SG83100A1 - Anti-tarnishing solution and a method for preventing tarnishing of copper or copper alloy - Google Patents

Anti-tarnishing solution and a method for preventing tarnishing of copper or copper alloy

Info

Publication number
SG83100A1
SG83100A1 SG9800541A SG1998000541A SG83100A1 SG 83100 A1 SG83100 A1 SG 83100A1 SG 9800541 A SG9800541 A SG 9800541A SG 1998000541 A SG1998000541 A SG 1998000541A SG 83100 A1 SG83100 A1 SG 83100A1
Authority
SG
Singapore
Prior art keywords
tarnishing
copper
solution
preventing
copper alloy
Prior art date
Application number
SG9800541A
Other languages
English (en)
Inventor
Aiba Akihiro
Original Assignee
Japan Energy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Energy Corp filed Critical Japan Energy Corp
Publication of SG83100A1 publication Critical patent/SG83100A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
SG9800541A 1997-04-25 1998-03-10 Anti-tarnishing solution and a method for preventing tarnishing of copper or copper alloy SG83100A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12151197A JP3371072B2 (ja) 1997-04-25 1997-04-25 銅または銅合金の変色防止液並びに変色防止方法

Publications (1)

Publication Number Publication Date
SG83100A1 true SG83100A1 (en) 2001-09-18

Family

ID=14813020

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9800541A SG83100A1 (en) 1997-04-25 1998-03-10 Anti-tarnishing solution and a method for preventing tarnishing of copper or copper alloy

Country Status (6)

Country Link
JP (1) JP3371072B2 (ko)
KR (1) KR100321205B1 (ko)
GB (2) GB2324538B (ko)
HK (1) HK1015428A1 (ko)
SG (1) SG83100A1 (ko)
TW (1) TW400396B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045461B2 (en) 2000-01-07 2006-05-16 Nikkon Materials Co., Ltd. Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these
WO2001049898A1 (fr) * 2000-01-07 2001-07-12 Nikko Materials Co., Ltd. Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere
CN101693994B (zh) * 2009-10-09 2011-06-29 河海大学常州校区 一种用于纯铜表面防变色的稀土盐处理溶液及其使用方法
JP5372983B2 (ja) * 2011-02-16 2013-12-18 株式会社日立製作所 金属の腐食防止方法
CN106148925B (zh) * 2015-03-23 2018-11-27 中国科学院高能物理研究所 一种银岛材料的制备方法
JP6779557B1 (ja) * 2020-07-20 2020-11-04 メック株式会社 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法
CN112538314A (zh) * 2020-11-06 2021-03-23 南京派诺金属表面处理技术有限公司 硅烷处理液及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011751A1 (en) * 1994-10-17 1996-04-25 Rd Chemical Company Noble metal coating method by immersion
WO1996017975A1 (en) * 1994-12-09 1996-06-13 Alpha Fry Limited Printed circuit board manufacture
WO1996036747A1 (en) * 1995-05-17 1996-11-21 Henkel Corporation Composition and process for treating the surface of copper-containing metals

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04265939A (ja) * 1991-02-21 1992-09-22 Hitachi Chem Co Ltd 液晶表示素子用透明電極の保護被膜形成法、透明電極保護被膜および液晶表示素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011751A1 (en) * 1994-10-17 1996-04-25 Rd Chemical Company Noble metal coating method by immersion
WO1996017975A1 (en) * 1994-12-09 1996-06-13 Alpha Fry Limited Printed circuit board manufacture
WO1996036747A1 (en) * 1995-05-17 1996-11-21 Henkel Corporation Composition and process for treating the surface of copper-containing metals

Also Published As

Publication number Publication date
GB2324538B (en) 2002-01-30
GB9805334D0 (en) 1998-05-06
TW400396B (en) 2000-08-01
JPH10298788A (ja) 1998-11-10
HK1015428A1 (en) 1999-10-15
KR100321205B1 (ko) 2002-07-03
GB9805154D0 (en) 1998-05-06
KR19980080039A (ko) 1998-11-25
JP3371072B2 (ja) 2003-01-27
GB2324538A (en) 1998-10-28

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