KR100244709B1 - Cleaning method of via hole - Google Patents
Cleaning method of via hole Download PDFInfo
- Publication number
- KR100244709B1 KR100244709B1 KR1019960067196A KR19960067196A KR100244709B1 KR 100244709 B1 KR100244709 B1 KR 100244709B1 KR 1019960067196 A KR1019960067196 A KR 1019960067196A KR 19960067196 A KR19960067196 A KR 19960067196A KR 100244709 B1 KR100244709 B1 KR 100244709B1
- Authority
- KR
- South Korea
- Prior art keywords
- via hole
- cleaning method
- cleaning
- hole
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960067196A KR100244709B1 (en) | 1996-12-18 | 1996-12-18 | Cleaning method of via hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960067196A KR100244709B1 (en) | 1996-12-18 | 1996-12-18 | Cleaning method of via hole |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19980048593A KR19980048593A (en) | 1998-09-15 |
KR100244709B1 true KR100244709B1 (en) | 2000-02-15 |
Family
ID=19488703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960067196A KR100244709B1 (en) | 1996-12-18 | 1996-12-18 | Cleaning method of via hole |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100244709B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100425999B1 (en) * | 2001-12-27 | 2004-04-06 | 동부전자 주식회사 | via hole rinsing method of semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3180779B2 (en) * | 1998-10-05 | 2001-06-25 | 日本電気株式会社 | Method for manufacturing semiconductor device |
-
1996
- 1996-12-18 KR KR1019960067196A patent/KR100244709B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100425999B1 (en) * | 2001-12-27 | 2004-04-06 | 동부전자 주식회사 | via hole rinsing method of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
KR19980048593A (en) | 1998-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121022 Year of fee payment: 14 |
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FPAY | Annual fee payment |
Payment date: 20131017 Year of fee payment: 15 |
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LAPS | Lapse due to unpaid annual fee |