SG86371A1 - Method of cleaning electronic components - Google Patents

Method of cleaning electronic components

Info

Publication number
SG86371A1
SG86371A1 SG200000583A SG200000583A SG86371A1 SG 86371 A1 SG86371 A1 SG 86371A1 SG 200000583 A SG200000583 A SG 200000583A SG 200000583 A SG200000583 A SG 200000583A SG 86371 A1 SG86371 A1 SG 86371A1
Authority
SG
Singapore
Prior art keywords
electronic components
cleaning electronic
cleaning
components
electronic
Prior art date
Application number
SG200000583A
Other languages
English (en)
Inventor
Morita Hiroshi
Ida Junichi
Original Assignee
Kurita Water Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP10291027A priority Critical patent/JP2000117208A/ja
Priority to KR1019990043734A priority patent/KR100629095B1/ko
Priority to TW088117521A priority patent/TW440945B/zh
Priority to EP99308039A priority patent/EP0994505A3/fr
Priority to US09/415,488 priority patent/US6431186B1/en
Application filed by Kurita Water Ind Ltd filed Critical Kurita Water Ind Ltd
Priority to SG200000583A priority patent/SG86371A1/en
Priority to CNB001008919A priority patent/CN1161825C/zh
Publication of SG86371A1 publication Critical patent/SG86371A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Cleaning By Liquid Or Steam (AREA)
SG200000583A 1998-10-13 2000-02-02 Method of cleaning electronic components SG86371A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP10291027A JP2000117208A (ja) 1998-10-13 1998-10-13 電子材料の洗浄方法
KR1019990043734A KR100629095B1 (ko) 1998-10-13 1999-10-11 전자 재료의 세정 방법
TW088117521A TW440945B (en) 1998-10-13 1999-10-11 Cleaning method for electronic material
EP99308039A EP0994505A3 (fr) 1998-10-13 1999-10-12 Procédé de nettoyage de substrats
US09/415,488 US6431186B1 (en) 1998-10-13 1999-10-12 Method of cleaning electronic components
SG200000583A SG86371A1 (en) 1998-10-13 2000-02-02 Method of cleaning electronic components
CNB001008919A CN1161825C (zh) 1998-10-13 2000-02-14 清洗电子元件的方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10291027A JP2000117208A (ja) 1998-10-13 1998-10-13 電子材料の洗浄方法
SG200000583A SG86371A1 (en) 1998-10-13 2000-02-02 Method of cleaning electronic components
CNB001008919A CN1161825C (zh) 1998-10-13 2000-02-14 清洗电子元件的方法

Publications (1)

Publication Number Publication Date
SG86371A1 true SG86371A1 (en) 2002-02-19

Family

ID=27178723

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000583A SG86371A1 (en) 1998-10-13 2000-02-02 Method of cleaning electronic components

Country Status (7)

