SG85659A1 - Method of drying copper foil and copper foil drying apparatus - Google Patents

Method of drying copper foil and copper foil drying apparatus

Info

Publication number
SG85659A1
SG85659A1 SG9903705A SG1999003705A SG85659A1 SG 85659 A1 SG85659 A1 SG 85659A1 SG 9903705 A SG9903705 A SG 9903705A SG 1999003705 A SG1999003705 A SG 1999003705A SG 85659 A1 SG85659 A1 SG 85659A1
Authority
SG
Singapore
Prior art keywords
copper foil
drying
drying apparatus
copper
foil
Prior art date
Application number
SG9903705A
Other languages
English (en)
Inventor
Imada Nobuyuki
Oshima Kazuhide
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of SG85659A1 publication Critical patent/SG85659A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/10—Arrangements for feeding, heating or supporting materials; Controlling movement, tension or position of materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
    • F26B3/283—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun in combination with convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Textile Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SG9903705A 1998-07-17 1999-07-16 Method of drying copper foil and copper foil drying apparatus SG85659A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20369298 1998-07-17

Publications (1)

Publication Number Publication Date
SG85659A1 true SG85659A1 (en) 2002-01-15

Family

ID=16478272

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9903705A SG85659A1 (en) 1998-07-17 1999-07-16 Method of drying copper foil and copper foil drying apparatus

Country Status (4)

Country Link
US (2) US6269551B1 (de)
EP (1) EP0973365A3 (de)
KR (1) KR20000011746A (de)
SG (1) SG85659A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10109847A1 (de) * 2001-03-01 2002-09-19 Adphos Advanced Photonics Tech Verfahren zum Erzeugen einer Beschichtung auf einem quasi-endlos geförderten Materialband
DE10158008A1 (de) * 2001-11-22 2003-06-05 Eisenmann Kg Maschbau Verfahren und Vorrichtung zum Trocknen und/oder Vernetzen einer lösemittelhaltigen Beschichtung eines Metallbands
TW200404484A (en) * 2002-09-02 2004-03-16 Furukawa Circuit Foil Copper foil for soft circuit board package module, for plasma display, or for radio-frequency printed circuit board
KR100673789B1 (ko) * 2003-12-12 2007-01-23 현대하이스코 주식회사 전도성, 내식성이 뛰어난 일액형 크롬프리 내지문 강판제조방법
US20050285313A1 (en) * 2004-06-24 2005-12-29 Ward Phillip D Gel/cure unit
JP4986060B2 (ja) * 2005-06-23 2012-07-25 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
KR101302748B1 (ko) * 2010-09-17 2013-08-30 한국식품연구원 비접촉 가열식 유전자 증폭시스템
IT1402209B1 (it) * 2010-10-04 2013-08-28 Aleph S R L Macchina di asciugatura di tessuti stampati
CN102425924B (zh) * 2011-09-22 2013-10-23 西安航天动力机械厂 一种铜箔表面处理机中的烘干装置
JP7143644B2 (ja) * 2018-06-25 2022-09-29 コニカミノルタ株式会社 乾燥装置、画像形成装置、乾燥方法及びインクジェット捺染方法
CN113739522A (zh) * 2021-09-02 2021-12-03 云南惠铜新材料科技有限公司 一种锂电铜箔抗翘的烘烤装置
CN114046643B (zh) * 2021-11-04 2023-03-24 盐城工学院 一种用于电极箔实验的干湿分离制备设备及其制备方法
CN114068191B (zh) * 2021-11-29 2022-05-27 四川省雅安新江浩科技有限公司 一种高压电解电容器用的阳极箔制造方法
CN114289357B (zh) * 2021-12-10 2022-09-13 江苏荣生电子有限公司 电极箔用的表面刮液整平整理装置
CN115560571B (zh) * 2022-09-21 2023-05-16 浙江桐昆新材料研究院有限公司 一种用于复合纤维染色干燥装置及干燥方法
CN115738968B (zh) * 2022-11-16 2023-07-07 广东嘉元科技股份有限公司 一种电解铜箔自动溶铜装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0095717A1 (de) * 1982-05-27 1983-12-07 Ernest Picot Heiztunnel
JPH09129221A (ja) * 1995-10-27 1997-05-16 Toshiba Battery Co Ltd 乾燥装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
JPS57184473A (en) * 1981-05-08 1982-11-13 Nippon Steel Corp Production of precoat steel sheet
LU84911A1 (fr) * 1983-07-14 1985-04-17 Cockerill Sambre Sa Procede et installation de cuisson d'un revetement organique applique sur un support
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US5319861A (en) * 1990-11-16 1994-06-14 Setsuo Tate Drying method and device for coated layer
EP0486035B1 (de) * 1990-11-16 1995-02-01 Setsuo Tate Trocknungsverfahren und -vorrichtungen für ein beschichtetes Substrat
JPH05267842A (ja) * 1992-03-18 1993-10-15 Hitachi Chem Co Ltd 金属ベース基板の製造方法
JP2861825B2 (ja) * 1994-09-09 1999-02-24 東亞合成株式会社 金属被覆用水性樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0095717A1 (de) * 1982-05-27 1983-12-07 Ernest Picot Heiztunnel
JPH09129221A (ja) * 1995-10-27 1997-05-16 Toshiba Battery Co Ltd 乾燥装置

Also Published As

Publication number Publication date
US6269551B1 (en) 2001-08-07
EP0973365A2 (de) 2000-01-19
KR20000011746A (ko) 2000-02-25
US20010046458A1 (en) 2001-11-29
EP0973365A3 (de) 2002-01-02

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