductor processing chambers
US5611863A (en) * 1994-08-22 1997-03-18 Tokyo Electron Limited Semiconductor processing apparatus and cleaning method thereof
US5633506A (en) * 1995-07-17 1997-05-27 Eaton Corporation Method and apparatus for in situ removal of contaminants from ion beam neutralization and implantation apparatuses
US5824375A (en) * 1996-10-24 1998-10-20 Applied Materials, Inc. Decontamination of a plasma reactor using a plasma after a chamber clean

Also Published As

Publication number Publication date
KR100587630B1 (ko) 2006-06-08
US6259105B1 (en) 2001-07-10
EP1054438A3 (en) 2001-11-21
EP1054438A2 (en) 2000-11-22
JP2001007041A (ja) 2001-01-12
TW455917B (en) 2001-09-21
KR20000077197A (ko) 2000-12-26

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