Country Link
US (1) US6431186B1 (fr)
EP (1) EP0994505A3 (fr)
JP (1) JP2000117208A (fr)
KR (1) KR100629095B1 (fr)
CN (1) CN1161825C (fr)
SG (1) SG86371A1 (fr)
TW (1) TW440945B (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6982006B1 (en) 1999-10-19 2006-01-03 Boyers David G Method and apparatus for treating a substrate with an ozone-solvent solution
JP2002009035A (ja) 2000-06-26 2002-01-11 Toshiba Corp 基板洗浄方法及び基板洗浄装置
JP3603764B2 (ja) * 2000-08-30 2004-12-22 松下電器産業株式会社 ガラスの洗浄方法
US20020121286A1 (en) * 2001-01-04 2002-09-05 Applied Materials, Inc. Rinsing solution and rinsing and drying methods for the prevention of watermark formation on a surface
JP4752117B2 (ja) * 2001-02-08 2011-08-17 日本テキサス・インスツルメンツ株式会社 半導体ウェハ上の粒子を除去する方法
JP2002261062A (ja) * 2001-03-05 2002-09-13 Texas Instr Japan Ltd 半導体ウェハ上の粒子を除去する方法及び装置
JP4000247B2 (ja) * 2001-04-18 2007-10-31 株式会社ルネサステクノロジ フォトマスクの洗浄方法
AU2003286616A1 (en) * 2002-10-25 2004-05-25 Intersurface Dynamics, Inc. Method for using additives in the caustic etching of silicon for obtaining improved surface characteristics
JP5087839B2 (ja) * 2005-12-19 2012-12-05 栗田工業株式会社 水質評価方法、該方法を用いる超純水評価装置及び超純水製造システム
KR100682538B1 (ko) * 2006-02-07 2007-02-15 삼성전자주식회사 반도체 웨이퍼 세정설비 및 세정방법
CN101152652B (zh) * 2006-09-29 2011-02-16 北京北方微电子基地设备工艺研究中心有限责任公司 一种阳极氧化零件表面的清洗方法
KR100779399B1 (ko) 2006-12-26 2007-11-23 동부일렉트로닉스 주식회사 반도체 소자의 제조방법
US7955440B2 (en) * 2007-12-07 2011-06-07 Sumco Corporation Method for cleaning silicon wafer and apparatus for cleaning the silicon wafer
KR20100007461A (ko) * 2008-07-14 2010-01-22 삼성전자주식회사 석영 부품용 세정액 및 이를 이용한 석영 부품 세정방법
JP2011205058A (ja) * 2009-12-17 2011-10-13 Rohm & Haas Electronic Materials Llc 半導体基体をテクスチャ化する改良された方法
CN102671890A (zh) * 2012-04-28 2012-09-19 鞍山市联达电子有限公司 一种晶闸管芯片的化学清洗方法
SG11201408464WA (en) * 2012-06-29 2015-04-29 Hoya Corp Glass substrate for information recording medium and method for manufacturing the same
CN110942975A (zh) * 2018-09-25 2020-03-31 君泰创新（北京）科技有限公司 硅片清洗方法
CN111229685B (zh) * 2020-01-08 2021-06-01 长江存储科技有限责任公司 一种集成电路铝焊盘晶体缺陷的去除方法
CN111584342A (zh) * 2020-05-07 2020-08-25 如皋市协创能源科技有限公司 双多晶电容工艺中清洗元件的方法
CN113410341A (zh) * 2021-06-21 2021-09-17 吉林师范大学 一种氧化硅钝化层的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676760A (en) * 1994-03-25 1997-10-14 Nec Corporation Method for wet processing of a semiconductor substrate
US5919311A (en) * 1996-11-15 1999-07-06 Memc Electronic Materials, Inc. Control of SiO2 etch rate using dilute chemical etchants in the presence of a megasonic field
US5983909A (en) * 1996-03-27 1999-11-16 Frontec Incorporated Cleaning method and apparatus for the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0674026B1 (fr) * 1994-03-25 2004-07-14 NEC Electronics Corporation Appareillage pour traitement électrolytique
JPH10261687A (ja) * 1997-03-18 1998-09-29 Furontetsuku:Kk 半導体等製造装置
JP3662111B2 (ja) * 1997-06-24 2005-06-22 アルプス電気株式会社 洗浄液の製造方法およびそのための装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676760A (en) * 1994-03-25 1997-10-14 Nec Corporation Method for wet processing of a semiconductor substrate
US5983909A (en) * 1996-03-27 1999-11-16 Frontec Incorporated Cleaning method and apparatus for the same
US5919311A (en) * 1996-11-15 1999-07-06 Memc Electronic Materials, Inc. Control of SiO2 etch rate using dilute chemical etchants in the presence of a megasonic field

Also Published As

Publication number Publication date
KR20000028975A (ko) 2000-05-25
CN1161825C (zh) 2004-08-11
EP0994505A3 (fr) 2000-07-19
EP0994505A2 (fr) 2000-04-19
KR100629095B1 (ko) 2006-09-28
TW440945B (en) 2001-06-16
US6431186B1 (en) 2002-08-13
CN1309417A (zh) 2001-08-22
JP2000117208A (ja) 2000-04-25

Similar Documents

Publication Publication Date Title
SG86371A1 (en) Method of cleaning electronic components
GB9814398D0 (en) Electronic apparatus
GB2376344B (en) Method of forming an electronic device
GB9908938D0 (en) Electronic part
EP0851728A4 (fr) Procede de montage de pieces electroniques
PL342469A1 (en) Method of obtaining stilbenic compounds
PL337927A1 (en) Method of manufacturing compound boards
PL341648A1 (en) Novel method of obtaining kethymin
EP1115574A4 (fr) Procede d'adherence de mousses ceramiques
EP0997450A4 (fr) PROCEDE DE REDUCTION DE NO x
GB2344235B (en) Method of designing tuner circuit
SG104301A1 (en) Integrated circuit assembly cleaning apparatus and method
EP0936641A4 (fr) Procede de fabrication d'un composant electronique
TW433479U (en) Shielding structure of electronic apparatus
PL345261A1 (en) Method of treatment
SG93276A1 (en) Method for the testing of electronic components
HUP9902826A3 (en) Method for cleaning electronic hardware components
KR100244709B1 (en) Cleaning method of via hole
GB2337648B (en) Electronic circuits
SG65652A1 (en) Production method of electronic components
GB9709649D0 (en) Method of cleaning
PL324254A1 (en) Method of obtaining /z/-tricos-14-en-6-one
PL330246A1 (en) Method of obtaining n-tert-butoxycarbonyl-l-lysine
PL324956A1 (en) Method of obtaining polyphenylborosiloxanes
PL324996A1 (en) Method of obtaining polyphenylsilsequinoxanes